Display module and electronic device

Abstract

This application provides a display module and an electronic device. The display module includes a panel layer, a first support layer, and a second support layer. The panel layer includes a first flat region, a bent region, and a second flat region connected in sequence. The bent region includes a first sub-region, a second sub-region, and a third sub-region connected in sequence. The first sub-region is bent towards the third sub-region. The first support layer is made of a metal material and is fixed to the side of the first flat region near the second flat region, with a portion located between the first and second flat regions. The second support layer includes a first support portion, a second support portion, and a third support portion connected in sequence. The first support portion is fixedly connected between the first flat region and the first support layer. The second support portion is fixedly connected to the first, second, and third sub-regions of the bent region. The third support portion is fixedly connected between the second flat region and the first support layer. The display module has a small thickness and high reliability.

Description

Technical Field

[0001] This application relates to the field of display device technology, and in particular to a display module and electronic device. Background Technology

[0002] With the development of technology and the demands of the electronic device market, users have increasingly higher requirements for large-screen displays on electronic devices. Traditional electronic devices generally include a display module, which is used to display images. Due to the unreasonable structural design of the display module, when it is applied to electronic devices, both the display module and the electronic device are relatively thick, making it impossible to achieve a thinner design for both. Summary of the Invention

[0003] This application provides a display module and electronic device that can balance a thin profile with high reliability.

[0004] In a first aspect, this application provides a display module. The display module includes a panel layer, a first support layer, and a second support layer; the panel layer includes a first flat area, a bent area, and a second flat area connected in sequence, the second flat area being disposed opposite to a portion of the first flat area, and the bent area being bent; the bent area includes a first sub-area, a second sub-area, and a third sub-area connected in sequence, the first sub-area being connected to the first flat area, the third sub-area being connected to the second flat area, the first sub-area and the third sub-area being disposed opposite to each other, the first sub-area being bent toward the third sub-area, and the second sub-area being bent away from the first sub-area and the third sub-area; the first support layer is made of a metallic material, the first support layer is fixed to the side of the first flat area near the second flat area, and a portion of it is located between the first flat area and the second flat area; the second support layer is made of an insulating material, the second support layer includes a first support portion, a second support portion, and a third support portion connected in sequence, the first support portion being fixedly connected between the first flat area and the first support layer, the second support portion being fixedly connected to the first sub-area, the second sub-area, and the third sub-area of ​​the bent area, and the third support portion being fixedly connected between the second flat area and the first support layer.

[0005] Understandably, the second support layer provides better support for the panel layer, which helps improve the reliability of the panel layer and, consequently, the reliability of the display module. The first support layer, through the second support layer, provides better support for the panel layer, further enhancing its reliability and thus contributing to the overall reliability of the display module.

[0006] Understandably, by setting the second flat area relative to the first flat area, it is beneficial to reduce the black border at the bottom of the display module, resulting in a better visual experience for the user.

[0007] Understandably, by bending the first sub-region closer to the third sub-region, the bending radius of the bending area is less likely to be significantly reduced, resulting in higher reliability of the bending area, as well as higher reliability of the panel layer and display module. Furthermore, by bending the first sub-region closer to the third sub-region, the thickness of the first support layer and the display module is reduced, which facilitates a thinner display module design.

[0008] In one possible implementation, the third sub-region bends toward the direction of the first sub-region.

[0009] Understandably, by setting the third sub-region to bend closer to the first sub-region, the bending radius of the bending area is less likely to be significantly reduced, resulting in higher reliability of the bending area, as well as higher reliability of the panel layer and display module. Furthermore, by setting the third sub-region to bend closer to the first sub-region, the thickness of the first support layer is smaller, which is beneficial for achieving a thinner display module.

[0010] In one possible implementation, the ratio of the thickness T1 of the first support layer to the bending radius R of the second sub-region satisfies: 1 / 6 ≤ T1 / R ≤ 1 / 2.

[0011] Understandably, by setting the ratio of the thickness T1 of the first support layer to the bending radius R of the second sub-region within the range of 1 / 6 to 1 / 2, on the one hand, the thickness of the first support layer is smaller, which is conducive to the thinner design of the display module, thereby facilitating the thinner design of the electronic device and providing a better user grip experience; on the other hand, the bending radius of the second sub-region is less likely to decrease significantly, and the metal traces in the bending area are less likely to break or develop micro-cracks, resulting in higher reliability of the bending area. Furthermore, the panel layer is less likely to experience bright lines or touch failures, leading to higher reliability of the display module and a better user experience.

[0012] In one possible implementation, the ratio of the thickness T1 of the first support layer to the bending radius R of the second sub-region satisfies: 1 / 6 ≤ T1 / R ≤ 1 / 3.

[0013] Understandably, by setting the ratio of the thickness T1 of the first support layer to the bending radius R of the second sub-region within the range of 1 / 6 to 1 / 3, on the one hand, the smaller thickness of the first support layer facilitates the thinner design of the display module, thereby contributing to the thinner design of the electronic device and providing a better user grip experience; on the other hand, the bending radius of the second sub-region is less likely to decrease significantly, and the metal traces in the bending area are less likely to break or develop micro-cracks, resulting in higher reliability of the bending area. Furthermore, the panel layer is less prone to issues such as bright lines or touch failures, leading to higher reliability of the display module and a better user experience.

[0014] In one possible implementation, the thickness T1 of the first support layer satisfies: 0.1mm≤T1≤0.35mm.

[0015] Understandably, by setting the thickness T1 of the first support layer within the range of 0.1mm to 0.35mm, the thickness of the first support layer is relatively small, resulting in a smaller display module thickness, which is beneficial for achieving a thinner display module design. Furthermore, while achieving a thinner display module design, the supporting performance of the first support layer is less likely to experience a significant decrease, leading to higher reliability of the display module.

[0016] In one possible implementation, the thickness T1 of the first support layer satisfies: 0.1mm≤T1≤0.2mm.

[0017] Understandably, by setting the thickness T1 of the first support layer to within the range of 0.1mm to 0.2mm, the thickness of the first support layer is relatively small, resulting in a smaller display module thickness, which is beneficial for achieving a thinner display module design. Furthermore, while achieving a thinner display module design, the supporting performance of the first support layer is less likely to experience a significant decrease, leading to higher reliability of the display module.

[0018] In one possible implementation, the elastic modulus K of the first support layer satisfies: 100Gpa≤K≤200Gpa.

[0019] It is understandable that the first support layer has a large elastic modulus and a large hardness, so while achieving the thinning of the first support layer, the support performance of the first support layer is good.

[0020] In one possible implementation, the material of the first support layer includes aluminum, steel, copper, or carbon fiber.

[0021] It is understandable that by setting the material of the first support layer to include aluminum, steel, copper or carbon fiber, the first support layer can be thinned while maintaining high strength and good support performance.

[0022] In one possible implementation, the thickness T2 of the second support layer satisfies: 0.05mm≤T2≤0.15mm.

[0023] Understandably, by setting the thickness T2 of the second support layer within the range of 0.05mm to 0.15mm, the thickness of the second support layer is relatively small, resulting in a smaller display module thickness, which is beneficial for achieving a thinner display module design. Furthermore, while achieving a thinner display module design, the support performance of the second support layer is less likely to experience a significant decrease, leading to higher reliability of the display module.

[0024] In one possible implementation, the second support portion includes a first surface and a second surface disposed opposite to each other; the second support portion is provided with a through hole, which forms an opening on the first surface, the second surface, or the first surface and the second surface.

[0025] Understandably, the through-holes in the second support section can reduce its stiffness and decrease the rebound stress generated during bending, thereby preventing cracking or even breakage. The second support section provides better support for the bending area of ​​the panel layer, thus improving the reliability of the panel layer and the display module. Furthermore, the through-holes do not easily reduce the support performance of the second support section in the bending area, allowing it to provide better support and protection.

