Electric compressor

Abstract

The present invention provides an electric compressor that, with the primary consideration of surface distance, suppresses large-scale operation and reduces the heat dissipation of power components. The electric compressor includes a converter (30) housed in a converter housing (20). The converter (30) includes a circuit board, a power component (40), and a metal substrate (50). The power component (40) includes a molded portion (41) and leads (42) exposed from a terminal side (411) and connected to a circuit pattern formed on the circuit board. The leads (42) include a first portion (421) and a second portion (422). The metal substrate (50) is disposed between the power component (40) and the converter housing (20). The metal substrate (50) includes a metal layer (51) and an insulating layer (52) integrally formed on one side of the metal layer (51). The insulating layer (52) has a molding-opposite portion (521) opposite to the molding portion (41) and a lead-opposite portion (522) extending from the molding-opposite portion (521).

Description

Technical Field

[0001] This invention relates to electric compressors. Background Technology

[0002] Patent Document 1 discloses an integrated electric compressor comprising a converter device and an electric compressor. The converter device is assembled into a converter housing provided within the housing of the electric compressor. The converter device includes an IGBT (Insulated Gate Bipolar Transistor) as a power element, a power substrate as a circuit board, and a metal plate fixed to the converter housing as a heat sink. The IGBT includes a molded portion formed by resin molding and terminals extending from the side of the molded portion as leads. The molded portion is disposed on the metal plate and connected to the power substrate via the terminals. The metal plate dissipates heat generated by the IGBT to the converter housing. The IGBT is fixed to the metal plate via an insulating sheet.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2008-128142 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] With the increasing popularity of electric vehicles, the power supply voltage of the electric compressors installed in electric vehicles has increased to 800V, etc. Therefore, it is necessary to ensure the insulation distance and surface distance from the leads to the metal plate.

[0008] In the solution described in Patent Document 1, the insulation distance from the lead to the metal plate can be ensured in accordance with the thickness of the insulating sheet. However, in this solution, it may be impossible to ensure the surface distance from the lead to the metal plate. If the thickness of the insulating sheet is increased to ensure the surface distance from the lead to the metal plate, it will lead to an increase in the size of the electric compressor and a decrease in the heat dissipation of the power components. Therefore, in the electric compressor, it is desirable to ensure the surface distance while suppressing the increase in the size of the electric compressor in the thickness direction and suppressing the decrease in the heat dissipation of the power components.

[0009] Technical means for solving the problem

[0010] An electric compressor for solving the above-mentioned problems includes: a compression section for compressing fluid; an electric motor for driving the compression section; a converter for driving the electric motor; and a converter housing for housing the converter. The converter includes: a circuit board on which a circuit pattern constituting the converter is formed; and a power element having a molded portion formed by molding a switching element constituting the converter's circuit using resin, and a plurality of leads exposed from the side of the molded portion and electrically connected to the circuit pattern. Each of the plurality of leads has a first portion extending outward from the side and a second portion bent from the first portion and extending toward the circuit board. The key point is that the converter... The device also includes a metal substrate disposed between the power element and the converter housing. The metal substrate has a metal layer for dissipating heat generated by the power element to the converter housing, and an insulating layer integrally formed on one side of the metal layer. The power element and the metal substrate are housed in the converter housing in this order, with the first portion, the insulating layer, and the metal layer arranged relative to the thickness direction of the metal substrate. The insulating layer has a molding opposing portion extending opposite to the molding portion in the thickness direction, and a lead opposing portion extending from the molding opposing portion opposite to at least the first portion in the thickness direction.

[0011] Accordingly, the electric compressor, while insulating the leads with an insulating layer to the metal layer, transfers the heat generated by the power components to the converter housing via the metal substrate. For example, in a converter without a metal substrate, heat dissipation of the power components is achieved by providing a heat sink in the converter housing. In such a converter, there are cases where the power components are insulated from the heat sink by providing a sheet of insulating material separate from the heat sink. Compared to this, the electric compressor, by having a metal substrate with a metal layer and an insulating layer integrally formed on the metal layer, can suppress the enlargement of the metal substrate in the thickness direction.

[0012] Furthermore, by including molded opposing portions and lead opposing portions in the insulating layer, the surface distance between the leads and the metal layer can be increased. Compared to increasing this surface distance by, for example, thickening the insulating layer, the electric compressor can suppress the increase in size in the thickness direction of the metal substrate. Additionally, by utilizing molded opposing portions and lead opposing portions to increase the surface distance, the electric compressor can suppress the reduction in heat dissipation of the power components compared to increasing the surface distance by thickening the insulating layer. Based on the above, the electric compressor can, with the surface distance as the primary consideration, suppress the increase in size and suppress the reduction in heat dissipation in the power components.

[0013] In an electric compressor, the molding portion may include a heat sink for dissipating heat from the switching element, and the molding opposite portion may be located between the heat sink and the metal layer.

[0014] Accordingly, the metal substrate has a molded opposing portion between the molded portion and the metal layer. For example, in IGBTs and IPMs (Intelligent Power Modules), which are examples of power components, there are cases where a heat sink is provided on the opposite side of the surface facing the circuit board. Even when the electric compressor has a power component with a heat sink, it is possible to insulate the power component from the metal layer and suppress its size while ensuring the distance between the leads and the surface of the metal layer.

[0015] In an electric compressor, the metal substrate may further include an element-side metal layer disposed on the opposite side of the metal layer, sandwiching the insulating layer in between. The power element and the metal substrate are housed in the converter housing in this order, with the molding portion, the element-side metal layer, the insulating layer, and the metal layer arranged relative to the thickness direction of the metal substrate. The molding opposing portion is located outside the element-side metal layer and is opposite to the molding portion in the thickness direction. The lead opposing portion extends from the molding opposing portion outside the element-side metal layer, at least opposite to the first portion in the thickness direction.

[0016] Accordingly, in the thickness direction of the metal substrate, one part of the molding portion faces the element-side metal layer, while another part faces the molding-opposite portion. Furthermore, the lead faces the lead-opposite portion extending from the molding-opposite portion. In other words, the power element positions the lead and the portion of the molding portion closest to the lead further outward than the element-side metal layer. This increases the insulation distance between the lead and the element-side metal layer. In the converter housing, the power element can simultaneously achieve heat dissipation from the molding portion through the element-side metal layer to the insulating layer and the metal layer, while also increasing the surface distance between the metal layer and the element-side metal layer and the lead. As a result, the electric compressor can simultaneously achieve heat dissipation using the element-side metal layer and ensure the surface distance between the metal layer and the lead.

[0017] In an electric compressor, the molding section may include a heat sink for dissipating heat from the switching element, the heat sink being soldered to a metal layer on the side of the element.

[0018] Accordingly, the converter can be miniaturized compared to, for example, using leaf springs to mount power components onto a metal substrate.

