Template error adjustment method, device and nanoimprint apparatus
By setting reference points in semiconductor manufacturing to identify deformation errors and control the moving device, template error adjustment is achieved, solving the problem of insufficient overlay accuracy in existing technologies, improving the accuracy and production capacity of nanoimprinting, and adapting to the error correction needs of templates of different sizes.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- PUYU TECHNOLOGY (SUZHOU) CO LTD
- Filing Date
- 2026-04-28
- Publication Date
- 2026-06-26
AI Technical Summary
Existing photolithography technologies are difficult to achieve high-precision overlay of multi-layer stacked memory chips and logic chips in semiconductor manufacturing. Self-aligned dual-patterning technology relies on complex hard mask processes to amplify overlay errors. Oriented self-assembly technology is highly sensitive. Extreme ultraviolet lithography relies on expensive high-power light sources. Electron beam direct writing equipment is expensive and has low capacity, making it difficult to meet the mass production needs of high-capacity memory/logic chips.
By setting at least three reference points on the target template, deformation errors are identified and the moving device is controlled to move the target position, thereby reducing the offset. A template error adjustment device and a nanoimprinting device are used to fix the template by adsorption. Combined with an elastic device and a multi-point displacement device, precise deformation correction is achieved.
It improves the overlay accuracy of masks and wafers in nanoimprint lithography, simplifies the process flow, reduces the dependence on special materials and high-power light sources, and meets the high precision and high capacity requirements of large-scale semiconductor manufacturing.
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Figure CN122284239A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor manufacturing, specifically to the field of nanoimprint lithography, and more specifically to a template error adjustment method, apparatus, and nanoimprint lithography equipment. Background Technology
[0002] In the semiconductor manufacturing industry, multilayer stacked memory chips and logic chips require precise overlay to achieve patterned alignment between the circuit layers of a silicon wafer. When the imprinting adhesive is subjected to the pressure of the template before curing, the resulting out-of-plane bending and deflection become the core sources of error in overlay accuracy.
[0003] Existing photolithography technologies mainly include self-aligned dual patterning (SADP), directed self-assembly (DSA), extreme ultraviolet (EUV) lithography, and electron beam direct writing (MEBL). SADP achieves a 50% reduction in feature size through sidewall spacer deposition and multiple etching steps; however, its complex process relying on hard masks significantly amplifies overlay errors during multi-layer imprinting. DSA utilizes the self-organizing properties of block copolymers to generate nanostructures, but its sensitivity to temperature and solvents leads to microphase separation defects, reducing pattern fidelity during resist flow. EUV lithography breaks through resolution limits with its 13.5nm wavelength light source, but it relies on expensive high-power light sources to ensure throughput. MEBL can directly create high-precision patterns, but its equipment is extremely expensive and its low production capacity only suits small-batch ASIC chips, making it difficult to meet the mass production needs of high-capacity memory / logic chips. Summary of the Invention
[0004] In view of the above problems, this application provides a template error adjustment method, apparatus, device, medium and program product for improving the overlay accuracy of masks and wafers in nanoimprinting in semiconductor processes.
[0005] According to a first aspect of this application, a template error adjustment method is provided, comprising: determining a deformation error of a target template based on the offset of at least three reference points on the target template relative to an expected position, wherein the at least three reference points are not collinear, and the deformation error includes at least one of X-direction scaling error, Y-direction scaling error, diagonal error, and trapezoidal error; determining the offset of a target position at the edge of the target template based on the deformation error; and controlling a moving device corresponding to the target position to move the target position based on the offset.
[0006] According to an embodiment of this application, the deformation error indicates the deformation ratio of the target template in a certain type; determining the offset of the target position at the edge of the target template based on the deformation ratio includes: determining the offset of the target position at the edge of the target template based on the deformation ratio and the size of the target template.
[0007] According to an embodiment of this application, controlling a moving device corresponding to a target position to move the target position includes: controlling the moving device corresponding to the target position to apply a corresponding force load to the target position to reduce the offset.
