Heat exchange system for thin film deposition apparatus and thin film deposition apparatus

Abstract

This application relates to the field of semiconductor fabrication technology, and discloses a heat exchange system for a thin film deposition apparatus, including a first heat exchanger and a second heat exchanger. The first heat exchanger is disposed in a spray device; the second heat exchanger is disposed in an exhaust pipe and connected to the first heat exchanger, enabling heat exchange between the two. This allows the first heat exchanger to cool the spray device, while the second heat exchanger heats the exhaust pipe. This effectively ensures the uniformity of cooling of the spray device, while reducing the complexity of the cooling system and the uncertain reliability risks, thus lowering costs. This application also discloses a thin film deposition apparatus.

Description

Technical Field

[0001] This application relates to the field of semiconductor fabrication technology, and for example to a heat exchange system and a thin film deposition apparatus for a thin film deposition equipment. Background Technology

[0002] Currently, atomic layer deposition (ALD) technology can separately introduce two or more process gases into the reaction chamber, allowing each process gas to undergo a fully saturated surface chemical reaction on the substrate surface, and then be deposited on the substrate surface in the form of a single-atom film. During the deposition process, it is often necessary to switch between two or more gases into the reaction chamber within a specific temperature field. This temperature field typically affects the spray plate in the form of thermal radiation, which may lead to excessively high spray plate temperatures. This can affect the stability of the process gases flowing through the spray plate, and even damage the spray plate itself.

[0003] In order to solve the problem of excessively high temperature of the spray plate, a cooling pipe is usually installed inside the spray plate. Cooling liquid or cooling air is introduced into the cooling pipe through a cooling system, and the cooling energy dissipated through the cooling channel reduces the temperature of the spray plate.

[0004] In the process of implementing the embodiments of this disclosure, at least the following problems were found in the related art:

[0005] While cooling pipes can cool the spray plates, these pipes are typically located inside the spray plates. Due to the structural limitations of the spray plates, their fabrication is difficult, and there may be areas where cooling pipes cannot be installed, leading to uneven cooling. Furthermore, this increases the complexity of the cooling system, introduces uncertain reliability risks, and raises the overall cost.

[0006] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0007] To provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. This summary is not intended as a general commentary, nor is it intended to identify key / important components or describe the scope of protection of these embodiments, but rather as a prelude to the detailed description that follows.

[0008] This disclosure provides a heat exchange system and a thin film deposition apparatus for use in a thin film deposition equipment. It can effectively ensure the uniformity of cooling of the spray device, while reducing the complexity of the cooling system and the uncertain reliability risks, and lowering costs.

[0009] In some embodiments, the heat exchange system for the thin film deposition apparatus includes a first heat exchanger and a second heat exchanger. The first heat exchanger is disposed in a spray device; the second heat exchanger is disposed in an exhaust pipe and connected to the first heat exchanger, and is capable of exchanging heat with the second heat exchanger, so that the first heat exchanger cools the spray device and the second heat exchanger heats the exhaust pipe.

[0010] In some embodiments, the first heat exchanger includes a plate and a first heat exchanger. The plate is disposed above the spray device, wherein the area in contact with the spray device is the heat exchange zone; the first heat exchanger is disposed within the plate, and its heat exchange surface is in contact with the heat exchange zone.

[0011] In some embodiments, a plurality of heat exchange protrusions that contact the spray device are provided on the heat exchange zone.

[0012] In some embodiments, the first heat exchanger further includes: a heat-conducting plate, movably disposed in the heat exchange area of ​​the plate body, and switchable between a first position and a second position within the plate body; wherein, when the heat-conducting plate is in the first position, the heat exchange between the first heat exchanger and the spray device is Q1, and when the heat-conducting plate is in the second position, the heat exchange between the first heat exchanger and the spray device is Q2, and Q1 > Q2.

[0013] In some embodiments, a first through hole is provided on the top plate of the plate body for the drive part of the telescopic mechanism to pass through, and the drive part of the telescopic mechanism is connected to the heat-conducting plate; wherein, the first heat exchanger is disposed on the heat-conducting plate.

