A synergic evaporation method of nickel ingot and nickel sheet

Abstract

A method for co-deposition of nickel ingots and nickel sheets, applied to electrode deposition of LED chips, includes the following steps: S1, providing a crucible and a standard nickel ingot, with a nickel ingot support cavity inside the crucible; S2, recording the initial mass of the nickel ingot, placing the standard nickel ingot into the nickel ingot support cavity, and performing several deposition cycles to obtain the remaining mass, and calculating the single deposition loss; S3, providing a nickel sheet group, comprising several nickel sheets, with a nickel sheet support cavity inside the crucible for placing the nickel sheets; S4, obtaining a target mass based on the single deposition loss, selecting a target nickel sheet from the group based on the target mass, placing the target nickel sheet in the nickel sheet support cavity, and co-depositing with the nickel ingot until the target nickel sheet is completely evaporated, and measuring the remaining mass of the nickel ingot to complete a single cycle. This invention solves the technical problem in the prior art where it is difficult to simultaneously improve material utilization while extending the effective deposition life of nickel ingots.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor manufacturing technology, and particularly relates to a method for the synergistic evaporation of nickel ingots and nickel sheets. Background Technology

[0002] Vacuum evaporation is one of the core processes in LED chip manufacturing. Nickel, as a key functional material for LED chip electrodes, forms a barrier layer that effectively inhibits electrode metal migration, ensuring the long-term electrical stability and reliability of the chip. Nickel is a high-value precious metal, and its consumption efficiency directly determines the cost and yield of mass-produced LED chips.

[0003] In existing technologies, nickel materials are generally deposited in the form of nickel ingots in oxygen-free copper crucibles via vapor deposition. Due to limitations in the vapor deposition process, the effective vapor deposition lifespan of a single nickel ingot is only about 10 cycles before it reaches a point of wear and tear, resulting in a material utilization rate of less than 20%. This leads to significant waste of precious metals and substantially increases the manufacturing cost of LED chips. The industry has attempted to extend the lifespan by using nickel granules to supplement the target material, but the irregular shape of nickel granules and their susceptibility to the magnetic field of the vapor deposition equipment easily cause crucible jamming. Furthermore, the amount added is difficult to control precisely, resulting in uneven film deposition. Other solutions have proposed using nickel sheets as supplementary material, but existing nickel sheet designs do not fully consider the magnetic field characteristics of the vapor deposition equipment and the consumption patterns of a single furnace. Problems such as mismatched supplementation amounts and insufficient resistance to magnetic field interference persist, failing to achieve both effective extension of nickel ingot lifespan and improved material utilization. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the purpose of this invention is to provide a synergistic vapor deposition method for nickel ingots and nickel sheets, which aims to solve the technical problem in the prior art that it is difficult to improve the material utilization rate while extending the effective vapor deposition life of nickel ingots.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solution: A method for co-deposition of nickel ingots and nickel sheets, applied to electrode deposition of LED chips, includes the following steps: S1, provides a crucible and a standard nickel ingot, wherein the crucible is provided with a nickel ingot support cavity; S2, record the initial mass of the nickel ingot, load the standard nickel ingot into the nickel ingot support cavity, and perform several vapor depositions to obtain the remaining mass, and calculate the single vapor deposition loss of a single vapor deposition. S3, a nickel sheet assembly is provided, the nickel sheet assembly includes a plurality of nickel sheets, and a nickel sheet bearing cavity is provided inside the crucible for placing the nickel sheets; S4. Based on the single evaporation loss, obtain the target mass, select a target nickel sheet from several nickel sheets using the target mass, place the target nickel sheet in the nickel sheet support cavity, and perform co-evaporation with the nickel ingot until the target nickel sheet is completely evaporated, and measure the remaining mass of the nickel ingot to complete a single cycle processing. S5. The remaining mass is compared with the mass threshold. If the remaining mass is less than the mass threshold, the vapor deposition is determined to be complete. If the remaining mass is greater than the mass threshold, the single cycle process is repeated.

[0006] Furthermore, the formula for obtaining the target quality is: A = B × C, where A represents the target quality, B represents the loss in a single evaporation, and C represents the total number of synergistic evaporations in a single cycle.

[0007] Furthermore, the evaporation temperature is 1430℃~1470℃.

[0008] Furthermore, all the nickel sheets are cuboid in structure, and there is a gap between the nickel sheet and the nickel sheet bearing cavity, the gap being in the range of 0.006mm to 0.024mm.

