A film detection method in an active alignment process and related device

Abstract

This invention discloses a thin-film detection method and related apparatus in an active alignment process, used to improve the success rate of alignment between a printed circuit board (PCB) sensor and a lens. The method includes: when the PCB is transferred to an identification station, a target identification code of the PCB is obtained by an identification module and sent to a manufacturing execution system (MES). The MES determines whether the PCB needs to undergo thin-film detection, wherein the PCB includes a sensor; if it is determined that the PCB needs to undergo thin-film detection, a conveying mechanism is controlled to transport the PCB to the detection station, and a thin-film detection module is controlled to detect whether there is a thin film on the sensor surface; if there is a thin film on the sensor surface, after removing the film, a vacuum adsorption module is controlled to adsorb the film to a thin-film storage location.

Description

Technical Field

[0001] This invention relates to the manufacturing process of vehicle-mounted cameras, and more particularly to a thin-film detection method and related apparatus in an active alignment process. Background Technology

[0002] In the manufacturing process of automotive cameras, the AA (Active Alignment) process is a core component determining the camera's optical performance. This process uses precise mechanical structures and image algorithms to achieve high-precision alignment between the PCB sensor and the lens. However, in actual production, the sensing surface of the PCB sensor is usually covered with a protective film during manufacturing and transportation to prevent dust adhesion, scratches, and other damage.

[0003] In the current production process, the removal of the protective film on the surface of the PCB sensor is mostly done manually. This often results in the PCB sensor entering the AA station with the protective film still attached. The film will block the sensing area of ​​the PCB sensor, causing deviations in image acquisition and signal feedback during the alignment process, directly leading to AA failure. Summary of the Invention

[0004] This invention provides a thin film detection method and related apparatus in an active alignment process, which is used to detect and remove the thin film on the surface of the PCB Sensor before it enters the AA (Active Alignment) station, so as to avoid the problem of AA failure caused by the protective film on the surface of the PCB Sensor not being removed before entering the AA station.

[0005] The first aspect of this application provides a thin film detection method in an active alignment process, which is applied to a programmable logic controller (PLC). The PLC is communicatively connected to an identification module, a thin film detection module, a vacuum adsorption module, a manufacturing execution system, and a conveying mechanism.

[0006] The methods include:

[0007] When the printed circuit board is transferred to the identification station, the target identification code of the printed circuit board is obtained by the identification module and sent to the manufacturing execution system. The manufacturing execution system determines whether the printed circuit board needs to perform a thin film inspection operation. The printed circuit board includes a sensor.

[0008] If it is determined that the printed circuit board needs to undergo thin film inspection, the control conveyor will transport the printed circuit board to the inspection station, and the control thin film inspection module will detect whether there is a thin film on the sensor surface.

[0009] If the sensor surface has a thin film, after the film is removed, the vacuum adsorption module is controlled to adsorb the film to the film storage location.

[0010] As an optional embodiment, the manufacturing execution system stores a set of identification codes and the process flow of the printed circuit board;

[0011] The manufacturing execution system is used to determine whether the target identification code belongs to the identification code set; if the target identification code belongs to the identification code set, it determines whether the process flow of the printed circuit board includes a thin film inspection operation; if the process flow includes a thin film inspection operation, it determines that the printed circuit board needs to perform a thin film inspection operation.

[0012] As an optional embodiment, the programmable logic controller is also communicatively connected to a thin-film counter, and the method further includes:

[0013] The thin film counter executes a counting instruction to count the number of thin films at the thin film storage location. The counting instruction is used to count the number of thin films at the thin film storage location.

[0014] As an optional embodiment, the method further includes:

[0015] If the counting command determines that the number of films at the film storage location is increasing, then it is determined that the film on the sensor surface has been removed.

[0016] As an optional embodiment, the programmable logic controller also communicates with the re-inspection sensor, and the method further includes:

[0017] After the film is removed, the sensor surface of the printed circuit board in the film residue re-inspection station is inspected using a re-inspection sensor.

[0018] If there is a residual film on the sensor surface of the printed circuit board, the vacuum adsorption module is controlled to adsorb the residual film on the sensor surface of the printed circuit board.

