Wafer temporary storage device and semiconductor apparatus

Abstract

This invention provides a wafer storage device and semiconductor equipment. The temperature control unit includes a cooling module and a preheating module, which are thermally connected to the wafer carrier plate through a thermally conductive structure. In the preheating mode, the preheating module heats the wafer carrier plate to a first preset temperature. Due to the increased temperature of the wafer carrier plate, the high-temperature wafer will not break due to a sudden temperature drop after entering the wafer storage device. After the wafer is placed on the wafer carrier plate, it is still at a relatively high temperature. Under the influence of the supporting force of the wafer carrier plate and its own gravity, the warpage of the wafer will be corrected to a certain extent. Before certain process steps, the preheating module can preheat the wafer in advance, thereby reducing the heating time of the process cavity and improving the efficiency of subsequent processes. In the cooling mode, the preheating module and the cooling module work simultaneously to linearly cool the wafer carrier plate to a second preset temperature, which can avoid sudden temperature changes of the wafer and reduce the probability of wafer breakage during cooling.

Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment technology, and more particularly to a wafer temporary storage device and semiconductor equipment. Background Technology

[0002] In semiconductor manufacturing, some processes (such as chemical vapor deposition and resist removal) require heating the wafer to high temperatures. However, the processed wafers cannot be directly stored in wafer cassettes due to their excessively high temperature. Therefore, a separate chamber is needed to store and cool the high-temperature wafers to improve processing efficiency.

[0003] Currently, the wafer storage cavity is equipped with layers of aluminum plates. When the wafer is placed on the aluminum plates, the heat on the wafer surface is transferred through the layers of aluminum plates to the bottom of the wafer storage cavity, where it is carried away by the circulating cooling water located at the bottom of the wafer storage cavity.

[0004] The cooling rate depends primarily on the inherent thermal conductivity of each component, the contact area, and the temperature of the cooling water. However, wafers of different materials and thicknesses can withstand different cooling rates. If the cooling rate is too high, it will cause uneven heating and cooling in certain areas of the wafer, leading to wafer breakage. If the cooling rate is too low, it will severely affect the wafer processing efficiency.

[0005] In existing technologies, many wafers are transported using electrostatic chucks. However, the chuck adheres to the center of the wafer's lower surface, leaving the edges unsupported. When the wafer is at high temperatures, it is prone to deformation. During the chuck's hold, the wafer's edges tend to warp downwards. As the wafer enters the wafer storage cavity and afterward, the sudden drop in temperature poses a risk of fragmentation. Furthermore, the wafer's hardness increases with cooling, making it susceptible to retaining its warped shape. Once the wafer has completely cooled, the warping significantly increases the likelihood of chuck failure.

[0006] Therefore, it is necessary to provide a new type of wafer temporary storage device and semiconductor equipment to solve the above-mentioned problems existing in the prior art. Summary of the Invention

[0007] The purpose of this invention is to provide a wafer storage device and semiconductor equipment that reduces the probability of fragmentation and the degree of wafer warping.

[0008] To achieve the above objectives, the wafer temporary storage device of the present invention includes: The temperature control unit includes a cooling module and a preheating module, which are thermally connected to the wafer carrier plate through a thermally conductive structure. In the preheating mode, the preheating module heats the wafer carrier to a first preset temperature; In cooling mode, the preheating module and the cooling module work simultaneously to linearly cool the wafer carrier to a second preset temperature.

[0009] Optionally, the number of wafer carriers is n, and the wafer temporary storage device further includes n heat insulation plates corresponding one-to-one with the n wafer carriers. The heat insulation plates are disposed on the underside of the wafer carriers, where n is a natural number greater than or equal to 1.

[0010] Optionally, the wafer temporary storage device further includes a cavity, a mounting body, and a temperature detection device. The mounting body is disposed on the cavity wall of the cavity. The cooling module, the preheating module, and the temperature detection device are all at least partially disposed within the mounting body, and the temperature detection device is connected to the heat-conducting structure.

[0011] Optionally, the surface of the heat-conducting structure that contacts the mounting body is provided with a first preheating module receiving hole and a first temperature detection element receiving hole, wherein a portion of the preheating module is disposed in the first preheating module receiving hole and a portion of the temperature detection element is disposed in the first temperature detection element receiving hole.

