A high-temperature-resistant packaging test device for a semiconductor chip

Abstract

This invention relates to the field of chip testing technology, and more particularly to a high-temperature packaging testing device for semiconductor chips. It includes a heat flow meter, a circuit board, and a mounting base. The mounting base is fixedly connected to the circuit board. Four rectangularly distributed guide members are fixedly connected to the mounting base. The inner sides of the four guide members together form a rectangle for positioning the chip. A fixing plate is fixedly connected to the mounting base. Uniformly distributed test probes are mounted through the fixing plate. The lower ends of the test probes pass through the mounting base and are electrically connected to the circuit board. A support frame is slidably connected to the mounting base and limits the movement of the guide members. This invention utilizes the guide members and support frame to position the chip before it mates with the test probes, reducing the probability of misalignment between chip pins and test probes, thereby reducing the number of times the chip needs to be removed and reinstalled, improving testing efficiency, and reducing the probability of chip pin damage.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, and in particular to a high-temperature packaging testing device for semiconductor chips. Background Technology

[0002] Packaging and testing, as a crucial later stage in the integrated circuit manufacturing process, are primarily responsible for verifying the structural integrity and electrical functions of packaged semiconductor components. This process requires specialized equipment to perform functional testing, performance evaluation, and reliability testing on the chips to ensure that their parameters meet design requirements. Among these, three-temperature testing monitors chip performance under three different temperature conditions. This process relies on a test socket to achieve a stable electrical connection between the chip and the circuit board. For PGA chips with densely packed array pins, the test socket has holes to accommodate probes and PGA chip pins. Due to the dense pin density of PGA chips, misalignment between the pins and the holes inside the test socket is highly likely during installation. If misalignment is not identified in time and pressure is continued during installation, it can lead to pin bending, wear of the probes inside the test socket, contact failure, distorted test data, or even permanent damage to the chip and testing equipment. Currently, the conventional solution is to remove the chip, adjust its position, and reinstall it, which is not only cumbersome and inefficient but also significantly increases the probability of chip damage during testing. Summary of the Invention

[0003] This invention provides a high-temperature packaging test device for semiconductor chips, which overcomes the shortcomings of existing chip testing installation processes, such as cumbersome operation, low efficiency, and easy damage to chips.

[0004] The technical implementation of this invention is as follows: a high-temperature resistant packaging test device for semiconductor chips, comprising: a heat flow meter, a circuit board, and a mounting base. The mounting base is fixedly connected to the circuit board. The mounting base is fixedly connected to four rectangularly distributed guide members. The inner sides of the four guide members together form a rectangle and are used for positioning the chip. The mounting base is fixedly connected to a fixing plate. The fixing plate is through-mounted with uniformly distributed test probes. The lower ends of the test probes pass through the mounting base and are electrically connected to the circuit board. The mounting base is slidably connected to a support frame that is limited and slidably connected to the guide members. A first spring is fixedly connected between the support frame and the mounting base. The mounting base is limited and slidably connected to a docking plate. The docking plate is located below the upper side of the support frame. The docking plate is provided with uniformly distributed docking holes that correspond one-to-one with all the test probes. The docking holes are used for the pins of the chip to dock with the corresponding test probes. A second spring is fixedly connected between the docking plate and the mounting base.

[0005] Furthermore, the upper part of the guide member is provided with a guide portion, and the horizontal spacing between two adjacent guide portions gradually decreases from top to bottom.

[0006] Furthermore, the mounting base is hinged with two symmetrically distributed locking members, and a torsion spring is fixed between the locking members and the mounting base. The support frame is provided with two symmetrically distributed clearance grooves.

[0007] Furthermore, the swing position of the positioning member is located inside the rectangle formed by the inner sides of the four guide members in the horizontal direction, and when the positioning member limits the chip, the position where the positioning member and the chip line contact each other is located in the same vertical plane as the swing axis of the positioning member.

[0008] Furthermore, the maximum horizontal spacing between the two relief grooves is less than the edge length of the rectangle formed by the inner sides of the four guides.

[0009] Furthermore, the support frame is provided with a limiting groove, and a compression spring is fixedly connected in the limiting groove. The upper part of the compression spring always tends to bend inward toward the support frame. The docking plate is used to compress the compression spring and make the compression spring fully enter the limiting groove. A limiting spring is fixedly connected to the guide member near the limiting groove. The limiting spring always tends to bend inward toward the support frame. The limiting spring is used to limit the support frame through the limiting groove.

