An automation terminal device running state monitoring device and a monitoring method

Abstract

This invention discloses an automated terminal equipment operation status monitoring device and method, belonging to the field of power distribution automation equipment monitoring technology. The device consists of an MCU, a current signal acquisition module, a voltage signal acquisition module, a temperature acquisition module, an A / D converter module, a power supply module, an alarm module, a communication recording module, a data storage module, and a display module. Each module is electrically connected according to a preset configuration to form a complete monitoring architecture. Based on this device, the method sequentially executes the following steps: system initialization self-calibration, multi-source signal synchronous acquisition and preprocessing, fault judgment threshold dynamic correction, multi-dimensional feature fusion fault analysis, hierarchical linkage response and data partitioning storage, and cyclic monitoring. This invention improves the accuracy of fault detection and analysis, can quickly locate faults and respond hierarchically, significantly shortens repair time, effectively improves the operation and maintenance management capabilities of terminal equipment, and ensures the safety of power distribution networks and equipment.

Description

Technical Field

[0001] This invention relates to the field of power distribution automation equipment monitoring technology, specifically to an automated terminal equipment operation status monitoring device and monitoring method. Background Technology

[0002] Low-voltage distribution networks are a core component of the power system to ensure the reliability of power supply to end users. As a key carrier for the operation and management, data acquisition, and command execution of low-voltage distribution networks, automated terminal equipment has seen its installation scale grow rapidly in recent years with the advancement of intelligent distribution network construction.

[0003] These types of terminal equipment are widely distributed in various scenarios such as power distribution rooms and feeder lines, exhibiting significant characteristics of numerous points, wide coverage, and dispersed layout. This has resulted in a serious mismatch between the growth rate of front-line operation and maintenance human resources and the growth in the scale of terminal equipment. For a long time, low-voltage distribution networks have lacked effective operation and control measures for terminal equipment, which has brought great pressure to the operation and maintenance management of terminal equipment.

[0004] Current conventional monitoring solutions for automated terminal equipment mostly adopt a single electrical quantity monitoring mode with fixed thresholds, which cannot adapt to the operating characteristics of equipment under different ambient temperatures and operating loads, and are prone to false alarms and missed alarms.

[0005] At the same time, the lack of on-site fault assessment capabilities based on multi-dimensional feature fusion makes it impossible to accurately identify fault types and locations. After a terminal malfunctions, maintenance personnel struggle to obtain complete fault information in a timely manner, resulting in long fault investigation and repair cycles. This not only affects the stability of the power distribution network but also further exacerbates the workload of maintenance personnel.

[0006] Therefore, it is very necessary to design an automated terminal equipment operation status monitoring device and monitoring method; Summary of the Invention

[0007] The purpose of this invention is to provide an automated terminal equipment operation status monitoring device and monitoring method to solve the problems mentioned in the background art, such as the lack of effective operation control, low efficiency of fault diagnosis and handling, and high pressure of operation and maintenance management of automated terminal equipment.

[0008] To achieve the above objectives, the present invention provides the following technical solution:

[0009] In a first aspect, an automated terminal equipment operation status monitoring device is provided, including an MCU, and further including a current signal acquisition module, a voltage signal acquisition module, a temperature acquisition module, an A / D converter module, a power supply module, an alarm module, a communication record module, a data storage module, and a display module;

[0010] The power output terminal of the power module is electrically connected to the power pin of the MCU.

[0011] The analog signal output terminals of the current signal acquisition module, voltage signal acquisition module, and temperature acquisition module are all electrically connected to the input terminal of the A / D converter module. The output terminal of the A / D converter module is electrically connected to the first signal input terminal of the MCU. The status output terminals of the current signal acquisition module, voltage signal acquisition module, and temperature acquisition module are electrically connected to the second, third, and fourth signal input terminals of the MCU, respectively. The status output terminal of the power supply module is electrically connected to the fifth signal input terminal of the MCU.

[0012] The first control output terminal of the MCU is electrically connected to the controlled terminal of the data storage module, the second control output terminal is electrically connected to the driving terminal of the alarm module, the third control output terminal is electrically connected to the control terminal of the communication recording module, and the fourth control output terminal is electrically connected to the signal input terminal of the display module.

[0013] As a further technical solution of the present invention, the MCU adopts an STM32F103 microcontroller, which is equipped with a peripheral interface with an independent clock switch. The peripheral interface includes an SPI communication interface, an I2C communication interface and a UART serial communication interface.

[0014] As a further technical solution of the present invention, the current signal acquisition module adopts a Hall current sensor; the voltage signal acquisition module adopts a voltage sampling circuit composed of a precision resistor voltage divider network and an RC low-pass filter circuit; the temperature acquisition module adopts at least two DS18B20 single-bus temperature sensing chips, and the two temperature sensing chips respectively correspond to the acquisition of the body temperature of the automated terminal equipment and the acquisition of the operating environment temperature.

[0015] As a further technical solution of the present invention, the A / D converter module integrates the AD7327 analog-to-digital converter chip and the ADUM1411 digital isolation chip; the AD7327 analog-to-digital converter chip is configured with multiple independent analog signal input channels, and the ADUM1411 digital isolation chip is connected in series between the AD7327 analog-to-digital converter chip and the MCU.

[0016] As a further technical solution of the present invention, the power supply module adopts a high-frequency rectification and voltage regulation power supply circuit. The power supply circuit is equipped with a rectification unit, a PWM modulation unit, a voltage regulation unit and a protection unit, and can output multiple isolated DC working power supplies.

[0017] As a further technical solution of the present invention, the alarm module adopts an electromagnetic buzzer with a transistor driving circuit and a freewheeling protection circuit; the communication recording module adopts an RS485 communication circuit based on the MAX3485 chip, and the communication circuit is equipped with a lightning protection unit and an impedance matching unit; the data storage module adopts a W25Q256FVFI flash memory chip, and the flash memory chip is equipped with an independent cyclic storage partition and a fault protection partition; the display module adopts a TFT serial port touch screen, and the touch screen integrates a TFT driving unit and a serial port communication unit.

[0018] Secondly, a method for monitoring the operating status of automated terminal equipment is provided, including the following steps:

[0019] S1 System Initialization and Self-calibration: After the device is powered on, the MCU completes the initialization configuration of all functional modules of the device, performs self-calibration and hardware integrity verification on the signal acquisition link and analog-to-digital conversion link, loads the preset benchmark threshold parameter library, and the device enters the standby monitoring state.

[0020] S2 Multi-Source Signal Synchronous Acquisition and Preprocessing: The MCU triggers the current signal acquisition module, voltage signal acquisition module, and temperature acquisition module to synchronously acquire the electrical and non-electrical operation signals of the automated terminal equipment. The acquired analog signals are converted from analog to digital and electrically isolated by the A / D converter module before being transmitted to the MCU to complete data validity verification and filtering preprocessing.

[0021] S3 Fault Judgment Threshold Dynamic Correction: The MCU dynamically corrects the fault judgment benchmark threshold in the benchmark threshold parameter library based on the pre-processed equipment body temperature, ambient temperature, temperature rise rate and voltage harmonic characteristics to obtain the action threshold adapted to the real-time operating status of the equipment.

