An optical module

Abstract

The optical module disclosed herein includes a first circuit board, a second circuit board, a fixing plate, and an optical emitting component. The first circuit board is used to transmit non-high-frequency signals and high-frequency signals, and the second circuit board is electrically connected to the first circuit board to transmit non-high-frequency signals. The fixing plate is located below the junction of the first and second circuit boards, supporting the first and second circuit boards. In the optical emitting component, the optical modulation chip includes a first input optical port, a second input optical port, and a third input optical port, and the optical modulation chip includes a first beam splitter, a second beam splitter, and a third beam splitter. The input port of the first beam splitter is optically connected to the second input optical port. One input port of the second beam splitter is optically connected to the third input optical port, and the other input port is optically connected to the first output port of the first beam splitter. One input port of the third beam splitter is optically connected to the first input optical port, and the other input port is optically connected to the second output port of the first beam splitter, compatible with lasers of different output optical powers, realizing multi-channel output.

Description

Technical Field

[0001] This disclosure relates to the field of optical communication technology, and in particular to an optical module. Background Technology

[0002] With the development of new business and application models such as cloud computing, mobile internet, and video, advancements in optical communication technology have become increasingly important. In optical communication technology, the optical module, as one of the key components in optical communication equipment, enables photoelectric signal conversion; and in the development of optical communication technology, the data transmission rate of optical modules is required to continuously improve. Summary of the Invention

[0003] Some embodiments provide an optical module that uses a first circuit board to transmit high-frequency signals and non-high-frequency signals, and a second circuit board to transmit non-high-frequency signals. At the same time, the optical modulation chip is compatible with lasers with different output optical powers.

[0004] In some embodiments, an optical module is provided, comprising:

[0005] The first circuit board is configured to transmit high-frequency signals and non-high-frequency signals;

[0006] The second circuit board is configured to transmit non-high frequency signals; the dielectric constant of the first circuit board is lower than that of the second circuit board; the second circuit board is electrically connected to the first circuit board.

[0007] A fixing plate has the first circuit board on one end and the second circuit board on the other end to fix the first circuit board and the second circuit board together.

[0008] A light-emitting component is disposed on the surface of the fixed plate, the light-emitting component comprising:

[0009] A laser, configured to emit light without carrying a signal, is electrically connected to the second circuit board;

[0010] An optical modulation chip, located in the optical path of the laser output, is configured to modulate the signal-free light to generate an optical signal; the surface of the optical modulation chip is electrically connected to the first circuit board and the second circuit board respectively; the optical modulation chip includes:

[0011] The first input optical port is located at the light input end of the optical modulation chip; when the output optical power of the laser is not higher than a preset value, the first input optical port is optically connected to the laser.

[0012] The second input optical port is located at the light input end of the optical modulation chip; when the output optical power of the laser is higher than a preset value, the second input optical port is optically connected to the laser.

[0013] The third input optical port is located at the light input end of the optical modulation chip; when the output optical power of the laser is not higher than a preset value, the third input optical port is optically connected to the laser.

[0014] The first optical splitter includes an input port, a first output port and a second output port, wherein the input port is optically connected to the second input port.

[0015] The second beam splitter includes two optical inlets and two optical outlets, wherein one optical inlet is optically connected to the third optical inlet, and the other optical inlet is optically connected to the first optical outlet of the first beam splitter.

[0016] The third beam splitter includes two optical inlets and two optical outlets, wherein one optical inlet is optically connected to the first optical inlet, and the other optical inlet is optically connected to the second optical outlet of the first beam splitter.

[0017] The fiber optic array is configured to transmit the optical signal modulated by the optical modulation chip.

[0018] The above technical solution has the following advantages or beneficial effects: The optical module includes a first circuit board, a second circuit board, a fixing plate, and a light emitting component. Gold fingers are formed on one end surface of the first circuit board, and high-frequency and non-high-frequency signals output by the gold fingers are transmitted along the surface of the first circuit board. The second circuit board is used to transmit non-high-frequency signals. The first and second circuit boards are electrically connected so that the non-high-frequency signals output by the gold fingers are transmitted from the first circuit board to the second circuit board. High-frequency signals are transmitted along the first circuit board, and non-high-frequency signals are transmitted along the first circuit board or from the first circuit board to the second circuit board for transmission. The dielectric constant of the first circuit board is lower than that of the second circuit board to support high-frequency signal transmission. Low-dielectric-constant materials have higher costs; therefore, using circuit boards with different dielectric constants can reduce costs. Simultaneously, the design of the first circuit board requires strict control over interlayer structure, layout, and wiring to provide better signal shielding and anti-interference capabilities to support high-frequency signal transmission. The design of the second circuit board is relatively simple. The first and second circuit boards are electrically connected by wire bonding, resulting in a weaker fixed connection. A first circuit board is mounted on one end of a fixed plate, and a second circuit board is mounted on the other end to fix the first and second circuit boards together, thereby enhancing the fixation between them. A light-emitting component is located on the surface of the fixed plate, providing a stable optical platform for the component while allowing heat generated by the component to be conducted away. A first clearance notch is formed on the surface of the second circuit board to allow the light-emitting component mounted on the fixed plate to pass. The light-emitting component, located within the first clearance notch, includes a laser, an optical modulation chip, and a fiber array. The laser is electrically connected to the second circuit board, allowing a low-frequency current signal to be input to the laser via the second circuit board, driving the laser to output light without a signal. The optical modulation chip is configured to modulate the light emitted by the laser, generating an optical signal. The surface of the optical modulation chip is electrically connected to both the first and second circuit boards, allowing high-frequency and non-high-frequency signals to be provided to the chip via the first and second circuit boards, respectively. The high-frequency signal is used to drive the optical modulation chip to modulate the optical signal. The optical modulation chip includes a first input optical port, a second input optical port, and a third input optical port, compatible with lasers of different output optical powers. When the laser's output optical power exceeds a preset value, it can support the output of four optical signals, with the laser outputting light towards the second input optical port. When the laser's output optical power does not exceed the preset value, one laser outputs light towards the first input optical port, and the other laser outputs light towards the third input optical port. The optical modulation chip internally includes a first beam splitter, a second beam splitter, and a third beam splitter. The first beam splitter includes an input port, a first output port, and a second output port. The input port is optically connected to the second input optical port, allowing light to couple along the second input port into the first beam splitter, where it is split into a first beam and a second beam.The second beam splitter includes two input ports and two output ports. One input port is optically connected to the third input port, and the other input port is optically connected to the first output port of the first beam splitter. Therefore, the second beam splitter can split light entering through the third input port or light entering through the first output port of the first beam splitter. The third beam splitter also includes two input ports and two output ports. One input port is optically connected to the first input port, and the other input port is optically connected to the second output port of the first beam splitter. This allows the third beam splitter to split light entering through the first input port or light entering through the second output port of the first beam splitter. This design allows for compatibility with lasers of different output powers, enabling multi-channel signal modulation.

[0019] In some embodiments, the optical modulation chip includes a first MZ modulator, a second MZ modulator, a third MZ modulator, and a fourth MZ modulator to modulate the signals of each beam splitter after being processed by the first beam splitter, the second beam splitter, and the third beam splitter, respectively.

[0020] The incident light from the first MZ modulator is split into two paths by a first wavelength division multiplexer for modulation, and the two optical signals generated by modulation are output through a first interferometer. The incident light from the second MZ modulator is split into two paths by a second wavelength division multiplexer for modulation, and the two optical signals generated by modulation are output through a second interferometer. The incident light from the third MZ modulator is split into two paths by a third wavelength division multiplexer for modulation, and the two optical signals generated by modulation are output through a third interferometer. The incident light from the fourth MZ modulator is split into two paths by a fourth wavelength division multiplexer for modulation, and the two optical signals generated by modulation are output through a fourth interferometer.

[0021] The above technical solution has the following advantages or beneficial effects: The optical modulation chip includes a first MZ modulator, a second MZ modulator, a third MZ modulator, and a fourth MZ modulator to modulate the signals of the four beams after processing by the first, second, and third beam splitters, respectively. The incident light from the first MZ modulator is split into two paths by the first beam splitter. Phase modulation is applied to one path or both paths simultaneously, creating a phase difference between the two beams, thereby achieving intensity modulation. The two modulated optical signals are output through the first interferometer and, through interference, generate the first optical signal. The incident light from the second MZ modulator is split into two paths by the second beam splitter. Phase modulation is applied to one path or both paths simultaneously, creating a phase difference between the two beams, thereby achieving intensity modulation. The two modulated optical signals are output through the second interferometer and, through interference, generate the second optical signal. The incident light from the third MZ modulator is split into two paths by the third wave splitter. Phase modulation is applied to one or both paths simultaneously, creating a phase difference between the two beams, thus achieving intensity modulation. The two modulated optical signals are output from the third interferometer and, through interference, generate a third optical signal. Similarly, the incident light from the fourth MZ modulator is split into two paths by the fourth wave splitter. Phase modulation is applied to one or both paths simultaneously, creating a phase difference between the two beams, thus achieving intensity modulation. The two modulated optical signals are output from the fourth interferometer and, through interference, generate a fourth optical signal.

[0022] In some embodiments, one input optical path of the first wavelength division multiplexer is coupled to a first grating coupler, and one output optical path of the first interferometer is coupled to a second grating coupler; one input optical path of the second wavelength division multiplexer is coupled to a third grating coupler, and one output optical path of the second interferometer is coupled to a fourth grating coupler; one input optical path of the third wavelength division multiplexer is coupled to a fifth grating coupler, and one output optical path of the third interferometer is coupled to a sixth grating coupler; one input optical path of the fourth wavelength division multiplexer is coupled to a seventh grating coupler, and one output optical path of the fourth interferometer is coupled to an eighth grating coupler.

[0023] The above technical solution has the following advantages or beneficial effects: The first beam splitter includes two input optical paths, one of which is used for phase modulation processing, and the other is coupled to a first grating coupler. The first grating coupler is optically connected to an external light source. The first interferometer includes two output optical paths, one of which is used to output a first optical signal, and the other is coupled to a second grating coupler. By comparing the optical power difference between the first and second grating couplers, the bit error rate is obtained, thereby enabling fault diagnosis and identification of the first beam splitting transmission link. When the optical power difference between the first and second grating couplers exceeds a preset range, the transmission link may be considered faulty. Similarly, the third and fourth grating couplers can be used to diagnose and identify faults in the second beam splitting transmission link. The fifth and sixth grating couplers can be used to diagnose and identify faults in the third beam splitting transmission link. The seventh and eighth grating couplers can be used to diagnose and identify faults in the fourth beam splitting transmission link.

[0024] In some embodiments, the optical modulation chip end includes a first optical loop interface and a second optical loop interface, and an optical waveguide connects the first optical loop interface and the second optical loop interface.

[0025] The above technical solution has the following advantages or beneficial effects: An optical waveguide connects the first optical loop interface and the second optical loop interface, forming a U-shaped optical loopback. Light is input to the optical modulation chip along the first optical loop interface and output from the optical modulation chip along the second optical loop interface. The first optical loop interface is coupled to an external light source. Light output from the external light source is input to the optical modulation chip along the first optical loop interface and output from the optical modulation chip along the second optical loop interface. By comparing the optical power difference between the first and second optical loop interfaces, the bit error rate is obtained, thereby enabling fault diagnosis and identification of the optical port of the optical modulation chip. When the optical power difference between the first and second optical loop interfaces exceeds a preset range, it can be considered that a fault may have occurred at the optical port.

[0026] In some embodiments, a first clearance notch is formed on the side surface of the second circuit board to avoid the light emitting component;

[0027] The optical module includes an optical receiving component, which includes:

[0028] The optical receiving component includes:

[0029] An optical receiver chip is located on the surface of the first circuit board;

[0030] A refracting element has a reflective end face formed at one end; the refracting element includes a first optical fiber support portion, which extends from the surface of the second circuit board to the surface of the first circuit board, so as to place the reflective end face above the light receiving chip.

[0031] The above technical solution has the following advantages or beneficial effects: A first clearance notch is formed on the surface of the second circuit board to avoid obstructing the light emitting component disposed on the surface of the fixed board. The light emitting component is located within the first clearance notch. The light receiving component includes a refracting element and a light receiving chip. The light receiving chip is located on the surface of the first circuit board. A reflective end face is formed at one end of the refracting element. The refracting element includes a first optical fiber support portion, which extends from the surface of the second circuit board to the surface of the first circuit board, so as to place the reflective end face above the light receiving chip. The reflective end face reflects the light signal, changing the direction of light signal transmission, so that the direction of light signal transmission after reflection is consistent with the light receiving direction of the light receiving chip, thereby allowing the light signal to enter the light receiving chip. The light receiving chip is located on the surface of the first circuit board, thereby improving the signal transmission between the light receiving chip and the high-frequency signal.

[0032] In some embodiments, the refracting element includes a first optical fiber support and a second optical fiber support;

[0033] The second optical fiber support is disposed on the surface of the second circuit board, and a third pad area is formed on the end surface of the second circuit board for wire bonding connection with the surface of the first circuit board; the end of the second optical fiber support does not extend to the surface of the third pad area to avoid wire bonding between the second circuit board and the first circuit board;

[0034] The first optical fiber support is located above the second optical fiber support.

[0035] The above technical solution has the following advantages or beneficial effects: The refracting element includes a first optical fiber support and a second optical fiber support. The second optical fiber support is disposed on the surface of a second circuit board. A third pad area is formed on the surface of the second circuit board for wire bonding connection with the first circuit board. The end face of the second optical fiber support does not extend to the third pad area to avoid wire bonding between the second circuit board and the first circuit board, thereby providing wiring space for the second circuit board and the first circuit board.

[0036] In some embodiments, the optical module includes:

[0037] Upper casing;

[0038] The lower housing, together with the upper housing cover, forms an enclosing cavity to accommodate the first circuit board and the second circuit board;

[0039] The lower housing has a protrusion on its surface, which protrudes toward the upper housing.

[0040] The protrusion is located within the first clearance notch and on one side of the laser;

[0041] The bottom surface of the fixing plate is thermally connected to the lower housing, and the top surface of the protrusion is thermally connected to the upper housing, so that the heat generated by the laser is conducted sequentially through the fixing plate and the lower housing to the upper housing.

[0042] The above technical solution has the following advantages or beneficial effects: The lower housing surface protrudes upwards to form a protrusion, which faces the upper housing. The protrusion is located on the laser side and within the first clearance notch. The first clearance notch not only avoids the light-emitting component but also avoids the protrusion. A thermally conductive connection is established between the fixing plate and the lower housing, and a thermally conductive connection is established between the protrusion and the upper housing. The heat generated by the laser is conducted downwards to the fixing plate, which then conducts the heat downwards to the lower housing. Then, the protrusion on the lower housing surface transfers the heat upwards to the upper housing. A heat dissipation channel can be formed between the upper housing and the cage of the host computer, resulting in better heat dissipation efficiency and thus improving the heat dissipation efficiency for the laser.

[0043] In some embodiments, a third clearance notch is formed on the surface of the second circuit board to avoid the light emitting component; a first support surface and a second support surface are formed on both sides of the third clearance notch;

[0044] The optical module includes an optical receiving component, which includes:

[0045] An optical receiver chip is located on the surface of the first circuit board;

[0046] A refracting element has a reflective end face at one end; the refracting element extends from the surface of the second circuit board, across the bonding wire between the first circuit board and the second circuit board, and to the surface of the first circuit board, so that the reflective end face is located above the light receiving chip, thereby allowing the reflected light signal to be incident on the surface of the light receiving chip.

[0047] The above technical solution has the following advantages or beneficial effects: A third clearance notch is formed on the surface of the second circuit board to avoid the light emitting component mounted on the surface of the fixed board. A first support surface and a second support surface are formed on both sides of the third clearance notch. The surface of the optical modulation chip is electrically connected to the first support surface and the second support surface, respectively, to increase the bonding area between the optical modulation chip and the second circuit board, meet the requirement of the optical modulation chip for the number of bonding wires, and thus meet the signal transmission requirements of the optical modulation chip. The optical receiving component includes a refracting element and an optical receiving chip. A reflective end face is formed at one end of the refracting element. The refracting element includes a first optical fiber support and a second optical fiber support. The length of the second optical fiber support is less than the length of the first optical fiber support to avoid the bonding wires between the first circuit board and the second circuit board, and increase the electrical connection area between the first circuit board and the second circuit board. The optical receiving chip is located on the surface of the first circuit board and is located on the reflected light path of the reflective end face. The reflective end face reflects the light signal, changes the light path transmission direction, and thus allows the light signal to enter the optical receiving chip.