[0009] Furthermore, the magnetic moment of the nickel sheet is ≤0.05A·m².

[0010] Furthermore, the nickel sheet undergoes vacuum annealing at a temperature of 800°C for a duration of 1.5 to 3 hours.

[0011] Furthermore, the purity of the nickel sheet is ≥99.99%.

[0012] Furthermore, the edges of the nickel sheet are passivated, with a passivation radius of 0.3 mm.

[0013] Furthermore, the surface roughness Ra of the nickel sheet is ≤0.1μm.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: by performing several evaporation processes and calculating the loss amount of a single evaporation process, a precise loss benchmark is established; by setting the total number of synergistic evaporation processes in a single cycle, the target quality is made equal to the loss amount of a single evaporation process multiplied by the total number of processes, and the number of synergistic evaporation processes is equal to the total number of processes, thus achieving a precise match between the replenishment amount and the consumption amount within the cycle; by limiting the single cycle process to terminate when the nickel sheet is completely evaporated, the synchronization of compensation and consumption is ensured, avoiding over-evaporation or insufficient replenishment; by performing multiple cycles until the remaining mass of the standard nickel ingot reaches the quality threshold, the effective evaporation life of the standard nickel ingot is significantly extended while also improving the utilization rate of the material. Attached Figure Description

[0015] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a flowchart illustrating a method for the synergistic vapor deposition of nickel ingots and nickel sheets according to an embodiment of the present invention.

[0016] The following detailed description, in conjunction with the accompanying drawings, will further illustrate the present invention. Detailed Implementation

[0017] To make the objectives, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Several embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of the present invention will be thorough and complete.

[0018] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," "up," "down," and similar expressions used herein are for illustrative purposes only and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0019] In this invention, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances. The term "and / or" as used herein includes any and all combinations of one or more of the related listed items.

[0020] Example 1: Please see Figure 1 A method for co-plating nickel ingots and nickel sheets includes the following steps: S1 provides an oxygen-free copper crucible and a standard nickel ingot. The crucible is provided with a nickel ingot support cavity for holding the standard nickel ingot, which has an initial mass of 298g.

[0021] S2, the standard nickel ingot is placed into the nickel ingot support cavity, and its initial mass of 298g is recorded. Four separate vapor deposition processes are performed at a temperature of 1450℃, and the loss per vapor deposition is calculated and recorded as the single-per-vapor deposition loss. Measurements show that after four vapor deposition processes, the mass of the standard nickel ingot decreased from 298g to 280.96g, with a total loss of 17.04g and a single-per-vapor deposition loss of 4.26g.

[0022] S3, a nickel sheet assembly is provided, comprising several nickel sheets. A nickel sheet support cavity is provided within the crucible, the cavity being 15.3 mm long, 15.3 mm wide, and 5 mm deep, for holding the nickel sheets. The gap between the nickel sheets and the support cavity is 0.006 mm to 0.024 mm. The nickel sheets are defined as cuboid structures with dimensions of 15.1 mm × 15.1 mm × 2.1 mm, with a tolerance of ±0.05 mm. In this embodiment, the measured gap between the nickel sheets and the support cavity is 0.015 mm. The nickel sheets have a purity of 99.99%, are vacuum annealed at 800°C for 2 hours, and then plasma polished to achieve a surface roughness Ra of 0.10 μm. The edges of the nickel sheets are passivated with a rounded corner radius of 0.3 mm, and are burr-free.

[0023] S4. Obtain the target quality according to the formula A=B×C, where A is the target quality, B is the loss per evaporation, and C is the total number of assisted evaporation cycles in a single processing cycle.

[0024] In this embodiment, the total number of co-deposition cycles in a single processing cycle is preset to C=1, and B=4.26g. Therefore, the target mass A=4.26g×1=4.26g. A nickel sheet with a mass of 4.26g is selected from several nickel sheets as the target nickel sheet. The target nickel sheet is placed in the nickel sheet support cavity and co-depositioned with the standard nickel ingot. This process is repeated C times (one co-deposition cycle) until the target nickel sheet is completely evaporated. The remaining mass of the standard nickel ingot is then measured to complete the single processing cycle.

[0025] S5. The remaining mass is compared with a mass threshold, i.e., a preset remaining mass of 250g. In this embodiment, if the remaining mass of the standard nickel ingot after a single cycle is not yet 250g, the next cycle is repeated. This process is repeated until the remaining mass of the standard nickel ingot reaches 250g, at which point the vapor deposition is considered complete.