[0022] S4 Multi-dimensional Feature Fusion Fault Judgment: The MCU compares the pre-processed real-time operating parameters with the dynamically corrected action thresholds, combines multi-dimensional operating features to perform fusion fault judgment, calculates fault confidence, classifies fault levels and identifies fault types.

[0023] S5 Hierarchical Linkage Response and Data Storage: The MCU drives the display module, alarm module, and communication record module to perform hierarchical linkage response actions according to the classified fault level. At the same time, it drives the data storage module to perform hierarchical and partitioned storage of operating data and fault data according to the fault level.

[0024] S6 Cyclic Monitoring: After completing a single monitoring cycle, the MCU returns to step S2 and continues to perform cyclic monitoring on the automated terminal equipment.

[0025] As a further technical solution of the present invention, S1 specifically includes the following:

[0026] After the device is powered on, the MCU serves as the core execution unit. It first completes the basic initialization configuration of the entire device hardware: including configuring the system clock, interrupt vector table and input / output interface mapping rules of the main control microcontroller, and completing the parameter configuration and clock enable of the three types of peripheral communication interfaces: SPI, I2C and UART. Then, it performs register configuration and working state initialization for the A / D converter module, communication record module, data storage module, display module and alarm module in sequence, and configures the output voltage and protection threshold of the power supply module to ensure that all hardware modules of the device enter the ready state.

[0027] After initialization, the MCU performs end-to-end self-calibration and hardware integrity verification, specifically including: zero-point drift correction of the sensing units in the current signal acquisition module and voltage signal acquisition module to eliminate sensor static errors; gain and offset calibration of the core conversion chip of the A / D converter module to ensure the linearity and accuracy of analog-to-digital conversion; reading the unique hardware serial number of each temperature sensing chip in the temperature acquisition module to verify the hardware integrity of the temperature probe and the validity of the single-bus communication link; and performing functional self-tests on the alarm module, communication recording module, and data storage module to confirm that the hardware driver and communication link are normal.

[0028] After all self-calibration and self-tests pass, the MCU loads the reference threshold parameter library from the preset parameter area of ​​the data storage module. The parameter library contains current and voltage reference thresholds, standard reference temperature, temperature safety upper limit, harmonic distortion rate standard limit, threshold correction compensation coefficient, fault judgment weight reference value, fault level judgment threshold, and temperature rise rate critical value that match the rated parameters of the terminal device. After the parameters are loaded, the device enters the standby monitoring state.

[0029] As a further technical solution of the present invention, S2 specifically includes the following:

[0030] The MCU starts a timer interrupt with a fixed period of 1ms, triggering the core conversion chip of the A / D converter module to synchronously acquire the three-phase analog current output from the current signal acquisition module and the three-phase analog voltage output from the voltage signal acquisition module. At the same time, through the single bus interface, it reads the digital signals of the equipment body temperature and the equipment operating environment temperature acquired by the temperature acquisition module, realizing the synchronous acquisition of electrical and non-electrical quantities of the automated terminal equipment, and assigning a unified hardware timestamp to all acquired data to ensure the timing consistency of multi-source data.

[0031] The acquired analog signal is quantized by an A / D conversion chip, then electrically isolated between the analog and digital sides by a digital isolation chip before being transmitted to the MCU. The MCU first verifies the validity of the acquired data, discarding invalid data such as conversion overflow, sensor disconnection, and values ​​exceeding the range.

[0032] The effective raw data is processed by moving average filtering. By smoothing 10 consecutive sets of raw data, high-frequency noise from the power grid and electromagnetic interference on site are eliminated. After filtering, the MCU restores the physical quantities of the data and calculates the standardized real-time operating parameters of the terminal equipment, including the effective values ​​of current and voltage, instantaneous power, the proportion of 2nd to 19th current harmonics, the total harmonic distortion rate of voltage, and the three-phase current imbalance.

[0033] As a further technical solution of the present invention, S3 specifically includes the following:

[0034] The MCU completes temperature data smoothing every 10ms and samples the device body temperature before and after every 100ms based on a fixed time interval to calculate the temperature change rate per unit time.

[0035] The MCU invokes a temperature-load coupled dynamic threshold correction algorithm to adaptively correct the current overload protection action threshold and the voltage anomaly judgment action threshold in real time. The correction of the current action threshold is based on the equipment's rated reference threshold, combined with the deviation between the equipment's body temperature and the standard reference temperature, the temperature rise rate, and the deviation between the ambient temperature and the standard room temperature. It is adjusted by a compensation coefficient pre-calibrated according to the equipment's insulation aging characteristics to obtain a current protection threshold suitable for the current operating state of the equipment. The correction of the voltage action threshold is based on the equipment's rated reference threshold, combined with the deviation between the real-time voltage harmonic distortion rate and the standard limit. It is adjusted by a pre-calibrated compensation coefficient to obtain a voltage judgment threshold suitable for the current power grid conditions.

[0036] After the correction is completed, the MCU will update the dynamic action threshold to the computing cache, replacing the fixed baseline threshold for subsequent fault analysis.

[0037] As a further technical solution of the present invention, S4 specifically includes the following:

[0038] The MCU compares the pre-processed real-time operating parameters with the dynamically corrected action thresholds. At the same time, it obtains a fault index that characterizes the severity of the fault through weighted fusion calculation of multi-dimensional operating features. The features involved in the fusion calculation include the relative deviation between the measured current value and the rated value, the relative deviation between the equipment body temperature and the safety upper limit, the degree of total current harmonic distortion, and the three-phase current imbalance. Each feature corresponds to a pre-set adaptive weight.

[0039] During the fault index calculation process, the MCU synchronously performs adaptive weight adjustment and normalization processing; when the temperature rise rate exceeds the preset critical value, the weight ratio of temperature-related features is automatically increased; when the harmonic distortion rate exceeds the standard, the weight ratio of harmonic-related features is automatically increased; after the weight adjustment is completed, normalization processing is performed again to ensure that the total proportion of all weights remains a fixed value.

[0040] Based on the fault index calculation results, the MCU performs fault level classification, dividing the equipment operating status into three levels: normal operation, early warning, and emergency fault. At the same time, the MCU calls the preset fault rule library and combines multi-dimensional parameter features to identify fault types and estimated locations. Typical faults that can be identified include four categories: poor contact overheating, nonlinear load impact, wiring errors or uneven load, and short circuit faults.

[0041] As a further technical solution of the present invention, S5 specifically includes the following:

[0042] Based on the device status and fault level output by the fault assessment, the MCU simultaneously executes hierarchical linkage response and hierarchical partition data storage, with the two actions triggered in parallel.

[0043] For normal operation, the MCU pushes real-time operating parameters and dynamic thresholds to the display module to refresh the screen display; it sends operating status messages to the distribution transformer terminal and the distribution automation master station at a fixed 1-minute cycle through the communication recording module; at the same time, it writes key operating indicators with timestamps to the circular log area of ​​the data storage module at a low frequency sampling rate of 10Hz, and cyclically overwrites the full amount of operating data stored in the most recent 24 hours; the main control microcontroller is configured to enter the clock off state when no peripherals are used, and the device enters the low power monitoring mode, retaining only the timer interrupt and the acquisition link activation.

