Manufacturing process of copper-nickel-silicon alloy for server connectors

By optimizing the component ratio and preparation process of copper-nickel-silicon alloy, and by adopting continuous extrusion, solution treatment and multi-stage aging treatment, the problem of high production cost was solved, the strength and conductivity of copper-nickel-silicon alloy were improved, and the equipment requirements were reduced.

CN122303652APending Publication Date: 2026-06-30NINGBO XINGAODA ADVANCED METALLIC MATERIALS
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
NINGBO XINGAODA ADVANCED METALLIC MATERIALS
Filing Date
2026-05-07
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

The production cost of copper-nickel-silicon alloy for existing server connectors is high, and the equipment costs and space requirements are large, resulting in weak competitiveness.

Method used

The proportions of nickel, silicon, magnesium, and other components are optimized, and a preparation process involving continuous extrusion, solution treatment, cold rolling, and multi-stage aging treatment is adopted, including preheating, water quenching, cold rolling, and multi-stage aging treatment, to form a supersaturated solid solution and high-density slip band, which promotes the precipitation and strengthening of the Ni2Si phase.

Benefits of technology

It reduces production costs, improves the strength and conductivity of copper-nickel-silicon alloys, and achieves both equipment savings and performance enhancement.

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Abstract

This invention discloses a preparation process for copper-nickel-silicon alloys for server connectors. This scheme optimizes the proportions of components such as nickel, silicon, and magnesium, and specifically designs the preparation process. Continuous extrusion causes dynamic recrystallization of the ingot, followed by solution treatment to form a supersaturated solid solution. High-density slip bands are generated during cold rolling. During the first-stage aging treatment, the reduction of shear bands promotes the growth of discontinuous Ni2Si phases. Fine cold rolling helps to combine precipitation strengthening and work hardening to achieve a dual-mechanism superposition, further improving the strength and other properties of the copper-nickel-silicon alloy. Second-stage aging helps eliminate internal stress from cold rolling and promotes the precipitation of trace amounts of solute, thereby improving stress relaxation resistance and electrical conductivity. This invention optimizes the component proportions of the copper-nickel-silicon alloy and specifically designs the preparation process, eliminating the need for hot rolling equipment and reducing costs. The prepared copper-nickel-silicon alloy exhibits excellent strength and electrical conductivity.
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