Multilayer on-chip inductor structure

Abstract

This invention discloses a multilayer chip-integrated inductor structure, comprising: a dielectric layer having first and second regions, and first and second winding patterns respectively disposed in layers below and above the dielectric layer and electrically connected. The first winding pattern includes adjacent first and second U-shaped windings, adjacent third and fourth U-shaped windings, and a first loop winding. The first and second U-shaped windings are located in the first region, with the second U-shaped winding surrounding the first U-shaped winding. The third and fourth U-shaped windings are located in the second region and are arranged correspondingly to the first and second U-shaped windings, respectively. The first and third U-shaped windings together surround the first loop winding. The second U-shaped winding has a horizontal bottom and two arms, with the line width of the arms being smaller than the line width of the horizontal bottom.

Description

Technical Field

[0001] This invention relates to a semiconductor structure, and more particularly to a multilayer on-chip inductor structure for improving inductance characteristics. Background Technology

[0002] Many digital and analog components and circuits have been successfully used in semiconductor integrated circuits. These components include passive elements, such as inductors, resistors, or capacitors. A typical semiconductor integrated circuit comprises a silicon substrate. One or more dielectric layers are disposed on the substrate, and one or more metal layers are disposed within the dielectric layers. These metal layers can be formed into chip-integrated components using current semiconductor fabrication techniques, such as T-coil chip-integrated inductor structures.

[0003] A T-type coil-type chip-embedded inductor structure can be designed by adding a suitable branch structure to a spiral inductor. In other words, a T-type coil-type chip-embedded inductor element has two inductor structures and a branch structure coupled between the windings of the two inductor structures, making the chip-embedded inductor element a three-terminal device with two input / output ports and a center tap (e.g., a T-type coil device).

[0004] Current T-type inductor structures typically use stacked metal layers within a dielectric layer (with plug connections between the stacked metal layers) as the windings of the inductor element to increase the Q value. However, the stacked metal layers are prone to edge coupling within the inductor element, thus limiting the coupling factor (K) of the inductor element.

[0005] Therefore, it is necessary to seek a new inductor structure that can improve the above-mentioned problems. Summary of the Invention

[0006] In some embodiments, a multilayer chip-in-chip inductor structure is provided, comprising: a dielectric layer having a first region and a second region divided by a centerline of an inductor center region. The inductor structure includes a first winding pattern disposed in a lower layer of the dielectric layer and a second winding pattern disposed in an upper layer of the dielectric layer. The second winding pattern is vertically stacked with and electrically connected to the first winding pattern. The first winding pattern includes first and second U-shaped windings located in the first region and adjacent to each other. The second U-shaped winding surrounds the first U-shaped winding and has a horizontal bottom and two arms, wherein the line width of the arms is smaller than the line width of the horizontal bottom. The first winding pattern also includes third and fourth U-shaped windings located in the second region and arranged corresponding to the first and second U-shaped windings, respectively. The first winding pattern further includes a first loop winding surrounding the inductor center and jointly surrounded by the first and third U-shaped windings.

[0007] In some embodiments, a multilayer chip-in-chip inductor structure is provided, comprising: a dielectric layer having a first region and a second region divided by a centerline of an inductor center region. The inductor structure includes a first winding pattern disposed in a lower layer of the dielectric layer and a second winding pattern disposed in an upper layer of the dielectric layer. The second winding pattern is perpendicularly stacked with and electrically connected to the first winding pattern. The first winding pattern includes: a first loop winding surrounding the inductor center area; first and second U-shaped windings located in the first and second areas respectively and jointly surrounding the first loop winding, wherein the first and second U-shaped windings each have a horizontal bottom and two arms, and the line width of the arms is smaller than the line width of the horizontal bottom; a first outer winding having a first segment and a separate second segment, and the first and second segments are respectively adjacent to the two arms of the first U-shaped winding; a second outer winding surrounding the first U-shaped winding and the first outer winding; a third outer winding having a third segment and a separate fourth segment, and the third and fourth segments are respectively adjacent to the two arms of the second U-shaped winding; and a fourth outer winding partially surrounding the second U-shaped winding and the third outer winding.

[0008] In some embodiments, a multilayer chip-in-chip inductor structure is provided, comprising: a dielectric layer having a first region and a second region divided by a centerline of an inductor center region. The inductor structure includes a first winding pattern disposed in a lower layer of the dielectric layer and a second winding pattern disposed in an upper layer of the dielectric layer. The second winding pattern is perpendicularly stacked with and electrically connected to the first winding pattern. The first winding pattern includes: a first annular winding, surrounding the inductor center region, and having first and second U-shaped portions located in the first and second regions respectively, with the first U-shaped portion having a horizontal bottom and two arms; a first outer winding, having a first segment and a separate second segment, with the first and second segments adjacent to the two arms of the first U-shaped portion respectively; a second outer winding, having a third segment and a separate fourth segment, with the third and fourth segments adjacent to the first and second segments respectively; a first U-shaped outer winding, located in the first region and surrounding the first U-shaped portion and the first and second outer windings; a second U-shaped outer winding, located in the second region and surrounding the second U-shaped portion, with the first and second U-shaped outer windings each having a horizontal bottom and two arms; a third outer winding, having a fifth segment and a separate sixth segment, with the fifth and sixth segments adjacent to the two arms of the second U-shaped outer winding; and a fourth outer winding, partially surrounding the second U-shaped outer winding and the third outer winding. The line width of the arm portion in the first U-shaped section is less than the line width of the horizontal bottom, the line width of the arm portion in the outer surround of the first U-shaped section is less than the line width of the horizontal bottom, and the line width of the arm portion in the outer surround of the second U-shaped section is less than the line width of the horizontal bottom. Attached Figure Description

[0009] Figure 1 This is a planar schematic diagram of a multilayer chip-in-cell inductor structure according to some embodiments of the present invention;

[0010] Figure 2A According to some embodiments of the present invention Figure 1 A planar schematic diagram of the upper winding pattern of the built-in inductor structure in a multilayer chip;

[0011] Figure 2B According to some embodiments of the present invention Figure 1 A planar schematic diagram of the lower layer winding pattern of the built-in inductor structure in a multilayer chip;

[0012] Figure 3 According to some embodiments of the present invention, along Figure 1 A cross-sectional view of line I-I' in the middle;

[0013] Figure 4 This is a planar schematic diagram of a multilayer chip-in-cell inductor structure according to some embodiments of the present invention;

[0014] Figure 5A According to some embodiments of the present invention Figure 4 A planar schematic diagram of the upper winding pattern of the built-in inductor structure in a multilayer chip;

[0015] Figure 5B According to some embodiments of the present invention Figure 4 A planar schematic diagram of the lower layer winding pattern of the built-in inductor structure in a multilayer chip;

[0016] Figure 6 According to some embodiments of the present invention, along Figure 4 A cross-sectional view of line I-I' in the middle;

[0017] Figure 7 This is a planar schematic diagram of a multilayer chip-in-cell inductor structure according to some embodiments of the present invention;

[0018] Figure 8A According to some embodiments of the present invention Figure 7 A planar schematic diagram of the upper winding pattern of the built-in inductor structure in a multilayer chip;

[0019] Figure 8B According to some embodiments of the present invention Figure 7 A planar schematic diagram of the lower layer winding pattern of the built-in inductor structure in a multilayer chip;

[0020] Figure 9A According to some embodiments of the present invention, along Figure 7 A cross-sectional view of line I-I' in the middle;

[0021] Figure 9BAccording to some embodiments of the present invention, along Figure 7 Schematic diagram of the cross section of line II-II';

[0022] Figure 10 This is a planar schematic diagram of a multilayer chip-in-cell inductor structure according to some embodiments of the present invention;

[0023] Figure 11A According to some embodiments of the present invention Figure 10 A planar schematic diagram of the upper winding pattern of the built-in inductor structure in a multilayer chip;

[0024] Figure 11B According to some embodiments of the present invention Figure 10 A planar schematic diagram of the lower layer winding pattern of the built-in inductor structure in a multilayer chip;

[0025] Figure 12A According to some embodiments of the present invention, along Figure 10 A cross-sectional view of line I-I' in the middle;

[0026] Figure 12B According to some embodiments of the present invention, along Figure 10 Schematic diagram of the cross section of line II-II';

[0027] Figure 13 This is a planar schematic diagram of a multilayer chip-in-cell inductor structure according to some embodiments of the present invention;

[0028] Figure 14A According to some embodiments of the present invention Figure 13 A planar schematic diagram of the upper winding pattern of the built-in inductor structure in a multilayer chip;

[0029] Figure 14B According to some embodiments of the present invention Figure 13 A planar schematic diagram of the lower layer winding pattern of the built-in inductor structure in a multilayer chip;

[0030] Figure 15A According to some embodiments of the present invention, along Figure 13 A cross-sectional view of line I-I' in the middle;

[0031] Figure 15B According to some embodiments of the present invention, along Figure 13 Schematic diagram of the cross section of line II-II';

[0032] Figure 16 This is a planar schematic diagram of a multilayer chip-in-cell inductor structure according to some embodiments of the present invention;

[0033] Figure 17A According to some embodiments of the present invention Figure 16A planar schematic diagram of the upper winding pattern of the built-in inductor structure in a multilayer chip;

[0034] Figure 17B According to some embodiments of the present invention Figure 16 A planar schematic diagram of the lower layer winding pattern of the built-in inductor structure in a multilayer chip;

[0035] Figure 18A According to some embodiments of the present invention, along Figure 16 A cross-sectional view of line I-I' in the middle;

[0036] Figure 18B According to some embodiments of the present invention, along Figure 16 A schematic cross-sectional view of line II-II'.

