Device for metallizing the surface of a diamond composite material

Abstract

This invention discloses a surface metallization treatment device for diamond composite materials, belonging to the field of diamond plating technology. It includes a main frame and a picking mechanism for picking up diamond semiconductor wafers. The main frame contains a plating mechanism for metallizing the surface of the diamond semiconductor wafers and a stirring mechanism for agitating the plating solution. Through the coordinated operation of a moving motor, a moving lead screw, a front moving frame, and a rear moving frame, combined with the independent actions of two sets of clamping modules, this invention achieves automatic feeding of wafers to be plated, automatic unloading of plated wafers, and finished product conveying, making it suitable for large-scale continuous production. Furthermore, by incorporating an inner clamping rod, side clamping plates, support blocks, and clamping springs within the plating cylinder, along with a linkage mechanism between an inner push rod and a rotating disk, this invention automatically clamps and fixes the diamond semiconductor wafers in four directions while the plating cylinder cover is closed, ensuring the wafers remain in a stable position even when the plating solution is violently agitated.

Description

Technical Field

[0001] This invention relates to the field of diamond coating technology, and in particular to a device for metallizing the surface of diamond composite materials. Background Technology

[0002] Diamond, as a wide-bandgap semiconductor material, possesses outstanding properties such as extremely high thermal conductivity, excellent chemical stability, high breakdown electric field, and low dielectric constant, earning it the reputation of being the ultimate semiconductor material. It has broad application prospects in power electronic devices, high-frequency communications, aerospace, and nuclear energy equipment. However, diamond itself does not possess good electrical conductivity, and its interfacial bonding with other metals or matrix materials is poor, limiting its direct application in practical devices.

[0003] To address the aforementioned issues, surface metallization techniques are typically employed to deposit one or more thin metal films on the diamond surface, thereby improving its solderability, bonding ability, and adhesion strength to the packaging substrate. Physical vapor deposition, electroless plating, and electroplating are widely used for surface metallization of diamond and its composite materials. However, existing metallization equipment still has significant shortcomings in terms of automation, plating uniformity, wafer fixation stability, and dynamic control of the plating solution.

[0004] First, traditional equipment relies on manual or semi-automatic methods to pick up, place, transfer, and position diamond wafers, which is inefficient and prone to contamination or positioning errors. Second, during the plating process, the wafers are prone to displacement or detachment due to the flow or agitation of the plating solution, affecting the quality of the plating layer. In addition, existing equipment lacks the ability to control the state of the plating solution in real time. Problems such as uneven plating solution concentration and inconvenience in replacement lead to unstable plating results, making it difficult to meet the requirements of high consistency and high reliability in industrial production. Summary of the Invention

[0005] To address the aforementioned technical problems, this invention discloses a diamond composite material surface metallization treatment device that integrates functions such as automatic pick-and-place, precise positioning, stable clamping, dynamic agitation, and automatic liquid replacement. The technical solution adopted by this invention is as follows: the diamond composite material surface metallization treatment device includes a main frame and a pick-up mechanism for picking up diamond semiconductor wafers. The main frame is provided with a plating mechanism for metallizing the surface of the diamond semiconductor wafers and an agitation mechanism for agitating the plating liquid. The picking mechanism includes a fixed guide rail fixedly installed on the main frame, a front moving frame and a rear moving frame slidably installed on the fixed guide rail, a track frame fixedly installed on the rear moving frame, a pressure rod fixedly installed on the front moving frame, a pressure wheel rotatably installed at the lower end of the pressure rod, and the track frame consists of an upper section, an inclined section and a lower section. The plating mechanism includes a base fixedly installed inside the main frame, a plating cylinder fixedly installed on the base, and a bottom rotating ring rotatably installed on the base.

[0006] Furthermore, the picking mechanism also includes a movable motor fixedly installed on a fixed guide rail, a movable lead screw rotatably installed inside the fixed guide rail, the movable lead screw being fixedly installed with the motor shaft of the movable motor, the front movable frame forming a threaded drive with the movable lead screw, and the rear movable frame forming a threaded drive with the movable lead screw.

[0007] Furthermore, each of the front and rear moving frames is provided with a clamping module. The clamping module includes a lifting electric cylinder fixedly installed on the front or rear moving frame. A lifting plate is fixedly installed on the output end of the lifting electric cylinder. Four clamping electric cylinders are fixedly installed on the lifting plate. A clamping plate is fixedly installed on the output end of the clamping electric cylinder. Both clamping modules are located below the upper section of the track frame.

[0008] The moving motor drives the moving lead screw to rotate, causing the front and rear moving frames to slide synchronously along the fixed guide rail. Initially, when the upper section of the track frame is between the upper and lower rollers, the plating cylinder cover is open. At this time, the lifting cylinder of the clamping module on the front moving frame extends, causing the lifting plate, clamping cylinder, and clamping plate to descend, bringing the four clamping plates to the periphery of the diamond semiconductor wafer to be plated, which is being conveyed in by the inlet belt. The four clamping cylinders then extend, causing the clamping plates to move inward, clamping the diamond semiconductor wafer to be plated. Subsequently, the lifting cylinder retracts, lifting the diamond semiconductor wafer from the inlet belt via the clamping plates. Then, the front and rear moving frames move along the fixed guide rail. The clamping module on the rear moving frame reaches above the outlet belt. At this point, the side clamping plates are not yet clamping the plated diamond semiconductor wafer. The lifting electric cylinder extends, causing the lifting plate, clamping electric cylinder, and clamping plate to descend. At this time, the four clamping plates reach the periphery of the plated diamond semiconductor wafer. The four clamping electric cylinders extend, causing the clamping plates to move inward, clamping the plated diamond semiconductor wafer. Then, the lifting electric cylinder retracts, lifting the plated diamond semiconductor wafer from the support block through the clamping plates. Subsequently, the clamping module on the rear moving frame carries the plated diamond semiconductor wafer to the top of the delivery belt, placing the plated diamond semiconductor wafer onto the delivery belt. The delivery belt then delivers the plated diamond semiconductor wafer. The clamping module on the front moving frame carries the diamond semiconductor wafer to be plated to the top of the plating cylinder, placing the diamond semiconductor wafer onto the support block. Then, the front and rear moving frames continue to move forward, and the inclined section of the track frame reaches between the upper and lower rollers.