[0008] According to an embodiment of this application, controlling a moving device corresponding to a target position to move the target position includes: controlling the moving device corresponding to the target position to move the target distance by a target stroke to reduce the offset.
[0009] A second aspect of this application provides a template error adjustment device, comprising: an installation position for installing a target template; an error identification device for determining the deformation error of the target template based on the offset of at least three reference points on the target template relative to the expected position, and determining the offset of the target position at the edge of the target template based on the deformation error, wherein the at least three reference points are not collinear, and the deformation error includes at least one of X-direction scaling error, Y-direction scaling error, diagonal error, and trapezoidal error; and at least one moving device disposed at the target position at the edge of the target template for moving the target position at the edge of the target template according to the offset, so as to reduce the offset.
[0010] According to an embodiment of this application, the target template is adsorbed onto the installation location by an adsorption method.
[0011] According to an embodiment of this application, at least one edge of the target template is distributed with N mobile devices, where N is a positive integer.
[0012] According to an embodiment of this application, N is greater than or equal to 3, and the spacing between the N mobile devices is equal.
[0013] According to an embodiment of this application, the template error adjustment device further includes: at least one pair of elastic devices; at least one pair of elastic devices are disposed on opposite sides of the target template for applying elastic force to the edge of the target template.
[0014] According to an embodiment of this application, the elastic device is disposed at the midpoint of the edge of the target template.
[0015] A third aspect of this application provides a nanoimprint apparatus, comprising: any of the above-described template error adjustment devices. Attached Figure Description
[0016] The above-mentioned contents, other objects, features and advantages of this application will become clearer from the following description of embodiments with reference to the accompanying drawings, in which:
[0017] Figure 1A A schematic diagram illustrating the offset error in the X direction during the alignment process is shown.
[0018] Figure 1BThis schematic diagram illustrates the offset error in the Y direction during the alignment process.
[0019] Figure 1C A schematic diagram illustrating the deflection angle error during the alignment process is shown.
[0020] Figure 1D A schematic diagram illustrating the scaling error in the X direction during the alignment process is shown.
[0021] Figure 1E This schematic diagram illustrates the scaling error in the Y direction during the alignment process.
[0022] Figure 1F A schematic diagram illustrating the diagonal error during the alignment process is shown.
[0023] Figure 1G This schematic diagram illustrates the trapezoidal error in the X direction during the alignment process.
[0024] Figure 1H This schematic diagram illustrates the trapezoidal error in the Y direction during the alignment process.
[0025] Figure 2 The schematic diagram illustrates a template error adjustment method according to an embodiment of this application.
[0026] Figure 3 A schematic diagram of another template error adjustment device according to an embodiment of this application is shown;
[0027] Figure 4 This illustration schematically shows an adsorption diagram on the upper surface of a template according to an embodiment of this application;
[0028] Figure 5 A schematic diagram of a third template error adjustment device according to an embodiment of this application is shown.
[0029] Figure 6 A schematic diagram of a fourth template error adjustment device according to an embodiment of this application is shown. Detailed Implementation
[0030] The embodiments of this application will now be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of this application. In the following detailed description, numerous specific details are set forth to provide a thorough understanding of the embodiments of this application for ease of explanation. However, it will be apparent that one or more embodiments may be implemented without these specific details. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concepts of this application.
[0031] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. The terms “comprising,” “including,” etc., as used herein indicate the presence of features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.
[0032] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein are to be interpreted in a manner consistent with the context of this specification, and not in an idealized or overly rigid way.
[0033] When using expressions such as "at least one of A, B and C", they should generally be interpreted in accordance with the meaning that is commonly understood by those skilled in the art (e.g., "a system having at least one of A, B and C" should include, but is not limited to, a system having A alone, a system having B alone, a system having C alone, a system having A and B, a system having A and C, a system having B and C, and / or a system having A, B and C, etc.).
