A consumable chip shielding packaging structure

Abstract

This invention relates to the field of chip packaging technology, and more particularly to a shielded packaging structure for consumable chips. The technical solution includes two side shielding plates symmetrically arranged on the top of a substrate. A rear shielding plate is fixedly installed at the end of each side shielding plate. The rear shielding plate has a U-shaped structure, and the two side shielding plates and the rear shielding plate surround the chip body. In this invention, hot air generated by the printer cartridge heat source flows between two adjacent fins, increasing the contact area between the hot air and the fins. The heat is transferred to the chip body through a heat spreader covered with a low thermal conductivity buffer layer. The heat flow passes through the fin assembly and is guided to the chip body by the filling flexible plate, the rear shielding plate, and the ramp strips, increasing the temperature of the chip body. This avoids the large temperature difference between the high printer temperature and the low consumable chip body temperature, which could cause different degrees of expansion or contraction of the materials inside the chip body, generating thermal stress and leading to structural damage such as microcracks inside the chip body.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, and in particular to a shielding packaging structure for consumable chips. Background Technology

[0002] Genuine printer consumable chips typically record consumable usage, such as ink or toner levels and page counts. When certain limits are reached, they will prompt for consumable replacement or restrict the printer's continued operation. Chip blocking is mainly to bypass these restrictions, allowing users to continue using depleted or non-genuine consumables, thereby reducing printing costs.

[0003] Patent document CN120709265A proposes a chip magnetic shielding packaging structure. This structure provides magnetic shielding to the chip located within the central cavity of the packaging structure through a shielding layer. Wiring is achieved through openings and channels within the shielding layer, improving the uniformity of the magnetic field distribution within the packaging structure and reducing magnetic leakage at the window, thereby enhancing the chip's effectiveness and reliability in magnetic field environments. The shielding packaging structure is made of iron-nickel soft magnetic alloy material, offering advantages such as moderate structural size and reduced production costs.

[0004] In winter, due to the low ambient temperature and the low power consumption and low heat generation of the consumable chip itself, the temperature is close to the ambient temperature. During the operation of the printer, heat is generated in other locations and transferred to the chip. Under the condition of excessive temperature difference for a long time, the chip pins will become fatigued and data will be lost. In addition, the chip cannot properly identify the status of the consumable after shielding, which will affect the operational stability of the shielded chip. Summary of the Invention

[0005] The purpose of this invention is to address the problems existing in the background art by proposing a shielding and packaging structure for consumable chips.

[0006] The technical solution of the present invention: a consumable chip shielding packaging structure, including a substrate, wherein a chip body is fixedly mounted on the top of the substrate, and further comprising: The heat preservation mechanism includes two side shielding plates symmetrically arranged on the top of the substrate. A rear shielding plate is fixedly installed at the end of the side shielding plate. The rear shielding plate adopts a U-shaped structure. The two side shielding plates and the rear shielding plate surround the chip body. A guide plate is fixedly installed on the side of the side shielding plate facing the chip body. A sealing plate that docks with the chip body is fixedly installed on the side of the guide plate. The top of the chip body is in contact with a heat spreader plate covered with a low thermal conductivity buffer layer. A fin assembly is fixedly installed on the top of the heat spreader plate, with the ends of the fin assembly facing the printer ink cartridge heat source. A front baffle is fixedly installed on the top of the substrate.

[0007] Optionally, the fin assembly includes multiple parallel fins, and hot air generated by the printer cartridge heat source flows between two adjacent fins. The bottom of each of the multiple fins is fixedly connected to a heat spreader plate covered with a low thermal conductivity buffer layer on top.

[0008] Optionally, a filling soft plate is fixedly installed on the rear shield plate facing the fin assembly, the side shield plate and the filling soft plate form a heat insulation cavity, and the side of the side shield plate and the side of the filling soft plate are both fixedly connected to the fin assembly.

[0009] Optionally, the guide plate is inclined, with its end facing the center of the arc of the filler plate cross section.

[0010] Optionally, both the side shielding plate and the rear shielding plate are made of heat-conducting plate material, and the bottom of the filling soft plate is fixedly installed with an inclined ramp strip, the bottom of which is in contact with the substrate.

[0011] Optionally, the bottom of the side shielding plate is provided with an adjustment mechanism, the adjustment mechanism including a first track fixedly installed on the top of the substrate, a second track slidably connected to the top of the first track, and the top of the second track fixedly connected to the side shielding plate.