[0012] Optionally, the temperature control unit further includes a kit made of thermally conductive metal. The surface of the mounting body that contacts the thermally conductive structure has a kit receiving hole extending into the interior of the mounting body. The kit is disposed within the kit receiving hole and contacts the thermally conductive structure. The surface of the kit that contacts the thermally conductive structure has a second preheating module receiving hole and a second temperature sensing element receiving hole. A portion of the preheating module is disposed within the second preheating module receiving hole, and a portion of the temperature sensing element is disposed within the second temperature sensing element receiving hole.

[0013] Optionally, the kit includes a kit head and a kit tail that are fixedly connected, the kit head being in contact with the heat-conducting structure, and the cross-sectional area of ​​the kit head being larger than that of the kit tail.

[0014] Optionally, the second preheating module receiving hole penetrates through the kit head and extends to the kit tail.

[0015] Optionally, the mounting body has a third temperature sensing element receiving hole that penetrates the mounting body, and a portion of the temperature sensing element is disposed in the third temperature sensing element receiving hole and extends outside the third temperature sensing element receiving hole.

[0016] Optionally, the preheating module includes several heating sections and several heat insulation sections, with the heat insulation sections disposed between adjacent heating sections, and the heating sections independently controlling the heating temperature.

[0017] Optionally, the cooling module includes an inlet pipe, an outlet pipe, and a first temperature-conducting pipe. The inlet pipe and the outlet pipe are disposed on the lower side of the mounting body. One end of the inlet pipe passes through the mounting body and communicates with one end of the first temperature-conducting pipe. The other end of the inlet pipe is used to receive the cooling medium. One end of the outlet pipe passes through the mounting body and communicates with the other end of the first temperature-conducting pipe. The other end of the outlet pipe is used to discharge the cooling medium. The first temperature-conducting pipe is disposed inside the kit head and the kit tail.

[0018] Optionally, the cooling module further includes a second temperature-conducting pipe, which is disposed within the heat-conducting structure, and its two ends are respectively connected to two different locations of the first temperature-conducting pipe.

[0019] Optionally, the temperature control unit further includes a protection unit disposed on the surface of the mounting body exposed outside the cavity, for isolating temperature.

[0020] The present invention also provides a semiconductor device, including the aforementioned wafer storage device.

[0021] The beneficial effects of the present invention are as follows: Firstly, in the preheating working mode, the preheating module raises the temperature of the wafer carrier to a first preset temperature. As the temperature of the wafer carrier increases, the high-temperature wafer will not break due to a sudden drop in temperature after entering the wafer temporary storage device. Secondly, after the wafer is placed on the wafer carrier plate, the wafer is still at a high temperature. Under the influence of the supporting force of the wafer carrier plate and its own weight, the warpage of the wafer will be corrected to a certain extent, reducing the probability that the electrostatic chuck will fail to adsorb the wafer after it cools down due to excessive warpage. Thirdly, before certain process steps, the preheating module can preheat the wafer in advance, thereby reducing the heating time of the process cavity and improving the efficiency of subsequent processes. Fourthly, in the cooling mode, the preheating module and the cooling module work simultaneously to linearly cool the wafer carrier to the second preset temperature, which can avoid sudden temperature changes in the wafer and reduce the probability of wafer fragmentation during cooling. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of the wafer temporary storage device in some embodiments of the present invention; Figure 2 This is a schematic diagram of the structure of the wafer carrier in some embodiments of the present invention; Figure 3 This is a schematic diagram of a wafer carrier plate carrying a wafer in some embodiments of the present invention.

[0023] Explanation of reference numerals in the attached figures: 10. Cavity wall; 11. Cavity body; 12. Mounting port; 20. Wafer; 21. Wafer carrier plate; 211. Robotic arm pick-up port; 22. Heat insulation plate; 30. Temperature control unit; 31. Mounting body; 32. Preheating module; 33. Cooling module; 331. Inlet pipe; 332. Outlet pipe; 34. Temperature detection element; 35. Kit; 351. Kit head; 352. Kit tail; 40. Thermal conductive structure; 50. Protection unit. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without inventive effort are within the scope of protection of this invention. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, but do not exclude other elements or objects.