[0019] Furthermore, the heat generated from the power components is transferred to the component-side metal layer via the heat sink and solder. In other words, the converter can improve heat dissipation performance compared to, for example, mounting the power components to a metal substrate using a leaf spring.

[0020] In an electric compressor, the element-side metal layer may have a molded outer portion extending outward from the molded portion in the arrangement direction of the plurality of leads.

[0021] Accordingly, the component-side metal layer has a portion that does not overlap with the molding portion when viewed in a plane from the thickness direction of the metal substrate, namely, a molding outer portion. By having a molding outer portion, the component-side metal layer can increase its heat capacity accordingly. In other words, by having a molding outer portion in the component-side metal layer, the electric compressor can improve the cooling performance of the power component.

[0022] Furthermore, the heat generated by the power element is transferred to a portion of the component-side metal layer that differs from the molded outer portion, and then transferred to the molded outer portion. Even when the power element experiences a rapid temperature rise, such as during the start-up of an electric compressor, the component-side metal layer can retain heat using the molded outer portion while dissipating heat to the metal layer via the insulating layer. Therefore, even when a rapid temperature rise occurs in the power element, the component-side metal layer can suppress heat accumulation due to receiving more heat than it can dissipate. Based on the above, by having a molded outer portion in the component-side metal layer, the cooling performance of the power element can be improved in the metal substrate.

[0023] In an electric compressor, the element-side metal layer may have a molded outer protrusion that extends further from the molded outer portion toward the first portion in a direction that is adjacent to the molded opposite portion and the lead opposite portion in the arrangement direction of the plurality of leads, and extends further from the molded outer portion toward the first portion.

[0024] Accordingly, by having a molded outer protrusion extending from the outer side of the mold, the component-side metal layer can increase its heat capacity compared to a case without a molded outer protrusion. In other words, by having a molded outer protrusion in the component-side metal layer, the electric compressor can improve the cooling performance of the power component.

[0025] In an electric compressor, a temperature sensor may be provided on the metal substrate, which measures the temperature of the power element and is electrically connected to the circuit board.

[0026] Accordingly, the temperature of the power element is measured by a temperature sensor mounted on a metal substrate. Compared to, for example, mounting a temperature sensor on a circuit board, the temperature sensor can measure the temperature of the power element closer to it, thus improving the accuracy of the temperature measurement.

[0027] Invention Effects

[0028] According to the present invention, it is possible to ensure the surface distance first, suppress the enlargement, and suppress the reduction of heat dissipation of power components. Attached Figure Description

[0029] Figure 1 This is a schematic diagram showing a general outline of an electric compressor and a vehicle air conditioning unit.

[0030] Figure 2 It is an exploded perspective view showing the circuit board, power components, and metal substrate.

[0031] Figure 3 This is a perspective view showing the power components and the metal substrate.

[0032] Figure 4 It is a cross-sectional view showing the power components and the metal substrate.

[0033] Figure 5 It is a top view showing the circuit board, power components, and metal substrate.

[0034] Explanation of reference numerals in the attached figures

[0035] 10… Electric compressor, 12… Compression section, 13… Electric motor, 20… Converter housing, 30… Converter, 31… Circuit board, 32… Circuit pattern, 40… Power element, 41… Molded section, 42… Lead wire, 43… Heat sink, 50… Metal substrate, 51… Metal layer, 52… Insulating layer, 53… Component-side metal layer, 70… Temperature sensor, 421… First part, 422… Second part, 521… Molded opposite part, 522… Lead wire opposite part, 532… Molded outer side part, 533… Molded outer side protrusion, A… Resin, S… Switching element. Detailed Implementation

[0036] The following describes one embodiment of the electric compressor. The electric compressor of this embodiment is used in a vehicle air conditioning system installed in a vehicle.

[0037] <Vehicle air conditioning unit>

[0038] like Figure 1As shown, the vehicle air conditioning unit 100 includes an electric compressor 10 and an external refrigerant circuit 101 that supplies refrigerant as a fluid to the electric compressor 10. The vehicle air conditioning unit 100 is mounted in a vehicle not shown. The external refrigerant circuit 101 includes, for example, a heat exchanger and an expansion valve. The vehicle air conditioning unit 100 cools or heats the interior of the vehicle by compressing the refrigerant using the electric compressor 10 and by heat exchange and expansion of the refrigerant using the external refrigerant circuit 101.

[0039] The vehicle air conditioning system 100 includes an air conditioning ECU 102 that controls the entire vehicle air conditioning system 100. The air conditioning ECU 102 is configured to know parameters such as the interior temperature and the set temperature, and based on these parameters, send various commands such as ON / OFF commands to the electric compressor 10.

[0040] <Overall situation of electric compressor>

[0041] The electric compressor 10 includes a housing 11, a compression section 12, an electric motor 13, a converter housing 20, and a converter 30. The electric compressor 10 is electrically connected to and driven by an on-board power supply E. In this embodiment, the voltage of the power supply E is 800V.

[0042] The housing 11 is generally cylindrical in shape. The housing 11 is formed of a material with good heat transfer properties. An example of the material forming the housing 11 is aluminum. An intake port 11a and an outlet port 11b are formed in the housing 11. Refrigerant is drawn into the housing 11 from the external refrigerant circuit 101 via the intake port 11a. The refrigerant drawn into the housing 11 is discharged to the outside of the housing 11 via the outlet port 11b. The outlet port 11b is formed at one end of the housing 11 in the axial direction. Furthermore, the intake port 11a is formed near the end opposite to the end where the outlet port 11b is formed.

[0043] The compression section 12 is housed within the casing 11. The compression section 12 compresses the fluid. In this embodiment, the compression section 12 compresses the refrigerant drawn into the casing 11 from the suction port 11a. The compression section 12 discharges the compressed refrigerant from the discharge port 11b. The specific configuration of the compression section 12 is arbitrary. Examples of specific configurations of the compression section 12 include scroll type, piston type, and vane type.

[0044] The electric motor 13 includes a rotating shaft 14, a rotor 15, and a stator 16. The electric motor 13 is housed within a housing 11. The electric motor 13 drives a compression unit 12. The rotating shaft 14 is a cylindrical body supported so as to be rotatable relative to the housing 11. The axial direction of the rotating shaft 14 is aligned with the axial direction of the housing 11. The rotor 15 is a cylindrical body fixed to the housing 11. A permanent magnet (not shown) is embedded in the rotor 15.

[0045] The stator 16 includes a stator core 17 and coils 18. The stator 16 is fixed to the housing 11. The stator core 17 is radially opposite to the rotor 15 on the rotation shaft 14. The stator core 17 is a cylindrical body fixed to the housing 11. The axial direction of the stator core 17 is aligned with the axial direction of the rotation shaft 14. Teeth 17a are formed on the inner circumferential surface of the stator core 17. The coils 18 are wound around the teeth 17a. The electric motor 13 in this embodiment is a three-phase motor. That is, the coils 18 have a three-phase structure consisting of a U-phase coil, a V-phase coil, and a W-phase coil.

