Counterflow enhanced liquid bath temperature control device for microfluidic chips and reagents

Abstract

This application relates to the field of microfluidic chip technology and discloses a convection-enhanced liquid bath temperature control device for microfluidic chips and reagents, including a housing, a microfluidic chip holder, a heat dissipation component, and a convection component. The housing has a first receiving cavity containing a heat-conducting medium. The microfluidic chip holder is disposed within the first receiving cavity. The heat dissipation component is disposed within the housing and at least partially within the first receiving cavity, with the heat dissipation component and the microfluidic chip holder spaced apart to form a mixing region. The convection component is disposed within the housing and is adapted to agitate the heat-conducting medium in the first receiving cavity. The convection component has a first inlet, a first outlet, and a second outlet. The first inlet is at least partially opposite to the mixing region and is located between the first and second outlets. The first outlet is closer to the microfluidic chip holder than the second outlet. The temperature control device according to this application improves temperature uniformity.

Description

Technical Field

[0001] This application relates to the field of microfluidic chip technology, and in particular to a convection-enhanced liquid bath temperature control device for microfluidic chips and reagents. Background Technology

[0002] Microfluidic chip technology, as a technology for manipulating tiny fluids in micrometer-scale channels, has been widely used in many cutting-edge fields such as liquid microflow measurement and calibration, microchemical synthesis, biomedical detection (such as PCR amplification, cell culture, and protein analysis) and environmental monitoring due to its outstanding advantages such as low sample consumption, fast analysis speed, and high integration.

[0003] Currently, temperature control methods for microfluidic chips and reagents mainly include air-cooled / air-bath temperature control, contact temperature control, and liquid bath temperature control. Traditional liquid bath temperature control devices suffer from problems such as insufficient temperature uniformity, slow thermal response speed, and poor adaptability to chip structures. Therefore, how to improve the temperature uniformity of temperature control devices for microfluidic chips is a technical problem that urgently needs to be solved. Summary of the Invention

[0004] This application provides a convection-enhanced liquid bath temperature control device for microfluidic chips and reagents, which improves temperature uniformity.

[0005] To achieve the above objectives, the main technical solutions adopted in this application include: In a first aspect, embodiments of this application provide a convection-enhanced liquid bath temperature control device for microfluidic chips and reagents, comprising a housing, a microfluidic chip holder, a heat dissipation component, and a convection component; the housing has a first accommodating cavity, in which a heat-conducting medium is disposed; the microfluidic chip holder is disposed in the first accommodating cavity; the heat dissipation component is disposed in the housing and at least partially located within the first accommodating cavity, and along a first direction, the heat dissipation component and the microfluidic chip holder are spaced apart to form a mixing region, the heat dissipation component being adapted to exchange heat with the heat-conducting medium; the convection component is disposed in the housing, the convection component being adapted to agitate the heat-conducting medium in the first accommodating cavity, the convection component having a first liquid inlet, a first liquid outlet, and a second liquid outlet, and along a second direction, the first liquid inlet is at least partially opposite to the mixing region, and along the first direction, the first liquid inlet is located between the first liquid outlet and the second liquid outlet, the first liquid outlet being closer to the microfluidic chip holder than the second liquid outlet, the first direction and the second direction being perpendicular.

[0006] The convection-enhanced liquid bath temperature control device for microfluidic chips and reagents proposed in the first aspect of this application enables the heat-conducting medium after heat exchange with the heat dissipation component and the heat-conducting medium after heat exchange with the microfluidic chip to be fully mixed in the mixing area in advance, effectively avoiding local excessively high or low temperatures, improving the overall temperature uniformity of the heat-conducting medium, and constructing a multi-layer convection structure in the first accommodating cavity to further enhance the medium disturbance and heat exchange effect, significantly improving temperature control accuracy, temperature uniformity and response speed.

[0007] Optionally, along the second direction, the first liquid outlet is at least partially opposite to the microfluidic chip placement rack, and the second liquid outlet is at least partially opposite to the heat dissipation component.

[0008] In the above scheme, two liquid outlets can reduce flow dead zones and temperature stratification, further improving the temperature control accuracy and operational stability of the entire temperature control device.

[0009] Optionally, the convection assembly is provided with a convection channel, which connects the first liquid inlet, the first liquid outlet and the second liquid outlet. The convection assembly also includes a convection generator, which is disposed in the convection channel and is disposed opposite to the first liquid inlet along the second direction.

[0010] In the above scheme, this arrangement can form a stable and orderly internal flow field, avoid eddies, backflow or flow dead zones, and further improve the temperature uniformity of the heat transfer medium.

