Method and device for analyzing repairable yield of chip function module
By calculating and fitting the repairable yield of chip functional modules, outliers are identified, solving the problem of lacking repairable yield analysis of chip functional modules in existing technologies and providing a new direction for improving chip yield.
CN122263751APending Publication Date: 2026-06-23HYGON INFORMATION TECH CO LTD
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Patent Information
- Application Number
- CN202610360139.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-03-23
- Publication Date
- 2026-06-23
AI Technical Summary
Technical Problem
The lack of analysis on the repairable yield of chip functional modules in existing technologies makes it difficult to effectively improve chip yield.
Method used
By obtaining the total number of failed dies and design parameter values before and after repair for each functional module, the repairable yield is calculated, and linear fitting is performed in a Cartesian coordinate system to screen out abnormal points with absolute errors greater than the threshold, thus determining their abnormal repairable yield.
Benefits of technology
It enables precise analysis of the repairable yield of chip functional modules, filters out abnormal modules, and provides new analytical directions for yield improvement.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention provides a method for analyzing the repairable yield of a chip function module. The method comprises the following steps: acquiring the total number of failed crystal grains before and after each function module is repaired and the design parameter value of each function module; calculating a repairable yield according to the total number of failed crystal grains before repairing and the total number of failed crystal grains after repairing of each functional module; for each functional module, drawing corresponding points in a rectangular coordinate system with the design parameter value as the horizontal axis and the repairable yield as the longitudinal axis, and performing linear fitting on a scatter diagram formed by the points to obtain a fitted curve; calculating an absolute error between a corresponding point of each functional module in the rectangular coordinate system and the fitting curve, and screening out abnormal points with the absolute error greater than an error threshold value; if the abnormal point is located above the fitting curve, judging that the repairable yield of the functional module corresponding to the abnormal point is normal; and if the abnormal point is located below the fitting curve, judging that the repairable yield of the functional module corresponding to the abnormal point is abnormal.
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