[0046] The converter housing 20 includes a converter plate 21 and a converter cover 22. The converter housing 20 is mounted on the housing 11. Specifically, the converter housing 20 is mounted on the opposite side of the end of the housing 11 in the axial direction, opposite to the end where the outlet 11b is formed.

[0047] The converter plate 21 is a plate-shaped body with the axial direction of the housing 11 as its thickness direction. The converter cover 22 is mounted on the housing 11 through the converter plate 21. More specifically, the converter cover 22 is mounted at the end of the housing 11 with the converter plate 21 positioned between the converter cover 22 and the housing 11 in the axial direction of the housing 11. The converter plate 21 and the converter cover 22 are fixed to the housing 11 by bolts 23.

[0048] The converter housing 20 has a receiving space 20a. The receiving space 20a is formed by the converter plate 21 and the converter cover 22.

[0049] <Transformer>

[0050] The converter 30 includes a circuit board 31, a control unit 33, multiple power components 40, a metal substrate 50, and a temperature sensor 70. The converter 30 is housed in a converter housing 20. The converter 30 is disposed in a housing space 20a. That is, the circuit board 31, the power components 40, and the metal substrate 50 are housed in the converter housing 20. The converter 30 is fixed relative to the housing 11 by the converter housing 20.

[0051] The converter 30 is cooled by refrigerant drawn into the housing 11 from the suction port 11a. More specifically, the heat generated in the converter 30 is transferred to the housing 11 via the converter housing 20. The heat transferred to the housing 11 is then transferred to the refrigerant inside the housing 11. In other words, the converter 30 transfers the heat generated in the converter 30 to the refrigerant via the converter housing 20 and the housing 11.

[0052] The converter 30 drives the electric motor 13. The converter 30 is configured to convert DC power input from the power source E into AC power and then output it to the electric motor 13. More specifically, the converter 30 is electrically connected to the power source E via an external connector C provided on the converter housing 22. Additionally, the converter 30 is electrically connected to the coil 18 of the electric motor 13 via a connector and wiring (not shown), and outputs AC power to the coil 18. The converter 30 is connected to the air conditioning ECU 102 via the external connector C.

[0053] The circuit board 31 is a thin plate. The thickness direction of the circuit board 31 is aligned with the axial direction of the housing 11. Power components 40 and various electronic components (not shown) are mounted on the circuit board 31.

[0054] A circuit pattern 32 constituting the circuitry of the converter 30 is formed on the circuit board 31. The circuit pattern 32 is formed on the surface of the circuit board 31 facing the converter cover 22 in the thickness direction. The circuit pattern 32 is electrically connected to the external connector C. Furthermore, the power components 40 and various electronic components mounted on the circuit board 31 are electrically connected to each other through the circuit pattern 32. Power is supplied from the power source E to the circuit pattern 32 via the external connector C. The power supplied via the external connector C is then supplied to the power components 40 and various electronic components via the circuit pattern 32.

[0055] The control unit 33 is mounted on the circuit board 31. The control unit 33 is electrically connected to the circuit pattern 32. The control unit 33 is electrically connected to the power element 40 and various electrical components via the circuit pattern 32. The control unit 33 is configured to control the power element 40. The control unit 33 controls the converter 30 by controlling the operation of the power element 40.

[0056] The control unit 33 is implemented, for example, by executing a program (software) using a hardware processor such as a CPU (Central Processing Unit). Furthermore, some or all of these components can be implemented using hardware (including the circuitry) such as LSI (Large Scale Integration), ASIC (Application Specific Integrated Circuit), FPGA (Field-Programmable Gate Array), and GPU (Graphics Processing Unit), or through a combination of software and hardware. The program can be pre-stored in a storage device equipped with a non-transitory storage medium such as flash memory, which is provided by the electric compressor 10.

[0057] <Power Components>

[0058] A power element 40 is disposed within a housing space 20a. The power element 40 is disposed within the housing space 20a between the circuit board 31 and the converter board 21. In this embodiment, the power element 40 is a discrete IGBT. The power element 40 is controlled to switch on and off by a control unit 33. Furthermore, the power element 40 in this embodiment has a built-in freewheeling diode. Alternatively, the power element 40 may not have a built-in freewheeling diode. In this case, the converter 30 includes a freewheeling diode corresponding to the power element 40.

[0059] The converter 30 includes multiple power elements 40. The converter 30 performs the conversion of the input power by controlling the on / off state of the multiple power elements 40. Furthermore, in... Figures 1 to 5 In this embodiment, only one of the multiple power elements 40 included in the converter 30 is shown. The number of power elements 40 varies depending on the configuration of the electric motor 13 driven by the converter 30. In this embodiment, the electric motor 13, which is a three-phase motor, has six power elements 40.

[0060] like Figure 1 and Figure 2 As shown, the power element 40 has a molded portion 41 and a plurality of leads 42. In this embodiment, the power element 40 includes Figure 2 The diagram shows three leads 42. However, the number of leads 42 is not limited to three and can be varied depending on the specific configuration of the power element 40. In this embodiment, the three leads 42 function as the gate terminal, collector terminal, and emitter terminal, respectively. The lead 42 functioning as the gate terminal is connected to the circuit pattern 32. Figure 1 The control unit 33 shown is connected. The power element 40 switches between on and off states based on the signal input from the control unit 33 to the lead 42, which functions as a gate terminal.

[0061] like Figure 2 As shown, the molding part 41 is a block shape. Figure 1 As shown, the molding section 41 is formed by molding the switching element S that constitutes the circuit of the converter 30 using resin A. Specifically, the molding section 41 is formed by containing the switching element S internally and filling the space containing the switching element S with resin A. The switching between the on and off states in the power element 40 is achieved by the switching operation of the switching element S. The heat generated in the switching element S due to this switching operation is transferred to the outside of the molding section 41 via the resin A.

[0062] The power element 40 is housed in the converter housing 20 such that the thickness direction of the molding portion 41 is aligned with the thickness direction of the circuit board 31 and the converter board 21. That is, one of the two surfaces of the molding portion 41 in the thickness direction faces the converter board 21, and the other surface faces the circuit board 31.

[0063] like Figure 1 and Figure 2 As shown, the molding section 41 includes a heat sink 43. The heat sink 43 is a plate-shaped body made of metal. The heat sink 43 is integral with the molding section 41. The heat sink 43 is assembled into the molding section 41. Although not shown in detail, the heat sink 43 has a heat dissipation surface 431 exposed to the outside of the molding section 41. The heat dissipation surface 431 is exposed on one side of the molding section 41 in the thickness direction. The heat dissipation surface 431 is coplanar with the one side of the molding section 41.

[0064] The molding section 41 exposes the heat sink 43 on the opposite side of the surface facing the circuit board 31. That is, the heat sink surface 431 faces the converter plate 21 in the thickness direction of the molding section 41.

