Electronic device and method of manufacturing the same

Abstract

This application discloses an electronic device and its fabrication method. The electronic device includes a heat source, a heat dissipation structure, and a first circuit board. The heat dissipation structure is in contact with the heat source and is used to dissipate heat from the heat source. At least a portion of the heat dissipation structure and the first circuit board enclose a radiating cavity with a radiating port, thereby forming a cavity antenna. The electronic device provided by this application can effectively utilize design space, enabling the electronic device to possess both good antenna performance and heat dissipation performance.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to an electronic device and a method for manufacturing the same. Background Technology

[0002] Currently, the limited design space in the architecture of electronic products can affect the performance of internal functional components. For example, to meet antenna performance requirements, the design space for the heat dissipation structure may be reduced, resulting in a smaller area of ​​the heat dissipation structure; or, to meet heat dissipation performance requirements, the design space for the antenna structure may be reduced, affecting the formation of effective resonance within the operating frequency band and leading to a significant decrease in radiation performance. Summary of the Invention

[0003] To address the aforementioned technical problems, this application provides an electronic device and its manufacturing method, which can effectively utilize design space and enable the electronic device to simultaneously possess good antenna performance and heat dissipation performance.

[0004] This application provides an electronic device, comprising a heat source, a heat dissipation structure, and a first circuit board. The heat dissipation structure is in contact with the heat source and is used to dissipate heat from the heat source. At least a portion of the heat dissipation structure and the first circuit board enclose a radiating cavity with a radiating port, thereby forming a cavity antenna.

[0005] The cavity antenna in the electronic device provided in this application can resonate and amplify radio waves at specific frequencies using the radiating cavity, thereby improving the antenna's radiation efficiency and directivity. Furthermore, in this embodiment, by forming the cavity antenna with at least a portion of the heat dissipation structure and the first circuit board, i.e., reusing at least a portion of the heat dissipation structure as part of the radiating cavity structure, not only are the design space requirements of the cavity antenna met, but the size of the heat dissipation structure can also be increased. This allows for structural integration of the heat dissipation structure and the cavity antenna, effectively utilizing the design space of the electronic device, optimizing the overall layout of the electronic device, and not only giving the electronic device good antenna performance but also improving its heat dissipation performance.

[0006] In one possible implementation, the heat dissipation structure includes a heat dissipation body, an extension, and a connecting portion. The heat dissipation body is in contact with the heat source. The extension is connected to the edge of the heat dissipation body and extends to a position directly opposite the first circuit board and spaced apart from the first circuit board. The connecting portion connects the extension and the first circuit board. The connecting portion, the extension, and the first circuit board enclose the radiation cavity to form the radiation cavity. The extension and the first circuit board form two opposing cavity walls of the radiation cavity. The connecting portion forms a sidewall of the radiation cavity located on a portion of the periphery of the radiation cavity. The other portion of the periphery of the radiation cavity is an opening to form the radiation port.

[0007] By providing an outwardly extending portion at the edge of the heat dissipation body and a connecting portion connecting the extension portion and the first circuit board, not only is the cavity antenna formed, but the heat from the heat source can also be conducted from the heat dissipation body to the extension portion and the connecting portion, thereby increasing the heat dissipation area and helping to improve heat dissipation efficiency.

[0008] In one possible implementation, the first circuit board is disposed on a first side of the heat source, and the extension is connected to the edge of the heat dissipation body and extends toward the first side to a position directly opposite the first circuit board and spaced apart from the first circuit board. The first circuit board and the extension are located on the same side of the heat source, which facilitates the formation of the radiation cavity and allows for a more compact internal structure of the electronic device.

[0009] In one possible implementation, at least a portion of the connecting portion is an extension structure extending further from the edge of the extension portion. This simplifies the manufacturing process of the connecting portion and reduces production costs.

[0010] In one possible implementation, the extension structure extends from a portion of the edge of the extension toward the first circuit board and connects to the first circuit board, forming at least a portion of the connection portion. Extending the extension structure from a portion of the edge of the extension reduces manufacturing difficulty and improves processing efficiency.

[0011] In one possible implementation, the heat dissipation structure further includes a fin assembly. A portion of the heat dissipation body is in contact with the heat source, and the fin assembly is located in the area of ​​the heat dissipation body that is not in contact with the heat source, thereby improving heat dissipation efficiency. The fin assembly can dissipate the heat from the heat source through air convection, thus improving heat dissipation performance.

[0012] In one possible implementation, at least a portion of the fin assembly is connected to the extension and the first circuit board, wherein at least a portion of the connection is the part of the fin assembly connected to the extension and the first circuit board. Thus, at least a portion of the fin assembly is reused as part of the structure of the radiating cavity, thereby structurally integrating the fin assembly and the cavity antenna.

[0013] In one possible implementation, the first circuit board includes opposing first and second edges, the second edge being farther away from the heat dissipation body than the first edge; the extension includes opposing third and fourth edges, the fourth edge being farther away from the heat dissipation body than the third edge; the fin assembly includes a plurality of spaced-apart fins near the third edge; at least a portion of the plurality of fins is connected between the extension and the first circuit board to form at least a portion of the connection.

[0014] By arranging multiple fins at intervals, the heat dissipation area can be further increased. Furthermore, by positioning the multiple fins close to the third edge, i.e., close to the extension, it is beneficial for the multiple fins and the extension to dissipate heat conducted from the heat dissipation body outwards. Additionally, it is beneficial for at least a portion of the multiple fins to connect with both the extension and the first circuit board, forming at least a portion of the connection.

[0015] In one possible implementation, the sidewall of the radiation cavity formed by the connection portion includes a first sidewall and a second sidewall, the first sidewall being connected between the first edge and the third edge, the second sidewall being adjacent to the first sidewall, and at least some of the plurality of fins being connected between the extension portion and the first circuit board, thereby forming at least a portion of the first sidewall and / or at least a portion of the second sidewall.

[0016] The first sidewall connects between the first edge and the third edge, preventing the radiation port from facing the heat source and the interior of the electronic device, thus facilitating signal transmission by the cavity antenna. Furthermore, by reusing at least a portion of the fins as part of the sidewall of the radiation cavity, the internal space utilization of the electronic device is improved, resulting in a more compact overall structure while simultaneously ensuring both heat dissipation and antenna performance.

[0017] In one possible implementation, the arrangement direction of the plurality of fins is parallel to the first edge or the third edge, each fin includes a first end and a second end along the extension direction, the first end being closer to the first circuit board and the extension than the second end, and at least some of the plurality of fins having their first ends connected to the first edge and the third edge to form at least a portion of the first sidewall.

[0018] Thus, by reusing the first end of at least some of the fins as at least part of the first sidewall of the radiation cavity, the multiple fins retain their own heat dissipation function and can also avoid structural complexity of the multiple fins.

[0019] In one possible implementation, at least one of the plurality of fins extends along the extension direction into the region between the first circuit board and the extension, and is connected to both the first circuit board and the extension to form at least a portion of the second sidewall.

[0020] Thus, the extension portion of the at least one fin is reused as at least part of the second sidewall of the radiation cavity, making it possible to reduce or even eliminate the need for additional components to construct the second sidewall.

[0021] In one possible implementation, the connecting portion includes a first sub-connecting portion, which connects between the first edge and the third edge to form the first sidewall. At least one of the plurality of fins extends along its extension direction to the region between the first circuit board and the extension, and connects with both the first circuit board and the extension to form the second sidewall of the radiation cavity. The extension direction of the first sub-connecting portion and the arrangement direction of the plurality of fins are parallel to the extension direction of either the first edge or the second edge. The projections of the plurality of fins along their extension directions at least partially overlap with the first sub-connecting portion. The first sub-connecting portion has a plurality of through holes, each through hole penetrating the first sub-connecting portion along the extension direction of the fins, such that the channel between two adjacent fins communicates with the interior of the radiation cavity. Because the projections of the plurality of fins along their extension directions at least partially overlap with the first sub-connecting portion, the projections of the channels between the plurality of fins at least partially overlap with the first sub-connecting portion, thereby shortening the airflow path and allowing the fan of the electronic device to more efficiently guide airflow through the fins and the through holes, thus enhancing the heat dissipation effect.

[0022] In one possible implementation, the first circuit board includes opposing first and second edges, the second edge being farther away from the heat dissipation body than the first edge; the extension includes opposing third and fourth edges, the fourth edge being farther away from the heat dissipation body than the third edge; the fin assembly includes a plurality of spaced-apart fins, the plurality of fins being close to the third edge; the connecting portion includes a first sub-connecting portion, the first sub-connecting portion being connected between the first edge and the third edge to form the portion of the sidewall; the extending direction of the first sub-connecting portion and the arrangement direction of the plurality of fins are parallel to the extending direction of the first edge or the second edge; the projection of the plurality of fins along the extending direction at least partially overlaps with the first sub-connecting portion; wherein the first sub-connecting portion has a plurality of through holes, each through hole penetrating the first sub-connecting portion along the extending direction of the fins, such that the channel between two adjacent fins communicates with the interior of the radiation cavity. Since the projections of the plurality of fins along the extension direction at least partially overlap with the first sub-connection portion, the projections of the channels between the plurality of fins at least partially overlap with the first sub-connection portion, thereby shortening the airflow path and enabling the fan of the electronic device to guide airflow through the fins and the through holes more efficiently, thereby enhancing the heat dissipation effect.

[0023] In one possible implementation, the fin assembly includes a plurality of fins spaced apart, wherein at least a portion of the fins have a channel between adjacent fins communicating with the radiating cavity. This allows air to flow smoothly through the channel and the radiating cavity, thereby facilitating the fan to transfer heat from the fins to the external environment via the channel and the radiating cavity.

[0024] In one possible implementation, the heat dissipation structure includes a vapor chamber, the heat dissipation body is the main body of the vapor chamber, and the extension is an extension of the vapor chamber. Thus, a portion of the vapor chamber is reused as part of the structure of the radiating cavity, thereby achieving structural integration between the vapor chamber and the cavity antenna.

[0025] In one possible implementation, the heat dissipation structure includes a cooling plate, the heat dissipation body is the main body portion of the cooling plate, and the extension portion is an extension portion of the cooling plate. Thus, a portion of the cooling plate is reused as part of the structure of the radiating cavity, thereby structurally integrating the cooling plate and the cavity antenna.

[0026] In one possible implementation, the heat dissipation structure includes a heat spreader and a cooling plate stacked together. The heat dissipation body is the main body portion of the stacked heat spreader and cooling plate, and the extension portion is an extension portion of the heat spreader and / or the cooling plate. Thus, portions of the heat spreader and / or the cooling plate are reused as part of the structure of the radiating cavity, thereby structurally integrating the heat spreader and / or the cooling plate with the cavity antenna.

[0027] In one possible implementation, the heat dissipation structure includes at least one metal sheet and at least one heat-conducting sheet alternately stacked. The heat dissipation body is formed by alternately stacking a main body portion of the at least one metal sheet and at least a portion of the at least one heat-conducting sheet. The extension portion is at least an extension portion of the at least one metal sheet. Thus, a portion of the metal sheet of the heat dissipation structure is reused as part of the structure of the radiating cavity, thereby achieving structural integration of the metal sheet and the cavity antenna.

[0028] In one possible implementation, the heat dissipation body includes a heat dissipation body portion and a connecting transition portion, wherein the connecting transition portion is connected to the edge of the heat dissipation body portion and extends in a direction away from the first circuit board to connect with the extension portion.

[0029] If the extension and the heat dissipation body are located on the same plane, the distance between the extension and the first circuit board will be small, which may cause the height of the radiating cavity to fail to meet the antenna performance requirements. In this embodiment, by providing the connecting transition portion extending from the edge of the heat dissipation body in a direction away from the first circuit board, a step difference is created between the extension and the edge of the heat dissipation body, thereby increasing the distance between the extension and the first circuit board, and thus ensuring that the height of the radiating cavity meets the antenna performance requirements.

