Wafer cleaning rod processing decap device

Abstract

This invention discloses a decapping device for wafer cleaning rod processing, comprising: a support structure including a support platform with two parallel support rails on the support platform; a clamping structure including multiple first sliders slidably connected to the upper ends of the support rails, with two first sliders on the same axis fixedly connected to the same first mounting plate at their upper ends, and a clamping component for fixing the wafer cleaning rod provided at the upper end of the first mounting plate; and a decapping structure including multiple second sliders slidably connected to the upper ends of the support rails, with the second sliders correspondingly disposed outside the first sliders. This invention, through the deep integration of precision mechanical structure design and intelligent adaptive control system, not only achieves a leap from manual to automated wafer cleaning rod decapping operations, but also endows the device with the core capability to cope with complex working conditions and ensure processing quality through real-time sensing and feedback control.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer cleaning rod processing, and more particularly to a decapping device. Background Technology

[0002] With the continuous advancement of semiconductor manufacturing processes, wafer cleaning, as one of the key processes, directly impacts the cleaning effect and wafer yield through the processing quality of its cleaning tool—the wafer cleaning bar. Wafer cleaning bars are typically injection molded using precision molds, with end caps at both ends to form the internal cavity structure. After processing, the end caps must be precisely and without damage removed from the mold (i.e., "cap removal") to eject the formed cleaning bar.

[0003] Currently, common cap removal methods mainly have the following problems: Manual or semi-automatic operation: Traditional methods rely on manual prying or knocking with simple tools, which is not only inefficient and labor-intensive, but also prone to damage to the internal structure of the cleaning rod (such as micro-cracks) or deformation of the end cap due to uneven force, making it difficult to guarantee the yield rate.

[0004] Poor synchronicity and alignment: Even when using simple mechanical devices for cap removal, there is often a lack of precise synchronization control mechanisms. The asynchronous pulling action of the two end caps and uneven force can easily cause the cleaning rod mold to be subjected to torsional loads, leading to mold positioning deviation, or even permanent damage to the mold or the cleaning rod itself.

[0005] Unable to handle complex operating conditions: Asymmetric adhesion may exist between the cleaning rod and the end cap due to material properties, temperature changes, or trace residues. Existing equipment lacks real-time sensing and adaptive adjustment capabilities. Once encountering unilateral adhesion or jamming, it can usually only be handled roughly or shut down for maintenance. It cannot intelligently identify and adjust strategies to complete cap removal, affecting production continuity and the level of intelligence.

[0006] Lack of process monitoring and safety assurance: Most existing devices are "open-loop" controls, which cannot monitor key parameters (such as torque and displacement) in real time during the cap removal process. When abnormalities occur (such as severe tilting and jamming), they cannot alarm in time and stop the machine safely, which poses a risk of damaging expensive molds and products.

[0007] Therefore, there is an urgent need to develop a dedicated decapping device for wafer cleaning rods that is highly automated and intelligent, capable of precise synchronization, adaptive adjustment, process monitoring, and effective protection of the product. Summary of the Invention

[0008] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the invention.

[0009] In view of the problems existing in the above-mentioned decapping device for wafer cleaning rod processing, the present invention is proposed.

[0010] Therefore, the purpose of this invention is to provide a decapping device for wafer cleaning rod processing. Through the deep integration of precision mechanical structure design and intelligent adaptive control system, it not only realizes the leap from manual to automated wafer cleaning rod decapping operation, but also endows the device with the core capability to cope with complex working conditions and ensure processing quality through real-time sensing and feedback control.

[0011] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a decapping device for wafer cleaning rod processing, comprising: A support structure, including a support platform, on which two parallel support slide rails are provided; The clamping structure includes multiple first sliders slidably connected to the upper end of the support slide rail. The upper ends of two first sliders on the same axis are fixedly connected to the same first mounting plate. The upper end of the first mounting plate is provided with a clamping component for fixing the wafer cleaning rod. The cap removal structure includes multiple second sliders slidably connected to the upper end of the support slide rails, and the second sliders are correspondingly disposed outside the first slider. The upper ends of two second sliders on the same axis are fixedly connected to the same second mounting plate. The upper end of the second mounting plate is provided with a cap removal component for removing the cap. A drive component connected to the second mounting plate is provided on the support platform between the two support slide rails. The control alarm structure includes a controller connected to the drive assembly and a displacement sensor and a torque sensor installed in the cover removal assembly. An alarm is also installed on the support platform. The status is determined by collecting real-time data from the torque sensor and the displacement sensor, and the data is fed back to the controller to control the drive assembly and the alarm.