[0065] The heat sink 43 dissipates heat from the switching element S. Specifically, when the switching element S inside the molding section 41 heats up, the heat from the switching element S is transferred to the heat sink 43 via the resin A filled in the molding section 41. The heat sink 43 then dissipates this heat from the heat dissipation surface 431 to the outside of the power element 40.

[0066] Lead 42 is disposed in molding portion 41. Lead 42 is formed of a conductive material. Lead 42 extends from the side of molding portion 41. Inside molding portion 41, lead 42 is electrically connected to switching element S and extends from the inside of molding portion 41 toward the outside via terminal side 411, which is the side of molding portion 41.

[0067] Three leads 42 extend from the terminal side 411. The terminal side 411 is one of the sides of the molding part 41. More specifically, the terminal side 411 is one of the surfaces of the molding part 41 that are parallel to the thickness direction of the molding part 41.

[0068] From now on, the direction perpendicular to the terminal side 411 will be referred to as the first direction D1. In addition, the direction orthogonal to the thickness direction of the molding portion 41 and the first direction D1 will be referred to as the second direction D2. The three leads 42 are arranged in one direction on the terminal side 411. Figure 2 The three leads 42 shown are arranged along the second direction D2 on the side of the terminal 411.

[0069] Each of the three leads 42 is electrically connected to the circuit pattern 32. The portion of the lead 42 extending from the molding portion 41 is electrically connected to the circuit board 31. The lead 42 electrically connects the switching element S inside the power element 40 relative to the circuit board 31. Hereinafter, the end of the portion of the lead 42 extending from the molding portion 41 that is near the terminal side 411 will be referred to as the base end, and the portion that is near the circuit board 31 will be referred to as the top end.

[0070] Each of the three leads 42 has a first portion 421 and a second portion 422. The lead 42 has the first portion 421 and the second portion 422 in the portion extending outward from the interior of the molding portion 41. The first portion 421 is the portion of the lead 42 near its base end. The first portion 421 extends outward from the side of the molding portion 41. The first portion 421 can also be described as the portion of the lead 42 that is erected on the terminal side 411. The first portion 421 extends along a first direction D1.

[0071] The second portion 422 is the part of the lead 42 near its top end. The second portion 422 bends from the first portion 421 and extends toward the circuit board 31. The second portion 422 can also be described as the portion of the lead 42 near the circuit board 31.

[0072] The lead 42 passes through the second portion 422 through the circuit board 31, with its tip protruding from the side of the circuit board 31 opposite to the side facing the molding portion 41. Thus, the lead 42 is connected to the circuit pattern 32 near the tip protruding from the circuit board 31.

[0073] <Metal Substrate>

[0074] like Figure 1 As shown, the metal substrate 50 includes a metal layer 51, an insulating layer 52, and a component-side metal layer 53. The metal substrate 50 is sheet-shaped. The metal substrate 50 is housed in a housing space 20a. The metal substrate 50 is disposed between the power component 40 and the converter housing 20. More specifically, the metal substrate 50 is disposed between the power component 40 and the converter board 21. The metal substrate 50 is disposed on the converter board 21 with its thickness direction aligned with the thickness direction of the converter board 21. That is, the thickness direction of the metal substrate 50 is aligned with the thickness directions of the converter board 21, the molding portion 41, and the circuit board 31. One side of the metal substrate 50 in the thickness direction faces the converter board 21, and the other side faces the power component 40.

[0075] In the metal substrate 50, the metal layer 51, the insulating layer 52, and the device-side metal layer 53 are stacked in this order. The metal substrate 50 is formed integrally by the metal layer 51, the insulating layer 52, and the device-side metal layer 53. In the metal substrate 50 of this embodiment, the thickness of the metal layer 51 is 1.0 mm, the thickness of the insulating layer 52 is 0.15 mm, and the thickness of the device-side metal layer 53 is 0.035 mm. Furthermore, regarding... Figures 1 to 5 The thickness of the metal substrate 50 is exaggerated in the illustration to easily show the structure of the metal substrate 50 in the thickness direction.

[0076] <Metallic Layer>

[0077] like Figure 1 and Figure 2 As shown, the metal layer 51 constitutes a portion of the metal substrate 50 near one side in the thickness direction. More specifically, the metal layer 51 constitutes a portion of the metal substrate 50 near the converter plate 21 in the thickness direction. The metal substrate 50 is opposite to the converter plate 21 at the metal layer 51.

[0078] The metal layer 51 is formed of a thermally conductive metallic material. In this embodiment, the material forming the metal layer 51 is aluminum. The metal substrate 50 brings the metal layer 51 into contact with the converter plate 21. Thus, the metal substrate 50 is connected to the converter plate 21 in a thermally conductive manner with respect to the metal layer 51.

[0079] <Insulating layer>

[0080] An insulating layer 52 is integrally formed on one side of the metal layer 51. The insulating layer 52 is formed on the opposite side of the metal layer 51 that contacts the converter plate 21 in the thickness direction of the metal substrate 50. The insulating layer 52 is located between the metal layer 51 and the power element 40 in the thickness direction of the metal substrate 50. More specifically, the insulating layer 52 is located between the metal layer 51 and the molding portion 41 in the thickness direction of the metal substrate 50. The insulating layer 52 is located between the heat sink 43 and the metal layer 51.

[0081] The insulating layer 52 is located between the metal layer 51 and the first portion 421 of the lead 42 in the thickness direction of the metal substrate 50. That is, the power element 40 and the metal substrate 50 are housed in the converter housing 20 in this order, with the first portion 421, the insulating layer 52, and the metal layer 51 arranged relative to the thickness direction of the metal substrate 50.

[0082] The insulating layer 52 includes a molded opposing portion 521 and a lead opposing portion 522. The insulating layer 52 is formed of an insulating material. In this embodiment, the insulating layer 52 is made of resin material. The insulating layer 52 insulates the power element 40 from the metal layer 51.

[0083] The molded opposing portion 521 is part of the insulating layer 52. The molded opposing portion 521 extends relative to the molded portion 41 in the thickness direction of the metal substrate 50. The molded opposing portion 521 is located between the heat sink 43 and the metal layer 51. In this embodiment, the molded opposing portion 521 constitutes a portion of the insulating layer 52 that overlaps with the molded portion 41 in the thickness direction of the metal substrate 50. The lead opposing portion 522 is part of the insulating layer 52. The lead opposing portion 522 extends from the molded opposing portion 521 in a manner at least relative to the first portion 421 in the thickness direction of the metal substrate 50.

[0084] The following uses Figure 3 and Figure 4 The extent to which the insulating layer 52 is disposed in the metal layer 51 will be explained. In the following explanation, a hypothetical plane P formed by a portion of the terminal side surface 411 will be considered. The hypothetical plane P only needs to be a portion of the terminal side surface 411, and the area of ​​this hypothetical plane P only needs to be the degree to which it intersects with the metal substrate 50. That is, the area of ​​the hypothetical plane P is not limited to... Figure 3 and Figure 4 As shown.