[0014] In some embodiments, the heat exchange protrusion extends from the bottom plate of the plate body into the inner side of the plate body.

[0015] In some embodiments, the heat-conducting plate is provided with heat exchange protrusions, and a second through hole is provided on the bottom plate of the plate for the heat exchange protrusions to pass through.

[0016] In some embodiments, the first heat exchanger includes a plurality of coil structures, and the coil structures are connected by flexible tubes; the heat-conducting plate includes a plurality of movable sub-heat-conducting plates, and each coil structure is respectively disposed on a corresponding sub-heat-conducting plate.

[0017] In some embodiments, the second heat exchanger includes a hollow cylinder and a second heat exchanger. The hollow cylinder is used to be fitted onto the exhaust pipe; the second heat exchanger is disposed between the hollow cylinder and the exhaust pipe, and its heat exchange surface is in contact with the outer wall of the exhaust pipe.

[0018] In some embodiments, the second heat exchanger includes a spiral coil structure wound around the outer wall of the exhaust pipe.

[0019] In some embodiments, a cooling air duct is also provided on the plate.

[0020] In some embodiments, the thin film deposition apparatus includes the heat exchange system for thin film deposition apparatus described in the foregoing embodiments.

[0021] The heat exchange system and thin film deposition equipment provided in this disclosure can achieve the following technical effects:

[0022] A first heat exchanger is installed on the spray device, and a second heat exchanger is installed on the exhaust pipe. The first and second heat exchangers are connected and capable of heat exchange. Therefore, the first heat exchanger absorbs heat from the spray device and releases the absorbed heat to the exhaust pipe through the second heat exchanger. This allows for both cooling of the spray device and heating of the exhaust pipe, effectively ensuring the stability of the process gas flowing through the spray device and reducing deposits on the exhaust pipe.

[0023] Based on this, the uniformity of cooling of the spray device can be effectively ensured by having the first heat exchanger directly contact the spray device. The heat exchange between the first and second heat exchangers also reduces the complexity of the cooling system and the uncertain reliability risks, thereby reducing costs.

[0024] The above general description and the description below are exemplary and illustrative only and are not intended to limit this application. Attached Figure Description

[0025] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations and drawings do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are shown as similar elements. The drawings are not to be scaled. And wherein:

[0026] Figure 1 This is a schematic diagram of a heat exchange system for a thin film deposition apparatus provided in an embodiment of this disclosure;

[0027] Figure 2 This is a schematic diagram of the structure of a first heat exchanger provided in an embodiment of this disclosure. Figure 1 ;

[0028] Figure 3 This is a schematic diagram of the structure of a first heat exchanger provided in an embodiment of this disclosure. Figure 2 ;

[0029] Figure 4 This is a schematic diagram of the structure of a first heat exchanger provided in an embodiment of this disclosure. Figure 3 ;

[0030] Figure 5 This is a schematic diagram of the structure of a first heat exchanger provided in an embodiment of this disclosure. Figure 4 ;

[0031] Figure 6 This is a schematic diagram of another heat exchange system for a thin film deposition apparatus provided in an embodiment of this disclosure;

[0032] Figure 7 This is a schematic diagram of the structure of a thin film deposition apparatus provided in an embodiment of this disclosure.

[0033] Figure label:

[0034] 100: Spraying device; 200: Exhaust pipe; 300: Reaction chamber;

[0035] 10: First heat exchanger; 11: Plate; 111: First through hole; 112: Second through hole; 113: Cooling air duct; 12: First heat exchanger; 121: Coil structure; 122: Flexible tube; 13: Heat-conducting plate; 131: Sub-heat-conducting plate;

[0036] 20: Second heat exchanger; 21: Hollow cylinder; 22: Second heat exchanger;

[0037] 30: Heat exchange zone; 31: Heat exchange protrusion. Detailed Implementation

[0038] To provide a more detailed understanding of the features and technical content of the embodiments of this disclosure, the implementation of the embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. The accompanying drawings are for illustrative purposes only and are not intended to limit the embodiments of this disclosure. In the following technical description, for ease of explanation, several details are used to provide a full understanding of the disclosed embodiments. However, one or more embodiments may still be implemented without these details. In other cases, well-known structures and devices may be simplified in their depiction to simplify the drawings.