[0009] Furthermore, the plating mechanism also includes an inner fixed plate fixedly installed inside the plating cylinder. A rotating disk is rotatably installed on the inner fixed plate. The rotating disk is provided with four inclined grooves. Four inner clamping rods are slidably installed on the inner fixed plate. The upper surface of the end of the inner clamping rod is provided with a slope. An inner push column is fixedly installed on the inner clamping rod. The inner push column slides in the inclined groove. A side clamping plate is fixedly installed on the end of the inner clamping rod. A support block is fixedly installed on the side clamping plate. A clamping spring is provided between two opposing support blocks.

[0010] Furthermore, the plating mechanism also includes a fixed cylinder fixedly installed inside the main frame body. A lifting column is slidably installed inside the fixed cylinder. A plating cylinder cover is fixedly installed on the lifting column. An inner push rod is fixedly installed on the plating cylinder cover. The bottom of the inner push rod is provided with a slope. A protective sleeve is fixedly installed outside the plating cylinder. A top frame is fixedly installed on the plating cylinder cover. An upper roller is rotatably installed on the top frame. A lifting block is slidably installed on the top frame. A lower roller is rotatably installed on the lifting block. A compression spring is provided between the lifting block and the plating cylinder cover. The track frame is located between the upper roller and the lower roller.

[0011] Furthermore, the plating mechanism also includes a discharge shell fixedly installed at the bottom of the plating cylinder, a sealing plate rotatably installed inside the discharge shell, an opening and closing plate fixedly installed on the sealing plate, an opening and closing electric cylinder rotatably installed on the plating cylinder, and the output end of the opening and closing electric cylinder rotatably installed with the opening and closing plate. In the initial state, the sealing plate closes the bottom of the plating cylinder.

[0012] Furthermore, the plating mechanism also includes a waste liquid tank and a replenishment liquid tank fixedly installed in the main frame body. The replenishment liquid tank contains plating liquid, and the waste liquid tank is provided with a recovery pipe. A recovery pump is provided on the recovery pipe and fixedly installed with the discharge shell. An inlet pipe is provided on the replenishment liquid tank and connected to the plating cylinder. An inner placement plate is fixedly installed in the main frame body, and the plating cylinder is fixedly installed with the inner placement plate. An inlet motor is fixedly installed on the inner placement plate, and two inlet rollers are rotatably installed on the inner placement plate. An inlet belt is wound around the two inlet rollers, and the inlet motor drives the inlet rollers to rotate. An outlet motor is fixedly installed in the main frame body, and two outlet rollers are rotatably installed in the main frame body. An outlet belt is wound around the two outlet rollers, and the outlet motor drives the outlet rollers to rotate.

[0013] Furthermore, the plating mechanism also includes an agitator column rotatably mounted at the bottom of the plating cylinder, an agitator blade fixedly mounted on the agitator column, the agitator blade being located inside the plating cylinder, a ratchet fixedly mounted on the agitator column, multiple one-way teeth slidably mounted inside the bottom rotating ring, a one-way spring being provided between the one-way teeth and the bottom rotating ring, an arc surface being provided on the bottom rotating ring, and the bottom rotating ring engaging with the ratchet.

[0014] The inlet motor drives the inlet roller to rotate, and the inlet roller drives the inlet belt to rotate. In use, the diamond semiconductor wafer to be plated is placed on the inlet belt. The outlet motor drives the outlet roller to rotate, and the outlet roller drives the outlet belt to rotate.

[0015] When the upper section of the track frame is between the upper and lower rollers, the track frame supports the upper roller, causing the plating cylinder cover to be in the raised state. When the inclined section of the track frame enters between the upper and lower rollers, it drives the lower roller, top frame, plating cylinder cover, and lifting column to descend. Just as the lower section of the track frame is about to enter between the upper and lower rollers, the plating cylinder cover has closed the plating cylinder. At this point, the inner push rod, through the engagement of its lower slope with the slope at the end of the inner clamping rod, pushes the inner clamping rod inward. As the inner clamping rod moves inward, it slides within the inclined groove via the inner push column, carrying... The rotating disk rotates, thereby driving the remaining inner push column, inner clamping rod, side clamping plate and support block to move inward through the remaining inclined groove. The diamond semiconductor wafer is clamped by the four side clamping plates to prevent the diamond semiconductor wafer from being blown away when the plating solution is stirred. When the lower section of the track frame enters between the upper roller and the lower roller, the track frame will press down the lower roller and the lifting block a small section, so that the pressure spring is in a compressed state, so that the plating cylinder cover can be pressed tightly onto the plating cylinder. Then the lower section of the track frame enters between the upper roller and the lower roller, and then the lower pressure roller begins to contact the lower pressure inclined frame.

[0016] When the plating solution is replaced, the opening and closing electric cylinder retracts, causing the opening and closing plate and the closing plate to rotate relative to the discharge shell. The closing plate no longer seals the bottom of the plating cylinder, and the plating solution in the plating cylinder flows into the recovery pump. The recovery pump starts and pumps the plating solution into the waste liquid tank through the recovery pipe. Then the opening and closing electric cylinder extends, causing the closing plate to seal the bottom of the plating cylinder again. Subsequently, the replenishment tank introduces new plating solution into the plating cylinder through the inlet pipe.

[0017] Furthermore, the agitation mechanism includes an extension frame fixedly mounted on a base, a downward pressure bracket rotatably mounted on the extension frame, a downward pressure plate fixedly mounted on the downward pressure bracket, two columns fixedly mounted on the extension frame, a lifting plate slidably mounted on the columns, a downward pressure spring provided between the lifting plate and the extension frame, and two docking wheels rotatably mounted on the lifting plate, the docking wheels contacting the lower surface of the downward pressure plate.