[0085] The imaginary plane P intersects with the metal substrate 50. In other words, the imaginary plane P intersects with the metal layer 51 and the insulating layer 52. Figure 3 and Figure 4 In the diagram, an imaginary line L is used to show the portion where the imaginary plane P intersects with the insulating layer 52. That is, the imaginary line L is a straight line on both the imaginary plane P and the insulating layer 52. The imaginary line L extends along the second direction D2.

[0086] The imaginary plane P extends in directions parallel to both the thickness direction of the molding portion 41 and the thickness direction of the metal substrate 50. Therefore, when viewed from a plane along the thickness direction of the metal substrate 50, the imaginary plane P coincides with the imaginary line L. In other words, when viewed from this plane, the terminal side surface 411 coincides with the imaginary line L.

[0087] In the insulating layer 52, the imaginary line L corresponds to the boundary line between the molded opposing portion 521 and the lead opposing portion 522. Specifically, in the first direction D1, the insulating layer 52 has a molded opposing portion 521 closer to the molded portion 41 than the imaginary line L, and a lead opposing portion 522 closer to the lead 42 than the imaginary line L. The molded opposing portion 521 extends from the imaginary line L and corresponds to the portion of the insulating layer 52 that is aligned with the molded portion 41 in the thickness direction of the metal substrate 50. That is, Figure 3 The diagram only shows the portion of the molded relative part 521 near the imaginary line L.

[0088] The insulating layer 52 extends from an imaginary line L intersecting the imaginary plane P containing the terminal side 411 and the metal substrate 50, in a manner at least opposite to the first portion 421 in the thickness direction. In other words, the metal substrate 50 has a lead-facing portion 522 in the insulating layer 52 such that it at least overlaps with the first portion 421 when viewed in a plane from the thickness direction. The insulating layer 52 can also be described as having a lead-facing portion 522 extending from the imaginary line L in a manner that at least insulates the first portion 421 from the metal layer 51. In addition, the metal substrate 50 has a molded portion 521 in the insulating layer 52 such that it at least overlaps with the molded portion 41 when viewed in a plane from the thickness direction. The insulating layer 52 can also be described as having a molded portion 521 such that it at least insulates the portion of the molded portion 41 near the lead 42 from the metal layer 51.

[0089] As described above, the insulating layer 52 is formed on the metal layer 51 in such a way that it at least insulates the first portion 421 from the metal layer 51. The insulating layer 52 may be formed on the entire surface of the metal layer 51 opposite to the surface that contacts the converter plate 21. Alternatively, the insulating layer 52 may be formed on a portion of this opposite surface of the metal layer 51. When the insulating layer 52 is formed on a portion of this opposite surface, multiple insulating layers 52 are formed to insulate the first portion 421 of each of the plurality of power elements 40 from the metal layer 51.

[0090] In summary, the insulating layer 52 only needs to insulate the first portion 421 from the metal layer 51, and can be formed at any position on the opposite side of the surface of the metal layer 51 that contacts the converter plate 21. In this embodiment, the insulating layer 52 is formed on the entire opposite side of the metal layer 51. Furthermore, in the case where multiple insulating layers 52 are formed in the metal layer 51, each insulating layer 52 includes a molded opposing portion 521 and a lead opposing portion 522.

[0091] Furthermore, when an insulating layer 52 is formed locally on the opposite side of the metal layer 51, the metal substrate 50 provides the insulating layer 52 in a manner that insulates the first portion 421 from the metal layer 51. Specifically, the metal substrate 50 provides the insulating layer 52 such that the spatial distance between the first portion 421 and the portion of the metal layer 51 not covered by the insulating layer 52 is greater than or equal to a desired distance. That is, the area and arrangement of the insulating layer 52 in the metal substrate 50 are set such that, taking each portion of the first portion 421 as a starting point, the spatial distance to the portion of the metal layer 51 not covered by the insulating layer 52 is greater than or equal to a desired distance. Here, each portion of the first portion 421 is the portion when the first portion 421 is divided into multiple portions with an arbitrary width in the extending direction of the first portion 421.

[0092] The desired distance between the first portion 421 and the portion of the metal layer 51 not covered by the insulating layer 52 is appropriately varied according to the voltage of the power supply E, i.e., the voltage applied to the power element 40. In this embodiment, the insulating layer 52 is provided such that the spatial distance between the first portion 421 and the portion of the metal layer 51 not covered by the insulating layer 52 is 5 mm or more.

[0093] <Component Side Metal Layer>

[0094] like Figure 1 and Figure 2 As shown, the metal substrate 50 has a component-side metal layer 53 on the opposite side of the metal layer 51, with the insulating layer 52 sandwiched in between. The power component 40 and the metal substrate 50 are housed in the converter housing 20 in this order: the molding portion 41, the component-side metal layer 53, the insulating layer 52, and the metal layer 51 relative to the thickness direction of the metal substrate 50. In other words, the insulating layer 52 is positioned between the metal layer 51 and the component-side metal layer 53 on the metal substrate 50. The component-side metal layer 53 can also be described as being disposed on the metal layer 51 with the insulating layer 52 in between.

[0095] A component-side metal layer 53 is disposed on an insulating layer 52, and is disposed on the opposite side of the insulating layer 52 to the side facing the metal layer 51. The component-side metal layer 53 constitutes a portion of the metal substrate 50 near the side facing the power component 40. In other words, the metal substrate 50 faces the power component 40 through the component-side metal layer 53.

[0096] like Figure 2As shown, the component-side metal layer 53 includes a main body portion 531, a molded outer side portion 532 extending from the main body portion 531, and two molded outer side protrusions 533 further extending from the molded outer side portion 532. The component-side metal layer 53 is formed of a heat-conducting metal material. The material forming the component-side metal layer 53 in this embodiment is copper. The component-side metal layer 53 is formed by molding the metal material. That is, the main body portion 531, the molded outer side portion 532, and the molded outer side protrusions 533 are each part of a component-side metal layer 53 made of a single metal material.

[0097] The component-side metal layer 53 has an edge portion 534. When viewed in a plane from the thickness direction of the metal substrate 50, the edge portion 534 coincides with the boundary line between the component-side metal layer 53 and the insulating layer 52. In other words, the component-side metal layer 53 can also be described as the portion surrounded by the closed edge portion 534.

[0098] like Figure 1 As shown, a conductive member 54 is provided on the component-side metal layer 53. The conductive member 54 electrically connects the component-side metal layer 53 to the circuit board 31. One example of the conductive member 54 is a busbar. Alternatively, the conductive member 54 can also be a wire.