[0039] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this disclosure are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this disclosure described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0040] In this disclosure, the terms "upper," "lower," "inner," "middle," "outer," "front," and "rear," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for better description of the embodiments of this disclosure and their implementations, and are not intended to limit the indicated devices, elements, or components to having a specific orientation, or to require them to be constructed and operated in a specific orientation. Furthermore, some of the aforementioned terms may be used to indicate other meanings besides orientation or positional relationship; for example, the term "upper" may in some cases indicate a dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in the embodiments of this disclosure according to the specific circumstances.

[0041] Furthermore, the terms "set up," "connect," and "fix" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this disclosure according to the specific circumstances.

[0042] Unless otherwise stated, the term "multiple" means two or more.

[0043] In this embodiment of the disclosure, the character " / " indicates that the objects before and after it are in an "or" relationship. For example, A / B means: A or B.

[0044] The term "and / or" describes an association between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or A and B.

[0045] It should be noted that, unless otherwise specified, the embodiments and features described in the present disclosure can be combined with each other.

[0046] Currently, traditional thin film deposition technologies, including Physical Vapor Deposition (PVD) and Chemical Vapor Deposition (CVD), are no longer able to effectively and precisely control film properties and meet increasingly stringent process requirements in some key production steps. Therefore, ALD (Alternating Deposition) demonstrates unique properties such as forming high-quality, pinhole-free, and conformal films on non-planar complex structures and three-dimensional surfaces.

[0047] Currently, atomic layer deposition (ALD) technology, as one of the most advanced thin film deposition technologies, has been widely used in advanced manufacturing industries such as microelectronics, displays, MEMS, sensors, and photovoltaic cells. With the continuous development of modern science and technology, its applications will continue to expand in the near future.

[0048] During the coating process in ALD equipment, on the inlet side (spray device side), process byproducts adhering to the surface of the spray device may reduce its heat dissipation capacity, leading to an increase in temperature. Furthermore, on the exhaust side (exhaust pipe side), if the temperature is lower, process gases may adhere to the inner wall of the exhaust pipe. Therefore, in conjunction with... Figure 1 As shown, this disclosure provides a heat exchange system for a thin film deposition apparatus, including a first heat exchanger 10 and a second heat exchanger 20. The first heat exchanger 10 is disposed in a spray device 100; the second heat exchanger 20 is disposed in an exhaust pipe 200 and connected to the first heat exchanger 10, enabling heat exchange between the two, so that the first heat exchanger 10 cools the spray device and the second heat exchanger 20 heats the exhaust pipe 200.

[0049] The heat exchange system for a thin film deposition apparatus provided in this embodiment includes a first heat exchanger 10 on the spray device 100 and a second heat exchanger 20 on the exhaust pipe 200. The first heat exchanger 10 and the second heat exchanger 20 are connected and capable of heat exchange. Therefore, the first heat exchanger 10 absorbs heat from the spray device 100 and releases the absorbed heat to the exhaust pipe 200 through the second heat exchanger 20. This achieves both cooling of the spray device 100 and heating of the exhaust pipe 200, effectively ensuring the stability of the process gas flowing through the spray device 100 and reducing deposits adhering to the exhaust pipe 200.

[0050] Based on this, the uniformity of cooling of the spray device 100 can be effectively ensured by having the first heat exchanger 10 directly contact the spray device 100. The heat exchange between the first heat exchanger 10 and the second heat exchanger 20 also reduces the complexity of the heat exchange system and the uncertain reliability risks, thereby reducing costs.

[0051] The ALD device first introduces a first type of reaction precursor into the reaction chamber and retains it on the substrate surface through chemical adsorption (saturated adsorption). When a second type of precursor is introduced into the reaction chamber, it reacts with the first precursor that has been adsorbed on the substrate surface. Repeating this process yields a film of a predetermined thickness.

[0052] During this process, excess process byproducts are generated, and the gas is heated by a device on the spray device side. This may cause the temperature on the spray device side to rise, thereby affecting the temperature of the gas entering the reaction chamber. Therefore, a first heat exchanger 10 is provided on the spray device 100 to transfer the excess heat on the spray device 100, thereby achieving the purpose of cooling.