[0025] To address the problems existing in the prior art, embodiments of the present invention provide a wafer temporary storage device applied to semiconductor equipment. (Refer to...) Figure 1 The wafer temporary storage device includes a temperature control unit 30, which comprises a cooling module 33 and a preheating module 32, both of which are thermally connected to the wafer carrier plate 21 via a thermally conductive structure 40. In the preheating mode, the preheating module 32 raises the temperature of the wafer carrier plate 21 to a first preset temperature; in the cooling mode, the preheating module 32 and the cooling module 33 operate simultaneously, linearly cooling the wafer carrier plate 21 to a second preset temperature.

[0026] In this application, during the preheating mode, the preheating module 32 raises the temperature of the wafer carrier plate 21 to a first preset temperature. Because of this temperature increase, the high-temperature wafer, upon entering the wafer storage device, will not break due to a sudden temperature drop. Furthermore, after the wafer is placed on the wafer carrier plate 21, it is still at a relatively high temperature. Under the support of the wafer carrier plate 21 and its own weight, the wafer's warpage is somewhat corrected, reducing the probability of electrostatic chuck failure due to excessive warpage after cooling. Before certain process steps, the preheating module 32 can preheat the wafer in advance, thereby reducing the heating time of the process cavity and improving the efficiency of subsequent processes. During the cooling mode, the preheating module 32 and the cooling module 33 work simultaneously, linearly cooling the wafer carrier plate 21 to a second preset temperature. This avoids sudden temperature changes in the wafer and reduces the probability of wafer breakage during cooling.

[0027] In some embodiments of the present invention, the first preset temperature is 120°C to 150°C. For example, the first preset temperature may be 120°C, 125°C, 130°C, 135°C, 140°C, 145°C or 150°C, or any value between any two of the aforementioned temperatures.

[0028] In some embodiments of the present invention, the second preset temperature is 25°C to 29°C. For example, the second preset temperature may be 25°C, 26°C, 27°C, 28°C, or 29°C, or any value between any two of the aforementioned temperatures.

[0029] In some embodiments of the present invention, the cooling rate of linear cooling can be 1℃ / min, 2℃ / min, 3℃ / min, 4℃ / min, 5℃ / min, 10℃ / min, etc., which can be selected according to the initial temperature of the wafer when it enters the wafer temporary storage device.

[0030] In some embodiments of the present invention, reference is made to Figure 1 The number of wafer carrier plates 21 is n. The wafer temporary storage device also includes n heat insulation plates 22 corresponding one-to-one with the n wafer carrier plates 21. The heat insulation plates 22 are disposed on the underside of the wafer carrier plates 21, where n is a natural number greater than or equal to 1. The heat insulation plates 22, disposed on the underside of the corresponding wafer carrier plates 21, can isolate heat radiation between adjacent wafer carrier plates 21, avoid mutual interference between high-temperature wafers, thereby improving cooling efficiency and allowing for better control of cooling efficiency.

[0031] In some embodiments of the present invention, reference is made to Figure 1The wafer temporary storage device further includes a cavity 11, a mounting body 31, and a temperature sensing element 34. The mounting body 31 is disposed on the cavity wall 10 of the cavity 11. Specifically, a mounting port 12 is provided on the lower side of the cavity 11, and the mounting body 31 is disposed within the mounting port 12. The cooling module 33, the preheating module 32, and the temperature sensing element 34 are all at least partially disposed within the mounting body 31, and the temperature sensing element 34 is connected to the heat-conducting structure 40. By placing the mounting body 31 inside the mounting port 12, the preheating module 32, cooling module 33, and temperature detection element 34 can be integrated into a single unit. The structure is compact and reasonable, significantly saving internal space in the cavity 11 and meeting the miniaturization and integration requirements of semiconductor equipment. Each functional module is at least partially embedded inside the mounting body 31, which can form a protective shield for the module structure, reducing the erosion and contamination of the devices by process airflow and dust particles inside the cavity 11, and improving the operational stability and service life of the preheating, cooling, and temperature detection components. The temperature detection element 34 is directly connected to the heat conduction structure 40, which can collect temperature data of the heat conduction structure 40 and the surrounding area in real time and accurately. It has a fast temperature response speed and small detection error, which makes it easy for the equipment to accurately adjust the working status of the preheating module 32 and cooling module 33 based on real-time temperature parameters. The overall assembly structure is neat and the modules are easy to disassemble and maintain. The preheating module 32, cooling module 33, and temperature detection element 34 can be inspected and replaced without disassembling the main body of the cavity 11, effectively reducing the later maintenance cost and downtime for maintenance.