[0030] In one possible implementation, the extension includes a first cover plate and a second cover plate disposed opposite to each other, the heat dissipation body includes a third cover plate and a fourth cover plate disposed opposite to each other, the first cover plate and the third cover plate are connected to form a first cover body, the second cover plate and the fourth cover plate are connected to form a second cover body, the first cover body and the second cover body are joined to form a sealed space, the sealed space is used to contain a cooling medium, the third cover plate and / or the fourth cover plate are in contact with the heat source, the first circuit board is disposed on the side of the first cover plate away from the second cover plate and directly opposite the first cover plate, and the connecting portion is connected between the first circuit board and the first cover plate.

[0031] By setting the heat dissipation body to include two cover plates and the extension to also include two cover plates, and joining the four cover plates together to form a sealed space for accommodating the cooling medium, the heat source can be dissipated using the cooling medium, thereby improving heat dissipation efficiency.

[0032] In one possible implementation, the third cover plate includes a first plate body portion and a first extension portion, the first extension portion being connected to the edge of the first plate body portion and extending in a direction away from the first circuit board, and the first cover plate being connected to the end of the first extension portion away from the first plate body portion.

[0033] If the first cover plate, the first extension portion, and the first plate body portion are located on the same plane, the distance between the first cover plate and the first circuit board will be small, which may cause the height of the radiating cavity to fail to meet the antenna performance requirements. In this embodiment, by setting the first extension portion to extend from the edge of the first plate body portion in a direction away from the first circuit board, a step difference is created between the first cover plate and the first plate body portion, thereby increasing the distance between the first cover plate and the first circuit board, and thus ensuring that the height of the radiating cavity meets the antenna performance requirements.

[0034] In one possible implementation, the first cover includes a first welded portion and a second welded portion, the first welded portion being the end of the first cover plate away from the first extension portion, and the second welded portion being the end of the first plate portion away from the first cover plate. The second cover includes a third welded portion and a fourth welded portion, the third welded portion being the end of the second cover plate away from the fourth cover plate, and the fourth welded portion being the end of the fourth cover plate away from the second cover plate. The first welded portion is welded to the third welded portion, and the second welded portion is welded to the fourth welded portion. The welding surfaces of the first welded portion and the second welded portion are located in the same plane, and the welding surfaces of the third welded portion and the fourth welded portion are located in the same plane.

[0035] The distance between the welding areas of the first and third welding parts and the laser device is made approximately equal to the distance between the welding areas of the second and fourth welding parts and the laser device. Therefore, the same laser device parameters can be used to weld the first and third welding parts and the second and fourth welding parts. This ensures that the energy received by the welding areas of the first and third welding parts is approximately the same as the energy received by the welding areas of the second and fourth welding parts, thereby enabling both welding areas to achieve a more stable weld and reducing the welding defect rate.

[0036] In one possible implementation, the fourth cover plate includes a second plate body portion and a second extension portion and a fourth welding portion respectively connected to opposite ends of the second plate body portion. The second extension portion is connected to the edge of the second plate body portion and extends in a direction away from the first circuit board. The second cover plate includes a third plate body portion, a third extension portion, and the third welding portion. The third plate body portion is connected to the second extension portion and has a step difference from the second plate body portion. The third extension portion is connected to the edge of the third plate body portion and extends in a direction close to the first circuit board to connect with the third welding portion. The inner surface of the second plate body portion, the welding surface of the fourth welding portion, and the welding surface of the third welding portion are located in the same plane. The third cover plate also includes a fourth extension portion, which is connected to the edge of the first plate body portion and extends in a direction close to the fourth cover plate to connect with the second welding portion. The first cover plate includes a fourth plate body portion and a first welding portion. The fourth plate body portion is connected between the first extension portion and the first welding portion. The inner surface of the fourth plate body portion, the welding surface of the first welding portion, and the welding surface of the second welding portion are located in the same plane.

[0037] By including the fourth extension portion in the third cover plate, and with the fourth extension portion and the first extension portion located on the same side of the first plate body, it is advantageous to ensure that the welding surface of the second welding portion is on the same plane as the welding surface of the first welding portion. Furthermore, by arranging the second plate body and the fourth welding portion on the same plane, and with the second extension portion and the third extension portion located on the same side of the third plate body, it is advantageous to ensure that the welding surface of the third welding portion is on the same plane as the welding surface of the fourth welding portion. This facilitates subsequent laser welding of the two welding positions.

[0038] In one possible implementation, the first cover plate and the third cover plate are integrally formed, and the second cover plate and the fourth cover plate are integrally formed. This improves the structural stability of the heat dissipation structure, simplifies structural design, increases production efficiency, and reduces processing errors.

[0039] In one possible implementation, the electronic device further includes a housing, in which the heat source, the heat dissipation structure, and the first circuit board are disposed. The housing includes a wave-transparent region, and the orthographic projection of the radiating port onto the wave-transparent region at least partially overlaps with the wave-transparent region. The wave-transparent region is used for allowing signals generated by the cavity antenna to pass through to be transmitted to the external space, and for allowing external signals to pass through to be transmitted to the cavity antenna.

[0040] The transparent area ensures that signals generated by the electronic device and external signals can pass smoothly through the housing, reducing attenuation and interference during signal transmission, thereby optimizing signal transmission and improving communication quality and stability.

[0041] In one possible implementation, the electronic device includes at least two first circuit boards spaced apart, and the heat dissipation structure includes at least two connecting portions and at least two extension portions. Each extension portion extends to a position directly opposite a corresponding first circuit board, and each connecting portion connects between a corresponding first circuit board and a corresponding extension portion. Each connecting portion, a corresponding extension portion, and a corresponding first circuit board enclose a radiation cavity.

[0042] By forming at least two cavity antennas, communication quality and reliability can be improved, signal coverage can be enhanced, and multiple operating frequency bands can be supported, thereby increasing communication flexibility and compatibility.

[0043] A second aspect of this application provides a method for manufacturing an electronic device, the method comprising the steps of: S1, providing a first cover and a second cover. The first cover includes a first cover plate and a third cover plate, the second cover includes a second cover plate and a fourth cover plate, the third cover plate includes a first plate portion, a first extension portion, a fourth extension portion, and a second welding portion, the first plate portion includes a first surface side and a second surface side facing away from each other, the first extension portion and the fourth extension portion are located on the first surface side of the first plate portion and are respectively connected to opposite ends of the first plate portion, one end of the fourth extension portion away from the first plate portion is connected to the second welding portion, the first cover plate includes a fourth plate portion and a first welding portion, opposite ends of the fourth plate portion are respectively connected to the first extension portion and the first welding portion, wherein the fourth plate portion and the first plate portion have a step difference, and the inner surface of the fourth plate portion, the welding surface of the first welding portion, and the welding surface of the second welding portion are located on the same plane. The fourth cover plate includes a second plate body and a second extension and a fourth welded portion respectively connected to opposite ends of the second plate body. The second plate body includes a third surface side and a fourth surface side facing away from each other. The second extension is located on the third surface side of the second plate body. The second cover plate includes a third plate body, a third extension, and a third welded portion. The third plate body is connected to the second extension and has a step difference from the second plate body. The third extension is connected between the third plate body and the third welded portion. The second extension and the third extension are located on the same side of the third plate body. The inner surface of the second plate body, the welded surface of the fourth welded portion, and the welded surface of the third welded portion are located on the same plane. S2. The fourth surface side of the second plate body is turned towards the first surface side of the first plate body, and the welded surface of the first welded portion is brought into contact with the welded surface of the third welded portion. The welded surface of the second welded portion is brought into contact with the welded surface of the fourth welded portion. S3. Using a laser to irradiate the surface of the third welded portion opposite to the first welded portion, the third welded portion and the first welded portion are welded together. Similarly, using a laser to irradiate the surface of the second welded portion opposite to the fourth welded portion, the second welded portion and the fourth welded portion are welded together, such that the first cover and the second cover are joined to form a sealed space, thus forming at least a portion of a heat dissipation structure. S4. Providing a heat source and a first circuit board, and contacting the heat source with the third cover and / or the fourth cover, and placing the first circuit board on the side of the first cover away from the second cover and directly opposite the first cover. S5. Enclosing at least the first cover and the first circuit board to form a radiating cavity with a radiating opening, thus forming a cavity antenna.

[0044] The preparation method provided in the second aspect is used to prepare the electronic device provided in the first aspect, and therefore can achieve the same or corresponding beneficial effects as the solution provided in the first aspect, which will not be elaborated here. Furthermore, since the fourth extension portion is inclined relative to the second welding portion, welding from the side of the second welding portion away from the fourth welding portion using a laser restricts the diffusion of heat generated by the laser around the welding area, reducing heat diffusion from the welding area into the surrounding material, which is beneficial to improving welding efficiency and avoiding uneven heat distribution, thereby reducing welding deformation. Similarly, since the third extension portion is inclined relative to the third welding portion, welding from the side of the third welding portion away from the first welding portion using a laser restricts heat diffusion, which is beneficial to improving welding efficiency and reducing welding deformation. Attached Figure Description

[0045] To more clearly illustrate the technical solution of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0046] Figure 1 This is a top view of the internal structure of an electronic device in the related technology.

[0047] Figure 2 This is a top view of the internal structure of an electronic device in some embodiments of this application.

[0048] Figure 3 This is a schematic diagram of the heat dissipation structure and the first circuit board in the first embodiment of this application from a certain perspective.

[0049] Figure 4 for Figure 3 The diagram shows the heat dissipation structure and the first circuit board from another perspective.

[0050] Figure 5 for Figure 3 The diagram shows the heat dissipation structure and the first circuit board from another perspective.

[0051] Figure 6 for Figure 3 The diagram shows the heat dissipation structure and the first circuit board from another perspective.

[0052] Figure 7 for Figure 3 A magnified view of A in the middle.

[0053] Figure 8 for Figure 6 A magnified view of B in the middle.

[0054] Figure 9 This is a schematic diagram of the heat dissipation structure and the first circuit board in the second embodiment of this application from one perspective.

[0055] Figure 10 for Figure 9 The diagram shows the heat dissipation structure and the first circuit board from another perspective.

[0056] Figure 11 This is a schematic diagram of the heat dissipation structure and the first circuit board in the third embodiment of this application from a certain perspective.

[0057] Figure 12 for Figure 11 The diagram shows the heat dissipation structure and the first circuit board from another perspective.

[0058] Figure 13 for Figure 11 The diagram shows the heat dissipation structure and the first circuit board from another perspective.

[0059] Figure 14 This is a schematic diagram of the heat dissipation structure and the first circuit board in the fourth embodiment of this application from one perspective.

[0060] Figure 15 for Figure 14 The diagram shows the heat dissipation structure and the first circuit board from another perspective.

[0061] Figure 16 This is a schematic diagram of the heat dissipation structure and the first circuit board in the fifth embodiment of this application from a certain perspective.

[0062] Figure 17 for Figure 16 The diagram shows the heat dissipation structure and the first circuit board from another perspective.

[0063] Figure 18 This is a schematic diagram of the heat dissipation structure and the cross-sectional structure of the first circuit board in some embodiments of this application.

[0064] Figure 19 This is a schematic diagram of the cross-sectional structure of the heat dissipation body, extension and heat source in some embodiments of this application.

[0065] Figure 20 This is a cross-sectional structural diagram of the heat dissipation body, extension and heat source in other embodiments of this application.

[0066] Figure 21 This is a flowchart illustrating the fabrication method of an electronic device in some embodiments of this application.