[0034] The embodiments of this application determine the displacement of the distortion by using the coordinates of a reference point, causing a moving device at the target position on the edge of the target template to move the target position, thereby reducing the deformation of the mask during the imprinting process. This improves the overlay accuracy between the mask and the wafer in nanoimprinting in semiconductor processes.
[0035] In nanoimprinting, deformation errors may occur in the imprinting template due to factors such as force, temperature, and material stress. Figures 1A-1H The diagrams show the deformation of different units during the alignment process.
[0036] Figure 1A The diagram illustrates the offset error in the X direction during the alignment process.
[0037] like Figure 1A As shown, the light lines represent the theoretical position of the mask pattern, and the dark lines represent the actual position of the mask pattern. Let the horizontal direction be the x-axis and the vertical direction be the y-axis. (x,y) are the theoretical coordinates of the reference point of the mask pattern, and (x',y') are the actual measured coordinates of the reference point. The same applies below.
[0038] In the figure, the mask pattern is shifted to the right, and the amount of shift (translation error) in the X direction is as follows.
[0039] X = x' - x
[0040] The offset in the X direction reflects the overall translational shift of the mask in the X-axis direction.
[0041] Figure 1B A schematic diagram illustrating the offset error in the Y direction during the alignment process is shown.
[0042] like Figure 1B As shown, the mask pattern is shifted upwards, and the shift amount (translation error) in the Y direction is as follows.
[0043] Y=y'-y
[0044] The offset in the Y direction reflects the overall translational shift of the mask in the Y-axis direction.
[0045] Figure 1C A schematic diagram illustrating the deflection angle error during the alignment process is shown.
[0046] like Figure 1C As shown, the center point of the mask pattern is (0,0), and the deflection angle of the mask pattern relative to the direction of the dashed line is... (Rotational error) is as follows.
[0047]
[0048] The deflection angle reflects the overall rotational offset of the mask.
[0049] Figure 1D A schematic diagram illustrating the scaling error in the X direction during the alignment process is shown.
[0050] like Figure 1D As shown, the mask pattern is magnified in the X direction (horizontal direction in the figure), and the expression for the magnification in the X direction is as follows.
[0051] =
[0052] X-axis scaling error reflects the magnification or reduction deformation of the mask in the X-axis direction.
[0053] Figure 1E A schematic diagram illustrating the scaling error in the Y direction during the alignment process is shown.
[0054] like Figure 1E As shown, the mask pattern is magnified in the Y direction (vertical in the figure), and the expression for the magnification in the Y direction is as follows.
[0055] =
[0056] Y-axis scaling error reflects the magnification or reduction deformation of the mask in the Y-axis direction.
[0057] Figure 1F A schematic diagram illustrating the diagonal error during the alignment process is shown.
[0058] like Figure 1FAs shown, the coordinates of the four corner points of the mask pattern are A(x1,y1), B(x2,y2), C(x3,y3), and D(x4,y4). Side AD forms an angle with side AB. Angle. The expression for diagonal error (orthogonality error) is as follows.
[0059]
[0060] Diagonal error reflects the orthogonality deviation of the diagonal of the mask pattern.
[0061] Figure 1G A schematic diagram illustrating the trapezoidal error in the X direction during the alignment process is shown.
[0062] like Figure 1G As shown, the center point of the mask pattern is (0,0), and one of its edges is perpendicular to the direction of the dashed line in the figure. The expression for the trapezoidal error in the X direction is as follows.
[0063] =
[0064] X-direction trapezoidal error reflects the trapezoidal distortion of the mask in the X-axis direction.
[0065] Figure 1H A schematic diagram illustrating the trapezoidal error in the Y direction during the alignment process is shown.
[0066] like Figure 1H As shown, the center point of the mask pattern is (0,0), and one of its edges is perpendicular to the direction of the dashed line in the figure. The angle. The expression for the trapezoidal error in the Y direction is as follows.
[0067] =
[0068] Y-direction trapezoidal error reflects the trapezoidal distortion of the mask in the Y-axis direction.
