Display panel, preparation method thereof and display device

Abstract

A display panel, its fabrication method, and a display device thereof. The display panel includes: a substrate, light-emitting devices, a first inorganic encapsulation layer, a touch layer, and driving elements, which are stacked sequentially away from the substrate; the driving elements are located in a first sub-region; the touch layer includes touch windings located in the first sub-region, and the touch windings and driving elements are arranged sequentially in a direction away from the bending sub-region; the first inorganic encapsulation layer is located in the display area and the first sub-region, and the orthographic projection of the first inorganic encapsulation layer on the substrate in the first sub-region is at least located between the orthographic projection of the touch windings on the substrate and the bending sub-region; when the orthographic projection of the first inorganic encapsulation layer on the substrate is located between the orthographic projection of the touch windings on the substrate and the bending sub-region in the first sub-region, at least a portion of the first inorganic encapsulation layer in the first sub-region has dummy vias, which are not electrically connected; the orthographic projection of at least one film layer on the side of the first inorganic encapsulation layer away from the substrate covers the orthographic projection of the dummy vias on the substrate.

Description

Technical Field

[0001] This disclosure pertains to the field of display technology, specifically relating to a display panel, its manufacturing method, and a display device. Background Technology

[0002] OLED (Organic Light-Emitting Diode) displays have attracted widespread attention due to their advantages such as self-illumination, low power consumption, thinness, flexibility, vibrant colors, high contrast, and fast response speed. Summary of the Invention

[0003] This disclosure provides a display panel, a method for manufacturing the same, and a display device.

[0004] In a first aspect, embodiments of this disclosure provide a display panel having a display area and a binding side frame area, the binding side frame area being located on at least one side of the display area, the binding side frame area including a bent sub-area and a first sub-area, the bent sub-area and the first sub-area being arranged sequentially along a direction away from the display area;

[0005] The display panel includes: a substrate,

[0006] The light-emitting device, the first inorganic encapsulation layer, the touch layer, and the driving element are located on one side of the substrate and are stacked sequentially in a direction away from the substrate;

[0007] The light-emitting device is located in the display area; the driving element is located in the first sub-area;

[0008] The touch layer includes touch windings located in the first sub-region, and the touch windings and the driving elements are arranged sequentially in a direction away from the bending sub-region;

[0009] The first inorganic encapsulation layer is located in the display area and the first sub-area. In the first sub-area, the orthographic projection of the first inorganic encapsulation layer on the substrate is at least located between the orthographic projection of the touch winding on the substrate and the bending sub-area.

[0010] At least in the first sub-region, when the orthographic projection of the first inorganic encapsulation layer on the substrate is located between the orthographic projection of the touch winding on the substrate and the bending sub-region, a dummy via is provided in at least a portion of the first inorganic encapsulation layer in the first sub-region, and the dummy via has no electrical connection.

[0011] The orthogonal projection of at least one film layer located on the side of the first inorganic encapsulation layer away from the substrate on the substrate covers the orthogonal projection of the dummy via on the substrate.

[0012] In some embodiments, within the first sub-region, the first inorganic encapsulation layer further extends from the region between the touch winding and the bent sub-region to a region close to the driving element.

[0013] The orthogonal projection of the touch winding on the substrate is located within the orthogonal projection of the first inorganic encapsulation layer on the substrate;

[0014] The first inorganic encapsulation layer and the driving element do not overlap in their orthographic projections on the substrate.

[0015] In some embodiments, the dummy vias are provided in at least the four peripheral edge regions of the first inorganic encapsulation layer within the first sub-region.

[0016] In some embodiments, the dummy via is also provided in the middle region of the first inorganic encapsulation layer within the first sub-region;

[0017] The number of touch windings is multiple, and the multiple touch windings are arranged at intervals along a direction away from the bending sub-area;

[0018] The orthographic projection of the dummy via on the substrate is located in the interval between the orthographic projections of the adjacent touch windings on the substrate.

[0019] In some embodiments, the orthographic projection of the first inorganic encapsulation layer on the substrate within the first sub-region is located between the orthographic projection of the touch winding on the substrate and the bending sub-region; and the orthographic projections of the first inorganic encapsulation layer and the touch winding on the substrate do not overlap.

[0020] In some embodiments, the touch winding includes a first conductive pattern, and the display panel further includes a second conductive pattern, wherein the second conductive pattern and the first conductive pattern are located on the same layer; and the orthographic projections of the second conductive pattern and the first conductive pattern on the substrate do not overlap.

[0021] The orthographic projection of the second conductive pattern on the substrate covers the orthographic projection of the dummy via on the substrate, and the area of ​​the orthographic projection of the second conductive pattern on the substrate is larger than the area of ​​the orthographic projection of the dummy via on the substrate.

[0022] In some embodiments, an inorganic insulating layer and a first organic insulating layer are further included, located on the side of the first inorganic encapsulation layer away from the substrate, and stacked sequentially in a direction away from the substrate.

[0023] The orthogonal projections of the inorganic insulating layer and the first organic insulating layer on the substrate cover the orthogonal projections of the dummy via on the substrate.

[0024] The orthographic projections of the inorganic insulating layer and the first organic insulating layer on the substrate also cover the orthographic projections of the touch windings on the substrate.

[0025] In some embodiments, a first organic insulating layer is further included, located on the side of the first inorganic encapsulation layer away from the substrate.

[0026] The orthogonal projection of the first organic insulating layer on the substrate covers the orthogonal projection of the dummy via on the substrate;

[0027] The orthographic projection of the first organic insulating layer on the substrate also covers the orthographic projection of the touch winding on the substrate.

[0028] In some embodiments, the substrate includes a substrate and at least three conductive layers, the at least three conductive layers being stacked sequentially in a direction away from the substrate;

[0029] The conductive layer that is furthest from the substrate among the at least three conductive layers is the top conductive layer, and the conductive layer adjacent to the top conductive layer is the second-to-top conductive layer.

[0030] The display panel also includes a second organic insulating layer and a third organic insulating layer.

[0031] The second organic insulating layer is located between the top conductive layer and the first inorganic encapsulation layer, and the third organic insulating layer is located between the top conductive layer and the next top conductive layer;

[0032] The top conductive layer includes a third conductive pattern, and the orthographic projection of the dummy via on the substrate is located within the orthographic projection of the third conductive pattern on the substrate;

[0033] The dummy via extends through the second organic insulating layer, and the third conductive pattern is exposed at the dummy via;

[0034] The second conductive pattern and the third conductive pattern are in contact at the bottom of the dummy via.

[0035] In some embodiments, a first adapter hole is further formed in the first inorganic encapsulation layer within the first sub-region, and the first adapter hole extends through the second organic insulating layer. The orthographic projection of the first adapter hole on the substrate is located at the junction of the first sub-region and the bent sub-region.

[0036] The top conductive layer further includes a fourth conductive pattern, wherein the orthographic projection of the first adapter hole on the substrate is located within the orthographic projection of the fourth conductive pattern on the substrate; and the fourth conductive pattern is exposed at the first adapter hole;

[0037] The touch layer further includes touch traces, which include a fifth conductive pattern. The fifth conductive pattern and the first conductive pattern are located on the same layer. The orthographic projection of the fifth conductive pattern on the substrate covers the orthographic projection of the first adapter hole on the substrate, and the fifth conductive pattern and the fourth conductive pattern are in contact at the bottom of the first adapter hole.

[0038] The second-top conductive layer includes a touch adapter wire, which extends from the bent sub-region to the junction of the first sub-region and the bent sub-region. A second adapter hole is formed in the third organic insulating layer. The second adapter hole, the fourth conductive pattern, and the orthographic projection of the touch adapter wire on the substrate at least partially overlap, and the fourth conductive pattern contacts and is electrically connected to the touch adapter wire through the second adapter hole.

[0039] In some embodiments, the touch trace extends along the arrangement direction of the bent sub-region and the first sub-region;

[0040] The touch wiring extends from one side of the display panel adjacent to the binding side bezel area to the other side of the display panel adjacent to the binding side bezel area, and connects with the touch wiring.

