A bonding apparatus and a bonding method

Abstract

This application discloses a bonding apparatus and a bonding method. The bonding apparatus includes a base, a stage, a feeding and expanding mechanism, an ejection mechanism, a flipping mechanism, a conveying mechanism, a rotary alignment and pressing mechanism, and a coaxial camera mechanism. The flipping mechanism has a flipping section, and the conveying mechanism has a conveying section that moves between the flipping section and the stage. The rotary alignment and pressing mechanism is mounted on the conveying section to switch between a pick-up position at the flipping section and a bonding position at the stage. The rotary alignment and pressing mechanism includes a pressing section. The pressing section can rotate about a first linear direction and slide along the first linear direction to press the chip onto the packaging board on the stage. The coaxial camera mechanism has a first optical path and a second optical path. The first optical path and the second optical path are located on the same optical axis. The feeding and expanding mechanism, the ejection mechanism, the flipping mechanism, the conveying mechanism, and the coaxial camera mechanism are all mounted on the base. The bonding apparatus of this application can improve production yield and production efficiency.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more particularly to a bonding apparatus and bonding method. Background Technology

[0002] In the semiconductor processing field, the traditional wafer bonding process is as follows: First, precise circuit patterns are etched on the wafer surface using photolithography. Then, the complete wafer is divided into individual chips using dicing equipment. Next, chip expansion is performed to facilitate subsequent wafer removal. Then, high-precision equipment is used to precisely align the chip with the bonding positions on the packaging board. Finally, the physical connection and electrical conduction between the chip and the packaging board are completed by pressing and bonding.

[0003] In recent years, with the rapid development of consumer electronics, artificial intelligence, data centers, and other fields, semiconductor devices have shown a trend towards miniaturization, high density, and high performance. Taking the field of artificial intelligence as an example, the demand for high-performance graphics cards and high-bandwidth memory (HBM) chips has exploded. Currently, bonding devices mainly adopt a bidirectional camera recognition mode, but due to the limitation of the dual-camera field of view, the two chips cannot be closely aligned during bonding, resulting in a large amount of wasted space and increased production costs. In addition, the dual-camera alignment structure of the bonding device is complex, and the design of the composite rotary linear axis is difficult, resulting in low production stability and yield of the bonding device, which affects the production efficiency of the bonding device. Summary of the Invention

[0004] The purpose of this invention is to provide a bonding apparatus and a bonding method that can solve the above-mentioned problems existing in the prior art.

[0005] To achieve the above objectives, this application adopts the following technical solution:

[0006] On one hand, a bonding device is provided, comprising: Base; A stage, used to support the packaging board; The feeding and expanding mechanism is used for feeding and expanding the film on chips. An ejection mechanism is used to eject the chip from the feeding and film expansion mechanism; A flipping mechanism having a flipping section for picking up and flipping the chip on the feeding and expanding film mechanism; A conveying mechanism having a conveying section that moves between the tilting section and the platform; A rotary alignment and pressing mechanism is installed on the conveying section to switch between a pick-up position at the flipping section and a bonding position at the stage; the rotary alignment and pressing mechanism includes a pressing section for picking up the chip on the flipping section; the pressing section is rotatable about a first linear direction and slides along the first linear direction to press the chip onto the packaging board on the stage; as well as A coaxial camera mechanism has a first optical path for identifying chips and a second optical path for identifying packaging boards; the first optical path and the second optical path are located on the same optical axis. The feeding and expanding film mechanism, the ejection mechanism, the flipping mechanism, the conveying mechanism, and the coaxial camera mechanism are all mounted on the machine base.

[0007] Preferably, the conveying mechanism includes a first base mounted on the base, a first linear driver mounted on the first base, a first slide mounted on the output end of the first linear driver, and an air-bearing module; the first slide is slidably mounted on the first base via the air-bearing module, the conveying part is located on the first slide, and the rotary alignment and pressing mechanism is mounted on the first slide.

[0008] Preferably, the conveying mechanism further includes an electromagnetic adsorption module; when the electromagnetic adsorption module is energized, the first slide can be adsorbed onto the first seat body through the electromagnetic adsorption module.

[0009] Preferably, the conveying mechanism further includes a first guide rail mounted on the first slide, a second slide slidably mounted on the first guide rail along the first linear direction, and a gravity balancer connecting the first slide and the second slide; the rotation alignment and pressing mechanism is mounted on the second slide.

[0010] Preferably, the rotary alignment and pressing mechanism includes a second base with a mounting groove, a voice coil motor mounted in the mounting groove, a first drive motor with a first rotating mover mounted in the mounting groove, an air bearing mounted in the mounting groove, a rotary shaft rotatably mounted in the mounting groove via the air bearing and connected to the first rotating mover, and a first suction member mounted on the rotary shaft; the first rotating mover is connected to the output end of the voice coil motor, and the pressing part is located on the first suction member.

[0011] Preferably, the platform includes a first linkage drive module having an output end movable along a second linear direction and a third linear direction, a first support base mounted on the output end of the first linkage drive module, a first rotating base rotatably mounted on the first support base, a leveling component mounted on the first rotating base, and a micro-adjustment module for supporting the packaging plate; the micro-adjustment module is mounted on the leveling component, and the first linear direction, the second linear direction, and the third linear direction are perpendicular to each other.

[0012] Preferably, the feeding and expanding film mechanism includes a second linkage drive module having an output end movable along a second linear direction and a third linear direction, a second support base mounted on the output end of the second linkage drive module, a film expanding base rotatably mounted on the second support base, and a feeding base slidably mounted on the film expanding base; a clamping gap is formed between the feeding base and the film expanding base, and the feeding base and the film expanding base together form an ejection groove, the ejection mechanism is located in the ejection groove, and the first linear direction, the second linear direction and the third linear direction are perpendicular to each other.

[0013] Preferably, the ejection mechanism includes a third base mounted on the feeding and film expanding mechanism, a second linear driver mounted on the third base, a needle can mounted on the output end of the second linear driver, a third linear driver mounted on the output end of the second linear driver, and an ejector pin mounted on the output end of the third linear driver; the needle can has a needle groove, and the ejector pin is located in the needle groove of the needle can.

[0014] Preferably, the flipping mechanism includes a fourth seat, a fourth linear actuator mounted on the fourth seat, a second drive motor having a second rotating mover and mounted on the output end of the fourth linear actuator, and a second adsorption member mounted on the second rotating mover; the flipping part is located on the second adsorption member, and the feeding and film expanding mechanism is located on the moving path of the second adsorption member.

[0015] Preferably, the coaxial camera mechanism includes a fifth base on the base, a third slide mounted on the fifth base, an optical path system mounted on the third slide, and a first camera body on the optical path system; the first optical path and the second optical path are located on the optical path system, and the first camera body is located between the first optical path and the second optical path.

[0016] Preferably, the bonding device further includes a correction mechanism mounted on the fifth housing; the correction mechanism has a first correction part adapted to the first optical path and a second correction part adapted to the second optical path.

[0017] Preferably, the bonding apparatus further includes a bonding inspection camera mechanism and / or a loading alignment camera mechanism for inspecting chip loading; the loading alignment camera mechanism is located above the loading and expanding film mechanism; the bonding inspection camera mechanism is movably mounted above the stage, so as to be close to or away from the stage.

[0018] On the other hand, a bonding method is provided, based on the above-described bonding apparatus, the bonding method comprising the following steps: A wafer with multiple chips is placed on the loading and film spreading mechanism, and a packaging board is placed on the stage; The feeding and film expansion mechanism expands and transports the chips on the wafer; The flipping part of the flipping mechanism picks up and flips the chip on the feeding and expanding film mechanism; The conveying part of the conveying mechanism drives the rotary alignment and pressing mechanism to move to the picking position, and the pressing part of the rotary alignment and pressing mechanism picks up the chip on the flipping part; The conveying part of the conveying mechanism drives the rotary alignment and pressing mechanism to move to the bonding position; The coaxial camera mechanism simultaneously identifies the markings on the chip and the markings on the package board. The pressing part of the rotating alignment pressing mechanism rotates around the first straight line direction according to the identification result of the coaxial camera mechanism to adjust the angle of the chip so that the markings on the chip and the markings on the package board are aligned. The pressing portion of the rotary alignment pressing mechanism moves along a first linear direction to press the chip onto the packaging plate on the carrier.

[0019] The beneficial effects of this application are as follows: The bonding apparatus of this application includes a base, a stage, a feeding and expanding mechanism, an ejection mechanism, a flipping mechanism, a conveying mechanism, a rotary alignment and pressing mechanism, and a coaxial camera mechanism. Through the cooperation of the stage, the feeding and expanding mechanism, the ejection mechanism, the flipping mechanism, the conveying mechanism, the rotary alignment and pressing mechanism, and the coaxial camera mechanism, automatic chip feeding, expanding, alignment, and bonding are achieved. During the alignment process, the first and second optical paths of the coaxial camera mechanism can simultaneously identify the markings on the chip and the markings on the package board. Finally, based on the identification results, the pressing part is driven to rotate the chip and adjust the chip angle, so that the markings on the chip and the markings on the package board are aligned. Compared with the traditional dual-camera identification method, the coaxial camera mechanism not only has higher identification efficiency but is also more accurate, improving the production yield and efficiency during bonding.

[0020] The bonding method of this application, by employing the aforementioned bonding apparatus, can improve the production yield and efficiency during bonding. Attached Figure Description

[0021] The present application will now be described in further detail with reference to the accompanying drawings and embodiments.