[0010] Furthermore, the second spring is always in a compressed and stored state, and the minimum elastic force of the second spring is greater than the force required to deform the compression spring.

[0011] Furthermore, the upper side of the docking plate is provided with evenly distributed support bumps that correspond one-to-one with all the test probes. The support bumps are used for the pins of the chip to pass through and to support the chip.

[0012] Furthermore, the support protrusion is made of silicone.

[0013] Furthermore, the mounting base is fixedly connected to elastic strips near the two locking members, and the locking members are provided with protruding ridges. The elastic strips are used to limit the adjacent locking members by means of the adjacent protruding ridges.

[0014] The beneficial effects of adopting the above technical solution are as follows: the present invention uses guides and support frames to position the chip before it is connected to the test probe, reducing the probability of misalignment between the chip pins and the test probe, thereby reducing the number of times the chip pins need to be removed and reinstalled, improving testing efficiency, and reducing the probability of chip pin damage.

[0015] The relative positional relationship between the support frame and the mating plate determines whether the chip pins are fully inserted into the mating hole. If it is determined that the chip pins cannot be fully inserted into the mating hole, the support frame is used to limit the chip's further downward movement, thereby reducing the probability of the chip pins being squeezed and bent.

[0016] By using support bumps to support the chip, a flow channel for gas flow is created between the chip and the mating plate, thereby improving the temperature uniformity of the chip. By limiting the material of the support bumps, the thermal expansion of the chip can be addressed. This allows space for the thermal expansion of the chip and reduces the probability of local stress concentration at the contact point between the support bumps and the chip. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a three-dimensional structural diagram of the mounting base and guide component of the present invention; Figure 3 This is a three-dimensional structural diagram of the guide component and support frame of the present invention; Figure 4 This is an exploded view of the mounting base, guide member, and support frame of the present invention. Figure 5 This is a three-dimensional structural diagram of the fixing plate and the docking plate of the present invention; Figure 6 Appendix to this invention Figure 5 Enlarged view of point A in the middle; Figure 7 This is a three-dimensional structural diagram of the support frame and locking component of the present invention under test conditions; Figure 8 This is a three-dimensional structural cross-sectional view of the mounting base and support frame of the present invention under test conditions; Figure 9 This is a three-dimensional structural diagram of the test probe and docking plate of the present invention under test conditions; Figure 10 Appendix to this invention Figure 9 Enlarged view of point B in the middle; Figure 11 This is a three-dimensional structural diagram of the locking component and elastic strip of the present invention under test conditions.

[0018] The markings in the attached diagram are as follows: 100-Heat flow meter, 200-Circuit board, 300-Chip, 1-Mounting base, 2-Guide component, 201-Guide part, 3-Fixing plate, 4-Test probe, 5-Support frame, 501-Limiting groove, 6-First spring, 7-Mating plate, 701-Mating hole, 8-Second spring, 9-Clocking component, 901-Leaning groove, 10-Torsion spring, 11-Compression spring, 12-Limiting spring, 13-Supporting protrusion, 14-Elastic strip, 141-Protruding ridge. Detailed Implementation

[0019] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0020] Example 1

[0021] This embodiment discloses a high-temperature packaging test device for semiconductor chips to solve the problems of cumbersome installation and operation, low testing efficiency, and easy damage to chip pins when performing three-temperature tests on PGA chips.

[0022] Please refer to Figures 1 to 5 and Figures 7 to 9 A high-temperature resistant packaging test device for semiconductor chips includes: a heat flow meter 100, a circuit board 200, and a mounting base 1. The heat flow meter 100 is an existing instrument, and will not be described in detail in the accompanying drawings and this document. The mounting base 1 is fixedly connected to the circuit board 200. Four rectangularly distributed guide members 2 are fixedly connected to the mounting base 1. The cross-section of the guide members 2 is L-shaped. The inner sides of the four guide members 2 together form a rectangle and are used to position the chip 300. A fixing plate 3 is fixedly connected to the mounting base 1. Test probes 4 are uniformly distributed and installed through the fixing plate 3. All test probes 4 correspond one-to-one with the pins on the chip 300 to be tested. The test probes 4 are existing devices and will not be described in detail in this document. The lower end of the test probe 4 passes through the mounting base 1 and is electrically connected to the circuit board 200. A support frame 5 is slidably connected to the mounting base 1 via a connecting rod. The guide members 2 and the support frame are connected to the support frame. 5. A limiting sliding connection is provided. The upper side of the support frame 5 is used to place the chip 300. A first spring 6 is fixed between the support frame 5 and the mounting base 1. In this paper, there are four first springs 6 to balance the circumferential force of the support frame 5. The mounting base 1 is slidably connected to the docking plate 7 through a connecting rod. The docking plate 7 contacts and slides with the inner side of the support frame 5. There is a gap between the docking plate 7 and the upper side of the support frame 5. The gap is greater than the length of the pins of the chip 300 so that when the chip 300 contacts the upper side of the support frame 5, the pins of the chip 300 do not contact the docking plate 7. The docking plate 7 is provided with evenly distributed docking holes 701 that correspond one-to-one with all the test probes 4. The docking holes 701 are used for the pins of the chip 300 to dock with the corresponding test probes 4. A second spring 8 is fixed between the docking plate 7 and the mounting base 1.