[0011] Optionally, the temperature control device further includes a drive assembly, which is disposed outside the convection channel. The power output end of the drive assembly is provided with a first magnetic element, and the convection generator is constructed as a second magnetic element. The convection generator also includes a housing, which is provided with a convection channel. The second magnetic element is rotatably disposed on the housing and is adapted to rotate under the drive of the first magnetic element. Along the second direction, the first magnetic element and the second magnetic element are disposed opposite to each other.

[0012] In the above scheme, the first magnetic component and the second magnetic component can realize non-contact driving of the driving component and the convection component, thereby ensuring the sealing of the first accommodating cavity.

[0013] Optionally, the heat dissipation component includes a semiconductor cooler, and the housing has a first opening that connects the first receiving cavity to the outside. The cold end of the semiconductor cooler passes through the first opening and extends into the first receiving cavity.

[0014] In the above scheme, the first opening can shorten the heat exchange path of the semiconductor cooler, improve heat exchange efficiency and temperature control response speed.

[0015] Optionally, the heat dissipation assembly also includes a liquid cooling head, the hot end of the semiconductor cooler is attached to the liquid cooling head, the liquid cooling head has a second liquid inlet and a third liquid outlet, and the liquid cooling head has a cooling channel inside, which is connected to the second liquid inlet and the third liquid outlet.

[0016] In the above scheme, the liquid cooling head can dissipate heat from the thermoelectric cooler, ensuring the heat dissipation efficiency and temperature control accuracy of the thermoelectric cooler.

[0017] Optionally, the thermoelectric cooler is constructed as a plate-like structure, with the cold end and hot end of the thermoelectric cooler arranged opposite each other along the thickness direction of the thermoelectric cooler, and the thickness direction, the first direction and the second direction of the thermoelectric cooler being perpendicular to each other.

[0018] In the above scheme, the plate structure increases the heat exchange area between the heat-conducting medium and the semiconductor cooler, thereby improving the temperature control accuracy and efficiency.

[0019] Optionally, the first receiving cavity includes a first sub-cavity and a second sub-cavity, the microfluidic chip placement holder is located in the first sub-cavity, the second sub-cavity is adapted to contain the reagent tube, and along the second direction, the second sub-cavity is located on the side of the first sub-cavity away from the convection assembly.

[0020] In the above scheme, the first sub-cavity and the second sub-cavity are beneficial for stabilizing and controlling the chip operating temperature and the reagent storage temperature respectively, thereby improving the temperature control accuracy and temperature uniformity.

[0021] Optionally, the temperature control device also includes a mixing tube disposed in the mixing area, the mixing tube extending along a second direction, the mixing tube having a third inlet and a fourth outlet, the fourth outlet being closer to the first inlet than the third inlet.

[0022] In the above scheme, the mixing pipe can make the temperature of the heat-conducting medium entering the convection component more uniform, which helps to further improve the temperature uniformity inside the first accommodating cavity.

[0023] Optionally, the housing includes an inner housing, an outer housing, and an air cavity. The inner housing has a first receiving cavity, the outer housing is disposed outside the inner housing, and the air cavity is located between the inner housing and the outer housing.

[0024] In the above scheme, the air cavity can reduce the heat exchange between the inside and outside of the shell, and further improve the temperature uniformity of the heat-conducting medium.

[0025] The beneficial effects of this application are: it enables the heat-conducting medium after heat exchange by the heat dissipation component and the heat-conducting medium after heat exchange by the microfluidic chip to be fully mixed in the mixing area in advance, effectively avoiding local excessively high or low temperatures, improving the overall temperature uniformity of the heat-conducting medium, constructing a multi-layer convection structure in the first accommodating cavity, further enhancing the medium disturbance and heat exchange effect, and significantly improving temperature control accuracy, temperature uniformity and response speed. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the overall structure of the temperature control device in some embodiments of this application; Figure 2 This is a top view of the temperature control device in some embodiments of this application; Figure 3 for Figure 2 Schematic diagram of the cross-sectional structure along the AA direction; Figure 4 for Figure 2 Schematic diagram of the cross-sectional structure in the middle BB direction; Figure 5 This is a schematic diagram of the structure of the heat dissipation component in some embodiments of this application; Figure 6 This is a top view of the heat dissipation assembly in some embodiments of this application; Figure 7 Figure 6 shows a schematic cross-sectional view of the structure along the CC direction. Figure 8 This is a schematic diagram of the structure of the driving component in some embodiments of this application; Figure 9 This is a schematic diagram of the mixing tube in some embodiments of this application.