[0022] Figure 1 A schematic diagram of the bonding device from one perspective; Figure 2 A schematic diagram of the bonding device from another perspective; Figure 3 This is a structural diagram of the coaxial camera mechanism and the calibration mechanism. Figure 4 A schematic diagram of the coaxial camera mechanism; Figure 5 This is a schematic diagram of the conveying mechanism and the rotary alignment and pressing mechanism. The conveying mechanism is located at the material pick-up position in the diagram. Figure 6 This is a schematic diagram of the conveying mechanism and the rotary alignment and pressing mechanism. The conveying mechanism is located at the bonding position in the diagram. Figure 7 This is a structural schematic diagram of the first seat and the air-float module; Figure 8 This is a structural schematic diagram of the first base, the first linear actuator, and the first slide of the conveying mechanism; Figure 9 This is a schematic diagram of the structure of the first slide and the second slide; Figure 10 This is a schematic diagram of the rotating alignment and pressing mechanism; Figure 11 A cross-sectional view of the rotary alignment and pressing mechanism; Figure 12 This is a schematic diagram of the composite grating ruler. Figure 13 A graph showing the pressure versus voltage of the rotating alignment and pressing mechanism; Figure 14 This is a schematic diagram of the stage structure; Figure 15 This is a schematic diagram of the feeding and film expansion mechanism; Figure 16 This is a schematic diagram of the ejection mechanism; Figure 17 This is a schematic diagram of the flipping mechanism; Figure 18 A schematic diagram of the bonding detection camera mechanism. Figure 19 This is a schematic diagram of the bonding detection camera mechanism; Figure 20 This is a schematic diagram of the feeding and alignment camera mechanism.

[0023] Explanation of reference numerals in the attached figures: 11. Base; 12. Stage; 13. Feeding and expanding mechanism; 14. Ejection mechanism; 15. Tilting mechanism; 16. Conveying mechanism; 17. Rotary alignment and pressing mechanism; 18. Coaxial camera mechanism; 19. Calibration mechanism; 20. Bonding detection camera mechanism; 21. Feeding and alignment camera mechanism; 22. Chip; 23. Packaging board; 121. First linkage drive module; 122. First support base; 123. First rotating base; 124. Leveling component; 125. Micro-adjustment module; 126. Base; 131. Second linkage drive module; 132. Second support base; 133. Film expansion base; 134. Feeding base; 135. Ejection slot; 136. First motor; 137. Second motor; 141. Third seat; 142. Second linear actuator; 143. Third linear actuator; 144. Needle holder; 145. Ejector pin; 146. Needle groove; 151. Flipping part; 152. Fourth seat; 153. Fourth linear actuator; 154. Second rotary actuator; 155. Second drive motor; 156. Second suction element; 1601. Conveying unit; 1602. First base; 1603. First linear actuator; 1604. First slide; 1605. Air flotation module; 1607. First guide rail; 1608. Second slide; 1609. Gravity balancer; 1610. First air flotation block; 1611. Second air flotation block; 1612. First contact surface; 1613. Second contact surface; 1614. Inclined surface; 1615. First stator; 1616. First mover; 1617. First micro offset sensor; 1618. Second micro offset sensor; 1619. First sensor measurement position; 1620. Second sensor measurement position; 1621. Abutment surface; 1622. Receiving groove; 1701. Second seat; 1702. Mounting slot; 1703. Voice coil motor; 1704. First drive motor; 1705. Air bearing; 1706. Pressing part; 1707. First suction element; 1708. Fixed seat; 1709. Vacuum passage; 1710. Rotary shaft; 1711. Tool head; 1712. Suction channel; 1713. Suction nozzle; 1714. First rotating mover; 1715. First rotating stator; 1716. Mounting shaft; 1717. Composite grating ruler; 1718. Rotary reading seat; 1719. Linear reading seat; 1720. First rotary reading head; 1721. Second rotary reading head; 1722. Linear reading head; 1723. First rotary scale; 1724. Second rotary scale; 1725. Linear scale; 181. First optical path; 182. Second optical path; 183. Fifth mounting body; 184. Third sliding mount; 185. Optical path system; 186. First camera body; 191. First Correction Department; 192. Second Correction Department; 201. Second camera body; 202. Telescope lens; 203. Objective lens; 204. Infrared light source; 205. Fifth linear actuator; 206. Sixth mount; 211. Third camera body; 212. Feeding light source. Detailed Implementation

[0024] To make the technical problems solved by this application, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of this application are further described in detail below. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "fixed," "linked," "communicated," "abutting," "clamping," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0026] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0027] Before discussing the exemplary embodiments in more detail, it should be noted that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although the flowcharts describe the operations (or steps) as sequential processes, many of these operations can be performed in parallel, concurrently, or simultaneously. Furthermore, the order of the operations can be rearranged. The process can be terminated when its operation is completed, but it may also have additional steps not included in the figures. The process may correspond to a method, function, procedure, subroutine, subroutine, etc.

[0028] Unless otherwise stated or defined, the term "and / or" as used in this invention includes any and all combinations of one or more of the associated listed items.

[0029] For ease of description, the first straight line direction or vertical direction mentioned below is... Figure 1 The vertical direction itself is consistent, and the second and third straight line directions mentioned below are the same as... Figure 1 They are aligned horizontally.

[0030] like Figures 1 to 4 As shown, this embodiment provides a bonding device, mainly used to connect chip 22 and package board 23 together with high precision through physical or chemical means, realizing electrical interconnection, structural support and functional integration. It directly determines the performance, power consumption and reliability of chip 22 in key technologies such as advanced packaging, 3D stacking, and HBM (high bandwidth memory).

[0031] The bonding device includes a base 11, a stage 12, a feeding and expanding mechanism 13, an ejection mechanism 14, a flipping mechanism 15, a conveying mechanism 16, a rotary alignment and pressing mechanism 17, and a coaxial camera mechanism 18. The base 11 serves as a support structure, and the stage 12, the feeding and expanding mechanism 13, the ejection mechanism 14, the flipping mechanism 15, the conveying mechanism 16, the rotary alignment and pressing mechanism 17, and the coaxial camera mechanism 18 are indirectly or directly mounted on the base 11.

[0032] The stage 12 is used to support the packaging board 23. The packaging board 23 is a wafer or substrate used for bonding with the chip 22.

[0033] The loading and film expansion mechanism 13 is used for loading and expanding the wafers 22. The loading and film expansion mechanism 13 loads wafers containing multiple chips 22. After the wafer is formed into multiple chips 22 through processes such as photolithography and dicing, it is placed on the loading and film expansion mechanism 13, which performs the film expansion operation on the wafer. The film expansion operation is generally performed after the wafer is diced into individual chips 22. After dicing, the chips 22 are still attached to the adhesive dicing tape. To prevent accidental contact with adjacent chips 22 during pickup, the tape needs to be stretched using the film expansion equipment to increase the distance between the chips 22, thereby providing operating space for subsequent bonding processes.

[0034] The ejection mechanism 14 is used to eject the chip 22 from the loading and expanding film mechanism 13. After the film expansion operation is completed, the ejection mechanism 14 can eject the single chip 22 from the blue film of the wafer on the loading and expanding film mechanism 13, so that the subsequent flipping mechanism 15 can pick up the chip 22.

[0035] The flipping mechanism 15 has a flipping section 151 for picking up and flipping the chip 22 on the feeding and expanding film mechanism 13. The flipping section 151 can pick up the chip 22 of the wafer on the feeding and expanding film mechanism 13 by means of negative pressure adsorption, clamping or the like, and after picking it up, flip the chip 22 at a certain angle, such as flipping it 180 degrees, so that it can be picked up by the rotary alignment and pressing mechanism 17 mounted on the conveying mechanism 16.

[0036] The conveying mechanism 16 has a conveying section 1601 that moves between the tilting section 151 and the platform 12. The conveying section 1601 is used to drive the rotary alignment and pressing mechanism 17 from the tilting section 151 to the platform 12.

[0037] A rotary alignment and pressing mechanism 17 is mounted on the conveyor section 1601 to switch between a pick-up position at the flip section 151 and a bonding position at the stage 12. The rotary alignment and pressing mechanism 17 includes a pressing section 1706 for picking up the chip 22 from the flip section 151. The pressing section 1706 is rotatable and slides along a first linear direction to press the chip 22 onto the packaging plate 23 on the stage 12. During bonding, the chip 22 is generally pressed downwards onto the packaging plate 23, such as a wafer; therefore, the first linear direction can be vertical, but in this application, it can be vertical. When the rotary alignment and pressing mechanism 17 switches to the pick-up position driven by the conveyor section 1601, the pressing section 1706 of the rotary alignment and pressing mechanism 17 picks up the chip 22 from the flip section 151 by adsorption, clamping, or other means, and then the rotary alignment and pressing mechanism 17 switches to the bonding position driven by the conveyor section 1601. At the bonding position, the rotary alignment pressing mechanism 17 is first above the stage 12, and then the angle of the chip 22 is adjusted by the rotation of the pressing part 1706 so that the mark on the chip 22 is aligned with the mark on the package board 23. Finally, the chip 22 is pressed onto the package board 23 on the stage 12 by the movement of the pressing part 1706.