[0053] In this embodiment, the spraying device 100 includes a top plate, a bottom plate with spray nozzles, and side plates surrounding the top plate and the bottom plate. Multiple mutually isolated through slots are also provided inside the spray plate 10. The first heat exchanger 10 is disposed on the top plate of the spraying device 100.

[0054] In addition, the exhaust pipe 200 also discharges excess process byproducts and excess process gases. Due to its long exhaust path, the heat of the excess process gases gradually cools during the discharge process, causing the temperature on the exhaust pipe 200 side to gradually decrease and eventually adhere to the exhaust pipe 200. Therefore, a second heat exchanger 20 is provided on the exhaust pipe 200 to provide some heat to the exhaust pipe 200, thereby achieving the purpose of heating.

[0055] In this embodiment, to enable heat exchange between the first heat exchanger 10 and the second heat exchanger 20, heat transfer can be achieved using a refrigerant. Specifically, the first heat exchanger 10 and the second heat exchanger 20 are connected via refrigerant piping. To further ensure the heat exchange effect, a corresponding compressor and expansion valve can be added to allow the refrigerant to convert between vaporization and liquefaction. Thus, the first heat exchanger 10 can function as an evaporator, and the second heat exchanger 20 can function as a condenser.

[0056] Combination Figures 2 to 5 As shown, in some embodiments, the first heat exchanger 10 includes a plate 11 and a first heat exchanger 12. The plate 11 is disposed above the spray device 100, wherein the area in contact with the spray device 100 is the heat exchange zone 30; the first heat exchanger 12 is disposed inside the plate 11, and its heat exchange surface is in contact with the heat exchange zone 30.

[0057] In this embodiment, the shape and size of the plate 11 are adapted to the shape and size of the spray device 100. For example, if the top plate of the spray device 100 is circular, the plate 11 is circular; or if the top plate of the spray device 100 is square, the plate 11 is square. Furthermore, the spray device 100 is connected to a corresponding air inlet pipe, and the plate 11 also has perforations for the air inlet pipe to pass through.

[0058] In this embodiment, the plate 11 is disposed above the spray device 100, i.e., on the top plate of the spray device 100, and the area where the plate 11 contacts the spray device 100 is the heat exchange zone 30, which is in contact with the heat exchange surface of the first heat exchanger 12. This effectively increases the heat exchange area between the first heat exchanger 12 and the spray device 100, enabling the spray device 100 to perform uniform cooling. Here, the first heat exchanger 12 and the second heat exchanger 20 can exchange heat.

[0059] In this embodiment of the disclosure, the plate 11 includes a top plate, a bottom plate, and a side plate surrounding the top plate and the bottom plate. In order to ensure that the first heat exchanger 12 can be sufficiently cooled by the spray device 100, the first heat exchanger 12 has a certain distance from the top plate and the side plate.

[0060] Combination Figures 3 to 5 As shown, in some embodiments, a plurality of heat exchange protrusions 31 that contact the spray device 100 are provided on the heat exchange zone 30.

[0061] In this embodiment, to further ensure the temperature stability of the spray device 100, if the heat exchange area of ​​the plate 11 is in direct contact with the top plate of the spray device 100, the actual heating temperature of the spray device 100 may be too low, resulting in the temperature of the gas entering the reaction chamber being lower than the target temperature, which would also affect the coating quality. Therefore, multiple heat exchange protrusions 31 are provided on the heat exchange area 30 of the plate 11, and the multiple heat exchange protrusions 31 are in contact with the top plate of the spray device 100. In this way, the first heat exchanger 10 can exchange heat with the spray device 100 through the heat exchange protrusions 31, thereby effectively controlling the heat exchange area.

[0062] Combination Figures 3 to 5 As shown, in some embodiments, the first heat exchanger 10 further includes a heat-conducting plate 13, which is movably disposed in the heat exchange zone 30 of the plate body 11 and can switch between a first position and a second position within the plate body 11; wherein, when the heat-conducting plate 13 is in the first position, the heat exchange between the first heat exchanger 12 and the spray device 10 is Q1, and when the heat-conducting plate 13 is in the second position, the heat exchange between the first heat exchanger 12 and the spray device 10 is Q2, and Q1 > Q2.