[0041] In some embodiments, the distance between the orthographic projection of the touch winding closest to the driving element on the substrate and the orthographic projection of the boundary of the first inorganic encapsulation layer near the driving element on the substrate is greater than 100 μm.

[0042] In some embodiments, the binding side border area further includes a second sub-area located between the display area and the bending sub-area;

[0043] The touch trace also includes a sixth conductive pattern, located in the second sub-region, and on the same layer as the fifth conductive pattern;

[0044] The touch adapter cable also extends from the bent sub-area to the position where the second sub-area intersects with the bent sub-area;

[0045] The top conductive layer also includes a seventh conductive pattern located in the second sub-region;

[0046] The first inorganic encapsulation layer also extends from the display area to the second sub-area;

[0047] The second organic insulating layer and the third organic insulating layer extend from the display area to the second sub-area, the bent sub-area, and the first sub-area, respectively;

[0048] A third adapter hole is also provided in the first inorganic encapsulation layer within the second sub-region. The third adapter hole extends through the second organic insulating layer. The orthographic projection of the third adapter hole on the substrate is located at the junction of the second sub-region and the bent sub-region. The orthographic projection of the third adapter hole on the substrate is located within the orthographic projection of the seventh conductive pattern on the substrate. The seventh conductive pattern is exposed at the third adapter hole.

[0049] The orthographic projection of the sixth conductive pattern on the substrate covers the orthographic projection of the third adapter hole on the substrate, and the sixth conductive pattern and the seventh conductive pattern are in contact at the bottom of the third adapter hole;

[0050] The third organic insulating layer also has a fourth adapter hole. The fourth adapter hole, the seventh conductive pattern and the touch adapter wire have at least partially overlapping projections on the substrate. The seventh conductive pattern contacts and is electrically connected to the touch adapter wire through the fourth adapter hole.

[0051] In some embodiments, the dummy via includes a first sub-via formed in the first inorganic encapsulation layer and a second sub-via formed in the second organic insulating layer, wherein the first sub-via is nested within the second sub-via.

[0052] The first inorganic encapsulation layer covers the wall of the second sub-via and extends to at least a portion of the edge region covering the bottom of the second sub-via;

[0053] The orthographic projection of the first sub-via on the substrate lies within the orthographic projection of the second sub-via on the substrate.

[0054] In some embodiments, the dummy via includes a first sub-via formed in the first inorganic encapsulation layer and a second sub-via formed in the second organic insulating layer, wherein the orthographic centers of the first sub-via and the second sub-via on the substrate coincide.

[0055] The orthographic projection of the second sub-via on the substrate is located within the orthographic projection of the first sub-via on the substrate, and the orthographic projection area of ​​the second sub-via on the substrate is smaller than the orthographic projection area of ​​the first sub-via on the substrate;

[0056] A transition step is formed between the wall of the first sub-via and the wall of the second sub-via.

[0057] In some embodiments, the structures of the first adapter hole and the third adapter hole are the same as the structure of the dummy via.

[0058] In some embodiments, the film layer located on the side of the first inorganic encapsulation layer away from the substrate and the bending sub-region do not overlap;

[0059] The substrate includes a base, a plurality of organic insulating layers and a plurality of conductive layers, wherein the plurality of organic insulating layers and the plurality of conductive layers are located on one side of the base, and at least a portion of the organic insulating layers and at least a portion of the conductive layers have their orthogonal projections onto the base overlapping the bending sub-region.

[0060] In some embodiments, a second inorganic encapsulation layer is further included, located between the second organic insulating layer and the first inorganic encapsulation layer.

[0061] The second inorganic encapsulation layer extends from the display area to the side of the third adapter hole in the second sub-area that is closer to the display area.

[0062] Secondly, embodiments of this disclosure also provide a display device, which includes the aforementioned display panel.

[0063] Thirdly, this disclosure also provides a method for preparing the above-mentioned display panel, comprising: preparing a substrate;

[0064] A light-emitting device, a first inorganic encapsulation layer, a touch layer, and a driving element are sequentially fabricated on one side of the substrate.

[0065] The preparation of the touch layer includes the preparation of touch windings;

[0066] The preparation of the first inorganic encapsulation layer includes: at least when the orthographic projection of the first inorganic encapsulation layer in the first sub-region on the substrate is located between the orthographic projection of the touch winding on the substrate and the bending sub-region, a dummy via is formed in at least a portion of the first inorganic encapsulation layer, the dummy via having no electrical connection;

[0067] It also includes preparing at least one film layer on the side of the first inorganic encapsulation layer away from the substrate;

[0068] The orthogonal projection of the at least one film layer on the substrate covers the orthogonal projection of the dummy via on the substrate. Attached Figure Description

[0069] The accompanying drawings are provided to further illustrate the embodiments of this disclosure and form part of the specification. They are used together with the embodiments of this disclosure to explain the disclosure and do not constitute a limitation thereof. The above and other features and advantages will become more apparent to those skilled in the art from the detailed description of exemplary embodiments with reference to the accompanying drawings, in which:

[0070] Figure 1A This is a top view schematic diagram of a display panel in the related art.

[0071] Figure 1B For along Figure 1A A structural cross-sectional view of the AA′ section line.

[0072] Figure 2A This is a top view of a display panel according to an embodiment of the present disclosure.

[0073] Figure 2B For along Figure 2A A structural cross-sectional view of the BB section line.

[0074] Figure 2C For along Figure 2A A structural cross-sectional view of the CC section line.

[0075] Figure 2D This is a cross-sectional schematic diagram of a structure with a dummy via in an embodiment of this disclosure.

[0076] Figure 2E This is a cross-sectional view of another structure for a virtual via in an embodiment of this disclosure.

[0077] Figure 2F This is a cross-sectional view of another structure with a dummy via in an embodiment of this disclosure.

[0078] Figure 2G This is a cross-sectional view of another structure with a virtual via in an embodiment of this disclosure.

[0079] Figure 2H This is a cross-sectional view of another structure with a virtual via in an embodiment of this disclosure.

[0080] Figure 3A This is a top view schematic diagram of another display panel in an embodiment of this disclosure.

[0081] Figure 3B For along Figure 3A A structural cross-sectional view of the DD section line.

[0082] Figure 4A This is a top view schematic diagram of another display panel in an embodiment of this disclosure.

[0083] Figure 4B For along Figure 4A A structural cross-sectional view of the EE section line.

[0084] Figure 5A This is a top view schematic diagram of another display panel in an embodiment of this disclosure.

[0085] Figure 5B For along Figure 5A A structural cross-sectional view of the FF section line.

[0086] Figure 6This is a cross-sectional schematic diagram showing the positions of the first adapter hole and the second adapter hole in an embodiment of this disclosure.

[0087] Figure 7 This is a cross-sectional schematic diagram showing the positions of the third and fourth adapter holes in an embodiment of this disclosure.

[0088] Figure 8 For along Figure 2A A structural cross-sectional view of the GG′ section line. Detailed Implementation

[0089] To enable those skilled in the art to better understand the technical solutions of the embodiments of this disclosure, the following describes in further detail a display panel, its preparation method, and a display device provided in the embodiments of this disclosure, in conjunction with the accompanying drawings and specific implementation details.

[0090] Embodiments of this disclosure will be described more fully below with reference to the accompanying drawings; however, the embodiments shown may be embodied in different forms and should not be construed as limited to the embodiments set forth in this disclosure. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will enable those skilled in the art to fully understand the scope of this disclosure.

[0091] Unless otherwise defined, the technical or scientific terms used in this application shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms “a,” “an,” “an,” “the,” and similar words used in this application do not indicate quantity limitation and may indicate singular or plural. The terms “comprising,” “including,” “having,” and any variations thereof used in this application are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or device that includes a series of steps or modules (units) is not limited to the listed steps or units, but may also include steps or units not listed, or may include other steps or units inherent to these processes, methods, products, or devices. The terms “connected,” “linked,” “coupled,” and similar words used in this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. “Multiple” used in this application refers to two or more. “And / or” describes the relationship between related objects, indicating that three relationships may exist; for example, “A and / or B” can represent: A alone, A and B simultaneously, and B alone. The character " / " generally indicates that the preceding and following objects are in an "or" relationship. The terms "first," "second," and "third" used in this application are merely to distinguish similar objects and do not represent a specific ordering of objects. "Above," "below," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0092] As used herein, “parallel” and “perpendicular” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°.