[0038] The coaxial camera mechanism 18 has a first optical path 181 for identifying the chip 22 and a second optical path 182 for identifying the package board 23. The first optical path 181 and the second optical path 182 are located on the same optical axis, allowing the coaxial camera mechanism 18 to simultaneously identify the marks on the chip 22 and the package board 23. Compared to a dual-camera approach, the coaxial camera mechanism 18 achieves synchronous imaging of the alignment marks on the chip 22 and the package board 23 through the shared optical path 181 and the second optical path 182, eliminating the need to switch optical paths or refocus. This effectively eliminates the field-of-view fragmentation and alignment blind spots caused by the separate optical paths in a bidirectional camera, allowing the two chips 22 to be closely aligned and reducing production costs. Simultaneously, the coaxial camera mechanism 18 achieves single-exposure, dual-mark identification, eliminating the two independent positioning, mechanical displacement, and refocusing processes required by a bidirectional camera. This shortens the alignment cycle, eliminates the accumulation of optical path offset errors, and achieves higher repeatability accuracy. Therefore, the coaxial camera mechanism 18 can improve the production stability, production efficiency, and production yield of wafer bonding.

[0039] The feeding and expanding mechanism 13, the ejection mechanism 14, the flipping mechanism 15, the conveying mechanism 16, and the coaxial camera mechanism 18 are all mounted on the base 11. Through the cooperation of the feeding and expanding mechanism 13, the ejection mechanism 14, the flipping mechanism 15, the conveying mechanism 16, and the coaxial camera mechanism 18, the bonding device can automatically complete the processes of feeding, expanding, and bonding.

[0040] The precise alignment of chip 22 and package board 23 employs a coaxial camera mechanism 18. Without additional movement, the first optical path 181 and the second optical path 182, sharing the same optical axis, simultaneously identify the markings on the upper chip 22 and the lower wafer. This eliminates the influence of axial positioning accuracy and straightness issues caused by axial movement in existing bidirectional cameras, resulting in smaller identification errors and higher accuracy. This application, through the cooperation of the rotational alignment and pressing mechanism 17 and the coaxial camera mechanism 18, achieves high-precision alignment and high-precision pressing control after alignment, resulting in high-yield bonding of chip 22 and package board 23, and improving the production stability, efficiency, and yield of wafer bonding.

[0041] like Figures 5 to 9 As shown, in one embodiment, the conveying mechanism 16 includes a first base 1602 mounted on the base 11, a first linear driver 1603 mounted on the first base 1602, a first slide 1604 mounted on the output end of the first linear driver 1603, and an air-bearing module 1605. The first slide 1604 is slidably mounted on the first base 1602 via the air-bearing module 1605. At this time, the conveying part 1601 is located on the first slide 1604, and the rotation alignment and pressing mechanism 17 is mounted on the first slide 1604. The first linear driver 1603 is a component such as a lead screw module or a linear motor module. In this application, the first linear driver 1603 is a linear motor module with an iron core, which meets the high-speed and high-acceleration requirements during the transfer axis movement, shortens the chip 22 transfer time, and improves equipment efficiency. The linear motor module provides power so that the first slide 1604 can move in the horizontal direction. The air flotation module 1605 can not only reduce the use of linear guide rails, but also reduce the sliding friction of the first slide 1604, improve the sliding stability of the first slide 1604, and thus improve the bonding quality.

[0042] This application uses the air-bearing module 1605 as a guide to compensate for the coaxial camera mechanism 18 and the fixed working distance of the coaxial camera mechanism 18, and to ensure that the rotational alignment and pressing mechanism 17 does not produce offsets in other directions during its lifting and lowering movements.

[0043] Optionally, the conveying mechanism 16 also includes an electromagnetic adsorption module. When the electromagnetic adsorption module is energized, the first slide 1604 can be adsorbed onto the first base 1602 via the electromagnetic adsorption module. Utilizing the magnetic attraction principle generated by the energized electromagnetic adsorption module, for example, an electromagnet can be installed on one of the first slide 1604 and the first base 1602, and a magnet on the other. When the electromagnet is energized, it attracts the magnet, fixing the first slide 1604 and the first base 1602 relatively. When the first slide 1604 needs to be moved, the electromagnet is de-energized. After the first slide 1604 drives the rotating alignment and pressing mechanism 17 to the bonding position, it is fixed by the electromagnetic adsorption module, reducing the impact of the movement vibration of the first base 1602 on the bonding, achieving high-precision alignment and bonding stability.

[0044] Furthermore, the conveying mechanism 16 also includes a first guide rail 1607 mounted on the first slide 1604, a second slide 1608 slidably mounted on the first guide rail 1607 along a first linear direction, and a gravity balancer 1609 connecting the first slide 1604 and the second slide 1608. At this time, the conveying unit 1601 is located on the second slide 1608, and the rotational alignment and pressing mechanism 17 is mounted on the second slide 1608. In mechanical equipment, the gravity balancer 1609 (also called a counterbalance) is mainly used to counteract the problem of components falling or becoming unbalanced due to their own weight. For example, in this application, the second slide 1608 lacks a self-locking function in the vertical direction, and the moving shaft may fall due to gravity when power is cut off; therefore, a gravity balancer 1609 needs to be installed to prevent accidents. Such devices provide a counterforce through springs, pneumatic or hydraulic components (cylinders, hydraulic cylinders, etc.) to counteract the effects of gravity and ensure the stability of the equipment during static or dynamic processes.

[0045] In this application, a first slide block 1604 is slidably mounted on a first base 1602 along a horizontal direction, and the first slide block 1604 is used to switch the rotary alignment and pressing mechanism 17 between the material picking position and the bonding position. A second slide block 1608 is mounted on the first slide block 1604 and slides along a first linear direction, meaning the second slide block 1608 can drive the rotary alignment and pressing mechanism 17 to slide up and down. Therefore, the bonding device of this application separates the position control and bonding pressure control of the rotary alignment and pressing mechanism 17 by using the sliding of the second slide block 1608 along the first linear direction and the sliding of the pressing part 1706 of the rotary alignment and pressing mechanism 17 along the first linear direction. That is, by controlling the vertical movement of the pressing part 1706 by the sliding of the second slide block 1608 along the first linear direction, the chip 22 can be quickly moved to the required bonding height, ensuring accurate bonding height. The rotation of the pressing part 1706 of the rotary alignment pressing mechanism 17 is used to adjust the angle and achieve alignment. After alignment, the up and down sliding of the pressing part 1706 of the rotary alignment pressing mechanism 17 controls the pressing force.

[0046] In one embodiment, the air flotation module 1605 includes a first air flotation block 1610 and a second air flotation block 1611. The first seat 1602 has a first contact surface 1612 and a second contact surface 1613. The first contact surface 1612 and the second contact surface 1613 are arranged at an angle, thereby providing vertical and horizontal support to the first slide 1604, respectively. For example, the first contact surface 1612 is horizontal, and the second contact surface 1613 is vertical. Both the first air flotation block 1610 and the second air flotation block 1611 are disposed on the first slide 1604, with the first air flotation block 1610 mounted on the first contact surface 1612 and the second air flotation block 1611 mounted on the second contact surface 1613. When the first contact surface 1612 is horizontally set and the second contact surface 1613 is vertically set, after the first air flotation block 1610 and the second air flotation block 1611 are filled with compressed gas, the gap between the first air flotation block 1610 and the first contact surface 1612, and the gap between the second air flotation block 1611 and the second contact surface 1613, the first contact surface 1612 provides vertical support for the first air flotation block 1610, the first slide block 1604 and the components on the first slide block 1604, and the second contact surface 1613 provides vertical support for the second air flotation block 1611, the second slide block 1608 and the components on the second slide block 1608, so as to achieve frictionless support and high-precision movement of the first slide block 1604.

[0047] Optionally, there are multiple first air flotations 1610 and multiple second air flotations 1611. Multiple first air flotations 1610 are spaced apart along the horizontal sliding direction of the first slide block 1604, and some second air flotations 1611 are spaced apart along the horizontal sliding direction of the first slide block 1604, while others are spaced apart along a first straight line direction. The second contact surface 1613 is provided with a receiving groove 1622. The output end of the first linear actuator 1603 is located within the receiving groove 1622 and between two second air flotations 1611 spaced apart along the first straight line direction. In this application, there are two first air flotations 1610 and three second air flotations 1611 arranged along the three vertices of a triangle, resulting in more stable force distribution. Two of the second air flotations 1611 are located below the output end of the first linear actuator 1603, and the other is located above the output end of the first linear actuator 1603.

[0048] Furthermore, considering the features of the electromagnetic adsorption module described above, the first air flotation block 1610 and the second air flotation block 1611 provide preload force, improving the motion stiffness and motion stability of the first slide block 1604. When the first slide block 1604 is stationary, the air pressure of the first air flotation block 1610 and the second air flotation block 1611 is released, and the first slide block 1604 is fixed by the magnetic attraction force of the electromagnetic adsorption module, eliminating the static vibration generated by the output end of the first linear driver 1603 and the first slide block 1604, and improving the alignment and bonding accuracy.

[0049] Optionally, the first base 1602 further has an inclined surface 1614 located within the receiving groove 1622, the inclined surface 1614 being the inner wall of the receiving groove 1622. The inclined surface 1614 is inclined upwards, that is, the inclined surface 1614 is inclined from top to bottom along the direction outside the receiving groove 1622, and the inclination angle of the inclined surface 1614 is 30 degrees, 45 degrees, etc., preferably 45 degrees in this application. The first stator 1615 of the first linear actuator 1603 is mounted on the inclined surface 1614, so that the first stator 1615 of the first linear actuator 1603 is also inclined. The first mover 1616 of the first linear actuator 1603 is mounted on the first stator 1615 of the first linear actuator 1603, and the first slide 1604 has an inclined abutment surface 1621, the abutment surface 1621 abutting against and connecting to the inclined first mover 1616. Thus, when the first slide 1604 moves to the bonding position under the drive of the first mover 1616 of the first linear actuator 1603, the gas supply to the air flotation module is stopped. Then, the first slide 1604 is adsorbed onto the first seat 1602 by the adsorption force generated by the electromagnetic adsorption module. At this time, since the first seat 1602 has an inclined surface 1614, the electromagnetic adsorption module provides an inclined adsorption force, which makes the adsorption force perpendicular to the inclined setting, further suppressing static jitter and greatly improving the alignment and bonding accuracy.