[0063] In this embodiment, the heat-conducting plate 13 is movably disposed in the heat exchange zone 30 of the plate body 11. Specifically, the heat-conducting plate 13 can move within the plate body 11. When the heat-conducting plate 13 is in the first position, it can be in contact with the first heat exchanger 12, the heat-conducting plate 13 can be in contact with the heat exchange protrusion 31, and the heat exchange protrusion 31 can also be in contact with the spray device 100. In this way, contact heat exchange can be performed, and the heat exchange capacity is relatively large.

[0064] When the heat-conducting plate 13 is in the second position, it can be separated from the first heat exchanger 12, or the heat-conducting plate 13 can be separated from the heat exchange protrusion 31, or the heat exchange protrusion 31 can be separated from the spray device 100, or the heat-conducting plate 13, the heat exchange protrusion 31 and the spray device 100 can all be separated. In this way, non-contact heat exchange can be performed, and the heat exchange capacity is relatively small.

[0065] Combination Figure 5 As shown, in some embodiments, a first through hole 111 is provided on the top plate of the plate 11 for the drive part of the telescopic mechanism to pass through, and the drive part of the telescopic mechanism is connected to the heat-conducting plate 13; wherein, the first heat exchanger 12 is disposed on the heat-conducting plate 13.

[0066] In this embodiment, a first heat exchanger 12 is disposed on the heat-conducting plate 13 to enable the heat-conducting plate 13 to conduct heat. At the same time, by controlling the heat-conducting plate 13 to move up and down within the heat exchange zone 30, the heat-conducting plate 13 is switched between a first position and a second position within the plate body 11.

[0067] Specifically, a telescopic mechanism (not shown in the figure) is provided above the plate 11, and the drive part of the telescopic mechanism is fixedly connected to the heat-conducting plate 13. A first through hole 111 is provided on the top plate of the plate 11, and the drive part of the telescopic mechanism passes through the first through hole 111 and is fixedly connected to the heat-conducting plate 13. Thus, when the drive part of the telescopic mechanism is retracted, the heat-conducting plate 13 can be controlled to move upward within the plate 11, separating it from the spray device 100. When the drive part of the telescopic mechanism is extended, the heat-conducting plate 13 can be controlled to move downward within the plate 11, allowing it to contact the spray device 100.

[0068] Combination Figure 5 As shown, in some embodiments, the heat exchange protrusion 31 extends from the bottom plate of the plate 11 into the inner side of the plate 11.

[0069] In this embodiment, by controlling the heat-conducting plate 13 to contact the end of the heat exchange protrusion 31 located inside the plate body 11, the first heat exchanger 12 can perform contact heat exchange with the spray device 100 through the heat-conducting plate 13 and the heat exchange protrusion 31. Here, when the heat-conducting plate 13 is controlled to move upward within the plate body 11, the heat-conducting plate 13 and the heat exchange protrusion 31 are separated. In this way, the first heat exchanger 12 can be separated from the spray device 100. When the heat-conducting plate 13 is controlled to move downward within the plate body 11, the heat-conducting plate 13 and the heat exchange protrusion 31 are in contact, thus enabling the first heat exchanger 12 to perform contact heat exchange with the spray device 100.

[0070] Combination Figure 5As shown, in some embodiments, the heat-conducting plate 13 is provided with heat exchange protrusions 31, and a second through hole 112 for the heat exchange protrusions 31 to pass through is provided on the bottom plate of the plate body 11.

[0071] In this embodiment, by controlling the heat exchange protrusion 31 to contact the spray device 100, the first heat exchanger 12 can achieve contact heat exchange with the spray device 100 through the heat-conducting plate 13 and the heat exchange protrusion 31. Here, the heat exchange protrusion 31 and the heat-conducting plate 13 are an integral structure, and the first heat exchanger 12 is disposed on the heat-conducting plate 13. Thus, when the heat-conducting plate 13 is controlled to move upward within the plate body 11, its heat exchange protrusion 31 also moves upward, causing the heat exchange protrusion 31 to be separated from the spray device 100. This allows the first heat exchanger 12 to perform non-contact heat exchange with the spray device 100. When the heat-conducting plate 13 is controlled to move downward within the plate body 11, its heat exchange protrusion 31 also moves downward, causing the heat exchange protrusion 31 to contact the spray device 100, thus enabling the first heat exchanger 12 to perform contact heat exchange with the spray device 100.