[0099] like Figure 2 As shown, the component-side metal layer 53 has a main body portion 531 in the portion opposite to the molded portion 41 of the power component 40. Figure 2 In the diagram, a dashed line is used to show the boundary B between the main body 531 and a portion different from the main body 531 in the component-side metal layer 53. Boundary B is rectangular. Boundary B consists of two sides extending along the first direction D1 and two sides extending along the second direction D2. Viewed from the thickness direction of the component-side metal layer 53, one of the four sides constituting boundary B coincides with a portion of the edge 534. Viewed from the thickness direction of the component-side metal layer 53, boundary B coincides with a portion of the edge 534 at one of the two sides extending along the second direction D2.

[0100] The main body 531 overlaps with the molded opposing portion 521 of the insulating layer 52 in the thickness direction of the component-side metal layer 53. Specifically, the portion of the insulating layer 52 that overlaps with the main body 531 in the thickness direction of the component-side metal layer 53 constitutes a part of the molded opposing portion 521. Therefore, the molded opposing portion 521 can also be described as being opposite to the molded portion 41 in the first direction D1 near the imaginary line L, while being covered by the component-side metal layer 53 in a portion different from this portion.

[0101] The component-side metal layer 53 is bonded to the power component 40 at the main body 531. More specifically, the component-side metal layer 53 and the power component 40 are bonded to the main body 531 by a heat sink 43. In other words, the heat sink 43 is soldered to the component-side metal layer 53. Figure 2 In the image, the portion of the component-side metal layer 53 containing the solder is shown by a double-dotted line.

[0102] The terminal side 411 is disposed on the outer side of the component-side metal layer 53 such that a portion of the molding portion 41 faces the component-side metal layer 53, and another portion of the molding portion 41 and the lead 42 face the insulating layer 52. The molding opposing portion 521 is located on the outer side of the component-side metal layer 53 and faces the molding portion 41 in the thickness direction of the metal substrate 50. In addition, the lead opposing portion 522 extends from the molding opposing portion 521 on the outer side of the component-side metal layer 53, facing at least the first portion 421 in the thickness direction of the metal substrate 50.

[0103] In other words, the power element 40 has a portion arranged with the insulating layer 52 across the main body portion 531 and a portion arranged with the insulating layer 52 without being separated from the main body portion 531 in the thickness direction of the metal substrate 50. Specifically, the portion of the power element 40 on the opposite side of the terminal side surface 411 in the molding portion 41 is arranged with the insulating layer 52 across the main body portion 531. The portion of the power element 40 on the terminal side surface 411 in the molding portion 41 is arranged with the molding opposing portion 521. In addition, the power element 40 is arranged with the lead opposing portion 522 at each of the leads 42. That is, the power element 40 is disposed on the element-side metal layer 53 in such a way that when the metal substrate 50 is viewed in a plane in the thickness direction, the terminal side surface 411 is outside the area surrounded by the edge portion 534.

[0104] The component-side metal layer 53 has a molded outer portion 532 extending outward from the molded portion 41 in the arrangement direction of the plurality of leads 42. More specifically, the component-side metal layer 53 has a molded outer portion 532 extending from the boundary B of the main body portion 531. The molded outer portion 532 is not opposite to the power component 40 in the thickness direction of the metal substrate 50.

[0105] In this embodiment, the molded outer portion 532 extends from the three sides of boundary B, excluding the side that coincides with the edge portion 534. The molded outer portion 532 surrounds the main body portion 531 along the three sides of boundary B, excluding the side that coincides with the edge portion 534. Furthermore, the molded outer portion 532 and the two molded outer protrusions 533 described below are bounded by the extension line of the side of boundary B that coincides with the edge portion 534. The portion of the component-side metal layer 53 where the main body portion 531 and the molded outer portion 532 are combined is rectangular.

[0106] Each of the two molded outer protrusions 533 extends further from the molded outer portion 532 in the direction extending toward the first portion 421. More specifically, the molded outer protrusion 533 extends along the first direction D1 from the portion of the molded outer portion 532 that is close to the lead 42. The molded outer protrusion 533 is not opposite to the power element 40 in the thickness direction of the metal substrate 50.

[0107] like Figure 5 As shown, when the metal substrate 50 is viewed in plan view from the thickness direction, two molded outer protrusions 533 extend from the molded outer portion 532 away from the lead 42 in the second direction D2. Specifically, the two molded outer protrusions 533 are arranged away from each other in the second direction D2. The lead 42 and the two molded outer protrusions 533 are arranged in the second direction D2 in the order of one molded outer protrusion 533, the lead 42, and the other molded outer protrusion 533. Therefore, when the metal substrate 50 is viewed in plan view from the thickness direction, the molded opposing portion 521 and the lead opposing portion 522 in the insulating layer 52 are adjacent to each other between the two molded outer protrusions 533.

[0108] The component-side metal layer 53 includes a main body 531, a molded outer portion 532, and a molded outer protrusion 533, such that the spatial distance from the first portion 421 to each of the main body 531, the molded outer portion 532, and the molded outer protrusion 533 is greater than or equal to a desired distance. Specifically, the area and arrangement of the main body 531, the molded outer portion 532, and the molded outer protrusion 533 in the component-side metal layer 53 are set such that, taking each portion on the first portion 421 as a starting point, the spatial distance to the main body 531, the molded outer portion 532, and the molded outer protrusion 533 is greater than or equal to a desired distance. As a result, the component-side metal layer 53 is insulated from the lead 42.

[0109] <Temperature Sensor>

[0110] like Figure 1 and Figure 2 As shown, a temperature sensor 70 is disposed on a metal substrate 50. The temperature sensor 70 measures the temperature of the power element 40. An example of the temperature sensor 70 is a thermistor. The temperature sensor 70 is disposed in the element-side metal layer 53 of the metal substrate 50. More specifically, the temperature sensor 70 is disposed on a molded outer protrusion 533. The temperature sensor 70 is fixed relative to the molded outer protrusion 533 by soldering.

[0111] Temperature sensor 70 is mounted on metal substrate 50. Temperature sensor 70 is electrically connected to the component-side metal layer 53 in metal substrate 50. That is, temperature sensor 70 is electrically connected to circuit board 31. More specifically, temperature sensor 70 is electrically connected to circuit pattern 32 via component-side metal layer 53 and conductive component 54. Temperature sensor 70 is connected to... Figure 1 The control unit 33 shown is connected. The temperature sensor 70 is configured to send the measured temperature of the power element 40 to the control unit 33. For example, if the temperature of the power element 40 measured by the temperature sensor 70 becomes a high temperature exceeding a preset allowable value, the control unit 33 stops the control of the electric motor 13 by the converter 30.

[0112] [The function of this implementation method]

[0113] Explain the function of this implementation method.

[0114] The electric compressor 10 uses a compression section 12 driven by an electric motor 13 to compress the refrigerant drawn into the housing 11. The electric compressor 10 uses a converter 30 to convert externally input DC power into AC power, and uses this AC power to drive the electric motor 13. The converter 30 performs the conversion from DC power to AC power through the operation of the power element 40 mounted on the circuit board 31.