[0037] Symbol explanation:

[0038] 10, 10a, 20, 20a, 30, 30a: Multilayer chip-embedded inductor structure

[0039] 100: Dielectric layer

[0040] 101: Conductive branch

[0041] 101a, 201a, 301a, 501a', 801a': Endpiece

[0042] 101b: Linear Section

[0043] 200A, 200B, 200C, 200D, 200E, 200F, 200G, 200H, 200I, 200J, 200K, 200L: Winding patterns

[0044] 201, 201', 501, 501', 701, 801: First loop winding

[0045] 210, 210', 510, 510': First U-shaped winding

[0046] 220, 220', 530, 530': Second U-shaped winding

[0047] 220a, 220c, 510a, 510c, 530a, 530c, 701a, 730a, 750a, 801a, 830a, 850a: Arm

[0048] 220b, 220d, 510b, 510d, 530b, 530d, 701b, 730b, 750b, 801b, 830b, 850b: Horizontal bottom

[0049] 230, 230': Third U-shaped winding

[0050] 240, 240': Fourth U-shaped winding

[0051] 250, 250', 520, 520', 710, 810: First outer perimeter

[0052] 250a, 250c, 520a, 520c, 710a, 810a: First segment

[0053] 250b, 250d, 520b, 520d, 710b, 810b: Second segment

[0054] 260, 260', 550, 550', 720, 820: Second outer perimeter

[0055] 271, 271', 571, 571', 771, 871: First input / output terminals

[0056] 272, 272', 572, 572', 772, 872: Second input / output terminals

[0057] 301, 301': Second loop winding

[0058] 310, 310': Fifth U-shaped winding

[0059] 320, 320': Sixth U-shaped winding

[0060] 330, 330': Seventh U-shaped winding

[0061] 340, 340': Eighth U-shaped winding

[0062] 350, 350', 540, 540', 740, 840: Third outer perimeter

[0063] 360, 360', 560, 560', 760, 860: Fourth outer perimeter

[0064] 371, 371': Third input / output winding section

[0065] 372, 372': Fourth input / output winding section

[0066] 410, 420, 430: Connector layer pairs

[0067] 410a, 420a, 430a: Upper crossover layer

[0068] 410b, 420b, 430b: Lower crossover layer

[0069] 540a, 540c, 720a, 820a: Third segment

[0070] 540b, 540d, 720b, 820b: Fourth segment

[0071] 701', 801': First U-shaped section

[0072] 701”, 801”: Second U-shaped section

[0073] 730, 830: Second U-shaped outer perimeter

[0074] 740a, 840a: Fifth segment

[0075] 740b, 8404b: Segment Six

[0076] 750, 850: First U-shaped outer perimeter

[0077] 751, 851: Notch

[0078] L: Centerline

[0079] C: Inductor center area

[0080] L1: Upper layer

[0081] L2: Lower layer

[0082] R1: Zone 1

[0083] R2: Second District

[0084] VC: Conductive plug

[0085] W1, W2, W3, W4: Width Detailed Implementation

[0086] The following will describe in detail the manufacturing and usage methods of embodiments of the present invention. However, it should be noted that the present invention provides many applicable inventive concepts, which can be implemented in various specific forms. The specific embodiments discussed and illustrated herein are merely specific ways of manufacturing and using the present invention and are not intended to limit the scope of the invention. Furthermore, repeated reference numerals or designations may be used in different embodiments. These repetitions are merely for the purpose of simply and clearly describing the present invention and do not represent any association between the different embodiments and / or structures discussed.

[0087] Please refer to Figure 1 This diagram illustrates a plan view of a multilayer chip-in-chip inductor structure 10 according to some embodiments of the present invention. In some embodiments, the multilayer chip-in-chip inductor structure 10 includes a dielectric layer 100. The dielectric layer 100 may be disposed on a substrate (not shown). The substrate may include a silicon substrate or other existing semiconductor material substrate. The substrate may contain various different elements, such as transistors, resistors, capacitors, and other conventional semiconductor elements. Furthermore, the substrate may also contain other conductive layers (e.g., copper, aluminum, or alloys thereof) and one or more insulating layers (e.g., silicon oxide layers, silicon nitride layers, or low-dielectric material layers).

[0088] In some embodiments, the dielectric layer 100 is an inter-metal dielectric layer located above a substrate, which may be a single-layer dielectric material layer or a multi-layer dielectric structure. For example, the inter-metal dielectric layer may include multiple layers of dielectric material. The multiple layers of dielectric material are typically formed alternately with multiple layers of horizontal conductive features (e.g., conductive layers / metal layers) on the substrate. Furthermore, the horizontal conductive features are electrically connected to each other via vertical conductive features (e.g., conductive plugs) and form an internal interconnection structure with the dielectric layer 100 to electrically connect various different elements located within or on the substrate. For example, the inter-metal dielectric layer may include a silicon oxide layer, a silicon nitride layer, a low-dielectric material layer, or other suitable dielectric material layers.

[0089] In some embodiments, the multilayer chip-in-chip inductor structure 10 further includes multilayer winding patterns disposed within the dielectric layer 100. These winding patterns constitute the multilayer chip-in-chip inductor structure and surround the inductor center region C of the dielectric layer 100. The inductor center region C is divided into a first region R1 and a second region R2 by its centerline L, as shown below. Figure 1 As shown. In some embodiments, the multilayer chip-in-chip inductor structure 10 includes winding patterns 200A and 200B disposed at different layers within the dielectric layer 100. Please refer to... Figure 3 It illustrates the following according to some embodiments of the present invention: Figure 1A cross-sectional view of line I-I'. The winding pattern 200B is disposed in a lower layer of the dielectric layer 100 (e.g., lower layer L2), while the winding pattern 200A is disposed in a higher layer of the dielectric layer 100 (e.g., upper layer L1).

[0090] Please also refer to Figure 2A and Figure 2B ,in Figure 2A Illustrations of some embodiments according to the present invention Figure 1 A planar schematic diagram of the upper winding pattern of the multilayer chip built-in inductor structure 10, and Figure 2B Illustrations of some embodiments according to the present invention Figure 1 A planar schematic diagram of the lower layer winding pattern of the inductor structure 10 in a multilayer chip.

[0091] In some embodiments, the lower winding pattern (i.e., winding pattern 200B) includes a first annular winding 201, a first U-shaped winding 210, a second U-shaped winding 220, a third U-shaped winding 230, and a fourth U-shaped winding 240. For example... Figure 2B As shown, in a top-down view, the first loop winding 201 (e.g., a rectangular or square loop) is located in the first region R1 and the second region R2 and surrounds the inductor center region C. Furthermore, the first U-shaped winding 210 and the second U-shaped winding 220 are located in the first region R1 and are adjacent to each other. The first U-shaped winding 210 surrounds the portion of the first loop winding 201 corresponding to the first region R1, and the second U-shaped winding 220 surrounds the first U-shaped winding 210. Similar to the arrangement of the first U-shaped winding 210 and the second U-shaped winding 220, the third U-shaped winding 230 and the fourth U-shaped winding 240 are located in the second region R2 and are adjacent to each other. The third U-shaped winding 230 surrounds the portion of the first loop winding 201 corresponding to the second region R2, and the fourth U-shaped winding 240 surrounds the third U-shaped winding 230. Thus, the first U-shaped winding 210 and the third U-shaped winding 230 together surround the first loop winding 201. In this embodiment, the second U-shaped winding 220 has a horizontal bottom 220b and two arms 220a located at two opposite ends of the horizontal bottom 220b, wherein the width W2 (or line width) of the arms 220a is smaller than the width W1 of the horizontal bottom 220b. In one embodiment, the two arms 220a are perpendicular to the horizontal bottom 220b. In this document, the relatively wide horizontal bottom is also referred to as the winding enlargement. Furthermore, the relatively narrow arms have the same line width (e.g., width W2) as the other windings.

[0092] In some embodiments, the winding pattern 200B further includes a first outer winding 250, a second outer winding 260, a first input / output winding portion 271, and a second input / output winding portion 272. The first outer winding 250 is located outside the second U-shaped winding 220 and has a first segment 250a and a second segment 250b, which is separated from the first segment 250a by the horizontal bottom 220b (i.e., the winding enlargement) of the second U-shaped winding 220. For example, in a top view, the first segment 250a and the second segment 250b correspond to the two opposite ends of the horizontal bottom 220b and are respectively adjacent to the two arms 220a of the second U-shaped winding 220. Furthermore, the second outer winding 260 is located outside the fourth U-shaped winding 240 and partially surrounds the fourth U-shaped winding 240. Furthermore, the first input / output winding portion 271 is connected to one end of the first segment 250a of the first outer winding 250, while the second input / output winding portion 272 is connected to one end of the second outer winding 260. It should be noted that the positions of the first input / output winding portion 271 and the second input / output winding portion 272 can be determined according to design requirements, and the end positions of the first segment 250a and the second outer winding 260 can be adjusted accordingly, without being limited to... Figure 2B The example shown.

[0093] In some embodiments, the windings in the upper winding pattern (i.e., winding pattern 200A) are not only perpendicularly stacked and electrically connected to the windings of the lower winding pattern, but also partially overlap or coincide with the lower winding pattern, such as... Figure 1 As shown. Similar to winding pattern 200B, winding pattern 200A includes a second annular winding 301, a fifth U-shaped winding 310, a sixth U-shaped winding 320, a seventh U-shaped winding 330, and an eighth U-shaped winding 340. For example... Figure 2A As shown, the second loop winding 301 is located in the first region R1 and the second region R2 and surrounds the inductor center region C. Furthermore, in a top view, the width of one end 301a of the second loop winding 301 in the second region R2 is greater than the width of the rest of the second loop winding 301. Since the first loop winding 201 does not have an end similar to end 301a, the second loop winding 301 partially overlaps with the first loop winding 201 rather than coincides with it.

[0094] Furthermore, the fifth U-shaped winding 310 and the sixth U-shaped winding 320 are located in the first region R1 and are adjacent to each other. Furthermore, the fifth U-shaped winding 310 surrounds the portion of the second loop winding 301 corresponding to the first region R1 and coincides with the first U-shaped winding 210. Furthermore, the sixth U-shaped winding 320 surrounds the fifth U-shaped winding 310. Since the sixth U-shaped winding 320 does not have a horizontal bottom 220b (winding enlargement) similar to the second U-shaped winding 220, it partially overlaps with the second U-shaped winding 220. Similar to the arrangement of the fifth U-shaped winding 310 and the sixth U-shaped winding 320, the seventh U-shaped winding 330 and the eighth U-shaped winding 340 are located in the second region R2 and are adjacent to each other. Furthermore, the seventh U-shaped winding 330 surrounds the portion of the second loop winding 301 corresponding to the second region R2 and coincides with the third U-shaped winding 230. The eighth U-shaped winding 340 surrounds the seventh U-shaped winding 330 and overlaps with the fourth U-shaped winding 240. Thus, the seventh U-shaped winding 330 and the eighth U-shaped winding 340 are arranged corresponding to the fifth U-shaped winding 310 and the sixth U-shaped winding 320, respectively. In this embodiment, the U-shaped windings in the winding pattern 200A have the same line width (e.g., width W2).

[0095] In some embodiments, the winding pattern 200A further includes a third outer winding 350, a fourth outer winding 360, a third input / output winding portion 371, and a fourth input / output winding portion 372. The third outer winding 350 surrounds the sixth U-shaped winding 320 and partially overlaps with the first outer winding 250 and the second U-shaped winding 220. That is, the horizontal bottom 220b of the second U-shaped winding 220 overlaps with a portion of the third outer winding 350. Furthermore, the second U-shaped winding 220 overlaps with the entire sixth U-shaped winding 320. In addition, the fourth outer winding 360 partially surrounds the eighth U-shaped winding 340 and coincides with the second outer winding 260. The third input / output winding portion 371 is connected to one end of the third outer winding 350 and coincides with the first input / output winding portion 271, while the fourth input / output winding portion 372 is connected to one end of the fourth outer winding 360 and coincides with the second input / output winding portion 272.