[0028] [Explanation of Labels in the Attached Image] 100. Shell; 101. First receiving cavity; 101a. Mixing region; 101b. First sub-cavity; 101c. Second sub-cavity; 102. First opening; 100a, Inner shell; 100b, Outer shell; 100c, Air cavity; 200. Microfluidic chip placement rack; 300. Heat dissipation components; 310. Semiconductor coolers; 320. Liquid cooling head; 321. Second liquid inlet; 322. Third liquid outlet; 323. Cooling channel; 400. Convection components; 410. Outer casing; 411. First liquid inlet; 412. First liquid outlet; 413. Second liquid outlet; 414. Convection channel; 420. Convection generator; 421. Second magnetic component; 500, Drive assembly; 510, First magnetic component; 600, Mixing tube; 610, Third inlet; 620, Fourth outlet; X, the first direction; Y, the second direction. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0030] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used in the description of this application is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms "comprising" and "having," and any variations thereof, in the description, claims, and accompanying drawings of this application are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the description, claims, or accompanying drawings of this application are used to distinguish different objects, not to describe a specific order or hierarchy.

[0031] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0032] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0033] Microfluidic chip technology, as a technique for manipulating tiny fluids in micrometer-scale channels, has been widely applied in many cutting-edge fields such as liquid microflow measurement and calibration, microchemical synthesis, biomedical detection (e.g., PCR amplification, cell culture, protein analysis), and environmental monitoring due to its outstanding advantages such as low sample consumption, fast analysis speed, and high integration. In most microfluidic applications, precise, rapid, and uniform temperature control of the reaction system is the key to achieving specific chemical reactions, ensuring biological activity, and improving detection accuracy and repeatability.

[0034] For example, in digital PCR, temperature uniformity directly affects amplification efficiency; in microchemical continuous flow reactions, constant temperature is a prerequisite for ensuring the purity and yield of reaction products.

[0035] Currently, temperature control methods for microfluidic chips and reagents mainly include air-cooled / air-bath temperature control, contact temperature control, and liquid bath temperature control. Air-cooled / air-bath temperature control achieves temperature control by regulating the ambient air temperature. This method is simple in structure, but suffers from slow temperature change rates, low temperature control accuracy, and susceptibility to environmental interference, making it difficult to meet the demands of high-precision microfluidic experiments. Contact temperature control typically combines a Peltier plate (TEC) with a metal heatsink, achieving heating or cooling by ensuring close contact between the chip and the heatsink. This method improves temperature control rate and accuracy, but its performance heavily relies on the contact quality between the chip and the heatsink, resulting in contact thermal resistance and potentially leading to uneven temperature distribution.

[0036] In addition, it is difficult to ensure good and uniform contact for chips with non-standard shapes or complex interfaces; liquid bath temperature control immerses the entire microfluidic chip in a constant temperature liquid (such as oil or water). This method takes advantage of the high thermal conductivity of liquids and can theoretically achieve good temperature uniformity.

[0037] However, traditional liquid bath temperature control is bulky, slow in response, and unsuitable for microfluidic chip observation. In summary, existing temperature control technologies, when applied to microfluidic chips and reagents, suffer from insufficient temperature uniformity, slow thermal response, and poor adaptability to chip structures.

[0038] The following describes in detail, with reference to the accompanying drawings, a convection-enhanced liquid bath temperature control device for microfluidic chips and reagents proposed in this application.

[0039] like Figure 1 , Figure 2 and Figure 3 As shown, a convection-enhanced liquid bath temperature control device for microfluidic chips and reagents, according to an embodiment of the first aspect of this application, includes a housing 100, a microfluidic chip placement rack 200, a heat dissipation component 300, and a convection component 400.

[0040] The housing 100 has a first receiving cavity 101 inside, and a heat-conducting medium is disposed in the first receiving cavity 101; specifically, the heat-conducting medium includes oil, water or other liquid media.

[0041] The microfluidic chip placement holder 200 is disposed in the first receiving cavity 101; specifically, the microfluidic chip placement holder 200 can fix the microfluidic chip in the first receiving cavity 101, thereby helping to keep the temperature of the microfluidic chip constant under the flow of the heat-conducting medium.

[0042] The heat dissipation component 300 is disposed in the housing 100 and is at least partially located in the first receiving cavity 101. Along the first direction X, the heat dissipation component 300 and the microfluidic chip placement rack 200 are spaced apart to form a mixing region 101a. The heat dissipation component 300 is adapted to exchange heat with the heat-conducting medium.

[0043] It is understandable that the heat dissipation component 300 can absorb the heat of the heat-conducting medium, thereby reducing the temperature of the heat-conducting medium flowing through the heat dissipation component 300. Specifically, a part of the heat-conducting medium can absorb the heat of the microfluidic chip to form a medium with a relatively higher temperature, while another part of the heat-conducting medium is cooled by the heat dissipation component 300 to form a medium with a relatively lower temperature. As the medium temperature decreases and the density increases, along the first direction X, the heat-conducting medium with a relatively lower temperature is located below the heat-conducting medium with a relatively higher temperature. The first direction X can be the up and down direction.