[0093] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0094] This document describes exemplary embodiments with reference to sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Therefore, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. Thus, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0095] Currently, the demand for narrow-bezel display panels is increasing. Most display panels integrate a touch film layer, making it more difficult to narrow the side bezels. (See reference...) Figure 1A and Figure 1BThe bonding side bezel area 101 of the display panel is located on one side of the outer periphery of the display area 100. The bonding side bezel area 101 includes at least a bent sub-area 101a and a first sub-area 101b arranged sequentially in a direction away from the display area 100. The display panel includes a display substrate 18, an encapsulation layer, and a touch layer 4. The encapsulation layer and the touch layer 4 are stacked sequentially on the display side of the display substrate 18. The encapsulation layer is used to encapsulate light-emitting devices (such as OLED devices) within the display area 100. The encapsulation layer typically includes a second inorganic encapsulation layer 7, an organic encapsulation layer (not shown in the figure), and a first inorganic encapsulation layer 3 stacked sequentially in a direction away from the display substrate 18. The touch layer 4 includes touch electrodes (not shown in the figure) and touch traces 42. The touch electrodes are located in the display area 100, and the touch traces 42 extend from the display area 100, pass through the bent sub-area, reach the first sub-area 101b, and are connected to the bonding terminal 20 located in the first sub-area 101b. To maintain its bending performance, the bending sub-region 101a typically retains only a portion of the organic insulating layer and a portion of the conductive layer from the display substrate 18. Before and after passing through the bending sub-region 101a, the touch trace 42 needs to be transferred from the touch layer 4 to a conductive layer 19 in the display substrate 18 via the upper transition hole M and the lower transition hole N, respectively, to achieve continuous extension of the touch trace 42 within the bending sub-region 101a. The lower transition hole N is located within the first sub-region 101b.

[0096] Reference Figure 1A and Figure 1B Currently, a method has been proposed through verification: extending the first inorganic encapsulation layer 3 from the display area 100 to the side of the lower transition hole N in the first sub-area 101b away from the bent sub-area 101a, and at a distance greater than 100 μm from the lower transition hole N, to reduce the width of the display panel bonding side bezel area 101; then, the first inorganic encapsulation layer 3 at the locations of the bent sub-area 101a, the upper transition hole M, and the lower transition hole N is etched away in one etching operation. (Refer to...) Figure 1AThe first sub-region 101b also houses a driving element (such as a driver chip IC) 5. Between the lower adapter hole A and the driving element 5 is the arrangement space for a lateral touch winding (touch winding 41 and touch trace 42 intersect; the touch winding needs to wind from one side of the bonding side frame to the other side of the bonding side frame to make room for the battery) 41. To ensure the uniformity of the etching of the lateral touch winding 41, the film thickness below the lateral touch winding 41 needs to be uniform. Therefore, the edge slope (shadow) of the first inorganic encapsulation layer 3 located on the side of the lower adapter hole N away from the bending sub-region 101a needs to be controlled between the lower adapter hole N and the lateral touch winding 41. Therefore, a thin strip of the first inorganic encapsulation layer 3 will remain between the lower adapter hole N and the driving element 5. The thin strip of the remaining first inorganic encapsulation layer 3 is prone to peeling during subsequent processes, which may peel off the organic insulating layer 24 below the thin strip of the first inorganic encapsulation layer 3 and the touch trace 42 above it, resulting in a loss of touch yield of the touch layer 4.

[0097] To address the aforementioned problems in the related art, in a first aspect, embodiments of this disclosure provide a display panel, referring to... Figure 2A , Figure 3A , Figure 4A and Figure 5A The display panel includes a display area 100 and a bonding side frame area 101. The bonding side frame area 101 is located on at least one side of the display area 100. The bonding side frame area 101 includes a bent sub-area 101a and a first sub-area 101b, which are arranged sequentially in a direction away from the display area 100. The display panel includes a substrate 1, a light-emitting device 2, a first inorganic encapsulation layer 3, a touch layer 4, and a driving element 5, which are located on one side of the substrate 1 and are stacked sequentially in a direction away from the substrate 1. The light-emitting device 2 is located in the display area 100. The driving element 5 is located in the first sub-area 101b. The touch layer 4 includes a touch winding 41, which is located in the first sub-area 101b, and the touch winding 41 and the driving element 5 are arranged in a direction away from the bent sub-area 101a. The directions are arranged sequentially; the first inorganic encapsulation layer 3 is located in the display area 100 and the first sub-area 101b. In the first sub-area 101b, the orthographic projection of the first inorganic encapsulation layer 3 on the substrate 1 is at least between the orthographic projection of the touch winding 41 on the substrate 1 and the bending sub-area 101a; when the orthographic projection of the first inorganic encapsulation layer 3 on the substrate 1 is at least between the orthographic projection of the touch winding 41 on the substrate 1 and the bending sub-area 101a, a dummy via 30 is opened in at least a portion of the area of ​​the first inorganic encapsulation layer 3 in the first sub-area 101b, and the dummy via 30 has no electrical connection; the orthographic projection of at least one film layer on the substrate 1 located on the side of the first inorganic encapsulation layer 3 away from the substrate 1 covers the orthographic projection of the dummy via 30 on the substrate 1.

[0098] The dummy via 30 can either penetrate only the first inorganic encapsulation layer 3, or extend further into the non-conductive film layer of the first inorganic encapsulation layer 3 near the substrate 1.

[0099] In some embodiments, refer to Figure 2B The light-emitting device 2 can be an OLED device. The light-emitting device 2 includes an anode 21, a light-emitting functional layer 22, and a cathode 23 stacked sequentially along the direction away from the substrate 1. The display panel also includes a pixel defining layer 6 located on one side of the substrate 1, with an opening 60 in the pixel defining layer 6, and the light-emitting device 2 disposed in the opening 60. The display panel also includes a second inorganic encapsulation layer 7 and an organic encapsulation layer 8 located between the first inorganic encapsulation layer 3 and the light-emitting device 2, with the second inorganic encapsulation layer 7 and the organic encapsulation layer 8 stacked sequentially along the direction away from the substrate 1. The sequential stacking of the second inorganic encapsulation layer 7, the organic encapsulation layer 8, and the first inorganic encapsulation layer 3 encapsulates the light-emitting device 2, thereby preventing external moisture from entering the light-emitting device 2 and ensuring that the light-emitting device 2 can emit light normally. The touch layer 4 also includes a touch electrode 43 located in the display area 100, and the touch electrode 43 includes a first conductive sublayer TMA and a second conductive sublayer TMB stacked sequentially along the direction away from the substrate 1.

[0100] In this embodiment, the first inorganic encapsulation layer 3 is not provided in the bending sub-region 101a, which ensures the flexible bending performance of the bending sub-region 101a. In related technologies, the first inorganic encapsulation layer 3 extends from the display area 100 to the side of the upper adapter hole near the display area 100. Due to the large thickness of the first inorganic encapsulation layer 3, its cut-off edge will form a slope surface (i.e., shadow) with a certain width and gradually decreasing thickness during the process. In order to avoid the problem of uneven etching process of the upper adapter hole caused by the upper adapter hole being formed on this slope surface, it is necessary to move the positions of the upper adapter hole and the lower adapter hole away from the display area 100, so as to avoid the upper adapter hole being formed on the slope surface of the cut-off edge of the first inorganic encapsulation layer 3. Therefore, the setting position of the cut-off edge of the first inorganic encapsulation layer 3 in related technologies is not conducive to achieving the narrowing of the side bezel area of ​​the display panel, that is, it is not conducive to achieving a narrow bezel of the display panel. In this embodiment, by ensuring that the orthographic projection of the first inorganic encapsulation layer 3 on the substrate 1 within the first sub-region 101b is at least between the orthographic projection of the touch winding 41 on the substrate 1 and the bending sub-region 101a, compared to the related art where the first inorganic encapsulation layer 3 extends from the display area 100 to the side of the upper adapter hole closer to the display area 100, on the one hand, it can prevent the positions of the upper and lower adapter holes from shifting away from the display area 100, thereby achieving a narrowing of the side bezel area of ​​the display panel, which is beneficial for achieving a narrow bezel of the display panel. On the other hand, by ensuring that both the upper and lower adapter holes are formed on the flat surface of the first inorganic encapsulation layer 3, the uniformity of the etching process of the upper and lower adapter holes is ensured.

