Film forming apparatus and deposition equipment
CN122303849APending Publication Date: 2026-06-30WUXI LEADPRO TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- WUXI LEADPRO TECH CO LTD
- Filing Date
- 2024-12-31
- Publication Date
- 2026-06-30
AI Technical Summary
Technical Problem
In the prior art, when multiple substrates rotate, the airflow field between adjacent substrates is disturbed, resulting in poor airflow uniformity and affecting the uniformity of film formation.
Method used
The film-forming device uses a fixed base, with the mounting sections arranged at intervals along a first direction and rotatable. Adjacent mounting sections are separated by partitions, and the air intake assembly is designed in a zoned manner to control the airflow and ensure that each mounting section is in uniform contact with the reaction gas.
Benefits of technology
This achieves consistent substrate film quality on each mounting section, reduces airflow disturbance, and improves the stability of the airflow field and the uniformity of film formation.
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Smart Images
Figure CN122303849A_ABST
Abstract
This application discloses a film-forming apparatus and deposition equipment, belonging to the technical field of film-forming equipment. The film-forming apparatus of this application includes: a reaction chamber having a reaction cavity; a base fixedly held within the reaction cavity; an air inlet assembly; and a plurality of mounting portions disposed on the base and spaced apart along a first direction. Each mounting portion has an axis and is configured to rotate relative to the base about the axis. Each mounting portion includes a mounting surface disposed on its top side. In the first direction, a partition is provided between two adjacent mounting portions. In the second direction, the mounting surface is lower than the top surface of the partition, and the second direction is parallel to the axis. By fixing the base and separating adjacent mounting portions with partitions, this application can reduce interference and spacing between adjacent mounting portions, saving the space required for multiple mounting portions, and making the film quality or thickness of the substrate on each mounting portion more consistent.
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