[0048] In some embodiments, a second clearance notch is formed at the other end of the first circuit board to avoid the light emitting component;

[0049] The optical module includes an optical receiving component, which includes:

[0050] A refractive element is located on the surface of the first circuit board and on one side of the second clearance notch. The refractive element includes an optical fiber, the end face of which is formed on a reflective end face. The optical fiber has a height difference with the surface of the first circuit board or the second circuit board, so that the bonding wire between the first circuit board and the second circuit board is located below the optical fiber.

[0051] The light receiving chip is located on the surface of the first circuit board and on the reflected light path of the reflective end face.

[0052] The above technical solution has the following advantages or beneficial effects: A second clearance notch is formed on the surface of the first circuit board to avoid the light emitting component fixed on the board surface. The light emitting component is located within the second clearance notch. The light receiving component includes a refracting element and a light receiving chip. The refracting element is located on the surface of the first circuit board. The refracting element includes an optical fiber, with the end face of the optical fiber formed on a reflective end face to reflect the light signal and change the direction of light transmission. The optical fiber has a height difference with the surface of the first or second circuit board, so that the bonding wire between the first and second circuit boards is located below the optical fiber, realizing the electrical connection between the first and second circuit boards.

[0053] In some embodiments, a fourth clearance notch is formed at one end of the first circuit board to avoid the light emitting component; a third support surface and a fourth support surface are formed on both sides of the fourth clearance notch, respectively;

[0054] The optical module includes an optical receiving component, which includes:

[0055] A refractive element is located on the surface of the first circuit board and on one side of the fourth clearance notch. The refractive element includes an optical fiber, the end face of which is formed on a reflective end face. The optical fiber has a height difference with the surface of the first circuit board or the second circuit board, so that the bonding wire between the first circuit board and the second circuit board is located below the optical fiber.

[0056] The light receiving chip is located on the surface of the first circuit board and on the reflected light path of the reflective end face.

[0057] The above technical solution has the following advantages or beneficial effects: A fourth clearance notch is formed on the surface of the first circuit board to avoid the light emitting component fixed on the board surface. A third arm surface and a fourth arm surface are formed on both sides of the fourth clearance notch. The light emitting component is located within the fourth clearance notch, and the opposite two sides of the light modulation chip are electrically connected to the third arm surface and the fourth arm surface, respectively, to input non-high frequency signals into the light modulation chip, thereby increasing the bonding area between the light modulation chip and the first circuit board, meeting the light modulation chip's requirement for the number of bonding wires, and thus meeting the signal transmission requirements of the light modulation chip. The light receiving component includes a refractive element and a light receiving chip. The refractive element is located on the surface of the first circuit board. The refractive element includes an optical fiber, with the fiber end face formed on the reflective end face to reflect the light signal and change the direction of light transmission. The optical fiber has a height difference with the surface of the first circuit board or the second circuit board, so that the bonding wire between the first circuit board and the second circuit board is located below the optical fiber, realizing the electrical connection between the first circuit board and the second circuit board.

[0058] In some embodiments, an optical module is provided, comprising:

[0059] The light emitting component includes:

[0060] A laser is configured to emit light that does not carry a signal.

[0061] An optical modulation chip, located in the optical path of the laser output, is configured to modulate the signal-free light to generate an optical signal. The optical modulation chip includes:

[0062] The first input optical port is located at the light input end of the optical modulation chip; when the output optical power of the laser is not higher than a preset value, the first input optical port is optically connected to the laser.

[0063] The second input optical port is located at the light input end of the optical modulation chip; when the output optical power of the laser is higher than a preset value, the second input optical port is optically connected to the laser.

[0064] The third input optical port is located at the light input end of the optical modulation chip; when the output optical power of the laser is not higher than a preset value, the third input optical port is optically connected to the laser.

[0065] The first optical splitter includes an input port, a first output port and a second output port, wherein the input port is optically connected to the second input port.

[0066] The second beam splitter includes two optical inlets and two optical outlets, wherein one optical inlet is optically connected to the third optical inlet, and the other optical inlet is optically connected to the first optical outlet of the first beam splitter.

[0067] The third beam splitter includes two optical inlets and two optical outlets, wherein one optical inlet is optically connected to the first optical inlet, and the other optical inlet is optically connected to the second optical outlet of the first beam splitter.

[0068] The fiber optic array is configured to transmit the optical signal modulated by the optical modulation chip.

[0069] The above technical solution has the following advantages or beneficial effects: The optical emitting component includes a laser, an optical modulation chip, and an optical fiber array. The laser emits light without carrying a signal, and the optical modulation signal modulates the signal-free light emitted by the laser to generate an optical signal. The optical modulation chip includes a first input optical port, a second input optical port, and a third input optical port, which is compatible with lasers with different output optical powers. When the laser's output optical power is higher than a preset value, it can support the output of four optical signals, and the laser outputs light towards the second input optical port. When the laser's output optical power is not higher than the preset value, two lasers are set up, one of which outputs light towards the first input optical port, and the other laser outputs light towards the third input optical port. The optical modulation chip internally includes a first beam splitter, a second beam splitter, and a third beam splitter. The first beam splitter includes an input port, a first output port, and a second output port. The input port is optically connected to the second input optical port, so the light is coupled into the first beam splitter along the second input optical port and split into a first beam and a second beam by the first beam splitter. The second beam splitter includes two input ports and two output ports. One input port is optically connected to a third input port, and the other input port is optically connected to the first output port of the first beam splitter. Therefore, the second beam splitter can split light entering through the third input port or light entering through the first output port of the first beam splitter. The third beam splitter also includes two input ports and two output ports. One input port is optically connected to the first input port, and the other input port is optically connected to the second output port of the first beam splitter. This third beam splitter can split light entering through the first input port or light entering through the second output port of the first beam splitter. Thus, when the laser's output power exceeds a preset value, the laser emits light through the second input port, and the emitted light is coupled into the optical modulation chip. Within the optical modulation chip, the emitted laser light is split into a first beam and a second beam by the first beam splitter. The first output port of the first beam splitter is optically connected to the first input port of the second beam splitter, so the first beam is coupled into the second beam splitter along the first output port of the first beam splitter. The second beam splitter splits the first beam into a first split and a second split, and outputs them through their respective output ports. The second output port of the first beam splitter is optically connected to the first input port of the third beam splitter, so the second beam is coupled into the third beam splitter along the second output port of the first beam splitter. The third beam splitter splits the second beam into a third split and a fourth split, and outputs them through their respective output ports. Thus, the light emitted by the laser is split into four paths through two beam splits. When the laser output power is not higher than a preset value, two lasers are set up, one laser outputting light towards the first input port and the other laser outputting light towards the third input port. The light output from one laser is input into the optical modulation chip through the first input port, and the light output from the other laser is input into the optical modulation chip through the third input port. When the third input optical port is optically connected to one of the input optical ports of the second beam splitter, the light output from a laser is coupled into the second beam splitter.The second beam splitter splits the laser output into a first beam and a second beam. The first input port is optically connected to one input port of the third beam splitter, allowing the light from another laser to couple into the third beam splitter. The third beam splitter then splits the laser output into a third beam and a fourth beam. Thus, the laser light is split into four paths through two beam splits.

[0070] In some embodiments, when the output optical power of the laser is higher than a preset value, the laser emits light toward the second input optical port, and the emitted light of the laser is split into a first beam and a second beam by the first beam splitter;

[0071] If the first output port of the first beam splitter is optically connected to the first input port of the second beam splitter, then the first beam is split into a first beam and a second beam by the second beam splitter, and output along the two output ports of the second beam splitter respectively.

[0072] If the second output port of the first beam splitter is optically connected to one input port of the third beam splitter, the second beam is split into a third beam and a fourth beam by the third beam splitter, and then output along the two output ports of the third beam splitter respectively.

[0073] The above technical solution has the following advantages or beneficial effects: When the laser output optical power is higher than a preset value, the laser emits light towards the second input port, and the emitted light is coupled into the optical modulation chip. Within the optical modulation chip, the emitted laser light is split into a first beam and a second beam by a first beam splitter. The first output port of the first beam splitter is optically connected to an input port of the second beam splitter, so the first beam is coupled into the second beam splitter along the first output port. The second beam splitter splits the first beam into a first split and a second split, and outputs them respectively through their two output ports. The second output port of the first beam splitter is optically connected to an input port of the third beam splitter, so the second beam is coupled into the third beam splitter along the second output port. The third beam splitter splits the second beam into a third split and a fourth split, and outputs them respectively through their two output ports. Thus, the light emitted by the laser is split into four paths through two beam splits.

[0074] In some embodiments, if the output optical power of the laser is not higher than a preset value, then two lasers are respectively set;

[0075] Of the two lasers, one of the lasers outputs light toward the third input port, which is optically connected to one of the input ports of the second beam splitter. The light output by the laser is coupled into the second beam splitter along the third input port, and the second beam splitter splits the input light into a first beam splitter and a second beam splitter.

[0076] Of the two lasers, the other laser outputs light toward the first input port. The first input port is optically connected to one of the input ports of the third beam splitter. The light output by the laser is coupled into the third beam splitter along the first input port. The third beam splitter splits the input light into a third beam splitter and a fourth beam splitter.

[0077] The above technical solution has the following advantages or beneficial effects: When the laser output power is not higher than a preset value, two lasers are set up, one laser outputting light towards the first input port and the other laser outputting light towards the third input port. The light output from one laser is input into the optical modulation chip through the first input port, and the light output from the other laser is input into the optical modulation chip through the third input port. The third input port is optically connected to one input port of the second beam splitter, so the light output from one laser is coupled into the second beam splitter. The second beam splitter splits the light output from this laser into a first beam splitter and a second beam splitter. The first input port is optically connected to one input port of the third beam splitter, so the light output from another laser is coupled into the third beam splitter. The third beam splitter splits the light output from this laser into a third beam splitter and a fourth beam splitter. Thus, the light emitted by the laser is split into four paths through two beam splits.

[0078] In some embodiments, the optical modulation chip includes a first MZ modulator, a second MZ modulator, a third MZ modulator, and a fourth MZ modulator to modulate the signals of each beam splitter after being processed by the first beam splitter, the second beam splitter, and the third beam splitter, respectively.

[0079] The incident light from the first MZ modulator is split into two paths by a first wavelength division multiplexer for modulation, and the two optical signals generated by modulation are output through a first interferometer. The incident light from the second MZ modulator is split into two paths by a second wavelength division multiplexer for modulation, and the two optical signals generated by modulation are output through a second interferometer. The incident light from the third MZ modulator is split into two paths by a third wavelength division multiplexer for modulation, and the two optical signals generated by modulation are output through a third interferometer. The incident light from the fourth MZ modulator is split into two paths by a fourth wavelength division multiplexer for modulation, and the two optical signals generated by modulation are output through a fourth interferometer.

[0080] The above technical solution has the following advantages or beneficial effects: The optical modulation chip includes a first MZ modulator, a second MZ modulator, a third MZ modulator, and a fourth MZ modulator to modulate the signals of the four beams after processing by the first, second, and third beam splitters, respectively. The incident light from the first MZ modulator is split into two paths by the first beam splitter. Phase modulation is applied to one path or both paths simultaneously, creating a phase difference between the two beams, thereby achieving intensity modulation. The two modulated optical signals are output through the first interferometer and, through interference, generate the first optical signal. The incident light from the second MZ modulator is split into two paths by the second beam splitter. Phase modulation is applied to one path or both paths simultaneously, creating a phase difference between the two beams, thereby achieving intensity modulation. The two modulated optical signals are output through the second interferometer and, through interference, generate the second optical signal. The incident light from the third MZ modulator is split into two paths by the third wave splitter. Phase modulation is applied to one or both paths simultaneously, creating a phase difference between the two beams, thus achieving intensity modulation. The two modulated optical signals are output from the third interferometer and, through interference, generate a third optical signal. Similarly, the incident light from the fourth MZ modulator is split into two paths by the fourth wave splitter. Phase modulation is applied to one or both paths simultaneously, creating a phase difference between the two beams, thus achieving intensity modulation. The two modulated optical signals are output from the fourth interferometer and, through interference, generate a fourth optical signal.

[0081] In some embodiments, one input optical path of the first wavelength division multiplexer is coupled to a first grating coupler, and one output optical path of the first interferometer is coupled to a second grating coupler; one input optical path of the second wavelength division multiplexer is coupled to a third grating coupler, and one output optical path of the second interferometer is coupled to a fourth grating coupler; one input optical path of the third wavelength division multiplexer is coupled to a fifth grating coupler, and one output optical path of the third interferometer is coupled to a sixth grating coupler; one input optical path of the fourth wavelength division multiplexer is coupled to a seventh grating coupler, and one output optical path of the fourth interferometer is coupled to an eighth grating coupler.

[0082] The above technical solution has the following advantages or beneficial effects: The first beam splitter includes two input optical paths, one of which is used for phase modulation processing, and the other is coupled to a first grating coupler. The first grating coupler is optically connected to an external light source. The first interferometer includes two output optical paths, one of which is used to output a first optical signal, and the other is coupled to a second grating coupler. By comparing the optical power difference between the first and second grating couplers, the bit error rate is obtained, thereby enabling fault diagnosis and identification of the first beam splitting transmission link. When the optical power difference between the first and second grating couplers exceeds a preset range, the transmission link may be considered faulty. Similarly, the third and fourth grating couplers can be used to diagnose and identify faults in the second beam splitting transmission link. The fifth and sixth grating couplers can be used to diagnose and identify faults in the third beam splitting transmission link. The seventh and eighth grating couplers can be used to diagnose and identify faults in the fourth beam splitting transmission link.

[0083] In some embodiments, the optical modulation chip end includes a first optical loop interface and a second optical loop interface, and an optical waveguide connects the first optical loop interface and the second optical loop interface.

[0084] The above technical solution has the following advantages or beneficial effects: An optical waveguide connects the first optical loop interface and the second optical loop interface, forming a U-shaped optical loopback. Light is input to the optical modulation chip along the first optical loop interface and output from the optical modulation chip along the second optical loop interface. The first optical loop interface is coupled to an external light source. Light output from the external light source is input to the optical modulation chip along the first optical loop interface and output from the optical modulation chip along the second optical loop interface. By comparing the optical power difference between the first and second optical loop interfaces, the bit error rate is obtained, thereby enabling fault diagnosis and identification of the optical port of the optical modulation chip. When the optical power difference between the first and second optical loop interfaces exceeds a preset range, it can be considered that a fault may have occurred at the optical port. Attached Figure Description

[0085] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are merely drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. Furthermore, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0086] Figure 1 This is a partial architecture diagram of an optical communication system according to some embodiments;

[0087] Figure 2 This is a partial structural diagram of a host computer according to some embodiments;

[0088] Figure 3 This is a structural diagram of an optical module according to some embodiments;

[0089] Figure 4 An exploded view of an optical module according to some embodiments;

[0090] Figure 5a This is a structural diagram of an optical module according to some embodiments;

[0091] Figure 5b This is a partial exploded view of the interior of an optical module according to some embodiments;

[0092] Figure 6a This is a schematic diagram of the optical path of an optical emitting component according to some embodiments;

[0093] Figure 6b This is a structural diagram of a refracting element according to some embodiments;

[0094] Figure 6c An exploded view of a refracting element according to some embodiments;

[0095] Figure 7 This is a cross-sectional view of the internal structure of an optical module according to some embodiments;

[0096] Figure 8 This is an exploded view of the internal structure of an optical module according to some embodiments;

[0097] Figure 9a This is a partial cross-sectional view of an optical module according to some embodiments;

[0098] Figure 9b This is an assembly diagram of a lower housing, a first circuit board, and a second circuit board according to some embodiments;

[0099] Figure 9c This is an exploded view of an assembly of a lower housing, a first circuit board, and a second circuit board according to some embodiments;

[0100] Figure 9d This is a cross-sectional view of an assembly of an upper housing, a lower housing, a first circuit board, and a second circuit board according to some embodiments;

[0101] Figure 10 This is an assembly diagram of a first circuit board and a second circuit board according to some embodiments;

[0102] Figure 11 This is an exploded view of a first circuit board and a second circuit board assembly according to some embodiments;

[0103] Figure 12 This is a partial view of an assembly of a first circuit board and a second circuit board according to some embodiments;

[0104] Figure 13a This is a first circuit board structure diagram according to some embodiments;

[0105] Figure 13b This is a diagram of a second circuit board structure according to some embodiments;

[0106] Figure 14 A partial cross-section of an optical module according to some embodiments Figure 1 ;

[0107] Figure 15a A partial cross-section of an optical module according to some embodiments Figure 2 ;

