Adsorption refrigeration equipment and server system

Abstract

This invention discloses an adsorption refrigeration device, comprising: an adsorption bed, wherein the adsorption chamber of the adsorption bed is provided with an adsorbent to exchange heat with a heat exchange channel; a heat source supply port for obtaining high-temperature fluid at the heat source load; a heat source inlet for introducing a desorption heat source fluid into the heat exchange channel; and a buffer tank for mixing the fluid introduced at the inlet with the existing liquid before exporting it to the outlet. The buffer tank is disposed between the heat source supply port and the heat source inlet to facilitate heat transfer. In the above-mentioned adsorption refrigeration device, the addition of a buffer tank effectively buffers temperature fluctuations in the high-temperature fluid supplied by the heat source load. Therefore, this adsorption refrigeration device effectively solves the problem of poor adaptability of current adsorption refrigeration devices. This invention also discloses a server system including the above-mentioned adsorption refrigeration device.

Description

Technical Field

[0001] This invention relates to the field of liquid cooling technology, and more specifically, to an adsorption refrigeration device, and also to a server system including the above-mentioned adsorption refrigeration device. Background Technology

[0002] Currently, data center air conditioning units mainly rely on the traditional method of converting electrical energy into mechanical energy for cooling. The high power consumption and heat generated by data centers, as well as the inexhaustible natural cooling sources, are not fully utilized. This waste heat utilization cooling solution can make full use of the heat of the data center, without the need for compressor cooling, and can still provide the cooling capacity required by the data center.

[0003] In the process of realizing this invention, the inventors discovered at least the following problems in the prior art: When designing an adsorption refrigeration system, it is necessary to consider the temperature type of the heat source fluid supplied on-site in order to select the corresponding heat-driven adsorption refrigeration system. When the heat source fluid enters the adsorption bed in the desorption stage, if the fluctuation range of the heat source fluid is relatively large, the desorption efficiency of the adsorption bed will be unstable. Once the desorption efficiency of the adsorption bed is unstable, the desorption time will also be unstable. Unstable desorption time will lead to unstable operation of the entire system, which will result in a significant decrease in COP (Coefficient of Performance). Summary of the Invention

[0004] In view of this, the first objective of the present invention is to provide an adsorption refrigeration device that can effectively solve the problem that the heat source utilization rate of current adsorption refrigeration devices is still not high. The second objective of the present invention is to provide a server system including the above-mentioned adsorption refrigeration device.

[0005] To achieve the first objective mentioned above, the present invention provides the following technical solution:

[0006] An adsorption refrigeration device, comprising:

[0007] An adsorption bed, wherein the adsorption chamber of the adsorption bed is provided with an adsorbent to exchange heat with a heat exchange channel;

[0008] Heat source supply port, used to obtain high-temperature fluid from the heat source load;

[0009] A heat source inlet is used to introduce a desorption heat source fluid into the heat exchange channel;

[0010] A buffer tank is provided to allow the fluid introduced through the inlet to mix with the existing liquid before being discharged to the outlet. The buffer tank is located between the heat source supply port and the heat source inlet port to enable heat transfer.

[0011] In the aforementioned adsorption refrigeration equipment, during operation, the heat source supply port is connected to the corresponding heat source load to obtain a high-temperature fluid. Then, the corresponding adsorption bed in the adsorption refrigeration equipment enters a desorption state. In this state, the high-temperature fluid enters directly or indirectly through a buffer tank. Within the buffer tank, the heat is balanced by the fluid stored there. The fluid is then supplied directly or indirectly to the heat source inlet through the outlet. This significantly reduces the temperature fluctuation of the desorption heat source fluid at the heat source inlet compared to the temperature fluctuation of the high-temperature fluid at the heat source supply port, resulting in more stable and uniform desorption in the adsorption bed. In summary, by adding a buffer tank, the aforementioned adsorption refrigeration equipment effectively buffers temperature fluctuations in the high-temperature fluid supplied by the heat source load. Therefore, this adsorption refrigeration equipment effectively solves the problem of poor adaptability in current adsorption refrigeration equipment.