[0012] Optionally, two rear shielding plates and filling soft plates are provided, and the rear shielding plate and the filling soft plate have inner cavities, with an inner plate slidably connected inside the inner cavity.

[0013] Optionally, the insert panel adopts a U-shaped structure, and the curvature of the insert panel is the same as the curvature of the filling soft board.

[0014] Optionally, the first track is provided with a positioning mechanism, which includes a slider that slides within the first track. The slider is fixedly installed on the inner wall of the second track. A support plate perpendicular to the slider is fixedly installed on the side of the slider. A spring sheet is elastically connected to the end of the support plate. The spring sheet abuts against the first track and has an arc-shaped structure.

[0015] Optionally, a pressure rod is slidably connected to the inner wall of the second track, and the end of the pressure rod contacts a spring plate.

[0016] In summary, this application includes at least one of the following beneficial technical effects: 1. In winter, when the printer is not running, the consumable temperature is the same as the ambient temperature. However, when the printer is running, inkjet printing requires heating the ink cartridge, causing the temperature at the ink cartridge to rise rapidly. Hot air generated by the printer's ink cartridge heat source flows between two adjacent fins, increasing the contact area between the hot air and the fins. The heat is then transferred to the chip body through a heat spreader covered with a low thermal conductivity buffer layer on top. The heat flow passes through the fin assembly and is guided to the chip body by the filling flexible plate, rear shielding plate, and ramp strips. This reduces the excessive temperature difference between the chip body and the ink cartridge heat source. It avoids situations where the printer temperature is high but the consumable chip body temperature is low. Because the printer consumable chip is close to the ink cartridge heat source, the ink cartridge heat source generates high temperatures during printing. The consumable chip has a side close to the ink cartridge heat source and a side far away from the ink cartridge heat source, resulting in uneven heating. Large instantaneous temperature differences cause different degrees of expansion or contraction of the materials inside the chip body, thereby generating thermal stress and causing structural damage such as microcracks inside the chip body.

[0017] 2. The present invention adjusts the lateral position of the two side shielding plates by drawing a second track on the top of the first track. By sliding the side shielding plates to make them slide on the top of the second track, the distance between the two side shielding plates is adjusted, thereby adapting to consumable chips of different sizes. After the position of the side shielding plates is changed, the sealing plate on the side of the side shielding plate docks with the consumable chip to improve the sealing performance of the heat preservation cavity formed by the side shielding plate and the rear shielding plate.

[0018] 3. In this invention, the elasticity of the spring plate pushes the support plate to increase the friction between the slider and the first track, thereby positioning the second track. When the pressure rod moves to the side of the spring plate, the arc surface of the spring plate abuts against the rod body of the pressure rod, and the spring plate no longer applies pressure to the slider toward the second track, thus unlocking the second track. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the fin assembly structure in its separated state. Figure 3 This is a schematic diagram showing the separation state of the insulation mechanism; Figure 4 This is a schematic diagram of the first track structure in its separated state; Figure 5 This is a cross-sectional view of the side shielding plate structure; Figure 6 This is a schematic diagram of the sealing plate structure; Figure 7 This is a schematic diagram of the second track structure; Figure 8 for Figure 7 A magnified schematic diagram of the spring sheet structure in part A.

[0020] Reference numerals: 1. Substrate; 2. Chip body; 3. Heat spreader plate with a low thermal conductivity buffer layer on top; 4. Fin assembly; 5. Insulation mechanism; 51. Side shielding plate; 52. Rear shielding plate; 53. Guide plate; 54. Sealing plate; 55. Filler flexible plate; 56. Ramp bar; 6. Adjustment mechanism; 61. First track; 62. Second track; 63. Embedded plate; 64. Inner cavity; 7. Positioning mechanism; 71. Pressure rod; 72. Slider; 73. Support plate; 74. Spring sheet; 8. Front baffle. Detailed Implementation

[0021] The technical solution of this application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0022] The components of the embodiments of this application described and shown in the accompanying drawings can be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of this application provided in the drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application.

[0023] Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0024] In the description of this application, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0025] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0026] Example: The present invention proposes a consumable chip shielding and packaging structure, such as... Figure 1As shown, the device includes a substrate 1, a chip body 2 fixedly mounted on the top of the substrate 1, a heat spreader 3 with a low thermal conductivity buffer layer on top of the chip body 2, and a fin assembly 4 fixedly mounted on the top of the heat spreader 3 with a low thermal conductivity buffer layer on top, with the ends of the fin assembly 4 facing the printer ink cartridge heat source.