[0067] Explanation of reference numerals in the attached figures:

[0068] 1-Electronic device; 101-Antenna module; 102-Heat dissipation module; 100-Electronic device; 10-Heat dissipation structure; 20-First circuit board; 30-Heat source; 411-Radiating port; 41-Radiating cavity; 40-Cavity antenna; 11-Heat dissipation body; 12-Extension; 13-Connecting part; 412-Cavity wall; 413-Side wall; 21-First edge; 22-Second edge; 121-Third edge; 122-Fourth edge; 23-Fifth edge; 24- Sixth edge; 123-Seventh edge; 124-Eighth edge; 413a-First sidewall; 413b-Second sidewall; 414-Conductive element; 13a-Extension structure; 14-Fin assembly; 141-Fin; 142-Channel; 1411-First end; 1412-Second end; 1413-Outer fin; 1413a-Outer fin body; 1413b-Outer fin extension; 60-Fan; 131-First sub-connection; 1311-Through hole; 132-Second sub-connecting part; 70-Heat distribution plate; 80-Cooling plate; 111-Heat dissipation main body; 112-Connecting transition part; 125-First cover plate; 126-Second cover plate; 113-Third cover plate; 114-Fourth cover plate; 15-First cover body; 16-Second cover body; 70-Sealed space; 1131-First plate body part; 1132-First extension part; 1141-Second plate body part; 1142-Second extension part; 1251-First welding part; 113 3-Second welding part; 1261-Third welding part; 1143-Fourth welding part; 1262-Third plate part; 1263-Third extension part; 1134-Fourth extension part; 1252-Fourth plate part; 1144-Fifth extension part; 17-First skirt; 18-Second skirt; 50-Shell; 51-Wave-transparent area; 1131a-First surface side; 1131b-Second surface side; 1141a-Third surface side; 1141b-Fourth surface side. Detailed Implementation

[0069] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0070] In the description of this application, the terms "first," "second," "third," "fourth," and "fifth," etc., are used to distinguish different objects, not to describe a specific order, and therefore should not be construed as limiting this application. The terms "upper," "lower," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this application.

[0071] In the description of this application, unless otherwise expressly specified and limited, the term "connection" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium; it can also refer to the internal connection of two components; it can be a communication connection; or it can be an electrical connection. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0072] In the description of the embodiments of this application, unless otherwise stated, " / " means "or". For example, a / b can mean a or b. "And / or" in the text is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, a and / or b can mean: a exists alone, a and b exist simultaneously, and b exists alone. In addition, in the description of the embodiments of this application, "multiple" means two or more.

[0073] It should be noted that the illustrations provided in the embodiments of this application are only schematic representations of the basic concept of this application. The illustrations only show the components related to this application and are not drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0074] In the description of this application, the words "exemplarily" or "for example" are used to indicate examples, illustrations, or explanations. Any embodiment or design described as "exemplarily" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or designs. Rather, the use of the words "exemplarily" or "for example" is intended to present the relevant concepts in a specific manner.

[0075] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The representation of this phrase in various locations throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0076] Please see Figure 1 , Figure 1 This is a top view of the internal structure of an electronic device 1 in the related art. The electronic device 1 includes an antenna module 101 and a heat dissipation module 102. To meet antenna performance requirements, the antenna module 101 needs to occupy a certain amount of space in the Y direction, which affects the design space of the heat dissipation module 102 in the Y direction. This causes the size of the heat dissipation module 102 in the Y direction to be compressed and reduced, thus affecting the heat dissipation performance of the heat dissipation module 102. If the heat dissipation module 102 is designed to occupy a large amount of space in the Y direction to meet heat dissipation performance requirements, it will compress the size of the antenna module 101 in the Y direction, thus affecting the antenna performance of the antenna module 101.

[0077] This application provides an electronic device that can reuse at least a portion of a heat dissipation structure as part of a cavity antenna structure, thereby effectively utilizing design space and enabling the electronic device to simultaneously possess good antenna performance and heat dissipation performance.

[0078] The electronic devices involved in the embodiments of this application can be various types of terminal devices, and the specific type of these devices is not limited in this application. For example, the electronic device can be a laptop computer, and can also include tablet computers, desktop computers, laptops, handheld computers, mobile phones, smart screens, wearable devices, augmented reality (AR) devices, virtual reality (VR) devices, artificial intelligence (AI) devices, in-vehicle systems, smart headphones, game consoles, and can also be Internet of Things (IoT) devices or smart home devices such as smart TVs, etc.

[0079] The electronic device provided in the embodiments of this application is described below.

[0080] Please see Figures 2 to 6 , Figure 2 This is a top view of the internal structure of the electronic device 100 in some embodiments of this application. Figure 3 This is a schematic diagram of the heat dissipation structure 10 and the first circuit board 20 in the first embodiment of this application from a certain perspective. Figure 4 for Figure 3 The diagram shows the structure of the heat dissipation structure 10 and the first circuit board 20 from another perspective. Figure 5 for Figure 3 The diagram shows the heat dissipation structure 10 and the first circuit board 20 from another perspective. Figure 6 for Figure 3 The diagram shows the heat dissipation structure 10 and the first circuit board 20 from another perspective. (See attached image.) Figure 2 As shown, the electronic device 100 includes a heat dissipation structure 10, a first circuit board 20, and a heat source 30. The heat dissipation structure 10 is in contact with the heat source 30, and the heat dissipation structure 10 is used to dissipate heat from the heat source 30. Figures 2 to 6 As shown, at least a portion of the heat dissipation structure 10 and the first circuit board 20 enclose a radiation cavity 41 with a radiation port 411, thereby forming a cavity antenna 40.

[0081] The cavity antenna 40 in the electronic device 100 provided in this application embodiment can resonate and amplify radio waves at specific frequencies using the radiating cavity, thereby improving the antenna's radiation efficiency and directivity. Furthermore, in this application embodiment, the cavity antenna 40 is formed by cooperating at least a portion of the heat dissipation structure 10 with the first circuit board 20, i.e., reusing at least a portion of the heat dissipation structure 10 as part of the radiating cavity 41 structure. This not only meets the design space requirements of the cavity antenna 40 but also increases the size of the heat dissipation structure 10, for example, increasing its size in the Y direction. Thus, the heat dissipation structure 10 and the cavity antenna 40 are structurally integrated, effectively utilizing the design space of the electronic device 100 and optimizing the overall layout of the electronic device 100. This not only gives the electronic device 100 good antenna performance but also improves its heat dissipation performance.

[0082] In some embodiments, the Y direction is generally parallel to the short side of the electronic device 100.

[0083] The heat source 30 may be a second circuit board, which may be the motherboard of the electronic device 100. The heat source 30 may also be a power supply, memory, hard drive, etc.

[0084] The first circuit board 20 may be a circuit board carrying antenna-related structures, such as a circuit board carrying radio frequency circuits, etc. The first circuit board 20 includes a metal layer, and the metal layer and at least a portion of the heat dissipation structure 10 enclose the cavity antenna 40.

[0085] In some embodiments, such as Figures 2 to 6As shown, the heat dissipation structure 10 includes a heat dissipation body 11, an extension 12, and a connecting part 13. The heat dissipation body 11 is in contact with the heat source 30. The extension 12 is connected to the edge of the heat dissipation body 11 and extends to a position directly opposite to the first circuit board 20 and is spaced apart from the first circuit board 20. The connecting part 13 is connected between the extension 12 and the first circuit board 20. The connecting part 13, the extension 12, and the first circuit board 20 enclose the radiation cavity 41.

[0086] The extension 12 and the first circuit board 20 form two opposing cavity walls 412 of the radiation cavity 41. The connecting portion 13 forms a sidewall 413 on a portion of the periphery of the radiation cavity 41. The other portion of the periphery of the radiation cavity 41 is open, forming the radiation port 411. That is, the connecting portion 13 closes part of the space between the first circuit board 20 and the extension 12, leaving an opening, which constitutes the radiation port 411. Both the extension 12 and the connecting portion 13 are made of conductive material, thus, together with the metal layer of the first circuit board 20, forming the conductive cavity walls 412 and sidewalls 413 of the radiation cavity 41. This allows electromagnetic wave signals to be radiated only through the radiation port 411, satisfying the operating conditions of the cavity antenna 40.

[0087] By providing an outwardly extending extension 12 at the edge of the heat dissipation body 11 and a connecting portion 13 connecting the extension 12 and the first circuit board 20, not only is a radiation cavity 41 of the cavity antenna 40 formed, but also the heat from the heat source 30 can be conducted from the heat dissipation body 11 to the extension 12 and the connecting portion 13, thereby increasing the heat dissipation area and helping to improve heat dissipation efficiency.

[0088] The sidewall 413 formed by the connecting portion 13 is projected as an open ring along a direction perpendicular to the first circuit board 20. In some embodiments, the projection may be arc-shaped, zigzag-shaped, etc. The direction perpendicular to the first circuit board 20 may be the direction perpendicular to the large surface of the first circuit board 20.

[0089] In some embodiments, the radiation cavity 41 may be in the shape of a cuboid, a cube, a sphere, or other three-dimensional shapes.

[0090] The materials of the extension 12 and the connecting part 13 may include metal.

[0091] In some embodiments, the first circuit board 20 is disposed on a first side of the heat source 30, and the extension 12 is connected to the edge of the heat dissipation body 11 and extends toward the first side to a position directly opposite the first circuit board 20 and spaced apart from the first circuit board 20. The first circuit board 20 and the extension 12 are located on the same side of the heat source 30, which is beneficial for forming the radiation cavity 41 and for making the internal structure of the electronic device 100 more compact.

[0092] Please see Figure 7 and Figure 8 , Figure 7 for Figure 3 Enlarged view of A in the middle. Figure 8 for Figure 6 A magnified view of B in the image. (See image below.) Figure 7 and Figure 8 As shown, the first circuit board 20 includes a first edge 21 and a second edge 22 opposite to each other, the second edge 22 being farther away from the heat dissipation body 11 than the first edge 21, and the extension 12 includes a third edge 121 and a fourth edge 122 opposite to each other, the fourth edge 122 being farther away from the heat dissipation body 11 than the third edge 121.

[0093] The projection of the third edge 121 onto the first circuit board 20 in a direction perpendicular to the first circuit board 20 may coincide with or be spaced apart from the first edge 21. That is, the third edge 121 and the first edge 21 may be directly opposite each other or offset. Similarly, the projection of the fourth edge 122 onto the first circuit board 20 in a direction perpendicular to the first circuit board 20 may coincide with or be spaced apart from the second edge 22. That is, the fourth edge 122 and the second edge 22 may be directly opposite each other or offset.

[0094] In some embodiments, such as Figure 7 and Figure 8 As shown, the first circuit board 20 may further include a fifth edge 23 and a sixth edge 24, which are connected end-to-end to form the edge of the first circuit board 20. The extension 12 may further include a seventh edge 123 and an eighth edge 124, which are connected end-to-end to form the edge of the extension 12.

[0095] In some embodiments, such as Figures 3 to 6As shown, the sidewall 413 of the radiation cavity 41 formed by the connecting portion 13 includes a first sidewall 413a and a second sidewall 413b that are connected to each other. The first sidewall 413a is connected between the first edge 21 and the third edge 121, and the second sidewall 413b is adjacent to the first sidewall 413a. The first sidewall 413a, connected between the first edge 21 and the third edge 121, prevents the radiation port 411 from facing the heat source 30 and avoids the radiation port 411 from facing the interior of the electronic device 100, thereby facilitating signal transmission by the cavity antenna 40.

[0096] In some embodiments, the second sidewall 413b is connected between the fifth edge 23 and the seventh edge 123, and / or between the sixth edge 24 and the eighth edge 124, and / or between the second edge 22 and the fourth edge 122.

[0097] In some embodiments, at least a portion of the connecting portion 13 is an extension structure extending further from the edge of the extension portion 12. This simplifies the manufacturing process of the connecting portion 13 and reduces production costs.

[0098] In some embodiments, the extension structure extends from a portion of the edge of the extension 12 toward the first circuit board 20 and connects to the first circuit board 20, forming at least a portion of the connection portion 13, i.e., at least a portion of the sidewall 413. Extending the extension structure from a portion of the edge of the extension 12 helps reduce manufacturing difficulty and improve processing efficiency.