[0032] In some embodiments of the present invention, reference is made to Figure 1 , Figure 2 and Figure 3 The wafer carrier plate 21 is used to carry the wafer 20. The wafer carrier plate 21 is in the form of a plate. The wafer carrier plate 21 has a robotic arm pick-up port 211 for adapting to the robotic arm. The shape of the robotic arm pick-up port 211 is determined by the robotic arm used and is not specifically limited here.

[0033] In some embodiments of the present invention, the wafer carrier plate is made of materials including silver, copper, aluminum, graphene, alumina, beryllium oxide, silicon carbide, etc. Specifically, the wafer carrier plate is made of aluminum 6061-T6, which has high thermal conductivity and low cost.

[0034] In some embodiments of the present invention, the material of the heat insulation board is aluminum foil, gold foil, Low-E glass layer material, multi-layer heat insulation material, glass wool, etc.

[0035] In some embodiments of the present invention, reference is made to Figure 1The surface of the heat-conducting structure 40 that contacts the mounting body 31 is provided with a first preheating module receiving hole (not shown in the figure) and a first temperature detection element receiving hole (not shown in the figure). A portion of the preheating module 32 is disposed in the first preheating module receiving hole, and a portion of the temperature detection element 34 is disposed in the first temperature detection element receiving hole.

[0036] In some embodiments of the present invention, a first preheating module receiving hole is provided on the surface of the heat-conducting structure 40 that contacts the mounting body 31. A portion of the preheating module 32 is disposed within the first preheating module receiving hole, which increases the contact area between the preheating module 32 and the heat-conducting structure 40. This facilitates the preheating module 32 transferring more heat to the heat-conducting structure 40, allowing the heat from the preheating module 32 to be transferred through the heat-conducting structure 40 to a plurality of wafer carrier plates 21. The heat is then dissipated through the wafer carrier plates 21 into the cavity 11, thereby preheating the cavity 11 and preventing excessive heat from the preheating module 32 from being wasted.

[0037] In some embodiments of the present invention, a first temperature sensing element receiving hole is provided on the surface of the heat-conducting structure 40 that contacts the mounting body 31, and a portion of the temperature sensing element 34 is disposed in the first temperature sensing element receiving hole, which can increase the contact area between the temperature sensing element 34 and the heat-conducting structure 40, making it easier for the temperature sensing element 34 to obtain the temperature of the heat-conducting structure 40 from more positions, thereby improving the accuracy of the temperature sensing element 34 in detecting the temperature of the heat-conducting structure 40.

[0038] In some embodiments of the present invention, the material of the thermally conductive structure includes silver, copper, aluminum, graphene, alumina, beryllium oxide, silicon carbide, etc. Specifically, the material of the thermally conductive structure is aluminum 6061-T6, which has high thermal conductivity and low cost.

[0039] In some embodiments of the present invention, reference is made to Figure 1 The temperature control unit 30 also includes a kit 35, which is made of thermally conductive metal. The surface of the mounting body 31 that contacts the thermally conductive structure 40 has a kit receiving hole extending into the interior of the mounting body 31. The kit is disposed in the kit receiving hole and the kit 35 contacts the thermally conductive structure 40. The surface of the kit 35 that contacts the thermally conductive structure 40 has a second preheating module receiving hole and a second temperature sensing element receiving hole. A portion of the preheating module 32 is disposed in the second preheating module receiving hole, and a portion of the temperature sensing element 34 is disposed in the second temperature sensing element receiving hole.

[0040] In some embodiments of the present invention, a portion of the preheating module 32 is disposed within the second preheating module receiving hole, and the second preheating module receiving hole is formed on the kit 35. Combined with the fact that the material of the kit 35 is a thermally conductive metal, the temperature of the preheating module 32 can be transferred to the thermally conductive structure 40 through the kit 35, which is equivalent to indirectly increasing the contact area between the thermally conductive structure 40 and the preheating module 32, without occupying more space of the thermally conductive structure 40.