[0012] In a preferred embodiment of the wafer cleaning rod processing cap removal device of the present invention, the clamping assembly includes two L-shaped brackets fixedly connected to the upper end of a first mounting plate. A clamping base is fixedly connected to the upper end of the first mounting plate between the two L-shaped brackets. A plurality of first clamping grooves connected to the wafer cleaning rod are evenly distributed on the clamping base. A clamping top plate is rotatably connected to the upper end of one of the L-shaped brackets. A second clamping groove connected to the wafer cleaning rod is provided at the lower end of the clamping top plate. A buckle unit connected to the clamping top plate is provided on the side wall of the other L-shaped bracket.

[0013] As a preferred embodiment of the wafer cleaning rod processing cap removal device of the present invention, the buckling unit includes a buckling seat fixedly connected to the side wall of the L-shaped bracket, an arc-shaped connector is rotatably connected to the side wall of the buckling seat, and a hook matching the arc-shaped connector is provided on the side wall of the clamping top plate. The arc-shaped connector cooperates with the hook to fix the clamping top plate to the L-shaped bracket.

[0014] In a preferred embodiment of the wafer cleaning rod processing cap removal device of the present invention, the cap removal assembly includes a gripper base plate fixedly connected to the upper end of a second mounting plate, and the upper end of the gripper base plate is provided with a first gripper groove for connecting with the end cap of the wafer cleaning rod. A vertical plate is fixedly connected to the side wall of the second mounting plate, and a horizontal plate is fixedly connected to the upper end of the vertical plate. A telescopic cylinder is fixedly connected to the lower end of the horizontal plate. A gripper top plate is fixedly connected to the telescopic end of the telescopic cylinder, and the lower end of the gripper top plate is provided with a second gripper groove for connecting with the end cap of the wafer cleaning rod.

[0015] In a preferred embodiment of the wafer cleaning rod processing cap removal device of the present invention, the first clamping groove and the first gripper groove are coaxially arranged, the first clamping groove is used to support the wafer cleaning rod, and the first gripper groove is used to support the end cap.

[0016] In a preferred embodiment of the wafer cleaning rod processing decapping device of the present invention, the driving component includes an electric slide rail fixedly connected between two sets of support slide rails. An electric slider is connected to the upper end of the electric slide rail, and the upper end of the electric slider is fixedly connected to the bottom wall of the second mounting plate. A servo motor is provided on one side of the electric slide rail and connected thereto. By controlling the servo motor, the lateral reciprocating motion of the electric slider can be realized, thereby changing the movement of the decapping component at the upper end of the second mounting plate.

[0017] In a preferred embodiment of the wafer cleaning rod processing decapping device of the present invention, the controller is provided with a control system, which is configured to execute the following adaptive decapping control process: S1: Controls two servo motors to start at a preset initial synchronous speed and torque, and clamps the end cap through the cap release assembly; S2: Real-time acquisition of feedback values ​​F1, F2 from two torque sensors and displacement values ​​D1, D2 from a displacement sensor; S3: Calculate the real-time torque difference ΔF = |F1-F2| and displacement difference ΔD = |D1-D2|; S4: If ΔF exceeds the first threshold and ΔD does not exceed the second threshold, it is determined to be a one-sided adhesion. The control system reduces the speed of the servo motor on the side with higher torque until ΔF falls back to within the threshold. S5: If ΔD exceeds the second threshold, it is determined that the end cap is tilted, the action is stopped immediately and an alarm is triggered; S6: When both displacement values ​​D1 and D2 reach the set cap removal stroke, and ΔF and ΔD are within the allowable range, the cap removal action is completed.

[0018] As a preferred embodiment of the wafer cleaning rod processing uncapping device of the present invention, the upper end of the support platform has a circular opening at the center, and an ejection structure can be provided in the circular opening to eject the uncapped wafer cleaning rod.

[0019] The beneficial effects of the present invention are as follows: The present invention provides a stable and parallel moving foundation for the clamping structure and the cap removal structure through the precise cooperation between the support slide rail and the slider, thus ensuring the accuracy of the movement trajectory. Furthermore, by integrating torque and displacement sensors, the control system can acquire dynamic data of the decapping process in real time and calculate the difference. Based on this, the system can intelligently judge the status: when unilateral adhesion is detected, it automatically adjusts the motor output to balance the force; when the end cap is detected to be tilted, it immediately stops the machine and alarms. This fundamentally solves the problem of product damage or production interruption caused by asymmetrical adhesion in traditional methods, significantly improving the decapping success rate and product integrity rate. Through the deep integration of precision mechanical structure design and intelligent adaptive control system, it not only realizes the leap from manual to automated wafer cleaning rod decapping operation, but also endows the device with the core capability to cope with complex working conditions and ensure processing quality through real-time sensing and feedback control. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein: Figure 1 This is a schematic diagram of the overall structure of the wafer cleaning rod processing decapping device of the present invention.