[0026] Example 2 This embodiment is basically the same as Embodiment 1, except that the vapor deposition temperature in this embodiment is 1430℃.

[0027] Example 3 This embodiment is basically the same as Embodiment 1, except that the evaporation temperature in this embodiment is 1470℃.

[0028] Example 4 This embodiment is basically the same as Embodiment 1, except that the size of the nickel sheet in this embodiment is 15.0mm×15.0mm×2.1mm.

[0029] Example 5 This embodiment is basically the same as Embodiment 1, except that the size of the nickel sheet in this embodiment is 15.2mm×15.2mm×2.1mm.

[0030] Example 6 This embodiment is basically the same as Embodiment 1, except that in this embodiment, the nickel sheet is plasma polished and the surface roughness Ra is 0.06μm.

[0031] Example 7 This embodiment is basically the same as Embodiment 1, except that in this embodiment, the nickel sheet is plasma polished and the surface roughness Ra is 0.12μm.

[0032] Example 8 This embodiment is basically the same as Embodiment 1, except that in this embodiment, the magnetic moment of the nickel sheet is 0.03 A·m².

[0033] Example 9 This embodiment is basically the same as Embodiment 1, except that the magnetic moment of the nickel sheet in this embodiment is 0.05 A·m².

[0034] Example 10 This embodiment is basically the same as Embodiment 1, except that in this embodiment, the vacuum annealing time of the nickel sheet is 3 hours.

[0035] Example 11 This embodiment is basically the same as Embodiment 1, except that in this embodiment, the vacuum annealing time of the nickel sheet is 1.5 hours.

[0036] Example 12 This embodiment is basically the same as Embodiment 1, except that in this embodiment, the radius of the passivated corner of the nickel sheet is 0.5mm.

[0037] Example 13 This embodiment is basically the same as Embodiment 1, except that in this embodiment, the radius of the passivation rounded corner of the nickel sheet is 0.2mm.

[0038] III. Comparative Example Comparative Example 1 This comparative example is basically the same as Example 1, except that the evaporation temperature in this comparative example is 1400°C.

[0039] Comparative Example 2 This comparative example is basically the same as Example 1, except that the evaporation temperature in this comparative example is 1500°C.

[0040] Comparative Example 3 This comparative example is basically the same as Example 1, except that the size of the nickel sheet in this comparative example is 14.5mm×14.5mm×2.1mm, which results in a measured gap of 0.030mm between the nickel sheet and the nickel sheet bearing cavity.

[0041] Comparative Example 4 This comparative example is basically the same as Example 1, except that in this comparative example, the size of the nickel sheet is 15.8mm×15.8mm×2.1mm, which cannot be placed into the nickel sheet carrier cavity and therefore cannot be used for synergistic vapor deposition.

[0042] Comparative Example 5 This comparative example is basically the same as Example 1, except that in this comparative example, the mass of the nickel sheet used for co-evaporation is 2.13g, instead of the single evaporation loss of 4.26g.

[0043] Comparative Example 6 This comparative example is basically the same as Example 1, except that no nickel sheets are added in this comparative example. Only standard nickel ingots are used for separate vapor deposition until the standard nickel ingots reach the preset remaining mass of 250g.

[0044] Comparative Example 7 This comparative example is basically the same as Example 1, except that in this comparative example, after the nickel sheet is completely evaporated, the evaporation is not stopped immediately, but the evaporation conditions are maintained so that the standard nickel ingot continues to evaporate separately for a period of time.

[0045] Comparative Example 8 This comparative example is basically the same as Example 1, except that in this comparative example, the nickel sheet is not vacuum annealed, the surface roughness Ra is 0.30 μm, and the magnetic moment is 0.08 A·m².

[0046] Comparative Example 9 This comparative example is basically the same as Example 1, except that the magnetic moment of the nickel sheet in this comparative example is 0.08 A·m².

[0047] Comparative Example 10 This comparative example is basically the same as Example 1, except that the purity of the nickel sheet in this comparative example is 99.5%.

[0048] Comparative Example 11 This comparative example is basically the same as Example 1, except that the edges of the nickel sheet in this comparative example are not passivated and have burrs.

[0049] Comparative Example 12 This comparative example is basically the same as Example 1, except that in this comparative example, the gap between the nickel sheet and the nickel sheet bearing cavity is measured to be 0.027 mm, which exceeds the range of 0.006 mm to 0.024 mm.