[0108] Figure 15b This is a partial cross-sectional enlarged view of an optical module according to some embodiments;

[0109] Figure 16 This is an alternative assembly structure diagram of the first circuit board and the second circuit board according to some embodiments;

[0110] Figure 17 This is an alternative assembly cross-sectional view of the first and second circuit boards according to some embodiments;

[0111] Figure 18 This is an enlarged cross-sectional view of another assembly of the first circuit board and the second circuit board according to some embodiments;

[0112] Figure 19 This is yet another internal structural form of an optical module according to some embodiments. Figure 1 ;

[0113] Figure 20 This is a structural breakdown of the internal morphology of an optical module according to some embodiments. Figure 1 ;

[0114] Figure 21 This is a partially enlarged view of another internal configuration of an optical module according to some embodiments;

[0115] Figure 22 This is a structural breakdown of the internal morphology of an optical module according to some embodiments. Figure 2 ;

[0116] Figure 23a This is a partial cross-section of the internal structure of an optical module according to some embodiments. Figure 1 ;

[0117] Figure 23bThis is a partial cross-section of the internal structure of an optical module according to some embodiments. Figure 2 ;

[0118] Figure 24a This is an assembly diagram of a lower housing, a first circuit board, and a second circuit board according to some embodiments;

[0119] Figure 24b This is a cross-sectional view of a lower housing, a first circuit board, and a second circuit board assembly according to some embodiments;

[0120] Figure 25 Another internal structure of an optical module according to some embodiments Figure 1 ;

[0121] Figure 26 Deconstruction of another internal structural form of an optical module according to some embodiments Figure 1 ;

[0122] Figure 27 This is an exploded view of a first circuit board and a second circuit board assembly according to some embodiments;

[0123] Figure 28 Another internal structure of an optical module according to some embodiments Figure 2 ;

[0124] Figure 29 Deconstruction of another internal structural form of an optical module according to some embodiments Figure 2 ;

[0125] Figure 30 This is a cross-sectional view of another internal configuration of an optical module according to some embodiments;

[0126] Figure 31 A partially enlarged cross-sectional view of another internal form of an optical module according to some embodiments. Figure 1 ;

[0127] Figure 32 A partially enlarged cross-sectional view of another internal form of an optical module according to some embodiments. Figure 2 ;

[0128] Figure 33 Another internal structure of an optical module according to some embodiments Figure 3 ;

[0129] Figure 34 Deconstruction of another internal structural form of an optical module according to some embodiments Figure 3 ;

[0130] Figure 35a This is a partially enlarged view of another internal configuration of an optical module according to some embodiments;

[0131] Figure 35b This is a schematic diagram of an assembly of a lower housing, a first circuit board, and a second circuit board according to some embodiments;

[0132] Figure 36 Another internal structure of an optical module according to some embodiments Figure 4 ;

[0133] Figure 37 Deconstruction of another internal structural form of an optical module according to some embodiments Figure 4 ;

[0134] Figure 38a This is an assembly structure diagram of a lower housing, a first circuit board, and a second circuit board according to some embodiments;

[0135] Figure 38b This is a partially enlarged cross-sectional view of a lower housing, a first circuit board, and a second circuit board assembly according to some embodiments;

[0136] Figure 39a A cross-sectional view of a protective cover assembly according to some embodiments. Figure 1 ;

[0137] Figure 39b A cross-sectional view of a protective cover assembly according to some embodiments. Figure 2 ;

[0138] Figure 40 This is a schematic diagram of the internal structure of an optical modulation chip according to some embodiments;

[0139] Figure 41 This is a diagram of the internal structure of another optical modulation chip according to some embodiments;

[0140] Figure 42 This is a schematic diagram of an electrical connection structure between an optical modulation chip and a first circuit board according to some embodiments;

[0141] Figure 43 This is a schematic diagram of wire bonding between an optical modulation chip and a first circuit board according to some embodiments. Figure 1 ;

[0142] Figure 44 This is a schematic diagram of wire bonding between an optical modulation chip and a first circuit board according to some embodiments. Figure 2 ;

[0143] Figure 45 This is a schematic diagram of wire bonding between an optical modulation chip and a first circuit board according to some embodiments. Figure 3 . Detailed Implementation

[0144] The embodiments of this disclosure will now be described clearly and in detail with reference to the accompanying drawings. However, the described embodiments are merely some, and not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0145] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0146] In optical communication technology, to establish information transmission between information processing devices, information is loaded onto light, and the speed of light propagation is used to transmit the information. This light carrying information is called an optical signal. When optical signals are transmitted in optical information transmission equipment, optical power loss can be reduced, enabling long-distance transmission of optical signals. At the same time, the cost of optical information transmission equipment such as optical fibers is lower than that of electrical information transmission equipment such as copper wires. Therefore, optical communication technology can achieve high-speed, long-distance, and low-cost information transmission.

[0147] Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., while optical information transmission equipment typically includes optical fibers and optical waveguides. Information processing equipment can only recognize and process electrical signals, while optical communication technology uses optical signals for transmission, requiring optical modules to convert between optical and electrical signals.

[0148] An optical module enables the conversion between optical signals and electrical signals between information processing equipment and optical information transmission equipment. In some embodiments, at least one of the optical signal input or output terminals of the optical module is connected to an optical fiber, and at least one of the electrical signal input or output terminals of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber.

[0149] Since multiple information processing devices can transmit information via electrical signals, at least one of these devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is also referred to as the host computer of the optical module. Furthermore, the optical signal input or output terminal of the optical module is called the optical port, and the electrical signal input or output terminal is called the electrical port.

[0150] Figure 1 This is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100 for optical modules, an optical module 200, an optical fiber 101, and a network cable 103. Among them, the optical fiber 101 is an optical information transmission device, and the network cable 103 is an electrical information transmission device.

[0151] In some embodiments, one end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can undergo total internal reflection in the optical fiber 101, and the propagation of the optical signal in the direction of total internal reflection can almost maintain the original optical power. The optical signal undergoes multiple total internal reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance information transmission based on low power loss.

[0152] The optical communication system includes one or more optical fibers 101. In some embodiments, the optical fiber 101 is detachably connected to the optical module 200; in some embodiments, the optical fiber 101 is non-detachably connected to the optical module 200.

[0153] The host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor or control the working status of the optical module 200.

[0154] The host computer 100 includes a housing for accommodating the optical module 200, and an optical module interface 102 disposed on the housing. The optical module 200 is inserted into the housing through the optical module interface 102 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0155] The host computer 100 also includes an external power interface that can connect to an electrical signal network. In some embodiments, the external power interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to connect a network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103.

[0156] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. In some embodiments, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted in the optical fiber 101 to the remote information processing device 1000.

[0157] In some embodiments, a first optical signal from a remote information processing device 1000 is transmitted through an optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to an optical module 200. The optical module 200 converts the first optical signal into a first electrical signal, and transmits the first electrical signal to a host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to a local information processing device 2000.

[0158] In some embodiments, the optical module is a tool for converting optical signals to electrical signals. During the conversion process, the information does not change, but the encoding or decoding method of the information changes.

[0159] In addition to optical network terminals, the host computer 100 also includes optical line terminals (OLTs), optical network equipment (ONTs), or data center servers.

[0160] Figure 2This is a partial structural diagram of a host computer according to some embodiments. To clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. For example... Figure 2 As shown, in some embodiments, the host computer 100 further includes a PCB circuit board 105 disposed in the receiving cavity, and a cage 106 disposed on the surface of the PCB circuit board 105; the optical module 200 is inserted into the cage 106 and fixed by the cage 106.

[0161] In some embodiments, a heat sink 107 is provided on the cage 106 to dissipate heat for the optical module; in some embodiments, the heat sink 107 has protruding structures such as fins to increase the heat dissipation area.

[0162] In some embodiments, an electrical connector is provided inside the cage 106, which is configured to connect to the electrical port of the optical module 200.

[0163] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the heat sink 107.

[0164] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, thereby establishing an electrical signal connection between the optical module 200 and the host computer 100.

[0165] In some embodiments, the optical port of the optical module 200 is connected to the optical fiber 101, thereby enabling the optical module 200 to establish an optical signal connection with the optical fiber 101.

[0166] Figure 3 This is a structural diagram of an optical module according to some embodiments. Figure 4 This is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, in some embodiments, the optical module 200 includes a shell, which comprises an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202, forming two openings 204 and 205, one of which is an electrical port and the other is an optical port. In some embodiments, the shell forms an opening that serves as both an electrical port and an optical port.

[0167] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0168] The assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc. into the housing. The upper housing 201 and the lower housing 202 can encapsulate and protect the above-mentioned devices.

[0169] The direction of the line connecting the two openings 204 and 205 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200. Figure 3 The opening 205 is also located at the end of the optical module 200 (right end). Figure 3 (The left end). Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200.

[0170] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0171] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0172] like Figure 3 and Figure 4As shown, in some embodiments, the optical module includes a circuit board 300 disposed within a housing. The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0173] In some embodiments, the circuit board includes a rigid circuit board, which, due to its relatively rigid material, can also serve a load-bearing function, such as being able to stably support the aforementioned electronic components and chips; the rigid circuit board can also be inserted into an electrical connector in the cage 106 of the host computer 100.

[0174] In some embodiments, the circuit board further includes a flexible circuit board, which can be used independently or in conjunction with a rigid circuit board.

[0175] In some embodiments, the circuit board further includes gold fingers formed on its end surface, the gold fingers consisting of a plurality of independent pins.

[0176] In some implementations, the gold fingers 301 are disposed on one side of the surface of the circuit board 300 (e.g., Figure 4 (as shown on the upper surface); In some implementations, the gold fingers 301 are disposed on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to situations where the number of pins is required.

[0177] In some implementations, the gold fingers of the circuit board extend from the opening 204 and are inserted into the electrical connector of the host computer 100; the circuit board is inserted into the cage 106, and the gold fingers 301 are connected to the electrical connector inside the cage 106. The gold fingers 301 are configured to establish an electrical connection with the host computer, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission.

[0178] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0179] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the fixation between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the cage 106.

[0180] In some embodiments, the optical module includes a light emitting component 400.

[0181] In some embodiments, the optical module includes an optical receiving component 500, such as... Figure 3 and Figure 4 As shown, the light receiving component 500 is located on one side of the light emitting component 400.

[0182] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0183] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on the surface of the circuit board 300 or the side of the circuit board 300.

[0184] Figure 5a This is a diagram illustrating the internal structure of an optical module according to some embodiments. Figure 5b This is a partially exploded view of the interior of an optical module according to some embodiments. For example... Figures 5a-5b As shown, in some embodiments, the light receiving component 500 is located on one side of the light emitting component 400.

[0185] In some embodiments, the light emitting component 400 is configured to emit an optical signal.

[0186] In some embodiments, the light emitting component 400 may include a laser 410. The laser 410 may emit light along its side without modulating the optical signal, so that the light emitted by the laser 410 does not carry an optical signal. Exemplarily, the laser 410 is a DFB laser.

[0187] In some embodiments, the light emitting component 400 may include a lens 420. The lens 420 is located in the light output path of the laser 410. The lens 420 is a converging lens to focus the light emitted by the laser 410.

[0188] In some embodiments, the light emitting component 400 may include an isolator 430. The isolator 430 is located in the light output path of the lens 420 to prevent light emitted by the laser 410 from returning to the laser 410.

[0189] In some embodiments, the light emitting component 400 may include an optical modulation chip 440. The optical modulation chip 440 is located in the output optical path of the isolator 430 and receives the light output from the isolator 430. The optical modulation chip 440 performs signal phase modulation on the light output from the isolator 430 to generate an optical signal. The optical modulation chip 440 integrates an MZ modulator to perform optical signal modulation and achieve optical signal transmission. The optical modulation chip 440 can be a silicon photonics chip, a thin-film lithium niobate chip, or a III-V group photonics chip.

[0190] In some embodiments, the optical emitting component 400 may include an optical fiber array 450. The optical fiber array 450 is end-face coupled to the optical modulation chip 440. The optical fiber array 450 is located in the optical output path of the optical modulation chip 440 to transmit the optical signal modulated by the optical modulation chip 440 to the outside.

[0191] In some embodiments, the light emitted by the laser 410 is transmitted to the optical modulation chip 440, where it is modulated to generate an optical signal. The optical signal is then output from the optical modulation chip 440 and transmitted through the fiber array 450.

[0192] In some embodiments, the laser 410, lens 420, and isolator 430 are located in the incident optical path of the optical modulation chip 440, providing the light source to be modulated to the optical modulation chip 440. The fiber array 450 is coupled to the output optical port of the optical modulation chip 440. Since the incident and output ports of the optical modulation chip 440 are formed on the same side, the laser 410, lens 420, isolator 430, and fiber array 450 are located on the same side of the optical modulation chip 440.

[0193] In some embodiments, the optical receiving component 500 is configured to receive optical signals.

[0194] In some embodiments, the light receiving component 500 may include a refracting element 510.

[0195] In some embodiments, the light receiving component 500 may include a light receiving chip 520.

[0196] In some embodiments, the light receiving component 500 may include a TIA530.

[0197] In some embodiments, the refracting element 510 includes an optical fiber 511 extending toward the optical receiver chip 520, with the end of the optical fiber 511 exposed above the optical receiver chip 520. A reflective end face 512 is formed at the end of the optical fiber 511, and this reflective end face 512 is exposed above the optical receiver chip 520. The reflective end face 512 is used to reflect and change the transmission direction of the optical signal transmitted through the optical fiber 511, thereby reflecting the optical signal transmitted through the optical fiber 511 to the optical receiver chip 520, thus achieving a reversal of the optical path.

[0198] In some embodiments, the TIA530 is located on the surface of the circuit board 300 and is situated to one side of the optical receiver chip 520. The optical receiver chip 520 converts the received optical signal into a photocurrent signal, and the TIA530 converts the photocurrent signal into a photovoltage signal and amplifies the photovoltage signal.

[0199] In some embodiments, a protective cover 400a is coated on the surface of the light emitting component 400 to protect the light emitting component 400 from damage. The protective cover 400a has an opening at the light-emitting end of the light emitting component 400. The opening is coated onto the surface of the isolator 430 to expose the light-emitting surface of the isolator 430 and avoid light blocking. The light output by the isolator 430 is then transmitted to the optical modulation chip 440.

[0200] Figure 6a This is a schematic diagram of the optical path of a light emitting component according to some embodiments. Figure 6b This is a structural diagram of a refracting element according to some embodiments. Figure 6c This is an exploded view of a refractive element according to some embodiments. For example... Figures 6a-6c As shown, in some embodiments, the reflective end face 512 reflects the optical signal transmitted by the optical fiber 511 to change the transmission direction of the optical signal in the optical fiber 511, thereby reflecting the optical signal transmitted by the optical fiber 511 to the optical receiving chip 520 to realize optical signal reception.

[0201] In some embodiments, the refracting element 510 may include an optical fiber 511. The light-emitting end face of the optical fiber 511 has a reflective end face 512.

[0202] In some embodiments, the refracting element 510 may include a first optical fiber support portion 513 and a second optical fiber support portion 514. The first optical fiber support portion 513 and the second optical fiber support portion 514 are arranged vertically opposite each other, and a plurality of optical fibers 511 are held between them. The plurality of optical fibers 511 form an optical fiber array. A V-groove 517 is formed on the bottom surface of the first optical fiber support portion 513 to embed the optical fibers 511.

[0203] In some embodiments, the refracting element 510 may include an optical fiber fixing portion 515. The optical fiber fixing portion 515 is located at the tail of the second optical fiber support portion 514 to fix the optical fiber 511. The optical fiber fixing portion 515 protects and cushions the optical fiber 511, thereby preventing fiber breakage. Exemplarily, the optical fiber fixing portion 515 is made of soft rubber, which protects and cushions the optical fiber 511.

[0204] In some embodiments, the length of the first optical fiber support portion 513 is longer than that of the second optical fiber support portion 514, and there is a space between the end of the second optical fiber support portion 514 and the end of the first optical fiber support portion 513, which is reserved for coating space of the optical fiber fixing portion 515.

[0205] In some embodiments, the reflective end face 512 is an inclined surface, and the received optical signal transmitted by the optical fiber 511 undergoes total internal reflection at the reflective end face 512. For example, the inclination angle of the reflective end face 512 is 46-50°, such as 48°.

[0206] In some embodiments, the optical fiber 511 passes through one end of the first optical fiber support 513 and extends to the outside of the other end of the first optical fiber support 513, such that the reflective end face 512 is located outside the other end of the first optical fiber support 513. One end of the optical fiber fixing part 515 is connected to one end of the second optical fiber support 514, and the other end of the optical fiber fixing part 515 is fixedly connected to the end of the optical fiber 511 to support the end of the optical fiber 511.

