Environmentally friendly biocides for chemical mechanical planarization (CMP) polishing compositions
By using FDA-approved food additives such as sorbic acid and benzoic acid and their derivatives as biocides in CMP polishing compositions, the issues of environmental friendliness and polishing rate are resolved, achieving the effects of microbial growth inhibition and environmental protection.
CN122249521APending Publication Date: 2026-06-19VERSUM MATERIALS US LLC
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Patent Information
- Application Number
- CN202480073189.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-11-21
- Filing Date
- 2024-11-06
- Publication Date
- 2026-06-19
AI Technical Summary
Technical Problem
The biocides commonly used in existing chemical mechanical polishing compositions are harmful to the environment and are difficult to inhibit microbial growth without affecting the polishing rate.
Method used
Using FDA-approved food additives and preservatives such as sorbic acid and its derivatives or benzoic acid and its derivatives as environmentally friendly biocides, combined with water-soluble solvents and other chemical additives, the pH of the composition is adjusted to the range of 2 to 9 to form a CMP polishing composition.
Benefits of technology
It effectively inhibits the growth of microorganisms while maintaining the polishing rate, reducing environmental pollution and meeting environmental protection requirements.
✦ Generated by Eureka AI based on patent content.
Abstract
The present invention provides environmentally friendly biocides for inhibiting microbial growth (bacterial and / or fungal growth) in chemical mechanical planarization (CMP) polishing compositions.
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