[0044] In response to the warning status, the MCU displays a yellow warning icon and warning details on the display module interface, including abnormal parameters, changing trends, and risk warnings; it also uploads warning messages to the distribution transformer terminal and the distribution automation master station through the communication recording module; at the same time, it triggers the data storage module to start warning trend recording, and writes the parameter change trend data 2 seconds before and after the warning to the dedicated warning sub-partition of the circular log area at a medium frequency sampling rate of 200Hz, retaining the most recent 100 warning event data.

[0045] In response to emergency fault conditions, the MCU drives the electromagnetic buzzer of the alarm module to emit a high-frequency audible and visual alarm; the display module shows the fault details in a red flashing mode, including the fault type, estimated location, abnormal parameters, and handling suggestions; the communication recording module sends the highest priority fault repair message to the distribution automation master station; at the same time, the data storage module is immediately triggered to switch to a high-frequency fault recording mode of no less than 3.2kHz, and writes the complete original sampled waveforms, temperature change curves, fault judgment results, and timestamp information for 500ms before and after the fault into a dedicated fault protection zone, and simultaneously triggers an independent hardware watchdog to ensure that the last piece of data is solidified before the system unexpectedly loses power;

[0046] The remote communication of the communication record module adopts a protocol encapsulation with a verification and retransmission mechanism throughout the process. The communication data packet is encapsulated in a fixed format, including frame header, address code, function code, data content, check code, and frame trailer. A standard 16-bit cyclic redundancy check mechanism is used to ensure the accuracy of data transmission. If the receiver does not return an acknowledgment signal within the 500ms timeout period, or if the verification fails, the device will automatically retransmit according to the exponential backoff strategy, with a maximum of 3 retransmissions.

[0047] As a further technical solution of the present invention, S6 specifically includes the following:

[0048] After a single full-process monitoring operation is completed, the MCU immediately returns to the signal acquisition stage to continuously monitor the operating status of the automated terminal equipment. At the same time, every 24 hours, based on historical operating data and statistical results of early warning and fault events, the device iteratively optimizes the compensation coefficient for threshold correction and the weight benchmark value for fault judgment. The optimized parameters are stored in the preset parameter area of ​​the data storage module.

[0049] Compared with existing technologies, the beneficial effects of this automated terminal equipment operation status monitoring device and method are:

[0050] This invention enables real-time, high-precision monitoring of the operating status of automated terminal equipment. Compared to conventional monitoring solutions, this invention utilizes a multi-source signal synchronous acquisition architecture to simultaneously acquire electrical and non-electrical operating data of the terminal equipment. Combined with a fault judgment mechanism based on multi-dimensional feature fusion and dynamic threshold correction technology coupled with temperature and load, it can accurately identify remote signaling information such as fault current, voltage, and switch position of the terminal equipment. It adapts to fault judgment requirements under different ambient temperatures and operating loads, effectively improving fault detection accuracy and early anomaly capture capabilities. When a fault occurs in the terminal equipment, a buzzer alarm can be activated immediately, and the fault details can be displayed on the touch screen in real time. The fault information is reliably transmitted to the main station of the automated equipment via an RS485 serial port with a verification and retransmission mechanism, ensuring that repair personnel can obtain key information such as fault type and estimated location as soon as possible. This greatly shortens the fault repair time and effectively improves the fault repair efficiency, perfectly meeting the core expected goals of on-site fault judgment, rapid fault notification, and rapid fault handling.

[0051] This invention enables comprehensive management and all-dimensional control of power quality in terminal equipment. It can monitor and issue tiered alarms in real time for key power quality data such as three-phase imbalance, reactive power, and harmonics. Combined with the fusion analysis of multi-dimensional operating parameters, it can accurately identify typical operating conditions such as nonlinear load impact, wiring abnormalities, and uneven load. At the same time, through a tiered partitioned data storage mechanism with a ring buffer and breakpoint continuation, it can completely retain the equipment's full-cycle operating data and fault recording information, effectively avoiding the loss of key data in power outage scenarios. This provides complete and reliable data support for post-fault tracing and maintenance strategy optimization. The device adopts a modular design, which is simple in structure, reliable in operation, fast in response, and convenient in operation and maintenance. It can be adapted to different types of automated terminal equipment without complicated on-site debugging, greatly reducing the workload of front-line maintenance personnel and effectively improving the safe operation level and overall operation and maintenance management capabilities of automated terminal equipment.

[0052] This invention integrates a high-precision analog-to-digital converter chip and a high-interference-resistance digital isolation chip, achieving reliable isolation and high-precision conversion between analog and digital signals. It enables stable data transmission even in environments with strong electromagnetic interference in power distribution networks. The communication interface features comprehensive lightning protection, transient overvoltage suppression, and impedance matching designs. The power module provides full-dimensional protection against overcurrent, overvoltage, and short circuits. Combined with a hardware watchdog and power-off data protection mechanism, it effectively avoids problems such as device crashes and data loss, exhibiting extremely high operational stability and data security. The device's deployment enables early detection, early warning, and early handling of terminal equipment failures, effectively mitigating the operational risks to the power distribution network caused by equipment failures. It effectively ensures the safety of personnel, the power grid, and equipment, demonstrating significant practical value and broad market application prospects. Attached Figure Description

[0053] Figure 1 This is a schematic diagram of the monitoring device design of the present invention;

[0054] Figure 2 Diagram of the MCU and its peripheral circuit interfaces;

[0055] Figure 3 This is a schematic diagram of a high-frequency rectified power supply.

[0056] Figure 4 Schematic diagram for current signal acquisition;

[0057] Figure 5 This is a circuit diagram for voltage sampling.

[0058] Figure 6 This is a schematic diagram of an RS485 communication chip.

[0059] Figure 7 This is a circuit diagram of an RS485 communication interface.

[0060] Figure 8 This is the circuit connection diagram for the A / D converter;

[0061] Figure 9 This is a circuit diagram for a digital isolator.

[0062] Figure 10 This is a schematic diagram of a data storage circuit.

[0063] Figure 11 This is the schematic diagram of the alarm circuit;

[0064] Figure 12 This is a schematic diagram of the internal structure of a touchscreen.

[0065] Figure 13 This is the interface schematic diagram for the DS18B20;

[0066] Figure 14 This is a schematic diagram of the method flow of the present invention. Detailed Implementation

[0067] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0068] Please see the appendix Figure 1 -Appendix Figure 13The present invention provides an embodiment of an automated terminal equipment operation status monitoring device, which includes an MCU, and further includes a current signal acquisition module, a voltage signal acquisition module, a temperature acquisition module, an A / D converter module, a power supply module, an alarm module, a communication record module, a data storage module, and a display module;

[0069] The power output terminal of the power module is electrically connected to the power pin of the MCU; the power module adopts a high-frequency rectification and voltage regulation power supply circuit, which is equipped with a rectification unit, a PWM modulation unit, a voltage regulation unit and a protection unit, and can output multiple isolated DC working power supplies; the MCU adopts an STM32F103 microcontroller, which is equipped with peripheral interfaces with independent clock switches, including SPI communication interface, I2C communication interface and UART serial communication interface;

[0070] The analog signal output terminals of the current signal acquisition module, voltage signal acquisition module, and temperature acquisition module are all electrically connected to the input terminal of the A / D converter module. The output terminal of the A / D converter module is electrically connected to the first signal input terminal of the MCU. The A / D converter module integrates an AD7327 analog-to-digital converter chip and an ADUM1411 digital isolation chip. The AD7327 analog-to-digital converter chip is configured with multiple independent analog signal input channels, and the ADUM1411 digital isolation chip is connected in series between the AD7327 analog-to-digital converter chip and the MCU.