[0096] In some embodiments, the multilayer chip-in-chip inductor structure 10 further includes a conductive branch 101, a plurality of conductive plugs VC, and a plurality of connection layer pairs 410, 420, and 430. For example... Figure 1As shown, in some embodiments, in a top view, the conductive branch 101 is disposed above the winding pattern 200A of the second region R2 and is surrounded by a corresponding dielectric layer. The dielectric layer surrounding the conductive branch 101 is disposed on the dielectric layer 100 and may be a single layer (sometimes also called a passivation sheath) or a multilayer structure (including at least one passivation sheath). Furthermore, the conductive branch 101 has an end portion 101a and a linear portion 101b. The top view profile of the end portion 101a may be similar to or the same as the end portion 301a of the second annular winding 301 and coincide with it (or partially overlap it). Furthermore, the linear portion 101b extends from the end portion 301a outward from the inductor center region C. The conductive branch 101 is electrically connected to the second annular winding 301 via a conductive plug (not shown) located between its end portion 101a and end portion 301a. Furthermore, the conductive branch 101 is electrically connected to the first annular winding 201 via a conductive plug (not shown) located below the end 301a. In some embodiments, the planar dimension of the conductive plug located between the end 101a and the end 301a may be larger than the planar dimension of the conductive plug VC.

[0097] like Figure 1 and Figure 3 As shown, the conductive plug VC is also disposed within the dielectric layer 100 between the winding pattern 200A and the winding pattern 200B, and is electrically connected to the winding pattern 200A and the winding pattern 200B. However, the arrangement of the conductive plug VC avoids the dielectric layer 100 located at the overlap of the horizontal bottom 220b of the third outer winding 350 and the second U-shaped winding 220, as shown. Figure 3 As shown.

[0098] Please refer to again Figure 1 , Figure 2A and Figure 2B The connecting layers 410, 420, and 430 electrically connect the ends of the corresponding annular windings, the ends of the corresponding U-shaped windings, and the ends of the corresponding outer windings in the winding patterns 200A and 200B. Specifically, the connecting layer 410 includes an upper cross-connect layer 410a (such as...). Figure 2A (as shown) and the lower crossover layer 410b (as shown) Figure 2B (As shown). Similarly, the connection layer pair 420 includes an upper crossover layer 420a (as shown). Figure 2A (as shown) and the lower crossover layer 420b (as shown) Figure 2B As shown), the connection layer 430 includes an upper crossover layer 430a (as shown). Figure 2A (as shown) and the lower crossover layer 430b (as shown) Figure 2B(As shown). The upper bonding layers 410a, 420a and 430a span the first region R1 and the second region R2 and are located at the upper layer L1 of the dielectric layer 100, while the lower bonding layers 410b, 420b and 430b also span the first region R1 and the second region R2 and are located at the lower layer L2 of the dielectric layer 100.

[0099] In this embodiment, the first input / output winding portion 271 and the third input / output winding portion 371, the first outer winding 250 and the third outer winding 350, the first U-shaped winding 210 and the fifth U-shaped winding 310, the fourth U-shaped winding 240 and the eighth U-shaped winding 340, the lower bridging layer 410b, the upper bridging layer 420a, and the upper bridging layer 430a constitute a first multilayer inductor structure. Furthermore, the second input / output winding portion 272 and the fourth input / output winding portion 372, the second outer winding 260 and the fourth outer winding 360, the second U-shaped winding 220 and the sixth U-shaped winding 320, the third U-shaped winding 230 and the seventh U-shaped winding 330, the first ring winding 201 and the second ring winding 301, the upper bridging layer 410a, the lower bridging layer 420b, and the lower bridging layer 430b constitute a second multilayer inductor structure. The first multilayer inductor structure and the second multilayer inductor structure together with the conductive branch 101 constitute a T-type coil inductor element (i.e., a multilayer chip-built-in inductor structure 10).

[0100] In the multilayer chip-embedded inductor structure 10, the overlapping structure formed by the second U-shaped winding 220 with an enlarged winding portion and the third outer winding 350 located thereon, where the upper and lower windings have at least partially identical structures (without plug connections between the overlapping metal windings), can provide strong magnetic interaction and a larger coupling area during inductor operation. Therefore, the aforementioned overlapping structure can establish greater broadside coupling, thereby effectively increasing the mutual inductance between the first and second multilayer inductor structures. This improves the coupling factor K of the T-type coil inductor element.

[0101] In some embodiments, the winding pattern 200B and the lower bridging layers 410b, 420b, and 430b can be formed from the second-to-top horizontal conductive feature (adjacent to the top horizontal conductive feature) within the dielectric layer 100, and can be made of copper, aluminum, their alloys, or other suitable metallic materials. Furthermore, the winding pattern 200A and the upper bridging layers 410a, 420a, and 430a can be formed from the top horizontal conductive feature (adjacent to the second-to-top horizontal conductive feature) within the dielectric layer 100, and can be made of copper, aluminum, their alloys, or other suitable metallic materials. Generally, the thickness of the top horizontal conductive feature is substantially the same as the thickness of the adjacent second-to-top horizontal conductive feature. Additionally, the conductive branch 101 can be formed from a redistribution layer located above the top horizontal conductive feature, and can be made of copper, aluminum, their alloys, or other suitable metallic materials. Generally, the thickness of the redistribution layer is greater than the thickness of the top horizontal conductive feature within the dielectric layer 100.

[0102] Please refer to Figure 4 , Figure 5A , Figure 5B and Figure 6 The diagram illustrates a multilayer chip-in-chip inductor structure 10a according to some embodiments of the present invention. Figure 4 A planar schematic diagram of a multilayer chip-integrated inductor structure 10a is shown. Figure 5A and Figure 5B A planar schematic diagram of the upper and lower winding patterns of the multilayer chip-in-the-chip inductor structure 10a is shown. Figure 6 The diagram illustrates the following aspects according to some embodiments of the present invention. Figure 4 A cross-sectional view of line I-I'. Here, Figure 4 , Figure 5A , Figure 5B and Figure 6 Zhongyu Figure 1 , Figure 2A , Figure 2B and Figure 3 Components that are identical or similar in use use the same or similar designations and their descriptions may be omitted. The structure and configuration of the multilayer chip-integrated inductor structure 10a are similar to those of other components. Figure 1 , Figure 2A , Figure 2B and Figure 3 The multilayer chip-in-inductor structure 10 is shown. The difference is that the upper winding pattern (i.e., the winding pattern 200C located in the upper layer L1 of the dielectric layer 100) in the multilayer chip-in-inductor structure 10a has a winding enlargement, while the lower winding pattern (i.e., the winding pattern 200D located in the lower layer L2 of the dielectric layer 100) does not have a winding enlargement.

[0103] like Figure 5A As shown, in some embodiments, the upper winding pattern (i.e., winding pattern 200C) includes a first annular winding 201', a first U-shaped winding 210', a second U-shaped winding 220', a third U-shaped winding 230', and a fourth U-shaped winding 240'. In a top view, the arrangement of the first annular winding 201', the first U-shaped winding 210', the second U-shaped winding 220', the third U-shaped winding 230', and the fourth U-shaped winding 240' is similar to... Figure 2B The arrangement of the first annular winding 201, the first U-shaped winding 210, the second U-shaped winding 220, the third U-shaped winding 230 and the fourth U-shaped winding 240 in the winding pattern 200B.

[0104] Unlike Figure 2B The first loop winding 201 shown has a width at one end 201a of the first loop winding 201' located in the second region R2 that is wider than the width of the other parts of the first loop winding 201'. Furthermore, the second U-shaped winding 220' also has a horizontal bottom 220d and two arms 220c, and the width W4 of the arms 220c (which may be the same as the width W2, indicated by...) Figure 2B Width W3 (which can be the same as width W1, indicated by a horizontal bottom value of 220d) is less than the horizontal bottom value of 220d. Figure 2B In this embodiment, the relatively narrow arm portion 220c may have the same line width as the other windings of the winding pattern 200C.

[0105] In some embodiments, the winding pattern 200C further includes a first outer winding line 250', a second outer winding line 260', a first input / output winding portion 271', and a second input / output winding portion 272'. In a top view, the arrangement of the first outer winding line 250', the second outer winding line 260', the first input / output winding portion 271', and the second input / output winding portion 272' is similar to... Figure 2B The arrangement of the first outer winding line 250, the second outer winding line 260, the first input / output winding section 271, and the second input / output winding section 272 in the winding pattern 200B. Further details will not be provided here. Similar to... Figure 2B The first outer winding 250 shown has a first segment 250c and a second segment 250d separated from the first segment 250c by a horizontal bottom 220d (i.e., winding enlargement) of the second U-shaped winding 220'. Additionally, a first input / output winding 271' is connected to one end of the first segment 250c, and a second input / output winding 272' is connected to one end of the second outer winding 260'. Similarly, the positions of the ends of the first segment 250c and the second outer winding 260' can be adjusted according to the positions of the first input / output winding 271' and the second input / output winding 272', and are not limited to these positions. Figure 5A The example shown.

[0106] In some embodiments, the windings in the lower winding pattern (i.e., winding pattern 200D) not only stack perpendicularly to and are electrically connected to the windings of the upper winding pattern, but also partially overlap or coincide with the upper winding pattern, such as... Figure 4 As shown. Figure 5B As shown, in some embodiments, the winding pattern 200D includes a second annular winding 301', a fifth U-shaped winding 310', a sixth U-shaped winding 320', a seventh U-shaped winding 330', and an eighth U-shaped winding 340'. Furthermore, in a top-down view, the arrangement of the second annular winding 301', the fifth U-shaped winding 310', the sixth U-shaped winding 320', the seventh U-shaped winding 330', and the eighth U-shaped winding 340' is similar to... Figure 2A The arrangement of the second ring-shaped winding 301, the fifth U-shaped winding 310, the sixth U-shaped winding 320, the seventh U-shaped winding 330, and the eighth U-shaped winding 340 in the winding pattern 200A is not described in detail here.

[0107] Unlike Figure 2A The second loop winding 301 shown is similar to... Figure 2B The widths of the first loop winding 201 and the second loop winding 301' at the ends of the second region R2 shown do not change. That is, the second loop winding 301' has a consistent width.

[0108] In some embodiments, the winding pattern 200D further includes a third outer winding line 350', a fourth outer winding line 360', a third input / output winding portion 371', and a fourth input / output winding portion 372'. In a top view, the arrangement of the third outer winding line 350', the fourth outer winding line 360', the third input / output winding portion 371', and the fourth input / output winding portion 372' is similar to... Figure 2A The arrangement of the third outer winding line 350, the fourth outer winding line 360, the third input / output winding section 371, and the fourth input / output winding section 372 in the winding pattern 200A is not described in detail here.

[0109] like Figure 4As shown, the conductive branch 101 has an end portion 101a and a linear portion 101b. The top view profile of the end portion 101a may be similar to or the same as the end portion 201a of the first loop winding 201' and coincide with it (or partially overlap it). Furthermore, the conductive branch 101 is electrically connected to the first loop winding 201' via a conductive plug (not shown) located between its end portion 101a and end portion 201a. Furthermore, the conductive branch 101 is electrically connected to the second loop winding 301' via a conductive plug (not shown) located below end portion 201a. In some embodiments, the planar dimension of the conductive plug located between end portion 101a and end portion 201a may be larger than the planar dimension of the conductive plug VC.