[0026] In one possible implementation, the through-hole is strip-shaped.

[0027] Understandably, the roughly strip-shaped through-hole can reduce the stiffness of the second support and reduce the rebound stress generated when the second support is bent, thereby avoiding cracking or even breakage of the second support. The second support provides better support for the bending area of ​​the panel layer, thereby improving the reliability of the panel layer and the display module.

[0028] In one possible implementation, the through-hole extends parallel to the central axis of the bend.

[0029] Understandably, by setting the extension direction of the through hole to be approximately parallel to the central axis of the bending area, the extension direction of the through hole can also be approximately parallel to the central axis of the second support. In this way, the through hole reduces the rebound stress during bending of the second support while minimizing its impact on the bending direction, thus ensuring higher reliability of the second support.

[0030] In one possible implementation, the plurality of through holes includes a first through hole group and a second through hole group arranged at intervals along a first direction; the first through hole group includes a plurality of first through holes arranged at intervals along a second direction, and the second through hole group includes a plurality of second through holes arranged at intervals along a second direction, wherein at least a portion of a first through hole is directly opposite the region between two adjacent second through holes, wherein the first direction is different from the second direction.

[0031] It is understandable that the first through hole of the first through hole group and the second through hole of the second through hole group can be arranged alternately and staggered, and the second support has good bendability and flexibility.

[0032] In one possible implementation, the distance H between the surface of the first flat region away from the first support layer and the surface of the second flat region away from the first support layer satisfies: 1.2mm≤H≤1.65mm.

[0033] It is understandable that by setting the distance H between the surface of the first flat region away from the first support layer and the surface of the second flat region away from the first support layer to be in the range of 1.2mm to 1.65mm, the distance between the surface of the first flat region away from the first support layer and the surface of the second flat region away from the first support layer is small, which is beneficial to achieving a thinner display module.

[0034] In one possible implementation, the display module further includes a polarizer, which is fixedly connected to the first flat region and located on the side of the first flat region away from the second flat region; in the second direction, at least a portion of the polarizer is disposed opposite to the first sub-region.

[0035] It is understandable that, since the polarizer can be set opposite to the first sub-region, when the display module is applied to an electronic device, the polarizer and the first sub-region can overlap in the thickness direction (i.e., the Z-axis direction) of the electronic device. The polarizer has a high space utilization rate in the thickness direction of the electronic device, and the polarizer can occupy less space in the thickness direction of the electronic device, which is conducive to realizing the thinner setting of the display module and the electronic device.

[0036] In one possible implementation, the display module further includes a cover plate and optical adhesive, the cover plate being fixedly connected to the polarizer by the optical adhesive and located on the side of the polarizer away from the first flat area.

[0037] Understandably, the optical adhesive secures the cover plate to the polarizer, helping to ensure the structural stability of the display module. Both the optical adhesive and the cover plate have high light transmittance, allowing light to pass through them to a greater extent, reducing light loss. This results in clearer images, more realistic colors, and a better visual experience for the user. Furthermore, the cover plate effectively prevents scratches, wear, and other physical damage to other parts of the display module. It also acts as a buffer, preventing dust, moisture, and other foreign objects from entering the display module or the electronic device when the display module is used.

[0038] In one possible implementation, in the second direction, at least a portion of the optical adhesive is disposed opposite to the first sub-region.

[0039] Understandably, since the optical adhesive can be positioned opposite the first sub-region, when the display module is applied to an electronic device, the optical adhesive and the first sub-region can overlap in the thickness direction (i.e., the Z-axis direction) of the electronic device. The optical adhesive has a high space utilization rate in the thickness direction of the electronic device, occupying less space and thus facilitating the thinning of both the display module and the electronic device. As shown in the figure, exemplarily, the display driver chip can be fixedly connected to the second flat region and located on the side of the second flat region away from the first support layer.

[0040] In one possible implementation, the first flat area is the display area of ​​the panel layer, and the bent area and the second flat area are the non-display areas of the panel layer.

[0041] It is understandable that the second flat area can be fixedly connected to the first flat area via a bending area, and is also electrically connected. The first flat area enables the display function of the panel layer.

[0042] In one possible implementation, a portion of the first flat area and the bent area constitutes the display area of ​​the panel layer, while the other portion of the bent area and the second flat area constitute the non-display area of ​​the panel layer.

[0043] It is understandable that the second flat area can be fixedly connected to the first flat area via the bending area, and is also electrically connected. A portion of the first flat area and the bending area can realize the display function of the panel layer.

[0044] In one possible implementation, the display module further includes a display driver chip, which is fixedly connected to the second flat area and located on the side of the second flat area away from the first support layer.

[0045] It is understandable that the display driver chip can be fixedly connected and electrically connected to the panel layer. When the display module is applied to electronic devices, the display driver chip can receive digital signals from the central processing unit of the electronic device and convert them into voltage or current signals required by the panel layer, thereby realizing the display of the panel layer.

[0046] Secondly, this application provides an electronic device. The electronic device includes a mid-frame and the aforementioned display module, the display module being fixedly connected to the mid-frame.

[0047] It is understandable that electronic devices can achieve a thin design, and the display modules of electronic devices have high reliability.

[0048] In one possible implementation, the middle frame includes a middle plate and a frame, the frame surrounds the middle plate and is fixedly connected to the middle plate, the display module is fixedly connected to the frame and is disposed opposite to the middle plate; the middle plate has a clearance space; the display module also includes a display driver chip, the display driver chip is fixedly connected to a second flat area and is located on the side of the second flat area away from the first support layer; the display driver chip is located outside the clearance space and is disposed opposite to the clearance space, or at least part of the display driver chip is located inside the clearance space.

[0049] Understandably, since the display driver chip is located on the side of the display module closer to the mid-frame, the clearance space prevents physical interference between the display driver chip and the mid-frame, ensuring proper installation of the display driver chip and avoiding negative impacts on the normal display function of the display module. Furthermore, since the mid-frame is generally made of metal, the clearance space allows for a larger distance between the display driver chip and the mid-frame, preventing the metal material of the mid-frame from interfering with the electrical signals transmitted by the display driver chip. This prevents display malfunctions and improves the reliability of the display module.

[0050] Understandably, the clearance space ensures the reliability of the display driver chip while also reducing the thickness of the display module at the display driver chip location, which is beneficial for achieving a thinner design of electronic devices.

[0051] In one possible implementation, the middle frame includes a middle plate and a frame, the frame surrounds the middle plate and is fixedly connected to the middle plate, the display module is fixedly connected to the frame and is disposed opposite to the middle plate; the middle plate has a clearance space; the display module also includes a display driver chip, the display driver chip is fixedly connected to a second flat area and is located on the side of the second flat area away from the first support layer; at least a portion of the display driver chip is located within the clearance space.

[0052] Understandably, by positioning at least a portion of the display driver chip within the clearance space, and maintaining a relatively large distance between the display driver chip and the mid-frame, the clearance space prevents physical interference between the display driver chip and the mid-frame, thus ensuring proper installation of the display driver chip and avoiding negative impacts on the normal display function of the display module. Furthermore, it prevents the metal material of the mid-frame from interfering with the electrical signals transmitted by the display driver chip, thereby preventing display malfunctions and contributing to the reliability of the display module.

[0053] Understandably, the clearance space ensures the reliability of the display driver chip while also reducing the thickness of the display module at the display driver chip location, which is beneficial for achieving a thinner design of electronic devices.

[0054] In one possible implementation, the electronic device further includes a circuit board mounted on the mid-frame, with the second flat area electrically connected to the circuit board.