[0012] In some technical solutions, a central heat exchanger is also included, which includes two fluid channels capable of exchanging heat with each other. The inlet of the buffer tank is connected to the heat source supply port, and the outlet of the buffer tank is connected to the inlet of one fluid channel of the central heat exchanger. The outlet of the other fluid channel of the central heat exchanger is connected to the heat source inlet.

[0013] In some technical solutions, the inlet of the buffer tank is connected to the heat source supply port, and the outlet of the buffer tank is connected to the heat source inlet port.

[0014] In some technical solutions, the capacity of the buffer tank is the volume of heat source fluid required for the adsorption bed to complete one desorption cycle.

[0015] In some technical solutions, a heat source outlet is also included, which is used to supply the desorption heat source fluid discharged from the heat exchange channel to the heat source load.

[0016] Some technical solutions also include a cooling heat exchanger, which includes a cooling channel and a temperature control channel that can exchange heat with each other. One end of the cooling channel is connected to the outlet of the heat exchange channel, and the other end is connected to the heat source outlet. The temperature control channel is used to introduce cooling fluid.

[0017] Some technical solutions include a condenser, an evaporator, a cooling fluid inlet, a cooling fluid outlet, and a heat source outlet;

[0018] The evaporation chamber of the evaporator is optionally connected to the adsorption chambers corresponding to different adsorption beds in the plurality of adsorption beds through the first valve group. The evaporator is also provided with a refrigeration fluid channel for heat exchange with the liquid adsorption working fluid in the evaporation chamber.

[0019] The condenser's condensing chamber is optionally connected to the adsorption chambers corresponding to different adsorption beds in the plurality of adsorption beds through a second valve group. The condenser is also provided with a cooling fluid channel for exchanging heat with the gaseous adsorption working fluid in the condensing chamber.

[0020] The first end of each heat exchange channel is optionally connected to the heat source inlet via a first multi-way valve, and the second end of each heat exchange channel is optionally connected to the heat source outlet via a second multi-way valve, so that each heat exchange channel can optionally be supplied with desorption heat source fluid, and the cooling channel is connected in series between the heat source outlet and the heat source discharge outlet.

[0021] The first end of each heat exchange channel is optionally connected to the cooling fluid inlet via a third multi-way valve, and the second end of each heat exchange channel is optionally connected to the cooling fluid outlet via a fourth multi-way valve, so that cooling fluid can be optionally introduced. The cooling fluid inlet is used to obtain cooling fluid from the cooling fluid supply port, and the cooling fluid outlet is used to discharge cooling fluid to the cooling fluid return port.

[0022] In some technical solutions, the temperature control channel is connected in series between the cooling fluid inlet and the cooling fluid supply port or between the cooling fluid outlet and the cooling fluid return port; the two ends of the cooling fluid channel are respectively connected to the cooling fluid supply port and the cooling fluid return port.

[0023] In some technical solutions, a natural cooling device is also included, wherein the supply port of the natural cooling device is connected to the cooling fluid supply port, and the return port of the natural cooling device is connected to the cooling fluid return port.

[0024] To achieve the second objective mentioned above, the present invention also provides a server system comprising any of the aforementioned adsorption cooling devices, including a server liquid cooling device. The server liquid cooling device includes a liquid cooling plate for dissipating heat from the chip. The inlet of the liquid cooling channel of the liquid cooling plate is connected to the heat source return port of the adsorption cooling device, and the outlet of the liquid cooling channel of the liquid cooling plate is connected to the heat source supply port of the adsorption cooling device. Since the aforementioned adsorption cooling device has the above-mentioned technical effects, the server system having this adsorption cooling device should also have the corresponding technical effects. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the structure of an adsorption refrigeration device provided in an embodiment of the present invention;

[0027] Figure 2 This is a schematic diagram of the structure of a second adsorption refrigeration device provided in an embodiment of the present invention.

[0028] The following labels are shown in the attached diagram:

[0029] 1. Adsorption bed; 2. Heat source supply port; 3. Heat source discharge port; 4. Cooling heat exchanger; 5. Buffer tank; 6. Cooling fluid supply port; 7. Cooling fluid return port; 8. Condenser; 9. Evaporator; 10. Cooling fluid inlet; 11. Cooling fluid outlet; 12. Heat source outlet; 13. First valve group; 14. Second valve group; 15. First multi-way valve; 16. Second multi-way valve; 17. Third multi-way valve; 18. Fourth multi-way valve; 19. Refrigerated fluid channel; 20. Cooling fluid channel; 21. Natural cooling device; 22. Heat exchange channel; 23. Central heat exchanger; 24. Heat source load; 25. Heat source inlet.