[0069] In the above formula, (x1, y1), (x2, y2), and (x4, y4) can be three reference points on the template, for example, the coordinates of three key vertices among the four vertices of a patterned area with dimensions of 26mm × 33mm on the mask. The magnitude of eight overlay deviation unit deformations is calculated based on the x / y offsets of the four points in the patterned area. Three rigid body displacements (X and Y translations and θ rotation) can be compensated by the air-floating wafer stage; the other five template deformations (X / Y scaling, orthogonality error, and X / Y trapezoidal error) can be achieved by controlling the template deformation.
[0070] An embodiment of this application provides a template error adjustment method, comprising: determining the deformation error of the target template based on the offset of at least three reference points on the target template relative to the expected position, wherein the at least three reference points are not collinear, and the deformation error includes at least one of X-direction scaling error, Y-direction scaling error, diagonal error, and trapezoidal error; determining the offset of the target position at the edge of the target template based on the deformation error; and controlling a moving device corresponding to the target position to move the target position based on the offset.
[0071] The target template can be, for example, a fused silica template, a silicon-based template, or a polymer template. Templates made of different materials have different thermal expansion and contraction, and stress deformation characteristics. The method in this embodiment identifies errors by the offset of reference points, without relying on material properties, and has strong adaptability. The target template can be a large-sized template (≥150mm × 150mm, such as a standard 6025 mask) or a small-to-medium-sized template (<100mm × 100mm, such as a microfluidic chip template). For templates of different sizes, only the number and layout of reference points and the distribution of the moving device need to be adjusted to adapt to the error correction of templates of different sizes.
[0072] The moving device is controllable and can generate minute directional displacements or output mechanical forces. For example, the moving device can be a force actuator or a micro-displacement platform, and the specific types of force actuators can be piezoelectric actuators, electric actuators, electromagnetic actuators, electrostatic actuators, etc.
[0073] Figure 2 The schematic diagram illustrates a template error adjustment method according to an embodiment of this application.
[0074] like Figure 2 As shown, assuming that the reference point and expected position on the target template are set as A before nanoimprinting. B C The target template has target positions E and F on its edge. The actual position measured after imprinting is A. B C Analysis revealed that the target template had a certain diagonal error.
[0075] Based on the diagonal error, the offsets of target positions E and F are calculated using geometric relationships, namely Δx and Δy. Based on these offsets Δx and Δy, the movement devices at the corresponding target positions E and F are controlled to move target position E to the left by Δx and target position F downwards by Δy. Finally, the diagonal error is corrected to restore the target template to its expected shape.
[0076] The embodiments of this application determine the displacement of the distortion by using at least three non-collinear reference points, which can accurately identify different types of errors; then, the edge offset is calculated based on the deformation error, and the offset is corrected to reduce the deformation of the mask during the imprinting process, thereby improving the accuracy of mask and wafer overlay in nanoimprinting in semiconductor processes.
[0077] In some embodiments of this application, the deformation error indicates the deformation ratio of the target template in a certain type; determining the offset of the target position at the edge of the target template according to the deformation ratio includes: determining the offset of the target position at the edge of the target template according to the deformation ratio and the size of the target template.
[0078] For example, the target template patterned area is a 20mm × 15mm quadrilateral, with the four corner points being reference points A(x1,y1), B(x2,y2), C(x3,y3), and D(x4,y4). Based on the actual coordinates, the deformation error is measured to be 1ppm in the X-direction. The target position point located on the patterned quadrilateral with an x-coordinate of 13mm has a unit deformation displacement of 13nm, and so on.
[0079] Deformation error is expressed in units of 1 ppm. For magnified error in the X direction, the point with an x-coordinate of 13 mm on the quadrilateral of the patterned area has a unit deformation displacement of 13 nm. Similarly, the target position E on the edge of the target template has an x-coordinate of 76 mm, and its offset is 76 mm × 1 ppm = 76 nm. This can drive the corresponding force actuator to move point E in the X-76 nm direction.