[0101] In this embodiment, when the orthographic projection of the first inorganic encapsulation layer 3 on the substrate 1 is located between the orthographic projection of the touch winding 41 on the substrate 1 and the bending sub-region 101a, at least a portion of the first inorganic encapsulation layer 3 in the first sub-region 101b is provided with a dummy via 30 that has no electrical connection. The orthographic projection of at least one film layer on the substrate 1 located on the side of the first inorganic encapsulation layer 3 away from the substrate 1 covers the orthographic projection of the dummy via 30 on the substrate 1. The dummy via 30 and the film layer covering it can form a good fixation for the narrower first inorganic encapsulation layer 3 located in the first sub-region 101b, thereby improving or preventing the peeling of the narrower first inorganic encapsulation layer 3 located in the first sub-region 101b, and thus ensuring good touch performance of the touch layer 4.

[0102] In some embodiments, refer to Figure 2A and Figure 2C Within the first sub-region 101b, the orthographic projection of the first inorganic encapsulation layer 3 on the substrate 1 is located between the orthographic projection of the touch winding 41 on the substrate 1 and the bending sub-region 101a; and the orthographic projections of the first inorganic encapsulation layer 3 and the touch winding 41 on the substrate 1 do not overlap.

[0103] The first inorganic encapsulation layer 3 and the touch winding 41 have no overlapping projections on the substrate 1, which ensures the uniformity of the film thickness on the side of the touch winding 41 closest to the substrate 1, thereby ensuring the uniformity of the touch winding 41 in the etching process, and thus improving or avoiding the breakage or poor connection of the touch winding 41 in the etching process.

[0104] In some embodiments, refer to Figure 2A Within the first sub-region 101b, the width of the first inorganic encapsulation layer 3 along the direction Y away from the bending sub-region 101a ranges from 200μm to 300μm. Within the first sub-region 101b, the length of the first inorganic encapsulation layer 3 along the extension direction X of the bonding side frame region 101 is approximately equal to the length of the bonding side frame region 101. For example, if the display panel is a straight panel, the length of the first inorganic encapsulation layer 3 along the extension direction X of the bonding side frame region 101 within the first sub-region 101b is approximately 50mm. If the display panel is a large folding screen, the length of the first inorganic encapsulation layer 3 along the extension direction X of the bonding side frame region 101 within the first sub-region 101b is approximately 120mm.

[0105] In some embodiments, refer to Figure 3A and Figure 3BWithin the first sub-region 101b, the first inorganic encapsulation layer 3 extends from the area between the touch winding 41 and the bending sub-region 101a to the area close to the driving element 5. The orthographic projection of the touch winding 41 on the substrate 1 is located within the orthographic projection of the first inorganic encapsulation layer 3 on the substrate 1. The orthographic projections of the first inorganic encapsulation layer 3 and the driving element 5 on the substrate 1 do not overlap.

[0106] Among them, reference Figure 3A Within the first sub-region 101b, the first inorganic encapsulation layer 3 extends from the area between the touch winding 41 and the bent sub-region 101a to the area close to the driving element 5. Within the first sub-region 101b, Figure 3A The width of the first inorganic encapsulation layer 3 along the direction away from the display area 100 is compared to Figure 2A The width of the first inorganic encapsulation layer 3 increases along the direction away from the display area 100, such as... Figure 3A The width of the first inorganic encapsulation layer 3 in the first sub-region 101b along the direction away from the display area 100 is increased to about 10mm, thereby increasing the adhesion of the first inorganic encapsulation layer 3 in the first sub-region 101b, and thus improving or avoiding the problem that the first inorganic encapsulation layer 3 in the first sub-region 101b is prone to peeling.

[0107] In some embodiments, refer to Figure 3A Since the width of the first inorganic encapsulation layer 3 in the first sub-region 101b increases along the direction away from the display area 100, it is not necessary to open a dummy via 30 in the first inorganic encapsulation layer 3 in the first sub-region 101b.

[0108] Additionally, refer to Figure 3A By making the orthographic projection of the touch winding 41 on the substrate 1 lie within the orthographic projection of the first inorganic encapsulation layer 3 on the substrate 1, the touch winding 41 can be formed on the flat surface of the first inorganic encapsulation layer 3, thereby ensuring that the film thickness of the touch winding 41 on the side close to the substrate 1 is uniform, thus ensuring the uniformity of the touch winding 41 in the etching process, thereby improving or avoiding the breakage or poor connection of the touch winding 41 in the etching process.

[0109] In some embodiments, refer to Figure 4A and Figure 4B ,exist Figure 3A Based on the structure of the first inorganic encapsulation layer 3 in the first sub-region 101b, a dummy via 30 is provided in at least the four peripheral edge regions of the first inorganic encapsulation layer 3 in the first sub-region 101b.

[0110] The dummy via 30 and the film covering it can effectively fix at least the four edges of the first inorganic encapsulation layer 3 located in the first sub-region 101b, thereby improving or preventing peeling of the four edges of the first inorganic encapsulation layer 3 located in the first sub-region 101b, and thus ensuring good touch performance of the touch layer 4.

[0111] This embodiment Figure 4A In this design, the opening size of the dummy via 30 located between two adjacent touch windings 41 can be smaller than the opening size of dummy via 30 located in other positions. This is because the dummy via 30 located between two adjacent touch windings 41 cannot overlap with the touch windings 41. Therefore, if the dummy via 30 located between two adjacent touch windings 41 conflicts with the position of the touch windings 41, the opening size of the dummy via 30 can be reduced. Reducing the opening size of the dummy via 30 will not affect its fixation to the first inorganic encapsulation layer 3, that is, it can still improve or prevent the first inorganic encapsulation layer 3 from peeling off.

[0112] In some embodiments, refer to Figure 5A and Figure 5B ,exist Figure 4A Based on the structure of the first inorganic encapsulation layer 3 in the first sub-region 101b, a virtual via 30 is also provided in the middle region of the first inorganic encapsulation layer 3 in the first sub-region 101b; there are multiple touch windings 41, and the multiple touch windings 41 are arranged at intervals along the direction away from the bending sub-region 101a; the orthogonal projection of the virtual via 30 on the substrate 1 is located in the interval between the orthogonal projections of adjacent touch windings 41 on the substrate 1.

[0113] Among them, Figure 4A Based on the fact that the virtual via 30 and the film layer covering it form a good fixation on at least the four peripheral edges of the first inorganic encapsulation layer 3 located in the first sub-region 101b, Figure 5A The virtual via 30 and the film covering it can also form a good fixation for the middle area of ​​the first inorganic encapsulation layer 3 located in the first sub-region 101b, thereby further improving or preventing the peeling of the middle area of ​​the first inorganic encapsulation layer 3 located in the first sub-region 101b, and thus ensuring the good touch performance of the touch layer 4.

[0114] In this embodiment, refer to Figure 5ABy positioning the orthographic projection of the dummy via 30 on the substrate 1 within the gap between the orthographic projections of adjacent touch windings 41 on the substrate 1, the dummy via 30 can be prevented from affecting the touch windings 41. Furthermore, in this embodiment, the higher the density of the dummy via 30 in the first inorganic encapsulation layer 3 within the first sub-region 101b, the stronger the adhesion between the first inorganic encapsulation layer 3 and the film layer located on its side closest to the substrate 1. This results in a more secure fixation of the first inorganic encapsulation layer 3 within the first sub-region 101b, further improving or preventing the peeling of the first inorganic encapsulation layer 3 within the first sub-region 101b.

