Apparatus and method for thin film bonding of semiconductor packages, and apparatus for cutting and sorting semiconductor packages.

Abstract

This invention provides a film bonding apparatus and method for semiconductor packages, as well as a cutting and sorting apparatus for semiconductor packages. The apparatus may include: a boat assembly loading device for transferring unbonded boat assemblies with bonded films to a pallet; a semiconductor package transfer device for transferring multiple semiconductor packages to positions corresponding to the pallet; and a batch bonding device for batch bonding the semiconductor packages to the bonded films by moving the pallet relative to the semiconductor packages in the direction of the semiconductor packages.

Description

Technical Field

[0001] This invention relates to a film bonding apparatus and method for semiconductor packages, as well as a cutting and sorting apparatus for semiconductor packages. More specifically, it relates to a film bonding apparatus and method for semiconductor packages, which, after cutting semiconductor strips into multiple semiconductor packages, and before sorting, batch-bonds the semiconductor packages to an adhesive film protecting the terminal faces of the semiconductor packages during the formation of an electromagnetic wave shielding film. Background Technology

[0002] Typically, existing semiconductor package cutting and sorting devices cut semiconductor strips into multiple semiconductor packages, identify the state of the semiconductor packages by photographing the surface or cut surface of the packages, and then use a pick-up device that can be individually transferred to sort the semiconductor packages according to their state into categories such as good products, products for rework, and defective products. Furthermore, the sorting results can be classified into good product trays, rework trays, and waste boxes.

[0003] Among them, semiconductor packages classified as good quality are transferred to a separate sputtering unit for the electromagnetic wave shielding film formation process.

[0004] Typically, semiconductor packages transferred to the sputtering apparatus are bonded in multiple semiconductor packages as process units to an adhesive film (UV adhesive tape) for protecting the terminal face by other pick-up devices. Then, electromagnetic wave shielding films (metal films) and the like are formed in batches on the remaining surfaces other than the terminal face in the sputtering apparatus. Summary of the Invention

[0005] The problem to be solved However, existing semiconductor package cutting and sorting devices that classify semiconductor packages individually have the following problems: In recent years, semiconductor packages have tended to be miniaturized. At the same time, with the number of semiconductor packages to be cut increasing significantly, the picking device consumes a lot of time in the process of picking up each of the large number of semiconductor packages individually and sorting them into trays. Moreover, in the sputtering device, the process of bonding the individually sorted semiconductor packages to a single adhesive film in multiple semiconductor packages as process units also consumes time, resulting in a decrease in overall productivity.

[0006] This invention addresses several problems, including those described above, and aims to provide a semiconductor package film bonding apparatus and method, as well as a semiconductor package cutting and sorting apparatus. This method involves directly and in batches bonding semiconductor packages cut by a cutting device to an adhesive film in an unsorted state to perform an electromagnetic wave shielding film formation process, after storing only the location information of defective semiconductor packages identified by a camera, and finally removing the defective semiconductor packages. However, these problems are merely exemplary, and the scope of this invention is not limited to these problems.

[0007] Problem-solving methods A thin-film bonding apparatus for semiconductor packages based on the present invention and used to solve the above-mentioned problems may include: a boat assembly loading device for transferring a boat assembly with an adhesive film formed thereon to a pallet; a semiconductor package transfer device for transferring a plurality of semiconductor packages to a position corresponding to the pallet; and a batch bonding device for batch bonding the semiconductor packages to the adhesive film by moving the pallet relative to the semiconductor packages in the direction of the semiconductor packages.

[0008] Furthermore, according to the present invention, the boat assembly may include: the adhesive film, which, in a subsequent process, is formed to contact and adhere to the terminal surface of the semiconductor package in order to protect the terminal surface; an inner frame, formed in a ring shape to support the adhesive film and maintain the flat shape of the adhesive film; and a boat tray for holding the adhesive film and the inner frame to support the adhesive film and the inner frame.

[0009] Furthermore, according to the present invention, the boat tray may include: a boat body, which is generally formed in a flat shape to support the reverse side, i.e., the back side, of the adhesive surface of the adhesive film; and a guide pin formed at a corner portion of the boat body.

[0010] Furthermore, according to the present invention, the boat component loading device may include: a boat picker for picking up and removing the boat component in an unattached state from a pallet loader, or picking up the boat component in an unattached state from a pallet conveyor; and a boat picker moving device for moving the boat picker toward the pallet table.

[0011] Furthermore, according to the present invention, the boat pickup may include: a pickup head, configured to correspond to the boat assembly; and a clamp formed on the pickup head for clamping the boat assembly.