[0207] In some embodiments, a protective surface 516 is formed on the end face of the first optical fiber support portion 513. The protective surface 516 surrounds the side of the reflective end face 512 to protect the reflective end face 512. For example, the protective surface 516 is an inclined surface with an inclination angle of 46-50°, such as 48°.

[0208] In some embodiments, the reflective end face 512 and the protective end face 516 are formed by grinding and polishing. The end face of the optical fiber 511 is ground to a certain tilt angle to form the reflective end face 512. The optical fiber 511 is cylindrical, and the cross-section of the reflective end face 512 after grinding is elliptical, so the bottom of the optical fiber 511 is exposed relative to the first optical fiber support portion 513.

[0209] In some embodiments, a certain gap is left between the fiber fixing part 515 and the surface of the circuit board 300 to prevent the fiber fixing part 515 from sticking to the optical adhesive on the surface of the circuit board 300 used to fix the second fiber support part 514, and to maintain the binding force of the fiber fixing part 515 on the fiber 511.

[0210] In some embodiments, the light receiver chip 520 is located on the surface of the circuit board 300. When the model of the light receiver chip 520 is fixed, its thickness is fixed, and therefore the distance from its photosensitive surface to the surface of the circuit board 300 is fixed.

[0211] In some embodiments, the preset distance between the reflective end face 512 and the light receiving chip 520 is small to ensure that the light signal reflected from the reflective end face 512 can be transmitted to the photosensitive surface of the light receiving chip 520 and then received by the light receiving chip 520. The thickness of the second optical fiber support portion 514 is small to ensure that the distance between the reflective end face 512 and the light receiving chip 520 meets the preset distance. For example, the thickness of the second optical fiber support portion 514 is smaller than that of the first optical fiber support portion 513 to ensure that the distance between the reflective end face 512 and the light receiving chip 520 meets the preset distance.

[0212] In some embodiments, there is a certain distance between the end of the second optical fiber support 514 and the reflective end face 512, and the length of the second optical fiber support 514 does not extend below the reflective end face 512, leaving space for the optical receiving chip 520 to be installed, so as to ensure that the distance from the reflective end face 512 to the optical receiving chip 520 meets the preset distance.

[0213] Figure 7 This is a cross-sectional view of the internal structure of an optical module according to some embodiments. Figure 8 This is an exploded view of the internal structure of an optical module according to some embodiments. For example... Figure 7 and Figure 8 As shown, in some embodiments, the light receiving component 500 is located on one side of the light emitting component 400.

[0214] In some embodiments, the optical module may include a first circuit board 310. The first circuit board 310 is configured to transmit high-frequency signals and non-high-frequency signals. A gold finger 301 is formed on one end surface of the first circuit board 310, and the high-frequency signals and non-high-frequency signals output by the gold finger 301 are transmitted along the surface of the first circuit board 310. High-speed signal traces and non-high-speed signal traces are arranged on the surface of the first circuit board 310 to transmit high-frequency signals and non-high-frequency signals.

[0215] In some embodiments, the optical module may include a second circuit board 320. The surface of the second circuit board 320 is provided with non-high-speed signal traces to transmit non-high-frequency signals.

[0216] In some embodiments, the first circuit board 310 and the second circuit board 320 are connected by gold wire bonding on their end faces to achieve electrical connection. The high-frequency signal output by the gold finger 301 then propagates along the surface of the first circuit board 310. The non-high-frequency signal output by the gold finger 301 can propagate along the surface of the first circuit board 310 or along the surface of the first circuit board 310 to the surface of the second circuit board 320.

[0217] In some embodiments, the optical module may include a mounting plate 900. A first circuit board 310 and a second circuit board 320 are respectively fixed to the surface of the mounting plate 900. The mounting plate 900 is located below the end-to-end contact point of the first circuit board 310 and the second circuit board 320 to simultaneously support both the first circuit board 310 and the second circuit board 320. Meanwhile, the mounting plate 900 has a high thermal conductivity.

[0218] In some embodiments, the first circuit board 310 and the second circuit board 320 are connected by gold wire bonding at their junction. The gold wires primarily establish electrical connections, with a relatively weaker fixed connection. The first circuit board 310 and the second circuit board 320 are respectively fixed to the surface of the fixing plate 900 to fix the first circuit board 310 and the second circuit board 320 together, thereby enhancing the fixation between the first circuit board 310 and the second circuit board 320.

[0219] In some embodiments, a first circuit board 310 is provided at one end of the surface of the fixing plate 900, and a second circuit board 320 is provided at the other end, so as to fix the first circuit board 310 and the second circuit board 320 together and enhance the fixed connection between the first circuit board 310 and the second circuit board 320.

[0220] In some embodiments, the light emitting component 400 is located on the surface of the fixing plate 900, which helps to improve the heat dissipation efficiency of the light emitting component 400. The fixing plate 900 has good thermal conductivity.

[0221] In some embodiments, the first circuit board 310 is configured to transmit both high-frequency and non-high-frequency signals, and the second circuit board 320 is configured to transmit non-high-frequency signals, thus achieving separate signal transmission between the two boards. The first and second circuit boards use different materials. The first circuit board 310 has a low dielectric constant to support high-frequency signal transmission. The second circuit board 320 has relatively lower dielectric constant requirements. Since high-frequency signals have a faster transmission rate, and the transmission rate is inversely proportional to the square root of the dielectric constant, the lower the dielectric constant, the faster the signal transmission rate.

[0222] In some embodiments, the first circuit board 310 has a low dielectric constant. For example, the dielectric constant of the first circuit board 310 is lower than that of the second circuit board 320. Since low dielectric constant materials are more expensive, separate board transmission of signals can reduce circuit board design costs.

[0223] In some embodiments, the first circuit board 310 is configured to transmit both high-frequency and non-high-frequency signals, and the second circuit board 320 is configured to transmit non-high-frequency signals. Therefore, the design of the first circuit board 310 requires strict control over its interlayer structure, layout, and wiring to provide better signal shielding and anti-interference capabilities to support high-frequency signal transmission. The design of the second circuit board 320 is relatively simple and has lower design costs.

[0224] In some embodiments, the optical modulation chip 440 is located on the surface of the fixing plate 900. There is a certain space between the optical modulation chip 440 and the edge of the fixing plate 900, thereby providing placement space for the first circuit board 310. The end of the first circuit board 310 is located on the surface of the fixing plate 900 and on one side of the optical modulation chip 440, which facilitates high-frequency signal electrical connection between the optical modulation chip 440 and the first circuit board 310.

[0225] In some embodiments, a gold finger 301 is formed on one end surface of the first circuit board 310, and a high-frequency signal pad and an electrical connection pad are formed on the other end surface. The high-frequency signal pad is used to realize the electrical connection between the first circuit board 310 and the optical modulation chip 440, and the electrical connection pad is used to realize the electrical connection between the first circuit board 310 and the second circuit board 320.

[0226] In some embodiments, the first circuit board 310 or the second circuit board 320 has a clearance notch to allow light emitting components 400 on the surface of the fixing plate 900 to pass.

[0227] In some embodiments, the DSP chip 302 is located on the surface of the first circuit board 310. The DSP chip 302 is located on one side of the gold finger 301, and high-frequency signals are transmitted between the DSP chip 302 and the gold finger 301.

[0228] In some embodiments, the optical modulation chip 440 is electrically connected to the DSP chip 302, and the modulation drive signal required by the optical modulation chip 440 can be provided by the DSP chip 302. Alternatively, the modulation drive signal required by the optical modulation chip 440 can be provided by a separately configured driver chip.

[0229] In some embodiments, one end of the TIA530 is electrically connected to the optical receiver chip 520 to receive the photocurrent signal output by the optical receiver chip 520. The other end of the TIA530 is electrically connected to the DSP chip 302 to transmit the amplified electrical signal from the TIA530 to the DSP chip 302.

[0230] In some embodiments, the TIA530 is located on the surface of the first circuit board 310 and on one side of the DSP chip 302, which helps to ensure the high-frequency signal transmission performance between the TIA530 and the DSP chip 302. For example, the DSP chip 302 is located between the TIA530 and the gold finger 301.

[0231] In some embodiments, the optical receiver chip 520 is located on the surface of the first circuit board 310 and on one side of the TIA 530, which helps to ensure the high-frequency signal transmission performance between the optical receiver chip 520 and the TIA 530. For example, the TIA 530 is located between the optical receiver chip 520 and the DSP chip 302.

[0232] In some embodiments, the second optical fiber support portion 514 in the refracting member 510 is located on the surface of the second circuit board 320. The length of the second optical fiber support portion 514 is shorter than the length of the first optical fiber support portion 513, and there is a certain space between the end of the second optical fiber support portion 514 and the reflective end face 512. Therefore, there is a height difference between the bottom surface of the first optical fiber support portion 513 and the surface of the first circuit board 310 or the second circuit board 320, thereby providing wire bonding space for the electrical connection between the first circuit board 310 and the second circuit board 320.

[0233] In some embodiments, the bonding area between the first circuit board 310 and the second circuit board 320 is located below the first optical fiber support 513. Exemplarily, the bonding area between the first circuit board 310 and the second circuit board 320 is located between the second optical fiber support 514 and the optical receiver chip 520.

[0234] In some embodiments, the first optical fiber support portion 513 in the refracting member 510 extends from the surface of the second circuit board 320, across the wire bonding between the first circuit board 310 and the second circuit board 320, and to the surface of the first circuit board 310, so that the reflective end face 512 is located above the light receiving chip 530.

[0235] Figure 9a This is a partial cross-sectional view of an optical module according to some embodiments. Figure 9a As shown, in some embodiments, the first circuit board 310 and the second circuit board 320 are respectively fixed to the surface of the fixing plate 900. The fixing plate 900 is located below the electrical connection area of ​​the first circuit board 310 and the second circuit board 320, so as to support the first circuit board 310 and the second circuit board 320 at the same time.

[0236] In some embodiments, the first circuit board 310 and the second circuit board 320 are respectively fixed on the surface of the fixing plate 900, and the two are connected by gold wire bonding to realize the electrical connection between the first circuit board 310 and the second circuit board 320. Thus, the non-high frequency signal output by the gold finger 301 can be transmitted along the surface of the first circuit board 310, or it can be transmitted along the first circuit board 310 to the surface of the second circuit board 320.

[0237] In some embodiments, one end of the fixing plate 900 is located below the first circuit board 310. The other end of the fixing plate 900 has a first region for supporting the second circuit board 320 and a second region for supporting the light emitting component 400.

[0238] In some embodiments, the second circuit board 320 has a first clearance notch 321 to avoid the light emitting component 400 on the surface of the fixing plate 900. The first clearance notch 321 is formed on the side of the second circuit board 320. The light emitting component 400 is located within the first clearance notch 321. The surface of the second circuit board 320 adjacent to the first clearance notch 321 is disposed above the fixing plate 900, thereby fixing the second circuit board 320 to the surface of the fixing plate 900.

[0239] In some embodiments, since a first clearance notch 321 is formed on the surface of the second circuit board 320, the dimension of the fixing plate 900 located below the second circuit board 320 is greater than the dimension of the fixing plate 900 located below the first circuit board 310.

[0240] In some embodiments, the refracting element 510 is located on one side of the light emitting component 400 and also on one side of the first clearance notch 321. The second optical fiber support portion 514 in the refracting element 510 is located on the surface of the second circuit board 320. The first optical fiber support portion 513 in the refracting element 510 extends from the surface of the second circuit board 320, across the wire bonding between the first circuit board 310 and the second circuit board 320, and to the surface of the first circuit board 310, so that the reflective end face 512 is located above the light receiving chip 530.

[0241] In some embodiments, the electrical connection area between the first circuit board 310 and the second circuit board 320 is located below the first optical fiber support 513. The bottom of the first optical fiber support 513 is higher than the surface of the first circuit board 310 or the second circuit board 320, thereby providing wiring space for the bonding between the first circuit board 310 and the second circuit board 320, and realizing the electrical connection between the first circuit board 310 and the second circuit board 320.

[0242] Figure 9b This is an assembly diagram of a lower housing, a first circuit board, and a second circuit board according to some embodiments. Figure 9c This is an exploded view of an assembly of a lower housing, a first circuit board, and a second circuit board according to some embodiments. Figure 9d This is a cross-sectional view of an assembly of an upper housing, a lower housing, a first circuit board, and a second circuit board according to some embodiments. Figures 9b-9d As shown, in some embodiments, a first clearance notch 321 is formed on the surface of the second circuit board 320 to avoid the light emitting component 400.

[0243] In some embodiments, the surface of the lower housing 202 protrudes upward to form a protrusion 2023. The protrusion 2023 protrudes toward the upper housing 201. The protrusion 2023 is located on one side of the fixing plate 900. Exemplarily, the protrusion 2023 is located on the side of the laser 410 and is located within the first clearance notch 321.

[0244] In some embodiments, a space is left between the end of the fixing plate 900 and the sidewall of the second circuit board 320 so that the first clearance notch 321 can avoid the light emitting component 400 and also avoid the protrusion 2023.

[0245] In some embodiments, the fixing plate 900 and the lower housing 202 are thermally conductively connected. Exemplarily, the bottom surface of the fixing plate 900 and the lower housing 202 are filled with thermally conductive gel.

[0246] In some embodiments, the protrusion 2023 is thermally connected to the upper housing 201. Exemplarily, the space between the surface of the protrusion 2023 and the upper housing 201 is filled with thermally conductive gel.

[0247] In some embodiments, the heat generated by the laser 410 is conducted downwards to the fixing plate 900. The fixing plate 900 then conducts the heat downwards to the lower housing 202. The protrusions 2023 on the surface of the lower housing 202 then transfer the heat upwards to the upper housing 201. A heat dissipation duct can be formed between the upper housing 201 and the cage 106 of the host computer 100, resulting in better heat dissipation efficiency.

[0248] In some embodiments, the fiber array 450 is located on the surface of the fixing plate 900. The fiber ribbons in the fiber array 450 extend along the surface of the fixing plate 900 to the surface of the second circuit board 320.

[0249] In some embodiments, the fiber ribbon in the fiber array 450 passes horizontally along the surface of the circuit board 300 to avoid stress and fiber breakage when the fiber comes into contact with the circuit board 300. In some embodiments, the fiber outlet of the fiber array 450 can be raised by a certain amount, so that the fiber can pass horizontally and buffered when it falls on the surface of the circuit board 300, reducing interference with the surface of the circuit board 300 and ensuring smooth horizontal fiber outlet.

[0250] In some embodiments, one end of the fixing plate 900 is located below the first circuit board 310, and the other end does not extend beyond the first clearance notch 321. That is, the size of the fixing plate 900 below the second circuit board 320 is smaller than the size of the first clearance notch 321. Therefore, there is a certain distance between the fixing plate 900 and the sidewall of the first clearance notch 321, and the fiber ribbon in the fiber array 450 is suspended within this distance. When the fiber ribbon in the fiber array 450 is lifted upwards, bending space can be provided for the fiber ribbon. The fiber is not subjected to stress within the bending space, thereby preventing fiber breakage.

[0251] Figure 10 This is an assembly diagram of a first circuit board and a second circuit board according to some embodiments. Figure 11 This is an exploded view of a first circuit board and a second circuit board assembly according to some embodiments. Figure 12This is a partial view of an assembly of a first circuit board and a second circuit board according to some embodiments. Figure 10-12 As shown, in some embodiments, the optical module includes a first circuit board 310 and a second circuit board 320. The first circuit board 310 and the second circuit board 320 are respectively fixed to the surface of the fixing plate 900.

[0252] In some embodiments, the first circuit board 310 and the second circuit board 320 are connected end-to-end to achieve electrical connection between them. A gold finger 301 is provided on one end surface of the first circuit board 310. A DSP chip 302 is provided on the surface of the first circuit board 310. The DSP chip 302 is located on one side of the gold finger 301.

[0253] In some embodiments, the first circuit board 310 is used to transmit high-frequency signals and non-high-frequency signals, and the second circuit board 320 is used to transmit non-high-frequency signals. High-frequency signals are transmitted along the surface of the first circuit board 310; non-high-frequency signals are transmitted along the surface of the first circuit board 310, and may also be transmitted from the first circuit board 310 to the surface of the second circuit board 320.

[0254] In some embodiments, the dielectric constant of the first circuit board 310 is lower than that of the second circuit board 320 to support high-frequency signal transmission.