[0115] In some embodiments, refer to Figure 2D , Figure 2E , Figure 4B and Figure 5B The touch winding 41 includes a first conductive pattern 410, and the display panel also includes a second conductive pattern 9. The second conductive pattern 9 and the first conductive pattern 410 are located on the same layer. The orthographic projections of the second conductive pattern 9 and the first conductive pattern 410 on the substrate 1 do not overlap. The orthographic projection of the second conductive pattern 9 on the substrate 1 covers the orthographic projection of the dummy via 30 on the substrate 1, and the area of ​​the orthographic projection of the second conductive pattern 9 on the substrate 1 is larger than the area of ​​the orthographic projection of the dummy via 30 on the substrate 1.

[0116] The orthographic projection of the second conductive pattern 9 on the substrate 1 can cover the orthographic projection of the dummy via 30 on the substrate 1 and the surrounding edge area of ​​its orthographic projection. Thus, the second conductive pattern 9 can form a rivet structure covering the dummy via 30. The rivet structure of the second conductive pattern 9 can firmly fix the first inorganic encapsulation layer 3, thereby preventing the first inorganic encapsulation layer 3 in the first sub-region 101b from peeling off.

[0117] In some embodiments, refer to Figure 2F The display panel also includes an inorganic insulating layer 10 and a first organic insulating layer 11, located on the side of the first inorganic encapsulation layer 3 away from the substrate 1, and stacked sequentially in the direction away from the substrate 1. The orthogonal projection of the inorganic insulating layer 10 and the first organic insulating layer 11 on the substrate 1 covers the orthogonal projection of the dummy via 30 on the substrate 1. The orthogonal projection of the inorganic insulating layer 10 and the first organic insulating layer 11 on the substrate 1 also covers the orthogonal projection of the touch winding 41 on the substrate 1.

[0118] The inorganic insulating layer 10 is in contact with the first inorganic encapsulation layer 3, and the inorganic insulating layer 10 can be made of materials such as silicon nitride or silicon oxide. The inorganic insulating layer 10 is located in the display area 100 and the first sub-area 101b. The first conductive sub-layer (TMA, such as including the first conductive pattern 410) of the touch layer 4 can be directly formed on the inorganic insulating layer 10 to enhance the adhesion of the first conductive sub-layer of the touch layer 4 to the inorganic insulating layer 10. The first organic insulating layer 11 is located in the display area 100 and the first sub-area 101b. The first organic insulating layer 11 includes an organic planarization layer (OC) covering the side of the first conductive sub-layer of the touch layer 4 away from the substrate 1 and a planarization protective layer (TOC) covering the side of the second conductive sub-layer (TMB, located on the side of the first conductive sub-layer away from the substrate 1) of the touch layer 4 away from the substrate 1.

[0119] In this embodiment, by covering the orthogonal projection of the inorganic insulating layer 10 and the first organic insulating layer 11 on the substrate 1 with the orthogonal projection of the dummy via 30 on the substrate 1, the first inorganic encapsulation layer 3 in the first sub-region 101b can be firmly fixed, thereby preventing the first inorganic encapsulation layer 3 in the first sub-region 101b from peeling off.

[0120] In some embodiments, refer to Figure 2G The display panel also includes a first organic insulating layer 11, located on the side of the first inorganic encapsulation layer 3 away from the substrate 1. The orthographic projection of the first organic insulating layer 11 on the substrate 1 covers the orthographic projection of the dummy via 30 on the substrate 1. The orthographic projection of the first organic insulating layer 11 on the substrate 1 also covers the orthographic projection of the touch winding 41 on the substrate 1.

[0121] The first organic insulating layer 11 is located in the display area 100 and the first sub-area 101b. The first organic insulating layer 11 includes an organic planarization layer (OC) covering the first conductive sub-layer (TMA, such as including the first conductive pattern 410) of the touch layer 4 on the side away from the substrate 1, and a planarization protective layer (TOC) covering the second conductive sub-layer (TMB, located on the side of the first conductive sub-layer away from the substrate 1) of the touch layer 4 on the side away from the substrate 1.

[0122] In this embodiment, by covering the orthogonal projection of the first organic insulating layer 11 on the substrate 1 with the orthogonal projection of the dummy via 30 on the substrate 1, the first inorganic encapsulation layer 3 in the first sub-region 101b can be firmly fixed, thereby preventing the first inorganic encapsulation layer 3 in the first sub-region 101b from peeling off.

[0123] In some embodiments, refer to Figure 3B and Figure 5BThe touch winding 41 also includes an eighth conductive pattern 411 located in the second conductive sublayer (TMB, located on the side of the first conductive sublayer away from the substrate 1) of the touch layer 4. The orthographic projection of the eighth conductive pattern 411 and the first conductive pattern 410 located in the first conductive sublayer (TMA) of the touch layer 4 on the substrate 1 at least partially overlaps. In the organic planarization layer (OC) between the first conductive sublayer (TMA) and the second conductive sublayer (TMB) of the touch layer 4 in the first organic insulating layer 11, a first via 110 is provided in the overlapping area of ​​the orthographic projections of the eighth conductive pattern 411 and the first conductive pattern 410. The eighth conductive pattern 411 and the first conductive pattern 410 are electrically connected through the first via 110. This can reduce the routing resistance of the touch winding 41, thereby reducing the signal attenuation in the touch winding 41.

[0124] In some embodiments, refer to Figure 2C , Figure 2E , Figure 4B and Figure 5B The substrate 1 includes a base 12 and at least three conductive layers, which are stacked sequentially in a direction away from the base 12. The conductive layer farthest from the base 12 among the at least three conductive layers is the top conductive layer 13, and the conductive layer adjacent to the top conductive layer 13 is the second top conductive layer 14. The display panel also includes a second organic insulating layer 15 and a third organic insulating layer 16. The second organic insulating layer 15 is located between the top conductive layer 13 and the first inorganic encapsulation layer 3, and the third organic insulating layer 16 is located between the top conductive layer 13 and the second top conductive layer 14. The top conductive layer 13 includes a third conductive pattern 130, and the orthographic projection of the dummy via 30 on the base 12 is located within the orthographic projection of the third conductive pattern 130 on the base 12. The dummy via 30 also extends through the second organic insulating layer 15, and the third conductive pattern 130 is exposed at the dummy via 30. The second conductive pattern 9 and the third conductive pattern 130 are in contact at the bottom of the dummy via 30.

[0125] Specifically, by having the second conductive pattern 9 and the third conductive pattern 130 contact the bottom of the dummy via 30, a more robust fixation can be formed on the first inorganic encapsulation layer 3 within the first sub-region 101b, thereby preventing the first inorganic encapsulation layer 3 within the first sub-region 101b from peeling off. Simultaneously, the fabrication process of the dummy via 30 involves: firstly, exposure and development in the second organic insulating layer 15 to form a portion of the dummy via 30 within the second organic insulating layer 15; then, deposition and etching of the first inorganic encapsulation layer 3 to form the other portion of the dummy via 30 therein. The setting of the third conductive pattern 130 also prevents over-etching of the third organic insulating layer 16 located on the side of the second organic insulating layer 15 closest to and in contact with the substrate 12 during the etching of the dummy via 30 in the first inorganic encapsulation layer 3, thereby preventing exposure of the conductive pattern on the side of the third organic insulating layer 16 closest to the substrate 12, which could lead to short circuits or poor open circuits.

[0126] In this embodiment, no electrical signal is applied to the second conductive pattern 9 and the third conductive pattern 130, nor are they connected to any conductive structure that applies an electrical signal. That is, the second conductive pattern 9 and the third conductive pattern 130 at the virtual via 30 only serve to fix the first inorganic encapsulation layer 3, so as to prevent the first inorganic encapsulation layer 3 in the first sub-region 101b from peeling off.