[0023] The above setup enables the guide 2 and support frame 5 to position the chip 300 before it docks with the test probe 4, reducing the probability of misalignment between the chip 300 pins and the test probe 4, thereby reducing the number of times the chip 300 pins need to be removed and reinstalled, improving testing efficiency, and reducing the probability of damage to the chip 300 pins.

[0024] Please refer to Figure 4 and Figure 5The upper part of the guide member 2 is provided with a guide part 201. From top to bottom, the horizontal spacing between two adjacent guide parts 201 gradually decreases, so that the four guide parts 201 form a four-sided pyramid structure to guide the four sides of the chip 300 to fit against the inner sides of the four guide members 2.

[0025] Please refer to Figures 3 to 5 and Figure 11 The mounting base 1 is hinged with two symmetrically distributed locking members 9. The locking members 9 are used to limit the position of the chip 300 to maintain the contact state between the pins of the chip 300 and the test probe 4. A torsion spring 10 is fixed between the locking members 9 and the mounting base 1. Two symmetrically distributed relief grooves 901 are provided on the support frame 5. The relief grooves 901 are used to provide space for the swing of the locking members 9, so that the locking members 9 can limit the chip 300. The swing position of the locking members 9 is located inside the rectangle formed by the inner sides of the four guide members 2 in the horizontal direction projection. When the locking members 9 limit the chip 300, the position of the line contact between the locking members 9 and the chip 300 is located in the same vertical plane as the swing axis of the locking members 9. This is used to eliminate the horizontal component force of the locking members 9 during the limiting of the chip 300 by the locking members 9, thereby improving the reliability of the locking members 9 in limiting the chip 300.

[0026] It should be noted that in this embodiment, chip 300 will directly contact the upper side of the docking plate 7.

[0027] Please refer to Figure 4 , Figure 5 and Figure 11 The maximum horizontal spacing between the two clearance slots 901 is less than the side length of the rectangle formed by the inner sides of the four guides 2, so that the overlapping part of the chip 300 and the two clearance slots 901 in the horizontal plane is in a suspended state, making it easy to remove the chip 300.

[0028] Test Procedure: Place the chip 300 to be tested on the upper side of the support frame 5 along the four guides 201, and position the chip 300 between the four guides 2. At this time, the chip 300 is in a horizontal state. Then press the chip 300 down, causing the chip 300 to move the support frame 5 down and begin to compress the first spring 6. The distance between the chip 300 and the docking plate 7 gradually decreases until the pins of the chip 300 enter the corresponding docking holes 701. The chip 300 continues to move down and contacts the upper side of the docking plate 7. At this time, continue to press the chip 300 down, causing the chip 300 to move the support frame 5 and the docking plate 7 down together. Continue to compress the first spring 6 and begin to compress the second spring 8, so that the upper end of the test probe 4 gradually enters the docking hole 701 and finally contacts the pins of the chip 300. At this time, rotate the two locking pieces 9 to limit the chip 300. The installation of the chip 300 is now complete.

[0029] The heat flow meter 100 is started, providing three different temperature conditions to the chip 300 and monitoring the performance of the chip 300 under each temperature condition. After the test is completed, the two locking pieces 9 are rotated in the opposite direction to release the chip 300 from its limit. At this time, the chip 300, the support frame 5, and the docking plate 7 gradually return to their original positions under the elastic force of the first spring 6 and the second spring 8. The operator uses tools to remove the chip 300 from the two clearance slots 901, and then replaces it with a new chip 300 to be tested and tests are repeated.

[0030] Example 2

[0031] This embodiment is a further optimization based on embodiment 1, to provide the function of identifying whether the internal holes of the test seat are blocked.