[0115] During the operation of the electric compressor 10, the power element 40 generates heat. This heat generation in the power element 40 originates from the heating of the switching element S included in the molding section 41 during this process. The heat generated in the power element 40 is transferred to the metal substrate 50. Specifically, the heat generated from the power element 40 is transferred to the element-side metal layer 53. In the metal substrate 50, the heat transferred from the power element 40 reaches the metal layer 51 via the insulating layer 52. The metal layer 51 dissipates the heat generated by the power element 40 to the converter housing 20. The converter housing 20, which receives this heat, is cooled by the refrigerant drawn into the interior of the housing 11.

[0116] The DC power input to the electric compressor 10 is supplied to the switching element S within the molding section 41 via the lead 42. The insulating layer 52 has a molding opposing portion 521 and a lead opposing portion 522 extending from the molding opposing portion 521, respectively facing the molding section 41 and the first portion 421 in the thickness direction of the metal substrate 50. This increases the surface distance (creep distance) between the molded opposing portion 521 and the lead opposing portion 522 between the lead 42 and the metal layer 51.

[0117] [Effects of this implementation method]

[0118] Explain the effects of this implementation method.

[0119] (1) While the electric compressor 10 insulates the lead 42 from the metal layer 51 using the insulating layer 52, it transfers the heat generated by the power element 40 to the converter housing 20 via the metal substrate 50. For example, in a converter 30 that does not have a metal substrate 50, there is a case where the power element 40 is insulated from the heat sink by providing a sheet of insulating material separate from the heat sink provided on the converter plate 21. Compared to this case, the electric compressor 10, by having a metal substrate 50 having a metal layer 51 and an insulating layer 52 integrally formed on the metal layer 51, can achieve miniaturization of the metal substrate 50 in the thickness direction.

[0120] Furthermore, the insulating layer 52 includes a molded opposing portion 521 and a lead opposing portion 522 extending from the molded opposing portion 521 and opposing the first portion 421. By including the molded opposing portion 521 and the lead opposing portion 522, the insulating layer 52 can increase the surface distance between the lead 42 and the metal layer 51. Compared to, for example, increasing the surface distance by thickening the insulating layer 52, the electric compressor 10 can suppress the enlargement of the metal substrate 50 in the thickness direction. By increasing the surface distance using the molded opposing portion 521 and the lead opposing portion 522, the electric compressor 10 can suppress the reduction in heat dissipation of the power element 40 compared to, the case where the surface distance is ensured by thickening the insulating layer 52. Based on the above, the electric compressor 10 can suppress the enlargement and the reduction in heat dissipation of the power element 40, primarily by ensuring the surface distance.

[0121] (2) The metal substrate 50 has an insulating layer 52 between the molding part 41 and the metal layer 51. Even if a potential difference is generated between the heat sink 43 and the metal layer 51, the electric compressor 10 can use the insulating layer 52 to insulate the power element 40 from the metal layer 51, and can be miniaturized while ensuring the surface distance between the lead 42 and the metal layer 51.

[0122] (3) The metal substrate 50 includes a device-side metal layer 53. The molded opposing portion 521 and the lead opposing portion 522 of the insulating layer 52 are disposed on the outside of the device-side metal layer 53. Accordingly, in the thickness direction of the metal substrate 50, a portion of the molded portion 41 faces the device-side metal layer 53, and another portion of the molded portion 41 faces the insulating layer 52 without being separated from the device-side metal layer 53. Therefore, in the metal substrate 50, heat generated from the power device 40 is transferred to the device-side metal layer 53 via the molded portion 41. In addition, by having the molded opposing portion 521 and the lead opposing portion 522, the insulating layer 52 increases the surface distance between the lead 42 and the device-side metal layer 53 and the metal layer 51. As a result, the power device 40 can achieve heat dissipation from the molded portion 41 to the device-side metal layer 53 while increasing the insulation distance between the metal layer 51 and the device-side metal layer 53 and the lead 42. As a result, the electric compressor 10 is able to balance heat dissipation using the component-side metal layer 53 with ensuring the surface distance between the metal layer 51 and the component-side metal layer 53 and the lead 42.

[0123] (4) The power element 40 is soldered to the metal substrate 50 via the heat sink 43 relative to the element-side metal layer 53. In this case, the converter 30 can be miniaturized compared to, for example, using a leaf spring to mount the power element 40 to the metal substrate 50.

[0124] Furthermore, the heat generated from the power element 40 is transferred to the element-side metal layer 53 via the heat sink 43 and solder. In other words, the converter 30 can improve heat dissipation performance compared to, for example, mounting the power element 40 to the metal substrate 50 by pressing with a leaf spring.

[0125] (5) The metal substrate 50 is bonded to the power device 40 via the device-side metal layer 53 formed on the insulating layer 52. By having the device-side metal layer 53, the metal substrate 50 can prevent the insulating layer 52 from being damaged by conductive foreign matter generated during soldering operations.

[0126] (6) The component-side metal layer 53 has a molded outer portion 532 extending to the outer side of the molding portion 41. By having the molded outer portion 532, the component-side metal layer 53 can increase its heat capacity accordingly. In other words, by having the molded outer portion 532 in the component-side metal layer 53, the electric compressor 10 can improve the cooling performance of the power element 40.

[0127] (7) After the heat generated by the power element 40 is transferred to the main body portion 531 in the element-side metal layer 53, it is transferred to the molded outer portion 532. For example, even when the power element 40 experiences a rapid temperature rise, such as during the start-up of the electric compressor 10, the element-side metal layer 53 can retain heat using the molded outer portion 532 while dissipating heat to the metal layer 51 via the insulating layer 52. Therefore, even when a rapid temperature rise occurs in the power element 40, the element-side metal layer 53 can suppress heat accumulation due to receiving more heat than dissipating heat. Based on the above, by providing the molded outer portion 532 in the element-side metal layer 53, the metal substrate 50 can improve the cooling performance of the power element 40.

[0128] (8) The component-side metal layer 53 has a molded outer protrusion 533 extending from the molded outer side portion 532. As a result, the component-side metal layer 53 can increase its heat capacity compared to the case where it does not have the molded outer protrusion 533. In other words, the electric compressor 10 can improve the cooling performance of the power element 40 compared to the case where the component-side metal layer 53 does not have the molded outer side portion 532.

[0129] (9) The component-side metal layer 53 has a molded outer protrusion 533 that separates from the lead 42 when the metal substrate 50 is viewed in plan view from the thickness direction. In other words, the metal substrate 50 can increase the area of ​​the component-side metal layer 53 while ensuring insulation between it and the lead 42. As a result, the component-side metal layer 53 can improve the cooling performance of the power component 40 while ensuring insulation between it and the lead 42.