[0019] As an optional embodiment,

[0020] The method also includes:

[0021] If there is no thin film on the sensor surface of the printed circuit board, the control conveyor will transport the printed circuit board to the active alignment station to perform the alignment operation between the sensor and the lens on the printed circuit board in the active alignment station.

[0022] As an optional embodiment, the programmable logic controller also communicates with the interception module;

[0023] The method also includes:

[0024] If there is a thin film residue on the sensor surface of the printed circuit board, the control interception module will intercept the printed circuit board and trigger an alarm.

[0025] A second aspect of this application provides an active alignment assembly production system, comprising a programmable logic controller (PLC), an identification module, a thin film detection module, a vacuum adsorption module, a manufacturing execution system, and a conveying mechanism. The PLC is used for:

[0026] When the printed circuit board is transferred to the identification station, the target identification code of the printed circuit board is obtained by the identification module and sent to the manufacturing execution system. The manufacturing execution system determines whether the printed circuit board needs to perform a thin film inspection operation. The printed circuit board includes a sensor.

[0027] If it is determined that the printed circuit board needs to undergo thin film inspection, the control conveyor will transport the printed circuit board to the inspection station, and the control thin film inspection module will detect whether there is a thin film on the sensor surface.

[0028] If the sensor surface has a thin film, after the film is removed, the vacuum adsorption module is controlled to adsorb the film to the film storage location.

[0029] A third aspect of this application provides a computer device including a processor, characterized in that, when the processor executes a computer program stored in a memory, it is used to implement the thin film detection method in the active alignment process provided in the first aspect of this application.

[0030] A fourth aspect of this application provides a computer-readable storage medium having a computer program stored thereon, characterized in that, when the computer program is executed by a processor, it is used to implement the thin film detection method in the active alignment process provided in the first aspect of this application.

[0031] The fifth aspect of this application provides a computer program product having a computer program stored thereon. When the computer program is executed by a processor, it is used to implement the thin film detection method in the active alignment process provided in the first aspect of this application.

[0032] As can be seen from the above technical solutions, the embodiments of the present invention have the following advantages:

[0033] In this embodiment, before the printed circuit board enters the active alignment station, the identification module detects the thin film on the surface of the printed circuit board. If a thin film is present on the surface of the printed circuit board, it is removed and stored in the film storage location. This ensures that the printed circuit board actively detects and removes the thin film on the surface of the PCB sensor before entering the active alignment station, thus avoiding the problem of active alignment failure caused by the protective film on the surface of the PCB sensor not being removed before entering the active alignment station. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of one embodiment of the active alignment assembly production system in this application.

[0035] Figure 2 This is a schematic diagram of an embodiment of the thin film detection method in the active alignment process of this application;

[0036] Figure 3 This is a schematic diagram of another embodiment of the active alignment assembly production system in this application.

[0037] Figure 4 This is a schematic diagram of an embodiment of performing re-inspection on the thin film on the surface of a PCB Sensor (printed circuit board sensor) in this application.

[0038] Figure 5 This is a schematic diagram of another embodiment of the active alignment assembly production system in this application.

[0039] Figure 6 This is a schematic diagram of an embodiment of performing re-inspection on the thin film on the surface of a PCB Sensor (printed circuit board sensor) in this application. Detailed Implementation

[0040] This invention provides a thin film detection method and related apparatus in an active alignment process, which is used to actively detect and remove the thin film on the surface of the PCB sensor before the PCB sensor enters the AA (Active Alignment) station, so as to avoid the problem of AA failure caused by the protective film on the surface of the PCB sensor not being removed before entering the AA station.

[0041] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0042] The terms "first," "second," "third," "fourth," etc., used in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0043] This application provides a thin film detection method in an active alignment process. The general principle of this detection method is as follows: when the printed circuit board is transferred to the identification station, the identification module obtains the target identification code of the printed circuit board and sends the target identification code to the manufacturing execution system (MES). The MES determines whether the printed circuit board needs to undergo thin film detection. The printed circuit board includes a sensor. If it is determined that the printed circuit board needs to undergo thin film detection, the conveying mechanism is controlled to transport the printed circuit board to the detection station, and the thin film detection module is controlled to detect whether there is a thin film on the sensor surface. If there is a thin film on the sensor surface, after the film is removed, the vacuum adsorption module is controlled to adsorb the film to the film storage location.

