Thin film deposition apparatus

Abstract

The thin film deposition apparatus of the present invention includes: a chamber forming a sealed space; a pumping pipe connected to the lower surface of the chamber; a heater configured to extend through the connection portion of the chamber and the pumping pipe; a main valve disposed at the rear end of the pumping pipe; a sub-valve forming a structure surrounding the heater and disposed at the connection portion of the chamber and the pumping pipe; and a motor connected to the sub-valve to operate the sub-valve, thereby enabling more precise adjustment of the pressure in the chamber by means of the sub-valve, thereby improving the thin film deposition quality of the wafer.

Description

Technical Field

[0001] This invention relates to a thin film deposition apparatus, and more specifically, to a thin film deposition apparatus in which the pressure inside the chamber can be adjusted more precisely. Background Technology

[0002] In order to produce semiconductor chips using semiconductor wafers, it is necessary to form thin films for various purposes on the surface of the wafer. The deposition of such thin films is achieved by placing the wafer inside a chamber that can form a vacuum and plasma, and supplying a gas containing the components required for deposition, thereby attaching the thin film components generated by a chemical reaction to the surface of the wafer.

[0003] According to existing thin film deposition apparatuses, a pumping pipe is connected to the bottom surface of the chamber, a vacuum pump is connected to the pumping pipe, and a valve is provided in the pumping pipe.

[0004] Therefore, the vacuum pump can create a vacuum by discharging air from inside the chamber to the outside, and the vacuum pressure of the chamber can be adjusted by regulating the opening degree of the valve.

[0005] However, in existing thin-film deposition apparatuses, because a pressure gauge is installed in the pumping line, it is impossible to accurately measure the pressure inside the chamber where the actual process is performed. More accurately, the pressure gauge measures the pressure in the pumping line, not the pressure in the chamber.

[0006] Furthermore, in existing thin film deposition apparatuses, due to the presence of a valve at the rear end of the pumping pipe, it is difficult to precisely regulate the pressure inside the chamber used to perform the process.

[0007] On the other hand, in order to more precisely regulate the pressure of the chamber, preferably, a valve is provided at the connection between the chamber and the pumping pipe, that is, at the inlet (front end) of the pumping pipe.

[0008] However, since the heater supporting the wafer is mounted through the interior of the pumping pipe, it is difficult to install a valve for regulating the pressure in the chamber at the inlet of the pumping pipe.

[0009] Prior art refers to technical information that the inventor possesses in order to derive this invention, or that is obtained in the process of deriving this invention, and is not necessarily publicly known technology that was disclosed to the general public before the application for this invention.

[0010] Existing technical documents

[0011] Patent documents

[0012] Patent Document 1: Korean Patent Publication No. 10-2023-0090898 (published on June 22, 2023) Summary of the Invention

[0013] The problem to be solved

[0014] In addressing the aforementioned problems, the object of the present invention is to provide a thin film deposition apparatus that can accurately measure the pressure inside the chamber where the deposition process is performed and can more precisely adjust the pressure inside the chamber.

[0015] The problems to be solved by the present invention are not limited to those mentioned above. Those skilled in the art to which this invention pertains can clearly understand from the following description other problems not mentioned.

[0016] Solution to the problem

[0017] According to one embodiment, the thin film deposition apparatus of the present invention may include: a chamber forming a sealed space; a pumping pipe connected to the lower surface of the chamber; a heater configured to extend through the connection portion of the chamber and the pumping pipe; a main valve disposed at the rear end of the pumping pipe; a sub-valve forming a structure surrounding the heater and disposed at the connection portion of the chamber and the pumping pipe; and a motor connected to the sub-valve to operate the sub-valve.

[0018] According to one embodiment, the sub-valve may include: a base plate, fixedly disposed at the connection between the chamber and the pumping pipe; a plurality of blades, one end of which is rotatably disposed on the base plate via a hinge pin and rotates toward the axial direction of the heater or the opposite direction to adjust the air passage area; and a drive plate, connected to the upper part of the plurality of blades, so that the plurality of blades can operate.