[0012] Furthermore, according to the present invention, the pallet loader may include a loading frame that houses the boat assembly, wherein the boat assemblies are stacked one above the other in an unbonded state.

[0013] Furthermore, according to the present invention, the semiconductor package transfer device may include a flipping table for adsorbing a plurality of the semiconductor packages and flipping them toward the pallet table.

[0014] Furthermore, according to the present invention, the flipping stage may include: a flipping body configured to vacuum-adsorb the semiconductor package and be rotatable with respect to a rotation axis; and a rotation device for rotating the rotation axis.

[0015] Furthermore, according to the present invention, a pin hole is formed on one side of the flipping body, into which a guide pin of the boat assembly can be inserted for alignment with the boat assembly.

[0016] Furthermore, according to the present invention, the batch bonding apparatus may include: the pallet platform for holding the boat assembly; a lifting device for lifting the pallet platform to bond the boat assembly to the semiconductor package; and a bonding pressure adjusting device for adjusting the bonding pressure of the boat assembly.

[0017] Furthermore, according to the present invention, the pallet platform may include: a pallet body for supporting the boat assembly; and a boat alignment device formed in the pallet body for aligning the boat assembly.

[0018] Furthermore, according to the present invention, the boat alignment device may include: a pressure rod that applies pressure to the side of the tray body; and a forward / backward actuator that moves the pressure rod forward or backward.

[0019] Furthermore, according to the present invention, a boat component unloading device may also be included, which is capable of unloading the boat component that has been glued.

[0020] Furthermore, according to the present invention, the boat assembly unloading device may include a pallet platform moving device, which is capable of moving the boat assembly toward the boat picker so as to unload the boat assembly in a bonded state to the pallet unloader or to transfer the boat assembly in a bonded state to the pallet conveyor.

[0021] Furthermore, according to the present invention, the pallet unloader may include an unloading frame for accommodating the boat assembly to stack the boat assembly in a bonded state in the vertical direction.

[0022] Furthermore, according to the present invention, a picking device may also be included, the picking device being used to individually pick up and transfer the semiconductor package when the semiconductor package is placed on the pallet table in the absence of the boat assembly.

[0023] Furthermore, according to the present invention, the picking device can be used to selectively pick up and remove only semiconductor packages that are determined to be defective from the batch-bonded boat assemblies when the boat assembly is placed on the pallet table, or to replace defective semiconductor packages with good semiconductor packages.

[0024] On the other hand, a thin-film bonding method for semiconductor packages based on the present invention and used to solve the above-mentioned problems may include: step (a) transferring a boat assembly with an adhesive film formed thereon to a pallet; step (b) transferring a plurality of semiconductor packages to a position corresponding to the pallet; and step (c) moving the pallet relative to the semiconductor packages in the direction of the semiconductor packages, thereby bonding the semiconductor packages in batches to the adhesive film.

[0025] Furthermore, according to the present invention, in step (b), the plurality of semiconductor packages are adsorbed and then flipped toward the pallet table.

[0026] On another aspect, a semiconductor package cutting and sorting apparatus based on the present invention and used to solve the above-mentioned problems may include: a cutting device for cutting semiconductor strips into multiple semiconductor packages; a cleaning device for cleaning the semiconductor packages; a flipping table for adsorbing the cleaned semiconductor packages; a camera for capturing images of the semiconductor packages adsorbed on the flipping table; a pallet table for receiving and transferring the semiconductor packages flipped by the flipping table; a sorting device for individually picking up the semiconductor packages from the pallet table using a picking device and sorting them into pallets; and a control unit for receiving image signals from the camera and determining the semiconductor packages. The packaged components are stored in their current state, and a sorting control signal is applied to the sorting device, or an unsorted control signal and a batch bonding control signal are applied to the sorting device to batch bond the semiconductor packages to the adhesive film; the packaged components may also include: a boat assembly loading device for transferring boat assemblies in an unbonded state with adhesive film formed to the pallet table when the batch bonding control signal is applied; a semiconductor package transfer device for transferring multiple semiconductor packages to the flipping table; and a batch bonding device for batch bonding the semiconductor packages to the adhesive film by moving the pallet table relative to the semiconductor packages.