[0099] In some embodiments, the portion of the extension structure extending near the first circuit board 20 can be connected to the first circuit board 20 via a conductive element 414 to improve sealing and conductive contact stability, and to maintain the sidewalls formed by the extension structure as complete conductive sidewalls, thereby improving antenna performance. The conductive element 414 can be conductive foam and / or conductive cloth. In other embodiments, the portion of the extension structure extending near the first circuit board 20 is soldered to the first circuit board 20. Obviously, the extension structure and the first circuit board 20 can also be connected through other connection methods.

[0100] In some embodiments, the extension structure extends toward the first circuit board 20 from at least a portion of at least one of the third edge 121, the fourth edge 122, the seventh edge 123, and the eighth edge 124 and connects to the first circuit board 20 to form at least a portion of the connection portion 13, i.e., at least a portion of the sidewall 413.

[0101] In some embodiments, the extension structure extends toward the first edge 21 from at least a portion of the third edge 121 and connects with the first edge 21 to form at least a portion of the first sidewall 413a.

[0102] In some embodiments, such as Figure 7 As shown, the extension structure 13a extends from the third edge 121 near the seventh edge 123 toward the first edge 21, forming a portion of the first sidewall 413a. Alternatively, the extension structure 13a may extend from the third edge 121 near the eighth edge 124 toward the first edge 21, forming a portion of the first sidewall 413a. The remaining portion of the first sidewall 413a may be composed of at least some of the fins described below, or may be composed of a metal piece connecting the third edge 121 and the first edge 21.

[0103] In other embodiments, the extension structure 13a extends from the entire position of the third edge 121 toward the first edge 21 to form the entire first sidewall 413a.

[0104] In some embodiments, the extension structure 13a extends from at least a portion of the eighth edge 124 toward the sixth edge 24 and connects with the sixth edge 24 to form at least a portion of the second sidewall 413b. Alternatively, the extension structure 13a extends from the entire location of the eighth edge 124 toward the sixth edge 24 to form the entirety of the second sidewall 413b.

[0105] In other embodiments, the extension structure 13a may extend from the eighth edge 124 toward the sixth edge 24 near the third edge 121 or near the fourth edge 122, forming a portion of the second sidewall 413b. The remaining portion of the second sidewall 413b may be constituted by at least a portion of the fins described below, or by a metal element connecting the eighth edge 124 and the sixth edge 24.

[0106] The extension structure 13a may also extend toward the first circuit board 20 from at least a portion of the other edge of the extension portion 12 and connect to the first circuit board 20, for example, extending toward the fifth edge 23 from at least a portion of the seventh edge 123. The specific structure can be referred to the case of extending from the third edge 121 and the eighth edge 124 described above, which will not be described in detail here.

[0107] In some embodiments, the extension structure 13a includes a first extension structure and a second extension structure. The first extension structure extends from at least a portion of the third edge 121 toward the first edge 21 and connects to the first edge 21, thereby forming at least a portion of the first sidewall 413a. The second extension structure extends from at least a portion of the eighth edge 124 toward the sixth edge 24 and connects to the sixth edge 24, or extends from at least a portion of the seventh edge 123 toward the fifth edge 23 and connects to the fifth edge 23, thereby forming at least a portion of the second sidewall 413b.

[0108] The extension structure 13a and the extension portion 12 can be integrally formed, or they can be connected by means of screwing, welding, riveting, snap-fitting, etc., or they can be connected by the conductive component 414 to achieve conductive and sealed connection. The conductive component 414 can be conductive foam and / or conductive cloth.

[0109] In some embodiments, such as Figures 3 to 6 As shown, the heat dissipation structure 10 further includes a fin assembly 14. A portion of the heat dissipation body 11 is in contact with the heat source 30, and the fin assembly 14 is located in the area of ​​the heat dissipation body 11 that is not in contact with the heat source 30, thereby improving heat dissipation efficiency. The fin assembly 14 is located on the first side of the heat source 30. The heat generated by the heat source 30 is conducted to the fin assembly 14 through the heat dissipation body 11, and the fin assembly 14 can dissipate the heat from the heat source 30 through air convection, thus improving heat dissipation performance.

[0110] In some embodiments, at least a portion of the fin assembly 14 is connected to the extension 12 and the first circuit board 20, wherein at least a portion of the connection portion 13 is the portion of the fin assembly 14 connected to the extension 12 and the first circuit board 20. Thus, at least a portion of the fin assembly 14 is reused as part of the structure of the radiating cavity 41, thereby structurally integrating the fin assembly 14 and the cavity antenna 40.

[0111] Please see Figures 9 to 12 , Figure 9 This is a schematic diagram of the heat dissipation structure 10 and the first circuit board 20 in the second embodiment of this application from a certain perspective. Figure 10 for Figure 9 The diagram shows the structure of the heat dissipation structure 10 and the first circuit board 20 from another perspective. Figure 11 This is a schematic diagram of the heat dissipation structure 10 and the first circuit board 20 in the third embodiment of this application from a certain perspective. Figure 12 for Figure 11The diagram shows the structure of the heat dissipation structure 10 and the first circuit board 20 from another perspective. Figure 13 for Figure 11 The diagram shows the heat dissipation structure 10 and the first circuit board 20 from another perspective. In some embodiments, such as... Figures 9 to 12 As shown, the fin assembly 14 includes a plurality of fins 141 arranged at intervals, with a channel 142 between adjacent fins 141. The plurality of fins 141 are closer to the third edge 121 than the heat source 30. At least a portion of the plurality of fins 141 are connected between the extension 12 and the first circuit board 20, forming at least a portion of the connection portion 13. The material of the fins 141 may include a metallic material.

[0112] By arranging multiple fins 141 at intervals, the heat dissipation area can be further increased. Furthermore, by positioning the multiple fins 141 close to the third edge 121, i.e., close to the extension 12, it is beneficial for the multiple fins 141 and the extension 12 to dissipate heat conducted from the heat dissipation body 11 outwards. Additionally, it is beneficial for at least a portion of the multiple fins 141 to be connected to both the extension 12 and the first circuit board 20, thus forming at least a portion of the connection portion 13.

[0113] In some embodiments, the extending direction of the fins 141 is perpendicular to the arrangement direction of the plurality of fins 141, and the arrangement direction of the plurality of fins 141 is parallel to the first edge 21 or the third edge 121, wherein the extending direction of each fin 141 is perpendicular to the first edge 21 or the third edge 121. The perpendicularity may be approximately perpendicular, and the parallelism may be approximately parallel.

[0114] In some embodiments, each fin 141 may be elongated, and the extension direction of each fin 141 is the length direction of the fin 141. In other embodiments, the fin 141 may also be in other shapes.

[0115] When at least some of the plurality of fins 141 form at least a portion of the first sidewall 413a, the size of the channel 142 between two adjacent fins 141 and the size of each fin 141 can be set according to the antenna performance requirements.

[0116] In some embodiments, such as Figures 9 to 12As shown, at least some of the plurality of fins 141 are connected between the extension 12 and the first circuit board 20, forming at least a portion of the first sidewall 413a and / or at least a portion of the second sidewall 413b. By reusing the at least some of the fins 141 as part of the sidewall 413 of the radiating cavity 41, the internal space utilization of the electronic device 100 can be improved, making the overall structure more compact, while simultaneously taking into account heat dissipation performance and antenna performance.

[0117] Please see Figure 9 and Figure 10 , Figure 9 and Figure 10 The fin assembly 14 is illustrated to form at least a portion of the first sidewall 413a. In some embodiments, such as Figure 9 and Figure 10 As shown, each fin 141 includes a first end 1411 and a second end 1412 along the extending direction, with the first end 1411 being closer to the first circuit board 20 and the extension 12 than the second end 1412. At least a portion of the fins 141 have their first ends 1411 connected to the first edge 21 and the third edge 121 to form at least a portion of the first sidewall 413a of the radiation cavity 41. The at least a portion of the fins 141 may be multiple fins 141.

[0118] Thus, the first end 1411 of at least some of the fins 141 is reused as at least part of the first sidewall 413a of the radiation cavity 41, so that the plurality of fins 141 maintain their own heat dissipation function and also avoid the structural complexity of the plurality of fins 141.

[0119] In some embodiments, the first end 1411 of the at least partial fin 141 forms the first sidewall 413a.

[0120] In other embodiments, the first end 1411 of at least some of the fins 141 is connected to a portion of the first edge 21 and a portion of the third edge 121 to form a portion of the first sidewall 413a. At least a portion of the extension structure 13a is connected to the remaining portion of the third edge 121 and extends toward the remaining portion of the first edge 21, and connects with the remaining portion of the first edge 21 to form the remaining portion of the first sidewall 413a. That is, the first end 1411 of at least some of the fins 141 and at least a portion of the extension structure 13a constitute the first sidewall 413a.

[0121] For example, the extension structure 13a extends from the third edge 121 near the seventh edge 123 toward the first edge 21 and connects to the portion of the first edge 21 near the fifth edge 23. The first end 1411 of the at least partial fin 141 connects between the remaining portion of the third edge 121 and the remaining portion of the first edge 21. Thus, the first end 1411 of the at least partial fin 141 and the extension structure 13a constitute the first sidewall 413a.

[0122] Please see Figure 11 and Figure 13 , Figure 11 and Figure 13 This illustrates that the fin assembly 14 forms at least a portion of the second sidewall 413b. In some embodiments, such as Figure 11 and Figure 13 As shown, at least one of the plurality of fins 141 extends along the extension direction to the region between the first circuit board 20 and the extension portion 12, and is connected to both the first circuit board 20 and the extension portion 12 to form at least a portion of the second sidewall 413b of the radiation cavity 41. The at least one fin 141 may be one or more.

[0123] Thus, the extension of at least one fin 141 is reused as at least a portion of the second sidewall 413b of the radiation cavity 41, making it possible to reduce or even eliminate the need for additional components to construct the second sidewall 413b.

[0124] In some embodiments, at least one fin 141 extends past the first edge 21 and the third edge 121, and extends close to the second edge 22 and the fourth edge 122. The portion of the at least one fin 141 extending past the first edge 21 and the third edge 121 and located between the first circuit board 20 and the extension 12 forms the second sidewall 413b of the radiation cavity 41.

[0125] For example, such as Figure 11 and Figure 13 As shown, the at least one fin 141 is the outermost fin 1413 among the plurality of fins 141. The outer fin 1413 includes an outer fin body portion 1413a and an outer fin extension portion 1413b. The outer fin extension portion 1413b extends along the extension direction past the first edge 21 and the third edge 121, and extends to near the second edge 22 and the fourth edge 122. The outer fin extension portion 1413b constitutes at least a portion of the second sidewall 413b.

[0126] In some embodiments, the second sidewall 413b is connected between the eighth edge 124 and the sixth edge 24, and the portion of the at least one fin 141 extending between the first circuit board 20 and the extension 12 is connected between the eighth edge 124 and the sixth edge 24 to form the second sidewall 413b. In other embodiments, the second sidewall 413b is connected between the seventh edge 123 and the fifth edge 23, and the portion of the at least one fin 141 extending between the first circuit board 20 and the extension 12 is connected between the seventh edge 123 and the fifth edge 23 to form the second sidewall 413b.

[0127] In some embodiments, the second sidewall 413b is connected between the eighth edge 124 and the sixth edge 24, the at least one fin 141 extends through the first edge 21 and the third edge 121 and extends to the middle position of the sixth edge 24 and the eighth edge 124 to form a portion of the second sidewall 413b, and at least a portion of the extension structure 13a extends from the eighth edge 124 near the fourth edge 122 toward the sixth edge 24 and connects with the sixth edge 24 to form the remaining portion of the second sidewall 413b. In other embodiments, the second sidewall 413b is connected between the seventh edge 123 and the fifth edge 23. At least one fin 141 extends through the first edge 21 and the third edge 121, reaching the midpoint between the seventh edge 123 and the fifth edge 23, forming a portion of the second sidewall 413b. At least a portion of the extension structure 13a extends from the seventh edge 123 near the fourth edge 122 toward the fifth edge 23 and connects with the fifth edge 23, forming the remaining portion of the second sidewall 413b. That is, the portion of the at least one fin 141 located between the extension 12 and the first circuit board 20, and at least a portion of the extension structure 13a constitute the second sidewall 413b.