[0255] In some embodiments, the fixing plate 900 is located below the mating area between the first circuit board 310 and the second circuit board 320 to simultaneously support the first circuit board 310 and the second circuit board 320 from below. One end of the fixing plate 900 is located below the first circuit board 310. The other end of the fixing plate 900 has a first region for supporting the second circuit board 320 and a second region for supporting the light emitting component 400.

[0256] In some embodiments, the second circuit board 320 has a first clearance notch 321 to avoid the light emitting component 400 on the surface of the fixing plate 900. The second circuit board 320 is L-shaped.

[0257] In some embodiments, the first circuit board 310 and the second circuit board 320 are mated and connected by gold wire bonding at their ends to achieve electrical connection between them, so that non-high frequency signals can be transmitted along the first circuit board 310 to the surface of the second circuit board 320.

[0258] In some embodiments, the bonding area between the first circuit board 310 and the second circuit board 320 is located below the first optical fiber support 513. Exemplarily, the bonding area between the first circuit board 310 and the second circuit board 320 is located between the second optical fiber support 514 and the optical receiver chip 520.

[0259] In some embodiments, the optical modulation chip 440 is located on the surface of the fixed plate 900. The optical modulation chip 440 is electrically connected to the first circuit board 310 so that a high-frequency signal is input into the optical modulation chip 440 through the first circuit board 310, thereby driving the optical modulation chip 440 to perform signal modulation.

[0260] In some embodiments, the optical modulation chip 440 is located on the surface of the fixed plate 900. The optical modulation chip 440 is electrically connected to the first circuit board 310 and the second circuit board 320 respectively to input high-frequency signals and non-high-frequency signals. The surface of the optical modulation chip 440 is flush with the surfaces of the first circuit board 310 and the second circuit board 320 respectively, so as to shorten the wiring between the optical modulation chip 440 and the first circuit board 310 and between the optical modulation chip 440 and the second circuit board 320, thereby improving signal transmission performance.

[0261] In some embodiments, the optical modulation chip 440 is electrically connected to the first circuit board 310 and the second circuit board 320 on its adjacent sides, respectively. Of the two adjacent sides of the optical modulation chip 440, one side is located on the side of the first circuit board 310 for electrical connection with the first circuit board 310; the other side is located on the side of the second circuit board 320 for electrical connection with the second circuit board 320.

[0262] In some embodiments, one side of the optical modulation chip 440 is electrically connected to the first circuit board 310 via wire bonding, so that a high-frequency signal can be input to the optical modulation chip 440 through the first circuit board 310. For example, the DSP chip 302 provides a modulation drive signal to the optical modulation chip 440 to drive the optical modulation chip 440 to modulate the optical signal.

[0263] In some embodiments, the other side of the optical modulation chip 440 is electrically connected to the second circuit board 320 via wire bonding, so that a non-high-frequency signal can be input to the optical modulation chip 440 through the second circuit board 320. For example, the gold finger 301 provides a modulation current signal to the optical modulation chip 440. The output modulation current signal is transmitted from the surface of the first circuit board 310 to the surface of the second circuit board 320, and then into the optical modulation chip 440.

[0264] In some embodiments, the laser 410 and the second circuit board 320 are electrically connected via wire bonding to input a non-high-frequency signal to the laser 410 through the second circuit board 320. Exemplarily, the gold finger 301 provides a bias current to the optical modulation chip 440. The bias current output by the gold finger 301 is transmitted through the surface of the first circuit board 310 to the surface of the second circuit board 320, and then into the laser 410.

[0265] In some embodiments, the bonding area between the first circuit board 310 and the second circuit board 320 is located at the end of the first circuit board 310 away from the gold finger 301, and the bonding area between the first circuit board 310 and the optical modulation chip 440 is also located at the end of the first circuit board 310 away from the gold finger 301.

[0266] Figure 13a This is a first circuit board structure diagram according to some embodiments. Figure 13b This is a diagram of a second circuit board structure according to some embodiments. For example... Figure 13a , 13b As shown, in some embodiments, the first circuit board 310 and the second circuit board 320 are electrically connected. The second circuit board 320 has a first clearance notch 321 to avoid the light emitting component 400. The second circuit board 320 is L-shaped, and the second circuit board 320 is a regular rectangle.

[0267] In some embodiments, a gold finger 301 is formed on one end surface of the first circuit board 310, and a first pad area 311 and a second pad area 312 are formed on the other end surface. The first pad area 311 is used for electrical connection with the second circuit board 320, and the second pad area 312 is used for electrical connection with the optical modulation chip 440.

[0268] In some embodiments, a third pad area 322 is formed on the end surface of the second circuit board 320. The third pad area 322 is wire-connected to the first pad area 311 to achieve electrical connection between the second circuit board 320 and the first circuit board 310.

[0269] In some embodiments, the second optical fiber support portion 514 is disposed on the surface of the second circuit board 320. The end of the second optical fiber support portion 514 is a certain distance from the end face of the second circuit board 320, and the end of the second optical fiber support portion 514 does not extend to the surface of the third pad area 322, that is, the end of the second optical fiber support portion 514 does not cover the third pad area 322, thereby avoiding the wire bonding between the second circuit board 320 and the first circuit board 310.

[0270] In some embodiments, a fourth pad area 323 is formed on the surface of the second circuit board 320. The fourth pad area 323 is wire-connected to the laser 410 to achieve electrical connection between the second circuit board 320 and the laser 410. The bias current output by the gold finger 301 is transmitted through the surface of the first circuit board 310 to the surface of the second circuit board 320, and then to the laser 410.

[0271] In some embodiments, a fifth pad region 324 is formed on the surface of the second circuit board 320. The fifth pad region 324 and the fourth pad region 323 are located on the same side, and the fifth pad region 324 and the third pad region 322 are located on adjacent sides.

[0272] In some embodiments, the second pad area 312 is electrically connected to one side of the optical modulation chip 440 to enable high-frequency signal transmission between the first circuit board 310 and the optical modulation chip 440. The fifth pad area 324 is electrically connected to the other side of the optical modulation chip 440 to enable non-high-frequency signal transmission between the second circuit board 320 and the optical modulation chip 440.

[0273] In some embodiments, the surface where the third pad area 322 is located is located on the surface of the fixing plate 900, thereby placing the second circuit board 320 on the surface of the fixing plate 900.

[0274] Figure 14 A partial cross-section of an optical module according to some embodiments Figure 1 .like Figure 14 As shown, in some embodiments, a first circuit board 310 is provided at one end of the surface of the fixing plate 900, and a second circuit board 320 is provided at the other end, so as to fix the first circuit board 310 and the second circuit board 320 together and enhance the fixed connection between the first circuit board 310 and the second circuit board 320.

[0275] In some embodiments, a second optical fiber support portion 514 is disposed on the surface of a second circuit board 320. A third pad area 322 is formed on the surface of the second circuit board 320 for wire bonding connection with the first circuit board 310. The end face of the second optical fiber support portion 514 does not extend to the third pad area 322 to avoid wire bonding between the second circuit board 320 and the first circuit board 310, thereby providing wiring space for the second circuit board 320 and the first circuit board 310.

[0276] In some embodiments, the second optical fiber support 514 is located above the first optical fiber support 513. The first optical fiber support 513 extends along the surface of the second circuit board 320 and across the bonding wire between the second circuit board 320 and the first circuit board 310 to the surface of the first circuit board 310, so that the reflective end face 512 is disposed on the light receiving chip 530, thereby allowing the reflected light signal to be incident on the light receiving chip 530.

[0277] In some embodiments, the bonding area between the first circuit board 310 and the second circuit board 320 is located below the first optical fiber support 513. Exemplarily, the bonding area between the first circuit board 310 and the second circuit board 320 is located between the second optical fiber support 514 and the optical receiver chip 520. Figure 6b As shown, there is a wiring space just below the first optical fiber support 513, which provides wiring space for the bonding between the first circuit board 310 and the second circuit board 320.

[0278] In some embodiments, the second optical fiber support portion 514 in the refracting member 510 is located on the surface of the second circuit board 320. The length of the second optical fiber support portion 514 is shorter than the length of the first optical fiber support portion 513. The cut-off end face of the second optical fiber support portion 514 is not flush with the end face of the second circuit board 320. The end face of the second optical fiber support portion 514 is a certain distance away from the end of the second circuit board 320, thereby avoiding the third pad area 322 on the surface of the second circuit board 320 and avoiding the wire bonding between the second circuit board 320 and the first circuit board 310.

[0279] In some embodiments, the bottom surface of the first optical fiber support 513 has a height difference from the surface of the first circuit board 310 or the second circuit board 320, thereby providing space for wire bonding for electrical connection between the first circuit board 310 and the second circuit board 320.

[0280] In some embodiments, the first optical fiber support portion 513 in the refracting member 510 extends from the surface of the second circuit board 320, across the wire bonding between the first circuit board 310 and the second circuit board 320, and to the surface of the first circuit board 310, so that the reflective end face 512 is disposed above the light receiving chip 530.

[0281] Figure 15a A partial cross-section of an optical module according to some embodiments Figure 2 , Figure 15b This is a partial cross-sectional enlarged view of an optical module according to some embodiments. For example... Figure 15a and Figure 15b As shown, in some embodiments, a fixing plate 900 is disposed on one side of the light emitting component 400, with one end used to support the light emitting component 400 and the other end used to support the first circuit board 310. The light modulation chip 440 is electrically connected to the first circuit board 310 so that the first circuit board 310 transmits high-frequency signals to the light modulation chip 440.

[0282] In some embodiments, there is a certain distance between the fixing plate 900 and the sidewall of the first clearance notch 321, and the fiber ribbon in the fiber array 450 is suspended in this distance. When the fiber ribbon in the fiber array 450 is lifted upwards, a bending space can be provided for the fiber ribbon, and the fiber is not subjected to stress within the bending space, thereby avoiding fiber breakage. The fiber ribbon travels along the surface of the fixing plate 900, through the suspended area, until it reaches the surface of the second circuit board 320.

[0283] In some embodiments, the surface of the optical modulation chip 440 is flush with the surface of the first circuit board 310 to shorten the wiring between them and improve the high-frequency signal transmission performance.

[0284] Figure 16 This is an alternative assembly structure diagram of a first circuit board and a second circuit board according to some embodiments. For example... Figure 16As shown, in some embodiments, the first circuit board 310 and the second circuit board 320 are electrically connected by wire bonding. The first circuit board 310 is used to transmit high-frequency signals and non-high-frequency signals, while the second circuit board 320 is used to transmit non-high-frequency signals. The dielectric constant of the first circuit board 310 is lower than that of the second circuit board 320 to meet the requirements for high-frequency signal transmission.

[0285] In some embodiments, the first circuit board 310 and the second circuit board 320 are fixed to the surface of the fixing plate 900. The fixing plate 900 supports the first circuit board 310 and the second circuit board 320.

[0286] In some embodiments, the light emitting component 400 is located on the surface of the fixing plate 900. The light receiving component 500 is located on one side of the light emitting component 400. Exemplarily, the refractive element 510 is located on one side of the light emitting component 400.

[0287] In some embodiments, the second circuit board 320 has a first clearance notch 321 to avoid the light emitting component 400. The refractive element 510 is located on one side of the first clearance notch 321.

[0288] In some embodiments, the bonding wire between the first circuit board 310 and the second circuit board 320 is located below the first optical fiber support portion 513. The first optical fiber support portion 513 extends from the surface of the second circuit board 320, across the bonding wire between the first circuit board 310 and the second circuit board 320, and to the surface of the first circuit board 310, so that the reflective end face 512 is located above the light receiving chip 530.

[0289] In some embodiments, the adjacent sides of the optical modulation chip 440 are electrically connected to the first circuit board 310 and the second circuit board 320, respectively, so as to input high-frequency signals and non-high-frequency signals to the optical modulation chip 440.

[0290] In some embodiments, the laser 410 is electrically connected to the second circuit board 320 to input a non-high frequency signal to the laser 410.

[0291] Figure 17 This is an alternative assembly cross-sectional view of the first and second circuit boards according to some embodiments. Figure 18 This is an enlarged cross-sectional view of another assembly of a first circuit board and a second circuit board according to some embodiments. Figure 18 for Figure 17 A magnified view of a portion of the image. In some embodiments, such as... Figure 17 and Figure 18 As shown, the first circuit board 310 and the second circuit board 320 are fixed on the surface of the fixing plate 900, and the two are connected end-to-end on the surface of the fixing plate 900.

[0292] In some embodiments, one end of the fixing plate 900 is located below the first circuit board 310, and the other end extends beyond the first clearance notch 321 to be located below the second circuit board 320. That is, the size of the fixing plate 900 below the second circuit board 320 is larger than the size of the first clearance notch 321. The fiber ribbon in the fiber array 450 exits from the fiber array 450 and extends to the surface of the second circuit board 320.

[0293] In some embodiments, one end of the fixing plate 900 supports the first circuit board 310; the other end has a first region supporting the light emitting component 400 and a second region supporting the second circuit board 320. The optical modulation chip 440 is disposed near the first circuit board 310, and the fiber array 450 is disposed near the second circuit board 320.

[0294] In some embodiments, the surface of the optical modulation chip 440 is flush with the surface of the first circuit board 310 to shorten the wiring between them and improve the high-frequency signal transmission performance.

[0295] In some embodiments, the dimension of the fixing plate 900 located below the second circuit board 320 is greater than the dimension of the fixing plate 900 located below the first circuit board 310.

[0296] In some embodiments, the light emitting component 400 is embedded in the first clearance notch 321, and the heat generated by the light emitting component 400 is conducted through the fixing plate 900.

[0297] Figure 19 This is yet another internal structural form of an optical module according to some embodiments. Figure 1 , Figure 20 This is a structural breakdown of the internal morphology of an optical module according to some embodiments. Figure 1 .like Figures 19-20 As shown, in some embodiments, the light receiving component 500 is located on one side of the light emitting component 400.

[0298] In some embodiments, the light emitting component 400 is located on the surface of the fixing plate 900. The heat generated by the light emitting component 400 is conducted through the fixing plate 900.

[0299] In some embodiments, the optical modulation chip 440 is electrically connected to the first circuit board 310 and the second circuit board 320 on its adjacent sides, respectively. One of the adjacent sides is electrically connected to the surface of the first circuit board 310b via wire bonding, so as to input a high-frequency signal to the optical modulation chip 440 through the first circuit board 310b. The other of the adjacent sides is electrically connected to the surface of the second circuit board 320b via wire bonding, so as to input a non-high-frequency signal to the optical modulation chip 440 through the second circuit board 320b.

[0300] In some embodiments, different models of the optical modulation chip 440 have different requirements for non-high-frequency signals. To meet the non-high-frequency signal requirements of the optical modulation chip 440, a first clearance notch is formed on the surface of the second circuit board 320 at different locations. For example, the first clearance notch is formed at the middle position of the second circuit board 320. To distinguish the second circuit board 320 mentioned above, the second circuit board is defined as the second circuit board 320b, and correspondingly, the first circuit board is defined as the first circuit board 310b.

[0301] In some embodiments, a third clearance notch 321b is formed on the surface of the second circuit board 320b to avoid the light emitting component 400. If the light emitting component 400 is located within the third clearance notch 321b, the light emitting component 400 can be electrically connected to the first circuit board 310b and the second circuit board 320b respectively.

[0302] In some embodiments, the second circuit board 320b may include a first support surface 3211b. The first support surface 3211b is located on one side of the third clearance notch 321b.

[0303] In some embodiments, the second circuit board 320b may include a second support surface 3212b. The second support surface 3212b is located on the other side of the third clearance notch 321b.

[0304] In some embodiments, the third clearance notch 321b is located between the first arm surface 3211b and the second arm surface 3212b. The light emitting component 400 is located between the first arm surface 3211b and the second arm surface 3212b. Exemplarily, the third clearance notch 321b is U-shaped.

[0305] In some embodiments, the first side surface of the optical modulation chip 440 is wired to the surface of the first circuit board 310b to input high-frequency signals to the optical modulation chip 440 through the first circuit board 310b. The two sides adjacent to the first side surface are wired to the surface of the second circuit board 320b to input non-high-frequency signals to the optical modulation chip 440 through the second circuit board 320b.

[0306] In some embodiments, on the side adjacent to the first side of the optical modulation chip 440, a surface is wired to the surface of the first support surface 3211b to input non-high-frequency signals to the optical modulation chip 440 through the first support surface 3211b. On the other side adjacent to the first side of the optical modulation chip 440, a surface is wired to the surface of the second support surface 3212b to input non-high-frequency signals to the optical modulation chip 440 through the second support surface 3212b, thereby increasing the wiring space for non-high-frequency signals of the optical modulation chip 440 and meeting the wired requirements for non-high-frequency signals of the optical modulation chip 440.