[0019] According to one embodiment, through holes with the same diameter as the inner diameter of the pumping pipe can be formed in the interior of each of the base plate and the drive plate. When the valve is fully open, the plurality of blades rotate toward the space between the base plate and the drive plate to fully open the through holes. When the valve is fully closed, the plurality of blades are configured to contact the shaft of the heater.

[0020] According to one embodiment, a drive pin may be formed protruding on the upper surface of the plurality of blades, and an arc-shaped guide groove inclined relative to the radial direction is formed on the drive plate. The drive pin is inserted into the guide groove, and when the drive plate is rotated, the drive pin moves along the guide groove, so that the blade is configured to rotate about the hinge pin.

[0021] According to one embodiment, the plurality of blades can be configured to overlap each other as part of an area, and the thickness of the entire overlapping blade is the same as the thickness of a single blade.

[0022] According to one embodiment, the plurality of blades can be configured such that the upper and lower surfaces are formed by a first cross-section, a second cross-section, and a third cross-section respectively, with a height difference. In the lower surface of the plurality of blades, the first cross-section is in surface contact with and slides against the upper surface of the base plate. In two adjacent blades, the first cross-section of the upper surface of one blade is in surface contact with and slides against the second cross-section of the lower surface of the other blade. The second cross-section of the upper surface of one blade is in surface contact with and slides against the third cross-section of the lower surface of the other blade. In the upper surface of the plurality of blades, the third cross-section is in surface contact with and slides against the lower surface of the drive plate.

[0023] According to one embodiment, the plurality of blades can be configured such that, when rotating, the opposing side portions of cross sections at the same height of two adjacent blades do not interfere with each other.

[0024] According to one embodiment, gear teeth may be formed on the outer peripheral surface of the drive plate, and the gear teeth may be configured to mesh with a drive gear disposed on the rotating shaft of the motor.

[0025] According to one embodiment, a first pressure gauge may be provided in the pumping pipeline, and a second pressure gauge may be provided in the chamber.

[0026] The effects of the invention

[0027] As described above, the thin film deposition apparatus of the present invention can accurately measure the pressure inside the chamber where the deposition process is performed, and can more precisely adjust the pressure inside the chamber.

[0028] The effects of the present invention are not limited to those mentioned above. Those skilled in the art to which this invention pertains can clearly understand other effects not mentioned from the following description. Attached Figure Description

[0029] Figure 1 This is a simplified structural diagram of a thin film deposition apparatus according to an embodiment of the present invention.

[0030] Figure 2 This is a perspective view of the sub-valve (drive plate separated), which is the main structure of the present invention.

[0031] Figure 3The following are perspective views of the blades, which are the main structure of the sub-valve: (a) is a planar perspective view, (b) is a bottom perspective view, (c) is a planar perspective view of two adjacent blades overlapping each other, and (d) is a bottom perspective view of two adjacent blades overlapping each other.

[0032] Figure 4 This is a front view showing the assembled state of the sub-valve.

[0033] Figure 5 This is a top view showing the sub-valve in its maximum open state.

[0034] Figure 6 This is a top view showing the sub-valve in its maximum closed state.

[0035] Figure 7 In order to be in Figure 5 The image shows the state of the driver board removed.

[0036] Figure 8 In order to be in Figure 6 The image shows the state of the driver board removed.

[0037] (Explanation of reference numerals in the attached diagram)

[0038] 10: Chamber 20: Pumping Pipeline

[0039] 30: Heater; 31: Shaft

[0040] 40: Main valve; 50: First pressure gauge

[0041] 60: Second pressure gauge; 100: Sub-valve

[0042] 110: Base plate; 111: Through hole

[0043] 112: Hinge pin; 120, 120': Blade

[0044] 121a, 121b: First section; 122a, 122b: Second section

[0045] 123a, 123b: Third section 130: Drive plate

[0046] 131: Through hole; 132: Guide groove Detailed Implementation

[0047] In this invention, the accompanying drawings may be exaggerated to facilitate differentiation from, clarity of, and mastery of the prior art. Furthermore, the terminology used below is defined in consideration of the functionality within this invention and may vary depending on the intent or convention of the user or operator; therefore, these terms should be defined based on the technical content of the entire specification. On the other hand, the embodiments are merely exemplary examples of structural elements presented within the scope of this invention and do not limit the scope of the invention, which should be interpreted based on the technical concept presented in the entire specification.