[0050] Optionally, based on the technical feature that the second slide 1608 is slidably mounted on the first slide 1604 via the first guide rail 1607, the second slide 1608 is mounted on the outer side of the first guide rail 1607. The second slide 1608 moves freely in the vertical direction along the first guide rail 1607. A gravity balancer 1609 is used to balance the gravity of the second slide 1608 and the moving parts. A first micro-offset sensor 1617 and a second micro-offset sensor 1618 are mounted on the second slide 1608. The first guide rail 1607 has a first sensor measurement position 1619 that cooperates with the first micro-offset sensor 1617, and a second sensor measurement position 1620 that cooperates with the second micro-offset sensor 1618, which can effectively measure the position deviation. The first micro-offset sensor 1617 is used to detect the positional offset of the second slide 1608 in the first horizontal direction, and the second micro-offset sensor 1618 is used to detect the positional offset of the second slide 1608 in the second horizontal direction. When the second slide 1608 moves along the vertical first straight line direction, the first micro-offset sensor 1617 and the second micro-offset sensor 1618 measure the positional error in the horizontal direction. After the measurement is completed, the bonding device can compensate for the error through other micro-motion mechanisms such as the stage 12.

[0051] like Figures 10 to 12 As shown, in one embodiment, the rotary alignment and pressing mechanism 17 includes a second seat 1701 with a mounting groove 1702, a voice coil motor 1703 mounted in the mounting groove 1702, a first drive motor 1704 with a first rotating mover 1714 mounted in the mounting groove 1702, an air bearing 1705 mounted in the mounting groove 1702, a rotary shaft 1710 rotatably mounted in the mounting groove 1702 via the air bearing 1705 and connected to the first rotating mover 1714, and a first suction member 1707 mounted on the rotary shaft 1710.

[0052] The second seat 1701 is a housing and is fixed to the second slide 1608 with screws, allowing the second seat 1701 to move vertically up and down following the second slide 1608. The first suction member 1707 is a vacuum suction cup. The first rotating actuator 1714 is connected to the output end of the voice coil motor 1703, whose output end is the movable coil of the voice coil motor 1703. The movable coil can move along a first linear direction, and the voice coil motor 1703 can achieve precise pressure control. The pressing part 1706 is located on the first suction member 1707, and the voice coil motor 1703 can drive the first suction member 1707 to move up and down.

[0053] The air bearing 1705 utilizes the air-bearing principle to guide the lifting and lowering of the rotary shaft 1710, enabling its rotation and sliding. This reduces the need for linear guides and lowers friction, ensuring no radial offset during the lifting and lowering of the rotary shaft 1710. This effectively guarantees the motion accuracy of the rotary shaft 1710, ensuring rotational precision and precise force control. Furthermore, the air bearing 1705 is a frictionless bearing, enabling higher movement speeds and improving production efficiency. In addition, the air bearing 1705 uses nitrogen as the air-bearing gas. Nitrogen's cleanliness and non-reactive properties prevent particulate matter generation or environmental pollution during the operation of the rotary shaft 1710, achieving ultra-clean, oil-free, and low-particulate-release precision motion control, ensuring the cleanliness of the bonding area, and preventing oxidation of the chip 22.

[0054] The voice coil motor 1703 drives the linear movement of the first adsorption component 1707 for precise bonding force control between the chip 22 and the wafer. This bonding force is precisely controlled through the current loop of the voice coil motor 1703. The advantages of the voice coil motor 1703 include faster response speed of the moving parts, achieving higher positioning accuracy. Furthermore, the precise current control allows the voice coil motor 1703 to perform precise force control, ensuring stability while preventing position overshoot.

[0055] Thus, through the cooperation of the voice coil motor 1703 and the first drive motor 1704, the first adsorption element 1707 and the chip 22 can simultaneously achieve small-angle rotation and micro-movement in the first linear direction. The first drive motor 1704 can drive the rotation of the first adsorption element 1707 to compensate for the angle between the chip 22 and the wafer, and the voice coil motor 1703 can precisely control the bonding force.

[0056] Optionally, the second seat 1701 is screwed onto the fixed seat 1708, and the fixed seat 1708 is mounted on the second slide 1608. The air bearing 1705 is fitted into the second seat 1701 and fixed onto the fixed seat 1708 by screws. The air bearing 1705 is inlaid with multiple air-floating throttle plugs. The rotary shaft 1710 is placed inside the air bearing 1705, and is the moving part guided by the air bearing 1705. Compressed gas enters the air bearing 1705 through the air-floating throttle plugs, forming an airflow gap between the air bearing 1705 and the rotary shaft 1710. This allows the rotary shaft 1710 to float frictionlessly within the heated interior of the air bearing 1705. When the rotary shaft 1710 performs both lifting and rotational movements, the air bearing 1705 ensures higher linearity and lateral runout, resulting in higher on-position stability and alignment accuracy. The use of the frictionless air bearing 1705 eliminates motion damping and static friction, leading to faster bonding response and higher bonding force accuracy.

[0057] The first adsorption component 1707 includes a suction nozzle 1713 installed inside the lower end of the rotary shaft 1710 and a tool head 1711 installed at the lower end of the rotary shaft 1710. The suction nozzle 1713 is positioned between the rotary shaft 1710 and the tool head 1711. The rotary shaft 1710 has a vacuum channel 1709 inside, and the tool head 1711 has an adsorption channel 1712. The vacuum channel 1709, the suction nozzle 1713, and the adsorption channel 1712 are connected in sequence. The negative pressure is used to adsorb the chip 22 or the fixture onto the tool head 1711. The tool head 1711 can be replaced according to the different chip 22 products being manufactured. The suction nozzle 1713 ensures the vacuum seal between the rotary shaft 1710 and the tool head 1711 after each replacement of the tool head 1711.

[0058] The first drive motor 1704 is a non-contact direct-drive motor. The first rotating rotor 1714 of the first drive motor 1704 is a custom-designed, extended permanent magnet. This design overcomes the magnetic loss caused by the change in the internal length of the permanent magnet in the stator of the first drive motor 1704 during synchronous lifting and lowering movements, thus solving the problem of synchronization between the rotation and lifting movements of the rotary shaft 1710. The first rotating stator 1715 of the first drive motor 1704 is bonded and fixed to the second base 1701. The stator of the voice coil motor 1703 is fixed with screws, and the end of the rotary shaft 1710 is threadedly connected to a mounting shaft 1716, which is connected to the first rotating rotor 1714 of the first drive motor 1704.

[0059] Optionally, a composite grating ruler 1717 is attached to the lower end of the rotary shaft 1710 by screws. A rotary reading base 1718 and a linear reading base 1719 are mounted on the lower part of the second base 1701 by screws. The rotary reading base 1718 has a first rotary reading head 1720 and a second rotary reading head 1721, which are spaced apart circumferentially along the rotary shaft 1710 and located on the same diameter of the rotary shaft 1710, i.e., arranged at 180°. The first rotary reading head 1720 and the second rotary reading head 1721 are used for measurement. The linear reading base 1719 is equipped with a linear reading head 1722. The linear reading head 1722 is located between the first rotary reading head 1720 and the second rotary reading head 1721. The first rotary reading head 1720, the second rotary reading head 1721, and the linear reading head 1722 are all used in conjunction with the composite grating ruler 1717 to measure the rotation angle and lifting height of the rotary shaft 1710.

[0060] Furthermore, the composite grating ruler 1717 is annular and has a first rotary scale 1723, a second rotary scale 1724, and a linear scale 1725. The first rotary scale 1723 and the second rotary scale 1724 are both located on the outer circumference of the composite grating ruler 1717. There are multiple first rotary scales 1723 and they are arranged at intervals along the circumference of the rotation axis 1710. There are multiple second rotary scales 1724 and they are arranged at intervals along the circumference of the rotation axis 1710. The first rotary scale 1723 cooperates with the first rotary reading head 1720, and the second rotary scale 1724 cooperates with the second rotary reading head 1721. The outer circumferential surface of the composite grating ruler 1717 is provided with a scale plane, which is parallel to the rotation axis of the rotary shaft 1710. The linear scale 1725 is provided on the scale plane and is located between the first rotary scale 1723 and the second rotary scale 1724. There are multiple linear scales 1725, which are arranged at intervals along the axial direction of the rotary shaft 1710. The linear scale 1725 is matched with the linear reading head 1722.

[0061] Thus, when the rotary shaft 1710 rotates, it drives the composite grating ruler 1717 to rotate. The first rotary reading head 1720 and the second rotary reading head 1721 read the first rotary scale 1723 and the second rotary scale 1724 respectively, thereby obtaining the current rotation angle. When the rotary shaft 1710 moves along the first linear direction, it drives the composite grating ruler 1717 to rise and fall along the first linear direction. The linear reading head 1722 reads the linear scale 1725, thereby obtaining the current linear distance traveled. When the rotary shaft 1710 simultaneously rises, falls, and rotates, the first rotary reading head 1720, the second rotary reading head 1721, and the linear reading head 1722 cooperate to confirm the rotary position information and linear movement position information of the rotary shaft 1710. The composite grating ruler 1717 adopts the design concept of a multi-dimensional grating ruler, which solves the problem of loss of feedback signal when performing multi-dimensional motion on a single motion axis, making the design of the rotation alignment and pressing mechanism 17 simpler and the motion mode more flexible.