[0071] The status output terminals of the current signal acquisition module, voltage signal acquisition module, and temperature acquisition module are electrically connected to the second, third, and fourth signal input terminals of the MCU, respectively, and the status output terminal of the power supply module is electrically connected to the fifth signal input terminal of the MCU. The current signal acquisition module uses a Hall current sensor; the voltage signal acquisition module uses a voltage sampling circuit composed of a precision resistor voltage divider network and an RC low-pass filter circuit; the temperature acquisition module uses at least two DS18B20 single-bus temperature sensing chips, with the two temperature sensing chips corresponding to the acquisition of the body temperature of the automated terminal equipment and the acquisition of the operating environment temperature, respectively.

[0072] The MCU's first control output is electrically connected to the controlled terminal of the data storage module, the second control output is electrically connected to the driving terminal of the alarm module, the third control output is electrically connected to the control terminal of the communication recording module, and the fourth control output is electrically connected to the signal input terminal of the display module. The alarm module uses an electromagnetic buzzer with a transistor driving circuit and a freewheeling protection circuit. The communication recording module uses an RS485 communication circuit based on the MAX3485 chip, and the communication circuit is equipped with a surge protection unit and an impedance matching unit. The data storage module uses a W25Q256FVFI flash memory chip, which is equipped with an independent circular storage partition and a fault protection partition. The display module uses a TFT serial touch screen, which integrates a TFT driving unit and a serial communication unit.

[0073] Please see the appendix Figure 14 The present invention provides an embodiment of a method for monitoring the operating status of an automated terminal device, comprising the following steps:

[0074] S1 System Initialization and Self-calibration: After the device is powered on, the MCU completes the initialization configuration of all functional modules of the device, performs self-calibration and hardware integrity verification on the signal acquisition link and analog-to-digital conversion link, loads the preset benchmark threshold parameter library, and the device enters the standby monitoring state.

[0075] S2 Multi-Source Signal Synchronous Acquisition and Preprocessing: The MCU triggers the current signal acquisition module, voltage signal acquisition module, and temperature acquisition module to synchronously acquire the electrical and non-electrical operation signals of the automated terminal equipment. The acquired analog signals are converted from analog to digital and electrically isolated by the A / D converter module before being transmitted to the MCU to complete data validity verification and filtering preprocessing.

[0076] S3 Fault Judgment Threshold Dynamic Correction: The MCU dynamically corrects the fault judgment benchmark threshold in the benchmark threshold parameter library based on the pre-processed equipment body temperature, ambient temperature, temperature rise rate and voltage harmonic characteristics to obtain the action threshold adapted to the real-time operating status of the equipment.

[0077] S4 Multi-dimensional Feature Fusion Fault Judgment: The MCU compares the pre-processed real-time operating parameters with the dynamically corrected action thresholds, combines multi-dimensional operating features to perform fusion fault judgment, calculates fault confidence, classifies fault levels and identifies fault types.

[0078] S5 Hierarchical Linkage Response and Data Storage: The MCU drives the display module, alarm module, and communication record module to perform hierarchical linkage response actions according to the classified fault level. At the same time, it drives the data storage module to perform hierarchical and partitioned storage of operating data and fault data according to the fault level.

[0079] S6 Cyclic Monitoring: After completing a single monitoring cycle, the MCU returns to step S2 and continues to perform cyclic monitoring on the automated terminal equipment.

[0080] Furthermore, in another embodiment of the method for monitoring the operating status of automated terminal equipment, S1 specifically includes the following:

[0081] After the device is powered on, the MCU serves as the core execution unit. It first completes the basic initialization configuration of the entire device hardware: including configuring the system clock, interrupt vector table and input / output interface mapping rules of the main control microcontroller, and completing the parameter configuration and clock enable of the three types of peripheral communication interfaces: SPI, I2C and UART. Then, it performs register configuration and working state initialization for the A / D converter module, communication record module, data storage module, display module and alarm module in sequence, and configures the output voltage and protection threshold of the power supply module to ensure that all hardware modules of the device enter the ready state.

[0082] After initialization, the MCU performs end-to-end self-calibration and hardware integrity verification, specifically including: zero-point drift correction of the sensing units in the current signal acquisition module and voltage signal acquisition module to eliminate sensor static errors; gain and offset calibration of the core conversion chip of the A / D converter module to ensure the linearity and accuracy of analog-to-digital conversion; reading the unique hardware serial number of each temperature sensing chip in the temperature acquisition module to verify the hardware integrity of the temperature probe and the validity of the single-bus communication link; and performing functional self-tests on the alarm module, communication recording module, and data storage module to confirm that the hardware driver and communication link are normal.

[0083] After all self-calibration and self-tests pass, the MCU loads the reference threshold parameter library from the preset parameter area of ​​the data storage module. The parameter library contains current and voltage reference thresholds, standard reference temperature, temperature safety upper limit, harmonic distortion rate standard limit, threshold correction compensation coefficient, fault judgment weight reference value, fault level judgment threshold, and temperature rise rate critical value that match the rated parameters of the terminal device. After the parameters are loaded, the device enters the standby monitoring state.

[0084] Furthermore, in another embodiment of the method for monitoring the operating status of automated terminal equipment, S2 specifically includes the following:

[0085] The MCU starts a timer interrupt with a fixed period of 1ms, triggering the core conversion chip of the A / D converter module to synchronously acquire the three-phase analog current output from the current signal acquisition module and the three-phase analog voltage output from the voltage signal acquisition module. At the same time, through the single bus interface, it reads the digital signals of the equipment body temperature and the equipment operating environment temperature acquired by the temperature acquisition module, realizing the synchronous acquisition of electrical and non-electrical quantities of the automated terminal equipment, and assigning a unified hardware timestamp to all acquired data to ensure the timing consistency of multi-source data.

[0086] The acquired analog signal is quantized by an A / D conversion chip, then electrically isolated between the analog and digital sides by a digital isolation chip before being transmitted to the MCU. The MCU first verifies the validity of the acquired data, discarding invalid data such as conversion overflow, sensor disconnection, and values ​​exceeding the range.

[0087] The effective raw data is processed by moving average filtering. By smoothing 10 consecutive sets of raw data, high-frequency noise from the power grid and electromagnetic interference on site are eliminated. After filtering, the MCU restores the physical quantities of the data and calculates the standardized real-time operating parameters of the terminal equipment, including the effective values ​​of current and voltage, instantaneous power, the proportion of 2nd to 19th current harmonics, the total harmonic distortion rate of voltage, and the three-phase current imbalance.

[0088] Furthermore, in another embodiment of the method for monitoring the operating status of automated terminal equipment, S3 specifically includes the following:

[0089] The MCU completes temperature data smoothing every 10ms and samples the device body temperature before and after every 100ms based on a fixed time interval to calculate the temperature change rate per unit time.