[0018] Furthermore, the agitation mechanism also includes a fixed lead screw fixedly mounted on the extension frame, a rotating nut rotatably mounted on the lifting plate, the rotating nut having an internal thread, the rotating nut and the fixed lead screw forming a threaded transmission, a driving wheel fixedly mounted below the rotating nut, a bottom wheel rotatably mounted on the base, a rotating square column fixedly mounted on the bottom wheel, a driven wheel slidably mounted on the rotating square column, a transmission belt wrapped around the driven wheel and the driving wheel, a synchronizing plate between the driving wheel and the driven wheel, the synchronizing plate enabling the driving wheel and the driven wheel to rise and fall synchronously, and a transmission belt wrapped around the bottom wheel and the bottom rotating wheel.

[0019] The pressure rod and pressure wheel continue to move forward, causing the pressure bracket and pressure plate to rotate relative to the extension frame. The pressure plate presses the docking wheel and lifting plate down along the column, compressing the pressure spring. When the lifting plate descends, the rotating nut begins to rotate in the threaded engagement with the fixed screw. The rotating nut drives the driven wheel, rotating square column and bottom rotating wheel to rotate through the transmission belt. The bottom rotating wheel drives the bottom rotating ring to rotate counterclockwise through the transmission belt. The synchronizing plate causes the driven wheel to descend along the rotating square column when the driving rotating wheel descends. When the bottom rotating ring rotates counterclockwise, it drives the ratchet, stirring column and stirring blade to rotate through the one-way teeth. The stirring blade stirs the plating solution to improve the plating effect of the diamond semiconductor wafer.

[0020] After plating is completed, the moving motor starts to reverse, driving the front and rear moving frames to move towards the moving motor. When the pressure rod and pressure roller move back, the pressure spring rebounds, driving the lifting plate to rise. The rotating nut rotates in the opposite direction under the action of the fixed screw. At this time, the bottom rotating ring rotates clockwise. At this time, the one-way tooth cannot drive the ratchet to rotate, and the one-way tooth slides relative to the bottom rotating ring. The one-way spring is compressed and released. At this time, the stirring blade will not rotate to reduce resistance. When the inclined section of the track frame reaches between the upper and lower rollers, the track frame lifts the upper roller, the top frame, and the plating cylinder cover upwards, so that the plating cylinder cover opens. Then the track frame returns to the initial position, and this process is repeated.

[0021] The beneficial effects of this invention compared with the prior art are: (1) This invention achieves automatic feeding of wafers to be plated, automatic unloading of plated wafers and finished product conveying by the coordinated cooperation of the moving motor, moving screw, front moving frame and rear moving frame, combined with the independent action of two sets of clamping modules. The entire picking, placing, transferring and positioning process does not require manual intervention, which significantly reduces the intensity of manual operation and human error, and is suitable for large-scale continuous production; (2) This invention sets an inner clamping rod, side clamping plate, support block and clamping spring in the plating cylinder, and cooperates with the linkage mechanism of the inner push rod and the rotating disk to automatically complete the four-way clamping and fixing of diamond semiconductor wafers when the plating cylinder cover is closed. Even if the plating liquid is violently agitated, the wafer still maintains a stable position, avoiding drift or (3) The present invention uses a mechanical linkage mechanism consisting of a pressure roller, a pressure inclined frame, a lifting plate, a rotating nut and a fixed screw to convert the linear motion of the moving frame into the unidirectional rotation of the stirring blade. The stirring is automatically started only during the plating stage. During the return stroke, the stirring blade idles and does not work, thus achieving efficient and uniform mixing of the plating liquid and improving the density and consistency of the plating layer. (4) The bottom of the plating cylinder set in the present invention is equipped with a closed plate and a discharge shell controlled by an opening and closing electric cylinder. With the help of the waste liquid tank, replenishment tank, recovery pump and recovery pipeline, the timed discharge, automatic recovery and new liquid replenishment of the plating liquid can be realized in a closed loop control, ensuring the stability of the concentration and cleanliness of the plating liquid, and realizing the centralized collection of waste liquid. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0023] Figure 2 This is a schematic diagram of the overall structure of the present invention (internal).

[0024] Figure 3 This is a schematic diagram of the picking mechanism of the present invention.

[0025] Figure 4 This is a schematic diagram of the clamping module structure of the present invention.

[0026] Figure 5 This is a schematic diagram of the plating mechanism of the present invention. Figure 1 .

[0027] Figure 6 This is a schematic diagram of the plating mechanism of the present invention. Figure 2 .

[0028] Figure 7 This is a schematic diagram of the plating mechanism of the present invention. Figure 3 .

[0029] Figure 8 This is a schematic diagram of the plating mechanism of the present invention. Figure 4 .

[0030] Figure 9 This is a schematic diagram of the plating mechanism of the present invention. Figure 5 .

[0031] Figure 10 This is a schematic diagram of the plating mechanism of the present invention. Figure 6 .

[0032] Figure 11 This is a schematic diagram of the plating mechanism of the present invention. Figure 7 .

[0033] Figure 12 This is a schematic diagram of the stirring mechanism of the present invention. Figure 1 .

[0034] Figure 13 This is a schematic diagram of the stirring mechanism of the present invention. Figure 2 .

[0035] Figure 14 This is a schematic diagram of the stirring mechanism of the present invention. Figure 3 .