[0041] In some embodiments of the present invention, a portion of the temperature sensing element 34 is disposed within the second temperature sensing element receiving hole, and the second temperature sensing element receiving hole is formed on the kit 35. Combined with the fact that the material of the kit 35 is a thermally conductive metal, the temperature of the thermally conductive structure 40 can be conducted to the temperature sensing element 34 through the kit 35, thereby improving the accuracy of the temperature sensing element 34 in detecting the temperature of the thermally conductive structure 40.

[0042] In some embodiments of the present invention, the materials of the kit include silver, copper, aluminum, graphene, alumina, beryllium oxide, silicon carbide, etc. Specifically, the kit is made of aluminum 6061-T6, which has high thermal conductivity and low cost.

[0043] In some embodiments of the present invention, the preheating module is a heating rod with a diameter of 10 cm and a power of 400~600W, which can raise the temperature inside the cavity to 120℃~150℃. The first preheating module receiving hole and the second preheating module receiving hole are both cylindrical, and the diameters of the first preheating module receiving hole and the second preheating module receiving hole are slightly larger than the heating rod, ensuring that the first preheating module receiving hole and the second preheating module receiving hole can accommodate the heating rod and prevent the heating rod from shaking.

[0044] In some embodiments of the present invention, the preheating module is a heating wire, and the first preheating module receiving hole extends into the interior of the heat-conducting structure and has several branches for receiving the heating wire.

[0045] In some embodiments of the present invention, reference is made to Figure 1 The kit 35 includes a kit head 351 and a kit tail 352 that are fixedly connected. The kit head 351 is in contact with the heat-conducting structure 40, and the cross-sectional area of ​​the kit head 351 is larger than the cross-sectional area of ​​the kit tail 352.

[0046] In some embodiments of the present invention, the cross-sectional area of ​​the kit head 351 is larger than the cross-sectional area of ​​the kit tail 352, which increases the contact area between the kit 35 and the heat-conducting structure 40, facilitating the transfer of temperature within the heat-conducting structure 40 to the kit 35.

[0047] In some embodiments of the present invention, reference is made to Figure 1 Both the kit head 351 and the kit tail 352 are cylindrical, and one bottom surface of the kit tail 352 is in contact with another bottom surface of the kit tail 352. The axis of symmetry of the kit head 351 and the axis of symmetry of the kit tail 352 are on the same straight line.

[0048] In some embodiments of the present invention, the second preheating module receiving hole penetrates through the kit head 351 and extends to the kit tail 352.

[0049] In some embodiments of the present invention, a third temperature sensing element receiving hole is provided in the mounting body 31, which penetrates the mounting body 31, and a portion of the temperature sensing element 34 is disposed in the third temperature sensing element receiving hole and extends outside the third temperature sensing element receiving hole.

[0050] In some embodiments of the present invention, the temperature sensing element 34 extends outside the third temperature sensing element receiving hole, without requiring the kit 35 to extend outside the mounting body 31, thus avoiding the temperature of the heat-conducting structure 40 from being transferred to the outside of the cavity 11 through the kit 35, and also avoiding the transfer of ambient temperature to the cavity 11.

[0051] In some embodiments of the present invention, the preheating module includes a plurality of heating sections and a plurality of heat insulation sections, wherein the heat insulation sections are disposed between adjacent heating sections, and the heating sections independently control their heating temperatures. The plurality of heating sections may be independently controlled heating rods.

[0052] In some embodiments of the present invention, the heating elements independently control their heating temperatures, enabling overall temperature regulation of the preheating module to meet a wider range of temperature requirements. The closer the component is to the heat-conducting structure, the easier it is for the temperature to be transferred to the structure; conversely, the farther away the component is from the heat-conducting structure, the more difficult it is for the temperature to be transferred. Independent temperature control of each heating element allows the preheating module to achieve stepped heating of the component; that is, the heating temperature is lower for components closer to the heat-conducting structure and higher for components farther away, making it easier for the temperature on the component to be transferred to the heat-conducting structure. Furthermore, the heat insulation portion is positioned between adjacent heating elements to prevent temperature interference between them, ensuring that the temperature of the heating elements is transferred to the sleeve as much as possible, rather than being transferred between the heating elements themselves.