[0090] The MCU invokes a temperature-load coupled dynamic threshold correction algorithm to adaptively correct the current overload protection action threshold and the voltage anomaly judgment action threshold in real time. The correction of the current action threshold is based on the equipment's rated reference threshold, combined with the deviation between the equipment's body temperature and the standard reference temperature, the temperature rise rate, and the deviation between the ambient temperature and the standard room temperature. It is adjusted by a compensation coefficient pre-calibrated according to the equipment's insulation aging characteristics to obtain a current protection threshold suitable for the current operating state of the equipment. The correction of the voltage action threshold is based on the equipment's rated reference threshold, combined with the deviation between the real-time voltage harmonic distortion rate and the standard limit. It is adjusted by a pre-calibrated compensation coefficient to obtain a voltage judgment threshold suitable for the current power grid conditions.

[0091] After the correction is completed, the MCU will update the dynamic action threshold to the computing cache, replacing the fixed baseline threshold for subsequent fault analysis.

[0092] Furthermore, in another embodiment of the method for monitoring the operating status of automated terminal equipment, S4 specifically includes the following:

[0093] The MCU compares the pre-processed real-time operating parameters with the dynamically corrected action thresholds. At the same time, it obtains a fault index that characterizes the severity of the fault through weighted fusion calculation of multi-dimensional operating features. The features involved in the fusion calculation include the relative deviation between the measured current value and the rated value, the relative deviation between the equipment body temperature and the safety upper limit, the degree of total current harmonic distortion, and the three-phase current imbalance. Each feature corresponds to a pre-set adaptive weight.

[0094] During the fault index calculation process, the MCU synchronously performs adaptive weight adjustment and normalization processing; when the temperature rise rate exceeds the preset critical value, the weight ratio of temperature-related features is automatically increased; when the harmonic distortion rate exceeds the standard, the weight ratio of harmonic-related features is automatically increased; after the weight adjustment is completed, normalization processing is performed again to ensure that the total proportion of all weights remains a fixed value.

[0095] Based on the fault index calculation results, the MCU performs fault level classification, dividing the equipment operating status into three levels: normal operation, early warning, and emergency fault. At the same time, the MCU calls the preset fault rule library and combines multi-dimensional parameter features to identify fault types and estimated locations. Typical faults that can be identified include four categories: poor contact overheating, nonlinear load impact, wiring errors or uneven load, and short circuit faults.

[0096] Furthermore, in another embodiment of the method for monitoring the operating status of automated terminal equipment, S5 specifically includes the following:

[0097] Based on the device status and fault level output by the fault assessment, the MCU simultaneously executes hierarchical linkage response and hierarchical partition data storage, with the two actions triggered in parallel.

[0098] For normal operation, the MCU pushes real-time operating parameters and dynamic thresholds to the display module to refresh the screen display; it sends operating status messages to the distribution transformer terminal and the distribution automation master station at a fixed 1-minute cycle through the communication recording module; at the same time, it writes key operating indicators with timestamps to the circular log area of ​​the data storage module at a low frequency sampling rate of 10Hz, and cyclically overwrites the full amount of operating data stored in the most recent 24 hours; the main control microcontroller is configured to enter the clock off state when no peripherals are used, and the device enters the low power monitoring mode, retaining only the timer interrupt and the acquisition link activation.

[0099] In response to the warning status, the MCU displays a yellow warning icon and warning details on the display module interface, including abnormal parameters, changing trends, and risk warnings; it also uploads warning messages to the distribution transformer terminal and the distribution automation master station through the communication recording module; at the same time, it triggers the data storage module to start warning trend recording, and writes the parameter change trend data 2 seconds before and after the warning to the dedicated warning sub-partition of the circular log area at a medium frequency sampling rate of 200Hz, retaining the most recent 100 warning event data.

[0100] In response to emergency fault conditions, the MCU drives the electromagnetic buzzer of the alarm module to emit a high-frequency audible and visual alarm; the display module shows the fault details in a red flashing mode, including the fault type, estimated location, abnormal parameters, and handling suggestions; the communication recording module sends the highest priority fault repair message to the distribution automation master station; at the same time, the data storage module is immediately triggered to switch to a high-frequency fault recording mode of no less than 3.2kHz, and writes the complete original sampled waveforms, temperature change curves, fault judgment results, and timestamp information for 500ms before and after the fault into a dedicated fault protection zone, and simultaneously triggers an independent hardware watchdog to ensure that the last piece of data is solidified before the system unexpectedly loses power;

[0101] The remote communication of the communication record module adopts a protocol encapsulation with a verification and retransmission mechanism throughout the process. The communication data packet is encapsulated in a fixed format, including frame header, address code, function code, data content, check code, and frame trailer. A standard 16-bit cyclic redundancy check mechanism is used to ensure the accuracy of data transmission. If the receiver does not return an acknowledgment signal within the 500ms timeout period, or if the verification fails, the device will automatically retransmit according to the exponential backoff strategy, with a maximum of 3 retransmissions.

[0102] Furthermore, in another embodiment of the method for monitoring the operating status of automated terminal equipment, S6 specifically includes the following:

[0103] After a single full-process monitoring operation is completed, the MCU immediately returns to the signal acquisition stage to continuously monitor the operating status of the automated terminal equipment. At the same time, every 24 hours, based on historical operating data and statistical results of early warning and fault events, the device iteratively optimizes the compensation coefficient for threshold correction and the weight benchmark value for fault judgment. The optimized parameters are stored in the preset parameter area of ​​the data storage module.

[0104] Application example:

[0105] S1 System Initialization and Self-Calibration:

[0106] After the device is powered on, the MCU acts as the core execution entity, first completing the basic initialization configuration of the entire device hardware: configuring the system clock tree, interrupt vector table and GPIO port mapping rules of the STM32F103 microcontroller, completing the parameter configuration and clock enable of the three types of peripheral interfaces: SPI, I2C and UART; then configuring the registers and initializing the working state of the A / D converter module, communication record module, data storage module, display module and alarm module in sequence, and configuring the output voltage and protection threshold of the power supply module to ensure that all hardware modules of the device enter the ready state;

[0107] After initialization, the MCU performs end-to-end self-calibration and hardware integrity verification: First, it performs zero-point drift correction on the sensing units of the current signal acquisition module and voltage signal acquisition module to eliminate static errors of the sensors; second, it performs gain and offset calibration on the AD7327 chip of the A / D converter module to ensure the linearity and accuracy of analog-to-digital conversion; third, it reads the unique 64-bit serial number of each DS18B20 chip in the temperature acquisition module to verify the hardware integrity of the temperature probe and the validity of the single-bus communication link; fourth, it performs functional self-tests on the alarm module, communication recording module, and data storage module to confirm that the hardware driver and communication link are normal.

[0108] After all self-calibration and self-tests pass, the MCU loads the reference threshold parameter library from the preset parameter area of ​​the data storage module. The parameter library contains the current / voltage reference threshold, standard reference temperature, temperature safety upper limit, harmonic distortion rate standard limit, compensation coefficient, adaptive weight reference value, fault level judgment threshold, and temperature rise rate critical value corresponding to the rated parameters of the terminal device. After the parameters are loaded, the device enters the standby monitoring state.