[0036] Reference numerals: 101-Main frame; 102-Fixed guide rail; 103-Moving motor; 104-Moving lead screw; 105-Front moving frame; 106-Rear moving frame; 107-Trajectory frame; 108-Pressing rod; 109-Pressing roller; 110-Lifting cylinder; 111-Lifting plate; 112-Clamping cylinder; 113-Clamping plate; 201-Inner placement plate; 202-Entry motor; 203-Entry roller; 204-Entry belt; 2 05-Inward pushing column; 206-Export motor; 207-Export roller; 208-Export belt; 209-Fixed cylinder; 210-Lifting column; 211-Base; 212-Waste liquid tank; 213-Replenishment tank; 214-Recovery pipe; 215-Recovery pump; 216-Discharge shell; 217-Inlet pipe; 218-Coating cylinder; 219-Opening and closing electric cylinder; 220-Opening and closing plate; 221-Closing plate; 222-Top frame; 223-Upper Roller; 224-Lower roller; 225-Lifting block; 226-Pressure spring; 227-Platinum-coated cylinder cover; 228-Bottom rotating ring; 229-Agitating column; 230-One-way tooth; 231-One-way spring; 232-Ratchet; 233-Agitating blade; 234-Inner push rod; 235-Protective sleeve; 236-Inner fixed plate; 237-Rotating plate; 238-Side clamping plate; 239-Support block; 240-Clamping spring; 241-Inner clamping rod; 242- Inclined groove; 301- Extending frame; 302- Lowering inclined frame; 303- Lowering plate; 304- Column; 305- Lifting plate; 306- Lowering spring; 307- Connecting wheel; 308- Rotating nut; 309- Fixing screw; 310- Driving wheel; 311- Driven wheel; 312- Synchronizing plate; 313- Transmission belt; 314- Rotating square column; 315- Bottom wheel; 316- Transmission belt; 4- Diamond semiconductor wafer. Detailed Implementation

[0037] The specific embodiments of the present invention will be further described below with reference to the accompanying drawings.

[0038] Example: Reference Figures 1-14 A diamond composite material surface metallization treatment device includes a main frame 101 and a picking mechanism for picking up a diamond semiconductor wafer 4. The main frame 101 is provided with a plating mechanism for metallizing the surface of the diamond semiconductor wafer 4 and a stirring mechanism for stirring the plating liquid. The picking mechanism includes a fixed guide rail 102 fixedly installed on the main frame 101. A front moving frame 105 and a rear moving frame 106 are slidably installed on the fixed guide rail 102. A track frame 107 is fixedly installed on the rear moving frame 106. A downward pressure rod 108 is fixedly installed on the front moving frame 105. A downward pressure wheel 109 is rotatably installed at the lower end of the downward pressure rod 108. The track frame 107 consists of an upper section, an inclined section and a lower section. The plating mechanism includes a base 211 fixedly installed inside the main frame 101, a plating cylinder 218 fixedly installed on the base 211, and a bottom rotating ring 228 rotatably installed on the base 211.

[0039] like Figure 3 , Figure 4 As shown, the picking mechanism also includes a movable motor 103 fixedly installed on a fixed guide rail 102. A movable lead screw 104 is rotatably installed inside the fixed guide rail 102. The movable lead screw 104 is fixedly installed with the motor shaft of the movable motor 103. The front movable frame 105 and the movable lead screw 104 form a threaded transmission, and the rear movable frame 106 and the movable lead screw 104 form a threaded transmission.

[0040] like Figure 3 , Figure 4 As shown, a clamping module is provided on the front moving frame 105 and the rear moving frame 106. The clamping module includes a lifting electric cylinder 110 fixedly installed on the front moving frame 105 or the rear moving frame 106. A lifting plate 111 is fixedly installed on the output end of the lifting electric cylinder 110. Four clamping electric cylinders 112 are fixedly installed on the lifting plate 111. A clamping plate 113 is fixedly installed on the output end of the clamping electric cylinder 112. Both clamping modules are located below the upper section of the track frame 107.

[0041] The moving motor 103 drives the moving lead screw 104 to rotate, causing the front moving frame 105 and the rear moving frame 106 to slide synchronously along the fixed guide rail 102. In the initial state, when the upper section of the track frame 107 is between the upper roller 223 and the lower roller 224, the plating cylinder cover 227 is in the open state. At this time, the lifting cylinder 110 of the clamping module on the front moving frame 105 extends, causing the lifting plate 111, the clamping cylinder 112 and the clamping plate 113 to descend, so that the four clamping plates 113 reach the diamond semiconductor wafer 4 to be plated that has been conveyed in by the belt 204. Around the perimeter, four clamping electric cylinders 112 extend, driving the clamping plates 113 to move inward, clamping the diamond semiconductor wafer 4 to be plated. Then, the lifting electric cylinder 110 retracts, lifting the diamond semiconductor wafer 4 from the inlet belt 204 via the clamping plates 113. Subsequently, the front moving frame 105 and the rear moving frame 106 move along the fixed guide rail 102. The clamping module on the rear moving frame 106 reaches above the outlet belt 208. At this point, the side clamping plate 238 is not yet clamping the plated diamond semiconductor wafer 4. The lifting cylinder 110 on the moving frame 106 extends, causing the lifting plate 111, clamping cylinder 112, and clamping plate 113 to descend. At this time, the four clamping plates 113 reach the periphery of the plated diamond semiconductor wafer 4. Then, the four clamping cylinders 112 extend, causing the clamping plates 113 to move inward, clamping the plated diamond semiconductor wafer 4. Subsequently, the lifting cylinder 110 retracts, lifting the plated diamond semiconductor wafer 4 from the support block 239 via the clamping plates 113. Then, the clamping module on the moving frame 106... The plated diamond semiconductor wafer 4 is brought to the top of the delivery belt 208. The plated diamond semiconductor wafer 4 is placed on the delivery belt 208, and the delivery belt 208 delivers the plated diamond semiconductor wafer 4. The gripping module on the front moving frame 105 carries the diamond semiconductor wafer 4 to be plated to the top of the plating cylinder 218. Then the diamond semiconductor wafer 4 is placed on the support block 239. Then the front moving frame 105 and the rear moving frame 106 continue to move forward. The inclined section of the track frame 107 reaches between the upper roller 223 and the lower roller 224.

[0042] like Figures 5-11As shown, the plating mechanism also includes an inner fixed plate 236 fixedly installed inside the plating cylinder 218. A rotating plate 237 is rotatably installed on the inner fixed plate 236. Four inclined grooves 242 are provided on the rotating plate 237. Four inner clamping rods 241 are slidably installed on the inner fixed plate 236. The upper surface of the end of the inner clamping rod 241 is provided with a slope. An inner push column 205 is fixedly installed on the inner clamping rod 241. The inner push column 205 slides in the inclined groove 242. A side clamping plate 238 is fixedly installed at the end of the inner clamping rod 241. A support block 239 is fixedly installed on the side clamping plate 238. A clamping spring 240 is provided between two opposing support blocks 239.