[0080] The embodiments of this application quantify deformation error by deformation ratio and calculate the offset of edge target position by combining the target template size. It has the advantages of accurate quantification and direct calculation. It can not only adapt to the error correction requirements of templates of different sizes, but also provide clear and traceable quantitative basis for the orientation adjustment of subsequent mobile devices, thereby improving the accuracy and versatility of error correction.
[0081] In some embodiments of this application, controlling the moving device corresponding to the target position to push the target position to move includes: controlling the moving device corresponding to the target position to apply a corresponding force load to the target position to reduce the offset.
[0082] Different types of actuators have different control logics. Some actuators, such as piezoelectric actuators, default to controlling the stroke; different voltages correspond to different strokes. For example, to compensate for a 2μm offset, the corresponding voltage is applied to the piezoelectric actuator, causing it to extend or retract by 2μm. Electromagnetic or electric servo actuators can be selected to control either force or stroke, such as controlling the target distance via pulse signals or controlling the output force via current. Pneumatic or hydraulic actuators control the output force by adjusting air or hydraulic pressure.
[0083] In the embodiments of this application, a correspondence between "error and force load" can be established. For example, if a deformation error of n ppm is detected, the force load corresponding to the unit error can be multiplied by n to directly obtain the required force without repeating complex simulations.
[0084] For example, during the printing process, if the target position E on a certain target template is offset to the right by 2nm to the X direction, the moving device controlling the target position E will apply a force load corresponding to twice the unit error to the target position to reduce the offset.
[0085] The embodiments of this application achieve movement adjustment by applying stress load to the target position, which can directly act on the source of error, efficiently reduce the offset, avoid damage to the target template due to excessive force, and provide reliable execution guarantee for accurate correction of template deformation error.
[0086] In some embodiments of this application, controlling the moving device corresponding to the target position to move the target position includes: controlling the moving device corresponding to the target position to move the target distance to reduce the offset.
[0087] For example, during the imprinting process, a target position F on a certain template is determined to be offset by 2 nm along the Y-axis. The moving device corresponding to the target position F is controlled to extend or retract 2 nm downward along the Y-axis. After the moving device accurately completes the target stroke, the offset of the target position F is reduced to within 0.1 nm, the template deformation error is effectively compensated, and the accuracy requirements of nanoimprinting are met.
[0088] The embodiments of this application control the moving device with the target stroke, which can directly match the quantified offset, correct accurately and efficiently, avoid interference from factors such as template stiffness and contact state, and ensure the consistency and reliability of error correction.
[0089] Based on the above-described template error adjustment method, this application also provides a template error adjustment device. The following will be combined with... Figures 3-6 The device is described in detail.
[0090] An embodiment of this application provides a template error adjustment device, comprising: an installation position for installing a target template; an error identification device for determining the deformation error of the target template based on the offset of at least three reference points on the target template relative to the expected position, wherein the at least three reference points are not collinear, and the deformation error includes at least one of X-direction scaling error, Y-direction scaling error, diagonal error, and trapezoidal error; and at least one moving device disposed at a target position on the edge of the target template for moving the target position on the edge of the target template according to the offset, so as to reduce the offset.
[0091] Figure 3 A schematic diagram of another template error adjustment device according to an embodiment of this application is shown.
[0092] like Figure 3 As shown, the template error adjustment device includes: an installation position for installing the target template 1; an error identification device for determining the deformation error of the target template 1 based on the offset of at least three reference points (A, B, and C) on the target template 1 relative to the expected position, and determining the offset of the target position of the edge of the target template based on the deformation error, wherein the at least three reference points (A, B, and C) are not collinear, and the deformation error includes at least one of X-direction scaling error, Y-direction scaling error, diagonal error, and trapezoidal error; and moving devices 21, 22, 23, and 24. Moving devices 21, 22, 23, and 24 are respectively located at points E, F, G, and H on the edge of the target template 1, and are used to push the edge of the target template to move according to the offset, thereby reducing the offset.
