Multi-color light source machine and display, light emitting panel package, display, and near-eye display

Abstract

This invention provides a multicolor light source based on an anisotropic conductive film, comprising: a plurality of light-emitting panel packages, wherein each light-emitting panel package includes: a light-emitting panel configured to emit light; a lens holder configured to support a coupling lens and having a window, wherein each window is aligned with at least one light-emitting panel; and a coupling lens disposed on the lens holder and configured to transmit light emitted by the light-emitting panel; a circuit board configured to electrically connect the light-emitting panel to a motherboard; and a motherboard bonded to and electrically connected to the circuit board via the anisotropic conductive film. This invention allows the use of multiple monochromatic light-emitting panels to provide a mixed-color light source, such as a white light source, while also reducing the size of the light source or display.

Description

Technical Field

[0001] This invention relates to the field of module packaging, and particularly to a multi-color light source and a display. Furthermore, this invention also relates to a light-emitting panel package and a near-eye display. Background Technology

[0002] A micro light-emitting diode (LED) is a novel LED structure created by thinning, miniaturizing, and arraying existing LED structures. It integrates arrayed micron-sized LED units onto an active-addressable driver panel to enable individual LED illumination and control, thereby outputting the desired display image. The core structure of a micro LED is a PN junction diode, constructed from a direct bandgap semiconductor material. When a forward bias voltage is applied to the upper and lower electrodes, allowing current to flow, electrons and holes recombine in the active region, simultaneously emitting a single-color photon.

[0003] Currently, to provide white light or light sources other than the three primary colors, white light-emitting diodes (LEDs) or miniature LEDs capable of providing that color are typically used to form the light-emitting panel or light source. However, mixed-color miniature LEDs are expensive, and the resulting light source is a fixed color with poor color-tuning capabilities. Furthermore, such light sources also suffer from significant thickness. Summary of the Invention

[0004] Based on existing technology, the objective of this invention is to provide a multi-color light source and display, which can use a single-color light-emitting panel to provide a mixed-color light source, such as a white light source, while also reducing the thickness of the light source or display.

[0005] According to the present invention, the aforementioned task is solved by a multicolor light source machine based on anisotropic conductive film, the multicolor light source machine comprising:

[0006] Multiple light-emitting panel packages, wherein each light-emitting panel package includes:

[0007] A light-emitting panel configured to emit light;

[0008] A lens holder configured to support a coupling lens and having windows, wherein each window is aligned with at least one light-emitting panel; and

[0009] A coupling lens, which is arranged on a lens holder and configured to transmit light emitted by a light-emitting panel;

[0010] Circuit board, configured to electrically connect the light-emitting panel to the motherboard; and

[0011] The motherboard is bonded to and electrically connected to the circuit board via an anisotropic conductive film.

[0012] In one extended embodiment of the invention, the light-emitting panel package further includes:

[0013] A reinforcing sheet, configured to support a light-emitting panel, and having a first contact portion thereon for electrical connection between the light-emitting panel and a circuit board; and

[0014] An adhesive post is placed between the reinforcing sheet and the lens holder to support the lens holder.

[0015] In another extension of the invention, the adhesive column is formed by curing an adhesive, wherein the adhesive contains solid particles that provide support after the adhesive has cured.

[0016] In another extension of the present invention, it is specified that:

[0017] The matrix material of the adhesive is selected from the group consisting of: epoxy resin adhesives and UV adhesives; and / or

[0018] The solid particles are made of silicon dioxide; and / or

[0019] The particle size of the solid particles is no greater than 20 μm.

[0020] In another extension of the present invention, it is specified that:

[0021] The circuit board is electrically connected to the reinforcing chip via a flip-chip package; and / or

[0022] The light-emitting panel is electrically connected to the reinforcing sheet via a flip-chip package.

[0023] In another extension of the invention, the circuit board is specified to include:

[0024] The second contact portion is disposed on the surface of the circuit board facing the light-emitting panel for electrical contact between the circuit board lines and solder balls; and

[0025] A solder ball, configured to electrically connect a second contact portion to a first contact portion arranged on a reinforcing sheet.

[0026] In another extension of the invention, the first contact portion and / or the second contact portion comprises at least one of the following:

[0027] Through-hole contact portion and contact point.

[0028] In another extension of the invention, it is specified that it further includes a connector disposed on the motherboard to connect the light-emitting panel to an external control source or an external power supply.

[0029] In another extension of the invention, the connector is specified to include at least one of the following:

[0030] Gold fingers and stitches.

[0031] In another extension of the invention, the plurality of light-emitting panel packages include three light-emitting panel packages, the three light-emitting panel packages respectively including a red light-emitting panel, a green light-emitting panel and a blue light-emitting panel, and each light-emitting panel is electrically connected to one of the three circuit boards.

[0032] In another extension of the invention, the window is specified as a gap or the window is filled with a transparent material to protect the light-emitting panel.

[0033] In another extension of the invention, the material of the lens holder is selected from the group consisting of:

[0034] Ceramics, plastics, metals, epoxy resins, silicone resins, and polyimides.

[0035] In another extension of the present invention, it is specified that:

[0036] The reinforcing sheet is made of a material selected from the group consisting of: steel plate, copper plate, and ceramic; or

[0037] The reinforcing sheet includes:

[0038] Flexible circuit board, configured to electrically connect light-emitting panel to circuit board; and

[0039] A metal plate is placed under the flexible circuit board to support it.

[0040] In another extension of the invention, the circuit board is specified as a flexible printed circuit board.

[0041] In another extension of the invention, the light source further includes:

[0042] The housing includes:

[0043] A receiving portion, configured to accommodate a light-emitting panel encapsulation;

[0044] A coupling inlet, located on the side of the housing opposite to the receiving portion, is configured to house a coupling lens and couple light emitted from the coupling lens to an optical waveguide lens via an optical fiber; and

[0045] The lens frame extends through the housing and is configured to house the optical waveguide lens;

[0046] An optical waveguide lens is disposed in the lens outer frame of the housing and is configured to output light coupled from the input inlet.

[0047] In another extension of the invention, the coupling lens is optically connected to the optical waveguide lens via an optical fiber.

[0048] In another extension of the invention, the light-emitting panel includes a plurality of miniature light-emitting diodes, wherein the miniature light-emitting diodes include:

[0049] A light-emitting platform, configured to emit light; and

[0050] Microlenses are constructed to guide light.

[0051] In another extension of the invention, the material of the microlens is selected from the group consisting of:

[0052] Silicon oxide (SiOx), silicon nitride (SiNx), titanium oxide (TiOx), and aluminum oxide (AlOx).

[0053] In another extension of the invention, the micro light-emitting diode further includes:

[0054] The driving backplane has a metal layer on its surface and a plurality of IC copper pillars disposed on the driving backplane. The IC copper pillars are electrically connected to the metal layer. The micro light-emitting diode array region is bonded to the driving backplane through a bottom conductive bonding layer. The micro light-emitting diode array region includes a plurality of semiconductor light-emitting mesa, each semiconductor light-emitting mesa corresponding to an IC copper pillar. The semiconductor light-emitting mesa includes a first epitaxial layer, a light-emitting layer and a second epitaxial layer deposited sequentially.

[0055] At least one first electrode is electrically connected to the copper pillar of the IC;

[0056] A passivation barrier layer is applied to the surface of the semiconductor light-emitting mesa, but at least a portion of the second epitaxial layer is exposed.

[0057] A transparent conductive layer is disposed on the surface of the passivation barrier layer and is in electrical contact with the first epitaxial layer; and

[0058] The second electrode is disposed on the surface of the transparent conductive layer.

[0059] In another extension of the invention, the second electrode is specified as an annular reflective electrode, disposed around the semiconductor light-emitting mesa.

[0060] In another extension of the invention, the polarity of the second electrode is specified to be opposite to that of the first electrode.

[0061] In another extension of the present invention, the material of the second epitaxial layer is a material layer of the second conductivity type comprising at least two or more elements of Ga, N, As, Al, In, and P, and the first epitaxial layer is a material layer of the first conductivity type comprising at least two or more elements of Ga, N, As, Al, In, and P, wherein the first conductivity type is different from the second conductivity type.

[0062] In another extension of the present invention, the light-emitting layer is specified to include a multi-quantum-well layer, wherein the multi-quantum-well layer is an InGaN / GaN multi-quantum-well layer, an InGaN / AlGaN multi-quantum-well layer, or an InGaAs / AlGaAs multi-quantum-well layer.