[0109] S2 Multi-Source Signal Synchronous Acquisition and Preprocessing:

[0110] The MCU's 1ms timer interrupt triggers the AD7327 chip in the A / D converter module to synchronously acquire the three-phase analog current output from the current signal acquisition module and the three-phase analog voltage output from the voltage signal acquisition module. Simultaneously, through the single-bus interface, it reads the digital signals of the equipment body temperature and the equipment operating environment temperature acquired by the temperature acquisition module, realizing the synchronous acquisition of electrical and non-electrical quantities of the automated terminal equipment, and assigning a unified hardware timestamp to all acquired data to ensure the timing consistency of multi-source data.

[0111] The acquired analog signals are quantized to 12 bits by the AD7327 chip, and then electrically isolated from the digital side by the ADUM1411 digital isolation chip before being transmitted to the MCU. The MCU first verifies the validity of the acquired data, discarding invalid data such as AD overflow, sensor disconnection, and values ​​exceeding the range. Then, it performs moving average filtering on the valid raw data to filter out high-frequency noise from the power grid and electromagnetic interference from the field. The filtering calculation formula is as follows:

[0112]

[0113] in, For the current moment Filtered data, For the first The raw data collected at any given moment This is the length of the filtering window, with a baseline value of 10;

[0114] After filtering, the MCU restores the physical quantities of the data and calculates the standardized real-time operating parameters of the terminal device, including the effective value of current or voltage, instantaneous power, the 2nd to 19th current harmonic content rate, the total voltage harmonic distortion rate, and the three-phase current imbalance obtained by 1024-point FFT fast Fourier transform, providing a unified data basis for subsequent threshold correction and fault judgment.

[0115] S3 fault determination threshold dynamic correction:

[0116] The MCU performs temperature data smoothing every 10 timer interrupt cycles and calculates the temperature rise rate of the device body every 100ms using the differential method. The calculation formula is as follows:

[0117]

[0118] in, For the current moment The temperature of the device itself, The temperature of the device body at the previous moment. The step size is set to 100ms.

[0119] The MCU invokes a temperature-load coupled dynamic threshold correction algorithm. Based on the pre-processed device body temperature, ambient temperature, temperature rise rate, and total harmonic distortion of voltage, it dynamically corrects the current overload protection action threshold and the voltage anomaly detection action threshold in real time. The correction formula is as follows:

[0120]

[0121]

[0122] in, The dynamic current action threshold at the current moment. The current dynamic voltage action threshold; , The reference threshold is the rated reference threshold from the reference threshold parameter library; The standard reference temperature is 25℃. For real-time monitoring of the equipment's operating environment temperature; The standard limit for harmonic distortion rate; , , , The compensation coefficient is calibrated based on the insulation aging characteristics of the terminal equipment, and its value range is as follows: , , , ;

[0123] After the correction is completed, the MCU will update the dynamic action threshold to the computing cache, replacing the fixed benchmark threshold for subsequent fault analysis, so as to achieve adaptive adaptation between the fault judgment standard and the real-time operating status and environmental conditions of the equipment.

[0124] S4 Multi-Dimensional Feature Fusion Fault Assessment:

[0125] The MCU compares the preprocessed real-time operating parameters with the dynamically corrected action thresholds, and simultaneously incorporates multi-dimensional operating features into the fault confidence fusion criterion function to calculate the fault index. The severity of the fault is quantified using the following criterion function formula:

[0126]

[0127] in, This is the measured effective value of the current. The rated current of the terminal equipment; The upper limit of temperature safety is defined in the baseline threshold parameter library; The content of the h-th current harmonic; This refers to the three-phase current imbalance. , , , The adaptive weighting coefficients satisfy the constraints. ;

[0128] During the fault index calculation process, the MCU synchronously performs adaptive weight adjustment and normalization: when the temperature rise rate is detected to exceed the preset critical value, the temperature-related weight is automatically increased. The value of [value] is determined; when the harmonic distortion rate exceeds the standard, the harmonic correlation weight is automatically increased. The value of ; after the weight adjustment is completed, normalization is performed to ensure that the adjusted weight sum is always 1, thus ensuring the effectiveness of the criterion function;

[0129] Based on the fault index calculation results, the MCU performs fault level classification: If If it is determined to be in normal operating condition; If it is determined to be a warning state; The system is identified as an emergency fault state. At the same time, the MCU calls the preset fault rule library and combines multi-dimensional parameter features to identify the fault type and estimated location, including four typical terminal faults: poor contact and overheating, nonlinear load impact, wiring error or uneven load, and short circuit fault.

[0130] S5 hierarchical linkage response and data storage:

[0131] Based on the device status and fault level output by the fault assessment, the MCU simultaneously executes hierarchical linkage response and hierarchical partitioned data storage. The two actions are triggered in parallel without any sequential timing gaps.

[0132] 1. Normal operation status: The MCU pushes real-time operating parameters and dynamic thresholds to the display module to refresh the screen display; it sends operating status messages to the distribution transformer terminal and the distribution automation master station at a preset cycle through the communication recording module; at the same time, it writes key operating indicators with timestamps to the circular log area of ​​the data storage module at a low frequency sampling rate of 10Hz, and cyclically overwrites the full amount of operating data stored in the most recent 24 hours; the STM32 microcontroller is configured to enter the clock off state when no peripherals are used, and the device enters the low power monitoring mode, retaining only the timer interrupt and the acquisition link activation.

[0133] 2. Warning Status: The MCU displays a yellow warning icon and warning details on the display module interface, including abnormal parameters, changing trends, and risk warnings; it uploads warning messages to the distribution transformer terminal and the distribution automation master station through the communication recording module; at the same time, it triggers the data storage module to start warning trend recording, and writes the parameter change trend data 2 seconds before and after the warning to the dedicated warning sub-partition of the circular log area at a sampling rate of 200Hz, retaining the most recent 100 warning event data.

[0134] 3. Emergency Fault Status: The electromagnetic buzzer of the MCU-driven alarm module emits a high-frequency audible and visual alarm; the display module shows the fault details in a red flashing mode, including the fault type, estimated location, abnormal parameters, and handling suggestions; the highest priority fault repair message is sent to the power distribution automation master station through the communication recording module; at the same time, the data storage module is immediately triggered to switch to a high-frequency fault recording mode of no less than 3.2kHz, and the complete original sampled waveforms, temperature change curves, fault judgment results, and timestamp information of 500ms before and after the fault are written into a dedicated fault protection zone. An independent hardware watchdog is triggered simultaneously to ensure that the last segment of data is solidified before the system unexpectedly loses power. The data in the fault protection zone cannot be overwritten, realizing permanent traceability storage of fault data.