[0062] Meanwhile, the rotation positioning feedback of the rotary shaft 1710 adopts a dual-reading head system with a first rotary reading head 1720 and a second rotary reading head 1721, and the first rotary reading head 1720 and the second rotary reading head 1721 are designed to be 180° symmetrical. The dual-path feedback measurement equalizes the problem of misalignment caused by assembly deviation, thereby making the measurement rotation accuracy higher.

[0063] Furthermore, the coaxial arrangement of the rotary shaft 1710, the first adsorption element 1707, and the chip 22 simplifies the compensation logic and increases the rotary compensation accuracy. The rotary alignment and pressing mechanism 17 only performs rotary alignment compensation, while the horizontal position alignment compensation of the chip 22 is achieved through the stage 12 or other mechanisms, resulting in higher alignment efficiency. The rotary alignment and pressing mechanism 17 adopts a cantilever structure, which is simpler and more stable.

[0064] A position feedback sensor is installed on the second seat 1701 of the rotary alignment and pressing mechanism 17. The position feedback sensor provides position feedback measurement for the micro-motion of the rotary shaft 1710 and the first adsorption member 1707.

[0065] The pressing operation of the rotary alignment pressing mechanism 17 in this application is as follows: Step 1: The voice coil motor 1703 drives the first suction component 1707 to descend slowly. The tool head 1711 of the first suction component 1707 stops moving after contacting the pressure sensor on the stage 12.

[0066] Step 2: The voice coil motor 1703 slowly outputs reverse current to give the tool head 1711 lift until the pressure sensor output is 0, at which point the increase in current output of the voice coil motor 1703 stops.

[0067] Step 3: Using the current output current of the current voice coil motor 1703 as zero, reduce the current value to zero in equal steps and then increase it in reverse.

[0068] Step 4: The tool head 1711, driven by the voice coil motor 1703, causes the pressure sensor to output different pressures under different currents. The pressure curve of the pressure sensor is shown below. Figure 13 As shown.

[0069] The alignment process of the rotary alignment and pressing mechanism 17 is as follows: Step 1: The coaxial camera mechanism 18 is identified, and the algorithm is used to separate the horizontal displacement deviation and the angular deviation of rotation around the vertical line.

[0070] Step 2: The first drive motor 1704 drives the rotary shaft 1710 to rotate to adjust the angle offset and perform precise angle alignment.

[0071] Step 3: The first rotary reading head 1720 and the second rotary reading head 1721 output a position signal by feeding back the actual movement position of the composite grating ruler 1717.

[0072] Step 4: Remeasure the angular deviation of the coaxial camera mechanism 18 to check if it meets the alignment accuracy requirements. If it does, proceed to Step 5; otherwise, return to Step 2.

[0073] Step 5: The first drive motor 1704 drives the rotary shaft 1710 to descend to the bonding height.

[0074] Step 6: The linear reading head 1722 feeds back the position signal of the composite grating ruler 1717.

[0075] Step 7: The controller of the rotary alignment and pressing mechanism 17 is switched to force control mode, the output current is set, the voice coil motor 1703 presses down according to the calibrated force, and the chip 22 is bonded.

[0076] In summary, the rotary alignment and pressing mechanism 17 of this application can achieve two degrees of freedom of movement in the lifting and rotating directions while simultaneously enabling precise force control. The guide of the rotary shaft 1710 adopts an air bearing 1705, which can simultaneously meet the high precision and low vibration requirements of the two degrees of freedom of the rotary shaft 1710 in lifting and rotation. Both lifting and rotation adopt a non-contact direct drive motor design, which can better improve positioning accuracy, force control response speed, and force control accuracy, meeting the requirements for higher precision rotary positioning and force control. The combination of the first drive motor 1704 and the voice coil motor 1703 improves motion flexibility, reduces the space occupied by the rotary alignment and pressing mechanism 17, and improves the mass of the moving parts, thereby improving force control accuracy. The dual reading head composed of the first rotary reading head 1720 and the second rotary reading head 1721 can obtain higher resolution accuracy after signal differential processing.

[0077] The rotary alignment and pressing mechanism 17 of this application is compatible with most bonding devices and bonding process requirements. It has high product adaptability and strong compatibility, and can meet the requirements for upgrading the bonding head without changing the main structure of the bonding equipment.

[0078] The conveying mechanism 16 and the rotary alignment and pressing mechanism 17 of this application are combined to achieve dual Z-axis motion. That is, both the conveying mechanism 16 and the rotary alignment and pressing mechanism 17 can achieve movement in the first linear direction. The downward movement of the second slide 1608 is separated from the pressing down of the first adsorption member 1707 of the rotary alignment and pressing mechanism 17 when they are bonded. The macro Z-axis motion is achieved by the rapid descent of the second slide 1608 into position, and the micro pressing down of the first adsorption member 1707 of the rotary alignment and pressing mechanism 17 is used for precision force control. Precision force control and position control can be achieved simultaneously.

[0079] The conveying mechanism 16 and the rotary alignment and pressing mechanism 17 work together to realize the chip 22 picking, transferring, and placing workflow, meeting the functional requirements of general bonding equipment. The workflow of the conveying mechanism 16 and the rotary alignment and pressing mechanism 17 working together is as follows: Step 1: When the first slide 1604 is in the material picking position, the first adsorption member 1707 of the rotating alignment and pressing mechanism 17 picks up the chip 22. Then, compressed gas is introduced into the air flotation module 1605, and the first slide 1604 floats up. Immediately afterwards, the output end of the first linear driver 1603 drives the first slide 1604 to move to the bonding position.

[0080] Step Two: Stop supplying air to the air flotation module 1605 and shut down the first linear actuator 1603. Shutting down the first linear actuator 1603 eliminates the effects of electromagnetic interference and insufficient rigidity of the conveying mechanism 16, improving the motion accuracy of the second slide 1608 and the rotary alignment and pressing mechanism 17. Then, the first slide 1604 descends, energizing the electromagnetic adsorption module, fixing the first slide 1604 to the first seat 1602, preventing static vibration of the first slide 1604, and improving the alignment and placement accuracy of the chip 22. The electromagnetic adsorption module utilizes magnetic force to apply a preset load or force in the initial stage to achieve positioning, vibration reduction, contact retention, or precision control.

[0081] Step 3: The coaxial camera mechanism 18 measures and calculates the positional deviation between the chip 22 and the wafer. The first angle compensation of the chip 22 is performed by rotating the first adsorption member 1707 of the coaxial camera mechanism 18. The first offset compensation is performed by adjusting the position of the packaging board 23 by the stage 12 or other mechanisms.

[0082] Step 4: The second slide 1608 quickly descends to the pre-bonding plane.

[0083] Step 5: After the first micro offset sensor 1617 and the second micro offset sensor 1618 move again on the second slide 1608, a horizontal deviation is generated. The angle position of the chip 22 is compensated for a second time by rotating the first adsorption member 1707 of the coaxial camera mechanism 18. The position of the packaging plate 23 is adjusted by the stage 12 or other mechanisms to perform a second offset compensation.

[0084] The above working steps use two motion offset compensations. After the first basic offset compensation between chip 22 and wafer, a second compensation is added for the horizontal deviation generated after the second slide 1608 moves, which improves the alignment accuracy.

[0085] Step 6: The voice coil motor 1703 of the coaxial camera mechanism 18 slowly drives the first adsorption component 1707 to lower the chip 22 until the chip 22 is bonded to the wafer and reaches the bonding pressure, then holds it.

[0086] Step 7: The first adsorption component 1707 is lifted, and the second slide 1608 rises and resets, completing the bonding process.

[0087] like Figure 14As shown, in one embodiment, the platform 12 includes a first linkage drive module 121 with output ends movable along a second linear direction and a third linear direction, a first support base 122 mounted on the output end of the first linkage drive module 121, a first rotating base 123 rotatably mounted on the first support base 122, a leveling assembly 124 mounted on the first rotating base 123, and a micro-adjustment module 125 for supporting the encapsulation plate 23. The micro-adjustment module 125 is mounted on the leveling assembly 124. The second and third linear directions are mutually perpendicular horizontal directions, the first linear direction is a vertical direction, and the first, second, and third linear directions are mutually perpendicular. Specifically, the first linkage drive module 121 includes two linear motors with output ends whose movement directions are mutually perpendicular. Macro-motion adjustment is achieved using the first linkage drive module 121, and the output of the micro-motion adjustment module 125 can also be along the second and third linear directions to achieve micro-motion adjustment. In this way, the coupling alignment compensation method of macro-motion and micro-motion adjustment is achieved through the first linkage drive module 121 and the micro-motion adjustment module 125. The stage 12 separates macro-motion adjustment and micro-motion adjustment, which can more effectively achieve high-precision alignment, improve the operating accuracy and stability of the bonding equipment, and thus improve the bonding stability and quality.

[0088] Optionally, the stage 12 also includes a vacuum adsorption assembly and a base 126. The vacuum adsorption assembly and the first linkage drive module are mounted on the first linkage drive module 121. After the first support seat 122 achieves horizontal macro-motion adjustment through the first linkage drive module 121, it is fixed on the base 126 by vacuum adsorption of the vacuum adsorption assembly, eliminating static vibration generated when the first support seat 122 is stationary, and achieving high-precision alignment and bonding stability.