[0063] In another extension of the present invention, an electron blocking layer is provided on the first side of the light-emitting layer, wherein the first side refers to the side along which electrons migrate out of the light-emitting layer.

[0064] In another extension of the invention, the material of the metal layer is specified as one or more alloys of the following metals: Ni, Al, Ti, Ni, Pt, Au.

[0065] In another extension of the invention, the material of the passivation barrier layer is specified as a SiO2 film or an Al2O3 film.

[0066] In another extension of the invention, the light-emitting panel is specified as a monochrome light-emitting panel.

[0067] In another extension of the invention, the brightness and / or chromaticity of the light source are adjusted by adjusting the brightness of the light-emitting panel.

[0068] Furthermore, the present invention also provides a display having a light source according to the present invention. The display may include, for example, a head-mounted display, smart glasses, AR (Augmented Reality) glasses, VR (Virtual Reality) glasses, a smartwatch, a smartphone, etc.

[0069] In addition, the present invention also provides a light source machine based on molding and packaging, comprising:

[0070] An encapsulation composite is bonded to the light source body via adhesive, wherein the encapsulation composite includes a light-emitting panel encapsulated based on anisotropic conductive film (ACF), the light-emitting panel comprising:

[0071] A first light-emitting panel is configured to emit a first color of light;

[0072] A second light-emitting panel is configured to emit a second color of light; and

[0073] The third light-emitting panel is configured to emit a third color of light;

[0074] The light source body has:

[0075] The first light-combining prism is configured to couple the first color light emitted by the first light-emitting panel into the fourth light-combining prism.

[0076] The second light-combining prism is configured to couple the second color light emitted by the second light-emitting panel into the fourth light-combining prism;

[0077] A third beam combiner prism is configured to couple the third-color light emitted by the third light-emitting panel into a fourth beam combiner prism; and

[0078] A fourth beam combining prism is configured to couple the first through third colors of light into the lens; and

[0079] The lens is configured to output the light input to the fourth combining prism.

[0080] In one extended embodiment of the invention, the encapsulation composite comprises:

[0081] The light-emitting panel has its connection area electrically connected to the input terminal of the flexible circuit;

[0082] A flexible circuit board, the output end of which is electrically connected to the input interface of the motherboard via an anisotropic conductive film; and

[0083] The motherboard has an external interface that is electrically connected to the input interface.

[0084] In another extension of the invention, the flexible circuit board includes...

[0085] The first flexible circuit board is bent to connect to the first light-emitting panel;

[0086] A second flexible circuit board, which is linear, is used to connect to the second light-emitting panel; and

[0087] The third flexible circuit board is bent to connect to the third light-emitting panel.

[0088] In another extension of the invention, the ends of the first flexible circuit board and the third flexible circuit board are arranged opposite to each other on the motherboard, and the end of the second flexible circuit board is arranged on the side of the first and third flexible circuit boards facing away from the template output port.

[0089] In another extension of the invention, the external interface is specified to include at least one of the following:

[0090] Gold fingers and stitches.

[0091] In another extension of the present invention, the first color light is red light, the second color light is green light and the third color light is blue light.

[0092] In another extension of the invention, it is specified that the first color light includes a first image, the second color light includes a second image, and the third color light includes a third image.

[0093] In another extension of the present invention, the first to fourth optical combining prisms are specified as optical fibers.

[0094] In another extension of the invention, the first to third beam combining prisms are specified as follows:

[0095] A columnar portion, the bottom surface of which is flat and larger than the light-emitting surface of the light-emitting panel to couple the input light emitted therefrom; and

[0096] The wedge-shaped portion has a wedge angle and an inclined surface, wherein the inclined surfaces of adjacent combining prisms coincide with each other.

[0097] In another extension of the invention, the fourth light-combining prism comprises:

[0098] An input wedge-shaped portion having a wedge angle and an inclined surface, wherein the inclined surfaces of the fourth beam-combining prism coincide with those of the adjacent beam-combining prisms; and

[0099] The output wedge has a wedge angle and an inclined surface.

[0100] In another extension of the invention, the wedge angle is specified to be 90°.

[0101] In another extension of the invention, the adhesive material is specified to be selected from the group consisting of:

[0102] UV adhesives and transparent optical adhesives.

[0103] In another extension of the present invention, it is specified that:

[0104] The outer surfaces of the two inclined surfaces of the second beam combining prism are coated with narrow-band reflective films, and the inclined surfaces of the first and third beam combining prisms adjacent to the fourth beam combining prism are also coated with narrow-band reflective films, wherein the narrow-band reflective films are configured to transmit light incident from their first side and reflect light incident from their second side; and / or

[0105] The refractive indices of the first and third beam combining prisms are greater than those of the second beam combining prism, and the refractive indices of the first and third beam combining prisms are less than those of the fourth beam combining prism.

[0106] In another extension of the invention, the light-emitting panel includes a plurality of miniature light-emitting diodes, wherein the miniature light-emitting diodes include:

[0107] A light-emitting platform, configured to emit light; and

[0108] Microlenses are constructed to guide light.

[0109] In another extension of the invention, the first and / or second and / or third light-emitting panels are specified as monochromatic light-emitting panels.

[0110] In another extension of the invention, the brightness and / or chromaticity of the light source are adjusted by adjusting the brightness of the first and / or second and / or third light-emitting panels.

[0111] The present invention has at least the following beneficial effects:

[0112] (1) The present invention provides mixed color light by using multiple micro light-emitting diode light-emitting panels, which can provide the desired mixed color by using multiple lower cost light-emitting panels, thereby reducing hardware costs.

[0113] (2) The present invention provides mixed color light by using multiple micro light-emitting diode light-emitting panels, and the chromaticity and brightness of the output mixed color can be flexibly adjusted by adjusting the brightness of one or more of the light-emitting panels.

[0114] (3) This invention achieves bonding and conductivity through anisotropic conductive films, avoiding soldering connections or additional intermediate conductors between the circuit board and the motherboard, and eliminating the need for additional bonding processes and adhesives, thereby reducing the thickness of the package. Furthermore, the windows of the support frame allow light from the corresponding light-emitting panel to enter the coupling lens, while the unwindowed portion of the support frame prevents light from adjacent light-emitting panels from entering the current coupling lens, thus preventing optical crosstalk. Additionally, since the light-emitting panel is electrically connected to the reinforcing sheet via flip-chip packaging, and the circuit board is also electrically connected to the reinforcing sheet via flip-chip packaging, and this electrical connection is achieved through solder balls and / or via contacts, wire bonding is unnecessary, thus eliminating the need for wire bonding and increasing the durability of the circuitry. Attached Figure Description

[0115] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0116] Figure 1 A schematic diagram of the light-emitting panel package of a multicolor light source machine with an anisotropic conductive film according to the present invention is shown;

[0117] Figure 2A and 2B A schematic diagram illustrating the connection method between the light-emitting panel and the circuit board, and the connection method between the circuit board and the motherboard according to the present invention;

[0118] Figure 3A and 3B The front view and rear view of the light source according to the present invention after it is assembled into the housing are shown respectively;

[0119] Figure 4 A schematic diagram of a miniature light-emitting diode chip in the light-emitting panel of a light source according to the present invention is shown;

[0120] Figure 5 The encapsulation structure of the light-emitting panel and the reinforcing plate is shown;

[0121] Figure 6 A schematic diagram and optical path diagram of the light source mechanism according to the present invention are shown;

[0122] Figures 7A-7C An optical path diagram of the light source mechanism according to the present invention is shown;

[0123] Figure 8 A first embodiment of the packaging method of the miniature light-emitting diode panel of the light source machine according to the present invention is shown;

[0124] Figure 9 A second embodiment of the packaging method of the miniature light-emitting diode panel of the light source machine according to the present invention is shown;

[0125] Figure 10 A fourth embodiment of the packaging method of the miniature light-emitting diode panel of the light source according to the present invention is shown; and

[0126] Figure 11A-11B A perspective view and a side view of the packaged light source 800 are shown. Detailed Implementation

[0127] In the following description, the invention is described with reference to various embodiments. However, those skilled in the art will recognize that the embodiments may be practiced without one or more specific details or with other alternatives and / or additional methods, materials, or components. In other instances, well-known structures, materials, or operations are not shown or described in detail so as not to obscure the inventive points of the invention. Similarly, for illustrative purposes, specific quantities, materials, and configurations are set forth to provide a comprehensive understanding of embodiments of the invention. However, the invention is not limited to these specific details.

[0128] It should be noted that the components in the various figures may be shown exaggeratedly for illustrative purposes and are not necessarily to scale. In each figure, the same reference numerals are used for components that are identical or have the same function.