[0043] like Figures 5-11 As shown, the plating mechanism also includes a fixed cylinder 209 fixedly installed inside the main frame 101. A lifting column 210 is slidably installed inside the fixed cylinder 209. A plating cylinder cover 227 is fixedly installed on the lifting column 210. An inner push rod 234 is fixedly installed on the plating cylinder cover 227. The bottom of the inner push rod 234 is provided with a slope. A protective sleeve 235 is fixedly installed outside the plating cylinder 218. A top frame 222 is fixedly installed on the plating cylinder cover 227. An upper roller 223 is rotatably installed on the top frame 222. A lifting block 225 is slidably installed on the top frame 222. A lower roller 224 is rotatably installed on the lifting block 225. A compression spring 226 is provided between the lifting block 225 and the plating cylinder cover 227. The track frame 107 is located between the upper roller 223 and the lower roller 224.

[0044] like Figures 5-11 As shown, the plating mechanism also includes a discharge shell 216 fixedly installed at the bottom of the plating cylinder 218. A sealing plate 221 is rotatably installed inside the discharge shell 216. An opening and closing plate 220 is fixedly installed on the sealing plate 221. An opening and closing electric cylinder 219 is rotatably installed on the plating cylinder 218. The output end of the opening and closing electric cylinder 219 is rotatably installed with the opening and closing plate 220. In the initial state, the sealing plate 221 closes the bottom of the plating cylinder 218.

[0045] like Figures 5-11As shown, the plating mechanism also includes a waste liquid tank 212 and a replenishment tank 213 fixedly installed inside the main frame 101. The replenishment tank 213 contains plating solution. A recovery pipe 214 is provided on the waste liquid tank 212, and a recovery pump 215 is provided on the recovery pipe 214. The recovery pump 215 is fixedly installed with the discharge shell 216. An inlet pipe 217 is provided on the replenishment tank 213, and the inlet pipe 217 is connected to the plating cylinder 218. An inner placement plate 201 is fixedly installed inside the main frame 101, and the plating cylinder 218 is connected to the inner placement plate 201. Plate 201 is fixedly installed. An inlet motor 202 is fixedly installed on the inner plate 201. Two inlet rollers 203 are rotatably installed on the inner plate 201. An inlet belt 204 is wound around the two inlet rollers 203. The inlet motor 202 drives the inlet rollers 203 to rotate. An outlet motor 206 is fixedly installed inside the main frame 101. Two outlet rollers 207 are rotatably installed inside the main frame 101. An outlet belt 208 is wound around the two outlet rollers 207. The outlet motor 206 drives the outlet rollers 207 to rotate.

[0046] like Figures 5-11 As shown, the plating mechanism also includes an agitator 229 rotatably mounted at the bottom of the plating cylinder 218. An agitator blade 233 is fixedly mounted on the agitator 229 and is located inside the plating cylinder 218. A ratchet 232 is fixedly mounted on the agitator 229. Multiple one-way teeth 230 are slidably mounted inside the bottom rotating ring 228. A one-way spring 231 is provided between the one-way teeth 230 and the bottom rotating ring 228. An arc surface is provided on the bottom rotating ring 228, and the bottom rotating ring 228 meshes with the ratchet 232.

[0047] The inlet motor 202 drives the inlet roller 203 to rotate, and the inlet roller 203 drives the inlet belt 204 to rotate. In use, the diamond semiconductor wafer 4 to be plated is placed on the inlet belt 204. The outlet motor 206 drives the outlet roller 207 to rotate, and the outlet roller 207 drives the outlet belt 208 to rotate.

[0048] When the upper section of the track frame 107 is located between the upper roller 223 and the lower roller 224, the track frame 107 supports the upper roller 223, causing the plating cylinder cover 227 to be in a raised state. When the inclined section of the track frame 107 enters between the upper roller 223 and the lower roller 224, the inclined section of the track frame 107 drives the lower roller 224, the top frame 222, the plating cylinder cover 227, and the lifting column 210 to descend. When the lower section of the track frame 107 is about to enter between the upper roller 223 and the lower roller 224, the plating cylinder cover 227 has already closed the plating cylinder 218. At this time, the inner push rod 234, through the lower slope surface, cooperates with the slope surface at the end of the inner clamping rod 241, pushing the inner clamping rod 241 to move inward. When the inner clamping rod 241 moves inward, it moves through the inner push column 205 in the inclined groove 242. The inner sliding causes the rotating disk 237 to rotate, thereby driving the remaining inner push column 205, inner clamping rod 241, side clamping plate 238 and support block 239 to move inward through the remaining inclined groove 242. The diamond semiconductor wafer 4 is clamped by the four side clamping plates 238 to prevent the diamond semiconductor wafer 4 from being blown away when the plating liquid is stirred. When the lower section of the track frame 107 enters the upper roller 223 and lower roller 224, the track frame 107 will press the lower roller 224 and lifting block 225 down a small section, so that the pressure spring 226 is in a compressed state, so that the plating cylinder cover 227 can be pressed tightly on the plating cylinder 218. Then the lower section of the track frame 107 enters between the upper roller 223 and lower roller 224, and then the lower pressure roller 109 begins to contact the lower pressure inclined frame 302.

[0049] When the plating solution is replaced, the opening and closing electric cylinder 219 retracts, causing the opening and closing plate 220 and the closing plate 221 to rotate relative to the discharge shell 216. The closing plate 221 no longer closes the bottom of the plating cylinder 218, and the plating solution in the plating cylinder 218 flows into the recovery pump 215. The recovery pump 215 starts and pumps the plating solution into the waste liquid tank 212 through the recovery pipe 214. Then the opening and closing electric cylinder 219 extends, causing the closing plate 221 to close the bottom of the plating cylinder 218 again. Then the replenishment tank 213 introduces new plating solution into the plating cylinder 218 through the inlet pipe 217.