[0050] Comparative Example 13 This comparative example is basically the same as Example 1, except that in this comparative example, the nickel sheet was not subjected to plasma polishing treatment and the surface roughness Ra is 0.30 μm.

[0051] Furthermore, relevant parameter tests and calculations were performed on Example 1: According to the test, the standard nickel ingot in this embodiment has a total of 66 vapor deposition cycles when it reaches the preset remaining mass of 250g.

[0052] Furthermore, the total material utilization rate was tested and calculated using the formula: Total material utilization rate = Total material consumption / (Initial nickel ingot mass + Total nickel sheet addition) × 100%.

[0053] In this embodiment, the total amount of nickel added = number of co-plating cycles × mass of nickel sheet per cycle. Number of co-plating cycles = total number of vapor deposition cycles. 4 = 62 times, with a single nickel sheet mass of 4.26g, the total nickel sheet added = 62 × 4.26g = 264.12g. Total material consumption = nickel ingot consumption + total nickel sheet added. Nickel ingot consumption = initial mass. The remaining mass at termination is 48g, and the total material consumption is 48g + 264.12g = 312.12g. The initial nickel ingot mass is 298g, the total nickel sheet addition is 264.12g, and the total material utilization rate is 312.12g / (298g + 264.12g) × 100% = 312.12g / 562.12g × 100% = 55.5%.

[0054] Furthermore, the consumption of nickel ingots per vapor deposition was tested, and the calculation formula is: Nickel ingot consumption per vapor deposition = Nickel ingot consumption / Total number of vapor deposition cycles. In this embodiment, 48g of nickel ingots were consumed, and the total number of vapor deposition cycles was 66. Therefore, the nickel ingot consumption per vapor deposition cycle = 48g / 66 cycles = 0.727g / cycle.

[0055] Furthermore, using Comparative Example 6 (without synergistic evaporation) as a baseline, the cost reduction rate per evaporation cycle was tested. Comparative Example 6: Nickel ingot consumption per evaporation cycle = 48g / 10 cycles = 4.8g / cycle. In this embodiment, nickel ingot consumption per evaporation cycle is 0.727g / cycle, and the cost reduction rate per evaporation cycle = (baseline single-cycle consumption...) Example single vapor deposition consumption) / Baseline single vapor deposition consumption × 100% = (4.8g / batch) (0.727g / time) / 4.8g / time × 100% = 84.9%.

[0056] Furthermore, the equipment uptime improvement rate was tested. Using the uptime rate of the equipment in Comparative Example 6 (without co-evaporation) as a baseline (set to 0%), the number of downtimes caused by crucible jamming was recorded. In this embodiment, the nickel sheet magnetic moment was 0.04 A·m², with no significant deviation throughout the process and no crucible jamming failures. The tested uptime rate was 4.2%.

[0057] Furthermore, the film deposition rate fluctuation was tested, and the nickel film deposition rate was measured for each deposition during the entire service life of the standard nickel ingot. The test results showed that the deposition rate fluctuation was 2.1%.

[0058] Furthermore, the film thickness uniformity was tested, with the film thickness measured at different locations on the substrate for each deposition. The test results showed a thickness uniformity of 1.8%.

[0059] Furthermore, the product yield improvement rate was tested. Using the yield of the LED chip product without co-deposition in Comparative Example 6 as a baseline (set to 0%), the product yield of this embodiment was recorded. The test showed a product yield improvement rate of 5.1%.

[0060] The parameters of Examples 1 to 13 and Comparative Examples 1 to 13 were tested and recorded, and the results are shown in Table 1 and Table 2, respectively.

[0061] Table 1:

[0062] Table 2:

[0063] The comparison between Examples 1 to 13 and Comparative Examples 1 to 13 shows that: Examples 1 to 13 strictly followed the logic of measuring a single vapor deposition loss of 4.26g, adding an equal mass of nickel sheet of 4.26g for each single cycle, and having a total number of synergistic vapor deposition cycles C=1 in a single cycle. This significantly increased the total number of vapor deposition cycles from 10 in Comparative Example 6 to 60 to 73, reduced the nickel ingot consumption per vapor deposition cycle from 4.8g / cycle to 0.66g / cycle to 0.80g / cycle, and reduced the cost per vapor deposition cycle by 83.3%-86.3%. Among them, Examples 6, 8, and 10 had a total of 73 evaporation cycles, with a single evaporation cost reduction rate of 86.3%; Examples 1, 2, 3, 4, 5, 12, and 13 had a total of 66 evaporation cycles, with a single evaporation cost reduction rate of 84.9%; and Examples 7, 9, and 11 had a total of 60 evaporation cycles, with a single evaporation cost reduction rate of 83.3%. This indicates that, through periodic quantitative compensation logic, the effective evaporation life of standard nickel ingots is significantly extended, and the cost of single evaporation of nickel ingots is greatly reduced.