[0129] In this invention, unless otherwise specified, "arranged on," "arranged above," and "arranged on" do not exclude the possibility of an intermediate element between them. Furthermore, "arranged on or above" merely indicates the relative positional relationship between two components, and in certain cases, such as when the product orientation is reversed, it can also be converted to "arranged below or under," and vice versa.

[0130] In this invention, the various embodiments are merely intended to illustrate the solutions of the invention and should not be construed as limiting.

[0131] In this invention, unless otherwise specified, the quantifiers “a” and “one” do not exclude scenarios involving multiple elements.

[0132] In this invention, the term "connection" can refer to a direct connection between two things or an indirect connection between two things through an intermediate element.

[0133] In this application, the term "configuration" refers to setting the shape, structure, material and / or function of a target object to achieve a desired technical effect. "Configuration" includes a variety of alternative technical means to achieve the technical effect, which become apparent from the teachings of this application.

[0134] In this specification, references to "an embodiment" or "this embodiment" mean that a particular feature, structure, or characteristic described in connection with that embodiment is included in at least one embodiment of the invention. The phrase "in one embodiment" appearing throughout this specification does not necessarily refer to all of the same embodiment.

[0135] It should be noted that the embodiments of the present invention describe the process steps in a specific order; however, this is only for illustrating the specific embodiment and not for limiting the order of the steps. On the contrary, in different embodiments of the present invention, the order of the steps can be adjusted according to the process.

[0136] Figure 1 A schematic diagram of a light-emitting panel package 100 for a multicolor light source machine with an anisotropic conductive film according to the present invention is shown.

[0137] exist Figure 1 In this design, the light-emitting panel package 100 includes three light-emitting panel packages 100A, 100B, and 100C, which respectively have a red light-emitting panel, a green light-emitting panel, and a blue light-emitting panel. In other applications, other numbers of light-emitting panel packages 100 or light-emitting panels of other colors can be used. For example... Figure 1 As shown, the light-emitting panel package 100 of the multicolor light source machine with anisotropic conductive film according to the present invention includes the following components (some of which are optional):

[0138] • A light-emitting panel 101 is configured to emit light. In this embodiment, the light-emitting panel package 100A has a red light-emitting panel configured to emit red light; the light-emitting panel package 100B has a green light-emitting panel configured to emit green light; and the light-emitting panel package 100C has a blue light-emitting panel configured to emit blue light. It should be noted that this is merely exemplary, and other monochromatic or mixed-light light-emitting panels are conceivable under the teachings of this invention.

[0139] Each light-emitting panel 101 may include a miniature light-emitting diode array 101A and a driving backplane 101B. The miniature light-emitting diode array 101A is configured to emit light. The driving backplane 101B carries the miniature light-emitting diode array 101A and is configured to drive the miniature light-emitting diode array 101A. Further details regarding the miniature light-emitting diode array 101A and the driving backplane 101B can be found in [reference needed]. Figure 4 And its description.

[0140] A lens holder 102, configured to support a coupling lens 104, has windows 106, each window 106 aligned with at least one light-emitting panel 101. Each window 106 is aligned with a single light-emitting panel 101. The windows 106 can be voids (filled with air or a protective gas, such as nitrogen, helium, argon, etc.) or filled with a transparent material to protect the light-emitting panel 101. Transparent materials may include, for example, silicon oxide (SiOx), silicon nitride (SiNx), titanium oxide (TiOx), and aluminum oxide (AlOx). The lens holder 102 is made of materials such as ceramics, plastics, metals, epoxy resins, silicone resins, and polyimides.

[0141] A coupling lens 104 is disposed on window 106 of lens holder 102 and configured to transmit light emitted by light-emitting panel 101. In this embodiment, three coupling lenses 104 are configured to couple light emitted from one of the three light-emitting panels 101 (e.g., red, green, and blue light) into an optical fiber (not shown), and then output the light to a lens via the optical fiber. The coupling lens 104 may include, for example, one or more lenses and / or optical waveguides, wherein the lenses are used to shape the light to, for example, form converging or parallel light (e.g., small-angle parallel light, i.e., the angle between the light and the optical axis does not exceed 8° to achieve an increased light spot), and the optical waveguides are used to couple the light output from the lenses into the optical fiber. The optical waveguides are, for example, optical conductors directly optically connected to the lenses, or optical conductors in the optical path of the light. The coupling lenses and optical conductors may include, for example, quartz glass (mainly made of SiO2), composite glass (mainly made of oxides such as SiO2, Na2O, and CaO), silicate glass, fluoride glass, etc. Optical fibers can include, for example, silica glass optical fibers (the main material is SiO2), composite optical fibers (the main materials are oxides such as SiO2, Na2O and CaO), silicate optical fibers, fluoride optical fibers, plastic-clad optical fibers, all-plastic optical fibers, liquid-core optical fibers, etc.

[0142] • A reinforcing sheet 103, configured to support the light-emitting panel 101, and having a first contact portion (not shown) thereon, the first contact portion being used for electrical connection between the light-emitting panel 101 and the circuit board (see [link]). Figure 2A and 2B The reinforcing sheet 103 may be made of materials such as steel plate, copper plate, and ceramic. When the reinforcing sheet 103 is made of steel plate or copper plate, it can act as a heat sink to dissipate the heat generated by the light-emitting panel 101. Furthermore, the reinforcing sheet may be a composite structure comprising a flexible circuit board and a metal plate, wherein the flexible circuit board is disposed on the upper layer and configured to electrically connect the light-emitting panel to the circuit board 108, while the metal plate acts as a support and heat sink, disposed on the lower layer to support the flexible circuit board and the light-emitting panel 101 and dissipate heat from them.

[0143] Here, the light-emitting panel 101 is electrically connected to the reinforcing sheet 103 via a flip-chip package. For example... Figure 5 As shown, the specific connection method is as follows: a contact portion 501, such as a through-hole contact portion or a contact point (in this case, a through-hole contact portion), is provided on the bottom surface of the driving back plate 101B of the light-emitting panel 101. This contact portion 501 is electrically connected to the contact portion 503 (e.g., a through-hole contact portion or contact point, in this case, a through-hole contact portion) on the surface of the reinforcing plate 103 facing the light-emitting panel 101 via solder balls 502. A conductive line 504 is also provided within the reinforcing plate 103 for electrically connecting the contact portion 505 to the first contact portion 505 for electrically contacting the circuit board.

[0144] In this invention, since the light-emitting panel 101 is electrically connected to the reinforcing sheet 103 via a flip-chip package, and the electrical connection is achieved through solder balls (or other conductors) and / or through-hole contacts, there is no need to use wire bonding, which eliminates the need for wire bonding and increases the durability of the circuit. At the same time, this structure also eliminates the area on the reinforcing sheet or light-emitting panel used for wire bonding, thereby reducing the area of ​​the package.

[0145] A bonding pillar 107 is disposed between the reinforcing sheet 103 and the lens holder 102 to support the lens holder 102. The bonding pillar 107 is formed by curing an adhesive, which may contain, for example, solid particles. These solid particles, in particular, have a strength higher than that of the cured adhesive. The solid particles may be, for example, metal particles, silica particles, etc., and provide support after the adhesive has cured. The matrix of the adhesive may, for example, include epoxy resin, UV adhesive, etc. The particle size of the solid particles is not greater than 20 μm, particularly 5 μm to 20 μm.

[0146] Figure 2A and 2B A schematic diagram illustrating the connection method between the light-emitting panel and the circuit board, and the connection method between the circuit board and the motherboard according to the present invention, is shown, wherein Figure 2A A schematic diagram of the connection between the light-emitting panel and the circuit board according to the present invention is shown, and a schematic diagram of the connection between the circuit board and the motherboard according to the present invention is shown.

[0147] like Figure 2A As shown, a light-emitting panel 101 (including a micro-LED array 101A and a driving backplane 101B) is arranged on a reinforcing sheet 103. A circuit board 108 is electrically connected to the reinforcing sheet 103 via a flip-chip package. Specifically, the first contact portion 505 of the reinforcing sheet 103 is electrically connected to the second contact portion 112 of the circuit board 101. For example, a solder ball 112 is provided between the first contact portion 505 and the second contact portion 112 for conductivity. In other applications, other conductors, such as conductive pillars or conductive sheets, are also conceivable. The second contact portion 112 can be a through-hole contact or a contact point. Furthermore, an electrical contact portion 114, in this case a gold finger, is provided on the circuit board 108, configured to electrically connect the reinforcing sheet 103 to the motherboard 110. In this embodiment, the electrical contact 114 is disposed on the side of the circuit board 108 facing the light-emitting panel 101A. However, in other embodiments, the electrical contact 114 may also be disposed on the side of the circuit board 108 facing away from the light-emitting panel 101A. The circuit board 108 may be a printed circuit board, especially a flexible printed circuit board, wherein or thereon are traces for electrical connection.