[0050] like Figures 12-14 As shown, the stirring mechanism includes an extension frame 301 fixedly mounted on a base 211, a downward pressure bracket 302 rotatably mounted on the extension frame 301, a downward pressure plate 303 fixedly mounted on the downward pressure bracket 302, two columns 304 fixedly mounted on the extension frame 301, a lifting plate 305 slidably mounted on the columns 304, a downward pressure spring 306 provided between the lifting plate 305 and the extension frame 301, and two docking wheels 307 rotatably mounted on the lifting plate 305, the docking wheels 307 contacting the lower surface of the downward pressure plate 303.

[0051] like Figures 12-14As shown, the stirring mechanism also includes a fixed lead screw 309 fixedly installed on the extension frame 301, a rotating nut 308 rotatably installed on the lifting plate 305, the rotating nut 308 having an internal thread, the rotating nut 308 and the fixed lead screw 309 forming a threaded transmission, a driving wheel 310 fixedly installed below the rotating nut 308, a bottom wheel 315 rotatably installed on the base 211, a rotating square column 314 fixedly installed on the bottom wheel 315, a driven wheel 311 slidably installed on the rotating square column 314, a transmission belt 313 wrapped around the driven wheel 311 and the driving wheel 310, a synchronizing plate 312 provided between the driving wheel 310 and the driven wheel 311, the synchronizing plate 312 causing the driving wheel 310 and the driven wheel 311 to rise and fall synchronously, and a transmission belt 316 wrapped around the bottom wheel 315 and the bottom rotating ring 228.

[0052] The pressure rod 108 and pressure roller 109 continue to move forward, causing the pressure bracket 302 and pressure plate 303 to rotate relative to the extension frame 301. The pressure plate 303 presses down the docking wheel 307 and the lifting plate 305 along the column 304, compressing the pressure spring 306. When the lifting plate 305 descends, the rotating nut 308 begins to rotate in the threaded engagement with the fixed screw 309. The rotating nut 308 drives the driven wheel 311, the rotating square column 314, and the bottom rotating wheel through the transmission belt 313. When wheel 315 rotates, the bottom rotating wheel 315 drives the bottom rotating ring 228 to rotate counterclockwise via the transmission belt 316. The synchronizing plate 312 causes the driven wheel 311 to descend along the rotating square column 314 when the driving rotating wheel 310 descends. When the bottom rotating ring 228 rotates counterclockwise, it drives the ratchet 232, the stirring column 229 and the stirring blade 233 to rotate via the one-way tooth 230. The stirring blade 233 stirs the plating solution to improve the plating effect of the diamond semiconductor wafer 4.

[0053] After plating is completed, the moving motor 103 starts to reverse, driving the front moving frame 105 and the rear moving frame 106 to move towards the moving motor 103. When the lower pressure rod 108 and the lower pressure wheel 109 move back, the lower pressure spring 306 rebounds, driving the lifting plate 305 to rise. The rotating nut 308 rotates in the opposite direction under the action of the fixed screw 309. At this time, the bottom rotating ring 228 rotates clockwise. At this time, the one-way tooth 230 cannot drive the ratchet 232 to rotate. The one-way tooth 230 slides relative to the bottom rotating ring 228. The one-way spring 231 is compressed and released. At this time, the stirring blade 233 will not rotate to reduce resistance. When the inclined section of the track frame 107 reaches between the upper roller 223 and the lower roller 224, the track frame 107 lifts the upper roller 223, the top frame 222 and the plating cylinder cover 227 upward, so that the plating cylinder cover 227 opens. Then the track frame 107 returns to the initial position, and so on.

[0054] Working principle: The inlet motor 202 drives the inlet roller 203 to rotate, which in turn drives the inlet belt 204 to rotate. During use, the diamond semiconductor wafer 4 to be plated is placed on the inlet belt 204. The delivery motor 206 drives the delivery roller 207 to rotate, which in turn drives the delivery belt 208 to rotate. The moving motor 103 drives the moving screw 104 to rotate, causing the front moving frame 105 and the rear moving frame 106 to slide synchronously along the fixed guide rail 102. Initially, when the upper section of the track frame 107 is between the upper roller 223 and the lower roller 224, the plating cylinder cover 227 is open. At this time, the lifting cylinder 110 of the clamping module on the front moving frame 105 extends, causing the lifting plate 111, the clamping cylinder 112, and the clamping plate 113 to descend, so that the four clamping plates 113 reach the diamond semiconductor wafer 4 to be plated, which has been conveyed in by the inlet belt 204. Around the perimeter, four clamping electric cylinders 112 extend, driving the clamping plates 113 to move inward, clamping the diamond semiconductor wafer 4 to be plated. Then, the lifting electric cylinder 110 retracts, lifting the diamond semiconductor wafer 4 from the inlet belt 204 via the clamping plates 113. Subsequently, the front moving frame 105 and the rear moving frame 106 move along the fixed guide rail 102. The clamping module on the rear moving frame 106 reaches above the outlet belt 208. At this point, the side clamping plate 238 is not yet clamping the plated diamond semiconductor wafer 4. The lifting cylinder 110 on the moving frame 106 extends, causing the lifting plate 111, clamping cylinder 112, and clamping plate 113 to descend. At this time, the four clamping plates 113 reach the periphery of the plated diamond semiconductor wafer 4. Then, the four clamping cylinders 112 extend, causing the clamping plates 113 to move inward, clamping the plated diamond semiconductor wafer 4. Subsequently, the lifting cylinder 110 retracts, lifting the plated diamond semiconductor wafer 4 from the support block 239 via the clamping plates 113. Then, the clamping module on the moving frame 106... The plated diamond semiconductor wafer 4 is brought to the top of the delivery belt 208. The plated diamond semiconductor wafer 4 is placed on the delivery belt 208, and the delivery belt 208 delivers the plated diamond semiconductor wafer 4. The gripping module on the front moving frame 105 carries the diamond semiconductor wafer 4 to be plated to the top of the plating cylinder 218. Then the diamond semiconductor wafer 4 is placed on the support block 239. Then the front moving frame 105 and the rear moving frame 106 continue to move forward. The inclined section of the track frame 107 reaches between the upper roller 223 and the lower roller 224.