[0048] In the full text of the specification, when a structure "includes" another structure, unless specifically opposed, it means that other structures may also be included, without excluding the remaining structures.

[0049] Furthermore, when one structure is "connected," "linked," or "combined" with another structure, it implies a situation of "direct connection," "direct linking," or "direct combination," and it can also mean "connected with other structures in between," "linked with other structures in between," or "combined with other structures in between." Conversely, when one structure is "directly connected," "directly linked," or "directly combined" with another structure, it should be understood that there are no other structures in between.

[0050] Furthermore, when directional terms such as “front,” “back,” “up,” “down,” “left,” “right,” “one end,” “the other end,” and “both ends” are used, they are used exemplarily in relation to the direction of the disclosed diagram and therefore cannot be interpreted restrictively. When terms such as “first” and “second” are used, they are terms used to distinguish the various structures and cannot be interpreted restrictively.

[0051] To more clearly illustrate the features of the embodiments of the present invention, detailed descriptions of matters well known to those skilled in the art to which the following embodiments pertain are omitted. Furthermore, detailed descriptions of portions of the figures unrelated to the description of the embodiments are omitted.

[0052] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0053] Figure 1 This is a simplified structural diagram of the thin film deposition apparatus according to an embodiment of the present invention. Figure 2 This is a perspective view of the sub-valve, which is the main structure of the present invention (drive plate separated). Figure 3 The following are perspective views of the blades, which are the main structure of the sub-valve: (a) is a planar perspective view, (b) is a bottom perspective view, (c) is a planar perspective view of two adjacent blades overlapping each other, and (d) is a bottom perspective view of two adjacent blades overlapping each other.

[0054] and, Figure 4 This is a front view showing the assembled state of the sub-valve. Figure 5 A top view showing the sub-valve in its maximum open state. Figure 6 A top view showing the sub-valve in its maximum closed state. Figure 7 In order to be in Figure 5 The image showing the state of the driver board has been removed. Figure 8 In order to be in Figure 6 The image shows the state of the driver board removed.

[0055] Reference Figures 1 to 8 According to one embodiment, the thin film deposition apparatus includes a chamber 10, a pumping pipe 20, a heater 30, a main valve 40, a sub-valve 100, and a motor 200.

[0056] According to one embodiment, the thin film deposition apparatus may also house a first pressure gauge 50 and a second pressure gauge 60.

[0057] According to one embodiment, the thin film deposition apparatus of the present invention may include: a chamber 10 forming a sealed space; a pumping pipe 20 connected to the lower surface of the chamber 10; a heater 30 configured to pass through the connection portion of the chamber 10 and the pumping pipe 20; a main valve 40 disposed on the rear end side of the pumping pipe 20; a sub-valve 100 forming a structure surrounding the shaft 31 of the heater 30 and disposed on the connection portion of the chamber 10 and the pumping pipe 20; and a motor 200 connected to the sub-valve 100 to operate the sub-valve 100.

[0058] According to one embodiment, the chamber 10 forms a sealed space. The chamber 10 provides a space for receiving gases required for the process and for performing thin film deposition on a wafer under vacuum and plasma atmosphere. For this purpose, the chamber 10 includes various gas supply devices and a remote plasma source (RPS) device.

[0059] According to one embodiment, the pumping pipe 20 is connected to the lower surface of the chamber 10. Furthermore, the pumping pipe 20 is generally formed as a cylindrical tube and is connected to an opening formed on the lower surface of the chamber 10.

[0060] According to one embodiment, a vacuum pump (not shown) is provided in the pipeline connected to the pumping pipe 20. The vacuum pump is used to discharge the gas (air, process gas) inside the chamber 10 to the outside, thereby forming and maintaining the required level of vacuum pressure inside the chamber 10.