[0064] Examples 6, 8, and 10, with a surface roughness Ra of 0.06 μm, a magnetic moment of 0.03 A·m², or an annealing time of 3 hours, require 69 single-cycle treatments, i.e., 69 co-deposition processes, with a total nickel sheet addition of 293.94 g and a total material utilization rate of 57.8%. Examples 7, 9, and 11, with a surface roughness Ra of 0.12 μm, a magnetic moment of 0.05 A·m², or an annealing time of 1.5 hours, require 56 single-cycle treatments, with a total nickel sheet addition of 238.56 g and a total material utilization rate of 53.4%. This indicates that by optimizing parameters such as nickel sheet surface roughness, magnetic moment, and annealing process, the loss of standard nickel ingots during co-deposition can be reduced, thereby using more nickel sheets with the same nickel ingot consumption, further improving the overall material utilization rate and production efficiency.

[0065] In Comparative Examples 1 to 13, due to parameters deviating from the preferred range, the loss of standard nickel ingots during synergistic evaporation was significantly increased, resulting in significantly lower total evaporation cycles, total material utilization, and cost reduction rate per evaporation cycle compared to the Examples. It is noteworthy that while some comparative examples had high total material utilization, such as Comparative Examples 11 and 13 at 41.0%, their nickel ingot lifespan was only 34 cycles, far lower than the 60 to 73 cycles of the Examples, failing to achieve a dual improvement in lifespan and material utilization. Specifically: When the evaporation temperature deviates from the 1430℃-1470℃ range, as in Comparative Examples 1 and 2, the total number of evaporation cycles is only 11 and 16, respectively, with a single-cycle evaporation cost reduction rate of only 16.7% and 37.5%; when the nickel sheet size causes the gap to exceed the range of 0.006mm to 0.024mm, as in Comparative Example 3, the measured gap is 0.030mm, and the total number of evaporation cycles is only 19, with a single-cycle evaporation cost reduction rate of 47.4%; when the nickel sheet quality is not equal to the single-cycle evaporation loss, as in Comparative Example 5, the total number of evaporation cycles is only 10, with a single-cycle evaporation cost reduction rate of 9.1%; when the standard nickel ingot continues to be evaporated individually after the co-evaporation is terminated, as in Comparative Example 7, the total number of evaporation cycles is only 24, with a single-cycle evaporation cost reduction rate of 60.0%; when the nickel sheet has not undergone vacuum annealing... When the physical or magnetic moment is too large, as in Comparative Examples 8 and 9, the total number of vapor depositions is only 24 and 19, respectively, with a single vapor deposition cost reduction rate of 60.0% and 47.4%. When the purity of the nickel sheet is insufficient, as in Comparative Example 10, the total number of vapor depositions is only 28, with a single vapor deposition cost reduction rate of 65.5%. When the nickel sheet is not subjected to edge passivation treatment, as in Comparative Example 11, the total number of vapor depositions is only 34, with a single vapor deposition cost reduction rate of 71.4%. When the gap exceeds the range of 0.006mm to 0.024mm, as in Comparative Example 12, the measured gap is 0.027mm, the total number of vapor depositions is only 28, with a single vapor deposition cost reduction rate of 65.5%. When the nickel sheet is not subjected to plasma polishing treatment, as in Comparative Example 13, the total number of vapor depositions is only 34, with a single vapor deposition cost reduction rate of 71.4%. This demonstrates the crucial role of the preferred parameters of the present invention, such as temperature, nickel sheet size, magnetic moment, annealing treatment, passivation treatment, and surface roughness, in improving material utilization efficiency while ensuring a significant extension of the lifespan of standard nickel ingots.