[0128] Please see Figure 14 and Figure 15 , Figure 14 This is a schematic diagram of the heat dissipation structure 10 and the first circuit board 20 from a certain perspective in the fourth embodiment of this application. Figure 15 for Figure 14 The diagram shows the heat dissipation structure 10 and the first circuit board 20 from another perspective. (See attached image.) Figure 14 and Figure 15As shown, the first sidewall 413a may be formed by at least a portion of the first end 1411 of the plurality of fins 141, and the second sidewall 413b may be formed by the outer fin extension 1413b of the outer fin 1413 of the plurality of fins 141.

[0129] In some embodiments, such as Figure 2 As shown, the electronic device 100 further includes at least one fan 60, located on the side of the fin assembly 141 away from the first circuit board 20, for dissipating heat from the heat source 30. At least a portion of the plurality of fins 141 have a channel 142 between adjacent fins 141 communicating with the radiation cavity 41. This allows air to flow smoothly through the channel 142 and the radiation cavity 41, facilitating the fan 60's transfer of heat from the fins 141 to the external environment via the channel 142 and the radiation cavity 41.

[0130] In some embodiments, such as Figures 3 to 15 As shown, the connecting portion 13 includes a first sub-connecting portion 131, which connects the portion of the sidewall 413 formed between the first edge 21 and the third edge 121, i.e., forms the first sidewall 413a. The projections of the plurality of fins 141 along the extending direction at least partially overlap with the first sub-connecting portion 131. Figure 5 , Figure 6 , Figure 12 As shown, the first sub-connecting portion 131 has multiple through holes 1311, each through hole 1311 extending through the first sub-connecting portion 131 along the extending direction of the fins 141, so that the channel 142 between two adjacent fins 141 communicates with the interior of the radiation cavity 41. Since the projections of the multiple fins 141 along the extending direction at least partially overlap with the first sub-connecting portion 131, the projections of the channel 142 between the multiple fins 141 at least partially overlap with the first sub-connecting portion 131, thereby shortening the airflow path and enabling the fan 60 to guide airflow more efficiently through the fins 141 and the through holes 1311, thereby enhancing the heat dissipation effect.

[0131] The size of each through hole 1311 and the gap between two adjacent through holes 1311 can be set according to the antenna performance requirements.

[0132] In some embodiments, the plurality of through holes 1311 are directly opposite to the plurality of channels 142 of the fin assembly 14, further shortening the airflow path.

[0133] In some embodiments, such as Figures 3 to 15As shown, the first sub-connection portion 131 may be composed of the aforementioned extension structure 13a and / or at least a portion of the aforementioned plurality of fins 141. In other embodiments, the first sub-connection portion 131 may be a first metal member connected between the first edge 21 and the third edge 121, the first metal member being connected to the first edge 21 and the third edge 121 by means of welding, screwing, riveting, snapping, etc. Wherein, the conductive element 414 may be provided at the connection between the first metal member and the first edge 21 and the third edge 121 to improve sealing and conductive contact stability, thereby improving antenna performance; the conductive element 414 may be conductive foam and / or conductive cloth.

[0134] In some embodiments, such as Figures 3 to 15 As shown, the connecting portion 13 further includes a second sub-connecting portion 132, which forms the second sidewall 413b. The second sub-connecting portion 132 may be composed of the aforementioned extension structure 13a and / or at least one fin 141 of the aforementioned plurality of fins 141. Alternatively, the second sub-connecting portion 132 may be a second metal component connecting the extension portion 12 and the first circuit board 20, the second metal component being connected to the extension portion 12 and the first circuit board 20 by welding, screwing, riveting, snap-fitting, or other methods. A conductive component 414 may be provided at the connection point between the second metal component and the extension portion 12 and the first circuit board 20, the conductive component 414 being conductive foam and / or conductive cloth.

[0135] In some embodiments, the extending direction of the first sub-connecting portion 131 is parallel to the extending direction of the first edge 21 or the second edge 22, wherein the parallelism may be substantially parallel. The extending direction of the second sub-connecting portion 132 is parallel to the extending direction of the sixth edge 24 or the eighth edge 124, wherein the parallelism may be substantially parallel.

[0136] In some embodiments, such as Figures 3 to 15 As shown, the heat dissipation structure 10 includes a heat spreader 70, the heat dissipation body 11 is the main body portion of the heat spreader 70, and the extension portion 12 is the extension portion of the heat spreader 70. The heat spreader 70 includes a main body portion and an extension portion, the extension portion extending from the edge of the main body portion.

[0137] Thus, a portion of the heat spreader 70 is reused as part of the structure of the radiation cavity 41, thereby achieving structural integration between the heat spreader 70 and the cavity antenna 40.

[0138] The heat dissipation plate along Figure 2The portion of the heat source 30 away from the Y direction shown is the cold end. By setting the extension 12 to extend outward from the edge of the heat dissipation body 11, it is equivalent to increasing the width of the cold end of the heat spreader, that is, increasing the size of the cold end in the Y direction, so that the vapor space at the cold end is more sufficient, which helps to improve the heat dissipation efficiency of the heat spreader.

[0139] The heat spreader can be any existing heat spreader, and the structure of the heat spreader will not be described in detail here.

[0140] In some embodiments, the heat dissipation structure 10 includes a cooling plate, the heat dissipation body 11 is the main body portion of the cooling plate, and the extension portion 12 is an extension portion of the cooling plate. The cooling plate includes a main body portion and an extension portion, the extension portion extending from the edge of the main body portion.

[0141] Thus, a portion of the cooling plate is reused as part of the structure of the radiating cavity 41, thereby achieving structural integration between the cooling plate and the cavity antenna 40.

[0142] By setting the extension 12 to extend outward from the edge of the heat dissipation body 11, it is equivalent to increasing the length of the flow channel inside the cooling plate, which is conducive to the flow of more coolant to remove the heat from the heat source 30, thereby improving the heat dissipation efficiency of the cooling plate.

[0143] The cooling plate can be any existing type of cooling plate; the structure of the cooling plate will not be described in detail here.

[0144] Please see Figure 16 and Figure 17 , Figure 16 This is a schematic diagram of the heat dissipation structure 10 and the first circuit board 20 in the fifth embodiment of this application from a certain perspective. Figure 17 for Figure 16 The diagram shows the heat dissipation structure 10 and the first circuit board 20 from another perspective. In some embodiments, such as... Figure 16 and Figure 17As shown, the heat dissipation structure 10 includes a heat spreader 70 and a cooling plate 80 stacked together. The heat dissipation body 11 is the main body portion of the stacked heat spreader 70 and cooling plate 80, that is, the main body portion of the overall structure of the heat spreader 70 and the cooling plate 80 constitutes the heat dissipation body 11. The extension portion 12 is an extension portion of the heat spreader 70 and / or the cooling plate 80, that is, the heat spreader 70 includes an extension portion and / or the cooling plate 80 includes an extension portion, and the extension portions of the heat spreader 70 and / or the cooling plate 80 constitute the extension portion 12. When the heat spreader 70 includes an extension portion, the extension portion extends from the edge of the main body portion of the overall structure. When the cooling plate 80 includes an extension portion, the extension portion extends from the edge of the main body portion of the overall structure.

[0145] Thus, a portion of the heat spreader 70 and / or a portion of the cooling plate 80 are reused as part of the structure of the radiation cavity 41, thereby structurally integrating the heat spreader 70 and / or the cooling plate 80 with the cavity antenna 40.

[0146] In some implementations, the cooling plate 80 is located on the side of the heat spreader 70 opposite to the first circuit board 20, or the heat spreader 70 is located on the side of the cooling plate 80 opposite to the first circuit board 20.

[0147] In some embodiments, the heat dissipation structure 10 includes at least one metal sheet and at least one heat-conducting sheet alternately stacked, the heat dissipation body 11 is a portion formed by alternately stacking the main body portion of the at least one metal sheet and at least a portion of the at least one heat-conducting sheet, and the extension portion 12 is at least an extension portion of the at least one metal sheet.

[0148] Each metal sheet includes a main body portion and an extension portion, the extension portion extending from the edge of the main body portion.

[0149] In some embodiments, the heat-conducting sheet and the main body portion of the metal sheet are opposite to and stacked, the heat dissipation body 11 is the main body portion of the at least one metal sheet and the at least one heat-conducting sheet, and the extension portion 12 is an extension portion of the at least one metal sheet. In other embodiments, the heat-conducting sheet includes a main body portion and an extension portion, the extension portion extending from the edge of the main body portion. The main body portion of the heat-conducting sheet and the main body portion of the metal sheet are opposite to and stacked, and the extension portion of the heat-conducting sheet and the extension portion of the metal sheet are opposite to and stacked. The heat dissipation body 11 is the main body portion of the at least one metal sheet and the main body portion of the at least one heat-conducting sheet, and the extension portion 12 is an extension portion of the at least one metal sheet and the extension portion of the at least one heat-conducting sheet.

[0150] Thus, a portion of the metal sheet of the heat dissipation structure 10 is reused as part of the structure of the radiation cavity 41, thereby achieving structural integration of the metal sheet and the cavity antenna 40.

[0151] Both the metal sheet and the heat-conducting sheet can dissipate heat generated by the heat source 30. The metal sheet can be made of aluminum, copper, silver, gold, etc., and the heat-conducting sheet can be made of graphite, silicon carbide, graphene, etc.

[0152] Please see Figure 18 This is a schematic cross-sectional view of the heat dissipation structure 10 and the first circuit board 20 in some embodiments of this application. Figure 18 The diagram illustrates the cross-sectional structure of the heat dissipation structure 10 and the first circuit board 20 along the Y direction. In some embodiments, such as... Figure 18 As shown, the heat dissipation body 11 includes a heat dissipation body portion 111 and a connecting transition portion 112, wherein the connecting transition portion 112 is connected to the edge of the heat dissipation body portion 111 and extends in a direction away from the first circuit board 20 to connect with the extension portion 12. The connection between the extension portion 12 and the heat dissipation body portion 111 at the edge of the connecting transition portion 112 has a step difference, and the heat dissipation body portion 111, the connecting transition portion 112, and the extension portion 12 are stepped.

[0153] If the extension 12 and the heat dissipation body 11 are located on the same plane, the distance between the extension 12 and the first circuit board 20 will be small, which may cause the height of the radiating cavity 41 to fail to meet the antenna performance requirements. In this embodiment, by setting the connecting transition portion 112 to extend from the edge of the heat dissipation body 111 in a direction away from the first circuit board 20, a step difference is created between the extension 12 and the edge of the heat dissipation body 11, thereby increasing the distance between the extension 12 and the first circuit board 20, and thus ensuring that the height of the radiating cavity 41 meets the antenna performance requirements.

[0154] In some embodiments, such as Figure 18 As shown, the heat source 30 and the first circuit board 20 may be located on the same side of the heat dissipation structure 10 to reduce the space occupied by the heat source 30, the first circuit board 20, and the heat dissipation structure 10. In other embodiments, the heat source 30 and the first circuit board 20 may be located on opposite sides of the heat dissipation structure 10.

[0155] Please see Figure 19 and Figure 20 , Figure 19 This is a schematic cross-sectional view of the heat dissipation body 11, extension 12, and heat source 30 in some embodiments of this application. Figure 20 This is a schematic cross-sectional view of the heat dissipation body 11, extension 12, and heat source 30 in other embodiments of this application. Figure 19 and Figure 20 The diagram illustrates the cross-sectional structure of the heat dissipation structure 10 and the first circuit board 20 along the Y direction. In some embodiments, such as... Figure 19 and Figure 20 As shown, the extension 12 includes a first cover plate 125 and a second cover plate 126 disposed opposite to each other, and the heat dissipation body 11 includes a third cover plate 113 and a fourth cover plate 114 disposed opposite to each other. The first cover plate 125 and the third cover plate 113 are connected to form a first cover 15, and the second cover plate 126 and the fourth cover plate 114 are connected to form a second cover 16. The first cover 15 and the second cover 16 are joined to form a sealed space, which is used to contain the cooling medium.