[0307] Figure 21This is a partially enlarged view of another internal configuration of an optical module according to some embodiments. For example... Figure 21 As shown, in some embodiments, the first circuit board 310b is electrically connected to the second circuit board 320b.

[0308] In some embodiments, a first pad area 311b is formed on the surface of the first circuit board 310b. The surface of the optical modulation chip 440 is wire-connected to the surface of the first pad area 311b to input a high-frequency signal to the optical modulation chip 440 through the first circuit board 310b.

[0309] In some embodiments, a second pad region 312b is formed on the surface of the first circuit board 310b. The second pad region 312b is located on one side of the first pad region 311b. A third pad region 322b is formed on the surface of the first support surface 3211b. The third pad region 322b is wire-connected to the second pad region 312b to achieve electrical connection between the first circuit board 310b and the second circuit board 320b. Non-high frequency signals can be transmitted along the first circuit board 310b to the surface of the second circuit board 320b.

[0310] In some embodiments, a fourth pad region 313b is formed on the surface of the first circuit board 310b. A fifth pad region 323b is formed on the surface of the second support surface 3212b. The fifth pad region 323b and the fourth pad region 313b are wire-connected to achieve electrical connection between the first circuit board 310b and the second circuit board 320b. Non-high frequency signals can be transmitted along the first circuit board 310b to the surface of the second circuit board 320b.

[0311] In some embodiments, a sixth pad region 324b is formed on the surface of the first arm surface 3211b. The surface of the optical modulation chip 440 is wire-connected to the surface of the sixth pad region 324b to input non-high frequency signals to the optical modulation chip 440.

[0312] In some embodiments, a seventh pad region 325b is formed on the surface of the second arm surface 3212b. The surface of the optical modulation chip 440 is wire-connected to the surface of the seventh pad region 325b to input non-high frequency signals to the optical modulation chip 440.

[0313] In some embodiments, an eighth pad region 326b is formed on the surface of the second arm surface 3212b. The eighth pad region 326b is located on one side of the seventh pad region 325b. The surface of the laser 410 is electrically connected to the surface of the eighth pad region 326b to input non-high frequency signals into the laser 410.

[0314] Figure 22 This is a structural breakdown of the internal morphology of an optical module according to some embodiments. Figure 2 , Figure 23a This is a partial cross-section of the internal structure of an optical module according to some embodiments. Figure 1, Figure 23b This is a partial cross-section of the internal structure of an optical module according to some embodiments. Figure 2 .like Figure 22 , Figure 23a and Figure 23b As shown, in some embodiments, the fixing plate 900 simultaneously supports the first circuit board 310b and the second circuit board 320b from below.

[0315] In some embodiments, one end of the fixing plate 900 is located below the first circuit board 310b, and the other end is located below the second circuit board 320b.

[0316] In some embodiments, the fifth pad area 323b and the fourth pad area 313b are wire-connected to achieve an electrical connection between the first circuit board 310b and the second circuit board 320b. The wire connection between the fifth pad area 323b and the fourth pad area 313b is located below the first optical fiber support 513. The first optical fiber support 513 is at a certain distance from the surface of the first circuit board 310b or the second circuit board 320b, thereby providing wiring space for the wire connection.

[0317] In some embodiments, the two opposite sides of the optical modulation chip 440 are wired to the surface of the second circuit board 320b to increase the wiring space for non-high frequency signals of the optical modulation chip 440 and meet the non-high frequency signal transmission requirements of the optical modulation chip 440.

[0318] Figure 24a This is an assembly diagram of a lower housing, a first circuit board, and a second circuit board according to some embodiments. Figure 24b This is a cross-sectional view of a lower housing, a first circuit board, and a second circuit board assembly according to some embodiments. Figure 24a , Figure 24b As shown, in some embodiments, the surface of the lower housing 202 protrudes upward to form a protrusion 2023. The protrusion 2023 protrudes toward the upper housing 201. The protrusion 2023 is located within the third clearance notch 321b and is located on one side of the fixing plate 900. Exemplarily, the protrusion 2023 is located on one side of the laser 410.

[0319] In some embodiments, the heat generated by the laser 410 is conducted downwards to the fixing plate 900. The fixing plate 900 then conducts the heat downwards to the lower housing 202. The protrusions 2023 on the surface of the lower housing 202 then transfer the heat upwards to the upper housing 201. A heat dissipation duct can be formed between the upper housing 201 and the cage 106 of the host computer 100, resulting in better heat dissipation efficiency.

[0320] Figure 25 Another internal structure of an optical module according to some embodiments Figure 1 , Figure 26Deconstruction of another internal structural form of an optical module according to some embodiments Figure 1 .like Figure 25 and 26 As shown, in some embodiments, the light receiving component 500 is located on one side of the light emitting component 400.

[0321] In some embodiments, the optical module may include a first circuit board 310a. One end surface of the first circuit board 310a is provided with gold fingers 301. The first circuit board 310a is used to transmit high-frequency signals and non-high-frequency signals.

[0322] In some embodiments, the optical module may include a second circuit board 320a. The second circuit board 320a is used to transmit non-high-frequency signals. The second circuit board 320a is end-to-end connected to the first circuit board 310a. A wire is punched at the end-to-end connection point to achieve electrical connection between the two.

[0323] In some embodiments, the dielectric constant of the first circuit board 310a is lower than that of the second circuit board 320a to support the transmission of high-frequency signals.

[0324] In some embodiments, the first circuit board 310a and the second circuit board 320a are respectively fixed to the surface of the fixing plate 900. The fixing plate 900 is located below the first circuit board 310a and the second circuit board 320a to simultaneously support both the first circuit board 310a and the second circuit board 320a.

[0325] In some embodiments, the light emitting component 400 is located on the surface of the fixing plate 900. The heat generated by the light emitting component 400 is conducted through the fixing plate 900.

[0326] In some embodiments, one end surface of the first circuit board 310a is provided with gold fingers 301, and the other end is formed with a second clearance notch 311a to avoid the light emitting component 400 on the surface of the fixing plate 900. Exemplarily, the first circuit board 310a is L-shaped, and the second circuit board 302a is regular in shape. The second clearance notch 311a is formed on the side of the first circuit board 310a.

[0327] In some embodiments, since a second clearance notch 311a is formed on the surface of the first circuit board 310a, the dimension of the fixing plate 900 located below the first circuit board 310a is greater than the dimension of the fixing plate 900 located below the second circuit board 320a.

[0328] In some embodiments, the light receiving component 500 is located on the surface of the first circuit board 310a. Exemplarily, the light receiving component 500 is located on one side of the second clearance notch 311a.

[0329] In some embodiments, the ends of the first circuit board 310a and the second circuit board 320a are electrically connected by wire bonding, thereby enabling non-high frequency signals to be transmitted along the first circuit board 310a to the surface of the second circuit board 320a.

[0330] In some embodiments, the bonding wire between the first circuit board 310a and the second circuit board 320a is located below the optical fiber 513 in the refracting element 510. The optical fiber 513 exits and passes above the bonding wire between the first circuit board 310a and the second circuit board 320a until it extends to the surface of the second circuit board 320a. There is a certain distance between the optical fiber 513 in the refracting element 510 and the surface of the circuit board 300, which can provide wiring space for the bonding wire between the first circuit board 310a and the second circuit board 320a.

[0331] In some embodiments, the surface of the laser 410 is wire-connected to the surface of the first circuit board 310a to achieve electrical connection between the two. In some embodiments, the surface of the laser 410 may also be wire-connected to the surface of the second circuit board 320a to achieve electrical connection between the two. Exemplarily, a shorter wire length can be selected to achieve electrical connection of the laser 410.

[0332] In some embodiments, the optical modulation chip 440 is wire-connected to the surface of the first circuit board 310a on both adjacent sides, thereby achieving electrical connection between the optical modulation chip 440 and the first circuit board 310a. On one of the adjacent sides, one surface is wire-connected to the first circuit board 310a to input high-frequency signals to the optical modulation chip 440 through the first circuit board 310a; the other surface is wire-connected to the first circuit board 310a to input non-high-frequency signals to the optical modulation chip 440 through the first circuit board 310a.

[0333] Figure 27 This is an exploded view of a first circuit board and a second circuit board assembly according to some embodiments. Figure 27 As shown, in some embodiments, the first circuit board 310a and the second circuit board 320a are connected end-to-end.

[0334] In some embodiments, one end of the surface of the first circuit board 310a is provided with gold fingers 301, and the other end is formed with a second clearance notch 311a. The first circuit board 310a is L-shaped, and the second circuit board 302a is regular in shape.

[0335] In some embodiments, a first pad region 312a is formed on the first surface of the end of the first circuit board 310a. The first pad region 312a is used for electrical connection with the second circuit board 320a.

[0336] In some embodiments, a second pad region 315a and a third pad region 314a are formed on the second surface of the end of the first circuit board 310a. The second pad region 315a is used for electrical connection with the laser 410. The third pad region 314a is used for electrical connection with the optical modulation chip 440 to input a non-high-frequency signal to the optical modulation chip 440. The second surface of the end of the first circuit board 310a and the first surface of the end of the first circuit board 310a are located on adjacent sides.

[0337] In some embodiments, a fourth pad region 313a is formed on the third surface of the first circuit board 310a at its end. The fourth pad region 313a is used for electrical connection with the optical modulation chip 440 to input high-frequency signals to the optical modulation chip 440. The third surface of the first circuit board 310a at its end and the second surface of the first circuit board 310a at its end are located on adjacent sides. The surface of the optical modulation chip 440 is flush with the surface of the first circuit board 310a to shorten the bonding wire length between them and improve the high-frequency signal transmission performance between them.

[0338] In some embodiments, a fifth pad area 321a is formed on the end surface of the second circuit board 320a. The fifth pad area 321a is wire-connected to the first pad area 312a to achieve electrical connection between the second circuit board 320a and the first circuit board 310a, so that non-high frequency signals can be transmitted along the surface of the first circuit board 310a to the surface of the second circuit board 320a.

[0339] Figure 28 Another internal structure of an optical module according to some embodiments Figure 2 , Figure 29 Deconstruction of another internal structural form of an optical module according to some embodiments Figure 2 .like Figure 28 and 29 As shown, in some embodiments, the fixing plate 900 simultaneously supports the first circuit board 310a and the second circuit board 320a.

[0340] In some embodiments, the light emitting component 400 is located on the surface of the fixing plate 900, and the light receiving component 500 is located on the surface of the first circuit board 310a. The light receiving component 500 is located on one side of the light emitting component 400. A second clearance notch 311a is formed on the surface of the first circuit board 310a to avoid the light emitting component 400, and the light receiving component 500 is located on one side of the second clearance notch 311a.

[0341] In some embodiments, the bonding wire between the first circuit board 310a and the second circuit board 320a is located below the optical fiber 513 of the refractive element 510. The optical fiber 513 is a certain distance from the surface of the circuit board 300, which can provide wiring space for the bonding wire between the first circuit board 310a and the second circuit board 320a.

[0342] In some embodiments, if a second clearance notch 311a is formed on the surface of the first circuit board 310a, then the dimension of the fixing plate 900 located below the first circuit board 310a is greater than the dimension of the fixing plate 900 located below the second circuit board 320a.

[0343] Figure 30 This is a cross-sectional view of another internal configuration of an optical module according to some embodiments. Figure 31 A partially enlarged cross-sectional view of another internal form of an optical module according to some embodiments. Figure 1 , Figure 32 A partially enlarged cross-sectional view of another internal form of an optical module according to some embodiments. Figure 2 .like Figure 30-32 As shown, in some embodiments, the fixing plate 900 simultaneously supports the first circuit board 310a and the second circuit board 320a. The first circuit board 310a and the second circuit board 320a are respectively fixed to the surface of the fixing plate 900.

[0344] In some embodiments, if there is a height difference between the optical fiber of the refracting element 510 and the surface of the first circuit board 310a or the second circuit board 320a, then the bonding wire between the first circuit board 310a and the second circuit board 320a can be located below the optical fiber, that is, within the space between the optical fiber and the first circuit board 310a or the second circuit board 320a.

[0345] In some embodiments, a second clearance notch 311a is formed at one end of the first circuit board 310a to avoid the light emitting component 400. The surface of the first circuit board 310a on one side of the second clearance notch 311a is located on the surface of the fixing plate 900.

[0346] In some embodiments, one end of the fixing plate 900 extends beyond one side of the second clearance notch 311a to be located below the first circuit board 310a, and the other end extends beyond the other side of the second clearance notch 311a to be located below the second circuit board 320a.

[0347] In some embodiments, one end of the fixing plate 900 is located below the first circuit board 310a, and the other end is located below the second circuit board 320a. The middle region of the fixing plate 900 is used to carry the light emitting component 400 and support the first circuit board 310a.

[0348] In some embodiments, the fiber optic array 450 is disposed close to the second circuit board 320a, and the outgoing fibers of the fiber optic array 450 pass through the surface of the second circuit board 320a. The optical modulation chip 440 is disposed close to the first circuit board 310a, and the surface of the optical modulation chip 440 may be flush with the surface of the first circuit board 310a to shorten the bonding length between the optical modulation chip 440 and the first circuit board 310a and improve the high-frequency signal transmission performance of both.

[0349] In some embodiments, the second clearance notch 311a is provided such that the surface where the refractive element 510 is disposed protrudes relative to the surface, forming a protruding plate 316a. The protruding plate 316a is located on one side of the second clearance notch 311a. A first pad area 312a is located on the surface of the protruding plate 316a, and the surface of the protruding plate 316a is wired to the surface of the second circuit board 320a to achieve electrical connection between the second circuit board 320a and the first circuit board 310a.

[0350] In some embodiments, the refracting element 510 is located on the surface of the protruding plate 316a.

[0351] In some embodiments, one end of the fixing plate 900 is located below the first circuit board 310a, and the other end is located below the second circuit board 320a. The middle region of the fixing plate 900 is used to support the light emitting component 400 and to support the protruding plate 316a.

[0352] Figure 33 Another internal structure of an optical module according to some embodiments Figure 3 , Figure 34 Deconstruction of another internal structural form of an optical module according to some embodiments Figure 3 , Figure 35a This is a partially enlarged view of another internal configuration of an optical module according to some embodiments. For example... Figure 33 , Figure 34 and Figure 35a As shown, in some embodiments, the light receiving component 500 is located on one side of the light emitting component 400.

[0353] In some embodiments, the optical module may include a first circuit board 310a and a second circuit board 320a. One end surface of the first circuit board 310a is provided with gold fingers 301. The first circuit board 310a is used to transmit high-frequency signals and non-high-frequency signals. The second circuit board 320a is used to transmit non-high-frequency signals. The second circuit board 320a and the first circuit board 310a are connected end-to-end, and wire bonding is performed at the end-to-end connection to achieve electrical connection between them. The dielectric constant of the first circuit board 310a is lower than that of the second circuit board 320a to support the transmission of high-frequency signals.

[0354] In some embodiments, a second clearance notch 311a is formed at one end of the first circuit board 310a to avoid the light emitting component 400. The second clearance notch 311a is provided such that the surface on which the refractive element 510 is provided protrudes, forming a protruding plate 316a.

[0355] In some embodiments, the optical module may include a mounting plate 900a. The mounting plate 900a supports the first circuit board 310a and the second circuit board 320a. The mounting plate 900a is located below the first circuit board 310a and the second circuit board 320a. The first circuit board 310a and the second circuit board 320a are respectively fixed to the surface of the mounting plate 900a.

[0356] In some embodiments, the fixing plate 900a may include a body plate 910a. A first region of the body plate 910a is used to support a light emitting component, and a second region is used to support a first circuit board 310a. Exemplarily, a protruding plate 316a is located on the surface of the second region of the body plate 910a.

[0357] In some embodiments, the fixing plate 900a may include an extension plate 920a. The extension plate 920a extends relative to the body plate 910a toward the second circuit board 320a to support the second circuit board 320a. Exemplarily, the fixing plate 900a is L-shaped.

[0358] In some embodiments, a first circuit board 310a is located at one end of a body board 910a, and a second circuit board 320a is located at one end of an extension board 920a. The bonding wire between the first circuit board 310a and the second circuit board 320a is located on the surface of the extension board 920a.

[0359] In some embodiments, the fiber array 450 is located on the surface of the body plate 910a. The fiber ribbon of the fiber array 450 extends along the body plate 910a toward the second circuit board 320a. The sidewall of the body plate 910a is a certain distance from the sidewall of the second circuit board 320a, and this sidewall does not extend below the second circuit board 320a; the fiber ribbon in the fiber array 450 is suspended in this distance. Therefore, when the fiber ribbon in the fiber array 450 is lifted upwards so that the fiber can fall horizontally and buffered onto the surface of the second circuit board 320a, bending space can be provided for the fiber ribbon. The fiber is not stressed within this bending space, thereby preventing fiber breakage.