[0089] The first linkage drive module 121 includes a linear motor and an air flotation component. The linear motor drives the first support base 122 to move, and the air flotation component reduces friction, enabling wafer bonding position switching. After the first support base 122 moves into place, the air supply to the air flotation component is shut off. The linear motor and air flotation component achieve macro-motion position switching, ensuring a clean and dust-free movement process. The air flotation component uses nitrogen as an inert gas to effectively control the oxidation of the chip 22.

[0090] The micro-adjustment module 125 includes piezoelectric ceramics and a flexible hinge. The piezoelectric ceramics and flexible hinge effectively control alignment accuracy. The output end of the micro-adjustment module 125 is equipped with a packaging base, which supports the wafer and other packaging plates 23. The micro-adjustment module 125 can achieve position adjustment in a second and third linear direction to compensate for horizontal offset between the chip 22 and the wafer. The coupled movement of the first rotating seat 123 and the leveling component 124 enables the lifting and leveling functions of the packaging plate 23. The first rotating seat 123 and the leveling component 124 actively adjust the flatness error of the packaging base and compensate for the visual focal plane offset caused by the different thicknesses of the packaging plate 23. The first rotating seat 123 rotates via a driver to adjust the angular offset generated by the packaging plate 23, and the leveling component 124 uses a three-point adjustment principle to achieve leveling of the packaging plate 23.

[0091] Furthermore, the stage 12 utilizes the three-axis coupled motion of the first rotating seat 123, the leveling component 124, and the micro-adjustment module 125 to achieve both stage 12 leveling and wafer thickness compensation, as well as camera focusing. The air-bearing design of the stage 12 lowers the center of gravity and makes the overall motion more stable. The rotation shaft 1710 of the first rotating seat 123 also adopts an air-bearing method, and the rotation angle error is fixed by vacuum adsorption after being adjusted by the first rotating seat 123, thus improving the overall structural stability.

[0092] The leveling assembly 124 includes three coupled leveling lifting shafts, which can effectively achieve leveling of the stage 12 while completing the lifting motion, thus enabling coaxial camera focusing. By placing the three coupled leveling lifting shafts on the first rotating seat 123, the installation of a lifting seat that can be raised and lowered along the first straight line direction on the coaxial camera mechanism 18 can be eliminated, ensuring higher positional structural stability and less disturbance of the coaxial camera mechanism 18.

[0093] like Figure 15As shown, in one embodiment, the loading and expanding film mechanism 13 includes a second linkage drive module 131 with an output end movable along a second linear direction and a third linear direction, a second support base 132 mounted on the output end of the second linkage drive module 131, an expanding film base 133 rotatably mounted on the second support base 132, and a loading base 134 slidably mounted on the expanding film base 133. The loading base 134 is a receiving plate. The loading base 134 is used to fix and receive the wafer with the chip 22. The loading base 134 slides up and down to drive the wafer to rise and fall. Both the loading base 134 and the expanding film base 133 are annular. The expanding film base 133 is located in the area enclosed by the loading base 134. The loading base 134 and the expanding film base 133 together enclose an ejection groove 135. The ejection mechanism 14 is located in the ejection groove 135. The first linear direction, the second linear direction, and the third linear direction are perpendicular to each other. The second linkage drive module 131 includes two linear motors. The second and third linear directions are two mutually perpendicular horizontal directions, meaning that the outputs of the two linear motors move horizontally and are perpendicular to each other.

[0094] The loading stand 134 is equipped with a clamping module or fixture. When wafers with chips 22 need to be loaded and expanded, the wafer is placed on the loading stand 134 and the wafer ring is fixed in place. Driven by the first motor 136 and the pulley assembly, the loading stand 134 moves the wafer downwards towards the expansion stand 133, so that the expansion edge of the expansion stand 133 passively pushes the blue film on the wafer, thus expanding and tightening the blue film, flattening the chip 22 attached to the blue film. After the blue film expands, a gap appears between every two adjacent chips 22 on the blue film, and the interaction force between adjacent chips 22 disappears. At the same time, the expansion stand 133 is controlled to rotate around a vertical line to adjust the angle of the wafer. When the expansion stand 133 rotates, the second motor 137 and the pulley assembly are used to drive the expansion stand 133 to rotate. Subsequently, the second linkage drive module 131 drives the loading stand 134 and the expansion stand 133 to move horizontally to the flipping mechanism 15 for feeding. Finally, the ejector mechanism 14 ejects the chip 22 from the wafer for the flipping mechanism 15 to pick up.

[0095] The wafer loading and expansion mechanism 13 of this application can load and expand the wafer, and then transport each chip 22 on the wafer to the area below the coaxial camera mechanism 18. After the wafer is loaded, there may be an angular deviation. The coaxial camera mechanism 18 performs coarse alignment, and the wafer loading and expansion mechanism 13 corrects the angular deviation after coarse alignment. Finally, the wafer loading and expansion mechanism 13 transports each chip 22 to be picked up to the flipping mechanism 15, and completes the pre-pickup coarse correction through the loading alignment camera mechanism 21 above the wafer loading and expansion mechanism 13.

[0096] like Figure 16As shown, optionally, the ejection mechanism 14 includes a third base 141 mounted on the feeding and expanding film mechanism 13, a second linear driver 142 mounted on the third base 141, a needle holder 144 mounted on the output end of the second linear driver 142, a third linear driver 143 mounted on the output end of the second linear driver 142, and an ejector pin 145 mounted on the output end of the third linear driver 143. The needle holder 144 has a needle groove 146, and the ejector pin 145 is located within the needle groove 146 of the needle holder 144. The second linear driver 142 employs a lead screw guide module, and the output end of the second linear driver 142 moves up and down in the vertical direction. The third linear driver 143 employs a cylinder, and the output end of the third linear driver moves up and down in the vertical direction. When the wafer is expanded and the chip 22 needs to be ejected, the second linear driver 142 drives the third linear driver 143, the needle can 144 and the ejector pin 145 to rise into position. Then the third linear driver 143 drives the ejector pin 145 to rise relative to the needle can 144 to eject the single chip 22 on the blue film of the wafer, so that the subsequent flipping mechanism 15 can pick up the chip 22.

[0097] like Figure 17 As shown, the flipping mechanism 15 further includes a fourth base 152, a fourth linear actuator 153 mounted on the fourth base 152, a second drive motor 155 having a second rotating mover 154 and mounted on the output end of the fourth linear actuator 153, and a second suction member 156 mounted on the second rotating mover 154. The flipping part 151 is located on the second suction member 156, and the feeding and film expanding mechanism 13 is located on the moving path of the second suction member 156. The output end of the fourth linear actuator 153 moves up and down in the vertical direction. The rotation axis of the second rotating mover 154 of the second drive motor 155 is horizontally set. The second suction member 156 is a component such as a vacuum suction cup. After the second suction member 156 picks up the chip 22, the fourth linear actuator 153 lifts the chip 22, and then the second rotating mover 154 drives the chip 22 to flip 180 degrees, which facilitates the rotation alignment and pressing mechanism 17 to pick up the chip 22.

[0098] like Figures 3 to 4As shown, in one embodiment, the coaxial camera mechanism 18 includes a fifth base 183 mounted on a base 11, a third slide 184 slidably mounted on the fifth base 183, an optical path system 185 mounted on the third slide 184, and a first camera body 186 mounted on the optical path system 185. The first optical path 181 and the second optical path 182 are located on the optical path system 185, and the first camera body 186 is located between the first optical path 181 and the second optical path 182. The optical path system 185 includes a housing and optical components such as a reflector mounted on the housing. The first optical path 181 and the second optical path 182 are part of the optical path system 185, and are arranged vertically from top to bottom at intervals, with the first camera body 186 located between the first optical path 181 and the second optical path 182. The first camera body 186 can simultaneously identify the markings on the chip 22 and the packaging board 23 through the first optical path 181 and the second optical path 182. That is, the first camera body 186 can observe the markings on the chip 22 above and the markings on the packaging board 23 above at the same position through the first optical path 181 and the second optical path 182. In this way, the coaxial camera mechanism 18 can more accurately measure the actual offset between the chip 22 and the packaging board 23 without switching the position of the first camera body 186. This allows the coaxial camera mechanism 18 of this application to achieve close arrangement of the chips 22 during the bonding process while meeting reliable alignment accuracy, thereby increasing the effective bonding area on the packaging board 23 and reducing production costs.

[0099] Furthermore, one of the markings on chip 22 and package board 23 is a frustum, and the other is a ring. When chip 22 and package board 23 are bonded, the ring fits onto the frustum. Specifically, chip 22 in this application has two markings, mark1 and mark2. Package board 23 has two markings, mark3 and mark4. mark1 corresponds to mark3, and mark2 corresponds to mark4. When the coaxial camera identifies the offset between chip 22 and wafer, it needs to move at least two positions. When the coaxial camera mechanism 18 moves to the first detection position, it simultaneously identifies mark1 on chip 22 and mark3 on package board 23. When the coaxial camera mechanism 18 moves to the second detection position, it simultaneously identifies mark2 on chip 22 and mark4 on package board 23. Through the two detections by the coaxial camera mechanism 18 at the first and second detection positions, the horizontal positional deviation and the vertical angular deviation T between package board 23 and chip 22 can be calculated.