[0061] According to one embodiment, the pumping conduit 20 provides a passage for discharging gas from inside the chamber 10.

[0062] According to one embodiment, the heater 30 is a structure that supports the wafer inside the chamber 10 and heats the wafer at a suitable temperature during the process.

[0063] According to one embodiment, the heater 30 is configured such that it extends through the connection between the chamber 10 and the pumping pipe 20.

[0064] According to one embodiment, the heater 30 includes a disc-shaped support for supporting a wafer and a cylindrical shaft 31 connected to the center of the lower surface of the support. The support is located inside the chamber 10, and the shaft 31 extends vertically through the connection between the chamber 10 and the pumping pipe 20. Although not shown, the shaft 31 is configured to be connected to a lifting drive device to move the heater 30 in a vertical direction.

[0065] According to one embodiment, the main valve 40 is disposed at the rear end of the pumping pipeline 20.

[0066] According to one embodiment, the magnitude of the vacuum pressure formed in the chamber 10 can be adjusted by regulating the operation of the vacuum pump and the opening degree of the main valve 40.

[0067] According to one embodiment, when the pressure of the chamber 10 is adjusted by the main valve 40, the sub-valve 100 is in an open state, which is suitable for situations with a large pressure adjustment range.

[0068] According to one embodiment, during the purging process after cleaning the chamber 10, the main valve 40 is opened to the maximum extent to allow gas and particles to be discharged smoothly.

[0069] According to one embodiment, the sub-valve 100 forms a structure surrounding the shaft 31 of the heater 30 and is disposed at the connection between the chamber 10 and the pumping pipe 20. For this purpose, the sub-valve 100 is manufactured as a disc shape with through holes 111 and 131 formed inside in the vertical direction.

[0070] According to one embodiment, the sub-valve 100 includes: a base plate 110, fixedly disposed at the connection between the chamber 10 and the pumping pipe 20; a plurality of blades 120, one end of which is rotatably disposed on the base plate 110 via a hinge pin 112 and rotates toward the axis 31 of the heater 30 or in the opposite direction to adjust the air passage area; and a drive plate 130, connected to the upper part of the plurality of blades 120 to operate the plurality of blades 120.

[0071] According to one embodiment, the base plate 110 and the drive plate 130 are formed of disks of the same size, and each has through holes 111 and 131 formed inside it. The through holes 111 and 131 are concentric with the outer periphery of each plate, and the diameters of the two through holes 111 and 131 are also the same. The base plate 110 and the drive plate 130 are arranged with their centers aligned in the same vertical direction.

[0072] According to one embodiment, the base plate 110 is configured to be fixed to the connection portion of the chamber 10 and the pumping pipe 20, that is, to be formed in the opening on the lower surface of the chamber 10 or the upper end of the pumping pipe 20.

[0073] According to one embodiment, through holes 111 and 131 with the same diameter as the inner diameter of the pumping pipe 20 are formed inside the base plate 110 and the drive plate 130, respectively. When the valve is fully open, the plurality of blades 120 move into the space between the base plate 110 and the drive plate 130 to fully open the through holes 111 and 131. When the valve is fully closed, they are configured to contact the shaft 31 of the heater 30.

[0074] In this way, the plurality of blades 120 contact the shaft 31, thereby effectively blocking the flow path between the shaft 31 and the inner circumferential surface of the pumping pipe 20. Therefore, the flow path blocking performance of the sub-valve 100 is excellent. That is, this is because when the ends of the plurality of blades 120 rotate toward the shaft 31, no gaps are formed between the ends of the plurality of blades 120, and a circular surface with almost no gaps is formed between the plurality of blades 120 and the shaft 31.

[0075] Therefore, the sub-valve 100 can adjust the gas flow rate through the sub-valve 100 by slightly expanding or narrowing the gap between the shaft 31 and the plurality of blades 120, thereby precisely controlling the pressure of the chamber 10.