[0027] Invention Effects The various embodiments of the present invention configured as described above have the following effects: after storing only the location information of defective semiconductor packages identified by the camera, semiconductor packages cut by the cutting device can be directly and in batches bonded to an adhesive film in an unsorted state to perform an electromagnetic wave shielding film formation process, and finally the defective semiconductor packages are removed, thereby minimizing logistics and maximizing productivity. Of course, the scope of the present invention is not limited to these effects. Attached Figure Description

[0028] Figure 1 This is a schematic diagram illustrating a thin-film bonding apparatus for a semiconductor package according to a partial embodiment of the present invention; Figures 2 to 9 It is shown step by step. Figure 1 A schematic diagram of the film bonding process in a film bonding device for semiconductor packages; Figure 10 It is shown Figure 1 Exploded perspective view of the boat assembly of the thin film bonding device for semiconductor packages; Figures 11 to 13 It is shown step by step. Figure 1 A side sectional view of the film bonding process in a film bonding apparatus for semiconductor packages; Figure 14 This is a schematic diagram illustrating a thin-film bonding apparatus for a semiconductor package according to another embodiment of the present invention; Figure 15 This is a schematic diagram illustrating a thin-film bonding apparatus for a semiconductor package according to yet another embodiment of the present invention; Figure 16 as well as Figure 17 This is a top-view diagram showing the configuration of a cutting and sorting apparatus for a semiconductor package according to a partial embodiment of the present invention. Figure 18 This is a sequence diagram illustrating a thin-film bonding method for a semiconductor package according to a partial embodiment of the present invention; Explanation of reference numerals in the attached figures: 1. Semiconductor strip; 2. Semiconductor package; 2a Terminal face; 10 Boat assembly; 11 Adhesive film; F1 Adhesive surface; F2 rear; 12 internal frame; 13 Boat trays; 131 Boat body; 132 guide pins; 20 boat component loading devices; 21 Boat pickup; 211 Pickup head; 212 Clamping device; 22 Boat pickup moving device; 23 Pallet loader; 231 Loading frame; 24 tray conveyors; 30 semiconductor package transfer devices; 31. Rotation table; 311. Rotation body; 312 Rotating shaft; 313 Rotating device; 314 pin hole section; 40 batch bonding device; 41 Palletizing platform; 411 Pallet body; 412 Boat alignment device; 413 Pressure rod; 414 Forward / reverse actuator; 42 Lifting device; 43 Adhesive pressure regulating device; 50 Boat component unloading device; 51 Pallet table moving device; 52 Pallet unloader; 521 Unloading frame; 60 Pickup device; 70 Cutting device; 71 Cleaning device; 72 Unit pickups; 73 Cameras; 74. Sorting device; 75. Buffer pickup; 90 Control unit; 100, 200, 300 Thin film bonding device for semiconductor packages; Cutting and sorting device for 1000 semiconductor packages. Detailed Implementation

[0029] Hereinafter, some preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0030] The embodiments of this invention are intended to describe the invention more fully to those skilled in the art. The following embodiments can be modified into several different forms, and the scope of the invention is not limited to these embodiments. Rather, these embodiments are intended to make this disclosure more thorough and complete, fully conveying the spirit of the invention to those skilled in the art. Furthermore, for ease of explanation and clarity, the thickness or size of the layers in the drawings has been exaggerated.

[0031] The terminology used in this specification is for describing particular embodiments and is not intended to limit the invention. As used herein, the singular form may include the plural form unless the context clearly indicates otherwise. Furthermore, the word "comprising" as used herein specifically designates the presence of shapes, numbers, steps, operations, components, elements, and / or combinations thereof, but does not exclude the presence or addition of more than one other shape, number, operation, component, element, and / or combination thereof.

[0032] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings, which schematically illustrate preferred embodiments of the invention. In the drawings, variations in the illustrated shapes can be anticipated, for example, based on manufacturing techniques and / or tolerances. Therefore, embodiments of the inventive concept should not be construed as limited to the specific shapes illustrated herein, but should include, for example, shape variations resulting from manufacturing processes.

[0033] Figure 1 This is a schematic diagram illustrating a thin-film bonding apparatus 100 for a semiconductor package according to a partial embodiment of the present invention.

[0034] like Figure 1 As shown, the semiconductor package film bonding apparatus 100 according to some embodiments of the present invention is an apparatus for batch bonding multiple semiconductor packages 2 to an adhesive film 11 using a boat assembly 10, and mainly includes: a boat assembly loading device 20, a semiconductor package transfer device 30, and a batch bonding device 40.

[0035] The boat assembly loading device 20 may be, for example, a device for transferring an unbonded boat assembly 10 with an adhesive film 11 formed thereon to a pallet table 41.

[0036] Here, as Figure 10 As shown, the boat assembly 10 may include: an adhesive film 11, which contacts and adheres to the terminal surface 2a of the semiconductor package 2 in order to protect the terminal surface 2a when the electromagnetic wave shielding film is formed in a subsequent process; an inner frame 12, which is formed into a ring shape to support the adhesive film 11 and maintain the flat shape of the adhesive film 11; and a boat tray 13, which holds the adhesive film 11 and the inner frame 12 to support the adhesive film 11 and the inner frame 12.