[0110] like Figure 4 and Figure 6 As shown, the conductive plug VC is also disposed within the dielectric layer 100 between the winding pattern 200C and the winding pattern 200D, and is electrically connected to the winding pattern 200C and the winding pattern 200D. However, the arrangement of the conductive plug VC avoids the dielectric layer 100 where the horizontal bottom 220d of the third outer winding 350' and the second U-shaped winding 220' overlaps, as shown in the figure. Figure 6 As shown.

[0111] Please refer to again Figure 4 , Figure 5A and Figure 5B The connecting layers 410, 420, and 430 electrically connect the ends of the corresponding annular windings, the ends of the corresponding U-shaped windings, and the ends of the corresponding outer windings in the winding patterns 200C and 200D. The corresponding upper bridging layers 410a, 420a, and 430a of the connecting layers 410, 420, and 430 span the first region R1 and the second region R2 and are located at the upper layer L1 of the dielectric layer 100, while the corresponding lower bridging layers 410b, 420b, and 430b also span the first region R1 and the second region R2 and are located at the lower layer L2 of the dielectric layer 100.

[0112] In this embodiment, the first input / output winding portion 271' and the third input / output winding portion 371', the first outer winding portion 250' and the third outer winding portion 350', the first U-shaped winding portion 210' and the fifth U-shaped winding portion 310', the fourth U-shaped winding portion 240' and the eighth U-shaped winding portion 340', the lower bridging layer 410b, the upper bridging layer 420a, and the upper bridging layer 430a constitute a first multilayer inductor structure. Furthermore, the second input / output winding portion 272' and the fourth input / output winding portion 372', the second U-shaped winding portion 220' and the sixth U-shaped winding portion 320', the third U-shaped winding portion 230' and the seventh U-shaped winding portion 330', the first ring winding portion 201' and the second ring winding portion 301', the upper bridging layer 410a, the lower bridging layer 420b, and the lower bridging layer 430b constitute a second multilayer inductor structure. The first multilayer inductor structure and the second multilayer inductor structure together with the conductive branch 101 constitute a T-type coil inductor element (i.e., a multilayer chip-built-in inductor structure 10a).

[0113] In the multilayer chip-in-inductor structure 10a, the overlapping structure formed by the second U-shaped winding 220' with the winding enlargement and the third outer winding 350' below it (without plug connections between the overlapping metal windings) can provide strong magnetic interaction and a large coupling area during inductor operation, thereby improving the coupling factor (K) of the T-type coil inductor element.

[0114] Similar to winding pattern 200B, winding pattern 200D and lower bridging layers 410b, 420b, and 430b can be formed by horizontally conductive features in the second-to-top layer of dielectric layer 100 (e.g., an intermetallic dielectric layer). Furthermore, similar to winding pattern 200A, winding pattern 200C and upper bridging layers 410a, 420a, and 430a can be formed by horizontally conductive features in the topmost layer of dielectric layer 100. In one embodiment, a redistribution layer may also be disposed on the topmost horizontally conductive feature.

[0115] Please refer to Figure 7 , Figure 8A , Figure 8B , Figure 9A and Figure 9B The diagram illustrates a multilayer chip-in-chip inductor structure 20 according to some embodiments of the present invention. Figure 7 A planar schematic diagram of a multilayer chip-integrated inductor structure 20 is shown. Figure 8A and Figure 8B A planar schematic diagram of the upper and lower winding patterns of the multilayer chip-built-in inductor structure 20 is shown. Figure 9A and Figure 9B The following figures illustrate the various embodiments of the present invention. Figure 7A schematic cross-sectional view of lines I-I' and II-II'. Here, Figure 7 , Figure 8A , Figure 8B , Figure 9A and Figure 9B Zhongyu Figure 1 , Figure 2A , Figure 2B and Figure 3 Components that are identical or similar in use use the same or similar designations and their descriptions may be omitted. The structure and configuration of the multilayer chip-integrated inductor structure 20 are similar to those of other components. Figure 1 , Figure 2A , Figure 2B and Figure 3 The multilayer chip-in-inductor structure 10 is shown. The difference is that the lower layer winding pattern (i.e., the winding pattern 200F of the lower layer L2 located in the dielectric layer 100) in the multilayer chip-in-inductor structure 20 has two winding enlargements.

[0116] like Figure 8A As shown, in some embodiments, the upper winding pattern (i.e., winding pattern 200E) is located at the upper layer L1 within the dielectric layer 100, and is adjacent to the lower winding pattern (i.e., winding pattern 200F, as shown in the figure). Figure 8B (As shown) Electrical connection. The structure, material, and arrangement of the winding pattern 200E are essentially the same as... Figure 2A The upper winding pattern shown is (i.e., winding pattern 200A). It will not be described again here.

[0117] In some embodiments, the windings in the lower winding pattern, in addition to being perpendicularly stacked and electrically connected to the windings of the upper winding pattern, also partially overlap or coincide with them, such as... Figure 7 As shown. Figure 8B As shown, in some embodiments, the winding pattern 200F includes a first loop winding 501, a first U-shaped winding 510, and a second U-shaped winding 530. In a top view, the first loop winding 501 (e.g., a rectangular or square loop) is located in the first region R1 and the second region R2 and surrounds the inductor center region C, corresponding to... Figure 8A The second loop winding 301 shown is different from the second loop winding 301 but similar to it. Figure 2B The first loop winding 201 is shown. For example, the width of one end of the first loop winding 501 located in the second region R2 is not greater than the width of the rest of the first loop winding 501. Furthermore, in a top view, the first U-shaped winding 510 and the second U-shaped winding 530 are separated by a center line L (indicated by...). Figure 7 The components are arranged symmetrically around an axis of symmetry. For example, the first U-shaped winding 510 has a horizontal bottom 510b and two arms 510a, and the width of the arms 510a (which may be the same as the width W2, indicated by...) Figure 2B The width is less than the horizontal bottom 510b (it can be the same as the width W1, indicated in the diagram). Figure 2B The second U-shaped winding 530 also has a horizontal bottom 530b and two arms 530a, and the width of the arms 530a (which may be the same as the width of the arms 510a) is smaller than the width of the horizontal bottom 530b (which may be the same as the width of the horizontal bottom 530b). In this embodiment, in a top view, the first U-shaped winding 510 partially overlaps with the sixth U-shaped winding 320 above it, and the second U-shaped winding 530 partially overlaps with the eighth U-shaped winding 340 above it, as shown below. Figure 7 As shown.

[0118] In some embodiments, the winding pattern 200F further includes a first outer winding 520, a second outer winding 550, a third outer winding 540, a fourth outer winding 560, a first input / output winding portion 571, and a second input / output winding portion 572. The first outer winding 520 is located outside the first U-shaped winding 510 and has a first segment 520a and a second segment 520b separated from the first segment 520a by the horizontal bottom 510b (i.e., the winding enlargement) of the first U-shaped winding 510. For example, in a top view, the first segment 520a and the second segment 520b correspond to the two opposite ends of the horizontal bottom 510b and are respectively arranged adjacent to the two arms 510a of the first U-shaped winding 510. Furthermore, the second outer winding line 550 surrounds the first U-shaped winding line 510 and the first outer winding line 520, such that the first segment 520a and the second segment 520b of the first outer winding line 520 are located between the corresponding arms 510a of the second outer winding line 550 and the first U-shaped winding line 510, respectively.

[0119] Similar to the arrangement of the first outer winding 520, the third outer winding 540 is located outside the second U-shaped winding 530 and has a third segment 540a and a fourth segment 540b that is separated from the third segment 540a by the horizontal bottom 530b (i.e., the winding enlargement) of the second U-shaped winding 530. For example, in a top view, the third segment 540a and the fourth segment 540b correspond to the two opposite ends of the horizontal bottom 530b of the second U-shaped winding 530 and are respectively arranged adjacent to the two arms 530a of the second U-shaped winding 530, such that the third segment 540a and the fourth segment 540b correspond to the first segment 520a and the second segment 520b, respectively. Furthermore, the fourth outer winding 560 partially surrounds the second U-shaped winding 530 and the third outer winding 540. In this way, the third segment 540a of the third outer winding 540 is located between the corresponding arm 530a of the second outer winding 550 and the second U-shaped winding 530. Furthermore, the fourth segment 540b of the third outer winding 540 is located between the corresponding arm 530a of the fourth outer winding 560 and the second U-shaped winding 530. Additionally, the first input / output winding portion 571 is connected to one end of the second outer winding 550, and the second input / output winding portion 572 is connected to one end of the fourth outer winding 560.

[0120] like Figure 7 As shown, the conductive branch 101 is electrically connected to the second annular winding 301 via a conductive plug (not shown) located between its end 101a and end 301a. Furthermore, the conductive branch 101 is electrically connected to the first annular winding 501 via a conductive plug (not shown) located below end 301a.

[0121] like Figure 7 , Figure 9A and Figure 9B As shown, the conductive plug VC is also disposed within the dielectric layer 100 between the winding pattern 200E and the winding pattern 200F, and is electrically connected to the winding pattern 200E and the winding pattern 200F. However, the arrangement of the conductive plug VC avoids the dielectric layer 100 where the horizontal bottom 510b of the first U-shaped winding 510 overlaps with the sixth U-shaped winding 320 above it, as shown. Figure 9A As shown. Similarly, the arrangement of the conductive plugs VC also avoids the dielectric layer 100 where the horizontal bottom 530b of the second U-shaped winding 530 overlaps with the upper eighth U-shaped winding 340, as shown. Figure 9B As shown.

[0122] Please refer to again Figure 7 , Figure 8A and Figure 8BThe connecting layers 410, 420, and 430 electrically connect the ends of the corresponding annular windings, the ends of the corresponding U-shaped windings, and the ends of the corresponding outer windings in the winding patterns 200E and 200F. The corresponding upper bridging layers 410a, 420a, and 430a of the connecting layers 410, 420, and 430 span the first region R1 and the second region R2 and are located at the upper layer L1 of the dielectric layer 100, while the corresponding lower bridging layers 410b, 420b, and 430b also span the first region R1 and the second region R2 and are located at the lower layer L2 of the dielectric layer 100.

[0123] In this embodiment, the first input / output winding portion 571 and the upper third input / output winding portion 371, the second outer winding 550 and the upper third outer winding 350, the third outer winding 540 and the upper eighth U-shaped winding 340, the first U-shaped winding 510 and the upper fifth U-shaped winding 310, the lower bridging layer 410b, the upper bridging layer 420a, and the upper bridging layer 430a constitute the first multilayer inductor structure. Furthermore, the second input / output winding portion 572 and the fourth input / output winding portion 372 above it, the fourth outer winding 560 and the fourth outer winding 360 above it, the first outer winding 520 and the sixth U-shaped winding 320 above it, the second U-shaped winding 530 and the seventh U-shaped winding 330 above it, the first ring winding 501 and the second ring winding 301 above it, the upper bridging layer 410a, the lower bridging layer 420b, and the lower bridging layer 430b constitute a second multilayer inductor structure. The first multilayer inductor structure and the second multilayer inductor structure, together with the conductive branch portion 101, constitute a T-type coil inductor element (i.e., a multilayer chip-built-in inductor structure 20).