[0127] In some embodiments, refer to Figure 6 The first inorganic encapsulation layer 3 within the first sub-region 101b also has a first adapter hole 31 (i.e., the lower adapter hole N in the related art). The first adapter hole 31 extends through the second organic insulating layer 15. The orthographic projection of the first adapter hole 31 on the substrate 12 is located at the junction of the first sub-region 101b and the bent sub-region 101a. The top conductive layer 13 also includes a fourth conductive pattern 131. The orthographic projection of the first adapter hole 31 on the substrate 12 is located within the orthographic projection of the fourth conductive pattern 131 on the substrate 12. The fourth conductive pattern 131 is exposed at the first adapter hole 31. The touch layer 4 also includes a touch trace 42, which includes a fifth conductive pattern 420 and the first conductive pattern 41. 0 are located on the same layer; the orthographic projection of the fifth conductive pattern 420 on the substrate 12 covers the orthographic projection of the first adapter hole 31 on the substrate 12, and the fifth conductive pattern 420 and the fourth conductive pattern 131 are in contact with the bottom of the first adapter hole 31; the second top conductive layer 14 includes a touch adapter line 140, which extends from the bent sub-region 101a to the position where the first sub-region 101b intersects with the bent sub-region 101a; a second adapter hole 160 is provided in the third organic insulating layer 16; the orthographic projections of the second adapter hole 160, the fourth conductive pattern 131 and the touch adapter line 140 on the substrate 12 at least partially overlap, and the fourth conductive pattern 131 contacts and is electrically connected to the touch adapter line 140 through the second adapter hole 160.

[0128] The fifth conductive pattern 420, the fourth conductive pattern 131, and the touch transfer line 140 are used to transmit touch signals. Since only part of the organic insulating layer and part of the conductive layer in the substrate 1 are retained in the bending sub-region 101a, the touch trace 42 located in the first sub-region 101b needs to be transferred to the touch transfer line 140 of the second-top conductive layer 14 of the substrate 1 when passing through the bending sub-region 101a.

[0129] In some embodiments, refer to Figure 6 The touch trace 42 also includes a ninth conductive pattern 421 located in the second conductive sublayer (TMB, located on the side of the first conductive sublayer away from the substrate 1) of the touch layer 4. The orthographic projection of the ninth conductive pattern 421 and the fifth conductive pattern 420 located in the first conductive sublayer (TMA) of the touch layer 4 on the substrate 1 at least partially overlaps. In the organic planarization layer (OC) of the first organic insulating layer 11 located between the first conductive sublayer (TMA) and the second conductive sublayer (TMB) of the touch layer 4, a second via 111 is provided in the overlapping area of ​​the orthographic projections of the ninth conductive pattern 421 and the fifth conductive pattern 420. The ninth conductive pattern 421 and the fifth conductive pattern 420 are electrically connected through the second via 111. This can reduce the trace resistance of the touch trace 42, thereby reducing the signal attenuation in the touch trace 42.

[0130] In some embodiments, refer to Figure 2A , Figure 3A , Figure 4A and Figure 5A The touch trace 42 extends along the Y direction of the arrangement of the bent sub-area 101a and the first sub-area 101b; the touch winding 41 extends from one side frame 102 of the display panel adjacent to the binding side frame area 101 to the other side frame 103 adjacent to the binding side frame area 101, and connects to the touch trace 42.

[0131] The routing of the touch winding 41 frees up space for the battery on the back of the display panel, which helps to narrow the binding side bezel area 101.

[0132] In some embodiments, refer to Figure 3A , Figure 4A and Figure 5AThe distance s between the orthographic projection of the touch winding 41 closest to the driving element 5 on the substrate 1 and the orthographic projection of the boundary of the first inorganic encapsulation layer 3 near the driving element 5 on the substrate 1 is greater than 100 μm. This setting can prevent the orthographic projection of the touch winding 41 on the substrate 1 from falling on the slope surface (i.e., shadow) where the thickness gradually decreases on the edge of the first inorganic encapsulation layer 3 near the driving element 5, thereby ensuring the uniformity of the film thickness on the side of the touch winding 41 near the substrate 1, and thus ensuring the etching uniformity of the touch winding 41 and avoiding the occurrence of touch winding 41 breakage defects.

[0133] In some embodiments, refer to Figure 2A , Figure 3A , Figure 4A , Figure 5A and Figure 7 The binding side frame area 101 also includes a second sub-area 101c, located between the display area 100 and the bent sub-area 101a; the touch trace 42 also includes a sixth conductive pattern 422, located in the second sub-area 101c, and on the same layer as the fifth conductive pattern 420; the touch adapter line 140 extends from the bent sub-area 101a to the position where the second sub-area 101c intersects with the bent sub-area 101a; the top conductive layer 13 also includes a seventh conductive pattern 132, located in the second sub-area 101c; the first inorganic encapsulation layer 3 extends from the display area 100 to the second sub-area 101c; the second organic insulating layer 15 and the third organic insulating layer 16 extend from the display area 100 to the second sub-area 101c, the bent sub-area 101a, and the first sub-area 101b, respectively; a third adapter hole 32 is also provided in the first inorganic encapsulation layer 3 within the second sub-area 101c, and the third adapter hole 32 extends further... The orthographic projection of the third adapter hole 32 on the substrate 12 extends through the second organic insulating layer 15 and is located at the junction of the second sub-region 101c and the bent sub-region 101a. The orthographic projection of the third adapter hole 32 on the substrate 12 is located within the orthographic projection of the seventh conductive pattern 132 on the substrate 12. The seventh conductive pattern 132 is exposed at the third adapter hole 32. The orthographic projection of the sixth conductive pattern 422 on the substrate 12 covers the orthographic projection of the third adapter hole 32 on the substrate 12, and the sixth conductive pattern 422 and the seventh conductive pattern 132 are in contact at the bottom of the third adapter hole 32. A fourth adapter hole 161 is also provided in the third organic insulating layer 16. The orthographic projections of the fourth adapter hole 161, the seventh conductive pattern 132, and the touch adapter cable 140 on the substrate 12 at least partially overlap, and the seventh conductive pattern 132 contacts and is electrically connected to the touch adapter cable 140 through the fourth adapter hole 161.

[0134] The sixth conductive pattern 422, the seventh conductive pattern 132, and the touch transfer line 140 are used to transmit touch signals. Since only part of the organic insulating layer and part of the conductive layer in the substrate 1 are retained in the bending sub-region 101a, the touch trace 42 located in the second sub-region 101c needs to be transferred to the touch transfer line 140 of the second-top conductive layer 14 of the substrate 1 when passing through the bending sub-region 101a.

[0135] In some embodiments, refer to Figure 7 The touch trace 42 also includes a tenth conductive pattern 423 located in the second conductive sublayer (TMB, located on the side of the first conductive sublayer away from the substrate 1) of the touch layer 4. The tenth conductive pattern 423 and the sixth conductive pattern 422 located in the first conductive sublayer (TMA) of the touch layer 4 at least partially overlap on the substrate 1 in their orthogonal projections. In the organic planarization layer (OC) of the first organic insulating layer 11 located between the first conductive sublayer (TMA) and the second conductive sublayer (TMB) of the touch layer 4, a third via 112 is provided in the overlapping area of ​​the orthogonal projections of the tenth conductive pattern 423 and the sixth conductive pattern 422. The tenth conductive pattern 423 and the sixth conductive pattern 422 are electrically connected through the third via 112. This can reduce the trace resistance of the touch trace 42, thereby reducing the signal attenuation in the touch trace 42.

[0136] In some embodiments, refer to Figure 2H The virtual via 30 includes a first sub-via 301 formed in the first inorganic encapsulation layer 3 and a second sub-via 302 formed in the second organic insulating layer 15. The first sub-via 301 is nested in the second sub-via 302. The first inorganic encapsulation layer 3 covers the hole wall of the second sub-via 302 and extends to at least a portion of the edge region covering the bottom of the second sub-via 302. The orthographic projection of the first sub-via 301 on the substrate 12 is located within the orthographic projection of the second sub-via 302 on the substrate 12.

[0137] This configuration results in the first sub-via 301 formed by the first inorganic encapsulation layer 3 having a non-flat surface wall, but rather a stepped surface P formed on the wall of the first sub-via 301. This makes the film layer covering the dummy via 30 on the side of the first inorganic encapsulation layer 3 away from the substrate 1 more firmly attached to or covered by the dummy via 30, thereby further improving the anti-peeling performance of the first inorganic encapsulation layer 3 in the first sub-region 101b.