[0055] Understandably, the second flat area can be electrically connected to the circuit board, and the panel layer can realize the display function. Attached Figure Description

[0056] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0057] Figure 2 yes Figure 1 The illustrated electronic device is shown in a partially exploded view according to one embodiment.

[0058] Figure 3 yes Figure 1 A partial cross-sectional schematic diagram of one embodiment of the electronic device shown at line AA;

[0059] Figure 4 yes Figure 2 The diagram shows a partial structural view of the display module from another angle.

[0060] Figure 5 yes Figure 4 The diagram shown is a top view of one embodiment of the display module;

[0061] Figure 6 yes Figure 4 The diagram shows a side view of the display module in one embodiment;

[0062] Figure 7 yes Figure 1 A partial cross-sectional schematic diagram of one embodiment of the electronic device shown at the BB line;

[0063] Figure 8 yes Figure 2 The diagram shown is a partially exploded view of another embodiment of the display module.

[0064] Figure 9 yes Figure 1 A partial cross-sectional schematic diagram of another embodiment of the electronic device shown at the BB line;

[0065] Figure 10 yes Figure 8 The diagram shown is a partial structural schematic of the second support layer in one embodiment.

[0066] Figure 11 yes Figure 1 A partial cross-sectional schematic diagram of another embodiment of the electronic device shown at the BB line. Detailed Implementation

[0067] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.

[0068] In the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation," "connection," "joining," and "joining" should be interpreted broadly. For example, "joining" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be an electrical connection or a mechanical connection. "Fixed connection" refers to a connection where the relative positional relationship remains unchanged after the connection. Furthermore, the integrated structure obtained by a one-piece molding process means that during the formation of one of the two components, that component is connected to the other component without requiring further processing (such as bonding, welding, snap-fit ​​connection, or screw connection). The relative arrangement of components A and B can be such that component A is projected along the target direction to obtain projection C, and component B is projected along the target direction to obtain projection D, with projection C and projection D at least largely overlapping. In some embodiments, this substantial overlap can be any of the following: projection C is completely within projection D; or projection D is completely within projection C; or projection C and projection D intersect each other, and the intersection area of ​​projection C and projection D accounts for more than 50% of projection C or projection D.

[0069] The directional terms mentioned in the embodiments of this application, such as "bottom," "inner," and "outer," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0070] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship. "Multiple" means at least two.

[0071] Furthermore, the limitations on relative positional relationships mentioned in the embodiments of this application, such as parallelism, are all relative to the current technological level and are not absolutely strict limitations. Slight deviations are allowed, and approximation of parallelism is acceptable. For example, A and B being parallel means that A and B are parallel or approximately parallel, and the angle between A and B can be between 0 degrees and 10 degrees.

[0072] Figure 1 This is a schematic diagram of the structure of an electronic device 1000 provided in an embodiment of this application.

[0073] like Figure 1 As shown, the electronic device 1000 can be a mobile phone, tablet personal computer, laptop computer, personal digital assistant (PDA), camera, personal computer, laptop computer, in-vehicle equipment, wearable device, augmented reality (AR) glasses, AR helmet, virtual reality (VR) glasses, or VR helmet, etc., that has a display module 100. Figure 1 The electronic device 1000 of the embodiment shown is illustrated using a mobile phone as an example.

[0074] It is understood that, for ease of description, the width direction of the electronic device 1000 is defined as the X-axis, the height direction as the Y-axis, and the thickness direction as the Z-axis. For example, the X-axis is defined as the first direction, the Y-axis as the second direction, and the Z-axis as the third direction, where the first, second, and third directions are different from each other. In other embodiments, the first, second, and third directions can be flexibly set according to requirements, ensuring that they are different from each other.

[0075] Figure 2 yes Figure 1 The illustrated electronic device 1000 is shown in a partially exploded view according to one embodiment.

[0076] like Figure 1 and Figure 2 As shown, the electronic device 1000 may include a display module 100, a mid-frame 200, a back cover 300, and a circuit board 400. It is understood that... Figure 1 , Figure 2 The accompanying drawings below only schematically illustrate some components included in the electronic device 1000; the actual shape, size, location, and construction of these components are not subject to change. Figure 1 , Figure 2As defined in the accompanying drawings below. In other embodiments, the electronic device 1000 may include more or fewer structures. For example, when the electronic device 1000 includes more structures, it may also include a camera module (not shown).

[0077] Figure 3 yes Figure 1 A partial cross-sectional view of one embodiment of the electronic device 1000 shown at line AA.

[0078] Please see Figure 3 and combined Figure 1 and Figure 2 As shown, exemplarily, the display module 100 can be fixedly connected to the mid-frame 200 and is located on one side of the mid-frame 200. It is understood that the mid-frame 200 can be used to support the display module 100.

[0079] For example, the back cover 300 can be fixedly connected to the middle frame 200 and is located on the side of the middle frame 200 away from the display module 100.

[0080] For example, the circuit board 400 can be mounted on the mid-frame 200. The display module 100 can be electrically connected to the circuit board 400. The circuit board 400 can be the main board of the electronic device 1000 or a sub-board of the electronic device 1000. Specifically, this application does not limit the scope.

[0081] For example, the display module 100 can be fixedly connected to the middle frame 200 by a dispensing process. The back cover 300 can also be fixedly connected to the middle frame 200 by a dispensing process. In other embodiments, the display module 100 can be fixedly connected to the middle frame 200 by other processes. The back cover 300 can also be fixedly connected to the middle frame 200 by other processes. This application does not specifically limit the details.

[0082] It is understood that this embodiment describes the structure of the middle frame 200 and the back cover 300 in one embodiment, but this does not affect the fact that the middle frame 200 and the back cover 300 can also have other configurations. For example, the middle frame 200 and the back cover 300 can be an integrally formed structure. Specifically, this application does not limit the specific configuration.

[0083] For example, the display module 100 and the mid-frame 200 can enclose a receiving space 500 for the electronic device 1000. The electronic device 1000 may also include functional components (not shown). The functional components may be located within the receiving space 500. These functional components may be proximity sensors, batteries, speakers, or other devices with specific functions. This application does not limit the specific structure of the functional components.

[0084] For example, the middle frame 200 may include a middle plate 21 and a side frame 22. The side frame 22 may be disposed around the middle plate 21 and fixedly connected to the middle plate 21.

[0085] For example, the display module 100 can be fixedly connected to the bezel 22 and disposed opposite to the middle plate 21.

[0086] Figure 4 yes Figure 2 The diagram shows a partial structural view of the display module 100 from another angle. Figure 5 yes Figure 4 The display module 100 shown is illustrated in a top view of one embodiment. Figure 6 yes Figure 4 The display module 100 shown is a side view schematic diagram of one embodiment.

[0087] like Figures 4 to 6 As shown, by way of example, the display module 100 may include a display section 100a, a bending section 100b, and a terminal section 100c connected in sequence.

[0088] For example, the display unit 100a may include a display surface 101a and a non-display surface 102a disposed opposite to each other. The display surface 101a of the display unit 100a can be used to display images.

[0089] For example, the terminal portion 100c may be located on the side of the display portion 100a facing away from the display surface 101a, and disposed opposite to a portion of the non-display surface 102a of the display portion 100a. It is understood that bending the terminal portion 100c to the side of the non-display surface 102a of the display portion 100a helps to narrow the black border of the display module 100, resulting in a better user experience.

[0090] For example, the bending portion 100b is bendable, and the bending portion 100b can realize the connection between the display portion 100a and the terminal portion 100c. It is understood that the shape of the bending portion 100b can be approximately teardrop-shaped.