[0027] The heat generated at the printer cartridge heat source, while the temperature at the consumable chip is low, causes the hotter air to flow towards the cooler air.

[0028] The fin assembly 4 includes multiple parallel fins. Hot air generated by the printer cartridge heat source flows between two adjacent fins, increasing the contact area between the hot air and the fins. The bottoms of the multiple fins are fixedly connected to the heat spreader 3 covered with a low thermal conductivity buffer layer on top. The fins transfer the temperature to the heat spreader 3 covered with a low thermal conductivity buffer layer on top. The heat spreader 3 heats the chip. Here, the fin assembly 4 is not for heat dissipation, but to achieve passive heat replenishment when replenishing heat for the consumable chip. The low thermal conductivity buffer layer on top of the heat spreader 3 prevents the temperature from increasing instantaneously.

[0029] If the printer's internal temperature and humidity are high, and the low-temperature consumable chip body 2 enters, water vapor in the surrounding air may condense into water droplets on the surface of the chip body 2. This could not only cause a short circuit but also corrode the metal pins and other parts of the chip body 2, thereby affecting its electrical connection performance and normal operation.

[0030] The chip body 2 is composed of layers of various materials, each with a different coefficient of thermal expansion. When the printer temperature is high and the chip body 2 temperature is low, the significant temperature difference causes different parts of the chip body 2 to expand or contract to varying degrees, resulting in thermal stress. Frequent or prolonged exposure to this temperature difference environment, with repeated thermal stress, may lead to structural damage such as microcracks inside the chip body 2, affecting its long-term reliability and service life.

[0031] like Figures 3 to 5 As shown, a heat preservation mechanism 5 is provided on the top of the substrate 1. The heat preservation mechanism 5 includes two side shielding plates 51 symmetrically arranged on the top of the substrate 1. A rear shielding plate 52 is fixedly installed at the end of the side shielding plate 51. The rear shielding plate 52 adopts a U-shaped structure. The two side shielding plates 51 and the rear shielding plate 52 surround the chip body 2. The hot air at the ink cartridge heat source passes through the fin group 4 and is guided by the heat flow through the rear shielding plate 52.

[0032] A guide plate 53 is fixedly installed on the side of the side shielding plate 51 facing the chip body 2. A sealing plate 54 that docks with the chip body 2 is fixedly installed on the side of the guide plate 53. The guide plate 53 guides the heat flow, and the sealing plate 54 contacts the chip body 2 to improve the sealing performance. A front baffle 8 is fixedly installed on the top of the substrate 1. The two side shielding plates 51, the rear shielding plate 52 and the front baffle 8 form a fence. The fin assembly 4 is the top cover and cooperates with the substrate 1 to clamp the chip body 2. The substrate 1, the fin assembly 4, the two side shielding plates 51, the rear shielding plate 52 and the front baffle 8 are combined to shield the chip body 2.

[0033] A filling soft plate 55 is fixedly installed on the rear shield plate 52 facing the fin group 4. The side shield plate 51 and the filling soft plate 55 form a heat preservation cavity. The side of the side shield plate 51 and the side of the filling soft plate 55 are both fixedly connected to the fin group 4.

[0034] The guide plate 53 is inclined, with its end facing the center of the arc of the filler plate 55. The side shielding plate 51 and the rear shielding plate 52 are both made of heat-conducting plate material. An inclined ramp strip 56 is fixedly installed at the bottom of the filler plate 55, and the bottom of the ramp strip 56 is in contact with the substrate 1.

[0035] The stark contrast between the low ambient temperature in winter and the heat generated by the ink cartridge heat source during operation, coupled with the fact that the consumable chip itself does not generate heat and is easily affected by the environment, results in the chip's temperature being close to the ambient temperature when the printer is off. When the printer is turned on, the ink cartridge heats up, and because the consumable chip is close to the heat source, the heat from the ink cartridge is transferred to the chip. This sudden temperature difference can cause different parts of the chip to expand or contract at different rates, generating thermal stress that can lead to structural damage such as microcracks inside the chip. At the same time, because the printer consumable chip is close to the ink cartridge heat source, the ink cartridge heats up during printing, resulting in uneven heating of the chip, with one side closer to the ink cartridge heat source and the other side farther away.