[0055] When the upper section of the track frame 107 is located between the upper roller 223 and the lower roller 224, the track frame 107 supports the upper roller 223, causing the plating cylinder cover 227 to be in a raised state. When the inclined section of the track frame 107 enters between the upper roller 223 and the lower roller 224, the inclined section of the track frame 107 drives the lower roller 224, the top frame 222, the plating cylinder cover 227, and the lifting column 210 to descend. When the lower section of the track frame 107 is about to enter between the upper roller 223 and the lower roller 224, the plating cylinder cover 227 has already closed the plating cylinder 218. At this time, the inner push rod 234, through the lower slope surface, cooperates with the slope surface at the end of the inner clamping rod 241, pushing the inner clamping rod 241 to move inward. When the inner clamping rod 241 moves inward, it moves through the inner push column 205 in the inclined groove 242. The inner sliding causes the rotating disk 237 to rotate, thereby driving the remaining inner push column 205, inner clamping rod 241, side clamping plate 238 and support block 239 to move inward through the remaining inclined groove 242. The diamond semiconductor wafer 4 is clamped by the four side clamping plates 238 to prevent the diamond semiconductor wafer 4 from being blown away when the plating liquid is stirred. When the lower section of the track frame 107 enters the upper roller 223 and lower roller 224, the track frame 107 will press the lower roller 224 and lifting block 225 down a small section, so that the pressure spring 226 is in a compressed state, so that the plating cylinder cover 227 can be pressed tightly on the plating cylinder 218. Then the lower section of the track frame 107 enters between the upper roller 223 and lower roller 224, and then the lower pressure roller 109 begins to contact the lower pressure inclined frame 302.

[0056] The pressure rod 108 and pressure roller 109 continue to move forward, causing the pressure bracket 302 and pressure plate 303 to rotate relative to the extension frame 301. The pressure plate 303 presses down the docking wheel 307 and the lifting plate 305 along the column 304, compressing the pressure spring 306. When the lifting plate 305 descends, the rotating nut 308 begins to rotate in the threaded engagement with the fixed screw 309. The rotating nut 308 drives the driven wheel 311, the rotating square column 314, and the bottom rotating wheel through the transmission belt 313. When wheel 315 rotates, the bottom rotating wheel 315 drives the bottom rotating ring 228 to rotate counterclockwise via the transmission belt 316. The synchronizing plate 312 causes the driven wheel 311 to descend along the rotating square column 314 when the driving rotating wheel 310 descends. When the bottom rotating ring 228 rotates counterclockwise, it drives the ratchet 232, the stirring column 229 and the stirring blade 233 to rotate via the one-way tooth 230. The stirring blade 233 stirs the plating solution to improve the plating effect of the diamond semiconductor wafer 4.

[0057] After plating is completed, the moving motor 103 starts to reverse, driving the front moving frame 105 and the rear moving frame 106 to move towards the moving motor 103. When the lower pressure rod 108 and the lower pressure wheel 109 move back, the lower pressure spring 306 rebounds, driving the lifting plate 305 to rise. The rotating nut 308 rotates in the opposite direction under the action of the fixed screw 309. At this time, the bottom rotating ring 228 rotates clockwise. At this time, the one-way tooth 230 cannot drive the ratchet 232 to rotate. The one-way tooth 230 slides relative to the bottom rotating ring 228. The one-way spring 231 is compressed and released. At this time, the stirring blade 233 will not rotate to reduce resistance. When the inclined section of the track frame 107 reaches between the upper roller 223 and the lower roller 224, the track frame 107 lifts the upper roller 223, the top frame 222 and the plating cylinder cover 227 upward, so that the plating cylinder cover 227 opens. Then the track frame 107 returns to the initial position, and so on.

[0058] When the plating solution is replaced, the opening and closing electric cylinder 219 retracts, causing the opening and closing plate 220 and the closing plate 221 to rotate relative to the discharge shell 216. The closing plate 221 no longer closes the bottom of the plating cylinder 218, and the plating solution in the plating cylinder 218 flows into the recovery pump 215. The recovery pump 215 starts and pumps the plating solution into the waste liquid tank 212 through the recovery pipe 214. Then the opening and closing electric cylinder 219 extends, causing the closing plate 221 to close the bottom of the plating cylinder 218 again. Then the replenishment tank 213 introduces new plating solution into the plating cylinder 218 through the inlet pipe 217.

[0059] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the present invention based on the technical solution and inventive concept of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A diamond composite material surface metallization treatment apparatus, comprising a main frame (101) and a picking mechanism for picking up a diamond semiconductor wafer (4), characterized in that: The main frame (101) is provided with a plating mechanism for plating metal onto the surface of a diamond semiconductor wafer (4) and an agitation mechanism for agitating the plating liquid. The picking mechanism includes a fixed guide rail (102) fixedly installed on the main frame (101), a front moving frame (105) and a rear moving frame (106) slidably installed on the fixed guide rail (102), a track frame (107) fixedly installed on the rear moving frame (106), a lowering rod (108) fixedly installed on the front moving frame (105), a lowering wheel (109) rotatably installed at the lower end of the lowering rod (108), and the track frame (107) is composed of an upper section, an inclined section and a lower section; The plating mechanism includes a base (211) fixedly installed inside the main frame (101), a plating cylinder (218) fixedly installed on the base (211), and a bottom rotating ring (228) rotatably installed on the base (211).

2. The diamond composite material surface metallization treatment device according to claim 1, characterized in that: The picking mechanism also includes a movable motor (103) fixedly installed on the fixed guide rail (102). A movable lead screw (104) is rotatably installed inside the fixed guide rail (102). The movable lead screw (104) is fixedly installed with the motor shaft of the movable motor (103). The front movable frame (105) and the movable lead screw (104) form a threaded transmission. The rear movable frame (106) and the movable lead screw (104) form a threaded transmission.