[0021] Figure 2 This is a schematic diagram of the back structure of the wafer cleaning rod processing uncapping device of the present invention.

[0022] Figure 3 This is a side view of the decapping device for wafer cleaning rod processing according to the present invention.

[0023] Figure 4 for Figure 3 Enlarged structural diagram at point A in the middle. Detailed Implementation

[0025] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0026] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0027] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0028] Secondly, the present invention is described in detail with reference to the schematic diagrams. When detailing the embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In addition, actual fabrication should include three-dimensional spatial dimensions of length, width, and depth.

[0029] Reference Figures 1-4 A device for removing end caps from wafer cleaning rods is provided. This device is compact, intelligently operated, and can automatically and non-destructively remove the end caps from both ends of the wafer cleaning rod simultaneously. Details are as follows: 1. Overall Structure and Layout The device mainly includes a support structure, a clamping structure, a cover removal structure, and a control and alarm structure.

[0030] The supporting structure forms the basic platform of the device, including a rectangular support platform 100. On the platform 100, two high-precision support slide rails 101 are arranged in parallel, which provide a reference for the linear movement of the entire device.

[0031] The clamping structure is used to fix the wafer cleaning rod mold to be processed. It includes four first sliders 201, with every two first sliders 201 slidably connected to a support slide rail 101. At the upper ends of two first sliders 201 located on the same axis (i.e., on the same side), a long strip-shaped first mounting plate 202 is fixedly connected by bolts. Above the two first mounting plates 202, a set of clamping assemblies for holding the wafer cleaning rod body is symmetrically arranged.

[0032] The cap-removing structure, located on the outside of the clamping structure, is used to perform the cap-removing action. It includes four second sliders 301, each pair slidably connected to a support rail 101, positioned corresponding to the outside of the first slider 201. A second mounting plate 302 is fixedly connected to the upper end of two second sliders 301 located on the same axis. Above each second mounting plate 302, a cap-removing assembly for gripping and removing the end cap is mounted. A drive assembly, connected to the two second mounting plates 302, is mounted on the support platform 100 between the two support rails 101, driving them to move synchronously towards or away from each other.

[0033] 2. Detailed Composition of the Clamping Structure The clamping assembly specifically includes two L-shaped brackets 203 fixedly connected to the upper end of the first mounting plate 202, the two L-shaped brackets 203 being arranged face to face. A clamping base 204 is fixed to the upper end of the first mounting plate 202 between the two L-shaped brackets 203 by screws. The upper surface of the clamping base 204 has multiple parallel first clamping grooves along its length, the shape of which matches the lower half of the outer contour of the wafer cleaning rod.

[0034] On one side of the L-shaped bracket 203, a clamping top plate 205 is hinged to the upper end. The lower surface of the clamping top plate 205 has second clamping grooves that correspond one-to-one with the first clamping grooves. When the clamping top plate 205 is snapped down, the first and second clamping grooves together form a complete circular clamping hole, firmly holding the wafer cleaning rod. On the side wall of the other L-shaped bracket 203, a snap-fit ​​unit is installed.

[0035] The locking unit includes a locking seat 206 welded to the side wall of the L-shaped bracket 203. An arc-shaped connector 207 is rotatably connected to the locking seat 206 via a pin. Correspondingly, a hook 208 is provided on the corresponding side wall of the clamping top plate 205. When the clamping top plate 205 is engaged, rotating the arc-shaped connector 207 downwards causes it to hook onto the hook 208, achieving quick locking and making the operation very convenient.

[0036] 3. Detailed Composition of the Cap Removal Structure and Drive Components The decapping assembly specifically includes: a gripper base plate 303 fixedly connected to the upper end of the second mounting plate 302. The upper surface of the gripper base plate 303 is machined with a first gripper groove that matches the contour of the lower half of the end cap. A vertical plate 304 is vertically fixed to the side wall of the second mounting plate 302, and a horizontal plate 305 extends horizontally from the top of the vertical plate 304. A telescopic cylinder 306 is installed below the horizontal plate 305. The piston rod (telescopic end) of the telescopic cylinder 306 points vertically downwards, and its end is fixedly connected to a gripper top plate 307. The lower surface of the gripper top plate 307 is machined with a second gripper groove corresponding to the first gripper groove. During operation, the telescopic cylinder 306 extends, driving the gripper top plate 307 to descend, causing the first gripper groove and the second gripper groove to close, thereby clamping the end cap. It should be noted that the first clamping groove and the first gripper groove are strictly coaxially arranged in the design, respectively used to support the wafer cleaning rod body and its end cap, ensuring aligned force.