[0044] The thin film detection method in the active alignment process provided in this application can actively detect and remove the thin film on the surface of the PCB sensor before the PCB sensor enters the AA (Active Alignment) station, so as to avoid the problem of AA failure caused by the protective film on the surface of the PCB sensor not being removed before entering the AA station.

[0045] For ease of understanding, the active alignment assembly production system in the embodiments of this application will be briefly described below. Please refer to [link to relevant documentation]. Figure 1The active alignment assembly production system is equipped with a programmable logic controller (PLC) 01 and includes at least an identification module 10, a thin film detection module 20, a vacuum adsorption module 30, a manufacturing execution system 40, and a conveying mechanism 50, all of which are communicatively connected to the PLC 01. The identification module 10 is located at the identification station 101, and the thin film detection module 20 is located at the detection station 201. In this embodiment, the PLC 01 controls the identification module 10, the thin film detection module 20, the vacuum adsorption module 30, the manufacturing execution system 40, and the conveying mechanism 50 to execute the steps in the following method embodiments.

[0046] Specifically, in this embodiment, the identification module 10 can be a scanning device with a camera, and the identification station 101 is used to place the PCB printed circuit board so that the identification module 10 can scan the identification code of the PCB printed circuit board placed in the identification station 101. The scanning device can identify barcodes or QR codes to obtain the target identification code for identifying the PCB printed circuit board. Specifically, the target identification code can be a barcode or a QR code, as long as it can uniquely identify the PCB printed circuit board. The specific external form of the target identification code is not specifically limited here.

[0047] The thin film detection module 20 can be a color sensor that identifies the color of the thin film. For example, when the thin film on the surface of the PCB Sensor is green, the thin film detection module 20 can be a color sensor that detects the green color. The detection station 201 is used to place the PCB printed circuit board, so that the thin film detection module 20 can detect the thin film on the surface of the PCB printed circuit board located in the detection station 201.

[0048] The vacuum adsorption module 30 automatically adsorbs the film on the surface of the PCB printed circuit board when a film is present, or it can manually remove the film from the surface of the printed circuit board when prompted by the programmable logic controller 01. After the film is removed, it is placed at the target position 301 so that the vacuum adsorption module 30 can adsorb the film from the target position to the film storage position. Specifically, the film storage position can be a box with an opening. In order to avoid the film being discarded at will after being removed and causing contamination of the production process, the vacuum adsorption module 30 in this embodiment can adsorb the film from the target position to the film storage position to avoid the film causing contamination of the production process.

[0049] For ease of understanding, the thin film detection method in the active alignment process of this application will be described below. Please refer to [link / reference]. Figure 2An embodiment of the thin film detection method in the active alignment process of this application includes: 201. When the printed circuit board is transferred to the identification station, the target identification code of the printed circuit board is identified by the identification module and sent to the manufacturing execution system so that the manufacturing execution system can determine whether the printed circuit board needs to perform a thin film detection operation, wherein the printed circuit board includes at least a sensor.

[0050] In the manufacturing process of automotive cameras, to achieve high-precision alignment between the PCB sensor and the lens, it is essential to ensure that there are no thin films on the surface of the PCB sensor. This is because thin films would obscure the sensing area of ​​the PCB sensor, causing deviations in image acquisition and signal feedback during the alignment process, directly leading to the failure of high-precision alignment between the PCB sensor and the lens.

[0051] In actual production, the sensing surface of a PCB sensor is usually covered with a protective film during manufacturing and transportation to avoid problems such as dust adhesion and scratch damage. Therefore, in order to avoid the problem of high-precision alignment failure between the PCB sensor and the lens, this application embodiment performs an active detection and removal process on the film on the surface of the PCB sensor before performing active alignment operation, to ensure that there is no film on the surface of the PCB sensor, thereby improving the success rate of high-precision alignment between the PCB sensor and the lens.

[0052] Specifically, when the printed circuit board (PCB) in this embodiment is sent to the "identification station" by the conveying mechanism, the programmable logic controller (PLC) can detect the PCB through the station sensor (such as a photoelectric sensor) set in the "identification station" to trigger the PCB identification module to identify the target identification code of the PCB. The PCB identification module in this embodiment can be a scanning device with a camera or an RFID reader, and the scanning device can identify barcodes or QR codes.