[0360] In some embodiments, the fixing plate 900a may include a notch 930a. The notch 930a is located on one side of the extension plate 920a. When the fiber ribbon in the fiber array 450 passes over the notch 930a, it provides bending space for the fiber ribbon, within which the fiber is not stressed, thereby preventing fiber breakage.

[0361] In some embodiments, the sidewalls of the body plate 910a do not extend below the second circuit board 320a to provide downward bending space for the fiber optic ribbon. The extension plate 920a extends below the second circuit board 320a to support the second circuit board 320a.

[0362] In some embodiments, the fixing plate 900a includes a notch 930a in an L-shape, thereby providing bending space for the optical fiber ribbon while also supporting the second circuit board 320a. Exemplarily, the second clearance notch 311a is further away from the second circuit board 300a relative to the notch 930a, and the light emitting component 400 is located between the second clearance notch 311a and the notch 930a.

[0363] Figure 35b This is a schematic diagram of an assembly of a lower housing, a first circuit board, and a second circuit board according to some embodiments. Figure 35b As shown, in some embodiments, a second clearance notch 311a is formed at one end of the first circuit board 310a to avoid the light emitting component 400.

[0364] In some embodiments, the surface of the lower housing 202 protrudes upward to form a protrusion 2023. The protrusion 2023 protrudes toward the upper housing 201. The protrusion 2023 is located on one side of the fixing plate 900. Exemplarily, the protrusion 2023 is located on the side of the laser 410 and is located within the first clearance notch 321.

[0365] In some embodiments, the second clearance notch 311a is further away from the second circuit board 300a relative to the notch portion 930a, and the notch portion 930a has space from the sidewall of the first circuit board 310a to the second circuit board 320a to avoid the protrusion 2023.

[0366] In some embodiments, the fixing plate 900a is thermally connected to the lower housing 202. Exemplarily, the bottom surface of the fixing plate 900a and the lower housing 202 are filled with thermally conductive gel.

[0367] In some embodiments, the protrusion 2023 is thermally connected to the upper housing 201. Exemplarily, the space between the surface of the protrusion 2023 and the upper housing 201 is filled with thermally conductive gel.

[0368] In some embodiments, the heat generated by the laser 410 is conducted downwards to the fixing plate 900a. The fixing plate 900a then conducts the heat downwards to the lower housing 202. The protrusions 2023 on the surface of the lower housing 202 then transfer the heat upwards to the upper housing 201. A heat dissipation duct can be formed between the upper housing 201 and the cage 106 of the host computer 100, resulting in better heat dissipation efficiency.

[0369] Figure 36 Another internal structure of an optical module according to some embodiments Figure 4 , Figure 37 Deconstruction of another internal structural form of an optical module according to some embodiments Figure 4 .like Figure 36 and Figure 37As shown, in some embodiments, the optical modulation chip 440 has different requirements for non-high-frequency signals depending on its model. To meet the non-high-frequency signal requirements of the optical modulation chip 440, a second clearance notch is formed on the surface of the first circuit board 310a at different locations. For example, the second clearance notch is formed at the middle position of the first circuit board 310a. To distinguish the first circuit board 310a from the above, the first circuit board is defined as the first circuit board 310c, and correspondingly, the second circuit board is defined as the second circuit board 320c.

[0370] In some embodiments, a fourth clearance notch 311c is formed on the surface of the first circuit board 310c to avoid the light emitting component 400.

[0371] In some embodiments, the first circuit board 310c may include a third support surface 312c. The third support surface 312c is located on one side of the fourth clearance notch 311c.

[0372] In some embodiments, the first circuit board 310c may include a fourth support surface 313c. The fourth support surface 313c is located on the other side of the fourth clearance notch 311c.

[0373] In some embodiments, if the fourth clearance notch 311c is located between the third arm surface 312c and the fourth arm surface 313c, then the light emitting component 400 is located between the third arm surface 312c and the fourth arm surface 313c. For example, the fourth clearance notch 311c is configured as a U-shaped opening.

[0374] In some embodiments, a first pad area 314c is formed on the surface of the first circuit board 310c. The surface of the optical modulation chip 440 is wire-connected to the first pad area 314c to input a high-frequency signal to the optical modulation chip 440 through the first circuit board 310c.

[0375] In some embodiments, a second pad area 3121c is formed on the surface of the third arm surface 312c. The surface of the optical modulation chip 440 is wire-connected to the second pad area 3121c to input a non-high frequency signal to the optical modulation chip 440 through the first circuit board 310c.

[0376] In some embodiments, a third pad area 3131c is formed on the surface of the fourth arm surface 313c. The surface of the optical modulation chip 440 is wire-connected to the third pad area 3131c to input non-high frequency signals to the optical modulation chip 440 through the first circuit board 310c, thereby increasing the wiring space for non-high frequency signals of the optical modulation chip 440 and meeting the non-high frequency signal transmission requirements of the optical modulation chip 440.

[0377] In some embodiments, the width of the fourth arm surface 313c is greater than the width of the third arm surface 312c, so that a refractive element 510 is provided on the surface of the fourth arm surface 313c.

[0378] Figure 38a This is an assembly structure diagram of a lower housing, a first circuit board, and a second circuit board according to some embodiments. Figure 38b This is a partially enlarged cross-sectional view of an assembly of a lower housing, a first circuit board, and a second circuit board according to some embodiments. Figure 38a and Figure 38b As shown, in some embodiments, a third arm surface 312c and a fourth arm surface 313c are respectively provided on both sides of the fourth clearance notch 311c. The optical modulation chip 440 can be wired to the third arm surface 312c and the fourth arm surface 313c respectively, increasing the number of wires of the optical modulation chip 440 and meeting the signal transmission requirements of the optical modulation chip 440.

[0379] In some embodiments, the surface of the lower housing 202 protrudes upward to form a protrusion 2023. The protrusion 2023 protrudes toward the upper housing 201. The protrusion 2023 is located on one side of the fixing plate 900. Exemplarily, the protrusion 2023 is located on the side of the laser 410 and within the fourth clearance notch 311c. The ends of the third arm surface 312c and the fourth arm surface 313c extend toward the second circuit board 320c to electrically connect to the second circuit board 320c.

[0380] In some embodiments, a space is left between the end of the fixing plate 900 and the sidewall of the second circuit board 320c so that the fourth clearance notch 311c can avoid the light emitting component 400 and the protrusion 2023 at the same time.

[0381] In some embodiments, the fixing plate 900 and the lower housing 202 are thermally conductively connected. Exemplarily, the bottom surface of the fixing plate 900 and the lower housing 202 are filled with thermally conductive gel.

[0382] In some embodiments, the protrusion 2023 is thermally connected to the upper housing 201. Exemplarily, the space between the surface of the protrusion 2023 and the upper housing 201 is filled with thermally conductive gel.

[0383] In some embodiments, the heat generated by the laser 410 is conducted downwards to the fixing plate 900. The fixing plate 900 then conducts the heat downwards to the lower housing 202. The protrusions 2023 on the surface of the lower housing 202 then transfer the heat upwards to the upper housing 201. A heat dissipation duct can be formed between the upper housing 201 and the cage 106 of the host computer 100, resulting in better heat dissipation efficiency.

[0384] In some embodiments, the third arm surface 312c and the fourth arm surface 313c extend beyond the fixing plate 900 toward the second circuit board 320c and establish an electrical connection with the second circuit board 320c respectively.

[0385] Figure 39aA cross-sectional view of a protective cover assembly according to some embodiments. Figure 1 .like Figure 39a As shown, in some embodiments, a protective cover 400a is coated on the surface of the light emitting component 400 to protect the light emitting component 400 from damage. At the light emitting end of the light emitting component 400, the protective cover 400a has an opening 401, which is coated on the surface of the isolator 430 to expose the light emitting surface of the isolator 430 and prevent light blocking. The light output by the isolator 430 is then transmitted to the optical modulation chip 440.

[0386] In some embodiments, the top surface of the protective cover 400a overlaps the surface of the second circuit board 320, and the bottom is fixed to the surface of the fixing plate 900, thereby fixing the protective cover 400a.

[0387] In some embodiments, the protective cover 400a and the fixing plate 900 form a receiving cavity, and the laser 410, lens 420 and isolator 430 are located inside the receiving cavity.

[0388] Figure 39b A cross-sectional view of a protective cover assembly according to some embodiments. Figure 2 .like Figure 39b As shown, in some embodiments, an opening 401 is formed at one end of the protective cover 400a to expose the light-emitting surface of the isolator 430 and prevent light blocking, so that the light output by the isolator 430 is transmitted to the optical modulation chip 440. In some embodiments, the other end of the protective cover 400a is sealed to provide sealed protection for the laser 410, the lens 420 and the isolator 430.

[0389] Figure 40 This is a structural diagram of the internal structure of an optical modulation chip according to some embodiments. Figure 40 As shown, in some embodiments, the optical modulation chip 440 includes three input optical ports, compatible with lasers 410 with different output optical powers. In some embodiments, the input and output ends of the optical modulation chip 440 are located on the same side.

[0390] In some embodiments, the light input end of the optical modulation chip 440 includes a first input optical port 441a, a second input optical port 441b, and a third input optical port 441c.

[0391] In some embodiments, the optical modulation chip 440 includes a first output optical port 442a, a second output optical port 442b, a third output optical port 442c, and a fourth output optical port 442d. These output optical ports face the fiber array 450.

[0392] In some embodiments, the first input optical port 441a, the second input optical port 441b, and the third input optical port 441c are respectively oriented toward the laser 410.

[0393] In some embodiments, when the output optical power of laser 410 is higher than a preset value, it can support the output of four optical signals, and laser 410 outputs light towards the second input optical port 441b. In some embodiments, when the output optical power of laser 410 is not higher than the preset value, two lasers 410 are respectively set, one laser 410 outputs light towards the first input optical port 441a, and the other laser 410 outputs light towards the third input optical port 441c.

[0394] In some embodiments, the optical modulation chip 440 may include a first beam splitter 443a. The first beam splitter 443a is located on the output optical path of the second input optical port 441b. The first beam splitter 443a includes an input port, a first output port, and a second output port, wherein the input port is optically connected to the second input optical port 441b. Exemplarily, the first beam splitter 443a may be a 1×2 multimode interference coupler.

[0395] In some embodiments, the optical modulation chip 440 may include a second beam splitter 443b. The second beam splitter 443b includes two input ports and two output ports. One input port is optically connected to a third input port 441c, and the other input port is optically connected to a first output port of the first beam splitter 443a. For example, the second beam splitter 443b may be a 2×2 multimode interference coupler.

[0396] In some embodiments, the optical modulation chip 440 may include a third beam splitter 443c. The third beam splitter 443c includes two input ports and two output ports. One input port is optically connected to the first input port 441a, and the other input port is optically connected to the second output port of the first beam splitter 443a. Exemplarily, the third beam splitter 443c may be a 2×2 multimode interference coupler.

[0397] In some embodiments, when the output optical power of the laser 410 is higher than a preset value, the laser 410 emits light toward the second input optical port 441b, and the emitted light from the laser 410 is coupled into the optical modulation chip 440. Within the optical modulation chip 440, the emitted light from the laser 410 is split into a first beam and a second beam by a first beam splitter 443a.

[0398] In some embodiments, the first output port of the first beam splitter 443a is optically connected to an input port of the second beam splitter 443b, so that the first beam is coupled into the second beam splitter 443b along the first output port of the first beam splitter 443a. The second beam splitter 443b splits the first beam into a first beam splitter and a second beam splitter, and outputs them along the two output ports respectively.

[0399] In some embodiments, the second output port of the first beam splitter 443a is optically connected to an input port of the third beam splitter 443c. The second beam then couples into the third beam splitter 443c along the second output port of the first beam splitter 443a. The third beam splitter 443c splits the second beam into a third beam and a fourth beam, which are then output along their respective output ports. Thus, the light emitted by the laser 410 is split into four paths through two beam splits.

[0400] In some embodiments, when the output optical power of the laser 410 is not higher than a preset value, two lasers 410 are respectively set, one of which outputs light toward the first input optical port 441a, and the other laser 410 outputs light toward the third input optical port 441c.

[0401] In some embodiments, light output from one laser 410 is input into the optical modulation chip 440 via a first input port 441a, and light output from another laser 410 is input into the optical modulation chip 440 via a third input port 441c.

[0402] In some embodiments, the third input optical port 441c is optically connected to one input port of the second beam splitter 443b, so that the light output from the laser 410 is coupled into the second beam splitter 443b. The second beam splitter 443b splits the light output from the laser 410 into a first beam splitter and a second beam splitter.

[0403] In some embodiments, the first input optical port 441a is optically connected to one input port of the third beam splitter 443c, so the light output from the other laser 410 is coupled into the third beam splitter 443c. The third beam splitter 443c splits the light output from the laser 410 into a third beam split and a fourth beam split. Thus, the light emitted by the laser 410 is split into four paths after two beam splits.

[0404] In some embodiments, the light is split in the output optical path of the first beam splitter 443a for monitoring the input optical power. The splitting ratio can be 1%-2%.

[0405] In some embodiments, when monitoring the input light power, the light can be split on the output light paths of the first beam splitter 443a and the second beam splitter 443b respectively to avoid light saturation.

[0406] In some embodiments, the optical modulation chip 440 may include a first Mach-Zehnder Interferometer (MZ) modulator 444a. The first MZ modulator 444a is located in the output optical path of the first beam splitter to modulate the signal of the first beam splitter, generating a first optical signal. The MZ modulator modulates the phase by changing the refractive index of the material, and then indirectly achieves intensity modulation of the light by utilizing the principles of constructive and destructive interference. Compared to electro-absorption modulators (EAM) and electro-absorption modulated lasers (EML), the MZ modulator has higher modulation rate and modulation efficiency.

[0407] In some embodiments, the optical modulation chip 440 may include a second MZ modulator 444b. The second MZ modulator 444b is located on the output optical path of the second beam splitter to modulate the signal of the second beam splitter, thereby generating a second optical signal.

[0408] In some embodiments, the optical modulation chip 440 may include a third MZ modulator 444c. The third MZ modulator 444c is located on the output optical path of the third beam splitter to modulate the signal of the third beam splitter and generate a third optical signal.

[0409] In some embodiments, the optical modulation chip 440 may include a fourth MZ modulator 444d. The fourth MZ modulator 444d is located on the output optical path of the fourth beam splitter to modulate the signal of the fourth beam splitter and generate a fourth optical signal.

[0410] In some embodiments, the incident light from the first MZ modulator 444a is split into two paths by the first wave splitter 445a, and one or both paths are phase modulated to generate a phase difference between the two paths, thereby achieving intensity modulation of the light. The two optical signals generated after modulation are output by the first interferometer 446a and generate a first optical signal through interference.

[0411] In some embodiments, the incident light from the second MZ modulator 444b is split into two paths by the second wave splitter 445b, and one or both paths are phase modulated to generate a phase difference between the two paths, thereby achieving intensity modulation of the light. The two optical signals generated after modulation are output by the second interferometer 446b and generate a second optical signal through interference.

[0412] In some embodiments, the incident light from the third MZ modulator 444c is split into two paths by the third wave splitter 445c, and one or both paths are phase modulated to generate a phase difference between the two paths, thereby achieving intensity modulation of the light. The two optical signals generated after modulation are output by the third interferometer 446c and generate a third optical signal through interference.

[0413] In some embodiments, the incident light from the fourth MZ modulator 444d is split into two paths by the fourth wave splitter 445d, and one or both paths are phase modulated to generate a phase difference between the two paths, thereby achieving intensity modulation of the light. The two optical signals generated after modulation are output by the fourth interferometer 446d and generate a fourth optical signal through interference.

[0414] In some embodiments, a first optical signal is output from the optical modulation chip 440 via a first output optical port 442a. A second optical signal is output from the optical modulation chip 440 via a second output optical port 442b. A third optical signal is output from the optical modulation chip 440 via a third output optical port 442c. A fourth optical signal is output from the optical modulation chip via a fourth output optical port 442d.

[0415] In some embodiments, the output optical path of the first interferometer 446a is split to monitor the output optical power of the first optical signal. Similarly, the output optical path of the second interferometer 446b is split to monitor the output optical power of the second optical signal. The output optical path of the third interferometer 446c is split to monitor the output optical power of the third optical signal. The output optical path of the fourth interferometer 446d is split to monitor the output optical power of the fourth optical signal.