[0037] In addition, the boat tray 13 may include, for example, a boat body 131, which is generally formed in a flat shape to support the adhesive surface F1 of the adhesive film 11 (see reference). Figure 11 The reverse side, i.e., the back side F2 (refer to) Figure 11 ); and guide pin 132, formed at the corner of the boat body 131.

[0038] Such adhesive films 11 can be, for example, photocurable films that remain viscous at room temperature and can be cured to increase adhesive strength when activated by ultraviolet light or the like, or become inactive in a cured state by ultraviolet light and thus become viscous again. However, such adhesive films 11 are not limited to this; a wide variety of types and forms of adhesive films can be used.

[0039] Therefore, the boat assembly 10 can be transferred by the boat assembly loading device 20, which will be described later, with the adhesive film 11 and the inner frame 12 assembled onto the boat tray 13. Subsequently, in the sputtering apparatus, the adhesive film 11 and the inner frame 12 can be separated from the boat tray 13 to perform the electromagnetic wave shielding film formation process.

[0040] like Figure 1 As shown, the boat component loading device 20 may include, for example, a boat picker 21 for picking up and removing unbonded boat components 10 from a tray loader 23, or from a tray transferr 24 (see reference 20). Figure 14 The system picks up the boat assembly 10 in an unattached state from the pallet table 41; and the boat pickup moving device 22 is used to move the boat pickup 21 toward the pallet table 41.

[0041] More specifically, such as Figure 1 As shown, the boat pickup 21 may include, for example, a pickup head 211 (see reference). Figure 1 and Figure 17 ), forming a structure corresponding to the boat assembly 10; and a clamp 212 (see reference 10). Figure 1 and Figure 17 ), formed in the pickup head 211, for holding the boat assembly 10.

[0042] Here, the pallet loader 23 may include, for example, a loading frame 231 that houses the boat assembly 10, which is stacked on top of each other in an unbonded state.

[0043] Pallet loaders like this 23 can not only accommodate boat components 10, but can also accommodate various pallets such as existing good pallets or rework pallets.

[0044] However, various sensors can be installed on such a pallet loader 23 to detect the remaining amount of the stacked boat components 10 or pallets, and additional lifting devices such as lifting devices that raise and lower the loaded boat components 10 or pallets can be installed so that the gripper 212 can grip the boat components 10 or pallets at a certain height. Such a boat component loading device 20 can be used in conjunction with the boat component unloading device 50 described later.

[0045] Therefore, the boat component loading device 20 can use the boat picker 21 to pick up and remove the unattached boat component 10 from the pallet loader 23, and can use the boat picker moving device 22 to move the boat component 10 toward the pallet table 41.

[0046] Boat picker 21 and boat picker moving device 22 are not limited to the structure shown in the figure. All kinds of transfer devices or transfer robots capable of picking up and transferring boat components 10 can be used.

[0047] like Figure 1 and Figure 11 As shown, the semiconductor package transfer device 30 may be, for example, a device capable of transferring multiple semiconductor packages 2 to positions corresponding to the pallet table 41.

[0048] The semiconductor package transfer device 30 may include, for example, a reverse table 31, which is capable of adsorbing multiple semiconductor packages 2 and flipping them toward the pallet table 41.

[0049] More specifically, for example, the flipping stage 31 may include: a flipping body 311, which is formed as a vacuum adsorption semiconductor package 2 and is rotatable with respect to a rotation axis 312; and a rotation device 313 for rotating the rotation axis 312.

[0050] like Figure 1 and Figure 11 As shown, such a flip-up body 311, for example, has a guide pin 132 formed on one side that can be inserted into the boat assembly 10 (see reference). Figure 10 The pin hole 314 is used for alignment with the boat assembly 10.

[0051] Therefore, the semiconductor package transfer device 30 can, for example, utilize the flip table 31 to transfer the semiconductor package from the semiconductor package cutting and sorting device 1000 (see below) which will be described later. Figure 16 and Figure 17 After the unit pickup 72 receives multiple cut semiconductor packages 2 in batches and flips them, it can be prepared for the bonding process.

[0052] In other words, for semiconductor package 2, the cutting device 70 of semiconductor package cutting and sorting device 1000 (see reference) can be used. Figure 16 The semiconductor package transfer device 30 can flip the semiconductor package 2 with the terminal face 2a facing upward and then wait with the terminal face 2a facing downward after cutting it with the terminal face 2a facing upward.

[0053] However, the semiconductor package transfer device 30 is not limited to the structure shown in the figure. It can flip the terminal surface 2a from an upward-facing state to a downward-facing state, or it can flip the terminal surface 2a from a downward-facing state to an upward-facing state, etc.