[0124] In the multilayer chip-in-circuit inductor structure 20, a first U-shaped winding 510 with an enlarged winding portion and a sixth U-shaped winding 320 thereon form a first overlapping structure. A second U-shaped winding 530 with an enlarged winding portion and an eighth U-shaped winding 340 thereon form a second overlapping structure. In the first and second overlapping structures, there are no plug connections between the overlapping metal windings. Furthermore, the first and second overlapping structures can provide stronger magnetic interaction and a larger coupling area during inductor operation, thereby improving the coupling factor (K) of the T-type coil inductor element.

[0125] Similar to winding patterns 200A and 200B, winding pattern 200E and upper bridging layers 410a, 420a and 430a can be formed by the topmost horizontal conductive feature within dielectric layer 100. Winding pattern 200F and lower bridging layers 410b, 420b and 430b can be formed by the second-highest horizontal conductive feature within dielectric layer 100.

[0126] Please refer to Figure 10 , Figure 11A , Figure 11B , Figure 12A and Figure 12B The diagram illustrates a multilayer chip-in-chip inductor structure 20a according to some embodiments of the present invention. Figure 10 A planar schematic diagram of a multilayer chip-integrated inductor structure 20a is shown. Figure 11A and Figure 11B A planar schematic diagram of the upper and lower winding patterns of the multilayer chip-in-built-in inductor structure 20a is shown. Figure 12A and Figure 12B The following figures illustrate the various embodiments of the present invention. Figure 10 A schematic cross-sectional view of lines I-I' and II-II'. Here, Figure 10 , Figure 11A , Figure 11B , Figure 12A and Figure 12B Zhongyu Figure 4 , Figure 5A , Figure 5B and Figure 6 Components that are identical or similar in use use the same or similar designations and their descriptions may be omitted. The structure and configuration of the multilayer chip-integrated inductor structure 20a are similar to those of other components. Figure 7 , Figure 8A , Figure 8B and Figure 9A , Figure 9B The multilayer chip-in-the-loop inductor structure 20 is shown. The difference is that in the multilayer chip-in-the-loop inductor structure 20a, the upper winding pattern (i.e., the winding pattern 200G located in the upper layer L1 of the dielectric layer 100) has two winding expansions, while the lower winding pattern (i.e., the winding pattern 200H located in the lower layer L2 of the dielectric layer 100) does not have winding expansions.

[0127] like Figure 11A As shown, in some embodiments, the upper winding pattern (i.e., winding pattern 200G) is located at the upper layer L1 within the dielectric layer 100, and is adjacent to the lower winding pattern (i.e., winding pattern 200H, as shown in the figure). Figure 11B (As shown) Electrical connection. For example... Figure 11A As shown, in some embodiments, the winding pattern 200G includes a first annular winding 501', a first U-shaped winding 510', a second U-shaped winding 530', a first outer winding 520', a second outer winding 550', a third outer winding 540', and a fourth outer winding 560'. In a top view, the arrangement of the first annular winding 501', the first U-shaped winding 510', the second U-shaped winding 530', the first outer winding 520', the second outer winding 550', the third outer winding 540', and the fourth outer winding 560' is similar to... Figure 8BThe arrangement of the first annular winding 501, the first U-shaped winding 510, the second U-shaped winding 530, the first outer winding 520, the second outer winding 550, the third outer winding 540, and the fourth outer winding 560 in the winding pattern 200F.

[0128] Unlike Figure 8B The first annular winding 501 shown has an end 501a' located in the second region R2 with a width greater than the width of the other parts of the first annular winding 501'. Furthermore, the first U-shaped winding 510' has a horizontal bottom 510d and two arms 510c, and the width of the arms 510c (which may be the same as the width W4, indicated by...) Figure 5A The width is less than 510d at the bottom horizontally (it can be the same as the width W3, indicated in the figure). Figure 5A The second U-shaped winding 530' also has a horizontal bottom 530d and two arms 530c, and the width of the arms 530c (which may be the same as the width of the arms 510c) is smaller than the width of the horizontal bottom 530d (which may be the same as the width of the horizontal bottom 510d).

[0129] Unlike the second loop winding 301', the width of one end 501a' of the first loop winding 501' located in the second region R2 is greater than the width of the other parts of the first loop winding 501'. Furthermore, the first U-shaped winding 510' has a horizontal bottom 510d and two arms 510c, and the width of the arms 510c (which may be the same as the width W4, indicated by...) Figure 5A The width is less than 510d at the bottom horizontally (it can be the same as the width W3, indicated in the figure). Figure 5A The second U-shaped winding 530' also has a horizontal bottom 530d and two arms 530c, and the width of the arms 530c (which may be the same as the width of the arms 510c) is smaller than the width of the horizontal bottom 530d (which may be the same as the width of the horizontal bottom 510d). In this embodiment, the relatively narrow arms 510c and 530c may have the same line width as the other windings of the winding pattern 200G. Furthermore, in a top view, the first U-shaped winding 510' partially overlaps with the lower sixth U-shaped winding 320', and the second U-shaped winding 530' partially overlaps with the lower eighth U-shaped winding 340', as shown below. Figure 10 As shown.

[0130] In some embodiments, the first outer perimeter line 520' is similar to Figure 8B The first outer winding 520 shown has a first segment 520c and a second segment 520d separated from the first segment 520c by a horizontal bottom 510d of the first U-shaped winding 510'. Similar to... Figure 8BThe third outer winding 540 shown has a third segment 540c and a fourth segment 540d that is separated from the third segment 540c by the horizontal bottom 530d of the second U-shaped winding 530'. For example, in a top view, the third segment 540c and the fourth segment 540d correspond to the two opposite ends of the horizontal bottom 530d of the second U-shaped winding 530' and are respectively adjacent to the two arms 530c of the second U-shaped winding 530', such that the third segment 540c and the fourth segment 540d correspond to the first segment 520c and the second segment 520d, respectively. Furthermore, the fourth outer winding 560' partially surrounds the second U-shaped winding 530' and the third outer winding 540'. In this way, the third segment 540c of the third outer winding 540' is located between the corresponding arms 530c of the second outer winding 550' and the second U-shaped winding 530'. Furthermore, the fourth segment 540d of the third outer winding 540 is located between the corresponding arm 530c of the fourth outer winding 560' and the second U-shaped winding 530'. In addition, the first input / output winding 571' is connected to one end of the second outer winding 550', while the second input / output winding 572' is connected to one end of the fourth outer winding 560'.

[0131] The structure, material, and arrangement of the 200H winding pattern are essentially the same as... Figure 5B The lower winding pattern (i.e., winding pattern 200D) is shown. It will not be described again here. In some embodiments, the windings in the lower winding pattern not only stack perpendicularly to and are electrically connected to the windings of the upper winding pattern, but also partially overlap or coincide with them, such as... Figure 10 As shown.

[0132] like Figure 10 As shown, the conductive branch 101 is electrically connected to the first annular winding 501' via a conductive plug (not shown) located between its end 101a and end 501a'. Furthermore, the conductive branch 101 is electrically connected to the first annular winding 501' via a conductive plug (not shown) located between its end 501a' (e.g., Figure 11A The conductive plug (not shown) below is electrically connected to the second annular winding 301'.

[0133] like Figure 10 , Figure 11A and Figure 11B As shown, the conductive plug VC is also disposed within the dielectric layer 100 between the winding pattern 200G and the winding pattern 200H, and is electrically connected to the winding pattern 200G and the winding pattern 200H. However, the arrangement of the conductive plug VC avoids the dielectric layer 100 where the horizontal bottom 510d of the first U-shaped winding 510' overlaps with the sixth U-shaped winding 320' below it, as shown. Figure 12AAs shown. Similarly, the arrangement of the conductive plug VC also avoids the dielectric layer 100 where the horizontal bottom 530d of the second U-shaped winding 530' overlaps with the eighth U-shaped winding 340' below it, as shown. Figure 12B As shown.

[0134] Please refer to again Figure 10 , Figure 11A and Figure 11B The connecting layers 410, 420, and 430 electrically connect the ends of the corresponding annular windings, the ends of the corresponding U-shaped windings, and the ends of the corresponding outer windings in the winding patterns 200G and 200H. The corresponding upper bridging layers 410a, 420a, and 430a of the connecting layers 410, 420, and 430 span the first region R1 and the second region R2 and are located at the upper layer L1 of the dielectric layer 100, while the corresponding lower bridging layers 410b, 420b, and 430b also span the first region R1 and the second region R2 and are located at the lower layer L2 of the dielectric layer 100.

[0135] In this embodiment, the first input / output winding portion 571' and the third input / output winding portion 371' below it, the second outer winding 550' and the third outer winding 350' below it, the third outer winding 540' and the eighth U-shaped winding 340' below it, the first U-shaped winding 510' and the fifth U-shaped winding 310' below it, the lower bridging layer 410b, the upper bridging layer 420a, and the upper bridging layer 430a constitute the first multilayer inductor structure. Furthermore, the second input / output winding portion 572' and the fourth input / output winding portion 372' below it, the fourth outer winding 560' and the fourth outer winding 360' below it, the first outer winding 520' and the sixth U-shaped winding 320' below it, the second U-shaped winding 530' and the seventh U-shaped winding 330' below it, the first ring winding 501' and the second ring winding 301' below it, the upper bridging layer 410a, the lower bridging layer 420b, and the lower bridging layer 430b constitute a second multilayer inductor structure. The first multilayer inductor structure and the second multilayer inductor structure, together with the conductive branch portion 101, constitute a T-type coil inductor element (i.e., a multilayer chip-built-in inductor structure 20a).

[0136] In the multilayer chip-in-circuit inductor structure 20a, a first U-shaped winding 510' with an enlarged winding portion and a sixth U-shaped winding 320' below it form a first overlapping structure. A second U-shaped winding 530' with an enlarged winding portion and an eighth U-shaped winding 340' below it form a second overlapping structure. In the first and second overlapping structures, there are no plug connections between the overlapping metal windings. Furthermore, the first and second overlapping structures can provide stronger magnetic interaction and a larger coupling area during inductor operation, thereby improving the coupling factor (K) of the T-type coil inductor element.

[0137] Similar to winding patterns 200E and 200F, winding pattern 200G and upper bridging layers 410a, 420a, and 430a can be formed by the topmost horizontal conductive feature within dielectric layer 100. Winding pattern 200H and lower bridging layers 410b, 420b, and 430b can be formed by the second-to-topmost horizontal conductive feature within dielectric layer 100.