[0053] For example, when the printed circuit board (PCB) identification module is a QR code scanner, it can scan and obtain fixed identification code labels (such as QR code stickers or etched codes) on the PCB, and then...

[0054] After parsing the scan results, the target identification code identifying the PCB is extracted. Then, via industrial Ethernet / serial communication, the target identification code, identification station number, and identification timestamp are packaged and sent to the Manufacturing Execution System (MES). Upon receiving this information, the MES system performs two judgment steps:

[0055] 1. Retrieve the pre-stored "identification code set" (database table) locally and determine whether the "identification code set" contains the target identification code (verify whether the PCB is a batch to be processed);

[0056] 2. If the "identification code set" contains the target identification code, then retrieve the "PCB process flow table" associated with the identification code, and query whether the process node of the PCB contains the "thin film inspection" step, and whether the current process step is to perform "thin film inspection". If the process node of the PCB contains thin film inspection, and the current process step is thin film inspection, then the Manufacturing Execution System (MES) will return the judgment result ("contains identification code + needs inspection") to the Programmable Logic Controller (PLC) so that the PLC controls the execution of step 202 on the PCB.

[0057] It should be noted here that the MES system (Manufacturing Execution System) is a management information system for the shop floor production execution layer. It sits between the upper-level Enterprise Resource Planning (ERP) system and the lower-level industrial control equipment, and is used to collect production data in real time, schedule production tasks, control production processes, and trace product information.

[0058] In this embodiment, the MES (Manufacturing Execution System) is mainly used for: storing and managing the set of identification codes for printed circuit boards; maintaining the process flow corresponding to each printed circuit board; and determining whether the current circuit board needs to perform thin-film inspection based on the identification code.

[0059] Furthermore, it records and synchronizes production information such as test results and process status to achieve traceability and automated control of the production process.

[0060] 202. If it is determined that the printed circuit board needs to undergo thin film inspection, the control conveyor will transport the printed circuit board to the inspection station, and the control thin film inspection module will detect whether there is a thin film on the sensor surface.

[0061] If the programmable logic controller (PLC) receives an instruction from the MES system that a PCB with a target identification code needs to undergo thin-film detection, the PLC controls the conveyor mechanism (such as a conveyor belt or robotic arm) at the identification station to start, transporting the PCB to the detection station according to a preset path. Once the positioning sensor (such as a proximity switch) at the detection station detects the PCB's arrival, the conveyor mechanism stops to position the PCB and prevent it from shifting. Then, the thin-film detection module is activated to detect the thin film on the PCB sensor surface. The process of detecting the thin film on the PCB sensor surface can vary depending on the detection principle of the thin-film detection module.

[0062] As an optional embodiment, the thin film detection module of this application embodiment can be set as a color sensor. Since the thin film on the surface of the PCB sensor is generally green, the color sensor can be used to detect green. When green is detected on the surface of the PCB sensor, it is determined that there is a thin film on the surface of the PCB sensor; otherwise, it is determined that there is no thin film on the surface of the PCB sensor.

[0063] As another optional embodiment, the thin film detection module in this application embodiment can also be an industrial camera or a laser sensor. Specifically, an industrial camera can be used to take pictures of the sensor area on the PCB, or a laser sensor can be used to scan the sensor area on the PCB. Then, an image algorithm is used to analyze whether there is a thin film covering the PCB sensor surface, because the reflection of the thin film and the sensor surface are significantly different.

[0064] After obtaining the detection results, the thin film detection module feeds the results back to the programmable logic controller (PLC).

[0065] 203. If the sensor surface has a thin film, after the film is removed, the vacuum adsorption module is controlled to adsorb the film to the film storage location.

[0066] If the thin film detection module detects a thin film on the sensor surface, it controls the vacuum adsorption module to adsorb the film to the thin film storage location after the film is removed.

[0067] Specifically, in this embodiment of the application, when there is a thin film on the sensor surface, the thin film is controlled to be removed. The removal operation can be a prompt for manual removal of the thin film. For example, after detecting that there is a thin film on the sensor surface, the operator is prompted to manually remove the film by means of an indicator light or sound. After the film is manually removed, the film is placed at the target location, and the vacuum adsorption module is controlled to adsorb the film from the target location to the film storage location to avoid the film from contaminating the production process.