[0044] This configuration allows heat-conducting media with relatively lower and higher temperatures to mix in the mixing region 101a, thereby reducing the temperature gradient and minimizing temperature stratification.

[0045] Meanwhile, when part of the heat dissipation component 300 is located in the first receiving cavity 101, the part of the heat dissipation component 300 located in the first receiving cavity 101 can directly exchange heat with the heat-conducting medium. When the entire heat dissipation component 300 is located in the first receiving cavity 101, the heat exchange area between the heat dissipation component 300 and the heat-conducting medium can be further increased.

[0046] A convection assembly 400 is disposed on the housing 100. The convection assembly 400 is adapted to agitate the heat-conducting medium in the first receiving cavity 101. The convection assembly 400 has a first liquid inlet 411, a first liquid outlet 412 and a second liquid outlet 413. Along the second direction Y, the first liquid inlet 411 is at least partially opposite to the mixing region 101a. Along the first direction X, the first liquid inlet 411 is located between the first liquid outlet 412 and the second liquid outlet 413. The first liquid outlet 412 is closer to the microfluidic chip placement rack 200 than the second liquid outlet 413. The first direction X and the second direction Y are perpendicular.

[0047] As an example, the microfluidic chip placement rack 200 and the heat dissipation assembly 300 are respectively located at least close to any one of the first liquid inlet 411, the first liquid outlet 412 and the second liquid outlet 413. That is, along the second direction Y, the microfluidic chip placement rack 200 and the heat dissipation assembly 300 can both be arranged opposite to the first liquid outlet 412 or the second liquid outlet 413, or one of them can be opposite to the first liquid outlet 412 and the other can be opposite to the second liquid outlet 413, or both of them can be arranged opposite to the first liquid inlet 411.

[0048] Understandably, the mixed heat-conducting medium can enter from the first inlet 411, with a portion flowing out from the first outlet 412 to control the temperature of the microfluidic chip at the microfluidic chip placement rack 200, and the other portion flowing out from the second outlet 413 to flow through the heat dissipation component 300 for heat exchange. Finally, it is mixed in the mixing region 101a, which greatly improves the uniformity of the heat-conducting medium in the first receiving cavity 101. This avoids the heat-conducting medium flowing directly to the microfluidic chip at the microfluidic chip placement rack 200 after being cooled by the heat dissipation component 300, thereby reducing the temperature gradient in the first receiving cavity 101. At the same time, it can prevent the relatively low-temperature heat-conducting medium from sinking to the bottom of the first receiving cavity 101 due to increased density.

[0049] According to the first aspect of this application, the convection-enhanced liquid bath temperature control device for microfluidic chips and reagents enables the heat-conducting medium after heat exchange with the heat dissipation component 300 and the heat-conducting medium after heat exchange with the microfluidic chip at the microfluidic chip placement rack 200 to be fully mixed in the mixing region 101a beforehand, effectively avoiding local overheating or underheating and improving the overall temperature uniformity of the heat-conducting medium. Simultaneously, the convection component 400 is provided with a first liquid outlet 412 and a second liquid outlet 413, with the first liquid outlet 412 being closer to the microfluidic chip than the second liquid outlet 413. This forms two directional and orderly medium circulation paths: one flows directly to the microfluidic chip for precise temperature control, and the other flows back to the heat dissipation component 300 for further heat exchange, thereby constructing a multi-layer convection structure within the first accommodating cavity 101, further enhancing the medium disturbance and heat exchange effect.

[0050] The first liquid inlet 411 is positioned opposite to the mixing region 101a, which allows the uniformly mixed heat-conducting medium to smoothly enter the convection component 400, ensuring a stable flow field, low flow resistance, and improved convection drive efficiency. At the same time, it ensures that the convection direction and the heat exchange direction are coordinated, avoiding flow field turbulence and temperature stratification, and significantly improving the temperature control accuracy, temperature uniformity, and temperature control efficiency of the microfluidic chip placement rack 200 area.

[0051] In some embodiments, such as Figure 3 As shown, along the second direction Y, the first liquid outlet 412 is at least partially opposite to the microfluidic chip placement rack 200, and the second liquid outlet 413 is at least partially opposite to the heat dissipation assembly 300.