[0100] Furthermore, the bonding device also includes a calibration mechanism 19 mounted on the fifth housing 183. The calibration mechanism 19 has a first calibration section 191 adapted to the first optical path 181 and a second calibration section 192 adapted to the second optical path 182. The first calibration sections 191 are spaced apart from top to bottom, and the calibration mechanism 19 is used to correct the measurement errors of the first optical path 181 and the second optical path 182. Since the optical path system 185 inside the coaxial camera mechanism 18 is relatively complex, when temperature or vibration disturbances occur, the optical path system 185 may experience offset of the upper and lower optical axes, causing alignment errors between the chip 22 and the package board 23. The coaxial camera mechanism 18 can be moved to the calibration mechanism 19 and use the calibration mechanism 19 to perform coaxiality change calibration compensation. After the error measurement is completed, the error is corrected by the algorithm of the calibration bonding device, thereby reducing the alignment error, improving the recognition accuracy, and ensuring stable recognition accuracy.

[0101] like Figures 18 to 19 As shown, optionally, the bonding apparatus also includes a bonding inspection camera mechanism 20. After bonding is completed, the bonding inspection camera mechanism 20 is used to check whether the bonding is qualified. The bonding inspection camera mechanism 20 is movably mounted above the stage 12 to move closer to or further away from the stage 12. Specifically, the bonding inspection camera mechanism 20 is mounted on the base 11 via a fifth linear driver 205, such as a linear motor. The bonding inspection camera mechanism 20 moves horizontally relative to the stage 12, thereby moving closer to or further away from the stage 12. When the bonding inspection camera mechanism 20 moves closer to the stage 12 and above the stage 12, it inspects the bonded product. After inspection, the bonding inspection camera mechanism 20 moves away from the stage 12 to avoid interfering with the inspection performed by the coaxial camera mechanism 18.

[0102] Optionally, the bonding detection camera mechanism 20 includes a second camera body 201. Due to the opacity of the chip 22, an infrared transmission camera with an infrared wavelength greater than 1050nm is used in the second camera body 201 to identify the intermediate layer markings after bonding of the chip 22 and the package board 23. When identifying deviations after bonding, each alignment position of the chip 22 and the package board 23 contains at least two infrared transmission camera-identifiable marks; that is, the chip 22 has two marks, mark1 and mark2, and the package board 23 has two marks, mark3 and mark4. The bonding detection camera mechanism 20 needs to move at least two positions to identify the post-bonding offset between the chip 22 and the package board 23. When the bonding detection camera mechanism 20 moves to one of these positions, it can simultaneously identify mark1 and mark3. When it moves to the other position, it can simultaneously identify mark2 and mark4. Finally, the bonding detection camera mechanism 20 calculates the horizontal position deviation and rotational deviation T between the package board 23 and the chip 22 after bonding based on the recognition results.

[0103] Furthermore, the bonding inspection camera mechanism 20 includes a second camera body 201, a tube lens 202, an objective lens 203, and an infrared light source 204. The second camera body 201 is an infrared camera. In this application, the fifth linear driver 205 is mounted on the base 11 via the sixth mount 206. The fifth linear driver 205 switches the position of the bonding inspection camera mechanism 20, allowing it to switch between a working position and a standby position. When in the working position, the bonding inspection camera mechanism 20 identifies the bonding accuracy between the chip 22 and the package board 23. The infrared camera can measure the intermediate layer after bonding the chip 22 and the package board 23 through the surface of the chip 22. The bonding inspection camera mechanism 20 can measure the bonding error through online detection. When bonding errors occur, they can be effectively compensated by fine-tuning the stage 12 or other adjustment mechanisms, improving product yield and reducing resource waste.

[0104] like Figure 20 As shown, optionally, the bonding apparatus further includes a loading alignment camera mechanism 21 for detecting the loading of the chip 22. The loading alignment camera mechanism 21 is located above the loading and expanding film mechanism 13. The loading alignment camera mechanism 21 is used to identify the offset of the chip 22 on the loading and expanding film mechanism 13, and then to perform pre-pickup coarse correction through the loading and expanding film mechanism 13. The loading alignment camera mechanism 21 includes a third camera body 211 and a loading light source 212.

[0105] Embodiments of this application also provide a bonding method, based on the bonding apparatus of any of the above embodiments, the bonding method comprising the following steps: S10: Place the wafer with multiple chips 22 on the loading and film expansion mechanism 13, and place the packaging board 23 on the stage 12.

[0106] S11: The loading and expanding mechanism 13 expands and transports the chip 22 on the wafer. That is, the loading and expanding mechanism 13 transports the chip 22 to be transferred to the area below the loading and alignment camera mechanism 21.

[0107] S12: The flipping part 151 of the flipping mechanism 15 picks up and flips the chip 22 on the feeding and expanding film mechanism 13.

[0108] In process S12, the loading alignment camera mechanism 21 calculates the offset of the chip 22 on the loading expansion mechanism 13 by recognizing the outline of the chip 22 or specific marks on the chip 22. Then, the loading expansion mechanism 13 performs coarse alignment through the second linkage drive module 131. Immediately afterwards, the ejection mechanism 14 ejects the chip 22, which has completed coarse alignment, from the wafer on the loading expansion mechanism 13, and the flipping mechanism 15 picks up the chip 22. After picking up the chip 22, the flipping mechanism 15 checks whether there is a chip 22 on the flipping mechanism 15. If there is, it proceeds to the next step S13; otherwise, it returns to step S11. After returning to step S11, the flipping part 151 of the flipping mechanism 15 descends again and adsorbs the chip 22, then flips 180 degrees, waiting for the rotation alignment pressing mechanism 17 to pick up the chip 22.

[0109] S13: The conveying part 1601 of the conveying mechanism 16 drives the rotary alignment and pressing mechanism 17 to move to the picking position, and the pressing part 1706 of the rotary alignment and pressing mechanism 17 picks up the chip 22 on the flipping part 151.

[0110] During process S13, the conveying mechanism 16 drives the rotating alignment and pressing mechanism 17 to move and pick up the chip 22 on the flipping mechanism 15.

[0111] S14: The conveying part 1601 of the conveying mechanism 16 drives the rotary alignment and pressing mechanism 17 to move to the bonding position.

[0112] During process S14, the conveying mechanism 16 drives the chip 22 on the rotary alignment and pressing mechanism 17 to move to the chip 22 placement position. At this time, the rotary alignment and pressing mechanism 17 is located above the stage 12. Finally, the position of the packaging board 23 is adjusted by the macro motion of the stage 12.

[0113] S15: The coaxial camera mechanism 18 simultaneously identifies the markings on the chip 22 and the markings on the package board 23. The pressing part 1706 of the rotation alignment pressing mechanism 17 rotates around the first straight line direction according to the identification result of the coaxial camera mechanism 18 to adjust the angle of the chip 22 so that the markings on the chip 22 and the markings on the package board 23 are aligned.

[0114] In process S15, the coaxial camera mechanism 18 is focused by adjusting the leveling component 124 of the stage 12. Then, the third slide 184 of the coaxial camera mechanism 18 moves the first camera body 186 to the first detection position. The first camera body 186 simultaneously identifies the mark 1 on the upper chip 22 and the mark 3 on the lower packaging plate 23. Then, the third slide 184 moves the first camera body 186 to the second detection position, where it simultaneously identifies the mark 2 on the upper chip 22 and the mark 4 on the lower packaging plate 23. Using an algorithm based on the identified marks 1, 2, 3, and 4, the horizontal position deviation and angular offset of the chip 22 and the packaging plate 23 are calculated. Finally, the angular offset is compensated by the rotation alignment and pressing mechanism 17, and the horizontal position deviation is compensated by the micro-motion of the stage 12.

[0115] S16, the coaxial camera mechanism 18 moves to the correction mechanism 19 to correct the offset and ensure the coaxiality of the first optical path 181 and the second optical path 182.

[0116] S17: The pressing part 1706 of the rotary alignment and pressing mechanism 17 moves along the first linear direction to press the chip 22 onto the packaging plate 23 on the stage 12. At this time, the conveying mechanism 16 drives the chip 22 on the rotary alignment and pressing mechanism 17 to descend to the bonding position. Under the drive of the voice coil motor 1703 of the rotary alignment and pressing mechanism 17, the chip 22 is pressed onto the packaging plate 23. The voice coil motor 1703 achieves precise control of the downward pressure.

[0117] S18: The conveying mechanism 16 drives the rotating alignment and pressing mechanism 17 to lift and reset. Then proceed to step S19 or return to step S13, where the conveying mechanism 16 drives the rotating alignment and pressing mechanism 17 to pick up the chip 22 for the next time.

[0118] S19: The bonding inspection camera mechanism 20 moves above the stage 12 for inspection.

[0119] S20: The stage 12 adjusts the position of the bonded product so that the bonding inspection camera mechanism 20 can detect the mark 1 on the chip 22 and the mark 3 on the package board 23.

[0120] S21: The stage 12 adjusts the position of the bonded product so that the bonding inspection camera mechanism 20 can detect the mark 2 on the chip 22 and the mark 4 on the package board 23.

[0121] S22: The algorithm calculates the horizontal position deviation and angular offset between chip 22 and package board 23 using the identified mark1, mark2, mark3, and mark4, and calculates the horizontal deviation and angular offset between chip 22 and wafer after bonding.

[0122] The bonding method of this application has the following advantages: 1. It can realize the position switching, identification, coarse alignment, ejection, picking, flipping, receiving and transfer of chip 22. The alignment accuracy is improved by the coaxial camera mechanism 18, and the rotating alignment pressing mechanism 17 can accurately control the bonding force. After bonding, the bonding quality can be automatically detected, which can meet the automated production needs of chip 22 bonding.

[0123] 2. The macro-motion adjustment of the stage 12 is fixed by vacuum suction, which eliminates the vibration problem of the stage 12, improves the stability of the packaging board 23, and improves the recognition accuracy of the coaxial camera mechanism 18.