[0135] The RS485 communication of the communication record module uses a protocol encapsulation with a check and retransmission mechanism throughout the process. The data packet format is: [Frame Header][Address Code][Function Code][Data Length][Payload][CRC16 Checksum][Frame Tail]. If the master station does not return an ACK confirmation frame within the set timeout period of 500ms, or if the CRC check fails, the device automatically executes an exponential backoff retransmission strategy, with a maximum of 3 retransmissions. The CRC16 checksum uses the MODBUS standard 16-bit checksum algorithm, and the iterative calculation formula is as follows:

[0136]

[0137] in, For the first The checksum after byte iteration, initial value ; For the first in the data packet One data byte; A predefined checksum table for the MODBUSCRC16 standard; This is an 8-bit right shift operation; This is a bitwise XOR operation; This is a bitwise AND operation;

[0138] S6 Cyclic Monitoring:

[0139] After completing a single full-process monitoring operation, the MCU immediately returns to step S2 and continues to perform uninterrupted cyclic monitoring of the operating status of the automated terminal equipment. At the same time, the MCU performs parameter self-optimization every 24 hours: based on the historical 24-hour operating data and the statistical results of false alarms / missed alarms of early warning / fault events, it iteratively optimizes the compensation coefficient and adaptive weight benchmark value through the least squares method. The optimized parameters are written into the preset parameter area of ​​the data storage module to continuously improve the monitoring accuracy and fault judgment reliability of the device.

[0140] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. An automated terminal equipment operation status monitoring device, comprising an MCU, characterized in that: It also includes a current signal acquisition module, a voltage signal acquisition module, a temperature acquisition module, an A / D converter module, a power supply module, an alarm module, a communication recording module, a data storage module, and a display module; The power output terminal of the power module is electrically connected to the power pin of the MCU. The analog signal output terminals of the current signal acquisition module, voltage signal acquisition module, and temperature acquisition module are all electrically connected to the input terminal of the A / D converter module. The output terminal of the A / D converter module is electrically connected to the first signal input terminal of the MCU. The status output terminals of the current signal acquisition module, voltage signal acquisition module, and temperature acquisition module are electrically connected to the second, third, and fourth signal input terminals of the MCU, respectively. The status output terminal of the power supply module is electrically connected to the fifth signal input terminal of the MCU. The first control output terminal of the MCU is electrically connected to the controlled terminal of the data storage module, the second control output terminal is electrically connected to the driving terminal of the alarm module, the third control output terminal is electrically connected to the control terminal of the communication recording module, and the fourth control output terminal is electrically connected to the signal input terminal of the display module.

2. The automated terminal equipment operation status monitoring device according to claim 1, characterized in that: The MCU is an STM32F103 microcontroller, which is equipped with peripheral interfaces with independent clock switches. These peripheral interfaces include SPI communication interface, I2C communication interface and UART serial communication interface.

3. The automated terminal equipment operation status monitoring device according to claim 1, characterized in that: The current signal acquisition module uses a Hall current sensor; the voltage signal acquisition module uses a voltage sampling circuit composed of a precision resistor voltage divider network and an RC low-pass filter circuit; the temperature acquisition module uses at least two DS18B20 single-bus temperature sensing chips, with the two temperature sensing chips respectively corresponding to the acquisition of the body temperature of the automated terminal equipment and the acquisition of the operating environment temperature.

4. The automated terminal equipment operation status monitoring device according to claim 1, characterized in that: The A / D converter module integrates the AD7327 analog-to-digital converter chip and the ADUM1411 digital isolation chip; the AD7327 analog-to-digital converter chip is configured with multiple independent analog signal input channels, and the ADUM1411 digital isolation chip is connected in series between the AD7327 analog-to-digital converter chip and the MCU.

5. The automated terminal equipment operation status monitoring device according to claim 1, characterized in that: The power module adopts a high-frequency rectification and voltage regulation power supply circuit. The power supply circuit is equipped with a rectification unit, a PWM modulation unit, a voltage regulation unit and a protection unit, and can output multiple isolated DC working power supplies.

6. The automated terminal equipment operation status monitoring device according to claim 1, characterized in that: The alarm module uses an electromagnetic buzzer with a transistor drive circuit and a freewheeling protection circuit; the communication recording module uses an RS485 communication circuit based on the MAX3485 chip, and the communication circuit is equipped with a lightning protection unit and an impedance matching unit; the data storage module uses a W25Q256FVFI flash memory chip, and the flash memory chip is equipped with an independent cyclic storage partition and a fault protection partition; the display module uses a TFT serial port touch screen, and the touch screen integrates a TFT drive unit and a serial communication unit.

7. The method for monitoring the operating status of automated terminal equipment according to claim 1, characterized in that: Includes the following steps: S1 System Initialization and Self-calibration: After the device is powered on, the MCU completes the initialization configuration of all functional modules of the device, performs self-calibration and hardware integrity verification on the signal acquisition link and analog-to-digital conversion link, loads the preset benchmark threshold parameter library, and the device enters the standby monitoring state. S2 Multi-Source Signal Synchronous Acquisition and Preprocessing: The MCU triggers the current signal acquisition module, voltage signal acquisition module, and temperature acquisition module to synchronously acquire the electrical and non-electrical operation signals of the automated terminal equipment. The acquired analog signals are converted from analog to digital and electrically isolated by the A / D converter module before being transmitted to the MCU to complete data validity verification and filtering preprocessing. S3 Fault Judgment Threshold Dynamic Correction: The MCU dynamically corrects the fault judgment benchmark threshold in the benchmark threshold parameter library based on the pre-processed equipment body temperature, ambient temperature, temperature rise rate and voltage harmonic characteristics to obtain the action threshold adapted to the real-time operating status of the equipment. S4 Multi-dimensional Feature Fusion Fault Judgment: The MCU compares the pre-processed real-time operating parameters with the dynamically corrected action thresholds, combines multi-dimensional operating features to perform fusion fault judgment, calculates fault confidence, classifies fault levels and identifies fault types. S5 Hierarchical Linkage Response and Data Storage: The MCU drives the display module, alarm module, and communication record module to perform hierarchical linkage response actions according to the classified fault level. At the same time, it drives the data storage module to perform hierarchical and partitioned storage of operating data and fault data according to the fault level. S6 Cyclic Monitoring: After completing a single monitoring cycle, the MCU returns to step S2 and continues to perform cyclic monitoring on the automated terminal equipment.

8. The method for monitoring the operating status of an automated terminal device according to claim 7, characterized in that: S1 specifically includes the following: After the device is powered on, the MCU serves as the core execution unit. It first completes the basic initialization configuration of the entire device hardware: including configuring the system clock, interrupt vector table and input / output interface mapping rules of the main control microcontroller, and completing the parameter configuration and clock enable of the three types of peripheral communication interfaces: SPI, I2C and UART. Then, it performs register configuration and working state initialization for the A / D converter module, communication record module, data storage module, display module and alarm module in sequence, and configures the output voltage and protection threshold of the power supply module to ensure that all hardware modules of the device enter the ready state. After initialization, the MCU performs end-to-end self-calibration and hardware integrity verification, specifically including: zero-point drift correction of the sensing units in the current signal acquisition module and voltage signal acquisition module to eliminate sensor static errors; gain and offset calibration of the core conversion chip of the A / D converter module to ensure the linearity and accuracy of analog-to-digital conversion; reading the unique hardware serial number of each temperature sensing chip in the temperature acquisition module to verify the hardware integrity of the temperature probe and the validity of the single-bus communication link; and performing functional self-tests on the alarm module, communication recording module, and data storage module to confirm that the hardware driver and communication link are normal. After all self-calibration and self-tests pass, the MCU loads the reference threshold parameter library from the preset parameter area of ​​the data storage module. The parameter library contains current and voltage reference thresholds, standard reference temperature, temperature safety upper limit, harmonic distortion rate standard limit, threshold correction compensation coefficient, fault judgment weight reference value, fault level judgment threshold, and temperature rise rate critical value that match the rated parameters of the terminal device. After the parameters are loaded, the device enters the standby monitoring state.