[0093] The embodiments of this application achieve stable fixation of the template by setting the installation position. With the offset detection of at least three non-collinear reference points, deformation types such as X / Y direction scaling, diagonal and trapezoidal errors can be accurately identified. The moving device is set at the edge of the template and can push the target position to move according to the quantified offset, so as to accurately correct the deformation error. Moreover, the device has a simple structure and can adapt to the error adjustment needs of templates of different sizes and types, taking into account the correction accuracy, execution reliability and versatility.
[0094] In some embodiments of this application, the target template is adsorbed onto the installation location by adsorption.
[0095] Figure 4 The illustration shows a schematic diagram of adsorption on the upper surface of a template according to an embodiment of this application.
[0096] like Figure 4 As shown, fused silica was selected as the template material. The target template was a standard 6025 template with dimensions of 152.1mm × 152.1mm × 6.35mm. The top and bottom surfaces of the target template were adsorbed by a suction cup. To reduce the contact area with the suction cup and make subsequent separation easier, the contact surface between the target template and the suction cup consisted of 5 rings 3.
[0097] The constraints are set according to the actual imprinting device: the patterned area of 26mm×33mm on the bottom surface and the five rings on the top surface are in contact, so the displacement in the direction perpendicular to the mask surface is 0.
[0098] The embodiments of this application fix the template to the installation position by adsorption, which can quickly achieve stable positioning of the template. The uniform adsorption force ensures that the template and the installation position are tightly attached without loosening or displacement, providing a stable benchmark for subsequent deformation error detection and error adjustment. At the same time, the adsorption fixing method is adaptable to templates of different sizes and shapes, and the installation and disassembly are convenient and efficient, taking into account both the reliability of fixing and the practicality of operation.
[0099] In some embodiments of this application, at least one edge of the target template is distributed with N mobile devices, where N is a positive integer.
[0100] In the embodiments of this application, N can be, for example, 2, 3, 4, 5, or a larger number. The larger the value, the more moving devices are available, allowing for more detailed adjustments to the target template.
[0101] Figure 5 A schematic diagram of a third template error adjustment device according to an embodiment of this application is shown.
[0102] like Figure 5 As shown, four moving devices are distributed along each side of the target template 1. Specifically, moving devices 1F, 2F, 3F, and 4F are distributed along the front side of the target template 1; moving devices 1B, 2B, 3B, and 4B are distributed along the rear side; moving devices 1L, 2L, 3L, and 4L are distributed along the left side; and moving devices 1R, 2R, 3R, and 4R are distributed along the right side. By specifying the displacement, the reaction forces of the 16 force actuator contact surfaces are obtained. Applying corresponding force loads to the 16 contact surfaces can correct the corresponding amplification or reduction errors.
[0103] The embodiments of this application, due to the distribution of N moving devices on at least one edge of the target template, can achieve precise application of force to the template edge in a segmented and multi-point manner. Compared with the limitation of a single moving device that can only push the entire template, this approach can specifically adapt to the offset of different positions on the edge, ensuring that the error in each area can be accurately targeted and corrected, avoiding the omission of local deviations. Furthermore, the value of N can be flexibly adjusted according to the length of the template edge and the error distribution density, adapting to the adjustment needs of templates of different sizes and error types, thus exhibiting strong versatility. At the same time, the multi-point coordinated application of force can balance the stress state of the template edge, avoiding secondary deformation of the template caused by concentrated force at a single point, improving the stability and uniformity of error correction, and ensuring the overall deformation correction effect of the template.
[0104] In some embodiments of this application, N is greater than or equal to 3, and the spacing between the N mobile devices is equal.
[0105] In the example above, the spacing between mobile devices 1R and 2R, 2R and 3R, and 3R and 4R can be set to be the same.