[0054] The batch bonding device 40 can, for example, be used to batch bond the semiconductor package 2 to the adhesive film 11 by moving the pallet table 41 relative to the semiconductor package 2 in the direction of the semiconductor package 2.

[0055] like Figure 1 and Figure 13 As shown, the batch bonding device 40 may include, for example, a pallet table 41 for placing the boat assembly 10; a lifting device 42 for lifting the pallet table 41 to bond the boat assembly 10 to the semiconductor package 2; and a bonding pressure adjusting device 43 for adjusting the bonding pressure of the boat assembly 10.

[0056] like Figure 11 As shown, the pallet platform 41 may include: a pallet body 411 for supporting the boat assembly 10, which is generally formed in a plate shape corresponding to the boat assembly 10 so as to apply pressure to the boat assembly in the direction of the semiconductor package 2; and a boat alignment device 412 formed in the pallet body 411 for aligning the boat assembly 10.

[0057] Here, as Figure 11 As shown, the boat alignment device 412 may include: a pressure rod 413 that applies pressure to the side of the pallet body 411; and a forward / backward actuator 414 that moves the pressure rod 413 forward or backward.

[0058] Furthermore, various motors or cylinder actuators, such as those that raise and lower the pallet table 41 to bond the boat assembly 10 to the semiconductor package 2, can be used for the lifting device 42.

[0059] Furthermore, various regulators, sensors, or pressure controllers for adjusting the bonding pressure of the boat assembly 10 can be applied to the bonding pressure regulating device 43.

[0060] Lifting device 42 and bonding pressure regulating device 43 can be combined to form a lifting pressure regulating device. The structure is not limited to that shown in the figure. A wide variety of shapes and types of devices can be used.

[0061] Therefore, when the boat assembly 10 is placed on the pallet body 411, the pallet table 41 can use the forward and backward actuator 414 of the boat alignment device 412 to push the pressure rod 413 forward, thereby aligning the boat assembly 10 to the correct position. Once the boat assembly 10 is aligned, the pallet table 41 can be lifted toward the semiconductor package 2 that has been flipped by the semiconductor package transfer device 30 and is waiting, thereby batch bonding the semiconductor package 2 to the adhesive film 11 of the boat assembly 10.

[0062] Additionally, according to some embodiments of the present invention, the thin film bonding apparatus 100 for semiconductor packages may further include a boat assembly unloading device 50, which is used to unload the boat assembly 10 that has been batch bonded to the semiconductor package 2 by the batch bonding device 40.

[0063] like Figure 1 As shown, the boat assembly unloading device 50 may include, for example, a pallet table moving device 51, which is capable of moving the boat assembly 10 toward the boat picker 21 to unload the boat assembly 10, which has been glued, to the tray unloader 52, or to the tray transfer 24 (see reference). Figure 14 Transfer the boat assembly 10, which has been glued in place.

[0064] Here, the tray unloader 52 may include an unloading frame 521 for accommodating the boat assembly 10 to stack the boat assembly 10 in a bonded state in the vertical direction.

[0065] Furthermore, the boat component unloading device 50 can also be used as the boat component loading device 20 described above. That is, the boat component loading device 20 can use the boat pick-up device 21 to unload the boat component 10, which has been glued, onto the tray unloader 52.

[0066] Therefore, by utilizing the boat component loading device 20 and boat component unloading device 50 of the present invention, a series of processes can be automatically implemented, including picking up the unbonded boat component 10 from the tray loader 23, batch bonding the semiconductor package 2 to the boat component 10, and unloading the bonded boat component 10 to the tray unloader 52.

[0067] Figures 2 to 9 It is shown step by step. Figure 1 A schematic diagram of the film bonding process in the film bonding apparatus 100 for semiconductor packages. Furthermore, Figures 11 to 13 It is shown step by step. Figure 1 A side sectional view of the film bonding process of the film bonding apparatus 100 for semiconductor packages.

[0068] like Figures 2 to 13 As shown, the operation of the thin film bonding apparatus 100 for a semiconductor package according to a partial embodiment of the present invention will be described. First, as... Figure 2 As shown, the boat component loading device 20 can use the boat picker 21 to pick up and remove the unattached boat component 10 from the pallet loader 23, and as... Figure 3 As shown, the boat assembly 10 can be moved toward the pallet table 41 by using the boat pickup moving device 22, and then the boat assembly 10 can be placed on the pallet table 41.

[0069] Next, as Figure 4 As shown, the pallet table 41 can be moved to a position corresponding to the flipping table 31 and wait.