3. The diamond composite material surface metallization treatment device according to claim 2, characterized in that: Each of the front moving frame (105) and the rear moving frame (106) is provided with a clamping module. The clamping module includes a lifting electric cylinder (110) fixedly installed on the front moving frame (105) or the rear moving frame (106). A lifting plate (111) is fixedly installed on the output end of the lifting electric cylinder (110). Four clamping electric cylinders (112) are fixedly installed on the lifting plate (111). A clamping plate (113) is fixedly installed on the output end of the clamping electric cylinder (112). Both clamping modules are located below the upper section of the track frame (107).

4. The diamond composite material surface metallization treatment device according to claim 1, characterized in that: The plating mechanism further includes an inner fixed plate (236) fixedly installed inside the plating cylinder (218). A rotating plate (237) is rotatably installed on the inner fixed plate (236). Four inclined grooves (242) are provided on the rotating plate (237). Four inner clamping rods (241) are slidably installed on the inner fixed plate (236). The upper surface of the end of the inner clamping rod (241) is provided with a slope. An inner push column (205) is fixedly installed on the inner clamping rod (241). The inner push column (205) slides in the inclined groove (242). A side clamping plate (238) is fixedly installed at the end of the inner clamping rod (241). A support block (239) is fixedly installed on the side clamping plate (238). A clamping spring (240) is provided between two opposite support blocks (239).

5. The diamond composite material surface metallization treatment apparatus according to claim 4, characterized in that: The plating mechanism also includes a fixed cylinder (209) fixedly installed inside the main frame (101). A lifting column (210) is slidably installed inside the fixed cylinder (209). A plating cylinder cover (227) is fixedly installed on the lifting column (210). An inner push rod (234) is fixedly installed on the plating cylinder cover (227). The bottom of the inner push rod (234) is provided with a slope. A protective sleeve (235) is fixedly installed outside the plating cylinder (218). 7) A top frame (222) is fixedly installed, an upper roller (223) is rotatably installed on the top frame (222), a lifting block (225) is slidably installed on the top frame (222), a lower roller (224) is rotatably installed on the lifting block (225), a compression spring (226) is provided between the lifting block (225) and the plated cylinder cover (227), and the track frame (107) is located between the upper roller (223) and the lower roller (224).

6. The diamond composite material surface metallization treatment apparatus according to claim 5, characterized in that: The plating mechanism also includes a discharge shell (216) fixedly installed at the bottom of the plating cylinder (218). A sealing plate (221) is rotatably installed inside the discharge shell (216). An opening and closing plate (220) is fixedly installed on the sealing plate (221). An opening and closing electric cylinder (219) is rotatably installed on the plating cylinder (218). The output end of the opening and closing electric cylinder (219) is rotatably installed with the opening and closing plate (220). In the initial state, the sealing plate (221) closes the bottom of the plating cylinder (218).

7. The diamond composite material surface metallization treatment apparatus according to claim 6, characterized in that: The plating mechanism also includes a waste liquid tank (212) and a replenishment tank (213) fixedly installed inside the main frame (101). The replenishment tank (213) contains plating liquid. A recovery pipe (214) is provided on the waste liquid tank (212), and a recovery pump (215) is provided on the recovery pipe (214). The recovery pump (215) is fixedly installed with the discharge shell (216). An inlet pipe (217) is provided on the replenishment tank (213), and the inlet pipe (217) is connected to the plating cylinder (218). An inner placement plate (201) is fixedly installed inside the main frame (101). The plating cylinder (218) is connected to the inner placement plate (201). A placement plate (201) is fixedly installed. An entry motor (202) is fixedly installed on the inner placement plate (201). Two entry rollers (203) are rotatably installed on the inner placement plate (201). An entry belt (204) is wound around the two entry rollers (203). The entry motor (202) drives the entry rollers (203) to rotate. An exit motor (206) is fixedly installed inside the main frame (101). Two exit rollers (207) are rotatably installed inside the main frame (101). An exit belt (208) is wound around the two exit rollers (207). The exit motor (206) drives the exit rollers (207) to rotate.

8. The diamond composite material surface metallization treatment apparatus according to claim 7, characterized in that: The plating mechanism further includes an agitator (229) rotatably mounted at the bottom of the plating cylinder (218), an agitator blade (233) fixedly mounted on the agitator (229), the agitator blade (233) being located inside the plating cylinder (218), a ratchet (232) fixedly mounted on the agitator (229), a plurality of one-way teeth (230) slidably mounted inside the bottom rotating ring (228), a one-way spring (231) being provided between the one-way teeth (230) and the bottom rotating ring (228), an arc surface being provided on the bottom rotating ring (228), and the bottom rotating ring (228) engaging with the ratchet (232).

9. The diamond composite material surface metallization treatment apparatus according to claim 1, characterized in that: The stirring mechanism includes an extension frame (301) fixedly installed on the base (211), a downward pressure bracket (302) rotatably installed on the extension frame (301), a downward pressure plate (303) fixedly installed on the downward pressure bracket (302), two columns (304) fixedly installed on the extension frame (301), a lifting plate (305) slidably installed on the columns (304), a downward pressure spring (306) is provided between the lifting plate (305) and the extension frame (301), and two docking wheels (307) rotatably installed on the lifting plate (305), the docking wheels (307) contacting the lower surface of the downward pressure plate (303).

10. The diamond composite material surface metallization treatment apparatus according to claim 9, characterized in that: The agitation mechanism also includes a fixed lead screw (309) fixedly mounted on the extension frame (301), a rotating nut (308) rotatably mounted on the lifting plate (305), the rotating nut (308) having an internal thread, the rotating nut (308) and the fixed lead screw (309) forming a threaded transmission, a drive wheel (310) fixedly mounted below the rotating nut (308), a bottom wheel (315) rotatably mounted on the base (211), and a rotating wheel (315) fixedly mounted on the bottom wheel (315). A rotating column (314) is provided with a driven wheel (311) slidably mounted on it. A transmission belt (313) is wound around the driven wheel (311) and the driving wheel (310). A synchronizing plate (312) is provided between the driving wheel (310) and the driven wheel (311). The synchronizing plate (312) enables the driving wheel (310) and the driven wheel (311) to rise and fall synchronously. A transmission belt (316) is wound around the bottom wheel (315) and the bottom rotating ring (228).

Images