9. The method for monitoring the operating status of an automated terminal device according to claim 7, characterized in that: S2 specifically includes the following: The MCU starts a timer interrupt with a fixed period of 1ms, triggering the core conversion chip of the A / D converter module to synchronously acquire the three-phase analog current output from the current signal acquisition module and the three-phase analog voltage output from the voltage signal acquisition module. At the same time, through the single bus interface, it reads the digital signals of the equipment body temperature and the equipment operating environment temperature acquired by the temperature acquisition module, realizing the synchronous acquisition of electrical and non-electrical quantities of the automated terminal equipment, and assigning a unified hardware timestamp to all acquired data to ensure the timing consistency of multi-source data. The acquired analog signal is quantized by an A / D conversion chip, then electrically isolated between the analog and digital sides by a digital isolation chip before being transmitted to the MCU. The MCU first verifies the validity of the acquired data, discarding invalid data such as conversion overflow, sensor disconnection, and values ​​exceeding the range. The effective raw data is processed by moving average filtering. By smoothing 10 consecutive sets of raw data, high-frequency noise from the power grid and electromagnetic interference on site are eliminated. After filtering, the MCU restores the physical quantities of the data and calculates the standardized real-time operating parameters of the terminal device, including the effective values ​​of current and voltage, instantaneous power, the proportion of current harmonics from 2nd to 19th, the total harmonic distortion rate of voltage, and the three-phase current imbalance.

10. The method for monitoring the operating status of an automated terminal device according to claim 7, characterized in that: S3 specifically includes the following: The MCU completes temperature data smoothing every 10ms and samples the device body temperature before and after every 100ms based on a fixed time interval to calculate the temperature change rate per unit time. The MCU calls the temperature-load coupling dynamic threshold correction algorithm to adaptively correct the current overload protection action threshold and the voltage anomaly detection action threshold in real time. The correction of the current action threshold is based on the equipment's rated reference threshold, combined with the deviation between the equipment's body temperature and the standard reference temperature, the rate of temperature rise, and the deviation between the ambient temperature and the standard room temperature. It is adjusted by a compensation coefficient pre-calibrated according to the equipment's insulation aging characteristics to obtain a current protection threshold suitable for the current operating state of the equipment. The correction of the voltage action threshold is based on the equipment's rated reference threshold, combined with the deviation between the real-time voltage harmonic distortion rate and the standard limit. It is adjusted by a pre-calibrated compensation coefficient to obtain a voltage judgment threshold suitable for the current power grid operating conditions. After the correction is completed, the MCU will update the dynamic action threshold to the computing cache, replacing the fixed baseline threshold for subsequent fault analysis.

11. The method for monitoring the operating status of an automated terminal device according to claim 7, characterized in that: S4 specifically includes the following: The MCU compares the preprocessed real-time operating parameters with the dynamically corrected action thresholds, and obtains a fault index that characterizes the severity of the fault through weighted fusion calculation of multi-dimensional operating features. The features involved in the fusion calculation include the relative deviation between the measured current value and the rated value, the relative deviation between the equipment body temperature and the safety upper limit, the degree of total current harmonic distortion, and the three-phase current imbalance. Each feature corresponds to a pre-set adaptive weight. During the fault index calculation process, the MCU synchronously performs adaptive weight adjustment and normalization processing; when the temperature rise rate exceeds the preset critical value, the weight ratio of temperature-related features is automatically increased; when the harmonic distortion rate exceeds the standard, the weight ratio of harmonic-related features is automatically increased; after the weight adjustment is completed, normalization processing is performed again to ensure that the total proportion of all weights remains a fixed value. Based on the fault index calculation results, the MCU performs fault level classification, dividing the equipment operating status into three levels: normal operation, early warning, and emergency fault. At the same time, the MCU calls the preset fault rule library and combines multi-dimensional parameter features to identify fault types and estimated locations. Typical faults that can be identified include four categories: poor contact overheating, nonlinear load impact, wiring errors or uneven load, and short circuit faults.

12. The method for monitoring the operating status of an automated terminal device according to claim 7, characterized in that: S5 specifically includes the following: Based on the device status and fault level output by the fault assessment, the MCU simultaneously executes hierarchical linkage response and hierarchical partition data storage, with the two actions triggered in parallel. During normal operation, the MCU pushes real-time operating parameters and dynamic thresholds to the display module to refresh the screen display; The communication recording module sends operation status messages to the distribution transformer terminal and the distribution automation master station at a fixed interval of 1 minute; at the same time, key operation indicators with timestamps are cyclically written to the circular log area of ​​the data storage module at a low frequency sampling rate of 10Hz, and the storage of the full amount of operation data of the most recent 24 hours is cyclically overwritten; the main control microcontroller is configured to enter the clock off state when no peripherals are used, and the device enters the low power monitoring mode, retaining only the timer interrupt and the acquisition link activation. In response to the warning status, the MCU displays a yellow warning icon and warning details on the display module interface, including abnormal parameters, changing trends, and risk warnings; The warning message is uploaded to the distribution transformer terminal and the distribution automation master station through the communication record module; At the same time, the data storage module is triggered to start the early warning trend recording. The parameter change trend data 2 seconds before and after the early warning is written to the dedicated early warning sub-partition of the circular log area at a medium frequency sampling rate of 200Hz, and the most recent 100 early warning event data are retained. In case of emergency failure, the MCU drives the electromagnetic buzzer of the alarm module to emit a high-frequency audible and visual alarm. The display module shows the fault details in a flashing red mode, including the fault type, estimated location, abnormal parameters, and handling suggestions; The highest priority fault repair message is sent to the distribution automation master station through the communication recording module; at the same time, the data storage module is immediately triggered to switch to a high-frequency fault recording mode of no less than 3.2kHz, and the complete original sampling waveforms, temperature change curves, fault judgment results, and timestamp information of 500ms before and after the fault are written into a dedicated fault protection zone. The independent hardware watchdog is triggered simultaneously to ensure that the last piece of data is solidified before the system loses power unexpectedly. The remote communication of the communication record module adopts a protocol encapsulation with a verification and retransmission mechanism throughout the process. The communication data packet is encapsulated in a fixed format, including frame header, address code, function code, data content, check code, and frame trailer. A standard 16-bit cyclic redundancy check mechanism is used to ensure the accuracy of data transmission. If the receiver does not return an acknowledgment signal within the 500ms timeout period, or if the verification fails, the device will automatically retransmit according to the exponential backoff strategy, with a maximum of 3 retransmissions.

13. The method for monitoring the operating status of an automated terminal device according to claim 7, characterized in that: S6 specifically includes the following: After a single full-process monitoring operation is completed, the MCU immediately returns to the signal acquisition stage to continuously monitor the operating status of the automated terminal equipment. At the same time, every 24 hours, based on historical operating data and statistical results of early warning and fault events, the device iteratively optimizes the compensation coefficient for threshold correction and the weight benchmark value for fault judgment. The optimized parameters are stored in the preset parameter area of ​​the data storage module.

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