[0068] To improve the efficiency of film removal, this embodiment can also control the vacuum adsorption module to adhere to the film surface and use negative pressure to adsorb the film to the film storage location. The film storage location in this embodiment can be a recycling box or a storage bin, etc., to avoid the film being discarded at will and causing pollution to the production process.

[0069] In this embodiment, when the printed circuit board is transferred to the identification station, the identification module obtains the target identification code of the printed circuit board and sends the target identification code to the manufacturing execution system, so that the manufacturing execution system can determine whether the printed circuit board needs to perform a thin film detection operation. The printed circuit board includes at least a sensor. If the printed circuit board needs to perform a thin film detection operation, the printed circuit board is transported to the detection station by a conveying mechanism, and the thin film detection module is controlled to detect whether there is a thin film on the sensor surface. If there is a thin film on the sensor surface, after the film is removed, the vacuum adsorption module is controlled to adsorb the film to the film storage location.

[0070] In this embodiment, before the printed circuit board enters the active alignment station, the target identification code of the printed circuit board is identified by the identification module. When the printed circuit board needs to perform a thin film detection operation, the thin film detection module is used to detect the thin film on the surface of the printed circuit board. If there is a thin film on the surface of the printed circuit board, after the thin film is removed, it is stored in the thin film storage location. This ensures that the printed circuit board actively removes and detects the thin film on the surface of the PCB sensor before entering the active alignment station, thus avoiding the problem of active alignment failure caused by the protective film on the surface of the PCB sensor not being removed before entering the active alignment station.

[0071] based on Figure 2 In the embodiments described above, to ensure that the thin film on the surface of the PCB sensor is completely removed, this application embodiment may also perform a re-inspection operation on the thin film on the surface of the PCB sensor after step 203. Please refer to [link to relevant documentation]. Figure 3 The active alignment assembly production system in this application embodiment may further include a thin-film counter 60 communicatively connected to a programmable logic controller (PLC) to perform re-inspection of the thin film on the surface of the PCB sensor. For an embodiment of re-inspection of the thin film on the surface of the PCB sensor in this application embodiment, please refer to... Figure 4 Specifically, it includes:

[0072] 401. After the vacuum adsorption module adsorbs the film to the film storage position, it controls the film counter to execute a counting instruction for the number of films at the film storage position. The counting instruction is used to count the number of films at the film storage position.

[0073] After the vacuum adsorption module adsorbs the film to the film storage location, the programmable logic controller (PLC) immediately sends a counting command to the film counter to ensure that the counter counts the film at the film storage location and avoids miscounting.

[0074] Specifically, after the thin film counter starts working, it can detect and count the real-time number of thin films at the thin film storage location in the following non-contact manner:

[0075] Detection method 1 (infrared through-beam type): An infrared through-beam sensor is installed at the entrance of the film storage location. When the film falls in, it blocks the infrared light. The sensor sends a counting signal once. After receiving the signal, the counter automatically increments by 1 to complete one count.

[0076] Detection method 2 (weight sensing): A weight sensor is installed at the bottom of the film storage location. The weight of a single film is pre-calibrated. Each time a film falls in, when the sensor detects that the weight increment matches the weight of a single film, the counter increments by 1.

[0077] Detection Method 3 (Visual Counting): The stacking status of the thin films at the storage location is captured by a small industrial camera. Combined with image recognition algorithms, the number of stacked layers (i.e., the number of thin films) is identified in real time, and the counter value is updated synchronously.

[0078] After the thin film counter completes counting, it can package the real-time thin film quantity, counting timestamp, and counting status (normal / abnormal) and send them to the PLC control system through the industrial communication interface. At the same time, it can also feed back to the Manufacturing Execution System (MES) for production data archiving.

[0079] 402. If the counting instruction determines that the number of films at the film storage location is increasing, then it is determined that the film on the sensor surface has been removed.

[0080] When the film counter determines that the number of films at the film storage location is increasing according to the counting instruction, it is determined that the film on the sensor surface has been removed. The programmable logic controller (PLC) then sends the status information "film removal qualified" to the MES system, and simultaneously records the film removal completion time and the corresponding film count number of the PCB for subsequent traceability. At the same time, it controls the start of the conveyor mechanism to transport the PCB to the next process station.