[0156] The third cover plate 113 and / or the fourth cover plate 114 are in contact with the heat source 30, for example, as shown in the image. Figure 19 and Figure 20 As shown, the third cover plate 113 is in contact with the heat source 30.

[0157] The first circuit board 20 is disposed on the side of the first cover plate 125 away from the second cover plate 126 and directly opposite the first cover plate 125, and the connecting part 13 is connected between the first circuit board 20 and the first cover plate 125.

[0158] By setting the heat dissipation body 11 to include two cover plates and the extension 12 to include two cover plates, and joining the four cover plates to form a sealed space for accommodating the cooling medium, the heat source 30 can be dissipated using the cooling medium, thereby improving the heat dissipation efficiency.

[0159] In some embodiments, the heat dissipation structure 10 includes the heat spreader 70, the first cover 15 and the second cover 16 may be the upper and lower covers of the heat spreader 70, respectively, and the cooling medium may be a cooling medium contained within the heat spreader 70. The heat spreader 70 may also include other structures, such as capillary structures, support structures, etc.

[0160] In some embodiments, the heat dissipation structure 10 includes a cooling plate 80, the first cover 15 and the second cover 16 may be the upper and lower covers of the cooling plate 80, respectively, and the cooling medium may be a cooling medium that flows within the cooling plate 80. The cooling plate 80 also has flow channels to allow the cooling medium to flow and carry away the heat from the heat source 30.

[0161] The cooling medium may be, for example, water, ethylene glycol, propylene glycol, glycerin, cooling oil, etc.

[0162] In some embodiments, such as Figure 19 and Figure 20 As shown, the third cover plate 113 includes a first plate portion 1131 and a first extension portion 1132 connected to each other. The first extension portion 1132 is connected to the edge of the first plate portion 1131 and extends in a direction away from the first circuit board 20. The first cover plate 125 is connected to the end of the first extension portion 1132 away from the first plate portion 1131. The first cover plate 125 is stepped away from the first plate portion 1131, and the first plate portion 1131, the first extension portion 1132, and the first cover plate 125 are stepped.

[0163] If the first cover plate 125, the first extension portion 1132, and the first plate body portion 1131 are located on the same plane, the distance between the first cover plate 125 and the first circuit board 20 will be small, which may cause the height of the radiating cavity 41 to fail to meet the antenna performance requirements. In this embodiment, by setting the first extension portion 1132 to extend from the edge of the first plate body portion 1131 in a direction away from the first circuit board 20, a step difference is created between the first cover plate 125 and the first plate body portion 1131, thereby increasing the distance between the first cover plate 125 and the first circuit board 20, and thus ensuring that the height of the radiating cavity 41 meets the antenna performance requirements.

[0164] In some embodiments, such as Figure 19 and Figure 20 As shown, the fourth cover plate 114 includes a second plate portion 1141 and a second extension portion 1142 connected to each other. The second extension portion 1142 is connected to the edge of the second plate portion 1141 and extends in a direction away from the first circuit board 20. The second cover plate 126 is connected to one end of the second extension portion 1142 away from the second plate portion 1141. This increases the space between the first cover plate 125 and the second cover plate 126, providing sufficient space for the cooling medium to flow, thereby ensuring better heat dissipation performance.

[0165] In some embodiments, the first extension 1132 and the second extension 1142 are substantially parallel.

[0166] In some embodiments, such as Figure 19 and Figure 20As shown, the first cover 15 includes a first welded portion 1251 and a second welded portion 1133. The first welded portion 1251 is the end of the first cover plate 125 away from the first extension portion 1132, and the second welded portion 1133 is the end of the first cover plate 125 away from the first cover plate 125. The second cover 16 includes a third welded portion 1261 and a fourth welded portion 1143. The third welded portion 1261 is the end of the second cover plate 126 away from the fourth cover plate 114, and the fourth welded portion 1143 is the end of the fourth cover plate 114 away from the second cover plate 126. The first welded portion 1251 is welded to the third welded portion 1261, and the second welded portion 1133 is welded to the fourth welded portion 1143.

[0167] The welding surface of the first welding part 1251 is in contact with the welding surface of the third welding part 1261, and the welding surface of the second welding part 1133 is in contact with the welding surface of the fourth welding part 1143.

[0168] In some embodiments, such as Figure 20 As shown, the welding surfaces of the first welding part 1251 and the second welding part 1133 are located on the same plane, and the welding surfaces of the third welding part 1261 and the fourth welding part 1143 are located on the same plane. This ensures that the distance between the welding areas of the first welding part 1251 and the third welding part 1261 and the laser device is approximately equal to the distance between the welding areas of the second welding part 1133 and the fourth welding part 1143 and the laser device. Therefore, the same laser device parameters can be used to weld the first welding part 1251 and the third welding part 1261, and the second welding part 1133 and the fourth welding part 1143. This results in the energy received by the welding areas of the first welding part 1251 and the third welding part 1261 being approximately the same as the energy received by the welding areas of the second welding part 1133 and the fourth welding part 1143. Consequently, both welding areas can achieve a more stable weld, reducing the welding defect rate.

[0169] In other embodiments, such as Figure 19 As shown, the welding surface of the first welding part 1251 is not on the same plane as the welding surface of the second welding part 1133, and the welding surface of the third welding part 1261 is not on the same plane as the welding surface of the fourth welding part 1143.

[0170] In some embodiments, such as Figure 20As shown, the fourth cover plate 114 includes a second plate portion 1141 and a second extension portion 1142 and a fourth welding portion 1143 respectively connected to opposite ends of the second plate portion 1141. The second extension portion 1142 is connected to the edge of the second plate portion 1141 and extends in a direction away from the first circuit board 20. The second cover plate 126 includes a third plate portion 1262, a third extension portion 1263 and a third welding portion 1261. The third plate portion 1262 is connected to the second extension portion 1142 and has a step difference from the second plate portion 1141. The third extension portion 1263 is connected to the edge of the third plate portion 1262 and extends in a direction close to the first circuit board 20 to connect with the third welding portion 1261. The inner surface of the second plate portion 1141, the welding surface of the fourth welding portion 1143 and the welding surface of the third welding portion 1261 are located in the same plane. The third cover plate 113 further includes a fourth extension portion 1134, which is connected to the edge of the first plate body portion 1131 and extends along the direction close to the fourth cover plate 114 to connect with the second welding portion 1133. The first cover plate 125 includes a fourth plate body portion 1252 and the first welding portion 1251. The fourth plate body portion 1252 is connected between the first extension portion 1132 and the first welding portion 1251. The inner surface of the fourth plate body portion 1252, the welding surface of the first welding portion 1251, and the welding surface of the second welding portion 1133 are located on the same plane.

[0171] In some embodiments, obtuse angles are formed between the first extension portion 1132 and the first plate portion 1131, between the fourth extension portion 1134 and the first plate portion 1131, and between the fourth extension portion 1134 and the second welded portion 1133. Obtuse angles are also formed between the second extension portion 1142 and the second plate portion 1141, between the third plate portion 1262 and the second extension portion 1142, between the third plate portion 1262 and the third extension portion 1263, and between the third extension portion 1263 and the third welded portion 1261.

[0172] By including the fourth extension 1134 in the third cover plate 113, and having the fourth extension 1134 and the first extension 1132 located on the same side of the first plate body 1131, it is advantageous to ensure that the welding surface of the second welding part 1133 is on the same plane as the welding surface of the first welding part 1251. Furthermore, by arranging the second plate body 1141 and the fourth welding part 1143 on the same plane, and having the second extension 1142 and the third extension 1263 located on the same side of the third plate body 1262, it is advantageous to ensure that the welding surface of the third welding part 1261 is on the same plane as the welding surface of the fourth welding part 1143. This facilitates subsequent laser welding of the two welding positions.

[0173] In other embodiments, such as Figure 19 As shown, the third cover plate 113 does not include the fourth extension portion 1134, and the inner surface of the first plate body portion 1131 and the welding surface of the second welding portion 1133 are located on the same plane. The fourth cover plate 114 includes a fifth extension portion 1144, which connects to the edge of the second plate body portion 1141 and extends along a direction close to the third cover plate 113 to connect with the fourth welding portion 1143. The fifth extension portion 1144 is substantially parallel to the first extension portion 1132. Obtuse angles are formed between the fifth extension portion 1144 and the fourth welding portion 1143, and between the fifth extension portion 1144 and the second plate body portion 1141.

[0174] In some embodiments, the first plate portion 1131 is substantially parallel to the second plate portion 1141, and the third plate portion 1262 and the fourth plate portion 1252 are substantially parallel.

[0175] In some embodiments, such as Figure 19 and Figure 20 As shown, the first cover plate 125 and the second cover plate 126 constitute the extension 12, and the fourth cover plate 114 and the third cover plate 113 constitute the heat dissipation body 11.

[0176] In some embodiments, when welding the first weld portion 1251 and the third weld portion 1261, laser welding can be performed from the side of the first weld portion 1251 opposite to the third weld portion 1261, or laser welding can be performed from the side of the third weld portion 1261 opposite to the first weld portion 1251. When welding the second weld portion 1133 and the fourth weld portion 1143, laser welding can be performed from the side of the second weld portion 1133 opposite to the fourth weld portion 1143, or laser welding can be performed from the side of the fourth weld portion 1143 opposite to the second weld portion 1133. The welding of the first weld portion 1251 and the second weld portion 1133, and the welding of the third weld portion 1261 and the fourth weld portion 1143, can be performed simultaneously or in stages.

[0177] In some embodiments, the edge of the first cover plate 125 near the heat dissipation body 11 and the edge of the second cover plate 126 near the heat dissipation body 11 form the aforementioned third edge 121, the edge of the first cover plate 125 away from the heat dissipation body 11 and the edge of the second cover plate 126 away from the heat dissipation body 11 form the aforementioned fourth edge 122, and the two opposite edges of the first cover plate 125 along the Y direction and the two opposite edges of the second cover plate 126 along the Y direction respectively form the aforementioned seventh edge 123 and the aforementioned eighth edge 124.

[0178] In some embodiments, the extension structure 13a extends from a portion of the edge of the first cover plate 125 and / or a portion of the edge of the second cover plate 126 toward the first circuit board 20 and connects to the first circuit board 20, thereby forming at least a portion of the connection portion 13.

[0179] In some embodiments, the first metal member is connected between the edge of the first cover plate 125 or the second cover plate 126 near the heat dissipation body 11 and the first edge 21.

[0180] In some embodiments, the second metal member is connected between the edge of the first cover plate 125 or the second cover plate 126 in the X direction and the fifth edge 23 or the sixth edge 24.

[0181] In some embodiments, the first welding portion 1251 and the third welding portion 1261 are welded together to form a shape such that... Figure 3The first skirt 17, the second welded portion 1133, and the fourth welded portion 1143 shown are welded to form the second skirt 18. At least a portion of the first skirt 17 extends toward and connects to the first circuit board 20, forming at least a portion of the connecting portion 13. In some embodiments, the portion of the first skirt 17 that bends toward the first circuit board 20 is the extension structure 13a. For example, the portion of the first skirt 17 near the heat dissipation body 11 serves as the extension structure 13a, which bends toward and extends toward the first circuit board 20 to connect with the first circuit board 20, forming at least a portion of the first sidewall 413a.

[0182] In some embodiments, the first cover plate 125 and the third cover plate 113 are integrally formed, and the second cover plate 126 and the fourth cover plate 114 are integrally formed. This improves the structural stability of the heat dissipation structure 10, simplifies structural design, increases production efficiency, and reduces processing errors.