[0053] In some embodiments of the present invention, reference is made to Figure 1The cooling module 33 includes an inlet pipe 331, an outlet pipe 332, and a first temperature-conducting pipe (not shown in the figure). The inlet pipe 331 and the outlet pipe 332 are disposed on the lower side of the mounting body 31. One end of the inlet pipe 331 passes through the mounting body 31 and communicates with one end of the first temperature-conducting pipe. The other end of the inlet pipe 331 is used to receive the cooling medium. One end of the outlet pipe 332 passes through the mounting body 31 and communicates with the other end of the first temperature-conducting pipe. The other end of the outlet pipe 332 is used to discharge the cooling medium. The first temperature-conducting pipe is disposed in the kit head 351 and the kit tail 352. The flow of the cooling medium allows heat in the kit 35 to be transferred to the cooling medium, allowing the heat on the kit 35 to be quickly transferred out, thereby cooling the kit 35. Subsequently, the heat on the wafer is transferred sequentially through the wafer carrier plate 21 and the thermally conductive structure 40 to the kit 35, thereby achieving the cooling of the wafer.

[0054] In some embodiments of the present invention, the cooling medium includes water, ionic liquid, coolant, heat transfer oil, nanofluid, etc.

[0055] In some embodiments of the present invention, the cooling module further includes a refrigeration system disposed outside the cavity. The refrigeration system may be a chiller, wherein the outlet of the chiller is connected to the other end of the inlet pipe, and the inlet of the chiller is connected to the other end of the outlet pipe.

[0056] In some embodiments of the present invention, reference is made to Figure 1 The cooling module 33 further includes a second temperature-conducting pipe (not shown in the figure), which is disposed within the heat-conducting structure 40, and its two ends are respectively connected to two different positions of the first temperature-conducting pipe.

[0057] In some embodiments of the present invention, the second temperature-conducting tube is disposed within the heat-conducting structure, and the two ends of the second temperature-conducting tube are respectively connected to two different positions of the first temperature-conducting tube, so that the temperature within the heat-conducting structure is quickly transferred to the cooling medium within the second temperature-conducting tube, thereby rapidly reducing the temperature of the heat-conducting structure and improving cooling efficiency.

[0058] In some embodiments of the present invention, the first temperature-conducting tube includes a plurality of first thin tubes, the total cross-sectional area of ​​the plurality of first thin tubes is equal to the cross-sectional area of ​​the water inlet pipe, one end of the plurality of first thin tubes is connected to one end of the water inlet pipe, and the other end of the plurality of first thin tubes is connected to one end of the water outlet pipe.

[0059] In some embodiments of the present invention, the first temperature-conducting tube includes a plurality of second thin tubes, the total cross-sectional area of ​​the second thin tubes is equal to the cross-sectional area of ​​the water inlet pipe, one end of the plurality of second thin tubes is connected to one end of the water inlet pipe, and the other end of the plurality of second thin tubes is connected to one end of the water outlet pipe.

[0060] In some embodiments of the present invention, the cross-section of the first thin tube is perpendicular to the axis of the first thin tube, the cross-section of the second thin tube is perpendicular to the axis of the second thin tube, and the cross-section of the water inlet pipe is perpendicular to the axis of the water inlet pipe.

[0061] In some embodiments of the present invention, reference is made to Figure 1 The temperature control unit 30 also includes a protection unit 50, which is disposed on the surface of the mounting body 31 exposed outside the cavity 11. The protection unit 50 is used to isolate the temperature, avoid the heat source, prevent the temperature inside the cavity 11 from overflowing, and protect the safety of the operator.

[0062] In some embodiments of the present invention, the protective unit is in the form of a thin film, covering the surface of the mounting body exposed outside the cavity. The protective unit is made of materials such as aluminum foil, gold foil, Low-E glass layer material, multi-layer thermal insulation material, or glass wool.

[0063] The present invention also provides a semiconductor device, including the aforementioned wafer storage device.

[0064] In some embodiments of the present invention, the semiconductor device includes, but is not limited to, a chemical vapor deposition apparatus having the wafer storage device and a resist removal apparatus having the wafer storage device.

[0065] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape, and proportions of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise changed, and the nature or number or position of discrete elements may be altered or changed. Therefore, all such modifications are intended to be included within the scope of the invention. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the specification, any term “device plus function” is intended to cover the structure described herein that performs the function, and not only structurally equivalent but also equivalent in structure. Other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments without departing from the scope of the invention.