[0106] The multi-point uniform layout of this application can fully cover the edge of the template, accurately match edge differential offsets caused by scaling, trapezoidal errors, etc., and avoid omission of local deviations; the equal spacing design can make the force application more uniform, balance the stress state of the template edge, effectively avoid stress concentration and secondary deformation caused by single-point or non-uniform force distribution, and ensure correction stability; the N≥3 configuration provides sufficient adjustment freedom, and can achieve fine error compensation through multi-point collaborative force application, which can improve the correction accuracy compared with a few moving devices; at the same time, this layout is adapted to template edges of different lengths without the need for additional adjustment of the spacing ratio, simplifying the device design and adaptation process, and taking into account the adjustment effect, operation convenience and versatility.
[0107] In some embodiments of this application, the template error adjustment device further includes: at least one pair of elastic devices; at least one pair of elastic devices are disposed on opposite sides of the target template for applying elastic force to the edge of the target template.
[0108] For simulations of unconstrained parts, spring bases can be selected to suppress the motion of rigid bodies. For example, spring constraints can be applied to opposite edges with a spring constant of 50 mN / mm. This feature introduces an additional stiffness to the degrees of freedom of the structural model relative to its undeformed position, causing it to deform without translation or rotation.
[0109] The embodiments of this application provide uniform preload to the template through symmetrical elasticity, ensuring that the template maintains a stable posture before and after error adjustment, avoiding positional displacement caused by the force applied by the moving device or the release of stress on the template itself, thus laying a stable foundation for accurate error correction. At the same time, the elastic force can buffer the impact of the force applied by the moving device, balance the force distribution at the edges, effectively avoid secondary deformation of the template caused by concentrated force at a single point, and ensure the stability of the correction process. In addition, the adaptive elasticity of the elastic device can adapt to the slight deformation of the template during the adjustment process, assisting the moving device to achieve fine error compensation, and the symmetrical layout is not limited to templates of specific sizes or error types, further improving the adaptability and adjustment reliability of the device, and taking into account the dual requirements of stable support and flexible compensation.
[0110] In some embodiments of this application, the elastic device is disposed at the midpoint of the edge of the target template.
[0111] Figure 6 A schematic diagram of a fourth template error adjustment device according to an embodiment of this application is shown.
[0112] like Figure 6 As shown, elastic devices 41, 42, 43 and 44 are respectively provided at the midpoint of the edge of the target template 1.
[0113] The embodiments of this application can provide balanced elastic force by applying force at the symmetrical midpoint, accurately balance the stress distribution of the multi-point force application of the moving device, avoid secondary deformation of the template, enhance the pre-tightening stability effect, assist in achieving fine error correction, and have a simple structure and strong adaptability.
[0114] The template error adjustment device of this application embodiment can realize a simple, fast, and low-cost alignment scheme. Compared with self-aligned dual patterning (DSA) and directional self-assembly (SADP) technologies, this application embodiment abandons the complex multi-process cycle and precision self-assembly environment constraints. It directly optimizes the imprinting overlay accuracy by controlling the mask mechanical deformation in real time, significantly simplifying the process flow and reducing dependence on special materials, and is widely adaptable to various random logic patterns. Compared with extreme ultraviolet lithography (EUVL) schemes, this application embodiment can fully reuse existing ultraviolet exposure architecture and standard mask systems, avoiding the investment requirements and capacity limitations of high-power light sources, maintaining high throughput characteristics with economical and efficient equipment modification, and meeting the core requirements of large-scale semiconductor manufacturing. Compared with the inherent limitation of electron beam direct writing (EBL) technology, where the mask pattern cannot be dynamically adjusted once written, this application embodiment can use a closed-loop control algorithm combined with real-time alignment mark feedback to dynamically correct template distortion, providing an overlay control method for the imprinting process that combines accuracy and economy.
[0115] A more specific embodiment of the template error adjustment device using the above embodiments is as follows.