[0037] The drive assembly includes an electric slide rail 401 fixedly mounted on a platform between two sets of support slide rails 101. An electric slider 402 is slidably connected to the electric slide rail 401, and in this embodiment, the bottoms of the two second mounting plates 302 are respectively fixedly connected to an independent electric slider 402. A servo motor 403 is mounted at one end of the electric slide rail 401. By controlling the forward and reverse rotation of the servo motor 403, the two electric sliders 402 can be precisely controlled to move synchronously towards each other (performing cap removal) or away from each other (resetting) along the electric slide rail 401, thereby driving the two cap removal components to move.

[0038] 4. Control Alarm Structure and Workflow The control and alarm structure is the core of the invention's intelligence. It includes a programmable logic controller (PLC) as the controller, which is electrically connected to the solenoid valves of the servo motor 403 and the telescopic cylinder 306. A torque sensor for detecting cap-removing resistance and a displacement sensor for detecting displacement are integrated into the gripper top plate 307 of each cap-removing assembly or the piston rod of the telescopic cylinder 306. An audible and visual alarm is also installed on the side of the support platform 100.

[0039] The controller has a pre-written control system program configured to execute the following adaptive cap removal control flow: S1 (Start Clamping and Cap Removal): The operator places the wafer cleaning rod mold into the groove of the clamping base 204 and fastens and locks the clamping top plate 205. Then, the device is started via the controller. The controller first controls the two telescopic cylinders 306 to actuate, causing the cap removal assembly to clamp the caps at both ends. Next, it controls the two servo motors 403 to start at a preset initial synchronous speed and torque, driving the cap removal assembly to begin smoothly removing the caps.

[0040] S2 (Data Acquisition): During the cap removal process, two torque sensors collect the cap removal force feedback values ​​F1 and F2 in real time, and two displacement sensors collect the displacement values ​​D1 and D2 of the end cap being pulled out in real time.

[0041] S3 (Difference Calculation): The controller calculates the real-time torque difference ΔF=|F1-F2| and displacement difference ΔD=|D1-D2| in real time.

[0042] S4 (Handling One-Sided Adhesion): The controller compares ΔF with a preset first threshold (e.g., 15% of the rated cap-pulling force) and ΔD with a preset second threshold (e.g., 0.5mm). If the system detects that ΔF exceeds the first threshold but ΔD does not exceed the second threshold, it intelligently determines that "one-sided adhesion" has occurred (i.e., one end cap is tighter). At this time, the control system will not forcibly pull, but will actively reduce the speed of the servo motor 403 on the side with higher torque, making it "wait" for the other side until the force on both sides is balanced and ΔF falls back to within the threshold, and then synchronous movement resumes.

[0043] S5 (Handling Tilt Jam): If the system detects that ΔD exceeds the second threshold, it determines that the end cap has "tilted and jammed," posing a risk of damaging the mold. The controller will immediately send an emergency stop command to all actuators and trigger an audible and visual alarm to notify the operator to intervene and inspect.

[0044] S6 (Cap Removal Completed): When both displacement values ​​D1 and D2 reach the preset cap removal stroke (i.e., the end cap is completely pulled out), and ΔF and ΔD do not exceed their allowable range throughout the process, the cap removal action is successfully completed. The controller stops the servo motor 403 and controls the telescopic cylinder 306 to release the gripper.

[0045] 5. Extended Functionality To further enhance automation, a circular opening is provided at the center of the upper end of the support platform 100. This opening design allows the device to be easily used in conjunction with a separate ejection structure (not shown in the figure, such as a pneumatic or electric ejector). After the capping action is completed, the ejection structure can rise from below through the circular opening to smoothly eject the completely detached wafer cleaning rod from the mold, achieving a continuous automated operation of the capping and ejection processes.

[0046] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A decapping device for processing wafer cleaning rods, characterized in that, include: The support structure includes a support platform (100) on which two parallel support slide rails (101) are provided. The clamping structure includes multiple first sliders (201) slidably connected to the upper end of the support slide rail (101). The upper ends of two first sliders (201) on the same axis are fixedly connected to the same first mounting plate (202). The upper end of the first mounting plate (202) is provided with a clamping assembly for fixing the wafer cleaning rod. The cap removal structure includes multiple second sliders (301) slidably connected to the upper end of the support slide rail (101), and the second sliders (301) are correspondingly arranged on the outside of the first slider (201). The upper ends of the two second sliders (301) on the same axis are fixedly connected to the same second mounting plate (302). The upper end of the second mounting plate (302) is provided with a cap removal component for removing the cap. The support platform (100) between the two support slide rails (101) is provided with a drive component connected to the second mounting plate (302). The control alarm structure includes a controller connected to the drive assembly and a displacement sensor and a torque sensor installed in the cover removal assembly. An alarm is also installed on the support platform (100). The status is determined by collecting real-time data from the torque sensor and the displacement sensor, and the data is fed back to the controller to control the drive assembly and the alarm.