[0030] Cooling channel 4-1, temperature control channel 4-2. Detailed Implementation

[0031] This invention discloses an adsorption refrigeration device that can effectively solve the problem that the heat source utilization rate of current adsorption refrigeration devices is still not high.

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] Please see Figures 1-2 , Figure 1 This is a schematic diagram of the structure of an adsorption refrigeration device provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of a second adsorption refrigeration device provided in an embodiment of the present invention.

[0034] In some embodiments, an adsorption refrigeration device is provided. Specifically, the adsorption refrigeration device mainly includes an adsorption bed 1, a heat source supply port 2, a heat source inlet 25, and a buffer tank 5. It is also generally provided with a condenser 8 and an evaporator 9.

[0035] The adsorption chamber of adsorption bed 1 is equipped with an adsorbent, and the working fluid used in conjunction with the adsorbent can flow through the adsorption chamber and the evaporation chamber of evaporator 9, as well as through condenser 8. The working fluid and adsorbent are combined to form a working fluid pair. In an adsorption refrigeration system, multiple sets of working fluid pairs can be provided. One adsorbent can correspond to multiple working fluids, or multiple adsorbents can correspond to one working fluid.

[0036] For adsorption bed 1, there are two main working states: adsorption and desorption, which are generally carried out in stages. In the adsorption state, a low-temperature fluid is used to cool adsorption bed 1, allowing the adsorbent in adsorption bed 1 to adsorb the gaseous working medium, thus ensuring continuous adsorption capacity of the adsorption chamber until the adsorbent reaches a preset saturation state. Taking physical adsorption as an example, the gaseous working medium will liquefy into a liquid state to maintain a low-pressure state within the adsorption chamber, enabling continuous external suction of the gaseous working medium, such as continuously adsorbing the gaseous working medium from evaporator 9, allowing evaporator 9 to continuously evaporate and absorb heat. Of course, adsorption bed 1 can also obtain the gaseous working medium from an external source, rather than from evaporator 9. In the desorption state, the adsorption bed 1 is generally heated by a high-temperature fluid, so that the adsorbent in the adsorbent is desorbed from the adsorbent and re-formed into a gaseous adsorbent. The gaseous adsorbent enters the condenser 8 and is liquefied into a liquid adsorbent in the condenser 8. Alternatively, the adsorbent can be discharged to the outside.

[0037] The adsorption bed 1 generally has a heat exchange channel 22 for heat exchange with the adsorbent in the adsorption chamber. This heat exchange channel 22 refers to a channel capable of carrying at least a high-temperature fluid (heat source fluid) during the desorption phase of the adsorption bed 1. During the adsorption phase, the heat exchange channel 22 can be closed or used to carry a low-temperature fluid. The heat exchange channel 22 can exchange heat with the adsorbent, ensuring that during the desorption phase, a high-temperature fluid flows through it, keeping the entire adsorption chamber at a high temperature. After absorbing heat, the adsorbent desorbs a gaseous adsorbent, which absorbs heat from the high-temperature fluid in the heat exchange channel 22. This gaseous adsorbent can be discharged to the outside or into the condensation chamber of the condenser 87, where it is condensed back into a gaseous adsorbent. It should be noted that one heat exchange channel 22 can be provided for alternating flow of high-temperature and low-temperature fluids; alternatively, one heat exchange channel 22 can be dedicated to carrying the low-temperature fluid, while another channel can be dedicated to carrying the high-temperature fluid.

[0038] The heat source supply port 2 is used to obtain the high-temperature fluid flowing out of the heat source load 24. In practice, it can be directly connected to the fluid channel outlet of the heat source load 24, or it can be transferred to the fluid in the heat source supply port 2 via a heat exchanger. The heat source load 24 generally refers to equipment capable of forming a high-temperature fluid. For some heat source loads 24, fluid needs to be introduced to exchange heat with the heat-generating parts. When the introduced fluid absorbs heat, it becomes high-temperature, thus forming a high-temperature fluid. This process achieves cooling of the heat source load 24. Specific heat source loads 24 include server liquid cooling equipment. Generally, a heat source load 24 with a large heat output and a high temperature is selected as the driving heat source for driving the desorption of the adsorption bed 1.