[0036] In winter, ambient temperatures are generally between 5-15℃, and the initial temperature of the consumable chip remains at a low level. However, when the ink cartridge is working (such as the printhead of an inkjet printer), the heat source temperature is stable at 40-60℃, at which point the chip temperature is much lower than the ink cartridge's heat source temperature. The fins, as metal heat-conducting components, actively absorb heat from the ink cartridge's heat source—on the one hand, receiving heat transferred from the heat source through thermal conduction, and on the other hand, absorbing the heat radiation emitted by the heat source. This heat is then directed to the even cooler chip, forming a reverse heating path of "heat source → fins → chip".

[0037] In summer, the ambient temperature reaches 25-35℃, causing the chip's temperature to rise initially. However, the ink cartridge's heat source temperature is only 40-60℃, and heat loss occurs between the heat source and the chip. The temperature difference between the heat source and the chip is significantly reduced, making the chip primarily a heat output device. The fins then quickly dissipate the chip's own heat and any absorbed radiant heat into the air. The heat transfer direction is "chip → fins → air," preventing reverse heating and thus providing heat dissipation.

[0038] In this invention, the hot air generated by the printer ink cartridge heat source flows between two adjacent fins, increasing the contact area between the hot air and the fins. The heat is then transferred to the chip body 2 through the heat spreader 3, which is covered with a low thermal conductivity buffer layer on top. The heat flow passes through the fin assembly 4 and is guided to the chip body 2 by the filling soft plate 55, the rear shielding plate 52, and the ramp strip 56, thereby increasing the temperature of the chip body 2. This avoids the situation where the printer temperature is high and the chip body 2 temperature is low, which would cause different degrees of expansion or contraction of the materials inside the chip body 2, resulting in thermal stress and structural damage such as microcracks inside the chip body 2.

[0039] like Figure 4 and Figure 6 As shown, an adjustment mechanism 6 is provided at the bottom of the side shielding plate 51. The adjustment mechanism 6 includes a first track 61 fixedly installed on the top of the substrate 1, a second track 62 slidably connected to the top of the first track 61, and the top of the second track 62 fixedly connected to the side shielding plate 51.

[0040] The lateral position of the side shielding plate 51 is adjusted by sliding the second track 62 at the top of the first track 61, and the longitudinal position of the side shielding plate 51 is adjusted by sliding the side shielding plate 51 at the top of the second track 62, so that the side shielding plate 51 and the rear shielding plate 52 surround the chip body 2, and the sealing plate 54 abuts against the chip body 2.

[0041] Two rear shielding plates 52 and filling soft plates 55 are provided. The rear shielding plate 52 and the filling soft plate 55 are provided with inner cavities 64. An inner plate 63 is slidably connected inside the inner cavity 64. The inner plate 63 adopts a U-shaped structure, and the curvature of the inner plate 63 is the same as that of the filling soft plate 55.

[0042] When adjusting the longitudinal distance between the two side shielding plates 51, the inner plate 63 is pulled out from the inner cavity 64, and the distance between the two rear shielding plates 52 changes. The inner plate 63 fills the space between the two rear shielding plates 52 to avoid any gaps.

[0043] The present invention adjusts the lateral position of the two side shielding plates 51 by drawing the second track 62 on the top of the first track 61. By sliding the side shielding plates 51 to make them slide on the top of the second track 62, the distance between the two side shielding plates 51 is adjusted, thereby adapting to consumable chips of different sizes. After the position of the side shielding plates 51 is changed, the sealing plate 54 on the side of the side shielding plate 51 docks with the consumable chip to improve the sealing performance of the heat preservation cavity formed by the side shielding plates 51 and the rear shielding plate 52.

[0044] like Figure 7 and Figure 8 As shown, a positioning mechanism 7 is provided inside the first track 61. The positioning mechanism 7 includes a slider 72 that slides within the first track 61. The slider 72 is fixedly installed on the inner wall of the second track 62. A support plate 73 perpendicular to the slider 72 is fixedly installed on the side of the slider 72. A spring plate 74 is elastically connected to the end of the support plate 73. The spring plate 74 abuts against the first track 61 and has an arc-shaped structure. The elasticity of the spring plate 74 pushes the support plate 73, increasing the friction between the slider 72 and the first track 61, thereby positioning the second track 62.

[0045] A pressure rod 71 is slidably connected to the inner wall of the second track 62. The end of the pressure rod 71 contacts the spring sheet 74. The pressure rod 71 compresses the spring sheet 74, causing it to bend. When the pressure rod 71 moves to the side of the spring sheet 74, the curved surface of the spring sheet 74 abuts against the rod body of the pressure rod 71. At this time, the spring sheet 74 no longer applies pressure to the slider 72 towards the second track 62, thus adjusting the position of the second track 62. A positioning mechanism 7 is also provided between the second track 62 and the side shielding plate 51 to position the side shielding plate 51.