[0072] Combination Figures 2 to 5 As shown, in some embodiments, the first heat exchanger 12 includes a plurality of coil structures 121, and the coil structures 121 are connected to each other by flexible tubes 122; the heat conduction plate 13 includes a plurality of movable sub-heat conduction plates 131, and each coil structure 121 is respectively disposed on the corresponding sub-heat conduction plate 131.

[0073] In this embodiment, to further control the heat exchange area between the heat exchange zone 30 and the spray device 100, the heat-conducting plate 13 can be configured as multiple sub-heat-conducting plates 131, and the first heat exchanger 12 can be configured as multiple coil structures 121. Each sub-heat-conducting plate 131 is provided with a corresponding coil structure 121, and each sub-heat-conducting plate 131 is connected to an independent telescopic mechanism. In this way, the movement of each sub-heat-conducting plate 131 can be controlled separately, thereby making it easier to control which part of the area is in contact with the spray device 100 for heat exchange.

[0074] In this embodiment, since each coil structure 121 can move independently, they are connected by flexible tubes 122. Optionally, the flexible tube 122 can be a rubber tube. This prevents the tubes from breaking during individual movement of each coil structure 121.

[0075] Combination Figure 6 As shown, in some embodiments, the second heat exchanger 20 includes a hollow cylinder 21 and a second heat exchanger 22. The hollow cylinder 21 is used to be fitted onto the exhaust pipe 200; the second heat exchanger 22 is disposed between the hollow cylinder 21 and the exhaust pipe 200, and its heat exchange surface is in contact with the outer wall of the exhaust pipe 200.

[0076] In this embodiment, the inner shape and size of the hollow column 21 are adapted to the shape and size of the exhaust pipe 200. For example, if the cross-section of the exhaust pipe 200 is circular, the inner cross-section of the hollow column 21 is circular; or if the cross-section of the exhaust pipe 200 is square, the inner cross-section of the hollow column 21 is square.

[0077] The hollow cylinder 21 has a gap between its inner side and the exhaust pipe 200 to facilitate the installation of the second heat exchanger 22. Here, the heat exchange surface of the second heat exchanger 22 is in contact with the outer wall of the exhaust pipe 200, and the second heat exchanger 22 can exchange heat with the first heat exchanger 12. Thus, after the first heat exchanger 12 releases heat from the spray device 100 to the exhaust pipe 200, the temperature of the exhaust pipe 200 is effectively increased, thereby reducing the adhesion of process gases. Simultaneously, the second heat exchanger 22 can release cold energy to the first heat exchanger 12, thereby cooling the spray device 100. This cycle repeats, achieving the goal of cooling the spray device 100 while simultaneously heating the exhaust pipe 200.

[0078] In some embodiments, the first heat exchanger 12 includes a spiral coil structure wound around the outer wall of the exhaust pipe 200. This effectively increases the heat exchange area between the first heat exchanger 12 and the exhaust pipe 200, thereby improving the heat exchange efficiency with the first heat exchanger 12, so as to further cool the spray device 100 and heat the exhaust pipe 200.

[0079] Combination Figure 2 As shown, in some embodiments, a cooling air duct 113 is also provided on the plate 11. In this way, by blowing gas into the cooling air duct 113, the spray device 100 can be further cooled.

[0080] In this embodiment of the present disclosure, in order to further increase the heat exchange efficiency of the first heat exchanger 12 and the second heat exchanger 22, the cooling air duct 113 can also be connected to the space between the hollow column 21 and the exhaust pipe 200. By circulating air through the cooling air duct 113, the heat exchange speed of the first heat exchanger 12 and the second heat exchanger 22 can be effectively increased.