[0039] The heat source inlet 25 is used to introduce the desorption heat source fluid into the heat exchange channel 22 of the adsorption bed 1, at which point the adsorption bed 1 enters the desorption state. That is, after the adsorption bed 1 completes adsorption, the desorption heat source fluid is introduced into the heat exchange channel 22 of the adsorption bed 1 through the heat source inlet 25, and then the adsorption bed 1 begins desorption until desorption is completed, at which point the introduction of the heat source fluid stops. Generally, adsorption refrigeration equipment is equipped with multiple adsorption beds 1. During operation, some adsorption beds 1 perform desorption, while others perform adsorption.

[0040] The buffer tank 5 is a container capable of holding a certain volume of fluid, and is equipped with an inlet and an outlet. The buffer tank 5 is characterized by its ability to mix the fluid introduced through the inlet with the existing liquid, and then discharge the mixture to the outlet. The capacity of the buffer tank 5 is set according to actual needs; generally, the buffer capacity is consistent with the flow rate of the heat source fluid required for desorption in the adsorption bed 1 during the first desorption stage. Specific buffer designs can refer to existing heat storage tanks.

[0041] Generally, liquids have the characteristic of rising when heated and falling when cooled. Therefore, the buffer tank 5 can be a liquid storage container with an inlet at the top and an outlet at the bottom. The fluid entering through the inlet mixes with other fluids during its descent, thus ensuring that the fluid entering through the outlet is fully mixed with the existing fluid.

[0042] If the existing liquid temperature is around 60 degrees Celsius, and the incoming fluid temperature is 50 degrees Celsius, due to the large volume of existing liquid, the outlet liquid temperature will gradually decrease from 60 degrees Celsius over time, and the rate of decrease will be very slow. This effectively transfers the existing heat as supplementary heat. Compared to when there is no buffer tank 5, the outlet fluid temperature will be more stable over a longer period, and the temperature will slowly decrease, preventing a rapid drop in outlet temperature. If the capacity is large, the delay time will be even longer, preventing the temperature of the desorption heat source fluid from becoming too low.

[0043] Conversely, if the liquid temperature is around 60 degrees Celsius, and the incoming fluid temperature is 65 degrees Celsius, due to the large volume of liquid, the outlet liquid temperature will rise from 60 degrees Celsius as the inflow time increases, and the rate of increase will be very slow. This is actually to store the excess heat from the inlet by heating the liquid in the buffer tank 5. Therefore, the outlet temperature will be lower than the inlet temperature, and will not cause the temperature of the heat source fluid for desorption to be too high.

[0044] After the delay, as long as the current fluctuation range is avoided from being too large and the changes are slow, other means can be used to adjust the ratio of desorption time to adsorption time of adsorption bed 1.

[0045] The buffer tank 5 is located between the heat source supply port 2 and the heat source inlet 25 to enable heat transfer. The inlet of the buffer tank 5 and the heat source supply port 2 can be directly connected, that is, the fluid from the heat source supply port 2 can be directly introduced into the inlet of the buffer tank 5 to enter the buffer tank 5; or heat exchange can be performed through a heat exchanger to transfer the heat from the heat source supply port 2 to the fluid at the inlet of the buffer tank 5.

[0046] Correspondingly, the outlet of the buffer tank 5 and the heat source inlet 25 can also be directly connected, that is, the fluid flowing out of the outlet of the buffer tank 5 can be directly supplied to the heat source inlet 25; or heat exchange can be carried out through a heat exchanger, so that the heat from the outlet of the buffer tank 5 can be transferred to the heat source inlet 25 through the heat exchanger.

[0047] Specifically, how the heat transfer occurs between the heat source supply port 2 and the heat source inlet port 25 can be configured as needed.