[0070] Next, as Figure 5 and Figure 11 As shown, the flip table 31 receives multiple cut semiconductor packages 2 in batches from the unit picker 72, and as... Figure 6 and Figure 12 After the semiconductor package 2 is flipped over, the bonding process can be prepared.

[0071] Next, as Figure 7 and Figure 13 As shown, the pallet platform 41 can be lifted toward the semiconductor package 2, thereby batch bonding the semiconductor package 2 to the adhesive film 11.

[0072] Next, as Figure 8 As shown, for the boat assembly 10 in the bonded state, it can be picked up again by the boat picker 21, as follows: Figure 9 The unloader is shown to be unloaded to the tray unloader 52.

[0073] Therefore, according to the present invention, a series of processes can be automatically implemented, including picking up the unbonded boat assembly 10 from the tray loader 23, bonding the semiconductor package 2 to the boat assembly 10 in batches, and unloading the bonded boat assembly 10 to the tray unloader 52.

[0074] Figure 14 This is a schematic diagram illustrating a thin-film bonding device 200 for a semiconductor package according to another embodiment of the present invention.

[0075] like Figure 14 As shown, the thin film bonding device 200 for semiconductor packages according to another embodiment of the present invention may further include two boat assembly loading devices 20 and a pallet conveyor 24 having the same or similar structure as the pallet table 41.

[0076] Therefore, the material flow of the boat assembly 10, which can be transferred using the two boat assembly loading devices 20 and the pallet conveyor 24, can be increased, and additional operations on the boat assembly 10 can be performed on the pallet conveyor 24.

[0077] Figure 15 This is a schematic diagram illustrating a thin-film bonding apparatus 300 for a semiconductor package according to yet another embodiment of the present invention.

[0078] like Figure 15As shown, the thin film bonding apparatus 300 for a semiconductor package according to another embodiment of the present invention may further include a picking device 60, which is configured to pick up and transfer the semiconductor package 2 independently when the semiconductor package 2 is placed on the pallet table 41 without the boat assembly 10.

[0079] Such a pickup device 60 may include, for example, a pickup head capable of individually vacuum-adsorbing a semiconductor package 2.

[0080] Therefore, when the boat assembly 10 is placed on the pallet table 41, the picking device 60 can selectively pick up and remove the semiconductor packages 2 identified as defective from the boat assemblies 10 that have been batch bonded, or replace the defective semiconductor packages with good semiconductor packages.

[0081] Figure 16 This is a top-view diagram showing the configuration of a cutting and sorting apparatus for semiconductor packages according to some embodiments of the present invention. Figure 17 Yes Figure 16 The configuration diagram of the thin film bonding device 300 for semiconductor packages is shown in an enlarged view.

[0082] like Figure 16 and Figure 17 As shown, the semiconductor package cutting and sorting apparatus 1000 according to some embodiments of the present invention may include: a cutting device 70 for cutting semiconductor strips 1 into multiple semiconductor packages 2; a cleaning device 71 for cleaning the semiconductor packages 2; a unit pick-up device 72 for transferring the cleaned semiconductor packages 2; a flipping table 31 for adsorbing the cleaned semiconductor packages 2; and a camera 73 (see reference). Figure 1 The system includes: a camera 73 for photographing semiconductor packages 2 adsorbed on a flip table 31; a pallet table 41 for receiving and transferring semiconductor packages 2 flipped by the flip table 31; a sorting device 74 for individually picking up semiconductor packages 2 from the pallet table 41 by a picking device 60 and sorting them into a pallet T; and a control unit 90 for receiving image signals from the camera 73, determining the state of the semiconductor packages 2 and storing them, and applying a sorting control signal to the sorting device 74, or applying an unsorted control signal and a batch bonding control signal to the sorting device 74, so that the semiconductor packages 2 are batch bonded to the adhesive film 11.

[0083] Here, the semiconductor package cutting and sorting device 1000 according to some embodiments of the present invention may further include a buffer pick-up 75, which transfers the semiconductor package to the pallet table 41 without flipping it, so that the semiconductor package 2 is transferred with all terminal faces 2a facing upward or to the right as needed.

[0084] In addition, such as Figure 15 , Figure 16 and Figure 17 The pickup device 60 shown can also function as a chip pickup when it is not necessary to batch bond the semiconductor packages 2 to the adhesive film 11, but rather to classify the semiconductor packages 2 into good products, rework products, defective products, etc.

[0085] Therefore, the semiconductor package cutting and sorting device 1000 according to some embodiments of the present invention can discharge the semiconductor package 2 in an appropriate manner as needed, thereby increasing the freedom of device configuration or process execution in the production line.