[0138] Please refer to Figure 13 , Figure 14A , Figure 14B , Figure 15A and Figure 15B The diagram illustrates a multilayer chip-in-chip inductor structure 30 according to some embodiments of the present invention. Figure 13 A planar schematic diagram of a multilayer chip-integrated inductor structure 30 is shown. Figure 14A and Figure 14B A planar schematic diagram of the upper and lower winding patterns of the multilayer chip-built-in inductor structure 30 is shown. Figure 15A and Figure 15B The following figures illustrate the various embodiments of the present invention. Figure 13 A schematic cross-sectional view of lines I-I' and II-II'. Here, Figure 13 , Figure 14A , Figure 14B , Figure 15A and Figure 15B Zhongyu Figure 1 , Figure 2A , Figure 2B and Figure 3 Components that are identical or similar in use use the same or similar designations and their descriptions may be omitted. The structure and configuration of the multilayer chip-built-in inductor structure 30 are similar to those of other components. Figure 1 , Figure 2A , Figure 2B and Figure 3 The multilayer chip-in-inductor structure 10 is shown. The difference is that the lower layer winding pattern (i.e., the winding pattern 200J of the lower layer L2 located within the dielectric layer 100) in the multilayer chip-in-inductor structure 30 has three winding enlargements.

[0139] like Figure 14A As shown, in some embodiments, the upper winding pattern (i.e., winding pattern 200I) is located at the upper layer L1 within the dielectric layer 100, and is adjacent to the lower winding pattern (i.e., winding pattern 200J, as shown in the figure). Figure 14B (As shown) Electrical connection. The structure, material, and arrangement of the winding pattern 200I are essentially the same as... Figure 2A The upper winding pattern shown is (i.e., winding pattern 200A). It will not be described again here.

[0140] In some embodiments, the windings in the lower winding pattern, in addition to being perpendicularly stacked and electrically connected to the windings of the upper winding pattern, also partially overlap or coincide with them, such as... Figure 13 As shown. Figure 14B As shown, in some embodiments, the winding pattern 200J includes a first annular winding 701, a first outer winding 710, a second outer winding 720, a first U-shaped outer winding 750, a second U-shaped outer winding 730, a third outer winding 740, and a fourth outer winding 760. In a top view, the first annular winding 701 is located in the first region R1 and the second region R2 and surrounds the inductor center region C. In this embodiment, the first annular winding 701 has a first U-shaped portion 701' and a second U-shaped portion 701' located in the first region R1 and the second region R2, respectively. Furthermore, the first U-shaped portion 701' has a horizontal bottom 701b and two arms 701a, and the width of the arms 701a (which may be the same as the width W2, indicated by...) Figure 2B The width of the bottom horizontal section 701b is less than the width of the bottom horizontal section (which can be the same as the width W1, as indicated in the diagram). Figure 2B In this embodiment, from a top-down view, the fifth U-shaped winding 310 partially overlaps with the horizontal bottom 701b of the lower first U-shaped portion 701'. Furthermore, the sixth U-shaped winding 320 partially overlaps with the horizontal bottom 750b of the lower first U-shaped outer winding 750. Additionally, the eighth U-shaped winding 340 partially overlaps with the horizontal bottom 730b of the lower second U-shaped outer winding 730, as shown below. Figure 13 As shown.

[0141] In some embodiments, the first outer surrounding line 710 has a first segment 710a and a second segment 710b separated from the first segment 710a by a horizontal bottom 701b of the first U-shaped portion 701'. For example, in a top view, the first segment 710a and the second segment 710b correspond to the two opposite ends of the horizontal bottom 701b of the first U-shaped portion 701' and are respectively adjacent to the two arms 701a of the first U-shaped portion 701'. Similar to the arrangement of the first outer surrounding line 710, the second outer surrounding line 720 is located outside the first outer surrounding line 710 and has a third segment 720a and a fourth segment 720b separated from the third segment 720a. For example, in a top view, the third segment 720a and the fourth segment 720b correspond to the first segment 710a and the second segment 710b respectively and are respectively adjacent to the first segment 710a and the second segment 710b.

[0142] In some embodiments, the first U-shaped outer surrounding line 750 is located in the first region R1 and surrounds the first U-shaped portion 701', the first outer surrounding line 710, and the second outer surrounding line 720. Furthermore, the second U-shaped outer surrounding line 730 is located in the second region R2 and surrounds the second U-shaped portion 701'. In some embodiments, the first U-shaped outer surrounding line 750 has a horizontal bottom 750b and two arms 750a. Furthermore, the line width of the arms 750a (which may be the same as the width of the arms 701a) is smaller than the line width of the horizontal bottom 750b (which may be the same as the width of the horizontal bottom 701b). In some embodiments, a pair of notches 751 are provided between the two ends of the arms 750a and the horizontal bottom 750b in the first U-shaped outer surrounding line 750, so that the horizontal bottom 750b and the arms 750a are partially separated by the pair of notches 751, such as... Figure 14B As shown. A pair of notches 751 help prevent current from flowing through the horizontal bottom 750b portion located between the pair of notches 751 during operation of the multilayer chip-integrated inductor structure 30. Instead, current flows through the horizontal bottom 750b portion adjacent to the bottom of the first notch 751 and the bottom of the second notch 751. This prevents the current from taking a shortcut (the portion of the horizontal bottom 750b near the first U-shaped portion 701' has a shorter horizontal distance), thus avoiding any impact on the inductance value. Similarly, the second U-shaped outer wrapping line 730 also has a horizontal bottom 730b and two arms 730a. Furthermore, the line width of the arms 730a (which may be the same as the width of the arms 701a) is smaller than the line width of the horizontal bottom 730b (which may be the same as the width of the horizontal bottom 701b).

[0143] Similar to the arrangement of the second outer surrounding line 720, the third outer surrounding line 740 is located outside the second U-shaped outer surrounding line 730 and has a fifth segment 740a and a sixth segment 740b that is separated from the fifth segment 740a by the horizontal bottom 730b of the second U-shaped outer surrounding line 730. For example, in a top view, the fifth segment 740a and the sixth segment 740b correspond to the two opposite ends of the horizontal bottom 730b of the second U-shaped outer surrounding line 730 and are respectively adjacent to the two arms 730a of the second U-shaped outer surrounding line 730, such that the fifth segment 740a and the sixth segment 740b correspond to the third segment 720a and the fourth segment 720b, respectively. Furthermore, the fourth outer surrounding line 760 partially surrounds the second U-shaped outer surrounding line 730 and the third outer surrounding line 740. In addition, the first input / output winding portion 771 is connected to one end of the first U-shaped outer winding 750, while the second input / output winding portion 772 is connected to one end of the fourth outer winding 760.

[0144] like Figure 13As shown, the conductive branch 101 is electrically connected to the second annular winding 301 via a conductive plug (not shown) located between its end 101a and end 301a. Furthermore, the conductive branch 101 is electrically connected to the first annular winding 701 via a conductive plug (not shown) located below end 301a.

[0145] like Figure 13 , Figure 14A and Figure 14B As shown, the conductive plug VC is also disposed within the dielectric layer 100 between the winding pattern 200I and the winding pattern 200J and is electrically connected to the winding pattern 200I and the winding pattern 200J. Similarly, the arrangement of the conductive plug VC avoids the dielectric layer 100 where the fifth U-shaped winding 310 overlaps with the horizontal bottom 701b of the lower first U-shaped portion 701', and also avoids the dielectric layer 100 where the sixth U-shaped winding 320 overlaps with the horizontal bottom 750b of the lower first U-shaped outer winding 750, as shown. Figure 15A As shown. Similarly, the arrangement of the conductive plug VC further avoids the dielectric layer 100 where the horizontal bottom 730b of the eighth U-shaped winding 340 overlaps with the lower second U-shaped outer winding 730, as shown. Figure 15B As shown.

[0146] Please refer to again Figure 13 , Figure 14A and Figure 14B The connecting layers 410, 420, and 430 electrically connect the ends of the corresponding annular windings, the ends of the corresponding outer windings, and the ends of the corresponding U-shaped outer windings in the winding patterns 200I and 200J. The corresponding upper bridging layers 410a, 420a, and 430a of the connecting layers 410, 420, and 430 span the first region R1 and the second region R2 and are located at the upper layer L1 of the dielectric layer 100, while the corresponding lower bridging layers 410b, 420b, and 430b also span the first region R1 and the second region R2 and are located at the lower layer L2 of the dielectric layer 100.

[0147] In this embodiment, the first input / output winding portion 771 and the upper third input / output winding portion 371, the first U-shaped outer winding 750 and the upper third outer winding 350, the third outer winding 740 and the upper eighth U-shaped winding 340, the first outer winding 710 and the upper fifth U-shaped winding 310, the lower bridging layer 410b, the upper bridging layer 420a, and the upper bridging layer 430a constitute the first multilayer inductor structure. Furthermore, the second input / output winding portion 772 and the fourth input / output winding portion 372 above it, the fourth outer winding 760 and the fourth outer winding 360 above it, the second outer winding 720 and the sixth U-shaped winding 320 above it, the second U-shaped outer winding 730 and the seventh U-shaped winding 330 above it, the first ring winding 701 and the second ring winding 301 above it, the upper bridging layer 410a, the lower bridging layer 420b, and the lower bridging layer 430b constitute a second multilayer inductor structure. The first multilayer inductor structure and the second multilayer inductor structure, together with the conductive branch portion 101, constitute a T-type coil inductor element (i.e., a multilayer chip-built-in inductor structure 30).

[0148] In the multilayer chip-in-circuit inductor structure 30, a first U-shaped portion 701' with an enlarged winding portion and a fifth U-shaped winding 310 thereon form a first overlapping structure. A first U-shaped outer winding 750 with an enlarged winding portion and a sixth U-shaped winding 320 thereon form a second overlapping structure. A second U-shaped outer winding 730 with an enlarged winding portion and an eighth U-shaped winding 340 thereon form a third overlapping structure. In the first to third overlapping structures, there are no plug connections between the overlapping metal windings. Furthermore, the first to third overlapping structures can provide stronger magnetic interaction and a larger coupling area during inductor operation, thereby improving the coupling factor (K) of the T-type coil inductor element.

[0149] Similar to winding patterns 200A and 200B, winding pattern 200I and upper bridging layers 410a, 420a and 430a can be formed by the topmost horizontal conductive feature within dielectric layer 100. Winding pattern 200J and lower bridging layers 410b, 420b and 430b can be formed by the second-to-topmost horizontal conductive feature within dielectric layer 100.

[0150] Please refer to Figure 16 , Figure 17A , Figure 17B , Figure 18A and Figure 18B The diagram illustrates a multilayer chip-in-chip inductor structure 30a according to some embodiments of the present invention. Figure 16 A planar schematic diagram of a multilayer chip-integrated inductor structure 30a is shown. Figure 17A and Figure 17BA planar schematic diagram of the upper and lower winding patterns of the multilayer chip-in-built-in inductor structure 30a is shown. Figure 18A and Figure 18B The following figures illustrate the various embodiments of the present invention. Figure 16 A schematic cross-sectional view of lines I-I' and II-II'. Here, Figure 16 , Figure 17A , Figure 17B , Figure 18A and Figure 18B The image and Figure 4 , Figure 5A , Figure 5B and Figure 6 Components that are identical or similar in type use the same or similar designations and their descriptions may be omitted. The structure and configuration of the multilayer chip-integrated inductor structure 30a are similar to those of other components. Figure 13 , Figure 14A , Figure 14B , Figure 15A and Figure 15B The multilayer chip-in-the-loop inductor structure 30 is shown. The difference is that the upper winding pattern (i.e., the winding pattern 200K located in the upper layer L1 of the dielectric layer 100) in the multilayer chip-in-the-loop inductor structure 30a has three winding expansions, while the lower winding pattern (i.e., the winding pattern 200L located in the lower layer L2 of the dielectric layer 100) does not have winding expansions.