[0046] The present invention increases the friction between the slider 72 and the first track 61 by the elastic push of the spring plate 74 to the support plate 73, thereby positioning the second track 62. When the pressure rod 71 moves to the side of the spring plate 74, the arc surface of the spring plate 74 abuts against the rod body of the pressure rod 71, and the spring plate 74 no longer applies pressure to the slider 72 toward the second track 62, that is, the second track 62 is unlocked.

[0047] The above specific embodiments are merely several optional embodiments of the present invention. Based on the technical solutions of the present invention and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

Claims

1. A consumable chip shielding packaging structure, comprising a substrate (1), wherein a chip body (2) is fixedly mounted on the top of the substrate (1), characterized in that, Also includes: The heat preservation mechanism (5) includes two side shielding plates (51) symmetrically arranged on the top of the substrate (1). A rear shielding plate (52) is fixedly installed at the end of the side shielding plate (51). The rear shielding plate (52) adopts a U-shaped structure. The two side shielding plates (51) and the rear shielding plate (52) surround the chip body (2). A guide plate (53) is fixedly installed on the side of the side shielding plate (51) facing the chip body (2). A sealing plate (54) that docks with the chip body (2) is fixedly installed on the side of the guide plate (53). The top of the chip body (2) is in contact with a heat spreader (3) covered with a low thermal conductivity buffer layer. A fin assembly (4) is fixedly installed on the top of the heat spreader (3). The end of the fin assembly (4) faces the heat source of the printer cartridge. A front baffle (8) is fixedly installed on the top of the substrate (1).

2. The consumable chip shielding packaging structure according to claim 1, characterized in that, The fin assembly (4) includes multiple parallel fins. Hot air generated by the printer cartridge heat source flows between two adjacent fins. The bottom of each of the multiple fins is fixedly connected to a heat spreader (3) with a low thermal conductivity buffer layer on top.

3. The consumable chip shielding packaging structure according to claim 2, characterized in that, The rear shielding plate (52) is fixedly installed with a filling soft plate (55) facing the fin group (4). The side shielding plate (51) and the filling soft plate (55) form a heat preservation cavity. The side of the side shielding plate (51) and the side of the filling soft plate (55) are both fixedly connected to the fin group (4).

4. The consumable chip shielding packaging structure according to claim 3, characterized in that, The guide plate (53) is inclined, and the end of the guide plate (53) faces the center of the arc of the cross section of the filling soft plate (55).

5. The consumable chip shielding packaging structure according to claim 4, characterized in that, Both the side shielding plate (51) and the rear shielding plate (52) are made of heat-conducting plate material. The bottom of the filling soft plate (55) is fixedly installed with an inclined ramp strip (56), and the bottom of the ramp strip (56) is in contact with the substrate (1).

6. The consumable chip shielding packaging structure according to claim 5, characterized in that, The bottom of the side shielding plate (51) is provided with an adjustment mechanism (6). The adjustment mechanism (6) includes a first track (61) fixedly installed on the top of the substrate (1). A second track (62) is slidably connected to the top of the first track (61). The top of the second track (62) is fixedly connected to the side shielding plate (51).

7. The consumable chip shielding packaging structure according to claim 6, characterized in that, Two rear shielding plates (52) and filling soft plates (55) are provided. The rear shielding plates (52) and filling soft plates (55) are provided with inner cavities (64). An inner plate (63) is slidably connected inside the inner cavity (64).

8. The consumable chip shielding packaging structure according to claim 7, characterized in that, The inlay panel (63) adopts a U-shaped structure, and the curvature of the inlay panel (63) is the same as that of the filling soft board (55).

9. The consumable chip shielding packaging structure according to claim 8, characterized in that, The first track (61) is provided with a positioning mechanism (7), which includes a slider (72) that slides within the first track (61). The slider (72) is fixedly installed on the inner wall of the second track (62). A support plate (73) perpendicular to the slider (72) is fixedly installed on the side of the slider (72). A spring plate (74) is elastically connected to the end of the support plate (73). The spring plate (74) abuts against the first track (61). The spring plate (74) has an arc-shaped structure.

10. The consumable chip shielding packaging structure according to claim 9, characterized in that, The inner wall of the second track (62) is slidably connected to a pressure rod (71), the end of which is in contact with a spring sheet (74).

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