[0124] 3. When the coaxial camera mechanism 18 performs offset identification between the chip 22 and the wafer, it performs at least two position identifications, which can more accurately identify the positional and angular deviations between the chip 22 and the wafer.

[0125] 4. At the first detection position and the second detection position, the coaxial camera mechanism 18 can simultaneously identify the chip 22 and the package board 23 through the first optical path 181 and the second optical path 182, avoiding the positioning accuracy error caused by device jitter when they are separated, and improving the recognition and alignment accuracy.

[0126] 5. Before or after each recognition, the coaxiality of the coaxial camera mechanism 18 can be corrected by the calibration mechanism 19. This can effectively identify changes in coaxiality caused by environmental changes, thereby achieving effective accuracy compensation and improving alignment accuracy.

[0127] 6. After the chip 22 is bonded to the packaging board 23, the bonding inspection camera mechanism 20 is used to perform the bonding offset detection process. The bonding inspection camera mechanism 20 can realize online detection, reduce the risk of mass production offset, and improve the yield of bonded products.

[0128] 7. The descent of the rotary alignment and pressing mechanism 17 and the descent during chip bonding are driven by different drivers. The conveying mechanism 16 drives the rotary alignment and pressing mechanism 17 to descend rapidly for high-precision positioning. The voice coil motor 1703 of the rotary alignment and pressing mechanism 17 performs precision force control, which can effectively ensure high-precision force control on the basis of position accuracy.

[0129] 8. The stage 12 can achieve leveling and micro-motion conditions, and can achieve smaller alignment movement steps to meet higher system alignment accuracy.

[0130] The technical principles of this application have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this application and should not be construed as limiting the scope of protection of this application in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this application without inventive effort, and these embodiments will all fall within the scope of protection of this application.

Claims

1. A bonding device, characterized in that, include: Base (11); A stage (12) is used to support the encapsulation board (23); The feeding and film expansion mechanism (13) is used for feeding and expanding the chip (22); The ejection mechanism (14) is used to eject the chip (22) from the feeding and film expansion mechanism (13); The flipping mechanism (15) has a flipping part (151) for picking up and flipping the chip (22) on the feeding and spreading mechanism (13); The conveying mechanism (16) has a conveying section (1601) that moves between the flipping section (151) and the platform (12); A rotary alignment and pressing mechanism (17) is mounted on the conveying section (1601) to switch between a pick-up position located at the flipping section (151) and a bonding position located at the stage (12); the rotary alignment and pressing mechanism (17) includes a pressing section (1706) for picking up the chip (22) on the flipping section (151); the pressing section (1706) is rotatable about a first linear direction and slides along the first linear direction to press the chip (22) onto the packaging plate (23) on the stage (12); as well as The coaxial camera mechanism (18) has a first optical path (181) for identifying the chip (22) and a second optical path (182) for identifying the packaged board (23); the first optical path (181) and the second optical path (182) are located on the same optical axis; The feeding and expanding film mechanism (13), the ejection mechanism (14), the flipping mechanism (15), the conveying mechanism (16), and the coaxial camera mechanism (18) are all mounted on the base (11).

2. The bonding apparatus according to claim 1, characterized in that, The conveying mechanism (16) includes a first base (1602) mounted on the base (11), a first linear driver (1603) mounted on the first base (1602), a first slide (1604) mounted on the output end of the first linear driver (1603), and an air flotation module (1605); the first slide (1604) is slidably mounted on the first base (1602) through the air flotation module (1605), the conveying part (1601) is located on the first slide (1604), and the rotary alignment and pressing mechanism (17) is mounted on the first slide (1604).

3. The bonding apparatus according to claim 2, characterized in that, The conveying mechanism (16) also includes an electromagnetic adsorption module; when the electromagnetic adsorption module is powered on, the first slide (1604) can be adsorbed onto the first seat (1602) through the electromagnetic adsorption module.

4. The bonding apparatus according to claim 2, characterized in that, The conveying mechanism (16) further includes a first guide rail (1607) mounted on the first slide (1604), a second slide (1608) slidably mounted on the first guide rail (1607) along the first straight direction, and a gravity balancer (1609) connecting the first slide (1604) and the second slide (1608); the rotation alignment and pressing mechanism (17) is mounted on the second slide (1608).

5. The bonding apparatus according to any one of claims 1 to 4, characterized in that, The rotary alignment and pressing mechanism (17) includes a second base (1701) with a mounting groove (1702), a voice coil motor (1703) mounted in the mounting groove (1702), a first drive motor (1704) with a first rotating mover (1714) mounted in the mounting groove (1702), an air bearing (1705) mounted in the mounting groove (1702), a rotary shaft (1710) rotatably mounted in the mounting groove (1702) via the air bearing (1705) and connected to the first rotating mover (1714), and a first suction member (1707) mounted on the rotary shaft (1710); the first rotating mover (1714) is connected to the output end of the voice coil motor (1703), and the pressing part (1706) is located on the first suction member (1707).

6. The bonding apparatus according to any one of claims 1 to 4, characterized in that, The platform (12) includes a first linkage drive module (121) having an output end movable along a second linear direction and a third linear direction, a first support base (122) mounted on the output end of the first linkage drive module (121), a first rotating base (123) rotatably mounted on the first support base (122), a leveling component (124) mounted on the first rotating base (123), and a micro-adjustment module (125) for supporting the encapsulation plate (23); the micro-adjustment module (125) is mounted on the leveling component (124), and the first linear direction, the second linear direction and the third linear direction are perpendicular to each other.

7. The bonding apparatus according to any one of claims 1 to 4, characterized in that, The feeding and expanding film mechanism (13) includes a second linkage drive module (131) having an output end that can move along a second linear direction and a third linear direction, a second support base (132) mounted on the output end of the second linkage drive module (131), an expanding film base (133) rotatably mounted on the second support base (132), and a feeding base (134) slidably mounted on the expanding film base (133); a clamping gap is formed between the feeding base (134) and the expanding film base (133), and the feeding base (134) and the expanding film base (133) together enclose an ejection groove (135), and the ejection mechanism (14) is located in the ejection groove (135), wherein the first linear direction, the second linear direction and the third linear direction are perpendicular to each other.

8. The bonding apparatus according to any one of claims 1 to 4, characterized in that, The ejection mechanism (14) includes a third base (141) mounted on the feeding and film expanding mechanism (13), a second linear driver (142) mounted on the third base (141), a needle canister (144) mounted on the output end of the second linear driver (142), a third linear driver (143) mounted on the output end of the second linear driver (142), and an ejector pin (145) mounted on the output end of the third linear driver (143); the needle canister (144) has a needle groove (146), and the ejector pin (145) is located in the needle groove (146) of the needle canister (144).

9. The bonding apparatus according to any one of claims 1 to 4, characterized in that, The flipping mechanism (15) includes a fourth seat (152), a fourth linear actuator (153) mounted on the fourth seat (152), a second drive motor (155) having a second rotating mover (154) and mounted on the output end of the fourth linear actuator (153), and a second adsorption member (156) mounted on the second rotating mover (154); the flipping part (151) is located on the second adsorption member (156), and the feeding and film expansion mechanism (13) is located on the moving path of the second adsorption member (156).

10. The bonding apparatus according to any one of claims 1 to 4, characterized in that, The coaxial camera mechanism (18) includes a fifth seat (183) disposed on the base (11), a third slide (184) slidably mounted on the fifth seat (183), an optical path system (185) mounted on the third slide (184), and a first camera body (186) disposed on the optical path system (185); the first optical path (181) and the second optical path (182) are located on the optical path system (185), and the first camera body (186) is located between the first optical path (181) and the second optical path (182).

11. The bonding apparatus according to claim 10, characterized in that, It also includes a correction mechanism (19) mounted on the fifth seat (183); the correction mechanism (19) has a first correction part (191) adapted to the first optical path (181) and a second correction part (192) adapted to the second optical path (182).

12. The bonding apparatus according to any one of claims 1 to 4, characterized in that, It also includes a bonding inspection camera mechanism (20) and / or a loading alignment camera mechanism (21) for loading the chip (22); the loading alignment camera mechanism (21) is located above the loading film expansion mechanism (13); the bonding inspection camera mechanism (20) is movably mounted above the stage (12) to be close to or away from the stage (12).

13. A bonding method, based on the bonding apparatus according to any one of claims 1 to 12, characterized in that, Includes the following steps: A wafer with multiple chips (22) is placed in the loading and film spreading mechanism (13), and a packaging board (23) is placed on the stage (12); The loading and film expansion mechanism (13) expands and transports the chip (22) on the wafer; The flipping part (151) of the flipping mechanism (15) picks up and flips the chip (22) on the feeding and expanding film mechanism (13); The conveying part (1601) of the conveying mechanism (16) drives the rotary alignment and pressing mechanism (17) to move to the picking position, and the pressing part (1706) of the rotary alignment and pressing mechanism (17) picks up the chip (22) on the flipping part (151); The conveying part (1601) of the conveying mechanism (16) drives the rotary alignment and pressing mechanism (17) to move to the bonding position; The coaxial camera mechanism (18) simultaneously identifies the markings on the chip (22) and the markings on the packaging board (23). The pressing part (1706) of the rotating alignment pressing mechanism (17) rotates around the first straight line direction according to the identification result of the coaxial camera mechanism (18) to adjust the angle of the chip (22) so that the markings on the chip (22) and the markings on the packaging board (23) are aligned. The pressing part (1706) of the rotary alignment pressing mechanism (17) moves along a first linear direction to press the chip (22) onto the packaging plate (23) on the stage (12).

Images