[0138] In some embodiments, refer to Figure 2EThe virtual via 30 includes a first sub-via 301 formed in the first inorganic encapsulation layer 3 and a second sub-via 302 formed in the second organic insulating layer 15. The centers of the orthographic projections of the first sub-via 301 and the second sub-via 302 on the substrate 12 coincide. The orthographic projection of the second sub-via 302 on the substrate 12 is located within the orthographic projection of the first sub-via 301 on the substrate 12, and the orthographic projection area of ​​the second sub-via 302 on the substrate 12 is smaller than the orthographic projection area of ​​the first sub-via 301 on the substrate 12. A transition step T is formed between the hole wall of the first sub-via 301 and the hole wall of the second sub-via 302.

[0139] This configuration makes the hole wall of the entire dummy via 30 a non-flat surface, and a transition step T is formed on the hole wall of the entire dummy via 30. This makes the film layer covering the dummy via 30 on the side of the first inorganic encapsulation layer 3 away from the substrate 1 more firmly attached to or covered by the dummy via 30, thereby further improving the anti-peeling performance of the first inorganic encapsulation layer 3 in the first sub-region 101b.

[0140] In some embodiments, the structures of the first adapter hole 31 and the third adapter hole 32 are the same as those of the dummy via 30. This makes the walls of the entire first adapter hole 31 and the third adapter hole 32 non-flat surfaces, forming stepped surfaces or transition steps on the walls of the entire first adapter hole 31 and the third adapter hole 32. This makes the film layer covering the first adapter hole 31 and the third adapter hole 32 on the side of the first inorganic encapsulation layer 3 away from the substrate 1 more firmly attached to or covered by the first adapter hole 31 and the third adapter hole 32, thereby further improving the anti-peeling performance of the first inorganic encapsulation layer 3 in the first sub-region 101b.

[0141] In some embodiments, the film layer and the bending region 101a located on the side of the first inorganic encapsulation layer 3 away from the substrate 1 do not overlap; the substrate 1 includes a substrate 12, a plurality of organic insulating layers and a plurality of conductive layers, the plurality of organic insulating layers and the plurality of conductive layers are located on one side of the substrate 12, and the orthogonal projection of at least a portion of the organic insulating layers and at least a portion of the conductive layers on the substrate 12 overlaps with the bending region 101a.

[0142] The substrate 12 is made of a flexible material, such as PI or PC. Multiple organic insulating layers, such as a second organic insulating layer 15 and a third organic insulating layer 16, and other organic insulating layers, such as other planar layers, are located on the side of the third organic insulating layer 16 closest to the substrate 12. This film layer arrangement within the bending sub-region 101a ensures that the bending sub-region 101a has a certain degree of flexibility, thereby facilitating its bending.

[0143] Additionally, the bending sub-region 101a is bent toward the back side of the display panel to bend the first sub-region 101b to the back side of the display panel. A bonding connection end is provided in the first sub-region 101b for bonding connection with a flexible printed circuit board (FPC).

[0144] In some embodiments, refer to Figure 8 The display panel also includes a second inorganic encapsulation layer 7, located between the second organic insulating layer 15 and the first inorganic encapsulation layer 3. The second inorganic encapsulation layer 7 extends from the display area 100 to the side of the third transition hole 32 in the second sub-area 101c that is close to the display area 100.

[0145] The second inorganic encapsulation layer 7 is cut off on the side of the third transition hole 32 in the second sub-region 101c near the display area 100; the display panel also includes an organic encapsulation layer 8, located between the second inorganic encapsulation layer 7 and the first inorganic encapsulation layer 3, and the organic encapsulation layer 8 covers the display area 100; the first inorganic encapsulation layer 3 can cover the four edges and edge end faces of the organic encapsulation layer 8 and the second inorganic encapsulation layer 7, thereby preventing external moisture from entering the light-emitting device.

[0146] Based on the above-described structure of the display panel, this disclosure also provides a method for manufacturing the display panel, which includes: preparing a substrate.

[0147] A light-emitting device, a first inorganic encapsulation layer, a touch layer, and a driving element are sequentially fabricated on one side of the substrate.

[0148] Fabricating the touch layer includes fabricating a touch winding; fabricating the first inorganic encapsulation layer includes: at least when the orthographic projection of the first inorganic encapsulation layer in the first sub-region onto the substrate is located between the orthographic projection of the touch winding onto the substrate and the bending sub-region, a dummy via is formed in at least a portion of the first inorganic encapsulation layer, and the dummy via has no electrical connection.

[0149] It also includes forming at least one film layer on the side of the first inorganic encapsulation layer away from the substrate. The orthogonal projection of the at least one film layer on the substrate covers the orthogonal projection of the dummy via on the substrate.

[0150] Secondly, embodiments of this disclosure also provide a display device, including the display panel described in the above embodiments.

[0151] By employing the display panel in the above embodiments, on the one hand, the width of the bonding side bezel area of ​​the display device can be narrowed, and on the other hand, the peeling of the first inorganic encapsulation layer located in the bonding side bezel area of ​​the display device can be improved or avoided, thereby ensuring good touch performance of the display device.

[0152] The display device provided in this disclosure can be any product or component with display function, such as an OLED panel, OLED TV, OLED billboard, monitor, mobile phone, or navigator.

[0153] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of this disclosure, and this disclosure is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this disclosure, and these modifications and improvements are also considered to be within the scope of protection of this disclosure.

Claims

1. A display panel, wherein, It has a display area and a binding side frame area, the binding side frame area is located on at least one side of the outer perimeter of the display area, the binding side frame area includes a bent sub-area and a first sub-area, the bent sub-area and the first sub-area are arranged sequentially in a direction away from the display area; The display panel includes: a substrate, The light-emitting device, the first inorganic encapsulation layer, the touch layer, and the driving element are located on one side of the substrate and are stacked sequentially in a direction away from the substrate; The light-emitting device is located in the display area; the driving element is located in the first sub-area; The touch layer includes touch windings located in the first sub-region, and the touch windings and the driving elements are arranged sequentially in a direction away from the bending sub-region; The first inorganic encapsulation layer is located in the display area and the first sub-area. In the first sub-area, the orthographic projection of the first inorganic encapsulation layer on the substrate is at least located between the orthographic projection of the touch winding on the substrate and the bending sub-area. At least in the first sub-region, when the orthographic projection of the first inorganic encapsulation layer on the substrate is located between the orthographic projection of the touch winding on the substrate and the bending sub-region, a dummy via is provided in at least a portion of the first inorganic encapsulation layer in the first sub-region, and the dummy via has no electrical connection. The orthogonal projection of at least one film layer located on the side of the first inorganic encapsulation layer away from the substrate on the substrate covers the orthogonal projection of the dummy via on the substrate.

2. The display panel according to claim 1, wherein, Within the first sub-region, the first inorganic encapsulation layer further extends from the area between the touch winding and the bent sub-region to the area close to the driving element. The orthogonal projection of the touch winding on the substrate is located within the orthogonal projection of the first inorganic encapsulation layer on the substrate; The first inorganic encapsulation layer and the driving element do not overlap in their orthographic projections on the substrate.

3. The display panel according to claim 2, wherein, The dummy via is provided in at least four peripheral regions of the first inorganic encapsulation layer within the first sub-region.

4. The display panel according to claim 3, wherein, The dummy via is also provided in the middle region of the first inorganic encapsulation layer within the first sub-region; The number of touch windings is multiple, and the multiple touch windings are arranged at intervals along a direction away from the bending sub-area; The orthographic projection of the dummy via on the substrate is located in the interval between the orthographic projections of the adjacent touch windings on the substrate.

5. The display panel according to claim 1, wherein, Within the first sub-region, the orthographic projection of the first inorganic encapsulation layer on the substrate lies between the orthographic projection of the touch winding on the substrate and the bending sub-region; and the orthographic projections of the first inorganic encapsulation layer and the touch winding on the substrate do not overlap.