[0091] For example, the display module 100 may further include a peripheral wiring portion 100d. The peripheral wiring portion 100d may be disposed around the display portion 100a and fixedly connected to the bending portion 100b and the terminal portion 100c.

[0092] In other embodiments, the structure of the display module 100 is not specifically limited.

[0093] The preceding text, with reference to the accompanying drawings, provided a detailed description of the general structure of the electronic device 1000 and the display module 100. It is understandable that users can choose to touch or press the display module 100 as a way to operate the electronic device 1000; therefore, the reliability of the display module 100 is an important factor of concern for users. The following text, with reference to the accompanying drawings, illustrates the structure of a display module 100.

[0094] Figure 7 yes Figure 1 A partial cross-sectional view of one embodiment of the electronic device 1000 at the BB line.

[0095] like Figure 7 As shown, for example, the display module 100 may include a panel layer 10, a first support layer 20, a second support layer 30, and a display driver integrated circuit (DDIC) 70.

[0096] The following will describe in detail one structural embodiment of the panel layer 10, the first support layer 20, and the second support layer 30 with reference to the accompanying drawings.

[0097] For example, panel layer 10 may include a first flat area 11, a bent area 12, and a second flat area 13 connected in sequence. The second flat area 13 may be disposed opposite to a portion of the first flat area 11. The bent area 12 may be bent and may be generally U-shaped.

[0098] For example, the thickness T1 of the first support layer 20 satisfies: 0.9 mm ≤ T1 ≤ 1.5 mm. For instance, T1 can be equal to 0.9 mm, 0.95 mm, 1 mm, 1.2 mm, 1.38 mm, or 1.5 mm, etc. It is understood that the thickness of the first support layer 20 needs to be relatively large to ensure that the first support layer 20 has sufficient strength.

[0099] like Figure 7 As shown, by way of example, the first support layer 20 can be fixed to the side of the first flat area 11 near the second flat area 13, and a portion of the first support layer 20 can be located between the first flat area 11 and the second flat area 13.

[0100] For example, the ratio of the thickness T1 of the first support layer 20 to the bending radius R of the bending region 12 can satisfy: 1 ​​< T1 / R < 2. For example, T1 / R can be equal to 1.1, 1.2, 1.5, 1.7 or 1.8, etc.

[0101] like Figure 7As shown, by way of example, the second support layer 30 may include a first segment 30a and a second segment 30b that are separately disposed. The first segment 30a may be fixedly connected between the first flat area 11 and the first support layer 20, and the second segment 30b may be fixedly connected between the second flat area 13 and the first support layer 20.

[0102] like Figure 7 As shown, the display driver chip 70 can be fixedly connected to the side of the second flat area 13 of the panel layer 10 away from the first support layer 20, and is disposed opposite to the middle plate 21. It is understandable that in order to provide space for the display driver chip 70, the middle plate 21 needs to have a clearance area, resulting in a larger distance between the middle plate 21 and the display driver chip 70. However, the reliability of the middle plate 21 is reduced after setting the clearance area. If the thickness of the middle plate 21 is increased to improve its reliability, the thickness of the electronic device 1000 will be even greater, meaning that the thickness of the electronic device 1000 cannot be reduced.

[0103] Understandable, Figure 7 The first support layer 20 shown provides good support for the panel layer 10. Furthermore, due to the large bending radius of the bending area 12, the metal traces within the bending area 12 are less prone to breakage, resulting in higher reliability of the display module 100 and thus solving the reliability problem of the display module 100. However, regarding... Figure 7 The support scheme for the display module 100 shown also has some technical issues. These are detailed below.

[0104] (1) The thickness of the first support layer 20 along the thickness direction (i.e., the Z-axis direction) of the electronic device 1000 is relatively large, and the thickness of the display module 100 is also relatively large, making it impossible to achieve a thinner electronic device 1000.

[0105] (2) The two-section structure of the second support layer 30 cannot provide support for the bending area 12 of the panel layer 10, which reduces the reliability of the bending area 12, and also reduces the reliability of the display module 100 and the electronic device 1000.

[0106] To address the technical issues raised above, the following section will provide a more detailed description of the structure of the display module 100, in conjunction with relevant accompanying drawings. The details are as follows.

[0107] First implementation method: Please refer to Figure 8 and Figure 9 , Figure 8 yes Figure 2 The diagram shown is a partially exploded view of the display module 100 in another embodiment. Figure 9 yes Figure 1 A partial cross-sectional schematic diagram of another embodiment of the electronic device 1000 shown at the BB line.

[0108] For example, the display module 100 may include a panel layer 10, a first support layer 20, a second support layer 30, a polarizer 40 (POL), a cover glass 50 (CG), an optically clear adhesive 60 (OCA), and a display driver integrated circuit 70 (DDIC). It is understood that... Figure 8 , Figure 9 The accompanying drawings below only schematically illustrate some components included in the display module 100; the actual shape, size, position, and construction of these components are not subject to change. Figure 8 , Figure 9 As defined in the accompanying drawings below. In other embodiments, the display module 100 may include more or fewer structures. For example, when the display module 100 includes more structures, it may also include a protective layer (not shown). When the display module 100 includes fewer structures, it may also omit the second support layer 30.

[0109] The following section will describe another structural implementation of the panel layer 10, the first support layer 20, and the second support layer 30 in conjunction with the relevant accompanying drawings.

[0110] For example, panel layer 10 can be an organic light-emitting diode (OLED) display panel, an active-matrix organic light-emitting diode (AMOLED) display panel, or the like. This application does not limit the specific type of panel layer 10.

[0111] like Figure 9 As shown, exemplarily, panel layer 10 may include a first flat region 11, a bent region 12, and a second flat region 13 connected in sequence. It is understood that... Figure 9 The first flat region 11, the bent region 12, and the second flat region 13 are only schematically separated by dashed lines. In other embodiments, the first flat region 11, the bent region 12, and the second flat region 13 may also adopt other arrangements. This application does not limit the specific arrangements.

[0112] For example, the first flat area 11 can be the display area of ​​the panel layer 10, and the bending area 12 and the second flat area 13 can be the non-display area of ​​the panel layer 10.

[0113] It is understood that the second flat area 13 can be fixedly connected to the first flat area 11 via the bending area 12, and is also electrically connected. Furthermore, the second flat area 13 is connected to the circuit board 400 (see [link to circuit board 400]). Figure 3 Electrical connection, so that the first flat area 11 can be electrically connected to the circuit board 400 through the bending area 12 and the second flat area 13, and the first flat area 11 can realize the display function of the panel layer 10.

[0114] In some embodiments, a portion of the first flat area 11 and the bending area 12 may be the display area of ​​the panel layer 10, and the other portion of the bending area 12 and the second flat area 13 may be the non-display area of ​​the panel layer 10.

[0115] It is understood that the second flat region 13 can be fixedly connected to and electrically connected to the first flat region 11 via the bending region 12. Furthermore, the second flat region 13 can be connected to the circuit board 400 (see [link to circuit board 400]). Figure 3 Electrical connection, so that the first flat area 11 can be electrically connected to the circuit board 400 through the bending area 12 and the second flat area 13, and a part of the first flat area 11 and the bending area 12 can realize the display function of the panel layer 10.

[0116] In other embodiments, the display area and non-display area of ​​panel layer 10 can be configured in other ways. This application does not impose specific limitations on this.

[0117] Exemplarily, the second flat region 13 may be disposed opposite to a portion of the first flat region 11, and the bending region 12 may be bent, with the central axis of the bending region 12 being parallel to the first direction (i.e., the X-axis direction). In one embodiment, the bending region 12 of the panel layer 10 may be generally teardrop-shaped. In other embodiments, the panel layer 10 may also be generally other shapes. This application does not specifically limit the details.