[0076] According to one embodiment, a drive pin 124 is formed protruding from the upper surface of the plurality of blades 120, and the drive plate 130 is configured to form an arc-shaped guide groove 132 inclined in the radial direction. The drive pin 124 is inserted into the guide groove 132, thereby, when the drive plate 130 rotates, the drive pin 124 moves along the guide groove 132, causing the plurality of blades 120 to rotate about the hinge pin 112.

[0077] In this way, the opening degree of the sub-valve 100 is adjusted by rotating the plurality of blades 120.

[0078] According to one embodiment, the drive plate 130 is configured not to be fixed to the side of the chamber 10 or the pumping pipe 20, but to be placed on the upper surface of the plurality of blades 120, so as to rotate in a sliding state.

[0079] According to one embodiment, although not shown, in order to prevent the drive plate 130 from detaching from the upper surface of the plurality of blades 120, a generally ring-shaped cover member may be provided to surround the base plate 110 and the drive plate 130 together.

[0080] According to one embodiment, in the case of the cover component, an opening hole needs to be formed in the cover component in order to connect the drive plate 130 and the motor 200.

[0081] According to one embodiment, if the drive plate 130 is forcibly rotated by the motor 200, the guide groove 132 also rotates together. The guide groove 132 is formed into an arc shape that is inclined relative to the radial direction of the drive plate 130. Therefore, it guides the circumferential and radial movement of the drive pin 124 between the inner and outer diameter portions of the drive plate 130.

[0082] According to one embodiment, depending on the rotation direction of the drive plate 130, the drive pin 124 moves toward the inner or outer end of the guide groove 132 in the radial direction. As a result, the ends of the plurality of blades 120 can rotate toward the axis 31 of the heater 30 or toward the space between the base plate 110 and the drive plate 130, and the opening area of ​​the through holes 111 and 131, i.e., the air passage area, can be adjusted.

[0083] According to one embodiment, the plurality of blades 120 are configured to overlap each other as part of an area, and the thickness of the entire overlapping blade 120 is the same as the thickness of a single blade 120.

[0084] That is, since the plurality of blades 120 are formed by overlapping each other through the height difference structure described below, the total thickness will not change due to the overlap.

[0085] Therefore, even though the plurality of blades 120 are disposed between the base plate 110 and the drive plate 130, the spacing between the base plate 110 and the drive plate 130 is maintained in the same manner as when a single blade 120 is provided (see reference). Figure 4 This allows the sub-valve 100 to be made thinner overall, which provides structural advantages in placing the sub-valve 100 in a thin film deposition apparatus.

[0086] The height difference and overlapping structure of the blades 120 are as follows.

[0087] According to one embodiment, the blades 120 are configured such that their upper and lower surfaces are formed by first cross-sections 121a, 121b, second cross-sections 122a, 122b, and third cross-sections 123a, 123b with a height difference. In the lower surfaces of the plurality of blades 120, the first cross-section 121b can make surface contact with and slide against the upper surface of the base plate 110. In two adjacent blades 120, the first cross-section 121a of the upper surface of one blade 120 can make surface contact with and slide against the second cross-section 122'b of the lower surface of the other blade 120'. The second cross-section 122a of the upper surface of one blade 120 can make surface contact with and slide against the third cross-section 123'b of the lower surface of the other blade 120'. In the upper surfaces of the plurality of blades 120, the third cross-section 123a can make surface contact with and slide against the lower surface of the drive plate 130.

[0088] According to one embodiment, the overlap area between corresponding cross-sections of two adjacent blades 120, 120' can be increased or decreased based on the angle of rotation of the blades 120, 120' around the hinge pin 112, and, depending on the situation, overlap may not be necessary. For example, as... Figure 7 As shown, when the valve is fully open, the third section 123b of the lower surface of one blade 120 is completely detached from the region of the second section 122'a formed on the upper surface of the adjacent blade 120', and is located above the first section 121'a formed on the upper surface of the other blade 120'. That is, in this state, the corresponding sections between the two blades 120 and 120' do not overlap.