[0066] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the best mode of carrying out the invention as currently considered, or those features that are not relevant to implementing the invention) may be omitted.

[0067] It should be understood that numerous specific implementation decisions can be made during the development of any practical implementation, such as in any engineering or design project. Such development efforts may be complex and time-consuming, but for those skilled in the art who benefit from this disclosure, the development effort will be a routine work of design, manufacturing, and production without requiring much experimentation.

[0068] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A wafer temporary storage device, characterized in that, include: The temperature control unit includes a cooling module and a preheating module, which are thermally connected to the wafer carrier through a thermally conductive structure. In the preheating mode, the preheating module heats the wafer carrier to a first preset temperature; In cooling mode, the preheating module and the cooling module work simultaneously to linearly cool the wafer carrier to a second preset temperature.

2. The wafer temporary storage device according to claim 1, characterized in that, The number of wafer carriers is n, and the wafer temporary storage device also includes n heat insulation plates corresponding one-to-one with the n wafer carriers. The heat insulation plates are disposed on the underside of the wafer carriers, where n is a natural number greater than or equal to 1.

3. The wafer temporary storage device according to claim 1, characterized in that, The wafer temporary storage device further includes a cavity, a mounting body, and a temperature detection device. The mounting body is disposed on the cavity wall of the cavity. The cooling module, the preheating module, and the temperature detection device are all at least partially disposed within the mounting body, and the temperature detection device is connected to the heat-conducting structure.

4. The wafer temporary storage device according to claim 3, characterized in that, The surface of the heat-conducting structure that contacts the mounting body has a first preheating module receiving hole and a first temperature detection element receiving hole. A portion of the preheating module is disposed in the first preheating module receiving hole, and a portion of the temperature detection element is disposed in the first temperature detection element receiving hole.

5. The wafer temporary storage device according to claim 4, characterized in that, The wafer temporary storage device also includes a kit made of thermally conductive metal. The surface of the mounting body that contacts the thermally conductive structure has a kit receiving hole extending into the interior of the mounting body. The kit is disposed in the kit receiving hole and is in contact with the thermally conductive structure. The surface of the kit that contacts the thermally conductive structure has a second preheating module receiving hole and a second temperature sensing element receiving hole. A portion of the preheating module is disposed in the second preheating module receiving hole, and a portion of the temperature sensing element is disposed in the second temperature sensing element receiving hole.

6. The wafer temporary storage device according to claim 5, characterized in that, The kit includes a kit head and a kit tail that are fixedly connected. The kit head is in contact with the heat-conducting structure, and the cross-sectional area of ​​the kit head is larger than that of the kit tail.

7. The wafer temporary storage device according to claim 6, characterized in that, The second preheating module receiving hole penetrates through the kit head and extends to the kit tail.

8. The wafer temporary storage device according to claim 6, characterized in that, The mounting body has a third temperature sensing element receiving hole that penetrates the mounting body, and a portion of the temperature sensing element is disposed in the third temperature sensing element receiving hole and extends outside the third temperature sensing element receiving hole.

9. The wafer temporary storage device according to any one of claims 6 to 8, characterized in that, The preheating module includes several heating sections and several heat insulation sections. The heat insulation sections are disposed between adjacent heating sections, and the heating sections independently control the heating temperature.

10. The wafer temporary storage device according to claim 6, characterized in that, The cooling module includes an inlet pipe, an outlet pipe, and a first temperature-conducting pipe. The inlet pipe and the outlet pipe are disposed on the lower side of the mounting body. One end of the inlet pipe passes through the mounting body and communicates with one end of the first temperature-conducting pipe. The other end of the inlet pipe is used to receive the cooling medium. One end of the outlet pipe passes through the mounting body and communicates with the other end of the first temperature-conducting pipe. The other end of the outlet pipe is used to discharge the cooling medium. The first temperature-conducting pipe is disposed inside the kit head and the kit tail.

11. The wafer temporary storage device according to claim 10, characterized in that, The cooling module also includes a second temperature-conducting pipe, which is disposed within the heat-conducting structure, and its two ends are respectively connected to two different positions of the first temperature-conducting pipe.

12. A semiconductor device, characterized in that, Includes the wafer temporary storage device as described in any one of claims 1 to 11.

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