[0118] Understandably, by setting the second flat area 13 and a portion of the first flat area 11 relative to each other, it is beneficial to reduce the black border at the bottom of the display module 100, resulting in a better visual experience for the user.

[0119] For example, multiple metal traces (not shown) can be provided in the first flat area 11, the bending area 12 and the second flat area 13. The metal traces can be used to realize display, touch and other functions of the panel layer 10.

[0120] like Figure 9 As shown, exemplarily, the bending area 12 may include a first sub-area 121, a second sub-area 122, and a third sub-area 123 connected sequentially. It is understood that... Figure 9The first sub-region 121, the second sub-region 122, and the third sub-region 123 are only schematically separated by dashed lines. In other embodiments, the first sub-region 121, the second sub-region 122, and the third sub-region 123 may also adopt other arrangements. This application does not limit the specific arrangements.

[0121] For example, the first sub-region 121 can be connected to the first flat region 11, and the third sub-region 123 can be connected to the second flat region 13.

[0122] For example, the first sub-region 121 may be disposed opposite to the third sub-region 123, and the first sub-region 121 may be bent toward the third sub-region 123. The second sub-region 122 may be bent away from the first sub-region 121 and the third sub-region 123. The third sub-region 123 may be bent toward the first sub-region 121.

[0123] Understandably, by setting the first sub-region 121 to bend towards the third sub-region 123 and the third sub-region 123 to bend towards the first sub-region 121, the bending radius R of the bending region 12 can be significantly reduced, resulting in higher reliability of the bending region 12, and consequently, higher reliability of the panel layer 10 and the display module 100. Furthermore, by setting the first sub-region 121 to bend towards the third sub-region 123 and the third sub-region 123 to bend towards the first sub-region 121, the thickness of the first support layer 20 is reduced, which facilitates a thinner design for the display module 100, thereby contributing to a thinner design for the electronic device 1000.

[0124] For example, the thickness T1 of the first support layer 20 satisfies: 0.1mm (millimeters) ≤ T1 ≤ 0.35mm. For example, T1 can be equal to 0.1mm, 0.18mm, 0.2mm, 0.23mm, 0.3mm or 0.35mm, etc.

[0125] Understandably, by setting the thickness T1 of the first support layer 20 within the range of 0.1mm to 0.35mm, the thickness of the first support layer 20 is relatively small, and the thickness of the display module 100 is also relatively small, which is beneficial for achieving a thinner display module 100. Furthermore, while achieving a thinner display module 100, the supporting performance of the first support layer 20 is less likely to decrease significantly, resulting in higher reliability of the display module 100.

[0126] In some implementations, the thickness T1 of the first support layer 20 satisfies: 0.1mm (millimeters) ≤ T1 ≤ 0.2mm. For example, T1 can be equal to 0.1mm, 0.13mm, 0.15mm, 0.18mm or 0.2mm, etc.

[0127] Understandably, by setting the thickness T1 of the first support layer 20 to within the range of 0.1mm to 0.2mm, the thickness of the first support layer 20 is relatively small, and the thickness of the display module 100 is also relatively small, which is beneficial for achieving a thinner display module 100. Furthermore, while achieving a thinner display module 100, the supporting performance of the first support layer 20 is less likely to decrease significantly, resulting in higher reliability of the display module 100.

[0128] In other embodiments, the thickness T1 of the first support layer 20 may also fall within other ranges. This application does not specifically limit the details.

[0129] For example, the elastic modulus K of the first support layer 20 can satisfy: 100Gpa≤K≤200Gpa, for example, K can be equal to 100Gpa, 120Gpa, 138Gpa, 150Gpa, 188Gpa or 200Gpa, etc.

[0130] It is understandable that the first support layer 20 has a large elastic modulus and a large hardness, so that while the first support layer 20 is thinned, its support performance is good.

[0131] In other embodiments, the elastic modulus of the first support layer 20 may also satisfy other ranges.

[0132] For example, the material of the first support layer 20 may include aluminum, steel, copper, or carbon fiber. In one embodiment, the material of the first support layer 20 may also include an insulating material, such as a non-metallic material.

[0133] It is understandable that by setting the material of the first support layer 20 to include aluminum, steel, copper or carbon fiber, the first support layer 20 can be thinned while maintaining high strength and good support performance.

[0134] In other embodiments, the material of the first support layer 20 may also include other materials. This application does not specifically limit the application.

[0135] For example, the material of the second support layer 30 may include an insulating material, such as a non-metallic material, polyethylene terephthalate (PET), etc.

[0136] For example, the thickness T2 of the second support layer 30 can satisfy: 0.05mm≤T2≤0.15mm, for example, T2 can be equal to 0.05mm, 0.06mm, 0.09mm, 0.1mm, 0.12mm or 0.15mm, etc.

[0137] Understandably, by setting the thickness T2 of the second support layer 30 within the range of 0.05mm to 0.15mm, the thickness of the second support layer 30 is relatively small, and the thickness of the display module 100 is also relatively small, which is beneficial for achieving a thinner display module 100. Furthermore, while achieving a thinner display module 100, the supporting performance of the second support layer 30 is less likely to experience a significant decrease, resulting in higher reliability of the display module 100.

[0138] In other embodiments, the thickness T2 of the second support layer 30 may also fall within other ranges. This application does not specifically limit the details.

[0139] like Figure 9 As shown, exemplarily, the second support layer 30 may include a first support portion 31, a second support portion 32, and a third support portion 33 connected sequentially. It is understood that... Figure 9 The first support portion 31, the second support portion 32, and the third support portion 33 are schematically separated by dashed lines. In other embodiments, the first support portion 31, the second support portion 32, and the third support portion 33 may also adopt other arrangements. Specifically, this application does not limit the specific arrangements.

[0140] For example, the third support portion 33 may be disposed opposite to a portion of the first support portion 31, and the second support portion 32 may be bent. In one embodiment, the central axis of the second support portion 32 may be substantially parallel to the central axis of the bending region 12; in other words, the central axis of the second support portion 32 may be substantially parallel to the first direction (i.e., the X-axis direction).

[0141] like Figure 9 As shown, exemplarily, the first support layer 20 can be fixed to the side of the first flat region 11 near the second flat region 13, and a portion of the first support layer 20 can be located between the first flat region 11 and the second flat region 13. Exemplarily, the ratio of the thickness T1 of the first support layer 20 to the bending radius R of the second sub-region 122 can satisfy: 1 / 6 ≤ T1 / R ≤ 1 / 2. For example, T1 / R can be equal to 1 / 6, 1 / 5, 1 / 4, 1 / 3, or 1 / 2, etc.

[0142] Understandably, by setting the ratio of the thickness T1 of the first support layer 20 to the bending radius R of the second sub-region 122 within the range of 1 / 6 to 1 / 2, on the one hand, the thickness of the first support layer 20 is smaller, which is conducive to achieving a thinner display module 100, thereby facilitating a thinner electronic device 1000 and providing a better user grip experience; on the other hand, the bending radius of the second sub-region 122 is less likely to decrease significantly, the metal traces in the bending area 12 are less likely to break or develop micro-cracks, the bending area 12 has higher reliability, the panel layer 10 is less likely to have bright lines or touch failures, the display module 100 has higher reliability, and the user experience is better.

[0143] In some embodiments, the ratio of the thickness T1 of the first support layer 20 to the bending radius R of the second sub-region 122 can satisfy: 1 / 6≤T1 / R≤1 / 3. For example, T1 / R can be equal to 1 / 6, 1 / 5, 1 / 4 or 1 / 3, etc.