[0148] like Figure 2B As shown, the motherboard 110 is bonded to and electrically connected to the circuit board 108 via an anisotropic conductive film 109. Here, the electrical contacts 114 of the circuit board 108 are electrically connected to the input interface of the motherboard 110 via the anisotropic conductive film 109. The circuit board 108 may be disposed on a substrate or may not have a substrate. The connection method is as follows: the electrical contacts 114 of the circuit board 401, such as gold fingers, are electrically connected to the input interface of the motherboard 110, such as through-hole contacts, contacts, or solder balls, via anisotropic conductive adhesive. After the anisotropic conductive adhesive cures, an anisotropic conductive film is formed, firmly bonding the two together to form a conductive connection. A connector 111 is also provided on the motherboard 110 for connecting the circuit board 108 to an external control source or power supply. The connector 111 may be, for example, gold fingers or contacts, such as contacts, contact pads, or contact pins.

[0149] In this invention, the bonding and conductive connection between the circuit board 108 and the motherboard 110 is achieved through the anisotropic conductive film 109, avoiding less stable electrical connections such as soldering between the circuit board and the motherboard, and also avoiding additional bonding processes and the use of adhesives. In other words, the encapsulation method of joining the three light-emitting panels through the anisotropic conductive film can form an alternative connector (such as...). Figure 8 Connection method of external interface 1204.

[0150] Figure 3A and 3B The front and rear views of the light source mechanism according to the present invention after it has been assembled into the housing are shown respectively. Figure 3A A formal diagram showing the light source mechanism according to the present invention assembled into the housing is shown. Figure 3B A rear view is shown after the light source according to the invention has been assembled into the housing.

[0151] The housing 200 of the light source machine according to the present invention includes the following components:

[0152] • Receiving portion 203 is configured to receive the light-emitting panel package 100A-100C. Here, the receiving portion 203 is configured as an open recess, such that when the light-emitting panel package 100A-100C is in use, at least a portion of the back side of the inserted component is exposed, for example, the reinforcing sheet 103 is exposed, thereby promoting heat dissipation. At the same time, the open recess also facilitates the replacement of the display component.

[0153] A coupling inlet 204 is disposed on the side of the housing 200 opposite to the receiving portion 203. The coupling inlet 204 is configured to receive the coupling lens 104 and couple the light emitted from the coupling lens 104 to the optical waveguide mirror 201 via an optical fiber (not shown). The coupling inlet 204 is, for example, constructed to fit the shape of the coupling lens 104 so as to stably fix it within the housing 200. In other applications, coupling inlets of other shapes are also conceivable, such as square, polygonal, or irregular shapes.

[0154] A lens frame 202 penetrates the housing 1 and is configured to accommodate the optical waveguide lens 201. The lens frame 202 is, for example, a rectangular notch opened in the housing 200, the four corners of which can be rounded. Preferably, the lens frame 202 has a snap-fit ​​structure for mounting the lens, such as a slot. The lens frame 202 can penetrate the housing 13 to suit applications such as smart glasses. That is, light can be transmitted from one side of the optical waveguide lens 201 to the other side and continue to propagate.

[0155] • An optical waveguide lens 201 is disposed within a lens frame 202 of the housing 200 and configured to output light coupled in from the coupling inlet 204. For example, the optical waveguide lens 201 is used to overlay images output from multiple, such as three light-emitting panels 101, onto the optical waveguide lens 201 to provide a user experience such as AR or VR. The materials of the optical waveguide lens 201 may include, for example, quartz glass (primarily SiO2), plexiglass, composite glass (primarily oxides such as SiO2, Na2O, and CaO), silicate glass, fluoride glass, etc.

[0156] The main material of the housing 200 may include, for example, plastic, wood, glass, metal, ceramic, etc. Different housing materials can be selected according to different scenarios to meet requirements such as insulation, thermal conductivity, mechanical strength, and weight.

[0157] Furthermore, the present invention also provides a display having a light source according to the invention. The display may include, for example, a head-mounted display, smart glasses, AR (Augmented Reality) glasses, VR (Virtual Reality) glasses, a smartwatch, a smartphone, etc. In these devices, by employing the light source according to the invention, the device area can be significantly reduced, which is beneficial to the trend of device miniaturization.

[0158] Figure 4 A schematic diagram of a miniature light-emitting diode chip according to the present invention is shown.

[0159] like Figure 4 As shown, the miniature light-emitting diode chip of the light-emitting panel 101 of the light source includes the following components:

[0160] The substrate 601 may be made of materials such as ceramic, quartz glass, silicate glass, soda-lime glass, fluoride glass, silicon oxide, or silicon nitride. For example, using a ceramic substrate to support the micro-LED chip can improve the substrate's mechanical strength, thus providing better protection for the micro-LED chip. Furthermore, compared to silicon substrates, ceramics offer better insulation, thereby improving the insulation of the micro-LED chip and preventing leakage current or interference from external currents.

[0161] A driving circuit 602 (i.e., driving backplane 101B) is formed on the substrate 601. The driving circuit 602 may be, for example, a thin-film transistor (TFT) driving circuit, and may include a 2T1C driving circuit, a 3T1C driving circuit, and a 5T2C driving circuit. The driving circuit 602 is configured to drive micro-light-emitting diodes (LEDs), for example, controlling the switching on, off, and brightness of the micro-LEDs. The driving circuit 602 may include, for example, transistors, capacitors, a conductive line layer, an insulating layer, and a metal layer. The conductive line layer is formed on the substrate and configured to supply power to the micro-LED array. An insulating layer is formed on the conductive line layer, wherein through-holes are provided in the insulating layer, and through-hole contacts (e.g., IC copper pillars) are provided in the through-holes for electrically connecting the conductive line layer to the micro-LED array. The metal layer is used for bonding and electrically contacting the micro-LEDs. The conductive circuit layer, metal layer, and insulating layer can be formed on the substrate 601 by deposition, such as physical vapor deposition (PVD) and chemical vapor deposition (CVD). Depending on the specific application, the metal layer and insulating layer can be patterned by photolithography and vias can be formed on them. Furthermore, transistors and capacitors in the conductive circuit layer can be formed by deposition and etching.

[0162] A micro-LED array 603 includes an epitaxial layer 608. The micro-LED array 603 is formed on a driving circuit 603 or a substrate 601. The specific structure of the epitaxial layer is described below. The micro-LED array 603 is bonded to the driving circuit 602 or the substrate 601 by bonding, including full-surface bonding and hybrid bonding. In some embodiments, the micro-LED array may include blue micro-LEDs. In some embodiments, the spacing of the micro-LED array, i.e., the minimum center-to-center distance between the micro-LEDs, may be between about 2 micrometers and about 50 micrometers. In some embodiments, the number of pixels on the micro-LED chip 100 may be between several thousand and several million.

[0163] Each miniature light-emitting diode includes the following components:

[0164] An epitaxial layer 608 is configured to emit light. The epitaxial layer includes a first epitaxial layer, a second epitaxial layer, and a light-emitting layer disposed between the first and second epitaxial layers. The epitaxial layer 108 comprises a first epitaxial layer, a light-emitting layer, and a second epitaxial layer deposited sequentially, wherein the light-emitting layer includes a multiple quantum well layer and an electron blocking layer. In one embodiment of the invention, the first epitaxial layer is an N-type GaN layer or an N-type AlGaN layer, and the second epitaxial layer is a P-type GaN layer or a P-type AlGaN layer. That is, the material of the second epitaxial layer can be a material layer of a second conductivity type comprising at least two or more elements of Ga, N, As, Al, In, and P, and the first epitaxial layer can be a material layer of a first conductivity type comprising at least two or more elements of Ga, N, As, Al, In, and P. The multiple quantum well layer is an InGaN / GaN multiple quantum well layer, an InGaN / AlGaN multiple quantum well layer, or an InGaAs / AlGaAs multiple quantum well layer. The electron blocking device is disposed on a first side of the light-emitting layer, where the first side refers to the side along which electrons migrate out of the light-emitting layer. In another embodiment of the present invention, the first epitaxial layer may also be a P-type GaN layer or a P-type AlGaN layer, and the second epitaxial layer may be an N-type GaN layer or an N-type AlGaN layer.