[0086] Furthermore, the semiconductor package cutting and sorting apparatus 1000 according to some embodiments of the present invention may also include a semiconductor package film bonding apparatus 300. The semiconductor package film bonding apparatus 300 may include: a boat assembly 10 in an unbonded state with an adhesive film 11 formed thereon to a pallet table 41 when a batch bonding control signal is applied; a semiconductor package transfer device 30 for transferring a plurality of semiconductor packages 2 to a flipping table 31; and a batch bonding apparatus 40 for batch bonding semiconductor packages 2 to the adhesive film 11 by moving the pallet table 41 relative to the semiconductor package 2 in the direction of the semiconductor package 2.

[0087] Here, the structure and function of the thin-film bonding device 300 for semiconductor packages are similar to... Figures 1 to 15 The thin film bonding device 300 of the semiconductor package of the present invention shown is the same, so detailed description is omitted.

[0088] Therefore, according to the present invention, a series of operations can be performed, including cutting the semiconductor strip 1 into multiple semiconductor packages 2, cleaning the cut semiconductor packages 2, batch transferring the cleaned semiconductor packages 2, adsorbing the cleaned semiconductor packages 2, photographing the semiconductor packages 2, and, when necessary, picking up the semiconductor packages 2 individually and classifying them into a tray after flipping and transferring them; and can be automatically performed, without classifying the semiconductor packages 2 when batch bonding them to the adhesive film 11, but instead picking up the unbonded boat assembly 10 from the tray loader 23 and batch bonding the semiconductor packages 2 to the boat assembly 10, and then unloading the bonded boat assembly 10 into the tray unloader 52.

[0089] Figure 18 This is a sequence diagram illustrating a thin-film bonding method for a semiconductor package according to a partial embodiment of the present invention.

[0090] like Figures 1 to 18As shown, a thin-film bonding method for semiconductor packages according to some embodiments of the present invention may include: step (a), transferring an unbonded boat assembly 10 with an adhesive film 11 formed thereon to a pallet table 41; step (b), transferring a plurality of semiconductor packages 2 to positions corresponding to the pallet table 41; and step (c), moving the pallet table 41 relative to the semiconductor packages 2 in the direction of the semiconductor packages 2, thereby bonding the semiconductor packages 2 in batches to the adhesive film 11.

[0091] Here, in step (b), multiple semiconductor packages 2 can be adsorbed and flipped toward the pallet table 41.

[0092] Therefore, according to the present invention, after storing the location information of defective semiconductor packages identified by the camera, the semiconductor packages cut by the cutting device can be directly batch-bonded to the adhesive film in an unclassified state to perform the electromagnetic wave shielding film formation process, and finally the defective semiconductor packages can be removed. This can minimize the logistics process and maximize productivity.

[0093] The embodiments shown in the figures are described with reference to the present invention, but are merely examples. It is understood that those skilled in the art can make various modifications and obtain equivalent other embodiments. Therefore, the true scope of protection of the present invention should be determined based on the technical concept of the appended claims.

Claims

1. A thin-film bonding apparatus for semiconductor packages, characterized in that, include: Boat assembly loading device for transferring boat assemblies with adhesive films formed onto pallet tables; A semiconductor package transfer device is used to transfer multiple semiconductor packages to a position corresponding to the pallet table; as well as A batch bonding apparatus bonds semiconductor packages to an adhesive film in batches by moving the pallet table relative to the semiconductor package in the direction of the semiconductor package.

2. The thin-film bonding apparatus for semiconductor packages according to claim 1, characterized in that, The boat assembly includes: The adhesive film is used to contact and bond with the terminal surface of the semiconductor package in order to protect the terminal surface of the semiconductor package when the electromagnetic wave shielding film is formed in subsequent processes. An internal frame is formed in a ring shape to support the adhesive film, thereby maintaining the flatness of the adhesive film; and A boat tray is used to hold the adhesive film and the internal frame to support them.

3. The thin-film bonding apparatus for semiconductor packages according to claim 2, characterized in that, The boat tray includes: The boat body is generally flat to support the reverse side, i.e., the back side, of the adhesive surface of the adhesive film; and Guide pins are formed at the corners of the main body of the boat.

4. The thin-film bonding apparatus for semiconductor packages according to claim 1, characterized in that, The boat component loading device includes: A boat picker that picks up and removes the boat assembly in an unbonded state from a pallet loader, or picks up the boat assembly in an unbonded state from a pallet conveyor; and The boat pickup moving device moves the boat pickup toward the pallet platform.

5. The thin-film bonding apparatus for semiconductor packages according to claim 4, characterized in that, The boat pickup includes: The pickup head is formed in a structure corresponding to the boat assembly; and A gripper, formed in the pickup head, is used to grip the boat assembly.