[0183] In some embodiments, such as Figure 2 As shown, the electronic device 100 also includes a housing 50. The heat source 30, the heat dissipation structure 10, the first circuit board 20, and the fan 60 are disposed within the housing 50. The housing 50 includes a wave-transparent region 51. The orthographic projection of the radiation port 411 onto the wave-transparent region 51 at least partially overlaps with the wave-transparent region 51. The wave-transparent region 51 is used for signals generated by the cavity antenna 40 to pass through and be transmitted to the external space, and for external signals to pass through and be transmitted to the cavity antenna 40. The wave-transparent region 51 ensures that signals generated by the electronic device 100 and external signals can pass smoothly through the housing 50, reducing attenuation and interference during signal transmission, thereby optimizing signal transmission and improving communication quality and stability.

[0184] The wave-transparent region 51 can be made of non-metallic materials, such as plastic, glass, ceramics, etc.

[0185] In some embodiments, the electronic device 100 may include a processor (not shown) electrically connected to a feed point of the first circuit board 20. The processor can transmit antenna signals to the cavity antenna 40, which can then transmit the antenna signals through the transparent region 51 to external space, thereby enabling signal transmission by the electronic device 100. The cavity antenna 40 can also receive antenna signals from outside the electronic device 100 and transmit them to the processor, thereby enabling signal reception by the electronic device 100. This achieves wireless communication for the electronic device 100.

[0186] In some embodiments, such as Figures 3 to 6 , Figures 9 to 12 , Figures 14 to 17 As shown, the electronic device 100 includes at least two first circuit boards 20 spaced apart. The heat dissipation structure 10 includes at least two connecting portions 13 and at least two extending portions 12. Each extending portion 12 extends to a position directly opposite a corresponding first circuit board 20. Each connecting portion 13 connects between a corresponding first circuit board 20 and a corresponding extending portion 12. Each connecting portion 13, a corresponding extending portion 12, and a corresponding first circuit board 20 enclose a radiating cavity 41. That is, at least a portion of the heat dissipation structure 10 and the at least two first circuit boards 20 form at least two cavity antennas 40.

[0187] By forming at least two cavity antennas 40, communication quality and reliability can be improved, signal coverage can be enhanced, and multiple operating frequency bands can be supported, thereby increasing communication flexibility and compatibility.

[0188] In some embodiments, the at least two first circuit boards 20 are along Figure 3 The arrangement is shown in the X direction. The X direction is perpendicular to the Y direction and is approximately parallel to the long side of the electronic device 100.

[0189] In the at least two extensions 12, two adjacent edges extending along the Y direction and close to another extension 12 may be spaced apart or connected together. For example, in the two adjacent extensions 12, the eighth edge 124 of one extension 12 and the seventh edge 123 of the other extension 12 may be spaced apart, or, as... Figure 3 As shown, the portions extending from the heat dissipation body 11 are connected together.

[0190] The at least two extensions 12 can be integrally formed.

[0191] In some embodiments, the cavity antenna 40 may operate in the WIFI 2.4G and / or WIFI 5G frequency bands. For example, the electronic device 100 includes two cavity antennas 40, operating in the WIFI 2.4G and WIFI 5G frequency bands, respectively. In other embodiments, the cavity antenna 40 may operate in other frequency bands.

[0192] In some embodiments, the electronic device 100 includes at least two fin assemblies 14, which are configured in a one-to-one correspondence with the at least two first circuit boards 20.

[0193] In some embodiments, the electronic device 100 includes two first circuit boards 20 and two fans 60. The heat dissipation structure 10 includes two connecting portions 13, two extension portions 12 and two fin assemblies 14. The two fans 60 are located on opposite sides of the heat dissipation body 11, and each fan 60 is located on the side of a fin assembly 14 away from a first circuit board 20.

[0194] In some embodiments, the connecting portion 13 has a plurality of slits that penetrate the connecting portion 13 along its thickness direction. The density of the plurality of slits is related to the operating frequency band of the cavity antenna 40. In some embodiments, the higher the operating frequency band of the cavity antenna 40, the higher the density of the plurality of slits.

[0195] When the connecting portion 13 includes the second sub-connecting portion 132, the second sub-connecting portion 132 may have multiple slots. In some other embodiments, the second sub-connecting portion 132 may not have the slots.

[0196] In some embodiments, compared to related technologies, the width of the cold end of the heat spreader 70 in this application embodiment is increased from 20mm to 38.8mm, and the heat dissipation area of ​​the entire heat spreader 70 is increased from 11400mm². 2 Increased to 13200mm 2 It increased by 1800mm 2 The heat dissipation area increased by 15.78%. Thermal simulation experiments were conducted on electronic device 1 in the related technology and electronic device 100 provided in the embodiment of this application, respectively. Compared with electronic device 1 in the related technology, the electronic device 100 provided in the embodiment of this application has a maximum case temperature gain of 0.8℃ and a chip junction temperature gain of 1.5℃, indicating that the heat dissipation performance of the electronic device 100 is improved.

[0197] Please see Figure 21 This is a flowchart illustrating a method for manufacturing an electronic device in some embodiments of this application. The method for manufacturing the electronic device is used to manufacture the electronic device 100 described in any of the foregoing embodiments. In some embodiments, such as... Figure 21 As shown, the method includes the following steps:

[0198] S1: Provide a first cover 15 and a second cover 16. As previously described, such as Figure 20As shown, the first cover 15 includes a first cover plate 125 and a third cover plate 113, and the second cover 16 includes a second cover plate 126 and a fourth cover plate 114. The third cover plate 113 includes a first plate portion 1131, a first extension portion 1132, a fourth extension portion 1134, and a second welded portion 1133. The first plate portion 1131 includes a first surface side 1131a and a second surface side 1131b facing away from each other. The first extension portion 1132 and the fourth extension portion 1134... The first plate 125 includes a fourth plate 1252 and a first welded portion 1251, located on the first surface side 1131a of the first plate portion 1131 and connected to opposite ends of the first plate portion 1131. The end of the fourth extension portion 1134 away from the first plate portion 1131 is connected to the second welded portion 1133. The first cover plate 125 includes a fourth plate portion 1252 and a first welded portion 1251, with opposite ends connected to the first extension portion 1132 and the first welded portion 1251, respectively. The fourth plate portion 1252 has a step difference from the first plate portion 1131, and the inner surface of the fourth plate portion 1252, the welding surface of the first welded portion 1251, and the welding surface of the second welded portion 1133 are located on the same plane. The fourth cover plate 114 includes a second plate portion 1141 and a second extension portion 1142 and a fourth weld portion 1143 respectively connected to opposite ends of the second plate portion 1141. The second plate portion 1141 includes a third surface side 1141a and a fourth surface side 1141b facing away from each other. The second extension portion 1142 is located on the third surface side 1141a of the second plate portion 1141. The second cover plate 126 includes a third plate portion 1262, a third extension portion 1263 and a third weld portion 1261. The third plate portion 1262 is connected to the second extension portion 1142 and has a step difference from the second plate portion 1141. The third extension portion 1263 is connected between the third plate portion 1262 and the third weld portion 1261. The second extension portion 1142 and the third extension portion 1263 are located on the same side of the third plate portion 1262. The inner surface of the second plate portion 1141, the welding surface of the fourth welding portion 1143, and the welding surface of the third welding portion 1261 are located on the same plane.

[0199] S2: The fourth surface side 1141b of the second plate portion 1141 faces the first surface side 1131a of the first plate portion 1131, and the welding surface of the first welding portion 1251 contacts the welding surface of the third welding portion 1261, and the welding surface of the second welding portion 1133 contacts the welding surface of the fourth welding portion 1143.

[0200] S3: Use a laser to irradiate the surface of the third welding part 1261 that is opposite to the first welding part 1251 to weld the third welding part 1261 and the first welding part 1251 together, and use a laser to irradiate the surface of the second welding part 1133 that is opposite to the fourth welding part 1143 to weld the second welding part 1133 and the fourth welding part 1143 together, so that the first cover and the second cover are joined to form a sealed space, thereby forming at least part of the heat dissipation structure.

[0201] S4: Provide a heat source 30 and a first circuit board 20, and make the heat source 30 contact the third cover plate 113 and / or the fourth cover plate 114, and place the first circuit board 20 on the side of the first cover plate 125 away from the second cover plate 126 and directly opposite the first cover plate 125.

[0202] S5: At least the first cover plate 125 and the first circuit board 20 are enclosed to form a radiation cavity 41 with a radiation port 411, thereby forming a cavity antenna 40.

[0203] The preparation method provided in this application is used to prepare the electronic device 100 described in any of the foregoing embodiments, and therefore can achieve the same or corresponding beneficial effects as the foregoing electronic device 100, which will not be repeated here. Furthermore, since the fourth extension portion 1134 is inclined relative to the second welding portion 1133, by using a laser (such as...) Figure 20 As shown by arrow C, welding is performed from the side of the second welding portion 1133 away from the fourth welding portion 1143. This restricts the diffusion of heat generated by the laser around the welding area, reducing heat diffusion from the welding area into the surrounding material, which is beneficial for improving welding efficiency. Furthermore, it avoids uneven heat distribution, thereby reducing welding deformation. Similarly, since the third extension portion 1263 is inclined relative to the third welding portion 1261, by using a laser (such as...) Figure 20 As shown by arrow D, welding is performed from the side of the third welding part 1261 away from the first welding part 1251, which can limit the diffusion of heat, thereby improving welding efficiency and reducing welding deformation.

[0204] In other embodiments, welding can also be performed from the side of the second welding portion 1133 opposite to the fourth welding portion 1143, and from the side of the first welding portion 1251 opposite to the third welding portion 1261. Alternatively, welding can also be performed from the side of the fourth welding portion 1143 opposite to the second welding portion 1133, and from the side of the third welding portion 1261 opposite to the first welding portion 1251.

[0205] The connection portion 13 can be fabricated according to the structure of the connection portion 13 in the aforementioned electronic device 100.

[0206] In some embodiments, a portion of the welded portion of the first cover plate 125 and the second cover plate 126 may be bent to form at least a portion of the connection portion 13.

[0207] In some embodiments, the aforementioned fin assembly 14 may be mounted on the third cover plate 113, and at least a portion of the fins 141 of the fin assembly 14 may be connected to the first circuit board 20 and the first cover plate 125, wherein the at least a portion of the fins 141 forms at least a portion of the connection portion 13.

[0208] In some embodiments, the aforementioned first metal member and second metal member may be mounted between the first circuit board 20 and the first cover plate 125 to form at least a portion of the connection portion 13.

[0209] It should be noted that the manufacturing method of the electronic device corresponds to the aforementioned electronic device 100. Manufacturing steps not specifically described in the manufacturing method can be carried out using appropriate processes based on the structure of the aforementioned electronic device 100. The contents of the manufacturing method for the electronic device 100 and the aforementioned electronic device can also be referred to each other.

[0210] It should be noted that the fabrication of the heat dissipation structure 10 may include other process steps, such as installing capillary structures within the heat dissipation structure 10 and injecting cooling medium when the heat dissipation structure 10 includes a vapor chamber. These process steps are not specifically described in this embodiment. The assembly of the electronic device 100 may also include the installation of other functional components, such as camera components, wireless interaction modules, and screens, which are not detailed in this embodiment.

[0211] The above are the implementation methods of the embodiments of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the embodiments of this application, and these improvements and modifications are also considered to be within the protection scope of this application.

Claims

1. An electronic device, comprising: The electronic device comprises: a heat source; a heat dissipation structure in contact with the heat source, the heat dissipation structure being configured to dissipate heat from the heat source; a first circuit board, wherein at least part of the heat dissipation structure and the first circuit board enclose a radiation cavity having a radiation opening, and a cavity antenna is formed.