2. The decapping device for wafer cleaning rod processing according to claim 1, characterized in that: The clamping assembly includes two L-shaped brackets (203) fixedly connected to the upper end of the first mounting plate (202). A clamping base (204) is fixedly connected to the upper end of the first mounting plate (202) between the two L-shaped brackets (203). A plurality of first clamping grooves connected to the wafer cleaning rod are evenly distributed on the clamping base (204). A clamping top plate (205) is rotatably connected to the upper end of one of the L-shaped brackets (203). A second clamping groove connected to the wafer cleaning rod is provided at the lower end of the clamping top plate (205). A buckle unit connected to the clamping top plate (205) is provided on the side wall of the other L-shaped bracket (203).

3. The decapping device for wafer cleaning rod processing according to claim 2, characterized in that: The buckle unit includes a buckle seat (206) fixedly connected to the side wall of the L-shaped bracket (203). An arc-shaped connector (207) is rotatably connected to the side wall of the buckle seat (206). A hook (208) matching the arc-shaped connector (207) is provided on the side wall of the clamping top plate (205). The arc-shaped connector (207) cooperates with the hook (208) to fix the clamping top plate (205) to the L-shaped bracket (203).

4. The decapping device for wafer cleaning rod processing according to claim 3, characterized in that: The decapping assembly includes a gripper base plate (303) fixedly connected to the upper end of the second mounting plate (302), and the upper end of the gripper base plate (303) is provided with a first gripper groove for connecting with the end cap of the wafer cleaning rod. A vertical plate (304) is fixedly connected to the side wall of the second mounting plate (302), and a horizontal plate (305) is fixedly connected to the upper end of the vertical plate (304). A telescopic cylinder (306) is fixedly connected to the lower end of the horizontal plate (305), and a gripper top plate (307) is fixedly connected to the telescopic end of the telescopic cylinder (306). The lower end of the gripper top plate (307) is provided with a second gripper groove for connecting with the end cap of the wafer cleaning rod.

5. The decapping device for wafer cleaning rod processing according to claim 4, characterized in that: The first clamping groove and the first gripper groove are coaxially arranged. The first clamping groove is used to support the wafer cleaning rod, and the first gripper groove is used to support the end cap.

6. The decapping device for wafer cleaning rod processing according to claim 4, characterized in that: The drive assembly includes an electric slide rail (401) fixedly connected between two sets of support slide rails. An electric slider (402) is connected to the upper end of the electric slide rail (401), and the upper end of the electric slider (402) is fixedly connected to the bottom wall of the second mounting plate (302). A servo motor (403) is provided on one side of the electric slide rail (401) and connected thereto. By controlling the servo motor (403), the electric slider (402) can be made to move laterally back and forth, thereby changing the movement of the cap removal assembly at the upper end of the second mounting plate (302).

7. The decapping device for wafer cleaning rod processing according to claim 6, characterized in that: The controller includes a control system configured to execute the following adaptive cap removal control procedure: S1: Control two servo motors (403) to start at a preset initial synchronous speed and torque, and clamp the end cap through the cap release assembly; S2: Real-time acquisition of feedback values ​​F1, F2 from two torque sensors and displacement values ​​D1, D2 from a displacement sensor; S3: Calculate the real-time torque difference ΔF = |F1-F2| and displacement difference ΔD = |D1-D2|; S4: If ΔF exceeds the first threshold and ΔD does not exceed the second threshold, it is determined to be a one-sided adhesion. The control system reduces the speed of the servo motor on the side with higher torque until ΔF falls back to within the threshold. S5: If ΔD exceeds the second threshold, it is determined that the end cap is tilted, the action is stopped immediately and an alarm is triggered; S6: When both displacement values ​​D1 and D2 reach the set cap removal stroke, and ΔF and ΔD are within the allowable range, the cap removal action is completed.

8. The decapping device for wafer cleaning rod processing according to claim 7, characterized in that: The support platform (100) has a circular opening at the center of its upper end, and an ejection structure can be provided inside the circular opening to eject the wafer cleaning rod after it has been decapped.

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