[0165] The cathode 611 is electrically connected to the first epitaxial layer of the epitaxial layer 603 via a transparent conductive layer 609 and a cathode contact 114 passing through the passivation layer 615. The cathode 611 can be a ring-shaped reflective electrode, disposed around the epitaxial layer 608, and can be formed, for example, by magnetron sputtering or vapor deposition. Its material can be, for example, Al or Al alloy metal for the sidewall reflective surface, and the electrode stack metal can be Ni, Al, Ti, Pt, Au, or other metal materials. The passivation layer 115 is disposed between the transparent conductive layer 609 and the epitaxial layer 608. Its function is not only to reduce current leakage at the sidewalls, but also to passivate sidewall defects and prevent water, oxygen, etc., from damaging the light-emitting mesa during operation. The passivation layer 114 can be formed by depositing SiO2 material using a CVD process or by depositing Al2O3 material using an ALD process. The cathode 111 can be, for example, a common cathode structure, i.e., an array of micro-light-emitting diodes connected to a common cathode.

[0166] • An anode 613 is disposed at the bottom of the epitaxial layer 608 to provide power. The anode 613 of each array of micro-LEDs can be selectively connected to the signal contact 612. The common cathode and selective anode connection can form a passive matrix control method to control the on / off state and brightness adjustment of each micro-LED. Additional layers, such as a passivation layer 615, a transparent conductive layer 609, a cathode 611, etc., are also provided on the epitaxial layer 608 and the anode 613. In addition, signal contacts 612 are formed on the side to bring out the anode 613 of the corresponding micro-LED.

[0167] Multiple miniature light-emitting diodes (LEDs) constitute a miniature LED array, and multiple miniature LED arrays in turn constitute a miniature LED chip. Each miniature LED chip is no larger than 1 cm in size, and the miniature LEDs are preferably no larger than 2050 micrometers. The miniature LED structure is formed in an array within the miniature LED chip, achieving printing resolutions such as 1200 DPI, 600 DPI, and resolutions such as 720*480, 640*480, 1920*1080, 1280*720, 2K, or 4K. The diameter of the miniature LED structure is in the nanometer / micrometer range, for example, from 20 nm to 100 to 50 nm.

[0168] Figure 6 A schematic diagram of a light source 1000 according to the present invention is shown.

[0169] like Figure 6 As shown, the light source 1000 according to the present invention has the following components:

[0170] • Encapsulation composites 1102A-1102C are attached to the light source body 1106 by adhesive 1103, wherein the encapsulation composites 1102A-1102C include light-emitting panels 1101A-1101C, and the light-emitting panels 1101A-1101C include:

[0171] A first light-emitting panel 1101A is configured to emit a first color of light. The first color of light is, for example, monochromatic light, such as red light. It should be noted that this is merely exemplary, and other light-emitting panels emitting monochromatic or mixed light are conceivable under the teachings of this invention.

[0172] The second light-emitting panel 1101B is configured to emit a second color of light. The second color of light is, for example, monochromatic light, such as green light. It should be noted that this is merely exemplary, and other monochromatic or mixed-color light-emitting panels are conceivable under the teachings of this invention.

[0173] The third light-emitting panel 1101C is configured to emit a third color of light. This third color of light is, for example, monochromatic light, such as blue light. It should be noted that this is merely exemplary, and other monochromatic or mixed-color light-emitting panels are conceivable under the teachings of this invention.

[0174] Here, the brightness and / or chromaticity of the light source can be adjusted by adjusting the brightness of the first to third light-emitting panels 1101A-1101C. For example, a luminous intensity of 3 (red):6 (green):1 (blue) can be selected, and then these lights can be mixed to generate white light. The formation of other colors of light is also conceivable. The luminous intensity of the light-emitting panels 1101A-1101C can be adjusted by lighting up a corresponding number of micro-light-emitting diodes in each light-emitting panel 1101A-1101C or by adjusting the brightness of each micro-light-emitting diode.

[0175] Depending on the application, the encapsulation composite 1102A-1102C may also include components such as a molding compound, a flexible circuit board, and a substrate. For specific embodiments, please refer to [link to relevant documentation]. Figure 8 And its description.

[0176] • The light source body 1106 has:

[0177] The first light combining prism 1104A is configured to couple the first color light emitted by the first light emitting panel 1101A into the fourth light combining prism 1104D.

[0178] The second light combining prism 1104B is configured to couple the second color light emitted by the second light emitting panel 1101B into the fourth light combining prism 1104D.

[0179] The third beam combiner prism 1104C is configured to couple the third-color light emitted by the third light-emitting panel 1101C to the fourth beam combiner prism 1104D; and

[0180] The fourth light combining prism 1104D is configured to couple the first to third color light into the lens 1105.

[0181] The first to fourth optical combining prisms 1104A-1104D can be optical fibers or other light-guiding materials. For example, the first to fourth optical combining prisms 1104A-1104D may include: quartz glass optical fiber (mainly made of SiO2), composite optical fiber (mainly made of oxides such as SiO2, Na2O, and CaO), silicate optical fiber, fluoride optical fiber, plastic-clad optical fiber, all-plastic optical fiber, liquid-core optical fiber, etc. The optical coupling input from the first to third optical combining prisms 1104A-1104C to the fourth optical combining prism 1104D can be achieved, for example, through optical fiber connectors. They can be connected to a common optical fiber connector, and their outputs can be connected to the fourth optical combining prism 1104D to achieve optical signal combining. Alternatively, the optical fiber connector can be omitted, and optical coupling input can be achieved by placing a narrow-band reflective film at the optical fiber interface. For more information on optical combining prisms 1104A-1104D and their optical paths, please refer to [link to relevant documentation]. Figures 7A-7C And its description. Alternatively, it can be specified that the refractive indices of the first beam combining prism 1104A and the third beam combining prism 1104C are greater than the refractive index of the second beam combining prism 1104B, and the refractive indices of the first beam combining prism 1104A and the third beam combining prism 1104C are less than the refractive index of the fourth beam combining prism 1104D. In this way, transmission occurs when light enters the material with a lower refractive index from the material with a higher refractive index, and reflection occurs when light enters the material with a lower refractive index from the material with a lower refractive index (the angle of incidence is greater than the critical angle). The critical angle can be reduced by setting a large difference in refractive indices between the materials.

[0182] Lens 1105 is configured to output the light input to the fourth beam combining prism 1104D as output light. Lens 1105 can be configured to guide, shape, or simply transmit the output light. For example, lens 1105 can converge the output light to form a point light source, collimate it to form parallel light, or simply transmit or filter it.

[0183] Figures 7A-7C An optical path diagram of the light source machine according to the present invention is shown, wherein Figure 7A The light path of the light input from the first light-emitting panel 1101A to the first light-combining prism 1104A is shown. Figure 7B The light path of the light input from the second light-emitting panel 1101B to the second light-combining prism 1104B is shown, and Figure 7C The light path of the light input from the third light-emitting panel 1101C to the third light-combining prism 1104C is shown.

[0184] like Figures 7A-7C As shown, each of the first to third beam combining prisms 1104A-1104C includes:

[0185] • A columnar portion 1107 has a flat bottom surface that is larger than the light-emitting surface of the light-emitting panel to couple the light emitted therefrom. The columnar portion 1107 is, for example, cylindrical, with a circular bottom surface that is exactly the circumcircle of the square light-emitting window of the light-emitting panel. The cross-section of the columnar portion 1107 can also be elliptical or other shapes, as long as its area is larger than the area of ​​the light-emitting window.

[0186] A wedge-shaped portion, having a wedge angle and inclined surfaces 1108 and 1109, wherein the inclined surfaces of adjacent beam-combining prisms coincide with each other. The wedge angle is, for example, 90° and is formed by two inclined surfaces 1108 and 1109. Here, the outer surfaces of the two inclined surfaces of the second beam-combining prism 1104B located in the middle are coated with a narrow-band reflective film, and the inclined surfaces 1109 of the first and third beam-combining prisms 1104A and 1104C near the fourth beam-combining prism are coated with a narrow-band reflective film. This narrow-band reflective film is configured to transmit light incident from its first side (e.g., the inner side or the side facing the light-emitting panel) and reflect light incident from its second side (the outer side, or the side facing away from the light-emitting panel), i.e., transmit light of a certain wavelength and reflect light of other wavelengths. The narrow-band reflective film can be, for example, a material with selective transmission characteristics for specific wavelengths of light and reflective characteristics for other wavelengths (e.g., a metal oxide coating such as indium tin oxide (ITO)) to achieve a unidirectional light transmission effect. Furthermore, the transmittance of specific wavelengths of light can be controlled by adjusting the thickness and composition of the coating. For example, the upper slope of the first beam-combining prism can be coated with a coating that is transmissive to the first color of light and reflective to other colors of light (such as the second and third colors), and the two slopes of the second beam-combining prism can be coated with a coating that is transmissive to the second color of light and reflective to other colors of light (such as the first and third colors). The upper slope of the third beam-combining prism can be coated with a coating that is transmissive to the third color of light and reflective to other colors of light (such as the first and second colors). The lower slopes of the first and third beam-combining prisms can be left uncoated. In this way, the combined output of three colors of light can be achieved.