[0048] In the aforementioned adsorption refrigeration equipment, during use, the heat source supply port 2 is connected to the corresponding heat source load to obtain a high-temperature fluid. Then, the corresponding adsorption bed 1 in the adsorption refrigeration equipment enters a desorption state. In this state, the high-temperature fluid enters directly or indirectly through the buffer tank 5. Within the buffer tank 5, the heat is balanced by the fluid stored there. Then, the fluid is supplied directly or indirectly to the heat source inlet 25 through the outlet. This results in a significantly smaller temperature fluctuation of the desorption heat source fluid at the heat source inlet 25 compared to the temperature fluctuation of the high-temperature fluid at the heat source supply port 2, thus making the desorption of the adsorption bed 1 more stable and uniform. In summary, by adding the buffer tank 5, the temperature fluctuations of the high-temperature fluid supplied by the heat source load 24 can be effectively buffered in the aforementioned adsorption refrigeration equipment. Therefore, this adsorption refrigeration equipment can effectively solve the problem of poor adaptability of current adsorption refrigeration equipment.

[0049] In some embodiments, as shown in the appendix Figure 1As shown, a central heat exchanger 23 is provided. Specifically, the central heat exchanger 23 includes two fluid channels capable of exchanging heat with each other, such as a first fluid channel and a second fluid channel. The inlet of the buffer tank 5 can be connected to the heat source supply port 2, and the outlet of the buffer tank 5 can be connected to the inlet of the first fluid channel. The outlet of this fluid channel can return the fluid to the heat source load 24 to absorb heat again, and then return to the buffer tank 5 to form a cycle. The outlet of the second fluid channel is connected to the heat source inlet 25, so that the fluid entering through the inlet of the second fluid channel can absorb heat from the first fluid channel to obtain the corresponding heat, and then be discharged from the outlet of the second fluid channel to be introduced into the heat source inlet 25 as the heat source fluid for desorption in the adsorption bed 1. Of course, the inlet of the second fluid channel can be connected to the heat source fluid outlet to form a circulation system. To ensure circulation, a liquid pump can be installed at the inlet of the second fluid channel.

[0050] In some embodiments, as shown in the appendix Figure 2 As shown, to avoid high thermal resistance, the inlet of buffer tank 5 can be connected to the heat source supply port 2, while the outlet of buffer tank 5 can be connected to the heat source inlet 25. That is, the high-temperature fluid after heat exchange from the heat source load 24 enters the heat source supply port 2, and then enters the buffer tank 5, where it is buffered. After buffering, it flows out from the outlet and into the heat source inlet 25 as the heat source fluid for desorption, and then enters the heat transfer channel of the adsorption bed 1. In the adsorption bed 1, the adsorbent is heated to complete desorption.

[0051] In some embodiments, when a heat source outlet 3 is provided, the heat source outlet 3 can be further used to supply the desorption heat source fluid discharged from the heat exchange channel 22 to the heat source load 24, thereby achieving circulation connection. In this case, the heat source can be fully utilized.

[0052] In some embodiments, for low-grade heat sources, the temperature of the heat source fluid used for desorption does not drop significantly after it enters the adsorption bed 1 and releases heat. Therefore, the temperature of the heat source fluid discharged from the heat source outlet 3 will not be too low. If it is directly returned to the heat source load 24, then the heat exchange area of ​​the heat source load 24 will be subject to very high requirements. Based on this, a cooling heat exchanger 4 can be provided, including a cooling channel 4-1 and a temperature control channel 4-2 that can exchange heat with each other. One end of the cooling channel 4-1 is connected to the outlet of the heat exchange channel 22, and the other end is connected to the heat source outlet 3. The temperature control channel 4-2 is used to introduce cooling fluid to cool the fluid in the cooling channel 4-1, so that the temperature of the fluid discharged from the heat source outlet 3 can be controlled.

[0053] In some embodiments, a cooling fluid supply port 6 and a cooling fluid return port 7 are further included for supplying cooling fluid to the adsorption bed 1 for cooling during the adsorption stage of the adsorption bed 1. Generally, when a condenser 8 is provided, the condenser 8 also needs to be cooled.

[0054] In some embodiments, the temperature control channel 4-2 and the heat exchange channel 22 can be connected in series between the cooling fluid supply port 6 and the cooling fluid return port 7, so that the temperature control channel 4-2 and the heat exchange channel 22 can share the cooling fluid.

