Photocuring modified fluorocarbon resin as well as preparation method and application thereof

By introducing allyl double bonds into the side chain of fluorocarbon resin through the Williamson etherification reaction, the photocurable modified fluorocarbon resin prepared solves the problems of etching resistance and film removal of UTG etching materials, and realizes rapid UV curing and clean film removal, which is suitable for efficient production of UTG.

CN122302131APending Publication Date: 2026-06-30CHANGSHA DIAT NEW MATERIAL SCI & TECH
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Patent Information

Application Number
CN202610690911.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-05-19
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

Existing UTG etching protection materials cannot simultaneously withstand HF acid etching and NaOH alkaline etching. It is difficult to balance photocuring and etching resistance. The process is complex and costly, and the contradiction between film removal and protection is prominent.

Method used

A photocurable modified fluorocarbon resin was prepared by introducing allyl double bonds into the side chain of fluorocarbon resin using the Williamson etherification reaction. The resulting film is resistant to both HF and NaOH, and can be rapidly formed by UV curing. The film can also be cleanly removed after etching.

Benefits of technology

It achieves dual tolerance to HF and NaOH, shortens curing time, reduces energy consumption and cost, improves production efficiency, and meets the high-precision processing requirements of UTG.

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Abstract

The invention relates to the technical field of high polymer materials, and discloses light-cured modified fluorocarbon resin as well as a preparation method and application thereof. The method comprises the following steps: (1) mixing hydroxyl-containing fluorocarbon resin with an organic solvent to obtain a resin solution with the concentration of 30-50wt%; (2) contacting the resin solution with an allyl halide and an acid-binding agent, and carrying out a first reaction under the protection of inert gas to obtain a mixture I; and (3) sequentially filtering the mixture I to remove inorganic salt, washing to be neutral, dehydrating and concentrating to obtain the photocuring modified fluorocarbon resin. The photocuring modified fluorocarbon resin provided by the invention is suitable for dual process protection of UTG acid etching and alkali etching, realizes no-residue stripping, has low surface roughness Ra value of stripped UTG, has the advantages of strong etching resistance, fast curing speed, simple process and low cost, and is suitable for large-scale production of folding screen UTG.
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