[0187] Alternatively or additionally, it can be specified that the refractive indices of the first beam combining prism 1104A and the third beam combining prism 1104C are greater than the refractive index of the second beam combining prism 1104B, and that the refractive indices of the first beam combining prism 1104A and the third beam combining prism 1104C are less than the refractive index of the fourth beam combining prism 1104D. In this way, transmission occurs when light enters the material with a lower refractive index from the material with a higher refractive index, and reflection or total internal reflection occurs when light enters the material with a lower refractive index from the material with a lower refractive index (the angle of incidence is greater than the critical angle). The critical angle can be reduced by setting a larger difference in refractive indices between the materials.

[0188] Similarly, the fourth beam combining prism 1104D includes:

[0189] • Input wedge section, which has a wedge angle and an inclined surface, wherein the inclined surface of the fourth beam combining prism coincides with that of the adjacent beam combining prism.

[0190] • Output wedge-shaped portion, which has a wedge angle and an inclined surface. The fourth beam combining prism 1104D has a similar shape to the first to third beam combining prisms, for example, it is also cylindrical.

[0191] The optical paths in each combining prism are described below.

[0192] like Figure 7A As shown, light A in the second beam combining prism 1104B originates from the second light-emitting panel 1101B and propagates through the columnar portion of the second beam combining prism 1104B. When it reaches the top inclined surface, it is transmitted into the first and third beam combining prisms 1104A and 1104C. This is because the inclined surface is provided with a narrow-band reflective film or the refractive index of the second beam combining prism 1104B is less than that of the first and third beam combining prisms 1104A and 1104C, allowing light A to be directly transmitted into the first and third beam combining prisms 1104A and 1104C. In the first and third beam-combining prisms 1104A and 1104C, light A continues to propagate until it passes through the upper inclined surfaces of the first and third beam-combining prisms 1104A and 1104C and enters the fourth beam-combining prism 1104D. This is because these two inclined surfaces are equipped with narrow-band reflective films, or the refractive index of the first and third beam-combining prisms 1104A and 1104C is less than the refractive index of the fourth beam-combining prism 1104D, allowing light A to directly transmit into the fourth beam-combining prism 1104D. After propagating in the fourth beam-combining prism 1104D, light A finally enters the lens and is output.

[0193] like Figure 7B As shown, light B in the first beam combining prism 1104A originates from the first light-emitting panel 1101A, propagates through the columnar portion of the first beam combining prism 1104A, and is transmitted into the fourth beam combining prism 1104D when it reaches the upper inclined surface at the top. It is also reflected at the lower inclined surface and passes upward through the upper inclined surface before being transmitted into the fourth beam combining prism 1104D. This is because the upper inclined surface is provided with a narrow-band reflective film, while the lower inclined surface is the back side of the narrow-band reflective film of the inclined surface of the second beam combining prism 1104B, which is reflective. Alternatively, the refractive index of the first beam combining prism 1104A is less than that of the fourth beam combining prism 1104D but greater than that of the second beam combining prism 1104B, allowing light B to be directly transmitted into the fourth beam combining prism 1104D at the upper inclined surface, while being reflected at the lower inclined surface and propagating upward to the upper inclined surface before being transmitted into the fourth beam combining prism 1104D. After propagating in the fourth combining prism 1104D, light B finally enters the lens and is output.

[0194] like Figure 7C As shown, similar to Figure 7BLight C in the third beam combining prism 1104C originates from the third light-emitting panel 1101C, propagates through the columnar portion of the third beam combining prism 1104C, and is transmitted into the fourth beam combining prism 1104D when it reaches the upper inclined surface at the top. It is also reflected at the lower inclined surface and passes upward through the upper inclined surface and is transmitted into the fourth beam combining prism 1104D. This is because the upper inclined surface is provided with a narrow-band reflective film, while the lower inclined surface is the back side of the narrow-band reflective film of the inclined surface of the second beam combining prism 1104B, which is reflective. Alternatively, the refractive index of the third beam combining prism 1104C is less than that of the fourth beam combining prism 1104D but greater than that of the second beam combining prism 1104B, so that light B can be directly transmitted into the fourth beam combining prism 1104D at the upper inclined surface, while it is reflected at the lower inclined surface and propagates upward to the upper inclined surface and is transmitted into the fourth beam combining prism 1104D. After propagating in the fourth combining prism 1104D, light B finally enters the lens and is output.

[0195] Finally, in the fourth light combining prism 1104D, the three colors of light from the three light-emitting panels 1101A-1101C are mixed to generate mixed color light or a corresponding image, which is then shaped and / or filtered or / or transmitted through the lens before being output.

[0196] Figure 8 A first embodiment of the packaging method of the miniature light-emitting diode panel of the light source machine according to the present invention is shown.

[0197] like Figure 8 As shown, the encapsulation composite 2000 is based on molding and includes the following components:

[0198] • Light-emitting panels 1101A-1101C. Light-emitting panels 1101A-1101C can be disposed on a substrate or a circuit board, and the circuit board can be disposed on a substrate or without a substrate. Light-emitting panels 1101A-1101C have a light-emitting surface or a light-emitting area, i.e., the area where the micro-LED array is located. This light-emitting surface should not be obstructed and should therefore be exposed by the encapsulation.

[0199] A circuit board 1203 is electrically connected to the light-emitting panels 1101A-1101C. Specifically, the circuit board 1203 can be connected to the driving circuitry of the light-emitting panels 1101A-1101C to connect them to an external power supply or control source. The circuit board 1203 may have connecting lines configured to connect the interface area of ​​the light-emitting panels to an external interface. The circuit board 1203 may also have an external interface 1204 configured to connect an external power supply and / or control signal or the light source body 1106 to power and / or control the light-emitting panels 1101A-1101C. The external interface 1204 can be a pin-type interface or a gold-finger type interface; other types of interfaces are also conceivable. The circuit board 1203 is preferably a flexible printed circuit board, and the connecting lines are traces arranged on the flexible printed circuit board.

[0200] A molding compound 1202 surrounds the light-emitting panels 1101A-1101C and exposes the light-emitting surface and interface area of ​​the light-emitting panels. The molding compound 1202 has an adhesive application area 1201 for bonding to the light source body via adhesive. The adhesive in the adhesive application area can be, for example, a transparent adhesive, or the adhesive can be left unapplied on the light-emitting surface of the light-emitting panel. The material of the molding compound 1202 may include, for example, epoxy resin, silicone resin, and polyimide.

[0201] The beneficial effects of the molded encapsulation-based encapsulation composite according to the present invention are that the molded encapsulation can tightly encapsulate the light-emitting panel and its wire bonding together, thereby improving the mechanical strength of the encapsulation composite and reducing space occupation.

[0202] Figure 9 A second embodiment of the packaging method of the miniature light-emitting diode panel of the light source machine according to the present invention is shown.

[0203] like Figure 9 As shown, the packaging complex 300 is based on a flip-chip (FC) package and includes the following components:

[0204] • Substrate 307, which is used to support the light-emitting panel 1101A-C. The substrate 307 can be a transparent substrate, such as a glass substrate, or it can be a substrate of other materials, such as GaAs, GaP, InP, SiC, ZnO, and sapphire substrates. In one embodiment of the present invention, the thickness of the substrate is approximately 700 micrometers.

[0205] • The light-emitting panel 1101A-C is mounted on the substrate using a flip-chip configuration. Flip-chip means that its wiring extends downwards from the back and through conductors in the reinforcement or substrate to the contact 305. The advantage of flip-chip is that electrical connections are achieved via solder balls or through-hole contacts, eliminating the need for wire bonding and increasing the durability of the wiring.

[0206] A reinforcing body 301 is disposed on the substrate 307 and surrounds the light-emitting panels 1101A-C, exposing its light-emitting surface and contact portions that are electrically connected to the electrodes of the light-emitting panels 1101A-C. The material of the reinforcing body may include, for example, epoxy resin, silicone resin, and polyimide.