2. The electronic device of claim 1, wherein, The heat dissipation structure comprises a heat dissipation main body, an extension part and a connecting part, the heat dissipation main body is in contact with the heat source, the extension part is connected to the edge of the heat dissipation main body and extends to a position opposite to the first circuit board and is spaced apart from the first circuit board, the connecting part is connected between the extension part and the first circuit board, and the connecting part, the extension part and the first circuit board enclose the radiation cavity, wherein the extension part and the first circuit board form two opposite cavity walls of the radiation cavity, the connecting part forms a side wall of the radiation cavity located at part of the side circumference of the radiation cavity, and the other part of the side circumference of the radiation cavity is open to form the radiation opening.

3. The electronic device of claim 2, wherein, The first circuit board is arranged on a first side of the heat source, the extension part is connected to the edge of the heat dissipation main body and extends to a position opposite to the first circuit board and is spaced apart from the first circuit board.

4. The electronic device of claim 2, wherein, At least part of the connecting part is an extension structure further extending from the edge of the extension part.

5. The electronic device of claim 4, wherein, The extension structure extends from part of the edge of the extension part towards the first circuit board and is connected to the first circuit board, and at least part of the connecting part is formed.

6. The electronic device of claim 2, wherein, The heat dissipation structure further comprises a fin assembly, part of the heat dissipation main body is in contact with the heat source, and the fin assembly is arranged on the region of the heat dissipation main body not in contact with the heat source to improve heat dissipation efficiency.

7. The electronic device of claim 6, wherein, At least part of the fin assembly is connected to the extension part and the first circuit board, wherein at least part of the connecting part is part of the fin assembly connected to the extension part and the first circuit board.

8. The electronic device of claim 7, wherein, The first circuit board comprises opposite first and second edges, the second edge is farther away from the heat dissipation main body than the first edge, the extension part comprises opposite third and fourth edges, the fourth edge is farther away from the heat dissipation main body than the third edge, the fin assembly comprises a plurality of fins arranged in an interval, the plurality of fins are close to the third edge, and at least part of the plurality of fins is connected between the extension part and the first circuit board to form at least part of the connecting part.

9. The electronic device of claim 8, wherein, The side wall of the radiation cavity formed by the connecting part comprises a first side wall and a second side wall, the first side wall is connected between the first edge and the third edge, the second side wall is adjacent to the first side wall, and at least part of the plurality of fins is connected between the extension part and the first circuit board to form at least part of the first side wall and / or at least part of the second side wall.

10. The electronic device of claim 9, wherein, The arrangement direction of the plurality of fins is parallel to the first edge or the third edge. Each fin includes a first end and a second end along the extension direction. The first end is closer to the first circuit board and the extension than the second end. The first end of at least some of the plurality of fins is connected to the first edge and the third edge to form at least a portion of the first sidewall.

11. The electronic device of claim 9, wherein, At least one of the plurality of fins extends along the extension direction into the region between the first circuit board and the extension portion, and is connected to both the first circuit board and the extension portion to form at least a portion of the second sidewall.

12. The electronic device of claim 9, wherein, The connecting portion includes a first sub-connecting portion, which is connected between the first edge and the third edge to form the first sidewall. At least one of the plurality of fins extends along the extending direction to the region between the first circuit board and the extending portion, and is connected to both the first circuit board and the extending portion to form the second sidewall of the radiation cavity. The extending direction of the first sub-connecting portion and the arrangement direction of the plurality of fins are parallel to the extending direction of the first edge or the second edge. The projection of the plurality of fins along the extending direction at least partially overlaps with the first sub-connecting portion. The first sub-connecting portion has a plurality of through holes, each through hole penetrating the first sub-connecting portion along the extending direction of the fin.

13. The electronic device of claim 6, wherein, The first circuit board includes opposing first and second edges, the second edge being farther away from the heat dissipation body than the first edge. The extension includes opposing third and fourth edges, the fourth edge being farther away from the heat dissipation body than the third edge. The fin assembly includes a plurality of fins spaced apart, the plurality of fins being close to the third edge. The connecting portion includes a first sub-connecting portion, the first sub-connecting portion being connected between the first edge and the third edge to form the sidewall portion. The extending direction of the first sub-connecting portion and the arrangement direction of the plurality of fins are parallel to the extending direction of the first edge or the second edge. The projection of the plurality of fins along the extending direction at least partially overlaps with the first sub-connecting portion. The first sub-connecting portion has a plurality of through holes, each through hole penetrating the first sub-connecting portion along the extending direction of the fins.

14. The electronic device of claim 6, wherein, The fin assembly includes a plurality of fins arranged at intervals, wherein at least a portion of the fins have a channel between two adjacent fins that communicates with the radiation cavity.

15. The electronic device of claim 2, wherein, The heat dissipation structure includes a heat spreader, the heat dissipation body is the main body of the heat spreader, and the extension is the extension of the heat spreader.

16. The electronic device of claim 2, wherein, The heat dissipation structure includes a cooling plate, the heat dissipation body is the main body of the cooling plate, and the extension is the extension of the cooling plate.

17. The electronic device of claim 2, wherein, The heat dissipation structure includes a heat spreader and a cooling plate stacked together. The heat dissipation body is the main body of the stacked heat spreader and cooling plate, and the extension is an extension of the heat spreader and / or the cooling plate.

18. The electronic device of claim 2, wherein, The heat dissipation structure includes at least one metal sheet and at least one heat-conducting sheet arranged in alternating layers. The heat dissipation body is a portion formed by alternating layers of the main body portion of the at least one metal sheet and at least a portion of the at least one heat-conducting sheet. The extension portion is at least an extension portion of the at least one metal sheet.

19. The electronic device of claim 2, wherein, The heat dissipation body includes a heat dissipation body portion and a connecting transition portion. The connecting transition portion is connected to the edge of the heat dissipation body portion and extends in a direction away from the first circuit board to connect with the extension portion. The connection between the extension portion and the heat dissipation body portion at the edge of the connecting transition portion has a step difference.

20. The electronic device of claim 2, wherein, The extension includes a first cover plate and a second cover plate disposed opposite to each other. The heat dissipation body includes a third cover plate and a fourth cover plate disposed opposite to each other. The first cover plate and the third cover plate are connected to form a first cover body. The second cover plate and the fourth cover plate are connected to form a second cover body. The first cover body and the second cover body are joined to form a sealed space. The sealed space is used to contain a cooling medium. The third cover plate and / or the fourth cover plate are in contact with the heat source. The first circuit board is disposed on the side of the first cover plate away from the second cover plate and is directly opposite to the first cover plate. The connecting part is connected between the first circuit board and the first cover plate.

21. The electronic device of claim 20, wherein, The third cover plate includes a first plate body portion and a first extension portion. The first extension portion is connected to the edge of the first plate body portion and extends in a direction away from the first circuit board. The first cover plate is connected to the end of the first extension portion away from the first plate body portion, wherein the first cover plate and the first plate body portion have a step difference.

22. The electronic device of claim 21, wherein, The first cover includes a first welded portion and a second welded portion. The first welded portion is the end of the first cover plate away from the first extension portion, and the second welded portion is the end of the third cover plate away from the first cover plate. The second cover includes a third welded portion and a fourth welded portion. The third welded portion is the end of the second cover plate away from the fourth cover plate, and the fourth welded portion is the end of the fourth cover plate away from the second cover plate. The first welded portion is welded to the third welded portion, and the second welded portion is welded to the fourth welded portion. The welding surface of the first welded portion and the welding surface of the second welded portion are located in the same plane, and the welding surface of the third welded portion and the welding surface of the fourth welded portion are located in the same plane.

23. The electronic device of claim 22, wherein, The fourth cover plate includes a second plate body portion and a second extension portion and a fourth welding portion respectively connected to opposite ends of the second plate body portion. The second extension portion is connected to the edge of the second plate body portion and extends in a direction away from the first circuit board. The second cover plate includes a third plate body portion, a third extension portion, and the third welding portion. The third plate body portion is connected to the second extension portion and has a step difference from the second plate body portion. The third extension portion is connected to the edge of the third plate body portion and extends in a direction close to the first circuit board to connect with the third welding portion. The inner surface of the second plate body portion, the welding surface of the fourth welding portion, and the welding surface of the third welding portion are located in the same plane. The third cover plate also includes a fourth extension portion. The fourth extension portion is connected to the edge of the first plate body portion and extends in a direction close to the fourth cover plate to connect with the second welding portion. The first cover plate includes a fourth plate body portion and a first welding portion. The fourth plate body portion is connected between the first extension portion and the first welding portion. The inner surface of the fourth plate body portion, the welding surface of the first welding portion, and the welding surface of the second welding portion are located in the same plane.

24. The electronic device of any of claims 20-23, wherein, The first cover plate and the third cover plate are integrally formed, and the second cover plate and the fourth cover plate are integrally formed.

25. The electronic device of claim 1, wherein, The electronic device further includes a housing, in which the heat source, the heat dissipation structure and the first circuit board are disposed. The housing includes a wave-transparent region, and the orthographic projection of the radiation port on the wave-transparent region at least partially overlaps with the wave-transparent region. The wave-transparent region is used for allowing signals generated by the cavity antenna to pass through to be transmitted to the external space, and for allowing external signals to pass through to be transmitted to the cavity antenna.

26. The electronic device of claim 2, wherein, The electronic device includes at least two first circuit boards spaced apart. The heat dissipation structure includes at least two connecting parts and at least two extending parts. Each extending part extends to a position directly opposite a corresponding first circuit board. Each connecting part is connected between a corresponding first circuit board and a corresponding extending part. Each connecting part, a corresponding extending part, and a corresponding first circuit board enclose a radiation cavity.

27. A method of manufacturing an electronic device, comprising: The method includes: A first cover and a second cover are provided. The first cover includes a first cover plate and a third cover plate. The second cover includes a second cover plate and a fourth cover plate. The third cover plate includes a first plate portion, a first extension portion, a fourth extension portion, and a second welded portion. The first plate portion includes a first surface side and a second surface side facing away from each other. The first extension portion and the fourth extension portion are located on the first surface side of the first plate portion and are respectively connected to opposite ends of the first plate portion. The end of the fourth extension portion away from the first plate portion is connected to the second welded portion. The first cover plate includes a fourth plate portion and a first welded portion. Opposite ends of the fourth plate portion are respectively connected to the first extension portion and the first welded portion. The fourth plate portion and the first plate portion have a step difference. The inner surface of the fourth plate portion, the first extension portion, the second extension portion, the third extension portion, the fourth ... The welding surface of the first welding part and the welding surface of the second welding part are located on the same plane; the fourth cover plate includes a second plate body and a second extension part and a fourth welding part respectively connected to opposite ends of the second plate body. The second plate body includes a third surface side and a fourth surface side facing away from each other. The second extension part is located on the third surface side of the second plate body. The second cover plate includes a third plate body, a third extension part and a third welding part. The third plate body is connected to the second extension part and has a step difference from the second plate body. The third extension part is connected between the third plate body and the third welding part. The second extension part and the third extension part are located on the same side of the third plate body. The inner surface of the second plate body, the welding surface of the fourth welding part and the welding surface of the third welding part are located on the same plane. The fourth surface side of the second plate portion is placed towards the first surface side of the first plate portion, and the welding surface of the first welding portion is in contact with the welding surface of the third welding portion, and the welding surface of the second welding portion is in contact with the welding surface of the fourth welding portion; The surface of the third weld portion away from the first weld portion is irradiated with a laser to weld the third weld portion and the first weld portion together. The surface of the second weld portion away from the fourth weld portion is irradiated with a laser to weld the second weld portion and the fourth weld portion together, so that the first cover and the second cover are joined to form a sealed space, thereby forming at least part of a heat dissipation structure. Provide a heat source and a first circuit board, and contact the heat source with the third cover plate and / or the fourth cover plate, and place the first circuit board on the side of the first cover plate away from the second cover plate and directly opposite the first cover plate; The first cover plate and the first circuit board are at least enclosed to form a radiating cavity with a radiating port, thereby forming a cavity antenna.

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