6. The thin-film bonding apparatus for semiconductor packages according to claim 4, characterized in that, The pallet loader includes a loading frame that houses the boat assembly, with the boat assembly stacked on top of each other in an unbonded state.

7. The thin-film bonding apparatus for semiconductor packages according to claim 1, characterized in that, The semiconductor package transfer device includes a flipping table, which is used to pick up multiple semiconductor packages and flip them toward the pallet table.

8. The thin-film bonding apparatus for semiconductor packages according to claim 7, characterized in that, The tilting table includes: The main body is flipped to allow vacuum adsorption of the semiconductor package and is rotatable with a rotation axis as a reference; and A rotating device for rotating the rotating shaft.

9. The thin film bonding apparatus for semiconductor packages according to claim 8, characterized in that, A pin hole is formed on one side of the flipping body, which allows a guide pin to be inserted into the boat assembly for alignment with the boat assembly.

10. The thin-film bonding apparatus for semiconductor packages according to claim 1, characterized in that, The batch bonding device includes: The pallet platform is used to house the boat assembly; A lifting device is used to lift the pallet platform to bond the boat assembly to the semiconductor package; and An adhesive pressure regulating device is used to regulate the adhesive pressure of the boat assembly.

11. The thin-film bonding apparatus for semiconductor packages according to claim 10, characterized in that, The pallet platform includes: The tray body is used to support the boat assembly; and A boat alignment device is formed in the tray body for aligning the boat assembly.

12. The thin-film bonding apparatus for semiconductor packages according to claim 11, characterized in that, The boat alignment device includes: A pressure bar applies pressure to the side of the tray body; and The forward and backward actuator causes the pressure rod to move forward and backward.

13. The thin-film bonding apparatus for semiconductor packages according to claim 1, characterized in that, It also includes a boat component unloading device, which is capable of unloading the boat component that has been glued together.

14. The thin-film bonding apparatus for semiconductor packages according to claim 13, characterized in that, The boat assembly unloading device includes a pallet platform moving device, which is capable of moving the boat assembly toward the boat picker so as to unload the boat assembly in a bonded state to the pallet unloader or to transfer the boat assembly in a bonded state to the pallet conveyor.

15. The thin-film bonding apparatus for semiconductor packages according to claim 14, characterized in that, The tray unloader includes an unloading frame that houses the boat assembly for stacking the boat assembly in a bonded state in a vertical direction.

16. The thin-film bonding apparatus for semiconductor packages according to claim 1, characterized in that, It also includes a pickup device for individually picking up and transferring the semiconductor package when the semiconductor package is placed on the pallet table without the boat assembly.

17. The thin-film bonding apparatus for semiconductor packages according to claim 16, characterized in that, The picking device is used to selectively pick up and remove only semiconductor packages that are determined to be defective from the batch-bonded boat assemblies when the boat assembly is placed on the pallet table, or to replace defective semiconductor packages with good semiconductor packages.

18. A method for thin-film bonding of a semiconductor package, characterized in that, include: Step (a): The boat assembly with the adhesive film formed is transferred to the pallet table; Step (b) involves transferring multiple semiconductor packages to positions corresponding to the pallet platform; as well as Step (c) involves moving the pallet platform relative to the semiconductor package to batch bond the semiconductor package to the adhesive film.

19. The thin-film bonding method for semiconductor packages according to claim 18, characterized in that, In step (b), the semiconductor packages are adsorbed and then flipped toward the pallet table.

20. A cutting and sorting apparatus for semiconductor packages, characterized in that, include: A cutting device for cutting semiconductor strips into multiple semiconductor packages; A cleaning device for cleaning the semiconductor package; A flipping table for adsorbing the cleaned semiconductor package; A camera for capturing images of the semiconductor package being attached to the flipping table; A pallet table for receiving and transferring the semiconductor package that has been flipped by the flipping table; A sorting device for individually picking up the semiconductor packages from the pallet table and sorting them into pallets using a picking device; as well as The control unit is used to receive image signals from the camera, determine the state of the semiconductor package and store them, and apply a classification control signal to the classification device, or apply an unclassified control signal and a batch bonding control signal to the classification device, so that the semiconductor package is batch bonded to the adhesive film. Also includes: A boat assembly loading device is used to transfer boat assemblies in an unbonded state with the adhesive film formed thereon to the pallet table when the batch bonding control signal is applied. A semiconductor package transfer device for transferring a plurality of said semiconductor packages to the flipping table; and A batch bonding apparatus bonds semiconductor packages to an adhesive film in batches by moving the pallet table relative to the semiconductor package in the direction of the semiconductor package.

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