[0081] Combination Figure 7 As shown, this disclosure also provides a thin film deposition apparatus, including the heat exchange system for thin film deposition apparatus described in the foregoing embodiments.

[0082] In this embodiment, the thin film deposition apparatus includes the heat exchange system described above for a thin film deposition apparatus. Referring to the above embodiments, it at least has the beneficial effects brought about by the technical solutions of the above embodiments, which will not be repeated here.

[0083] In this embodiment of the present disclosure, the thin film deposition apparatus includes a reaction chamber 300, wherein a spray device 100 is disposed above the reaction chamber 300, and a first heat exchanger 10 of a heat exchange system is disposed above the spray device 100. An exhaust pipe 200 is disposed below the reaction chamber 300, and a second heat exchanger 20 of a heat exchange system is disposed on the exhaust pipe 200.

[0084] In the embodiments disclosed herein, the thin film deposition equipment includes, but is not limited to, etching equipment, chemical vapor deposition equipment, atomic layer deposition equipment, or physical vapor deposition equipment. However, it should be noted that the coating equipment of this application is not limited to these, and those skilled in the art, after reading the following technical solutions, will obviously be able to apply it to other process equipment.

[0085] The foregoing description and accompanying drawings fully illustrate embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the order of operation may vary. Parts and features of some embodiments may be included or substituted for parts and features of other embodiments. Embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from its scope. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A heat exchange system for a thin film deposition apparatus, characterized in that, include: The first heat exchanger is used to install in the spray device; The second heat exchanger is installed in the exhaust pipe and connected to the first heat exchanger. It can exchange heat with the second heat exchanger so that the first heat exchanger is used to cool down the spray device and the second heat exchanger is used to heat up the exhaust pipe.

2. The heat exchange system for a thin film deposition apparatus according to claim 1, characterized in that, The first heat exchanger includes: The plate is positioned above the spray device, and the area in contact with the spray device is the heat exchange zone. The first heat exchanger is located inside the plate body, and its heat exchange surface is in contact with the heat exchange zone.

3. The heat exchange system for a thin film deposition apparatus according to claim 2, characterized in that, Multiple heat exchange protrusions are provided in the heat exchange zone to contact the spray device.

4. The heat exchange system for a thin film deposition apparatus according to claim 3, characterized in that, The first heat exchanger also includes: The heat-conducting plate is movably disposed in the heat exchange area of ​​the plate body and can switch between a first position and a second position within the plate body; When the heat-conducting plate is in the first position, the heat exchange between the first heat exchanger and the spray device is Q1; when the heat-conducting plate is in the second position, the heat exchange between the first heat exchanger and the spray device is Q2, and Q1 > Q2.

5. The heat exchange system for a thin film deposition apparatus according to claim 4, characterized in that, A first through hole is provided on the top plate of the plate for the drive part of the telescopic mechanism to pass through, and the drive part of the telescopic mechanism is connected to the heat-conducting plate; wherein, the first heat exchanger is disposed on the heat-conducting plate.

6. The heat exchange system for a thin film deposition apparatus according to claim 5, characterized in that, The heat exchange protrusions extend from the bottom plate of the plate body into the inner side of the plate body.

7. The heat exchange system for a thin film deposition apparatus according to claim 5, characterized in that, The heat-conducting plate is provided with heat exchange protrusions, and a second through hole is provided on the bottom plate of the plate for the heat exchange protrusions to pass through.

8. The heat exchange system for a thin film deposition apparatus according to any one of claims 4 to 7, characterized in that, The first heat exchanger includes multiple coil structures, which are connected by flexible tubes; the heat-conducting plate includes multiple movable sub-heat-conducting plates, with each coil structure disposed on its corresponding sub-heat-conducting plate.

9. The heat exchange system for a thin film deposition apparatus according to any one of claims 1 to 7, wherein the second heat exchanger comprises: Hollow cylinder, used to be fitted into exhaust pipes; The second heat exchanger is located between the hollow cylinder and the exhaust pipe, with its heat exchange surface in contact with the outer wall of the exhaust pipe.

10. A thin film deposition apparatus, characterized in that, Includes a heat exchange system for a thin film deposition apparatus as described in any one of claims 1 to 9.

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