[0055] In some embodiments, multiple adsorption beds 1 are typically provided, forming multiple heat exchange channels 22. Desorption and adsorption do not occur simultaneously in some adsorption beds 1. Generally, some adsorption beds 1 perform desorption while others perform adsorption, ensuring that some adsorption beds 1 are always adsorbing while others are desorbing, thus guaranteeing the continuity of heat source utilization and cooling. As shown in the attached figure, two adsorption beds 1 are provided, each equipped with a heat exchange channel 22. The two adsorption beds 1 alternately perform adsorption and desorption. Preheating and precooling are required during switching, but the switching time is generally very short and can be ignored. The precooling stage, in particular, has a beneficial effect on the heat source load 24. A single heat exchange channel 22 in the adsorption bed 1 can be a single-channel structure or a multi-channel parallel structure.

[0056] For ease of control and switching, the first end of each heat exchange channel 22 is optionally connected to the heat source inlet 25 via a first multi-way valve 15, and the second end of each heat exchange channel 22 is optionally connected to the heat source outlet 12 via a second multi-way valve 16, so that each heat exchange channel 22 can selectively receive the desorption heat source fluid. A cooling channel 4-1 is connected in series between the heat source outlet 12 and the heat source discharge outlet 3, so that the hot fluid discharged from the heat source outlet 12 can first pass through the cooling channel 4-1 for corresponding cooling, thus preventing excessive temperature.

[0057] In some embodiments, a typical adsorption refrigeration device is provided with a condenser 8 and an evaporator 9. Generally, the condenser 8 and the evaporator 9 are provided separately, but they can also be provided together, such as by using a heat exchanger to be used alternately as the condenser 8 and the evaporator 9.

[0058] The evaporator 9 has an evaporation chamber that can be optionally connected to the adsorption chambers of different adsorption beds 1 in the plurality of adsorption beds 1 via a first valve group 13. The evaporator 9 also has a chilled fluid channel 19 for heat exchange with the liquid adsorbent in the evaporation chamber. The chilled fluid channel 19 is used to cool the object being cooled. Generally, the chilled fluid channel 19 and the channel in the object being cooled form a circulating flow so that after absorbing heat in the object, it flows back into the chilled fluid channel 19 and then releases heat in the evaporator 9, causing the liquid adsorbent in the evaporation chamber to evaporate and carry away the heat. When the adsorption bed 1 is in the adsorption stage, the adsorption chamber of the adsorption bed 1 is connected to the evaporation chamber, allowing the gaseous adsorbent in the evaporation chamber to enter the adsorption chamber and be adsorbed by the adsorbent. The first valve group 13 can be a multi-way valve or a valve group formed by combining multiple switching valves. As shown in the attached figure, the outlet of the evaporation chamber is connected to the adsorption chamber of each adsorption bed 1 via multiple switching valves. It should be noted that there can be one evaporator 9 or multiple evaporators 9.

[0059] The condensing chamber of the condenser 8 is optionally connected to the adsorption chambers of different adsorption beds 1 in the plurality of adsorption beds 1 through the second valve group 14. The condenser 8 is also provided with a cooling fluid channel 20 for heat exchange with the gaseous adsorbent in the condensing chamber. The cooling fluid channel 20 mainly introduces external cooling water to absorb heat from the gaseous adsorbent in the condensing chamber, allowing the gaseous adsorbent to condense into a liquid adsorbent, thus enabling continuous intake of gaseous adsorbent from the corresponding adsorption chamber. When the adsorption bed 1 is in the desorption stage, the adsorption chamber of that adsorption bed 1 is connected to the condensing chamber. The second valve group 14 can be a multi-way valve or a valve group formed by combining multiple switching valves. As shown in the attached figure, the inlet of the condensing chamber is connected to the adsorption chamber of each adsorption bed 1 through multiple switching valves. It should be noted that there can be one condenser 8 or multiple condensers 8.