[0032] In the prior art, after long-term use, the test sockets used for PGA chips may become clogged due to chip pins falling off, impurities, etc. In this case, if the chip is forcibly installed on the test socket, the chip pins will be bent and damaged.

[0033] Please refer to Figures 4 to 6 , Figure 9 and Figure 10 The support frame 5 is provided with limiting grooves 501, which can be two centrally symmetrically distributed grooves to ensure uniform circumferential force distribution on the support frame 5. A compression spring strip 11 is fixedly connected within the limiting groove 501, and the upper part of the compression spring strip 11 always tends to bend inwards towards the support frame 5 (see attached diagram). Figure 6 The state shown is when the spring bar 11 is bent under pressure. Figure 10 The state in which the compression spring 11 is fully inserted into the limiting groove 501 is as follows. The docking plate 7 is used to compress the compression spring 11 and ensure that the compression spring 11 is fully inserted into the limiting groove 501. The side of the docking plate 7 used to compress the compression spring 11 can be provided with an inclined surface (see attached). Figure 6 A limiting spring strip 12 is fixedly attached to the guide member 2 near the limiting groove 501. The limiting spring strip 12 always tends to bend inward toward the support frame 5. The limiting spring strip 12 is used to limit the support frame 5 through the limiting groove 501.

[0034] The above setup enables the determination of whether the pins of the chip 300 are fully inserted into the docking hole 701 based on the relative positional relationship between the support frame 5 and the docking plate 7. When it is determined that the pins of the chip 300 cannot be fully inserted into the docking hole 701, the support frame 5 is limited to prevent the chip 300 from continuing to move downward, thereby reducing the probability of the pins of the chip 300 being squeezed and bent.

[0035] Please refer to Figures 4 to 6The second spring 8 is always in a compressed and stored state, and the minimum elastic force of the second spring 8 is greater than the force required to deform the compression spring 11; it is used to enable the docking plate 7 to compress the compression spring 11 and the limiting spring 12 into a vertical state under the elastic force of the second spring 8.

[0036] The process of determining whether the pins of chip 300 can fully enter the mating hole 701 using the compression spring 11 and the limiting spring 12 is as follows: If they can fully enter, during the insertion of the pins of chip 300 into the mating hole 701, the support frame 5 moves the compression spring 11 downward. The compression spring 11 is compressed by the mating plate 7 and gradually becomes vertical. After the chip 300 is in contact with the upper side of the mating plate 7, the side of the compression spring 11 that contacts the mating plate 7 is completely vertical. At this time, the compression spring 11 fully fills the upper part of the limiting groove 501 (see attached diagram). Figure 10 As shown in the diagram, in this state, the limiting spring 12 cannot engage with the upper side of the limiting groove 501, so that the limiting spring 12 cannot limit the support frame 5, and the support frame 5 can continue to move downward.

[0037] If it cannot fully enter, the chip 300 cannot contact the upper side of the docking plate 7, that is, there is a gap between the two. As the support frame 5 moves down to the position corresponding to the limiting spring 12, since the docking plate 7 cannot squeeze the compression spring 11 into a completely vertical state, the limiting spring 12 will limit the support frame 5 through the limiting groove 501, preventing the support frame 5 from moving down further. In this state, the pins on the chip 300 corresponding to the blocked docking hole 701 are only subjected to the elastic force given by the second spring 8, thus reducing the probability of damage to the pins on the chip 300.

[0038] Example 3

[0039] This embodiment is a further optimization based on embodiment 2, to provide a function that facilitates uniform heating of chip 300.

[0040] Please refer to Figure 4 , Figure 5 and Figure 11 The upper side of the docking plate 7 is provided with evenly distributed support bumps 13 that correspond one-to-one with all the test probes 4. The support bumps 13 are used for the pins of the chip 300 to pass through and support the chip 300. By using the support bumps 13 to support the chip 300, there is a flow channel for gas flow between the chip 300 and the docking plate 7, thereby improving the temperature uniformity of the chip 300. The support bumps 13 are made of silicone to cope with the thermal expansion of the chip 300. On the one hand, it provides space for the thermal expansion of the chip 300, and on the other hand, it reduces the probability of local stress concentration at the contact point between the support bumps 13 and the chip 300.

[0041] It should be noted that in this embodiment, the chip 300 will contact the support bump 13 but not the upper side of the mating plate 7.

[0042] Example 4

[0043] This embodiment is a further optimization based on embodiment 3 to improve ease of use.