[0207] The flexible circuit board 303 has its bottom electrically connected to the contact portion via solder balls. The flexible circuit board 303 is also flip-chip packaged here, with its bottom electrically connected to the contact 305, thus effectively avoiding wire bonding. The flexible circuit board 303 may also include contacts, such as gold fingers 304, for electrical connection to an external power supply or controller.

[0208] • Reinforcing part 306, which fixes the bottom of the flexible circuit board 303 to the reinforcing body 301 and the substrate 307.

[0209] The beneficial effect of the flip-chip-based packaging complex according to the present invention is that the electrical connection is achieved through solder balls or through-hole contacts, without the need for wire bonding, thus eliminating the need for wire bonding and increasing the durability of the circuit.

[0210] Figure 10 A fourth embodiment of the packaging method of the miniature light-emitting diode panel of the light source machine according to the present invention is shown.

[0211] like Figure 10 As shown, the encapsulation composite 600 is based on a ceramic substrate and includes the following components:

[0212] • Ceramic substrate 501, which is configured to carry light-emitting panels 1101A-1101C.

[0213] • Light-emitting panels 1101A-1101C are disposed on a ceramic substrate 501, wherein the light-emitting surface 508 of the light-emitting panels 1101A-1101C is exposed. The light-emitting panels 1101A-1101C are bonded to the glass substrate 501 by adhesive 509.

[0214] • A molding compound 502 is configured to encapsulate the light-emitting panels 1101A-1101C and / or their leads 505 and 506 on a ceramic substrate 501, wherein the molding compound 502 has a window to expose the light-emitting surface 508 of the light-emitting panel. The molding compound 502 may be, for example, a gold wire protectant.

[0215] • A glass baffle 503 is arranged on the window of the molding compound 502 and is bonded to the molding compound by a glass adhesive 510 to protect the light-emitting panels 1101A-1101C from external damage, while also having a light-transmitting function. The glass adhesive 510 may contain solid particles, which can provide support for the glass baffle 503 after the glass adhesive has cured.

[0216] • A memory chip 504 is disposed between the ceramic substrate 504 and the light-emitting panels 1101A-1101C. The memory chip 504 may be used, for example, to store control programs or calibration programs for the light-emitting panels 1101A-1101C, or other programs or data used for debugging or controlling the light-emitting panels 1101A-1101C.

[0217] • A first lead 505 includes a pair of leads configured to electrically connect the cathode and anode of the light-emitting panels 1101A-1101C to a first contact on the ceramic substrate 501, wherein the first lead 505 and the first contact are encapsulated in a molding compound 502.

[0218] • The second lead 506 includes a pair of leads configured to electrically connect the cathode and anode of the memory chips 1101A-1101C to a second contact on the ceramic substrate 501, wherein the second lead 506 and the second contact are encapsulated in a plastic encapsulation 502.

[0219] Connector 507 is disposed on the side of ceramic substrate 501 facing away from light-emitting panels 1101A-1101C. Conductive lines are provided in ceramic substrate 501, passing through the ceramic substrate to electrically connect the light-emitting panels to connector 507. Connector 507 includes, for example, gold fingers and pins.

[0220] The beneficial effects of the ceramic substrate-based encapsulation composite according to the present invention are that the ceramic substrate provides better bottom support and protection, and the glass baffle also provides better protection for the light-emitting panel. Furthermore, the connector is directly disposed on the back side of the ceramic substrate and uses an interface such as gold fingers, allowing direct connection to the circuit board without soldering or wire bonding.

[0221] Figure 11A-11B A perspective view and a side view of the packaged light source 800 are shown.

[0222] like Figure 11A and 11BAs shown, the light source 800 includes three encapsulation assemblies 1102A-1102C arranged on the side and a lens 1105 arranged at the front end. Each encapsulation assembly includes a light-emitting panel (not shown) and a flexible circuit board 108, wherein the flexible circuit board 108 is connected to a motherboard 110 via an anisotropic conductive film 109. The light-emitting panels in the three encapsulation assemblies 1102A-1102C output light from the lens 1105 after being combined by a light-combining prism.

[0223] from Figure 11A and 11B It can be seen that by using the anisotropic conductive film 109 to achieve bonding and conductive connection between the circuit board 108 and the motherboard 110, the less stable electrical connections such as soldering between the circuit board and the motherboard can be avoided, while also eliminating the need for additional bonding processes and adhesives. In other words, the encapsulation method of joining the three light-emitting panels through anisotropic conductive film can form an alternative connector (such as...). Figure 8 Connection method of external interface 1204.

[0224] While some embodiments of the invention have been described in this application, those skilled in the art will understand that these embodiments are merely illustrative. Numerous variations, alternatives, and improvements will arise in those skilled in the art under the teachings of this invention without departing from its scope. The appended claims are intended to define the scope of the invention and thereby cover the methods and structures within the scope of the claims themselves and their equivalents.

Claims

1. A multicolor light source machine based on anisotropic conductive film, comprising: Multiple light-emitting panel packages, wherein each light-emitting panel package includes: A light-emitting panel configured to emit light; A lens holder configured to support a coupling lens and having windows, wherein each window is aligned with at least one light-emitting panel; and A coupling lens, which is arranged on a lens holder and configured to transmit light emitted by a light-emitting panel; Circuit board, configured to electrically connect the light-emitting panel to the motherboard; and The motherboard is bonded to and electrically connected to the circuit board via an anisotropic conductive film.

2. The light source device according to claim 1, wherein the light-emitting panel package further comprises: A reinforcing sheet is configured to support a light-emitting panel and has a first contact portion thereon, the first contact portion being used for electrical connection between the light-emitting panel and the circuit board. as well as An adhesive post is placed between the reinforcing sheet and the lens holder to support the lens holder.

3. The light source machine according to claim 2, wherein the adhesive column is formed by curing adhesive, wherein the adhesive contains solid particles, and the solid particles provide support after the adhesive has cured.

4. The light source machine according to claim 3, characterized in that: The matrix material of the adhesive is selected from the group consisting of: epoxy resin adhesives and UV adhesives; and / or The solid particles are made of silicon dioxide; and / or The particle size of the solid particles is no greater than 20 μm.

5. The light source machine according to claim 2, characterized in that: The circuit board is electrically connected to the reinforcing chip via a flip-chip package; and / or The light-emitting panel is electrically connected to the reinforcing sheet via a flip-chip package.

6. The light source machine according to claim 5, wherein the circuit board comprises: The second contact portion is disposed on the surface of the circuit board facing the light-emitting panel for electrical contact between the circuit board lines and the solder balls; as well as A solder ball, configured to electrically connect a second contact portion to a first contact portion arranged on a reinforcing sheet.

7. The light source machine according to claim 6, wherein the first contact portion and / or the second contact portion comprises at least one of the following: Through-hole contact portion and contact point.

8. The light source machine according to claim 1, further comprising: A connector is mounted on the motherboard to connect the light-emitting panel to an external control source or external power supply.

9. The light source machine according to claim 8, wherein the connector comprises at least one of the following: Gold fingers and stitches.

10. The light source machine according to claim 1, wherein the plurality of light-emitting panel packages include three light-emitting panel packages, the three light-emitting panel packages respectively include a red light-emitting panel, a green light-emitting panel and a blue light-emitting panel, and each light-emitting panel is electrically connected to one of the three circuit boards.

11. The light source machine according to claim 1, wherein the window is a gap or the window is filled with a transparent material to protect the light-emitting panel.

12. The light source machine according to claim 1, wherein the material of the lens holder is selected from the group consisting of: Ceramics, plastics, metals, epoxy resins, silicone resins, and polyimides.

13. The light source machine according to claim 1, characterized in that: The reinforcing sheet is made of a material selected from the group consisting of: steel plate, copper plate, and ceramic; or The reinforcing sheet includes: Flexible circuit board, configured to electrically connect light-emitting panel to circuit board; and A metal plate is placed under the flexible circuit board to support it.

14. The light source machine according to claim 1, wherein the circuit board is a flexible printed circuit board.

15. The light source machine according to claim 1, further comprising: The housing includes: A receiving portion, configured to accommodate a light-emitting panel encapsulation; A coupling inlet, located on the side of the housing opposite to the receiving portion, is configured to house a coupling lens and couple light emitted from the coupling lens to an optical waveguide lens via an optical fiber; and The lens frame extends through the housing and is configured to house the optical waveguide lens; An optical waveguide lens is disposed in the lens outer frame of the housing and is configured to output light coupled from the input inlet.