[0060] In some embodiments, a cooling fluid inlet 10 connected to the cooling fluid supply port 6 and a cooling fluid outlet 11 connected to the cooling fluid return port 7 may be further provided. Specifically, the first end of each heat exchange channel 22 may be optionally connected to the cooling fluid inlet 10 via a third multi-way valve 17, and the second end of each heat exchange channel 22 may be optionally connected to the cooling fluid outlet 11 via a fourth multi-way valve 18, so that adsorption cooling fluid can be optionally introduced. The cooling fluid inlet 10 is used to obtain cooling fluid from the cooling fluid supply port 6, and the cooling fluid outlet 11 is used to discharge cooling fluid to the cooling fluid return port 7. At this time, the cooling fluid used to cool the adsorbent in the adsorption stage and the heating fluid used to heat the adsorbent in the desorption stage can share the heat exchange channel 22, so that the heat exchange channel 22 alternately receives the desorption heat source fluid and the adsorption cooling fluid.

[0061] Furthermore, the temperature control channel 4-2 and the heat exchange channel 22 can be connected in parallel. That is, the channel between the cooling fluid inlet 10 and the cooling fluid supply port 6 can be connected in parallel with the temperature control channel 4-2, thus avoiding mutual interference. In this case, an adjustable valve with an adjustable valve opening can be installed on the temperature control channel 4-2 to control the heat exchange efficiency of the temperature control channel 4-2, thereby controlling the fluid temperature at the outlet of the cooling supply channel 4-1 as needed.

[0062] Alternatively, the temperature control channel 4-2 can be connected in series between the cooling fluid inlet 10 and the cooling fluid supply port 6, or between the cooling fluid outlet 11 and the cooling fluid return port 7. Generally, during the adsorption stage, the temperature at the outlet of the heat exchange channel 22 will not be too high, and the temperature control channel 4-2 is connected in series between the cooling fluid outlet 11 and the cooling fluid return port 7.

[0063] Furthermore, the cooling fluid channel 20 in the condenser 8 is connected to a cooling fluid supply port 6 and a cooling fluid return port 7 at its two ends, respectively. Specifically, the cooling fluid channel 20 and the heat exchange channel 22 in the adsorption stage can be connected in series or in parallel. For example, the cooling fluid channel 20 can be connected in series between the heat exchange channel 22 and the cooling fluid inlet 10, or in series between the heat exchange channel 22 and the cooling fluid outlet 11, or the heat exchange channel 22 and the cooling fluid channel 20 can be connected in parallel between the cooling fluid inlet 10 and the cooling fluid outlet 11.

[0064] In some embodiments, a natural cooling device 21 may be included to provide cooling fluid. Specifically, the supply port of the natural cooling device 21 may be connected to the cooling fluid supply port 6, and the return port of the natural cooling device 21 may be connected to the cooling fluid return port 7. That is, the natural cooling device 21 receives fluid cooled by natural cooling, which flows from its supply port into the cooling fluid supply port 6. After subsequent heat absorption, the fluid is heated, for example, by acquiring heat in the cooling fluid channel 20, the temperature control channel 4-2, and the heat exchange channel 22 in the adsorption stage. After being heated, the fluid flows out from the cooling fluid return port 7 and enters the return port of the natural cooling device 21 for further cooling by the natural cooling device 21.

[0065] The natural cooling device 21 can be either an air-cooled device or an evaporative cooling device, depending on the specific requirements.

[0066] Based on the adsorption cooling device provided in the above embodiments, the present invention also provides a server system. This server system includes any one of the adsorption cooling devices described in the above embodiments, including a server liquid cooling device. The server liquid cooling device includes a liquid cooling plate for dissipating heat from the chip. The liquid cooling channel inlet of the liquid cooling plate is connected to the heat source outlet 3 of the adsorption cooling device, and the liquid cooling channel outlet of the liquid cooling plate is connected to the heat source supply port 2 of the adsorption cooling device. Since this server system uses the adsorption cooling device described in the above embodiments, the beneficial effects of this server system are explained in the above embodiments.

[0067] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0068] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A sorption refrigeration apparatus, characterized by include: Adsorption bed (1), wherein the adsorption chamber of the adsorption bed (1) is provided with an adsorbent so that it can exchange heat with the heat exchange channel (22); Heat source supply port (2) is used to obtain high-temperature fluid at the heat source load (24); A heat source inlet (25) is used to introduce a desorption heat source fluid into the heat exchange channel (22); The buffer tank (5) is designed to allow the fluid introduced into the inlet to mix with the existing liquid and then be discharged to the outlet. The buffer tank (5) is located between the heat source supply port (2) and the heat source inlet port (25) to enable heat transfer.