[0144] Understandably, by setting the ratio of the thickness T1 of the first support layer 20 to the bending radius R of the second sub-region 122 within the range of 1 / 6 to 1 / 3, on the one hand, the thickness of the first support layer 20 is smaller, which is conducive to achieving a thinner display module 100, thereby facilitating a thinner electronic device 1000 and providing a better user grip experience; on the other hand, the bending radius of the second sub-region 122 is less likely to decrease significantly, the metal traces in the bending area 12 are less likely to break or develop micro-cracks, the bending area 12 has higher reliability, the panel layer 10 is less likely to have bright lines or touch failures, the display module 100 has higher reliability, and the user experience is better.

[0145] In other embodiments, the ratio of the thickness T1 of the first support layer 20 to the bending radius R of the second sub-region 122 may also satisfy other ranges. Specifically, this application does not limit the specifics.

[0146] exist Figure 7In the illustrated electronic device 1000, although the electronic device 1000 can solve the reliability problem of the display module 100, the thickness of the first support layer 20 and the display module 100 is relatively large, making it impossible to achieve a thinner design for both the display module 100 and the electronic device 1000. In this embodiment, however, the first support layer 20 can balance a thinner thickness with better support performance, which is beneficial for ensuring the reliability of the display module 100 and achieving a thinner design for the electronic device 1000. Furthermore, the bending radius R of the bending area 12 of the panel layer 10 is not significantly reduced, and the metal traces in the bending area 12 are less prone to breakage or micro-cracks, resulting in higher reliability of the bending area 12. This reduces the likelihood of bright lines or touch failures in the panel layer 10, leading to higher reliability of the electronic device 1000 and a better user experience. Therefore, the display module 100 and electronic device 1000 in this embodiment can balance a thinner thickness with higher reliability.

[0147] For example, the second support layer 30 can be fixedly connected to the side of the panel layer 10 closest to the first support layer 20; in other words, the first support layer 20 can be fixedly connected to the panel layer 10 via the second support layer 30. In one embodiment, the first support portion 31 can be fixedly connected between the first flat area 11 and the first support layer 20, the second support portion 32 can be fixedly connected to the bending area 12, and the third support portion 33 can be fixedly connected between the second flat area 13 and the first support layer 20.

[0148] Understandably, the second support layer 30 can provide better support for the panel layer 10, which is beneficial to improving the reliability of the panel layer 10, and thus to improving the reliability of the display module 100. The first support layer 20 can provide better support for the panel layer 10 through the second support layer 30, which is beneficial to further improving the reliability of the panel layer 10, and thus to further improving the reliability of the display module 100.

[0149] exist Figure 7 In the illustrated electronic device 1000, although the electronic device 1000 can solve the reliability problem of the display module 100, the two-section structure of the second support layer 30 cannot provide support for the bending area 12 of the panel layer 10, resulting in low reliability of the bending area 12, and consequently low reliability of both the display module 100 and the electronic device 1000. However, in this embodiment, the second support portion 32 of the second support layer 30 can provide support for the bending area 12 of the panel layer 10, resulting in higher reliability of the bending area 12, higher reliability of both the display module 100 and the electronic device 1000, and a better user experience.

[0150] For example, the distance H between the surface of the first flat region 11 away from the first support layer 20 and the surface of the second flat region 13 away from the first support layer 20 can satisfy: 1.2mm≤H≤1.65mm. For example, H can be equal to 1.2mm, 1.3mm, 1.35mm, 1.4mm, 1.5mm, 1.6mm, or 1.65mm, etc.

[0151] It is understandable that by setting the distance H between the surface of the first flat region 11 away from the first support layer 20 and the surface of the second flat region 13 away from the first support layer 20 to be in the range of 1.2mm to 1.65mm, the distance between the surface of the first flat region 11 away from the first support layer 20 and the surface of the second flat region 13 away from the first support layer 20 is small, which is beneficial to achieving a thinner display module 100, thereby facilitating a thinner electronic device 1000.

[0152] In other embodiments, the distance H between the surface of the first flat region 11 away from the first support layer 20 and the surface of the second flat region 13 away from the first support layer 20 may also satisfy other ranges. Specifically, this application does not limit the specifics.

[0153] like Figure 9 As shown, for example, the polarizer 40 can be fixedly connected to the first flat region 11 and is located on the side of the first flat region 11 away from the second flat region 13.

[0154] For example, in the second direction, at least a portion of the polarizer 40 may be positioned opposite to the first sub-region 121.

[0155] It is understandable that since the polarizer 40 can be arranged opposite to the first sub-region 121, the polarizer 40 and the first sub-region 121 can overlap in the thickness direction (i.e., the Z-axis direction) of the electronic device 1000. The polarizer 40 has a high space utilization rate in the thickness direction of the electronic device 1000, and the polarizer 40 can occupy less space in the thickness direction of the electronic device 1000, which is conducive to realizing the thinner configuration of the display module 100 and the electronic device 1000.

[0156] like Figure 9 As shown, by way of example, the cover plate 50 can be fixedly connected to the polarizer 40 by optical adhesive 60 and is located on the side of the polarizer 40 away from the first flat area 11.

[0157] Understandably, the optical adhesive 60 secures the cover plate 50 to the polarizer 40, which helps ensure the structural stability of the display module 100. Both the optical adhesive 60 and the cover plate 50 have high light transmittance, allowing light to pass through them to a greater extent, reducing light loss. This results in clearer images and more realistic colors displayed by the display module 100, providing a better visual experience for the user. Furthermore, the cover plate 50 effectively prevents scratches, wear, and other physical damage to other structures of the display module 100. It also acts as a buffer, preventing external dust, moisture, and other foreign objects from entering the interior of the display module 100 or the electronic device 1000.

[0158] For example, in the second direction, at least a portion of the optical adhesive 60 may be positioned opposite to the first sub-region 121.

[0159] Understandably, since the optical adhesive 60 can be positioned opposite to the first sub-region 121, the optical adhesive 60 and the first sub-region 121 can overlap in the thickness direction (i.e., the Z-axis direction) of the electronic device 1000. The optical adhesive 60 has a high space utilization rate in the thickness direction of the electronic device 1000, and can occupy less space in the thickness direction of the electronic device 1000, which is beneficial for achieving a thinner design for both the display module 100 and the electronic device 1000. Figure 8 As shown, by way of example, the display driver chip 70 can be fixedly connected to the second flat area 13 and located on the side of the second flat area 13 away from the first support layer 20.

[0160] It is understood that the display driver chip 70 can be fixedly connected and electrically connected to the panel layer 10. The display driver chip 70 can receive digital signals from the central processing unit of the electronic device 1000 and convert them into voltage or current signals required by the panel layer 10, thereby realizing the display of the panel layer 10.

[0161] For example, the middle plate 21 may be provided with a clearance space 211. The opening of the clearance space 211 may face the display module 100.

[0162] like Figure 8 As shown, by way of example, the display driver chip 70 may be located outside the clearance space 211 and disposed opposite to the clearance space 211.

[0163] Understandably, since the display driver chip 70 is located on the side of the display module 100 closest to the mid-frame 200, the clearance space 211 prevents physical interference between the display driver chip 70 and the mid-frame 200, thus ensuring the proper installation of the display driver chip 70 and avoiding negative impacts on the normal display function of the display module 100. Furthermore, since the mid-frame 200 is generally made of metal, the clearance space 211 provides a larger distance between the display driver chip 70 and the mid-frame 200, preventing the metal material of the mid-frame 200 from interfering with the electrical signals transmitted by the display driver chip 70, thereby preventing display abnormalities in the display module 100 and improving the reliability of the display module 100.