6. The display panel according to any one of claims 1-5, wherein, The touch winding includes a first conductive pattern, and the display panel further includes a second conductive pattern. The second conductive pattern and the first conductive pattern are located on the same layer; and the orthographic projections of the second conductive pattern and the first conductive pattern on the substrate do not overlap. The orthographic projection of the second conductive pattern on the substrate covers the orthographic projection of the dummy via on the substrate, and the area of ​​the orthographic projection of the second conductive pattern on the substrate is larger than the area of ​​the orthographic projection of the dummy via on the substrate.

7. The display panel according to any one of claims 1-5, wherein, It also includes an inorganic insulating layer and a first organic insulating layer, located on the side of the first inorganic encapsulation layer away from the substrate, and stacked sequentially in a direction away from the substrate. The orthogonal projections of the inorganic insulating layer and the first organic insulating layer on the substrate cover the orthogonal projections of the dummy via on the substrate. The orthographic projections of the inorganic insulating layer and the first organic insulating layer on the substrate also cover the orthographic projections of the touch windings on the substrate.

8. The display panel according to any one of claims 1-5, wherein, It also includes a first organic insulating layer located on the side of the first inorganic encapsulation layer away from the substrate. The orthogonal projection of the first organic insulating layer on the substrate covers the orthogonal projection of the dummy via on the substrate; The orthographic projection of the first organic insulating layer on the substrate also covers the orthographic projection of the touch winding on the substrate.

9. The display panel according to claim 6, wherein, The substrate includes a base and at least three conductive layers, wherein the at least three conductive layers are stacked sequentially in a direction away from the base. The conductive layer that is furthest from the substrate among the at least three conductive layers is the top conductive layer, and the conductive layer adjacent to the top conductive layer is the second-to-top conductive layer. The display panel also includes a second organic insulating layer and a third organic insulating layer. The second organic insulating layer is located between the top conductive layer and the first inorganic encapsulation layer, and the third organic insulating layer is located between the top conductive layer and the next top conductive layer; The top conductive layer includes a third conductive pattern, and the orthographic projection of the dummy via on the substrate is located within the orthographic projection of the third conductive pattern on the substrate; The dummy via extends through the second organic insulating layer, and the third conductive pattern is exposed at the dummy via; The second conductive pattern and the third conductive pattern are in contact at the bottom of the dummy via.

10. The display panel according to claim 9, wherein, A first adapter hole is also provided in the first inorganic encapsulation layer within the first sub-region. The first adapter hole extends through the second organic insulating layer. The orthographic projection of the first adapter hole on the substrate is located at the junction of the first sub-region and the bent sub-region. The top conductive layer further includes a fourth conductive pattern, wherein the orthographic projection of the first adapter hole on the substrate is located within the orthographic projection of the fourth conductive pattern on the substrate; Furthermore, the fourth conductive pattern is exposed at the first adapter hole; The touch layer also includes touch traces, which include a fifth conductive pattern, and the fifth conductive pattern and the first conductive pattern are located on the same layer; The orthographic projection of the fifth conductive pattern on the substrate covers the orthographic projection of the first adapter hole on the substrate, and the fifth conductive pattern and the fourth conductive pattern are in contact at the bottom of the first adapter hole; The second-top conductive layer includes a touch adapter wire, which extends from the bent sub-region to the junction of the first sub-region and the bent sub-region. A second adapter hole is formed in the third organic insulating layer. The second adapter hole, the fourth conductive pattern, and the orthographic projection of the touch adapter wire on the substrate at least partially overlap, and the fourth conductive pattern contacts and is electrically connected to the touch adapter wire through the second adapter hole.

11. The display panel according to claim 10, wherein, The touch traces extend along the arrangement direction of the bent sub-area and the first sub-area; The touch wiring extends from one side of the display panel adjacent to the binding side bezel area to the other side of the display panel adjacent to the binding side bezel area, and connects with the touch wiring.

12. The display panel according to claim 4, wherein, The distance between the orthographic projection of the touch winding closest to the driving element on the substrate and the orthographic projection of the boundary of the first inorganic encapsulation layer near the driving element on the substrate is greater than 100 μm.

13. The display panel according to claim 10, wherein, The binding side frame area also includes a second sub-area, located between the display area and the bending sub-area; The touch trace also includes a sixth conductive pattern, located in the second sub-region, and on the same layer as the fifth conductive pattern; The touch adapter cable also extends from the bent sub-area to the position where the second sub-area intersects with the bent sub-area; The top conductive layer also includes a seventh conductive pattern located in the second sub-region; The first inorganic encapsulation layer also extends from the display area to the second sub-area; The second organic insulating layer and the third organic insulating layer extend from the display area to the second sub-area, the bent sub-area, and the first sub-area, respectively; A third adapter hole is also provided in the first inorganic encapsulation layer within the second sub-region. The third adapter hole extends through the second organic insulating layer. The orthographic projection of the third adapter hole on the substrate is located at the junction of the second sub-region and the bent sub-region. The orthographic projection of the third adapter hole on the substrate is located within the orthographic projection of the seventh conductive pattern on the substrate; Furthermore, the seventh conductive pattern is exposed at the third adapter hole; The orthographic projection of the sixth conductive pattern on the substrate covers the orthographic projection of the third adapter hole on the substrate, and the sixth conductive pattern and the seventh conductive pattern are in contact at the bottom of the third adapter hole; The third organic insulating layer also has a fourth adapter hole. The fourth adapter hole, the seventh conductive pattern and the touch adapter wire have at least partially overlapping projections on the substrate. The seventh conductive pattern contacts and is electrically connected to the touch adapter wire through the fourth adapter hole.

14. The display panel according to claim 13, wherein, The dummy via includes a first sub-via formed in the first inorganic encapsulation layer and a second sub-via formed in the second organic insulating layer, wherein the first sub-via is nested within the second sub-via. The first inorganic encapsulation layer covers the wall of the second sub-via and extends to at least a portion of the edge region covering the bottom of the second sub-via; The orthographic projection of the first sub-via on the substrate lies within the orthographic projection of the second sub-via on the substrate.

15. The display panel according to claim 13, wherein, The dummy via includes a first sub-via formed in the first inorganic encapsulation layer and a second sub-via formed in the second organic insulating layer, wherein the orthographic centers of the first sub-via and the second sub-via on the substrate coincide. The orthographic projection of the second sub-via on the substrate is located within the orthographic projection of the first sub-via on the substrate, and the orthographic projection area of ​​the second sub-via on the substrate is smaller than the orthographic projection area of ​​the first sub-via on the substrate; A transition step is formed between the wall of the first sub-via and the wall of the second sub-via.

16. The display panel according to claim 14 or 15, wherein, The structure of the first adapter hole and the third adapter hole is the same as the structure of the dummy via.

17. The display panel according to any one of claims 1-5, wherein, The film layer located on the side of the first inorganic encapsulation layer away from the substrate and the bending sub-region do not overlap; The substrate includes a base, a plurality of organic insulating layers and a plurality of conductive layers, wherein the plurality of organic insulating layers and the plurality of conductive layers are located on one side of the base, and at least a portion of the organic insulating layers and at least a portion of the conductive layers have their orthogonal projections onto the base overlapping the bending sub-region.

18. The display panel according to claim 13, wherein, It also includes a second inorganic encapsulation layer, located between the second organic insulating layer and the first inorganic encapsulation layer. The second inorganic encapsulation layer extends from the display area to the side of the third adapter hole in the second sub-area that is closer to the display area.

19. A display device, wherein, Includes the display panel described in any one of claims 1-18.

20. A method for manufacturing a display panel as described in any one of claims 1-18, wherein, include: Preparing a substrate; A light-emitting device, a first inorganic encapsulation layer, a touch layer, and a driving element are sequentially fabricated on one side of the substrate. The preparation of the touch layer includes the preparation of touch windings; The preparation of the first inorganic encapsulation layer includes: at least when the orthographic projection of the first inorganic encapsulation layer in the first sub-region on the substrate is located between the orthographic projection of the touch winding on the substrate and the bending sub-region, a dummy via is formed in at least a portion of the first inorganic encapsulation layer, the dummy via having no electrical connection; It also includes preparing at least one film layer on the side of the first inorganic encapsulation layer away from the substrate; The orthogonal projection of the at least one film layer on the substrate covers the orthogonal projection of the dummy via on the substrate.

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