[0089] According to one embodiment, such as Figure 8 As shown, when the valve is closed to the maximum extent, the inner ends of the blades 120 and 120' (the opposite ends of the connecting ends of the hinge pin 112) rotate toward the center of the valve, and the third section 123b formed on the lower surface of one side blade 120 moves toward the area of ​​the second section 122'a formed on the upper surface of the adjacent other side blade 120', thereby making the two sections come into contact with each other.

[0090] According to one embodiment, the plurality of blades 120 are configured such that, when rotating, the opposing side portions of cross sections at the same height of two mutually adjacent blades 120, 120' do not interfere with each other.

[0091] According to one embodiment, in two adjacent blades 120, 120', the inner wall surfaces 123aa, 123ab of the third section 123a formed on the upper surface of one side blade 120 are formed into a curved shape to prevent interference with the outer wall surfaces 123'aa, 123'ab of the third section 123'a of the opposite side blade 120' (see reference). Figure 3 (a) and (c) of the blades. That is, the opposing side portions between two adjacent blades 120 and 120' are formed in a shape that will not cause interference between them.

[0092] According to one embodiment, the following advantages are achieved: when the plurality of blades 120 are operated, friction caused by contact between the side surfaces of the plurality of blades 120 is reduced, thereby reducing the required driving force. Therefore, a motor 200 with a smaller driving force can be used, thereby saving on the manufacturing cost of the thin film deposition apparatus. According to one embodiment, gear teeth are formed on the outer peripheral surface of the drive plate 130, and the gear teeth are configured to mesh with a drive gear 210 disposed on the rotating shaft of the motor 200.

[0093] According to one embodiment, when a cover member is provided to surround the base plate 110 and the drive plate 130, the gear teeth of the drive plate 130 and the drive gear 210 are meshed through an opening formed in the cover member.

[0094] According to one embodiment, the motor 200 is a structure connected to the sub-valve 100 to enable the sub-valve 100 to operate.

[0095] According to one embodiment, the motor 200 is fixedly mounted in the chamber 10 or the pumping pipe 20 via a bracket (not shown), and the drive gear 210 is coupled to its output shaft, and as described above, the drive gear 210 meshes with the gear teeth of the drive plate 130.

[0096] According to one embodiment, the rotational force of the motor 200 can cause the drive plate 130 to rotate, thereby causing the drive pin 124 to move due to the guide groove 132 formed in the drive plate 130, which in turn allows the blade 120 to run.

[0097] According to one embodiment, the blade 120 can be rotated toward the inner or outer side of the sub-valve 100 in the radial direction according to the rotation direction of the motor 200, thereby precisely adjusting the opening and closing operation and opening degree of the sub-valve 100.

[0098] According to one embodiment, by finely adjusting the opening of the sub-valve 100, the air passage area (flow path cross-sectional area) between the blade 120 and the shaft 31 of the heater 30 can be precisely adjusted. Therefore, the amount of air discharged to the vacuum pump side via the pumping pipe 20 can be finely adjusted, and the vacuum pressure inside the chamber 10 can also be precisely adjusted.

[0099] Therefore, when performing the thin film deposition process, the process conditions can be controlled more precisely, thereby improving the precision of process control and enabling the deposition of high-quality thin films on the wafer.

[0100] According to one embodiment, the pumping pipe 20 is provided with a first pressure gauge 50, and the chamber 10 is provided with a second pressure gauge 60.

[0101] According to one embodiment, the first pressure gauge 50, as part of a structure also provided in an existing thin-film deposition apparatus, measures and displays the pressure inside the pumping conduit 20. Previously, the pressure in the chamber 10 was estimated based on the pressure displayed by the first pressure gauge 50.

[0102] According to one embodiment, when the sub-valve 100 is operated in a closed state, such that the internal space of the chamber 10 is separated from the internal space of the pumping pipe 20 in terms of pressure, the second pressure gauge 60 accurately displays the pressure inside the chamber 10.

[0103] Therefore, the operator can accurately confirm the actual pressure inside the chamber 10 where the process is being carried out by using the second pressure gauge 60, and based on this, precisely control the process conditions (pressure conditions) of the thin film deposition apparatus.