[0081] In this embodiment, the thin film counter enables both quantitative management of thin film recycling and precise verification of the film tearing effect, overcoming the limitations of feedback from a single film tearing mechanism and improving the accuracy of evaluating the thin film detection status on the surface of the PCB sensor.

[0082] based on Figure 2 In the embodiments described above, to ensure that the thin film on the surface of the PCB sensor is completely removed, this application embodiment may also perform a re-inspection operation on the thin film on the surface of the PCB sensor after step 203. Please refer to [link to relevant documentation]. Figure 5 The active alignment assembly production system in this application embodiment may further include a re-inspection sensor 70 communicatively connected to a programmable logic controller (PLC), wherein the re-inspection sensor 70 is disposed at the film residue re-inspection station 701, as well as an active alignment station 80 and an interception module 90, and Figure 6 Another embodiment of performing re-inspection on the thin film on the surface of a PCB sensor (printed circuit board sensor) according to the embodiments of this application includes:

[0083] 601. Use a re-inspection sensor to inspect the sensor surface of the printed circuit board in the thin film residue re-inspection station;

[0084] After the operator or automated equipment removes the protective film covering the surface of the printed circuit board, the programmable logic controller (PLC) issues a transmission command to control the transmission mechanism in the active alignment assembly production system to start, transporting the printed circuit board with the film removed to the film residue re-inspection station, so as to complete the re-inspection operation of the residual film on the surface of the printed circuit board sensor in the film residue re-inspection station.

[0085] Specifically, the printed circuit board can be placed in a tray with an opening at the bottom. A thin-film re-inspection sensor can be placed directly opposite the opening to re-inspect the sensor surface of the printed circuit board to determine whether there is any residual film on the sensor surface.

[0086] Specifically, the thin film re-inspection sensor can be an optical sensor, which can be used to identify the differences in reflectivity and transmittance between the thin film and the sensor surface, so as to achieve accurate identification of residual thin film.

[0087] 602. If there is a residual film on the sensor surface of the printed circuit board, the vacuum adsorption module is controlled to adsorb the residual film on the sensor surface of the printed circuit board.

[0088] If the programmable logic controller (PLC) analyzes the detection data transmitted by the thin film re-inspection sensor and determines that there is residual film on the sensor surface of the printed circuit board, it sends a transmission command to the transmission mechanism to transfer the printed circuit board to the inspection station and controls the vacuum adsorption module to adsorb the residual film on the sensor surface of the printed circuit board.

[0089] Specifically, in this embodiment, the adsorption head of the vacuum adsorption module can be aligned with the residual film area on the sensor surface, and the adsorption pressure can be adjusted according to the size of the residual film area to accurately adsorb the residual film and ensure that the residual film can be completely peeled off.

[0090] After adsorption is complete, the process returns to the step of conveying the printed circuit board to the thin film residue re-inspection station via the conveying mechanism, until the number of adsorptions by the vacuum adsorption module reaches a preset threshold N, where N is greater than or equal to 2.

[0091] After the adsorption of the residual film on the surface of the printed circuit board is completed, the process returns to step 601 to detect again whether there is a residual film on the sensor surface of the printed circuit board. If there is still a residual film on the sensor surface of the printed circuit board, the printed circuit board is transferred to the detection station again through the conveying mechanism, and the vacuum adsorption module is controlled to adsorb the residual film on the sensor surface of the printed circuit board until the number of adsorptions by the vacuum adsorption module reaches a preset threshold N, where N is greater than or equal to 2.

[0092] 603. If, based on the re-inspection results, it is determined that there is no thin film on the sensor surface of the printed circuit board, the control conveying mechanism will transport the printed circuit board to the active alignment station to perform the alignment operation between the sensor and the lens on the printed circuit board in the active alignment station.

[0093] After the vacuum adsorption module has adsorbed a preset threshold N times, the re-inspection results are used to further determine whether there is a thin film on the sensor surface of the printed circuit board. If there is no thin film, a thin film clean signal is output. Based on the thin film clean signal, the conveying mechanism is controlled to transport the printed circuit board to the active alignment station, so as to perform the alignment operation between the sensor and the lens of the printed circuit board in the active alignment station.

[0094] 604. If, based on the re-inspection results, it is determined that there is still film residue on the sensor surface of the printed circuit board, the control interception module will intercept the printed circuit board and trigger an alarm operation.