2. The adsorption refrigeration device according to claim 1, characterized in that It also includes a central heat exchanger (23), which includes two fluid channels that can exchange heat with each other. The inlet of the buffer tank (5) is connected to the heat source supply port (2), and the outlet of the buffer tank (5) is connected to the inlet of one fluid channel of the central heat exchanger (23). The outlet of the other fluid channel of the central heat exchanger (23) is connected to the heat source inlet port (25).

3. The adsorption refrigeration device according to claim 1, characterized in that The inlet of the buffer tank (5) is connected to the heat source supply port (2), and the outlet of the buffer tank (5) is connected to the heat source inlet port (25).

4. The adsorption refrigeration device according to claim 3, characterized in that The capacity of the buffer tank (5) is the amount of heat source fluid required for the desorption bed (1) to complete one desorption.

5. The adsorption refrigeration device according to claim 4, characterized in that It also includes a heat source outlet (3), which is used to supply the desorption heat source fluid discharged from the heat exchange channel (22) to the heat source load (24).

6. The adsorption refrigeration device according to claim 5, characterized in that It also includes a cooling heat exchanger (4), which includes a cooling channel (4-1) and a temperature control channel (4-2) that can exchange heat with each other. One end of the cooling channel (4-1) is connected to the outlet of the heat exchange channel (22), and the other end is connected to the heat source outlet (3). The temperature control channel (4-2) is used to introduce cooling fluid.

7. The adsorption refrigeration device according to claim 6, characterized in that It includes a condenser (8), an evaporator (9), a cooling fluid inlet (10), a cooling fluid outlet (11), and a heat source outlet (12). The evaporation chamber of the evaporator (9) can be optionally connected to the adsorption chambers of different adsorption beds (1) in the plurality of adsorption beds (1) through the first valve group (13). The evaporator (9) is also provided with a refrigeration fluid channel (19) for exchanging heat with the liquid adsorption working fluid in the evaporation chamber. The condenser (8) has its condensation chamber connected to the adsorption chambers of different adsorption beds (1) in the plurality of adsorption beds (1) via a second valve group (14). The condenser (8) is also provided with a cooling fluid channel (20) for exchanging heat with the gaseous adsorption working fluid in the condensation chamber. The first end of each heat exchange channel (22) is optionally connected to the heat source inlet (25) via a first multi-way valve (15), and the second end of each heat exchange channel (22) is optionally connected to the heat source outlet (12) via a second multi-way valve (16), so that each heat exchange channel (22) can optionally be supplied with desorption heat source fluid, and the cooling channel (4-1) is connected in series between the heat source outlet (12) and the heat source discharge outlet (3); The first end of each heat exchange channel (22) is optionally connected to the cooling fluid inlet (10) via a third multi-way valve (17), and the second end of each heat exchange channel (22) is optionally connected to the cooling fluid outlet (11) via a fourth multi-way valve (18) so that cooling fluid can be optionally introduced. The cooling fluid inlet (10) is used to obtain cooling fluid from the cooling fluid supply port (6), and the cooling fluid outlet (11) is used to discharge cooling fluid to the cooling fluid return port (7).

8. The adsorption refrigeration device according to claim 7, characterized in that The temperature control channel (4-2) is connected in series between the cooling fluid inlet (10) and the cooling fluid supply port (6) or between the cooling fluid outlet (11) and the cooling fluid return port (7); the two ends of the cooling fluid channel (20) are respectively connected to the cooling fluid supply port (6) and the cooling fluid return port (7).

9. The adsorption refrigeration device according to claim 8, characterized in that It also includes a natural cooling device (21), the supply port of which is connected to the cooling fluid supply port (6), and the return port of which is connected to the cooling fluid return port (7).

10. A server system comprising a server liquid cooling apparatus, the server liquid cooling apparatus comprising a liquid cooling plate for dissipating heat from a chip, characterized in that, The adsorption refrigeration device as described in any one of claims 1-9 is provided, wherein the liquid cooling channel inlet of the liquid cooling plate is connected to the heat source outlet (3) of the adsorption refrigeration device, and the liquid cooling channel outlet of the liquid cooling plate is connected to the heat source supply port (2) of the adsorption refrigeration device.

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