[0164] Understandably, the clearance space 211 ensures the reliability of the display driver chip 70 while the thickness of the display module 100 at the display driver chip 70 is small, which is conducive to the thinning of the electronic device 1000.

[0165] In some implementations, at least a portion of the display driver chip 70 may be located within the clearance space 211.

[0166] Understandably, by positioning at least a portion of the display driver chip 70 within the clearance space 211, the distance between the display driver chip 70 and the mid-frame 200 remains relatively large. The clearance space 211 prevents physical interference between the display driver chip 70 and the mid-frame 200, thus ensuring the proper installation of the display driver chip 70 and avoiding negative impacts on the normal display function of the display module 100. Furthermore, it prevents the metal material of the mid-frame 200 from interfering with the electrical signals transmitted by the display driver chip 70, thereby preventing display abnormalities in the display module 100 and contributing to the reliability of the display module 100.

[0167] Understandably, the clearance space 211 ensures the reliability of the display driver chip 70 while the thickness of the display module 100 at the display driver chip 70 is small, which is conducive to the thinning of the electronic device 1000.

[0168] Please combine Figures 4 to 6 For example, the first flat area 11 of the panel layer 10, the first support layer 20, the first support portion 31 of the second support layer 30, the polarizer 40, at least a portion of the cover plate 50, and the optical adhesive 60 can constitute the display portion 100a of the display module 100. The bending area 12 of the panel layer 10 and the second support portion 32 of the second support layer 30 can constitute the bending portion 100b of the display module 100. The second flat area 13 of the panel layer 10, the third support portion 33 of the second support layer 30, and the display driver chip 70 can constitute the terminal portion 100c of the display module 100.

[0169] For example, the surface of the first flat area 11 of the panel layer 10 that is away from the first support layer 20 can constitute the display surface 101a of the display unit 100a. The surface of the first support layer 20 that is away from the first flat area 11 of the panel layer 10 and the surface of the first support portion 31 of the second support layer 30 that is away from the first flat area 11 of the panel layer 10 can constitute the non-display surface 102a of the display unit 100a.

[0170] Figure 10 yes Figure 8 The second support layer 30 shown is a partial structural schematic diagram of one embodiment.

[0171] Please see Figure 10 and combined Figure 8 As shown, exemplarily, the second support portion 32 may include a first surface 321 and a second surface 322 disposed opposite to each other. In one embodiment, the first surface 321 of the second support portion 32 may face the panel layer 10, and the second surface 322 of the second support portion 32 may face the first support layer 20. In other embodiments, the first surface 321 of the second support portion 32 may face the first support layer 20, and the second surface 322 of the second support portion 32 may face the panel layer 10. Specific details are not limited herein.

[0172] Please see Figure 10 and combined Figure 8 As shown, exemplarily, the second support portion 32 may be provided with a through hole 323. In one embodiment, the through hole 323 may be formed with an opening on the first surface 321, or with an opening on the second surface 322, or with an opening on both the first surface 321 and the second surface 322.

[0173] Understandably, the through-hole 323 of the second support portion 32 can reduce the rigidity of the second support portion 32 and reduce the rebound stress generated when the second support portion 32 is bent, thereby preventing the second support portion 32 from cracking or even breaking. The second support portion 32 provides good support for the bending area 12 of the panel layer 10, thereby improving the reliability of the panel layer 10 and the display module 100. In addition, the through-hole 323 does not easily reduce the support performance of the second support portion 32 for the bending area 12, and the second support portion 32 can provide better support and protection for the bending area 12.

[0174] like Figure 10 As shown, by way of example, the through hole 323 may be generally strip-shaped.

[0175] Understandably, the through-hole 323, which is roughly strip-shaped, can reduce the rigidity of the second support 32 and reduce the rebound stress generated when the second support 32 is bent, thereby avoiding cracking or even breakage of the second support 32. The second support 32 provides good support for the bending area 12 of the panel layer 10, thereby improving the reliability of the panel layer 10 and the display module 100.

[0176] In other embodiments, the through hole 323 may also be in other shapes, for example, the through hole 323 may be generally circular, etc. This application does not limit the specific shape.

[0177] like Figure 10 As shown, by way of example, the extension direction of the through hole 323 can be approximately parallel to the central axis of the bending region 12; in other words, the extension direction of the through hole 323 can be approximately parallel to the first direction.

[0178] Understandably, by setting the extension direction of the through hole 323 to be approximately parallel to the central axis of the bending area 12, the extension direction of the through hole 323 can also be approximately parallel to the central axis of the second support portion 32. In this way, the through hole 323 reduces the rebound stress when the second support portion 32 is bent, while also minimizing its impact on the bending direction of the second support portion 32, resulting in higher reliability of the second support portion 32.

[0179] In other embodiments, the extension direction of the through hole 323 may also be substantially parallel to other directions, for example, the extension direction of the through hole 323 may also be substantially parallel to the second direction. This application does not specifically limit the application.

[0180] like Figure 10 As shown, exemplarily, the number of through holes 323 can be multiple. Multiple through holes 323 may include a first group of through holes 324 and a second group of through holes 325 arranged at intervals along a first direction.

[0181] For example, the first through-hole group 324 may include a plurality of first through-holes 3241 arranged at intervals along the second direction. The second through-hole group 325 may include a plurality of second through-holes 3251 arranged at intervals along the second direction.

[0182] For example, at least a portion of a first through hole 3241 may be directly opposite the area between two adjacent second through holes 3251.

[0183] It is understandable that the first through hole 3241 of the first through hole group 324 and the second through hole 325 of the second through hole group 325 can be arranged alternately and in a staggered manner, and the second support part 32 has good bendability and good flexibility.

[0184] In other embodiments, the first through-hole group 324 and the second through-hole group 325 may be arranged in other ways. The first through-hole 3241 and the second through-hole 3251 may also be arranged in other ways. This application does not specifically limit the arrangement.

[0185] In other embodiments, the second support portion 32 may not have the through hole 323. This application does not specifically limit the details.

[0186] Second implementation method: Please refer to Figure 11 , Figure 11 yes Figure 1 This is a partial cross-sectional view of the electronic device 1000 at line BB, representing another embodiment. It is understood that the design of the electronic device 1000 in the first embodiment can be directly applied to the structural design of the electronic device 1000 shown in this embodiment, provided there is no conflict. Much of the technical content that is the same as that of the electronic device 1000 shown in the first embodiment will not be repeated in this embodiment.

[0187] For example, panel layer 10 may include a first flat region 11, a bent region 12, and a second flat region 13 connected in sequence. It is understood that... Figure 11 The first flat region 11, the bent region 12, and the second flat region 13 are schematically separated by dashed lines. In other embodiments, the first flat region 11, the bent region 12, and the second flat region 13 may also be arranged in other ways. This application does not limit the specific arrangement.

[0188] For example, the bending area 12 may include a first sub-area 121, a second sub-area 122, and a third sub-area 123 connected sequentially. For example, Figure 11 The first sub-region 121, the second sub-region 122, and the third sub-region 123 are schematically separated by dashed lines. In other embodiments, the first sub-region 121, the second sub-region 122, and the third sub-region 123 may also adopt other configurations. This application does not limit the specific configuration.

[0189] For example, the first sub-region 121 can be connected to the first flat region 11, and the third sub-region 123 can be connected to the second flat region 13.

[0190] For example, the first sub-region 121 may be disposed opposite to a portion of the second flat region 13, and the first sub-region 121 may be curved toward the second flat region 13. The second sub-region 122 may be curved away from the first sub-region 121. The third sub-region 123 may be substantially straight.