[0052] This allows the heat transfer medium driven by the convection component 400 to flow directly to the microfluidic chip at the microfluidic chip placement rack 200, shortening the medium flow path and improving the heat exchange efficiency and temperature uniformity in the microfluidic chip placement rack 200 area. It also prevents excessive local temperature differences caused by flow field deviation, ensuring stable and controllable microfluidic chip temperature. Simultaneously, it allows the returning heat transfer medium to flow directly and centrally to the heat dissipation component 300 for further cooling, improving the cooling efficiency of the heat dissipation component 300 and enabling the heat transfer medium to quickly return to the set temperature.

[0053] The two liquid outlets correspond to the microfluidic chip placement rack 200 and the heat dissipation component 300, respectively. They can form two clear and orderly circulating flow fields in the first accommodating cavity 101, avoid mutual interference of medium flow, reduce flow dead zones and temperature stratification, and further improve the temperature control accuracy and operational stability of the entire temperature control device.

[0054] In some embodiments, such as Figure 3 and Figure 4 As shown, the convection assembly 400 is provided with a convection channel 414, which connects the first liquid inlet 411, the first liquid outlet 412 and the second liquid outlet 413. The convection assembly 400 also includes a convection generator 420, which is disposed in the convection channel 414 along the second direction Y, and is disposed opposite to the first liquid inlet 411.

[0055] The convection generator 420 directly drives the heat transfer medium entering the convection channel 414, making the flow of the heat transfer medium smoother and the power transmission more direct, reducing flow resistance and energy loss, and improving the convection driving efficiency. Simultaneously, this arrangement allows the heat transfer medium to be rapidly disturbed and accelerated after entering the convection channel 414, which is beneficial for quickly and uniformly guiding the mixed heat transfer medium to the first outlet 412 and the second outlet 413, forming a stable and orderly internal flow field, avoiding eddies, backflow, or flow dead zones, and further improving the temperature uniformity of the heat transfer medium. Furthermore, the convection generator 420 is positioned directly opposite the inlet, which enhances the suction and pushing effect on the medium, making the flow distribution of the two circulating media more stable, and improving the temperature control accuracy and operational stability of the temperature control device.

[0056] In some embodiments, such as Figure 4 and Figure 8 As shown, the temperature control device also includes a drive assembly 500, which is disposed on the outside of the convection channel 414. The power output end of the drive assembly 500 is provided with a first magnetic element 510. The convection generator 420 is constructed as a second magnetic element 421. The convection generator 420 also includes a housing 410, which is provided with the convection channel 414. The second magnetic element 421 is rotatably disposed on the housing 410 and is adapted to rotate under the drive of the first magnetic element 510. Along the second direction Y, the first magnetic element 510 and the second magnetic element 421 are disposed opposite to each other.

[0057] This configuration enables non-contact driving between the drive assembly 500 and the convection assembly 400, avoiding the need for through structures such as shaft holes in the housing 100. This ensures the sealing of the first accommodating cavity 101, prevents leakage of the heat transfer medium and the entry of external moisture and impurities into the interior, and improves operational reliability.

[0058] Meanwhile, non-contact magnetic drive can reduce mechanical friction and transmission noise, reduce the interference of vibration on microfluidic chips, help maintain a stable flow field and temperature field, and improve temperature control accuracy and experimental stability.

[0059] Furthermore, arranging the first magnetic element 510 and the second magnetic element 421 opposite each other along the second direction Y can make the magnetic transmission more stable and uniform, ensure the stable rotation speed of the convection generator 420, and thus make the convection intensity and flow field distribution of the heat-conducting medium more controllable, further improving the temperature uniformity of the heat-conducting medium.

[0060] Specifically, the magnetism of the first magnetic element 510 may be different from that of the second magnetic element 421. When the first magnetic element 510 rotates under the drive of the drive assembly 500, the second magnetic element 421 rotates due to the repulsive magnetic force. The rotation of the second magnetic element 421 agitates the heat-conducting medium, and the heat-conducting medium generates radial or axial flow under the rotation drive of the second magnetic element 421, thereby forming convection in the first receiving cavity 101 and improving the temperature uniformity of the heat-conducting medium at different positions.

[0061] The first magnetic element 510 can have the same magnetism as the second magnetic element 421. When the first magnetic element 510 rotates under the drive of the drive assembly 500, the second magnetic element 421 rotates due to the magnetic attraction. The rotation of the second magnetic element 421 agitates the heat-conducting medium, and the heat-conducting medium forms convection in the first accommodating cavity 101, which greatly accelerates the heat transfer efficiency, thereby achieving higher control precision, better temperature uniformity and faster temperature response.