[0116] Fused silica was selected as the template material to construct a standard 6025 template measuring 152.1mm × 152.1mm × 6.35mm. First, the magnitude of eight alignment deviation unit deformations was calculated based on the x / y offsets of four points in a patterned area of 26mm × 33mm on the target template mask. Figures 1A-1H As shown. The contact surfaces of 16 force actuators are evenly and uniformly distributed laterally on the target template. Figure 5 As shown. Five rings are designed on the upper surface of the template. Due to contact between the five rings on the upper surface and the 26mm × 33mm patterned area on the lower surface, the displacement in the z-direction is set to 0. The negative pressure in the area between the rings is set to -900kPa. Figure 4 As shown, a specified displacement is set on the contact surface of the force actuator so that the five types of deformation in the 26mm×33mm area are all unit deformations of 1ppm, and 16 reaction forces on the contact surface of the force actuator are obtained. Finally, based on the four reference points of the mask pattern, five types of deformation errors are obtained, and corresponding forces are applied to the force actuator to complete the deformation correction of the overlay.
[0117] Based on the above-mentioned template error adjustment device, this application also provides a nanoimprinting device, which includes any of the above template error adjustment devices.
[0118] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in a block diagram or flowchart, and combinations of blocks in a block diagram or flowchart, may be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.
[0119] Those skilled in the art will understand that the features described in the various embodiments of this application can be combined and / or combined in various ways, even if such combinations or combinations are not explicitly described in this application. In particular, the features described in the various embodiments of this application can be combined and / or combined in various ways without departing from the spirit and teachings of this application. All such combinations and / or combinations fall within the scope of this application.
Claims
1. A template error adjustment method characterized by, include: The deformation error of the target template is determined based on the offset of at least three reference points on the target template relative to the expected position, wherein the at least three reference points are not collinear, and the deformation error includes at least one of X-direction scaling error, Y-direction scaling error, diagonal error and trapezoidal error. The offset of the target position at the edge of the target template is determined based on the deformation error; Based on the offset, control the moving device corresponding to the target position to move the target position.
2. The method according to claim 1, characterized in that, The deformation error indicates the deformation ratio of the target template in that type; The step of determining the offset of the target template edge target position based on the deformation ratio includes: The offset of the target position at the edge of the target template is determined based on the deformation ratio and the size of the target template.
3. The method according to claim 1 or 2, characterized in that, The control of the moving device corresponding to the target position to move the target position includes: The moving device corresponding to the target position is controlled to apply a corresponding force load to the target position in order to reduce the offset.
4. The method according to claim 1 or 2, characterized in that, The control of the moving device corresponding to the target position to move the target position includes: The moving device corresponding to the target position is controlled to move the target distance by a certain distance to reduce the offset.
5. A template error adjustment device, characterized in that, include: The installation location for installing the target template; An error identification device is used to determine the deformation error of the target template based on the offset of at least three reference points on the target template relative to the expected position, and to determine the offset of the target position of the edge of the target template based on the deformation error, wherein the at least three reference points are not collinear, and the deformation error includes at least one of X-direction scaling error, Y-direction scaling error, diagonal error and trapezoidal error. as well as At least one moving device is provided at a target position on the edge of the target template, for moving the target position on the edge of the target template according to the offset, so as to reduce the offset.
6. The apparatus according to claim 5, characterized in that, The target template is adsorbed onto the installation location by an adsorption method.
7. The apparatus according to claim 5, characterized in that, The target template has at least one edge on which N mobile devices are distributed, where N is a positive integer.
8. The apparatus according to claim 7, characterized in that, The N is greater than or equal to 3, and the spacing between the N mobile devices is equal.
9. The apparatus of claim 5, wherein, Also includes: At least one pair of elastic devices; The at least one pair of elastic devices are disposed on opposite sides of the target template and are used to apply elastic force to the edge of the target template.
10. The apparatus of claim 9, wherein, The elastic device is located at the midpoint of the edge of the target template.
11. A nanoimprint apparatus characterized by comprising: It includes the template error adjustment device according to any one of claims 4 to 9.