[0191] It is understandable that by setting the first sub-region 121 to bend towards the second flat region 13, the second sub-region 122 to bend away from the first sub-region 121, and the third sub-region 123 to be roughly straight, the bending radius R of the bending region 12 can be reduced less easily, the reliability of the bending region 12 is higher, and the reliability of the panel layer 10 and the display module 100 is also higher.

[0192] For example, the structure, parameters, positional relationships, and connection relationships of the first support layer 20, the second support layer 30, the polarizer 40, the optical adhesive 60, the cover plate 50, and the display driver chip 70 can all be referred to the relevant solutions of the first embodiment. Specific details will not be elaborated further.

[0193] Understandably, compared to the panel layer 10 of the first embodiment, the third sub-region 123 of this embodiment is roughly flat, the bending radius R of the second sub-region 122 is not significantly reduced, the metal traces in the second sub-region 122 are less prone to breakage or micro-cracks, the bending area 12 has higher reliability, the panel layer 10 is less prone to bright lines or touch failures, the display module 100 has higher reliability, and the user experience is better. Furthermore, the thickness of the first support layer 20 in this embodiment is not significantly increased, which is beneficial for achieving a thinner display module 100, thereby facilitating a thinner electronic device 1000 and improving the user's grip.

[0194] In other embodiments, the third sub-region 123 may also be curved generally toward the first flat region 11. This application does not specifically limit the details.

[0195] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments described in this application can be combined with each other, and any combination of features in different embodiments is also within the protection scope of this application. That is to say, the multiple embodiments described above can also be arbitrarily combined according to actual needs.

[0196] It should be noted that all the above-described figures are exemplary illustrations of this application and do not represent the actual size of the product. Furthermore, the dimensional proportions between the components in the figures are not intended to limit the actual product of this application. The above are merely some embodiments and implementations of this application, and the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A display module (100), characterized in that, It includes a panel layer (10), a first support layer (20), and a second support layer (30); The panel layer (10) includes a first flat area (11), a bending area (12) and a second flat area (13) connected in sequence. The second flat area (13) is disposed opposite to a part of the first flat area (11), and the bending area (12) is bent. The bending area (12) includes a first sub-area (121), a second sub-area (122), and a third sub-area (123) connected in sequence. The first sub-area (121) is connected to the first flat area (11), and the third sub-area (123) is connected to the second flat area (13). The first sub-area (121) and the third sub-area (123) are arranged opposite to each other. The first sub-area (121) bends toward the third sub-area (123), and the second sub-area (122) bends away from the first sub-area (121) and the third sub-area (123). The material of the first support layer (20) includes a metallic material. The first support layer (20) is fixed to the side of the first flat area (11) near the second flat area (13), and a portion of it is located between the first flat area (11) and the second flat area (13). The material of the second support layer (30) includes an insulating material. The second support layer (30) includes a first support part (31), a second support part (32), and a third support part (33) connected in sequence. The first support part (31) is fixedly connected between the first flat area (11) and the first support layer (20). The second support part (32) is fixedly connected to the first sub-area (121), the second sub-area (122), and the third sub-area (123) of the bending area (12). The third support part (33) is fixedly connected between the second flat area (13) and the first support layer (20).

2. The display module (100) according to claim 1, characterized in that, The third sub-region (123) bends toward the first sub-region (121).

3. The display module (100) according to claim 1 or 2, characterized in that, The ratio of the thickness T1 of the first support layer (20) to the bending radius R of the second sub-region (122) satisfies: 1 / 6≤T1 / R≤1 / 2.

4. The display module (100) according to any one of claims 1 to 3, characterized in that, The thickness T1 of the first support layer (20) satisfies: 0.1mm≤T1≤0.35mm.

5. The display module (100) according to any one of claims 1 to 4, characterized in that, The elastic modulus K of the first support layer (20) satisfies: 100Gpa≤K≤200Gpa.

6. The display module (100) according to any one of claims 1 to 5, characterized in that, The material of the first support layer (20) includes aluminum, steel, copper or carbon fiber.

7. The display module (100) according to any one of claims 1 to 6, characterized in that, The thickness T2 of the second support layer (30) satisfies: 0.05mm≤T2≤0.15mm.

8. The display module (100) according to any one of claims 1 to 7, characterized in that, The second support portion (32) includes a first surface (321) and a second surface (322) disposed opposite to each other; The second support portion (32) is provided with a through hole (323), which forms an opening on the first surface (321) and / or the second surface (322).

9. The display module (100) according to claim 8, characterized in that, The through hole (323) is strip-shaped.

10. The display module (100) according to claim 9, characterized in that, The extension direction of the through hole (323) is parallel to the central axis of the bending area (12).

11. The display module (100) according to any one of claims 8 to 10, characterized in that, The plurality of through holes (323) include a first group of through holes (324) and a second group of through holes (325) arranged at intervals along a first direction; The first through-hole group (324) includes a plurality of first through-holes (3241) spaced apart along a second direction, and the second through-hole group (325) includes a plurality of second through-holes (3251) spaced apart along the second direction, wherein at least a portion of a first through-hole (3241) is directly opposite to the region between two adjacent second through-holes (3251), wherein the first direction is different from the second direction.

12. The display module (100) according to any one of claims 1 to 11, characterized in that, The distance H between the surface of the first flat region (11) away from the first support layer (20) and the surface of the second flat region (13) away from the first support layer (20) satisfies: 1.2mm≤H≤1.65mm.

13. The display module (100) according to any one of claims 1 to 12, characterized in that, The display module (100) further includes a polarizer (40), which is fixedly connected to the first flat area (11) and located on the side of the first flat area (11) away from the second flat area (13). In the second direction, at least a portion of the polarizer (40) is disposed opposite to the first sub-region (121).

14. The display module (100) according to claim 13, characterized in that, The display module (100) further includes a cover plate (50) and an optical adhesive (60). The cover plate (50) is fixedly connected to the polarizer (40) by the optical adhesive (60) and is located on the side of the polarizer (40) away from the first flat area (11).

15. The display module (100) according to claim 14, characterized in that, In the second direction, at least a portion of the optical adhesive (60) is disposed opposite to the first sub-region (121).

16. The display module (100) according to any one of claims 1 to 15, characterized in that, The first flat area (11) is the display area of ​​the panel layer (10), and the bent area (12) and the second flat area (13) are the non-display areas of the panel layer (10); Alternatively, a portion of the first flat area (11) and the bent area (12) may be the display area of ​​the panel layer (10), and the other portion of the bent area (12) and the second flat area (13) may be the non-display area of ​​the panel layer (10).

17. The display module (100) according to any one of claims 1 to 16, characterized in that, The display module (100) further includes a display driver chip (70), which is fixedly connected to the second flat area (13) and located on the side of the second flat area (13) away from the first support layer (20).

18. An electronic device (1000), characterized in that, It includes a mid-frame (200) and a display module (100) as described in any one of claims 1 to 17, wherein the display module (100) is fixedly connected to the mid-frame (200).

19. The electronic device (1000) according to claim 18, characterized in that, The middle frame (200) includes a middle plate (21) and a frame (22). The frame (22) surrounds the middle plate (21) and is fixedly connected to the middle plate (21). The display module (100) is fixedly connected to the frame (22) and is disposed opposite to the middle plate (21). The middle plate (21) is provided with a clearance space (211); The display module (100) further includes a display driver chip (70), which is fixedly connected to the second flat area (13) and located on the side of the second flat area (13) away from the first support layer (20). The display driver chip (70) is located outside the clearance space (211) and is disposed opposite to the clearance space (211), or at least a portion of the display driver chip (70) is located inside the clearance space (211).

20. The electronic device (1000) according to claim 19, characterized in that, The electronic device (1000) further includes a circuit board (400) mounted on the middle frame (200), and the second flat area (13) is electrically connected to the circuit board (400).

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