[0130] (10) The converter 30 includes a temperature sensor 70 disposed on the metal substrate 50. The temperature of the power element 40 is measured by the temperature sensor 70 disposed on the metal substrate 50. Compared to, for example, the case where the temperature sensor 70 is mounted on the circuit board 31, the temperature sensor 70 can measure the temperature of the power element 40 in a location closer to the power element 40. As a result, the temperature sensor 70 can measure the temperature of the power element 40 with higher accuracy compared to, for example, the case where it is mounted on the circuit board 31.

[0131] [Example of Change]

[0132] Furthermore, the above-described embodiments can be implemented with the following modifications. The above-described embodiments and the following modifications can be combined with each other to implement them without technical inconsistencies.

[0133] ○ Temperature sensor 70 can also be mounted on circuit board 31 and measure the temperature of power element 40. In this case, converter 30 may not have conductive component 54.

[0134] ○ The component-side metal layer 53 may also not have the molded outer protrusion 533. For example, the component-side metal layer 53 may also be a rectangular shape composed of the main body 531 and the molded outer part 532.

[0135] ○ The shape of the molded outer portion 532 is not limited to the embodiment. The molded outer portion 532 may also be a portion extending from one of the edges provided by the main body portion 531. In short, the molded outer portion 532 only needs to extend to a position outside the molded portion 41.

[0136] ○ The component-side metal layer 53 may also not have the molded outer side portion 532. For example, the component-side metal layer 53 may consist only of the main body portion 531.

[0137] ○ The heat sink 43 may not be soldered to the component-side metal layer 53. For example, the power component 40 may also have the heat sink 43 pressed against the component-side metal layer 53 by a leaf spring provided on the metal substrate 50.

[0138] ○ The metal substrate 50 can also be separated from the component-side metal layer 53. That is, the metal substrate 50 can also allow the plate-shaped metal component disposed on the insulating layer 52 to function as the component-side metal layer 53.

[0139] ○ The metal substrate 50 may also lack the component-side metal layer 53. In this case, the power component 40 is mounted on the metal substrate 50 with the molding portion 41 facing the insulating layer 52.

[0140] ○ The molding part 41 may also be without the heat sink 43. In this case, the insulating layer 52 is located between the molding part 41 and the lead wire 42 and the metal layer 51 respectively.

[0141] ○ The power element 40 is not limited to a discrete IGBT, but can also be a MOSFET (Metal Oxide Semiconductor Field Effect Transistor). Alternatively, it can be a power module modularized from the power element 40, or an IGBT modularized from multiple switching elements S. Furthermore, the power element 40 can also have leads 42 extending from the inside of the molding portion 41 to the outside on multiple sides of the molding portion 41. In this case, the power element 40 has terminal sides 411 corresponding to the number of these sides.

[0142] ○ The power element 40 may also be an IPM containing multiple switching elements S. In short, the power element 40 can be configured to convert DC power into AC power by mounting one or more of the power element 40 on the circuit board 31. For example, the specific configuration of the power element 40, such as the shape and number of leads 42 and the number of switching elements S, may be appropriately changed according to the type of power element 40 used in the converter 30.

[0143] When the metal substrate 50 is used as a power element 40 by insulating the molded portion 41 with an IPM, it may also have a portion where the insulating layer 52 is absent between the molded portion 41 and the metal layer 51. In other words, the insulating layer 52 may not have a molded opposing portion 521 that is entirely formed in the thickness direction of the metal substrate 50 where it overlaps with the molded portion 41. In this case, the insulating layer 52 only needs to extend the molded opposing portion 521 between the molded portion 41 and the metal layer 51 to a degree that ensures the required surface distance between the lead 42 and the metal layer 51.

[0144] In this case, the heat generated by the power element 40 is not transferred to the metal layer 51 via the insulating layer 52. As a result, the metal substrate 50 can improve the cooling performance of the power element 40.

[0145] ○ The voltage of power supply E is not limited to 800V. The insulation distance between lead 42 and metal layer 51 is appropriately varied according to the voltage of power supply E.

[0146] ○ The electric compressor 10 can be installed in any vehicle, not just any vehicle.

[0147] ○ The electric compressor 10 may not be used in the vehicle air conditioning system 100. The electric compressor 10 may also be used in other devices. For example, in the case of a fuel cell vehicle equipped with a fuel cell, the electric compressor 10 may be used as a supply device for supplying air to the aforementioned fuel cell. In this case, the fluid compressed by the compression unit 12 is air.

Claims

1. An electric compressor, comprising: The compression section compresses the fluid; An electric motor drives the compression unit; The converter drives the electric motor; and Converter housing, which houses the converter. The converter has the following features: A circuit board having a circuit pattern forming the circuitry constituting the converter; and The power element has a molded portion formed by molding a switching element constituting the circuit of the converter using resin, and a plurality of leads electrically connected to the switching element, extending from the side of the molded portion and electrically connected to the circuit pattern. Each of the plurality of leads has a first portion extending outward from the side and a second portion that bends from the first portion and extends toward the circuit board. Its features are, The converter also includes a metal substrate disposed between the power element and the converter housing. The metal substrate includes a metal layer for dissipating heat generated by the power element to the converter housing, and an insulating layer integrally formed on one side of the metal layer. The power element and the metal substrate are housed in the converter housing in this order, with the first portion, the insulating layer, and the metal layer arranged relative to the thickness direction of the metal substrate. The insulating layer includes a molded opposing portion extending in a manner opposite to the molded portion in the thickness direction, and a lead opposing portion extending from the molded opposing portion in a manner at least opposite to the first portion in the thickness direction.

2. The electric compressor according to claim 1, wherein, The molding section includes a heat sink for dissipating heat from the switching element. The molded opposite portion is located between the heat sink and the metal layer.

3. The electric compressor according to claim 1, wherein, The metal substrate further includes a component-side metal layer disposed on the opposite side of the metal layer, such that the insulating layer is sandwiched in the middle. The power components and the metal substrate are housed in the converter housing in the manner in which the molded portion, the component-side metal layer, the insulating layer, and the metal layer are arranged in this order relative to the thickness direction. The molded opposing portion is located on the outer side of the metal layer on the component side, and is opposite to the molded portion in the thickness direction. The lead-opposing portion extends from the molded opposing portion at a location outside the element-side metal layer, in a manner at least opposite to the first portion in the thickness direction.

4. The electric compressor according to claim 3, wherein, The molding section includes a heat sink for dissipating heat from the switching element. The heat sink is soldered to the metal layer on the side of the component.

5. The electric compressor according to claim 3, wherein, The element-side metal layer has a molded outer portion that extends outward from the molded portion in the arrangement direction of the plurality of leads.

6. The electric compressor according to claim 5, wherein, The component-side metal layer has a molded outer protrusion that extends further from the molded outer portion toward the first portion in a direction that is adjacent to the molded opposite portion and the lead opposite portion in the arrangement direction of the plurality of leads, and extends further from the molded outer portion toward the first portion.

7. The electric compressor according to claim 1, wherein, A temperature sensor is provided on the metal substrate to measure the temperature of the power element and is electrically connected to the circuit board.

Images