[0095] After the vacuum adsorption module has adsorbed a preset threshold N times, the re-inspection results are used to further determine whether there is a thin film on the sensor surface of the printed circuit board. If there is a thin film, the interception module is controlled to intercept the printed circuit board and trigger an alarm operation to prevent the printed circuit board from entering the active alignment station and causing the problem of active external failure between the PCB Sensor and the lens.

[0096] Specifically, in the embodiments of this application, when intercepting a printed circuit board, the printed circuit board can be intercepted by means of a cylinder and a baffle. For example, when an alarm operation occurs, the cylinder uses compressed air to drive the piston to move the baffle up and down / turn over, so as to achieve precise blocking and release of the printed circuit board.

[0097] In this embodiment, after the thin film re-inspection of the sensor surface of the printed circuit board is completed, based on the re-inspection results, on the one hand, the printed circuit board with the film completely removed is controlled to enter the active alignment station, thereby achieving seamless connection between the film removal, re-inspection and alignment processes, reducing waiting and transfer time between processes, and improving the operational stability and continuity of the entire production line. On the other hand, an alarm operation is controlled for printed circuit boards with the film not completely removed, thereby avoiding rework in subsequent processes due to unqualified products, effectively reducing production losses and production costs.

[0098] It is understood that, in various embodiments of the present invention, the order of the steps does not imply the order of execution. The execution order of each step should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0099] This application also provides a computer program product on which a computer program is stored. When the computer program is executed by a processor, it is used to implement the various steps in the above method embodiments.

[0100] The computer device in the embodiments of the present invention will now be described from the perspective of hardware processing:

[0101] This computer device is used to implement the functions of an active alignment assembly production device. One embodiment of the computer device in this invention includes:

[0102] Processor and memory;

[0103] The memory is used to store computer programs, and when the processor executes the computer programs stored in the memory, it can implement the various steps in the above method embodiments.

[0104] It is understood that when the processor in the computer device described above executes the computer program, it can also implement the functions of each unit in the corresponding device embodiments described above, which will not be repeated here. For example, the computer program can be divided into one or more modules / units, which are stored in the memory and executed by the processor to complete the present invention. The one or more modules / units can be a series of computer program instruction segments capable of performing specific functions, which describe the execution process of the computer program in the active alignment assembly production apparatus. For example, the computer program can be divided into units in the active alignment assembly production apparatus described above, and each unit can implement the specific functions described in the corresponding active alignment assembly production apparatus.

[0105] The computer device may be a desktop computer, laptop, handheld computer, or cloud server, etc. The computer device may include, but is not limited to, a processor and memory. Those skilled in the art will understand that the processor and memory are merely examples of a computer device and do not constitute a limitation on the computer device. It may include more or fewer components, or a combination of certain components, or different components. For example, the computer device may also include input / output devices, network access devices, buses, etc.

[0106] The processor can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or any conventional processor. The processor is the control center of the computer device, connecting various parts of the computer device via various interfaces and lines.

[0107] The memory can be used to store the computer programs and / or modules. The processor implements various functions of the computer device by running or executing the computer programs and / or modules stored in the memory and by calling data stored in the memory. The memory may mainly include a program storage area and a data storage area. The program storage area may store the operating system, at least one application program required for a function, etc.; the data storage area may store data created according to the use of the terminal, etc. In addition, the memory may include high-speed random access memory, and may also include non-volatile memory, such as hard disk, RAM, plug-in hard disk, smart media card (SMC), secure digital card (SD card), flash card, at least one disk storage device, flash memory device, or other volatile solid-state storage device.

[0108] The present invention also provides a computer-readable storage medium for implementing the functions of an active alignment assembly production apparatus, wherein a computer program is stored thereon, and when the computer program is executed by a processor, the processor can be used to perform the various steps in the above method embodiments.

[0109] It is understood that if the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a corresponding computer-readable storage medium. Based on this understanding, all or part of the processes in the above-described embodiments of the present invention can also be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the above-described method embodiments. The computer program includes computer program code, which can be in the form of source code, object code, executable file, or some intermediate form. The computer-readable medium can include: any entity or device capable of carrying the computer program code, recording media, USB flash drive, portable hard drive, magnetic disk, optical disk, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signals, telecommunication signals, and software distribution media, etc. It should be noted that the content included in the computer-readable medium can be appropriately added or removed according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, computer-readable media do not include electrical carrier signals and telecommunication signals.