[0062] In a specific embodiment, a portion of the first magnetic element 510 and a portion of the second magnetic element 421 are arranged opposite to each other. The first magnetic element 510 can be constructed as an elliptical structure, and the second magnetic element 421 can be constructed as a spindle-shaped structure. The second magnetic element 421 forms a low-pressure zone by rotating and stirring the heat-conducting medium, and entrains the heat-conducting medium in the mixing region 101a.

[0063] In some embodiments, such as Figure 5 As shown, the heat dissipation assembly 300 includes a semiconductor cooler 310. The housing 100 has a first opening 102, which connects the first receiving cavity 101 to the outside. The cold end of the semiconductor cooler 310 passes through the first opening 102 and extends into the first receiving cavity 101.

[0064] Specifically, the outer surface of the cold end of the semiconductor cooler 310 is flush with the inner wall of the first receiving cavity 101.

[0065] By opening a first opening 102 in the housing 100 and allowing the cold end of the semiconductor cooler 310 to extend directly into the first receiving cavity 101, the heat exchange path can be shortened, the thermal resistance and heat loss caused by intermediate heat transfer links can be reduced, and the cold end can directly exchange heat with the heat-conducting medium, which significantly improves the heat exchange efficiency and temperature control response speed.

[0066] Meanwhile, the semiconductor cooler 310 is directly assembled through the first opening 102, which is simple in structure, reliable in positioning, easy to disassemble and install and maintain, and helps to improve assembly efficiency.

[0067] In addition, the cold end extends directly into the liquid bath, which allows the cooling energy to be diffused more evenly into the heat-conducting medium, avoiding sudden cooling or temperature stratification in some areas. This further ensures stable and uniform temperature in the microfluidic chip placement rack 200 area, improving the temperature control accuracy and operational reliability of the entire temperature control device.

[0068] In some embodiments, such as Figure 6 and Figure 7 As shown, the heat dissipation assembly 300 also includes a liquid cooling head 320, the hot end of the semiconductor cooler 310 is attached to the liquid cooling head 320, the liquid cooling head 320 has a second liquid inlet 321 and a third liquid outlet 322, and the liquid cooling head 320 has a cooling channel 323 inside, which is connected to the second liquid inlet 321 and the third liquid outlet 322.

[0069] By tightly attaching the hot end of the thermoelectric cooler 310 to the liquid cooling head 320 and setting a cooling channel 323 inside the liquid cooling head 320, the heat generated by the thermoelectric cooler 310 can be quickly and efficiently transferred to the cooling medium inside the liquid cooling head 320, thereby achieving continuous and stable heat dissipation of the hot end, avoiding a decrease in cooling efficiency due to heat accumulation in the thermoelectric cooler 310, and ensuring the heat dissipation efficiency and temperature control accuracy of the thermoelectric cooler 310.

[0070] Meanwhile, the liquid cooling head 320 forms an independent closed-loop cooling circuit through the second liquid inlet 321 and the third liquid outlet 322, which can flexibly adjust the cooling flow rate and heat dissipation intensity according to temperature control requirements, thereby improving the controllability and adaptability of the heat dissipation system. The independent cooling channel 323 can avoid mutual interference between the heat-conducting medium and the liquid cooling medium, ensuring the stability of the temperature field within the first accommodating cavity 101, and further improving the temperature control accuracy and temperature uniformity of the microfluidic chip placement rack 200 area.

[0071] In some embodiments, the semiconductor cooler 310 is configured as a plate-like structure, with the cold end and the hot end of the semiconductor cooler 310 arranged opposite each other along the thickness direction of the semiconductor cooler 310, and the thickness direction, the first direction X, and the second direction Y of the semiconductor cooler 310 being perpendicular to each other.

[0072] The above structure can increase the heat exchange area between the cold end and the heat-conducting medium, making the heat exchange between the semiconductor cooler 310 and the heat-conducting medium more sufficient and uniform. This is beneficial to improving heat exchange efficiency, ensuring the temperature uniformity of the heat-conducting medium, forming a stable and orderly flow field and temperature field, avoiding local temperature unevenness or flow dead zones due to chaotic heat exchange direction, further ensuring the temperature stability and uniformity of the area where the microfluidic chip is located, and improving temperature control accuracy and device operation reliability.

[0073] On the other hand, the plate-like structure has a regular layout and occupies little space, which can better fit the internal space of the shell 100, making it easier to achieve a compact arrangement in the first accommodating cavity 101 and improve the integration of the device.

[0074] When the thermoelectric cooler 310 is working, it absorbs heat from the heat-conducting medium through the cold end and releases heat through the hot end, thereby achieving heat dissipation of the heat-conducting medium and ensuring the temperature uniformity of the heat-conducting medium. The plate-like structure increases the heat exchange area between the heat-conducting medium and the thermoelectric cooler 310 and extends the heat exchange path, ensuring that the temperature of the heat-conducting medium flowing through the thermoelectric cooler 310 is relatively low when it mixes with the heat-conducting medium flowing through the microfluidic chip, thus improving the temperature control accuracy and efficiency.