[0044] Please refer to Figure 11 Elastic strips 14 are fixedly attached to the mounting base 1 near the two locking pieces 9. The elastic strips 14 can be made of elastic rubber. The locking pieces 9 are provided with protruding ribs 141. The elastic strips 14 are used to limit the adjacent locking pieces 9 by the adjacent protruding ribs 141, and the force required to overcome the limiting force of the elastic strips 14 on the protruding ribs 141 is greater than the torque of the torsion spring 10. During the installation of the chip 300, the elastic strips 14 are used to limit the locking pieces 9 to keep the two locking pieces 9 in an "open" state, preventing the locking pieces 9 from affecting the movement of the support frame 5 and the docking plate 7, and improving the convenience of use.

[0045] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A high-temperature packaging testing device for semiconductor chips, characterized in that it comprises: A heat flow meter (100), a circuit board (200), and a mounting base (1) are provided. The mounting base (1) is fixedly connected to the circuit board (200). The mounting base (1) is fixedly connected to four rectangularly distributed guide members (2). The inner sides of the four guide members (2) together form a rectangle and are used to position the chip (300). The mounting base (1) is fixedly connected to a fixing plate (3). The fixing plate (3) is mounted with uniformly distributed test probes (4) through it. The lower ends of the test probes (4) pass through the mounting base (1) and are electrically connected to the circuit board (200). The mounting base (1) is slidably connected to the guide members. (2) A support frame (5) with a limiting sliding connection, a first spring (6) is fixed between the support frame (5) and the mounting base (1), a docking plate (7) is limited and slidably connected to the mounting base (1), the docking plate (7) is located below the upper side of the support frame (5), the docking plate (7) is provided with evenly distributed docking holes (701) that correspond one-to-one with all the test probes (4), the docking holes (701) are used for the pins of the chip (300) to dock with the corresponding test probes (4), and a second spring (8) is fixed between the docking plate (7) and the mounting base (1).

2. The high-temperature resistant packaging and testing device for semiconductor chips according to claim 1, characterized in that, The upper part of the guide member (2) is provided with a guide part (201), and the distance between two adjacent guide parts (201) in the horizontal direction gradually decreases from top to bottom.

3. The high-temperature resistant packaging and testing device for semiconductor chips according to claim 1, characterized in that, The mounting base (1) is hinged with two symmetrically distributed locking parts (9), and a torsion spring (10) is fixed between the locking parts (9) and the mounting base (1). The support frame (5) is provided with two symmetrically distributed relief grooves (901).

4. A semiconductor chip high-temperature packaging testing device according to claim 3, characterized in that, The swing position of the locking member (9) is located inside the rectangle formed by the inner sides of the four guide members (2) in the horizontal direction. When the locking member (9) limits the chip (300), the position where the locking member (9) and the chip (300) make line contact is located in the same vertical plane as the swing axis of the locking member (9).

5. A semiconductor chip high-temperature packaging testing device according to claim 3, characterized in that, The maximum horizontal spacing between the two relief grooves (901) is less than the edge length of the rectangle formed by the inner sides of the four guides (2).

6. A semiconductor chip high-temperature packaging testing device according to claim 3, characterized in that, The support frame (5) is provided with a limiting groove (501), and a compression spring (11) is fixedly connected in the limiting groove (501). The upper part of the compression spring (11) always tends to bend towards the inside of the support frame (5). The docking plate (7) is used to compress the compression spring (11) and make the compression spring (11) completely enter the limiting groove (501). A limiting spring (12) is fixedly connected on the guide member (2) near the limiting groove (501). The limiting spring (12) always tends to bend towards the inside of the support frame (5). The limiting spring (12) is used to limit the support frame (5) through the limiting groove (501).

7. A semiconductor chip high-temperature packaging testing device according to claim 6, characterized in that, The second spring (8) is always in a compressed and stored state, and the minimum elastic force of the second spring (8) is greater than the force required to deform the extrusion strip (11).

8. A semiconductor chip high-temperature packaging testing device according to claim 6, characterized in that, The upper side of the docking plate (7) is provided with evenly distributed support bumps (13) that correspond one-to-one with all the test probes (4). The support bumps (13) are used for the pins of the chip (300) to pass through and support the chip (300).

9. A semiconductor chip high-temperature packaging testing device according to claim 8, characterized in that, The support protrusion (13) is made of silicone.

10. A semiconductor chip high-temperature packaging testing device according to claim 3, characterized in that, The mounting base (1) is fixed with elastic strips (14) near the two locking members (9). The locking members (9) are provided with protrusions (141). The elastic strips (14) are used to limit the adjacent locking members (9) by the adjacent protrusions (141).

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