[0110] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection between apparatuses or units through some interfaces, and may be electrical, mechanical, or other forms.

[0111] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0112] Furthermore, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0113] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A thin film detection method in an active alignment process, characterized in that, It is applied to a programmable logic controller, which is communicatively connected to an identification module, a thin film detection module, a vacuum adsorption module, a manufacturing execution system, and a conveying mechanism; The method includes: When the printed circuit board is transferred to the identification station, the identification module obtains the target identification code of the printed circuit board and sends the target identification code to the manufacturing execution system so that the manufacturing execution system can determine whether the printed circuit board needs to perform a thin film inspection operation. The printed circuit board includes a sensor. If it is determined that the printed circuit board needs to undergo a thin film detection operation, the conveying mechanism is controlled to transport the printed circuit board to the detection station, and the thin film detection module is controlled to detect whether the sensor surface has a thin film. If the sensor surface has a thin film, then after the thin film is removed, the vacuum adsorption module is controlled to adsorb the thin film to the thin film storage location.

2. The method according to claim 1, characterized in that, The manufacturing execution system stores a set of identification codes and the process flow of printed circuit boards; The manufacturing execution system is used to determine whether the target identification code belongs to the identification code set; if the target identification code belongs to the identification code set, it determines whether the process flow of the printed circuit board includes the thin film detection operation; if the process flow includes the thin film detection operation, it determines whether the current process of the printed circuit board is the thin film detection operation; if so, it determines that the printed circuit board needs to perform the thin film detection operation.

3. The method according to claim 1, characterized in that, The programmable logic controller is also communicatively connected to a thin-film counter, and the method further includes: The thin film counter executes a counting instruction for the number of thin films at the thin film storage location, and the counting instruction is used to count the number of thin films at the thin film storage location.

4. The method according to claim 3, characterized in that, The method further includes: If, according to the counting instruction, it is determined that the number of films at the film storage location is increasing, then it is determined that the film on the sensor surface has been removed.

5. The method according to claim 1, characterized in that, The programmable logic controller is also communicatively connected to the re-inspection sensor, and the method further includes: After the film is removed, the sensor surface of the printed circuit board in the film residue re-inspection station is inspected using the re-inspection sensor. If there is a residual film on the sensor surface of the printed circuit board, the vacuum adsorption module is controlled to adsorb the residual film on the sensor surface of the printed circuit board.

6. The method according to claim 5, characterized in that, The method further includes: If there is no thin film on the sensor surface of the printed circuit board, the conveying mechanism is controlled to transport the printed circuit board to the active alignment station, so as to perform the alignment operation between the sensor and the lens of the printed circuit board in the active alignment station.

7. The method according to claim 5, characterized in that, The programmable logic controller is also communicatively connected to the interception module; The method further includes: If it is determined that there is a thin film residue on the sensor surface of the printed circuit board, the interception module is controlled to intercept the printed circuit board and trigger an alarm operation.

8. An active alignment assembly production system, characterized in that, The system includes a programmable logic controller (PLC), an identification module, a thin film detection module, a vacuum adsorption module, a manufacturing execution system, and a conveying mechanism. The PLC is used for: When the printed circuit board is transferred to the identification station, the identification module obtains the target identification code of the printed circuit board and sends the target identification code to the manufacturing execution system so that the manufacturing execution system can determine whether the printed circuit board needs to perform a thin film inspection operation. The printed circuit board includes a sensor. If it is determined that the printed circuit board needs to undergo a thin film detection operation, the conveying mechanism is controlled to transport the printed circuit board to the detection station, and the thin film detection module is controlled to detect whether the sensor surface has a thin film. If the sensor surface has a thin film, then after the thin film is removed, the vacuum adsorption module is controlled to adsorb the thin film to the thin film storage location.

9. A computer device comprising a processor, characterized in that, When the processor executes a computer program stored in the memory, it is used to implement the thin film detection method in the active alignment process as described in any one of claims 1 to 7.

10. A computer program product having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it is used to implement the thin film detection method in the active alignment process as described in any one of claims 1 to 7.

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