[0075] In some embodiments, such as Figure 3 As shown, the first receiving cavity 101 includes a first sub-cavity 101b and a second sub-cavity 101c. The microfluidic chip placement rack 200 is located in the first sub-cavity 101b, and the second sub-cavity 101c is adapted to accommodate a reagent tube. Along the second direction Y, the second sub-cavity 101c is located on the side of the first sub-cavity 101b away from the convection assembly 400.

[0076] It can realize the partitioned arrangement of microfluidic chip and reagent tube, so that the microfluidic chip and reagent tube are in relatively independent temperature control areas, avoiding mutual interference between the temperature of microfluidic chip and reagent tube, which is conducive to the stable control of chip operating temperature and reagent storage temperature, and improving temperature control accuracy.

[0077] Meanwhile, the first sub-cavity 101b and the second sub-cavity 101c are arranged sequentially along the second direction Y, which can work with the convection component 400 to form an orderly and stable convection flow field, so that the heat conduction medium can flow through the chip area and the reagent area sequentially according to the preset path, reducing flow dead zones and temperature stratification, and further improving the temperature uniformity of the entire first accommodating cavity 101.

[0078] Furthermore, integrating the microfluidic chip and reagent tube into different sub-cavities of the same housing 100 can improve the space utilization of the device, realize the integrated chip temperature control and reagent temperature control, make the structure more compact, facilitate assembly, operation and subsequent maintenance, and at the same time improve the stability and reliability of microfluidic experiments.

[0079] In some embodiments, such as Figure 9 As shown, the temperature control device also includes a mixing tube 600, which is disposed in the mixing region 101a. The mixing tube 600 extends along the second direction Y and has a third inlet 610 and a fourth outlet 620. The fourth outlet 620 is closer to the first inlet 411 than the third inlet 610.

[0080] Specifically, the heat-conducting medium cooled by the heat dissipation component 300 and the heat-conducting medium passed through the microfluidic chip can enter the mixing tube 600 through the third inlet 610, where they are mixed. The mixed heat-conducting medium can then flow out through the fourth outlet 620 and enter the first inlet 411. A portion of the heat-conducting medium entering the first inlet 411 flows out through the first outlet 412, and the other portion flows out through the second outlet 413.

[0081] The heat-conducting medium flowing out from the first outlet 412 flows through the microfluidic chip placement rack 200, thereby achieving heat exchange with the microfluidic chip. The heat-conducting medium flowing out from the first outlet 412 subsequently repeats the above process, thereby ensuring that the temperature of the microfluidic chip is stable and uniform throughout.

[0082] The heat-conducting medium flowing out from the second outlet 413 flows through the heat dissipation component 300 again, thereby being cooled by the heat dissipation component 300. At the same time, multi-layer convection is formed in the first receiving cavity 101, which further improves the temperature uniformity of the heat-conducting medium in the first receiving cavity 101.

[0083] Meanwhile, since the mixing tube 600 can form an independent mixing region 101a in the first accommodating cavity 101, the relatively low temperature heat-conducting medium cooled by the heat dissipation component 300 and the relatively high temperature heat-conducting medium after heat exchange by the microfluidic chip can be fully mixed in the mixing tube 600, so that the temperature of the heat-conducting medium entering the convection component 400 is more uniform, avoiding the occurrence of local overcooling or overheating, and significantly improving the temperature uniformity in the first accommodating cavity 101.

[0084] In addition, the mixed heat-conducting medium flows out from the first outlet 412 at a more uniform and stable temperature, which can reduce the impact of temperature fluctuations on the microfluidic chip, make it easier to maintain the target temperature, and help improve temperature control accuracy.

[0085] The heat-conducting medium flowing out from the first outlet 412 flows to the microfluidic chip in the microfluidic chip placement rack 200, and the heat-conducting medium flowing out from the second outlet 413 flows back to the heat dissipation assembly 300. Multi-layer circulation convection is formed in the first receiving cavity 101, so that the heat-conducting medium inside the housing 100 is continuously agitated and fully heat-exchanged, further improving the overall temperature uniformity. The two heat-conducting media form orderly convection in the housing 100, which can effectively eliminate dead zones in the flow of heat-conducting media and temperature stratification, and improve the temperature uniformity inside the first receiving cavity 101.