[0151] like Figure 17A As shown, in some embodiments, the upper winding pattern (i.e., winding pattern 200K) is located at the upper layer L1 within the dielectric layer 100, and is adjacent to the lower winding pattern (i.e., winding pattern 200L, as shown in the figure). Figure 17B (As shown) Electrical connection. For example... Figure 17A As shown, in some embodiments, the winding pattern 200K includes a first loop winding 801, a first outer winding 810, a second outer winding 820, a first U-shaped outer winding 850, a second U-shaped outer winding 830, a third outer winding 840, and a fourth outer winding 860. In a top view, the arrangement of the first loop winding 801, the first outer winding 810, the second outer winding 820, the first U-shaped outer winding 850, the second U-shaped outer winding 830, the third outer winding 840, and the fourth outer winding 860 is similar to... Figure 14B The arrangement of the first annular winding 701, the first outer winding 710, the second outer winding 720, the first U-shaped outer winding 750, the second U-shaped outer winding 730, the third outer winding 740, and the fourth outer winding 760 in the winding pattern 200J.

[0152] Unlike Figure 14BThe width of one end 801a' of the first annular winding 701 located in the second region R2 is greater than the width of the other parts of the first annular winding 801. Furthermore, in this embodiment, the first annular winding 801 has a first U-shaped portion 801' and a second U-shaped portion 801" located in the first region R1 and the second region R2, respectively. Furthermore, the first U-shaped portion 801' has a horizontal bottom 801b and two arm portions 801a, and the width of the arm portions 801a (which may be the same as the width W4, indicated by...) Figure 5A The width is less than the horizontal bottom 801b (it can be the same as the width W3, indicated in the diagram). Figure 5A ).

[0153] In some embodiments, similar to Figure 14B The arrangement of the first outer surrounding line 710 shown includes a first segment 810a and a second segment 810b. For example, in a top view, the first segment 810a and the second segment 810b correspond to the two opposite ends of the horizontal bottom 801b of the first U-shaped portion 801' and are respectively arranged adjacent to the two arms 810a of the first U-shaped portion 801'. Similar to... Figure 14B The arrangement of the second outer surrounding line 720 shown is such that the second outer surrounding line 820 is located outside the first outer surrounding line 810 and has a third segment 820a and a fourth segment 820b separate from the third segment 820a. For example, in a top view, the third segment 820a and the fourth segment 820b correspond to the first segment 810a and the second segment 810b respectively and are arranged adjacent to the first segment 810a and the second segment 810b respectively.

[0154] In some embodiments, similar to Figure 14B The arrangement of the first U-shaped outer surrounding line 750 and the second U-shaped outer surrounding line 730 shown is such that the first U-shaped outer surrounding line 850 is located in the first region R1 and surrounds the first U-shaped portion 801', the first outer surrounding line 810, and the second outer surrounding line 820, and the second U-shaped outer surrounding line 830 is located in the second region R2 and surrounds the second U-shaped portion 801'. In some embodiments, the first U-shaped outer surrounding line 850 has a horizontal bottom 850b and two arms 850a. Furthermore, the line width of the arms 850a (which may be the same as the width of the arms 801a) is smaller than the line width of the horizontal bottom 850b (which may be the same as the width of the horizontal bottom 801b). Furthermore, as... Figure 17A As shown, a pair of notches 851 are also present between the two ends of the arm portion 850a and the horizontal bottom portion 850b in the first U-shaped outer surrounding line 850, which serve the same function as Figure 14BA pair of notches 751 are shown. In addition, the second U-shaped outer surrounding line 830 also has a horizontal bottom 830b and two arms 830a. Furthermore, the line width of the arms 830a (which may be the same as the width of the arms 801a) is smaller than the line width of the horizontal bottom 830b (which may be the same as the width of the horizontal bottom 801b).

[0155] Similar to Figure 14B The arrangement of the third outer surrounding line 740 shown is such that the third outer surrounding line 840 is located outside the second U-shaped outer surrounding line 830 and has a fifth segment 840a and a sixth segment 840b separated from the fifth segment 840a. For example, in a top view, the fifth segment 840a and the sixth segment 840b are respectively arranged adjacent to the two arms 830a of the second U-shaped outer surrounding line 830, such that the fifth segment 840a and the sixth segment 840b correspond to the third segment 820a and the fourth segment 820b, respectively. Furthermore, the fourth outer surrounding line 860 partially surrounds the second U-shaped outer surrounding line 830 and the third outer surrounding line 840. In addition, the first input / output winding portion 871 is connected to one end of the first U-shaped outer surrounding line 850, and the second input / output winding portion 872 is connected to one end of the fourth outer surrounding line 860.

[0156] The structure, material, and arrangement of the 200L winding pattern are essentially the same as... Figure 5B The lower winding pattern (i.e., winding pattern 200D) is shown. It will not be described again here. In some embodiments, the windings in the lower winding pattern not only stack perpendicularly to and are electrically connected to the windings of the upper winding pattern, but also partially overlap or coincide with them, such as... Figure 16 As shown.

[0157] In this embodiment, from a top-down view, the fifth U-shaped winding 310' partially overlaps with the horizontal bottom 801b of the upper first U-shaped portion 801'. Furthermore, the sixth U-shaped winding 320' partially overlaps with the horizontal bottom 850b of the upper first U-shaped outer winding 850. Additionally, the eighth U-shaped winding 340' partially overlaps with the horizontal bottom 830b of the upper second U-shaped outer winding 830, as shown below. Figure 16 As shown.

[0158] like Figure 16 As shown, the conductive branch 101 is electrically connected to the first annular winding 801 via a conductive plug (not shown) located between its end 101a and end 801a'. Furthermore, the conductive branch 101 is electrically connected to the second annular winding 301' via a conductive plug (not shown) located below end 801a'.

[0159] like Figure 16 , Figure 17A and Figure 17BAs shown, the conductive plug VC is also disposed within the dielectric layer 100 between the winding pattern 200K and the winding pattern 200L, and is electrically connected to the winding pattern 200K and the winding pattern 200L. However, the arrangement of the conductive plug VC avoids the dielectric layer 100 where the horizontal bottom 801b of the fifth U-shaped winding 310' overlaps with the upper first U-shaped portion 801', and also avoids the dielectric layer 100 where the horizontal bottom 850b of the sixth U-shaped winding 320' overlaps with the upper first U-shaped outer winding 850, as shown. Figure 18A As shown. Similarly, the arrangement of the conductive plug VC further avoids the dielectric layer 100 where it overlaps with the horizontal bottom 830b of the eighth U-shaped winding 340' and the upper second U-shaped outer winding 830, as shown. Figure 18B As shown.

[0160] Please refer to again Figure 16 , Figure 17A and Figure 17B The connecting layers 410, 420, and 430 electrically connect the ends of the corresponding annular windings, the ends of the corresponding outer windings, and the ends of the corresponding U-shaped outer windings in the winding patterns 200K and 200L. The corresponding upper bridging layers 410a, 420a, and 430a of the connecting layers 410, 420, and 430 span the first region R1 and the second region R2 and are located at the upper layer L1 of the dielectric layer 100, while the corresponding lower bridging layers 410b, 420b, and 430b also span the first region R1 and the second region R2 and are located at the lower layer L2 of the dielectric layer 100.

[0161] In this embodiment, the first input / output winding portion 871 and the third input / output winding portion 371' below it, the first U-shaped outer winding 850 and the third outer winding 350' below it, the third outer winding 840 and the eighth U-shaped winding 340' below it, the first outer winding 810 and the fifth U-shaped winding 310' below it, the lower bridging layer 410b, the upper bridging layer 420a, and the upper bridging layer 430a constitute the first multilayer inductor structure. Furthermore, the second input / output winding portion 872 and the fourth input / output winding portion 372' below it, the fourth outer winding 860 and the fourth outer winding 360' below it, the second outer winding 820 and the sixth U-shaped winding 320' below it, the second U-shaped outer winding 830 and the seventh U-shaped winding 330' below it, the first ring winding 801 and the second ring winding 301' below it, the upper bridging layer 410a, the lower bridging layer 420b, and the lower bridging layer 430b constitute a second multilayer inductor structure. The first multilayer inductor structure and the second multilayer inductor structure, together with the conductive branch portion 101, constitute a T-type coil inductor element (i.e., a multilayer chip-built-in inductor structure 30a).

[0162] In the multilayer chip-in-circuit inductor structure 30a, a first U-shaped portion 801' with an enlarged winding portion and a fifth U-shaped winding 310' below it form a first overlapping structure. A first U-shaped outer winding 850 with an enlarged winding portion and a sixth U-shaped winding 320' below it form a second overlapping structure. A second U-shaped outer winding 830 with an enlarged winding portion and an eighth U-shaped winding 340' below it form a third overlapping structure. In the first to third overlapping structures, there are no plug connections between the overlapping metal windings. Furthermore, the first to third overlapping structures can provide stronger magnetic interaction and a larger coupling area during inductor operation, thereby improving the coupling factor (K) of the T-type coil inductor element.

[0163] Similar to winding patterns 200I and 200J, winding pattern 200K and upper bridging layers 410a, 420a and 430a can be formed by the topmost horizontal conductive feature within dielectric layer 100. Winding pattern 200L and lower bridging layers 410b, 420b and 430b can be formed by the second-to-topmost horizontal conductive feature within dielectric layer 100.

[0164] According to the multilayer chip-in-inductor structure of the above embodiment, one or more overlapping structures (without plugs between windings) and stacked structures (with plugs between windings) are formed in the winding path starting from the first input / output terminal to the center of the inductor and / or in the winding path starting from the second input / output terminal to the center of the inductor. This overlapping structure and stacked structure are formed by a lower winding with an enlarged winding portion and an adjacent upper winding portion above it. Alternatively, it is formed by an upper winding with an enlarged winding portion and an adjacent lower winding portion below it. Furthermore, in the overlapping structure, there is no conductive plug between one of the adjacent windings and the corresponding winding with an enlarged winding portion, while the other is electrically connected to the corresponding winding with an enlarged winding portion through a conductive plug, forming a stacked structure. In this way, the configuration of overlapping structures with enlarged winding portions in the multilayer chip-in-inductor structure can provide stronger magnetic interaction and a larger coupling area during inductor operation, thereby establishing a larger wide-side coupling. Therefore, the coupling factor (K) of the T-type coil inductor element can be improved / enhanced. Meanwhile, the configuration of the stacked structure with the winding expansion section can maintain the quality factor (Qfactor) of the inductor.