[0066] As shown in Table 2, the deposition rate fluctuations in Examples 1 to 13 were all controlled within 1.8% to 2.5%, the thickness uniformity within 1.6% to 2.1%, the equipment uptime improvement rate within 3.7% to 4.5%, and the product yield improvement rate within 4.6% to 5.3%. Specifically, Examples 6, 8, and 10 exhibited deposition rate fluctuations as low as 1.8% to 1.9%, thickness uniformity as low as 1.6% to 1.7%, equipment uptime improvement rate within 4.2% to 4.5%, and yield improvement rate within 5.1% to 5.3%. In contrast, Comparative Examples 1 to 13 showed deposition rate fluctuations as high as 5.0% to 12.5%, thickness uniformity as high as 4.5% to 10.8%, equipment uptime improvement rate only 0.3% to 2.2%, and yield improvement rate only 0.5% to 2.8%. This indicates that, through the periodic quantitative compensation logic and optimized parameters of the present invention, not only is the lifespan of standard nickel ingots significantly extended and costs reduced, but equipment uptime, film quality, and product yield are also greatly improved.

[0067] Based on the data in Tables 1 and 2, this invention, through periodic quantitative compensation logic, significantly increases the effective evaporation life of standard nickel ingots from 10 cycles to 60-73 cycles, reduces the cost of a single evaporation nickel ingot by 83.3% to 86.3%, achieves a total material utilization rate of 53.4% ​​to 57.8%, increases equipment uptime by 3.7% to 4.5%, minimizes film deposition rate fluctuations to ≤2.5%, improves thickness uniformity to ≤2.1%, and increases product yield by 4.6% to 5.3%. This invention solves the technical problem in existing technologies where it is difficult to simultaneously improve material utilization while extending the effective evaporation life of nickel ingots.

[0068] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0069] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of this patent should be determined by the appended claims.

Claims

1. A synergistic evaporation method of nickel ingot and nickel sheet applied to electrode evaporation of LED chip, characterized in that, The co-plating method for nickel ingots and nickel sheets includes the following steps: S1, provides a crucible and a standard nickel ingot, wherein the crucible is provided with a nickel ingot support cavity; S2, record the initial mass of the nickel ingot, load the standard nickel ingot into the nickel ingot support cavity, and perform several vapor depositions to obtain the remaining mass, and calculate the single vapor deposition loss of a single vapor deposition. S3, a nickel sheet assembly is provided, the nickel sheet assembly includes a plurality of nickel sheets, and a nickel sheet bearing cavity is provided inside the crucible for placing the nickel sheets; S4. Based on the single evaporation loss, obtain the target mass, select a target nickel sheet from several nickel sheets using the target mass, place the target nickel sheet in the nickel sheet support cavity, and perform co-evaporation with the nickel ingot until the target nickel sheet is completely evaporated, and measure the remaining mass of the nickel ingot to complete a single cycle processing. S5. The remaining mass is compared with the mass threshold. If the remaining mass is less than the mass threshold, the vapor deposition is determined to be complete. If the remaining mass is greater than the mass threshold, the single cycle process is repeated.

2. The method for synergistic vapor deposition of nickel ingots and nickel sheets according to claim 1, characterized in that, The formula for obtaining the target quality is: A = B × C, where A represents the target quality, B represents the loss in a single evaporation, and C represents the total number of synergistic evaporations in a single cycle.

3. The method for synergistic vapor deposition of nickel ingots and nickel sheets according to claim 1, characterized in that, The vapor deposition temperature is 1430℃~1470℃.

4. The method for synergistic vapor deposition of nickel ingots and nickel sheets according to claim 1, characterized in that, All the nickel sheets are cuboid in structure, and there is a gap between the nickel sheet and the nickel sheet bearing cavity, the gap being in the range of 0.006mm to 0.024mm.

5. The method for synergistic vapor deposition of nickel ingots and nickel sheets according to claim 1, characterized in that, The magnetic moment of the nickel sheet is ≤0.05A·m².

6. The method for synergistic vapor deposition of nickel ingots and nickel sheets according to claim 1, characterized in that, The nickel sheet undergoes vacuum annealing at a temperature of 800°C for a duration of 1.5 to 3 hours.

7. The method for synergistic vapor deposition of nickel ingots and nickel sheets according to claim 1, characterized in that, The purity of the nickel sheet is ≥99.99%.

8. The method for synergistic vapor deposition of nickel ingots and nickel sheets according to claim 1, characterized in that, The edges of the nickel sheet are passivated, with a passivation radius of 0.3 mm.

9. The method for co-plating nickel ingots and nickel sheets according to claim 1, characterized in that, The surface roughness Ra of the nickel sheet is ≤0.1μm.

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