[0086] In some embodiments, such as Figure 3As shown, the housing 100 includes an inner housing 100a, an outer housing 100b, and an air cavity 100c. The inner housing 100a has a first receiving cavity 101, the outer housing 100b is disposed outside the inner housing 100a, and the air cavity 100c is located between the inner housing 100a and the outer housing 100b.

[0087] Specifically, the housing 100 can be constructed as a double-layer structure, with the inner housing 100a and the outer housing 100b being constructed as a single integral part, or the inner housing 100a and the outer housing 100b being detachably connected.

[0088] This design effectively blocks external heat from entering the first accommodating cavity 101 or the heat in the first accommodating cavity 101 from being transferred to the outside, reducing heat exchange between the inside and outside of the shell 100, reducing the interference of the external ambient temperature on the internal liquid bath heat-conducting medium, making the temperature of the heat-conducting medium more stable and uniform, and helping to improve the temperature control accuracy and uniformity of the temperature control device.

[0089] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0090] The above description is merely an embodiment of this application and is not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

[0091] Although embodiments of this application have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of this application, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A counterflow enhanced liquid bath temperature control device for microfluidic chips and reagents, characterized in that, include: The housing has a first receiving cavity inside, and a heat-conducting medium is disposed inside the first receiving cavity; A microfluidic chip placement rack is disposed in the first accommodating cavity; A heat dissipation component is disposed in the housing and at least partially located within the first accommodating cavity. Along a first direction, the heat dissipation component and the microfluidic chip placement rack are spaced apart to form a mixing region. The heat dissipation component is adapted to exchange heat with the thermally conductive medium. A convection assembly is disposed in the housing. The convection assembly is adapted to agitate the heat-conducting medium in the first accommodating cavity. The convection assembly has a first liquid inlet, a first liquid outlet, and a second liquid outlet. Along a second direction, the first liquid inlet is at least partially opposite to the mixing region. Along the first direction, the first liquid inlet is located between the first liquid outlet and the second liquid outlet. The first liquid outlet is closer to the microfluidic chip placement rack than the second liquid outlet. The first direction and the second direction are perpendicular.

2. The temperature control device of claim 1, wherein Along the second direction, the first liquid outlet is at least partially opposite to the microfluidic chip placement rack, and the second liquid outlet is at least partially opposite to the heat dissipation component.

3. The temperature control device of claim 1, wherein, The convection assembly is provided with a convection channel, which connects the first liquid inlet, the first liquid outlet and the second liquid outlet. The convection assembly also includes a convection generator, which is disposed in the convection channel along the second direction and is disposed opposite to the first liquid inlet.

4. The temperature control device of claim 3, wherein The temperature control device further includes a drive assembly disposed outside the convection channel. The drive assembly has a first magnetic element at its power output end. The convection generator is constructed as a second magnetic element. The convection generator also includes a housing with the convection channel. The second magnetic element is rotatably disposed on the housing and is adapted to rotate under the drive of the first magnetic element. Along the second direction, the first magnetic element and the second magnetic element are disposed opposite to each other.

5. The temperature control device of claim 1, wherein, The heat dissipation component includes a semiconductor cooler. The housing has a first opening that connects the first accommodating cavity to the outside. The cold end of the semiconductor cooler passes through the first opening and extends into the first accommodating cavity.

6. The temperature control device of claim 5, wherein, The heat dissipation assembly also includes a liquid cooling head, the hot end of the semiconductor cooler is attached to the liquid cooling head, the liquid cooling head has a second liquid inlet and a third liquid outlet, and the liquid cooling head has a cooling channel inside, which is connected to the second liquid inlet and the third liquid outlet.

7. The temperature control device of claim 6, wherein The semiconductor cooler is constructed as a plate-like structure. Along the thickness direction of the semiconductor cooler, the cold end and the hot end of the semiconductor cooler are arranged opposite each other, and the thickness direction, the first direction, and the second direction of the semiconductor cooler are perpendicular to each other.

8. The temperature control device of claim 1, wherein, The first accommodating cavity includes a first sub-cavity and a second sub-cavity. The microfluidic chip placement holder is located in the first sub-cavity, and the second sub-cavity is adapted to accommodate a reagent tube. Along the second direction, the second sub-cavity is located on the side of the first sub-cavity away from the convection component.

9. The temperature control device of claim 3, wherein, The temperature control device further includes a mixing tube disposed in the mixing area. The mixing tube extends along the second direction and has a third inlet and a fourth outlet. The fourth outlet is closer to the first inlet than the third inlet.

10. The temperature control device according to claim 1, characterized in that, The housing includes an inner housing, an outer housing, and an air cavity. The inner housing has the first receiving cavity, the outer housing is disposed outside the inner housing, and the air cavity is located between the inner housing and the outer housing.

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