[0104] According to one embodiment, the operator can compare the displayed values ​​of the first pressure gauge 50 and the second pressure gauge 60 during the process to understand the pressure difference between the chamber 10 and the pumping pipe 20.

[0105] As described above, the thin film deposition apparatus of the present invention can accurately measure the pressure inside the chamber during the deposition process and can adjust the pressure inside the chamber more precisely. This not only improves the quality of the thin film deposited on the wafer but also helps to improve the reliability and consistency of the process.

[0106] As described above, the present invention has been illustrated with reference to the embodiments shown in the figures. However, it should be understood that these are merely exemplary, and various modifications and equivalent embodiments are possible based on common knowledge in the art to which this invention pertains. Therefore, the true scope of protection of this invention is based on the appended claims and should be determined according to the specific content of the invention described above.

[0107] Industrial availability

[0108] This invention relates to a thin film deposition apparatus, which can be utilized in the industrial field of mechanical devices with axial structures in gas flow paths.

Claims

1. A thin film deposition apparatus, characterized by, include: The chambers form a closed space; A pumping pipe is connected to the lower surface of the chamber; The heater is configured such that the connection between the chamber and the pumping pipe runs vertically through the upper and lower parts; The main valve is located at the rear end of the pumping pipeline; A sub-valve, forming a structure surrounding the shaft of the heater, and disposed at the connection between the chamber and the pumping pipe; and A motor is connected to the sub-valve to operate the sub-valve.

2. The thin film deposition apparatus according to claim 1, characterized in that, The sub-valve includes: A base plate is fixedly installed at the connection between the chamber and the pumping pipe; Multiple blades, one end of which is rotatably mounted on the base plate via a hinge pin, rotate toward the axial direction of the heater or the opposite direction to adjust the air passage area; and A drive plate is connected to the upper part of the plurality of blades to enable the plurality of blades to operate.

3. The thin film deposition apparatus according to claim 2, characterized in that, Each of the base plate and the drive plate has a through hole with the same diameter as the inner diameter of the pumping pipe. When the valve is fully open, the plurality of blades move into the space between the base plate and the drive plate to fully open the through hole. When the valve is fully closed, the plurality of blades are configured to contact the shaft of the heater.

4. The thin film deposition apparatus according to claim 2, characterized in that, A drive pin is formed protruding from the upper surface of the plurality of blades, and an arc-shaped guide groove is formed on the drive plate with an inclination relative to the radial direction. The drive pin is inserted into the guide groove, and when the drive plate rotates, the drive pin moves along the guide groove, so that the blade is configured to rotate about the hinge pin.

5. The thin film deposition apparatus according to claim 2, characterized in that, The plurality of blades are configured to overlap each other as part of an area, and the thickness of the entire overlapping blade is the same as the thickness of a single blade.

6. The thin film deposition apparatus according to claim 5, characterized in that, The plurality of blades are configured such that their upper and lower surfaces are formed by a first cross-section, a second cross-section, and a third cross-section, respectively, with a height difference. In the lower surface of the plurality of blades, the first cross-section makes surface contact with and slides against the upper surface of the base plate. In two adjacent blades, the first cross-section of the upper surface of one blade makes surface contact with and slides against the second cross-section of the lower surface of the other blade. The second cross-section of the upper surface of one blade makes surface contact with and slides against the third cross-section of the lower surface of the other blade. In the upper surface of the plurality of blades, the third cross-section makes surface contact with and slides against the lower surface of the drive plate.

7. The thin film deposition apparatus according to claim 6, characterized in that, The plurality of blades are configured such that, when rotating, the opposing side portions of cross sections at the same height of two adjacent blades do not interfere with each other.

8. The thin film deposition apparatus according to claim 2, characterized in that, Gear teeth are formed on the outer peripheral surface of the drive plate, and the gear teeth are configured to mesh with the drive gear disposed on the rotating shaft of the motor.

9. The thin film deposition apparatus according to claim 1, characterized in that, A first pressure gauge is provided in the pumping pipeline, and a second pressure gauge is provided in the chamber.

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