[0165] The foregoing summary outlines the features of several embodiments of the present invention, enabling those skilled in the art to more readily understand the nature of the invention. Anyone skilled in the art should understand that the present invention can be readily used as a basis for modifications or designs to other manufacturing processes or structures to achieve the same objectives and / or obtain the same advantages as the embodiments described herein. Those skilled in the art will also understand that equivalent structures described above do not depart from the spirit and scope of the present invention, and that modifications, substitutions, and refinements can be made without departing from the spirit and scope of the invention.

Claims

1. A multilayer chip-embedded inductor structure, comprising: The dielectric layer has a first region and a second region divided by the center line of the inductor center region; The first winding pattern is disposed in the layer below the dielectric layer, including: A first U-shaped winding and a second U-shaped winding are located in the first region and are adjacent to each other, wherein the second U-shaped winding surrounds the first U-shaped winding; and The third U-shaped winding and the fourth U-shaped winding are located in the second area and are respectively arranged corresponding to the first U-shaped winding and the second U-shaped winding; A first loop winding surrounds the central region of the inductor and is jointly surrounded by the first U-shaped winding and the third U-shaped winding; and The second winding pattern is disposed in the layer above the dielectric layer, and is perpendicularly stacked and electrically connected to the first winding pattern. The second U-shaped winding has a horizontal bottom and two arms, and the line width of the two arms is smaller than the line width of the horizontal bottom.

2. The multilayer chip-embedded inductor structure as described in claim 1, wherein the first winding pattern further includes: The first outer winding has a first segment and a second segment separated therefrom, wherein the first segment and the second segment are respectively adjacent to the two arms of the second U-shaped winding; The second outer wrapping line partially wraps around the fourth U-shaped wrapping line; The first input / output winding portion is connected to the first segment of the first outer winding; as well as The second input / output winding is connected to the second outer winding.

3. The multilayer chip-embedded inductor structure as described in claim 1, wherein the second winding pattern comprises: The fifth U-shaped winding and the sixth U-shaped winding are located in the first region and are adjacent to each other, wherein the sixth U-shaped winding surrounds the fifth U-shaped winding; The seventh and eighth U-shaped windings are located in the second region and are respectively arranged corresponding to the fifth and sixth U-shaped windings; and The second annular winding is formed by the fifth U-shaped winding and the seventh U-shaped winding, and is arranged perpendicularly to and electrically connected to the first annular winding. The line widths of the fifth, sixth, seventh, and eighth U-shaped windings are the same as the line widths of the two arms.

4. The multilayer chip-embedded inductor structure as described in claim 3, wherein the second winding pattern further includes: The third outer surrounding line surrounds the sixth U-shaped surrounding line; The fourth outer surrounding line partially surrounds the eighth U-shaped surrounding line; The third input / output winding section is connected to the third outer winding wire; as well as The fourth input / output winding section is connected to the fourth outer winding.

5. The multilayer chip-in-circuit inductor structure as described in claim 4, wherein, in a top view, the second U-shaped winding partially overlaps with the third outer winding and with the entire sixth U-shaped winding, while the first U-shaped winding, the third U-shaped winding, and the fourth U-shaped winding respectively overlap with the fifth U-shaped winding, the seventh U-shaped winding, and the eighth U-shaped winding.

6. The multilayer chip-embedded inductor structure as described in claim 5, further comprising: Multiple conductive plugs are disposed within the dielectric layer between the first winding pattern and the second winding pattern, but avoid the dielectric layer located at the partial overlap between the third outer winding and the second U-shaped winding.

7. The multilayer chip-embedded inductor structure as described in claim 3, further comprising: A conductive branch is disposed in the second region and located above the first and second annular windings, and is electrically connected thereto.

8. A multilayer chip-embedded inductor structure, comprising: The dielectric layer has a first region and a second region divided by the center line of the inductor center region; The first winding pattern, disposed in the layer below the dielectric layer, includes: The first loop winding surrounds the central area of ​​the inductor; The first U-shaped winding and the second U-shaped winding are located in the first area and the second area respectively and together surround the first loop winding. Each of the first U-shaped winding and the second U-shaped winding has a horizontal bottom and two arms, and the line width of the two arms is smaller than the line width of the horizontal bottom. The first outer winding has a first segment and a second segment separated therefrom, and the first segment and the second segment are respectively adjacent to the two arms of the first U-shaped winding; The second outer surrounding line surrounds the first U-shaped surrounding line and the first outer surrounding line; The third outer winding has a third segment and a fourth segment separated from it, and the third segment and the fourth segment are respectively adjacent to the two arms of the second U-shaped winding; and The fourth outer surrounding line partially surrounds the second U-shaped surrounding line and the third outer surrounding line; and The second winding pattern is disposed on the upper layer of the dielectric layer and is stacked perpendicularly to and electrically connected to the first winding pattern.

9. The multilayer chip-embedded inductor structure as described in claim 8, wherein the first winding pattern further includes: The first input / output winding portion is connected to the second outer winding; as well as The second input / output winding is connected to the fourth outer winding.

10. The multilayer chip-embedded inductor structure as described in claim 8, wherein the second winding pattern comprises: The second annular winding is arranged perpendicularly to and electrically connected to the first annular winding; The third U-shaped winding and the fourth U-shaped winding are located in the first region and are adjacent to each other, wherein the fourth U-shaped winding surrounds the third U-shaped winding; and The fifth and sixth U-shaped windings are located in the second zone and are respectively arranged corresponding to the third and fourth U-shaped windings. The line widths of the third, fourth, fifth, and sixth U-shaped windings are the same as the line widths of the two arms.

11. The multilayer chip-embedded inductor structure as described in claim 10, wherein the second winding pattern further includes: The fifth outer wrapping line surrounds the fourth U-shaped wrapping line; The sixth outer surrounding line, partially surrounding the sixth U-shaped surrounding line; The third input / output winding section is connected to the fifth outer winding; as well as The fourth input / output winding section is connected to the sixth outer winding.

12. The multilayer chip-in-circuit inductor structure as described in claim 10, wherein, in a top view, the fourth U-shaped winding partially overlaps with the first U-shaped winding, and the sixth U-shaped winding partially overlaps with the second U-shaped winding.

13. The multilayer chip-embedded inductor structure as described in claim 12, further comprising: Multiple conductive plugs are disposed within the dielectric layer between the first winding pattern and the second winding pattern, but avoid the dielectric layer located at the partial overlap between the fourth U-shaped winding and the first U-shaped winding, and the dielectric layer located at the partial overlap between the sixth U-shaped winding and the second U-shaped winding.

14. The multilayer chip-embedded inductor structure as described in claim 10, further comprising: A conductive branch is disposed in the second region and located above the first and second annular windings, and is electrically connected thereto.

15. A multilayer chip-embedded inductor structure, comprising: The dielectric layer has a first region and a second region divided by the center line of the inductor center region; The first winding pattern is disposed in the layer below the dielectric layer, including: A first loop winding surrounds the central region of the inductor and has a first U-shaped portion and a second U-shaped portion located in the first region and the second region respectively, wherein the first U-shaped portion has a horizontal bottom and two arms; The first outer surrounding line has a first segment and a second segment separated therefrom, and the first segment and the second segment are respectively adjacent to the two arms of the first U-shaped portion; The second outer surrounding line has a third segment and a fourth segment separated from it, and the third segment and the fourth segment are respectively adjacent to the first segment and the second segment; The first U-shaped outer surrounding line is located in the first region and surrounds the first U-shaped portion, the first outer surrounding line, and the second outer surrounding line; The second U-shaped outer surrounding line is located in the second area and surrounds the second U-shaped portion, wherein the first U-shaped outer surrounding line and the second U-shaped outer surrounding line each have a horizontal bottom and two arms; The third outer surrounding line has a fifth segment and a separate sixth segment, and the fifth segment and the sixth segment are respectively adjacent to the two arms of the second U-shaped outer surrounding line; and The fourth outer surrounding line partially surrounds the second U-shaped outer surrounding line and the third outer surrounding line; and The second winding pattern is disposed in the layer above the dielectric layer, and is perpendicularly stacked and electrically connected to the first winding pattern. The line width of the two arms in the first U-shaped section is smaller than the line width of the horizontal bottom. The line width of the two arms in the first U-shaped outer surrounding line is smaller than the line width of the horizontal bottom; and The line width of the two arms in the second U-shaped outer surrounding line is smaller than the line width of the horizontal bottom.

16. The multilayer chip-in-inductor structure as described in claim 15, wherein the horizontal bottom of the first U-shaped outer surrounding line has a first notch and a second notch between it and the two arms, thereby partially separating the horizontal bottom from the two arms.

17. The multilayer chip-embedded inductor structure as described in claim 15, wherein the first winding pattern further includes: The first input / output winding section is connected to the first U-shaped outer winding wire; as well as The second input / output winding is connected to the fourth outer winding.

18. The multilayer chip-embedded inductor structure as described in claim 15, wherein the second winding pattern comprises: The second loop winding surrounds the center area of ​​the inductor and is arranged perpendicularly to and electrically connected to the first loop winding; The first U-shaped winding and the second U-shaped winding are located in the first area and are adjacent to each other, wherein the second U-shaped winding surrounds the first U-shaped winding; The third and fourth U-shaped windings are located in the second region and are arranged corresponding to the first and second U-shaped windings, respectively. The line widths of the first U-shaped winding, the second U-shaped winding, the third U-shaped winding, and the fourth U-shaped winding are the same as the line widths of the two arms.

19. The multilayer chip-embedded inductor structure as described in claim 18, wherein the second winding pattern further comprises: The fifth outer wrapping line surrounds the second U-shaped wrapping line; The sixth outer surrounding line partially surrounds the fourth U-shaped surrounding line; The third input / output winding section is connected to the fifth outer winding; as well as The fourth input / output winding section is connected to the sixth outer winding.

20. The multilayer chip-in-circuit inductor structure as claimed in claim 18, wherein, in a top view, the first U-shaped winding partially overlaps with the horizontal bottom of the first U-shaped portion, the second U-shaped winding partially overlaps with the horizontal bottom of the outer surrounding line of the first U-shaped portion, and the fourth U-shaped winding partially overlaps with the horizontal bottom of the outer surrounding line of the second U-shaped portion.

21. The multilayer chip-embedded inductor structure as described in claim 20, further comprising: Multiple conductive plugs are disposed in the dielectric layer between the first winding pattern and the second winding pattern, but avoid the dielectric layer located at the point where the horizontal bottom of the first U-shaped winding and the first U-shaped portion partially overlap, the dielectric layer located at the point where the horizontal bottom of the second U-shaped winding and the outer winding of the first U-shaped portion partially overlap, and the dielectric layer located at the point where the horizontal bottom of the fourth U-shaped winding and the outer winding of the second U-shaped portion partially overlap.

22. The multilayer chip-embedded inductor structure as described in claim 18, further comprising: A conductive branch is disposed in the second region and located above the first and second annular windings, and is electrically connected thereto.

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