16. The light source machine according to claim 15, wherein the coupling lens is optically connected to the optical waveguide lens via an optical fiber.

17. The light source machine according to claim 1, wherein the light-emitting panel includes a plurality of miniature light-emitting diodes, wherein the miniature light-emitting diodes include: A light-emitting platform, configured to emit light; as well as Microlenses are constructed to guide light.

18. The light source machine according to claim 17, wherein the material of the microlens is selected from the group consisting of: Silicon oxide (SiOx), silicon nitride (SiNx), titanium oxide (TiOx), and aluminum oxide (AlOx).

19. The light source according to claim 17, wherein the miniature light-emitting diode further comprises: The driving backplane has a metal layer on its surface and a plurality of IC copper pillars disposed on the driving backplane. The IC copper pillars are electrically connected to the metal layer. The micro light-emitting diode array region is bonded to the driving backplane through a bottom conductive bonding layer. The micro light-emitting diode array region includes a plurality of semiconductor light-emitting mesa, each semiconductor light-emitting mesa corresponding to an IC copper pillar. The semiconductor light-emitting mesa includes a first epitaxial layer, a light-emitting layer and a second epitaxial layer deposited sequentially. At least one first electrode is electrically connected to the copper pillar of the IC; A passivation barrier layer is applied to the surface of the semiconductor light-emitting mesa, but at least a portion of the second epitaxial layer is exposed. A transparent conductive layer is disposed on the surface of the passivation barrier layer and is in electrical contact with the first epitaxial layer; as well as The second electrode is disposed on the surface of the transparent conductive layer.

20. The light source according to claim 19, wherein the second electrode is an annular reflective electrode disposed around the semiconductor light-emitting platform.

21. The light source according to claim 19, wherein the polarity of the second electrode is opposite to that of the first electrode.

22. The light source machine according to claim 19, wherein the material of the second epitaxial layer is a material layer of the second conductivity type comprising at least two or more elements including Ga, N, As, Al, In, and P, and the first epitaxial layer is a material layer of the first conductivity type comprising at least two or more elements including Ga, N, As, Al, In, and P, wherein the first conductivity type is different from the second conductivity type.

23. The light source according to claim 19, wherein the light-emitting layer comprises a multi-quantum well layer, wherein the multi-quantum well layer is an InGaN / GaN multi-quantum well layer, an InGaN / AlGaN multi-quantum well layer, or an InGaAs / AlGaAs multi-quantum well layer.

24. The light source according to claim 19, wherein an electron blocking layer is provided on the first side of the light-emitting layer, the first side referring to the side along which electrons migrate out of the light-emitting layer.

25. The light source machine according to claim 19, wherein the material of the metal layer is one or more alloys of the following metals: Ni, Al, Ti, Ni, Pt, Au.

26. The light source machine according to claim 19, wherein the material of the passivation barrier layer is a SiO2 film or an Al2O3 film.

27. The light source machine according to claim 1, wherein the light-emitting panel is a monochromatic light-emitting panel.

28. The light source machine according to claim 27, wherein the brightness and / or chromaticity of the light source is adjusted by adjusting the brightness of the light-emitting panel.

29. A display having a light source according to any one of claims 1 to 28.

30. A light-emitting panel package, wherein each light-emitting panel package comprises: At least two light-emitting panels are configured to emit light; A lens holder configured to support a coupling lens and having windows, wherein each window is aligned with at least one light-emitting panel; as well as A coupling lens, which is arranged on a lens holder and configured to transmit light emitted by a light-emitting panel.

31. A near-eye display, comprising: Multiple light-emitting panel packages, wherein each light-emitting panel package includes: A light-emitting panel configured to emit light; A lens holder configured to support a coupling lens and having windows, wherein each window is aligned with at least one light-emitting panel; and A coupling lens, which is arranged on a lens holder and configured to transmit light emitted by a light-emitting panel; A circuit board configured to electrically connect a light-emitting panel to a motherboard; The motherboard is bonded to and electrically connected to the circuit board via an anisotropic conductive film; The housing includes: A receiving portion, configured to accommodate a light-emitting panel encapsulation; A coupling inlet, located on the side of the housing opposite to the receiving portion, is configured to house a coupling lens and couple light emitted from the coupling lens to an optical waveguide lens via an optical fiber; and The lens frame, which penetrates the housing and is configured to house the optical waveguide lens; and An optical waveguide lens is disposed in the lens outer frame of the housing and is configured to output light coupled from the input inlet.

32. A light source machine based on molded packaging, comprising: An encapsulation composite is bonded to the light source body via adhesive, wherein the encapsulation composite includes a light-emitting panel encapsulated based on anisotropic conductive film (ACF), the light-emitting panel comprising: A first light-emitting panel is configured to emit a first color of light; A second light-emitting panel is configured to emit a second color of light; and The third light-emitting panel is configured to emit a third color of light; The light source body has: The first light-combining prism is configured to couple the first color light emitted by the first light-emitting panel into the fourth light-combining prism. The second light-combining prism is configured to couple the second color light emitted by the second light-emitting panel into the fourth light-combining prism; A third beam combiner prism is configured to couple the third-color light emitted by the third light-emitting panel into a fourth beam combiner prism; and A fourth beam combining prism is configured to couple the first through third colors of light into the lens; and The lens is configured to output the light input to the fourth combining prism.

33. The light source device according to claim 32, wherein the encapsulation composite comprises: The light-emitting panel has its connection area electrically connected to the input terminal of the flexible circuit; The output end of the flexible circuit board is electrically connected to the input interface of the motherboard through an anisotropic conductive film. as well as The motherboard has an external interface that is electrically connected to the input interface.

34. The light source machine according to claim 33, wherein the flexible circuit board comprises The first flexible circuit board is bent to connect to the first light-emitting panel; The second flexible circuit board is linear in shape to connect to the second light-emitting panel; as well as The third flexible circuit board is bent to connect to the third light-emitting panel.

35. The light source machine according to claim 34, wherein the ends of the first flexible circuit board and the third flexible circuit board are arranged opposite to each other on the mother plate, and the end of the second flexible circuit board is arranged on the side of the first and third flexible circuit boards facing away from the template output port.

36. The light source machine according to claim 33, wherein the external interface includes at least one of the following: Gold fingers and stitches.

37. The light source according to claim 32, wherein the first color light is red light, the second color light is green light and the third color light is blue light.

38. The light source machine according to claim 32, wherein the first color light comprises a first image, the second color light comprises a second image, and the third color light comprises a third image.

39. The light source machine according to claim 32, wherein the first to fourth light combining prisms are optical fibers.

40. The light source machine according to claim 32, wherein the first to third beam combining prisms comprise: The columnar part has a flat bottom surface that is larger than the light-emitting surface of the light-emitting panel to couple the input light emitted by it. as well as The wedge-shaped portion has a wedge angle and an inclined surface, wherein the inclined surfaces of adjacent combining prisms coincide with each other.

41. The light source machine according to claim 40, wherein the fourth beam combining prism comprises: The input wedge has a wedge angle and an inclined surface, wherein the inclined surfaces of the fourth beam combining prism coincide with those of the adjacent beam combining prisms; as well as The output wedge has a wedge angle and an inclined surface.

42. The light source machine according to any one of claims 40 and 41, wherein the wedge angle is 90°.

43. The light source machine according to claim 32, wherein the adhesive material is selected from the group consisting of: UV adhesives and transparent optical adhesives.

44. The light source machine according to claim 32, wherein: The outer surfaces of the two inclined surfaces of the second beam combining prism are coated with narrow-band reflective films, and the inclined surfaces of the first and third beam combining prisms adjacent to the fourth beam combining prism are also coated with narrow-band reflective films, wherein the narrow-band reflective films are configured to transmit light incident from their first side and reflect light incident from their second side; and / or The refractive indices of the first and third beam combining prisms are greater than those of the second beam combining prism, and the refractive indices of the first and third beam combining prisms are less than those of the fourth beam combining prism.

45. The light source device according to claim 32, wherein the light-emitting panel comprises a plurality of miniature light-emitting diodes, wherein the miniature light-emitting diodes comprise: A light-emitting platform, configured to emit light; as well as Microlenses are constructed to guide light.

46. ​​The light source machine according to claim 32, wherein the first and / or second and / or third light-emitting panels are monochromatic light-emitting panels.

47. The light source machine according to claim 46, wherein the brightness and / or chromaticity of the light source are adjusted by adjusting the brightness of the first and / or second and / or third light-emitting panels.

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