[0416] In some embodiments, the optical modulation chip 440 may include a first heater 447a. The first heater 447a is disposed on the first or second interferometer arm of the first MZ modulator 444a to heat the first or second interferometer arm, change the phase of the first or second interferometer arm, and thereby adjust the phase difference between the first and second interferometer arms. When the first and second interferometer arms have a phase difference of π / 2, the first MZ modulator 444a is in its optimal operating state.

[0417] In some embodiments, the optical modulation chip 440 may include a second heater 447b. The second heater 447b is disposed on the first or second interferometer arm of the second MZ modulator 444b to heat the first or second interferometer arm and thereby adjust the phase difference between the first and second interferometer arms.

[0418] In some embodiments, the optical modulation chip 440 may include a third heater 447c. The third heater 447c is disposed on the first or second interferometer arm of the third MZ modulator 444c to heat the first or second interferometer arm and thereby adjust the phase difference between the first and second interferometer arms.

[0419] In some embodiments, the optical modulation chip 440 may include a fourth heater 447d. The fourth heater 447d is disposed on the first or second interferometer arm of the fourth MZ modulator 444d to heat the first or second interferometer arm and thereby adjust the phase difference between the first and second interferometer arms.

[0420] In some embodiments, the optical fiber link of the optical modulation chip 440 may fail, requiring fault diagnosis to identify the fault. For example, in loopback mode, the optical path is looped back for fault diagnosis and identification.

[0421] In some embodiments, the first wavelength division multiplexer 445a includes two input optical paths, one of which is used for phase modulation processing, and the other is coupled to a first grating coupler 448a. The first grating coupler 448a is optically connected to an external light source.

[0422] In some embodiments, the first interferometer 446a includes two output optical paths, one of which is used to output a first optical signal, and the other output optical path is coupled to the second grating coupler 448b.

[0423] In some embodiments, the bit error rate is determined by comparing the optical power difference between the first grating coupler 448a and the second grating coupler 448b, thereby enabling fault diagnosis and identification of the first optical splitting transmission link. For example, if the optical power difference between the first grating coupler 448a and the second grating coupler 448b exceeds a preset range, the transmission link may be considered to be faulty.

[0424] In some embodiments, similarly, one input optical path of the second demultiplexer 445b is coupled to the third grating coupler 448c, and one output optical path of the second interferometer 446b is coupled to the fourth grating coupler 448d. By comparing the optical power difference between the third grating coupler 448c and the fourth grating coupler 448d, the bit error rate is obtained, thereby enabling fault diagnosis and identification of the second optical splitting transmission link.

[0425] In some embodiments, similarly, one input optical path of the third splitter 445c is coupled to the fifth grating coupler 448e, and one output optical path of the third interferometer 446c is coupled to the sixth grating coupler 448f. By comparing the optical power difference between the fifth grating coupler 448e and the sixth grating coupler 448f, the bit error rate is obtained, thereby enabling fault diagnosis and identification of the third optical splitting transmission link.

[0426] In some embodiments, similarly, one input optical path of the fourth splitter 445d is coupled to the seventh grating coupler 448g, and one output optical path of the fourth interferometer 446d is coupled to the eighth grating coupler 448h. By comparing the optical power difference between the seventh grating coupler 448g and the eighth grating coupler 448h, the bit error rate is obtained, thereby enabling fault diagnosis and identification of the fourth optical splitting transmission link.

[0427] In some embodiments, the first demultiplexer 445a, the second demultiplexer 445b, the third demultiplexer 445c, and the fourth demultiplexer 445d are all 2×2 multimode interference couplers. The first interferometer 446a, the second interferometer 446b, the third interferometer 446c, and the fourth interferometer 446d are all 2×2 multimode interference couplers.

[0428] In some embodiments, the optical modulation chip 440 may include a first optical loop interface 449a and a second optical loop interface 449b. An optical waveguide connects the first optical loop interface 449a and the second optical loop interface 449b, forming a U-shaped optical loop. Light enters the optical modulation chip 440 along the first optical loop interface 449a and exits from the optical modulation chip 440 along the second optical loop interface 449b.

[0429] In some embodiments, the first optical loop interface 449a and the second optical loop interface 449b are respectively located at the optical port of the optical modulation chip 440. The first optical loop interface 449a is coupled to an external light source. Light output from the external light source is input into the optical modulation chip 440 along the first optical loop interface 449a and output from the optical modulation chip 440 along the second optical loop interface 449b.

[0430] In some embodiments, the bit error rate is obtained by comparing the optical power difference between the first optical loop interface 449a and the second optical loop interface 449b, thereby enabling fault diagnosis and identification of the optical port of the optical modulation chip 440. For example, if the optical power difference between the first optical loop interface 449a and the second optical loop interface 449b exceeds a preset range, it can be considered that a fault may have occurred at the optical port.

[0431] Figure 41 This is a diagram of the internal structure of another optical modulation chip according to some embodiments. Figure 41As shown, in some embodiments, the optical modulation chip 440 includes an input optical port that supports a laser 410 with high output power to output four optical modulation signals.

[0432] In some embodiments, the light input end and the light output end of the optical modulation chip 440 are located on the same side. The light input end of the optical modulation chip 440 includes an input optical port 441. Light emitted from the laser 414 is coupled into the optical modulation chip 440 through the input optical port 441. Exemplarily, the input optical port 441 faces the isolator 430 to receive light output from the isolator 430.

[0433] In some embodiments, the optical modulation chip 440 includes a first output optical port 442a, a second output optical port 442b, a third output optical port 442c, and a fourth output optical port 442d. These output optical ports face the fiber array 450.

[0434] In some embodiments, the optical modulation chip 440 may include a first beam splitter 443a. The first beam splitter 443a is located on the output optical path of the input optical port 441 to split the light output from the input optical port 441 into a first beam and a second beam. Exemplarily, the first beam splitter 443a is a 1×2 multimode interference coupler.

[0435] In some embodiments, the optical modulation chip 440 may include a second beam splitter 443b. The second beam splitter 443b is located in the transmission optical path of the first beam to split the first beam into a first beam splitter and a second beam splitter. Exemplarily, the second beam splitter 443b is a 1×2 multimode interference coupler.

[0436] In some embodiments, the optical modulation chip 440 may include a third beam splitter 443c. The third beam splitter 443c is located in the transmission optical path of the second beam to split the second beam into a third beam splitter and a fourth beam splitter. Thus, the light emitted by the laser 410 is split into four paths after two beam splits. Exemplarily, the third beam splitter 443c is a 1×2 multimode interference coupler.

[0437] In some embodiments, subsequent processing may refer to the appendix. Figure 41 The relevant information will not be elaborated further.

[0438] Figure 42 This is a schematic diagram of the electrical connection structure between an optical modulation chip and a first circuit board according to some embodiments. Figure 42 As shown, in some embodiments, the optical modulation chip 440 is wired to the first circuit board 310 so that the first circuit board 310 can input a driving signal to the optical modulation chip 440, thereby driving the optical modulation chip 440 to perform signal modulation.

[0439] In some embodiments, the high-frequency signal pad area of ​​the optical modulation signal 440 is connected to the first circuit board 310 using a G(GND)S(Signal)SG pad method to prevent crosstalk between different channels.

[0440] In some embodiments, the surface of the optical modulation chip 440 is formed with a first ground pad 4401, a first signal pad 4402, a second signal pad 4403 and a second ground pad 4404.

[0441] In some embodiments, a first ground pad 317, a first high-frequency signal pad 318a, a second high-frequency signal pad 318b, and a second ground pad 319 are formed on the surface of the first circuit board 310.

[0442] In some embodiments, the first ground pad 4401 is wired to the first ground pad 317, the first signal pad 4402 is wired to the first high-frequency signal pad 318a, the second signal pad 4403 is wired to the second high-frequency signal pad 318b, and the second ground pad 4404 is wired to the second ground pad 319, thereby realizing the GSSG signal transmission mode and preventing signal crosstalk between different channels.

[0443] In some embodiments, the first signal pad 4402 and the first high-frequency signal pad 318a are electrically connected using a differential signal transmission method, and the second signal pad 4403 and the second high-frequency signal pad 318b are also electrically connected using a differential signal transmission method, so as to improve the optical modulation amplitude of the optical modulation chip 440, thereby improving the modulation rate and bandwidth of the optical modulation chip 440.

[0444] In some embodiments, a first bonding wire 461 is provided between the first ground pad 4401 and the first ground pad 317.

[0445] In some embodiments, a sixth bonding wire 466 is provided between the second ground pad 4404 and the second ground pad 319.

[0446] In some embodiments, a second bonding wire 462 and a third bonding wire 463 are provided between the first signal pad 4402 and the first high-frequency signal pad 318a. The second bonding wire 462 and the third bonding wire 463 are a pair of differential signal transmission lines to improve the optical modulation amplitude.

[0447] In some embodiments, a fourth bonding wire 464 and a fifth bonding wire 465 are provided between the second signal pad 4403 and the second high-frequency signal pad 318b. The fourth bonding wire 464 and the fifth bonding wire 465 are a pair of differential signal transmission lines to improve the optical modulation amplitude.

[0448] In some embodiments, the solder joints of the second bonding wire 462 and the third bonding wire 463 overlap on the surface of the first high-frequency signal pad 318a, and different solder joints are used on the surface of the first signal pad 4402, thereby reducing parasitic inductance, improving high-frequency performance and preventing crosstalk.

[0449] In some embodiments, the fourth bonding wire 464 and the fifth bonding wire 465 overlap on the surface of the second high-frequency signal pad 318b, and different bonding wires are used on the surface of the second signal pad 4403, thereby reducing parasitic inductance, improving high-frequency performance and preventing crosstalk.

[0450] In some embodiments, the second bonding wire 462 and the third bonding wire 463 are bonded together on the surface of the optical modulation chip 440 and bonded separately on the surface of the first circuit board 310, thereby effectively reducing parasitic inductance and improving high-frequency performance.

[0451] Figure 43 This is a schematic diagram of wire bonding between an optical modulation chip and a first circuit board according to some embodiments. Figure 1 , Figure 44 This is a schematic diagram of wire bonding between an optical modulation chip and a first circuit board according to some embodiments. Figure 2 , Figure 45 This is a schematic diagram of wire bonding between an optical modulation chip and a first circuit board according to some embodiments. Figure 3 .like Figures 43-45 As shown, in some embodiments, a second bonding wire 462 and a third bonding wire 463 are provided between the first signal pad 4402 and the first high-frequency signal pad 318a. The second bonding wire 462 and the third bonding wire 463 are a pair of differential signal transmission lines to improve the optical modulation amplitude.

[0452] In some embodiments, the second wire bonding 462 has a high curvature close to the surface of the first circuit board 310, and the curvature gradually decreases towards the surface of the light modulation chip 440. In some embodiments, the third wire bonding 463 has a high curvature close to the surface of the light modulation chip 440, and the curvature gradually decreases towards the surface of the first circuit board 310.

[0453] In some embodiments, the second bonding wire 462 and the third bonding wire 463 are bonded together on the surface of the optical modulation chip 440 and bonded separately on the surface of the first circuit board 310, thereby effectively reducing parasitic inductance and improving high-frequency performance.

[0454] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. An optical module, characterized in that, include: The first circuit board is configured to transmit high-frequency signals and non-high-frequency signals; The second circuit board is configured to transmit non-high frequency signals; the dielectric constant of the first circuit board is lower than that of the second circuit board; the second circuit board is electrically connected to the first circuit board. A fixing plate has the first circuit board on one end and the second circuit board on the other end to fix the first circuit board and the second circuit board together. A light-emitting component is disposed on the surface of the fixed plate, the light-emitting component comprising: A laser, configured to emit light without carrying a signal, is electrically connected to the second circuit board; An optical modulation chip, located in the optical path of the laser output, is configured to modulate the signal-free light to generate an optical signal; the surface of the optical modulation chip is electrically connected to the first circuit board and the second circuit board respectively; the optical modulation chip includes: The first input optical port is located at the light input end of the optical modulation chip; when the output optical power of the laser is not higher than a preset value, the first input optical port is optically connected to the laser. The second input optical port is located at the light input end of the optical modulation chip; when the output optical power of the laser is higher than a preset value, the second input optical port is optically connected to the laser. The third input optical port is located at the light input end of the optical modulation chip; when the output optical power of the laser is not higher than a preset value, the third input optical port is optically connected to the laser. The first optical splitter includes an input port, a first output port and a second output port, wherein the input port is optically connected to the second input port. The second beam splitter includes two optical inlets and two optical outlets, wherein one optical inlet is optically connected to the third optical inlet, and the other optical inlet is optically connected to the first optical outlet of the first beam splitter. The third beam splitter includes two optical inlets and two optical outlets, wherein one optical inlet is optically connected to the first optical inlet, and the other optical inlet is optically connected to the second optical outlet of the first beam splitter. The fiber optic array is configured to transmit the optical signal modulated by the optical modulation chip.

2. The optical module according to claim 1, characterized in that, The optical modulation chip includes a first MZ modulator, a second MZ modulator, a third MZ modulator, and a fourth MZ modulator, to modulate the signals of each beam splitter after being processed by the first beam splitter, the second beam splitter, and the third beam splitter, respectively. The incident light from the first MZ modulator is split into two paths by a first wavelength division multiplexer for modulation, and the two optical signals generated by modulation are output through a first interferometer. The incident light from the second MZ modulator is split into two paths by a second wavelength division multiplexer for modulation, and the two optical signals generated by modulation are output through a second interferometer. The incident light from the third MZ modulator is split into two paths by a third wavelength division multiplexer for modulation, and the two optical signals generated by modulation are output through a third interferometer. The incident light from the fourth MZ modulator is split into two paths by a fourth wavelength division multiplexer for modulation, and the two optical signals generated by modulation are output through a fourth interferometer.

3. The optical module according to claim 2, characterized in that, One input optical path of the first wavelength division multiplexer is coupled to the first grating coupler, and one output optical path of the first interferometer is coupled to the second grating coupler; one input optical path of the second wavelength division multiplexer is coupled to the third grating coupler, and one output optical path of the second interferometer is coupled to the fourth grating coupler; one input optical path of the third wavelength division multiplexer is coupled to the fifth grating coupler, and one output optical path of the third interferometer is coupled to the sixth grating coupler; one input optical path of the fourth wavelength division multiplexer is coupled to the seventh grating coupler, and one output optical path of the fourth interferometer is coupled to the eighth grating coupler.

4. The optical module according to claim 1, characterized in that, The optical modulation chip includes a first optical loop interface and a second optical loop interface, and an optical waveguide connects the first optical loop interface and the second optical loop interface.

5. The optical module according to claim 1, characterized in that, The second circuit board has a first clearance notch on its side surface to avoid the light emitting component; The optical module includes an optical receiving component, which includes: The optical receiving component includes: An optical receiver chip is located on the surface of the first circuit board; A refracting element has a reflective end face formed at one end; the refracting element includes a first optical fiber support portion, which extends from the surface of the second circuit board to the surface of the first circuit board, so as to place the reflective end face above the light receiving chip.

6. The optical module according to claim 5, characterized in that, The refracting element includes a first optical fiber support and a second optical fiber support; The second optical fiber support is disposed on the surface of the second circuit board, and a third pad area is formed on the end surface of the second circuit board for wire bonding connection with the surface of the first circuit board. The end of the second optical fiber support does not extend to the surface of the third pad area to avoid wire bonding between the second circuit board and the first circuit board; The first optical fiber support is located above the second optical fiber support.

7. The optical module according to claim 5, characterized in that, The optical module includes: Upper casing; The lower housing, together with the upper housing cover, forms an enclosing cavity to accommodate the first circuit board and the second circuit board; The lower housing has a protrusion on its surface, which protrudes toward the upper housing. The protrusion is located within the first clearance notch and on one side of the laser; The bottom surface of the fixing plate is thermally connected to the lower housing, and the top surface of the protrusion is thermally connected to the upper housing, so that the heat generated by the laser is conducted sequentially through the fixing plate and the lower housing to the upper housing.

8. The optical module according to claim 1, characterized in that, The second circuit board has a third clearance notch formed on its surface to avoid the light emitting component; a first support surface and a second support surface are formed on both sides of the third clearance notch; The optical module includes an optical receiving component, which includes: An optical receiver chip is located on the surface of the first circuit board; A refracting element has a reflective end face at one end; the refracting element extends from the surface of the second circuit board, across the bonding wire between the first circuit board and the second circuit board, and to the surface of the first circuit board, so that the reflective end face is located above the light receiving chip, thereby allowing the reflected light signal to be incident on the surface of the light receiving chip.

9. The optical module according to claim 1, characterized in that, A second clearance notch is formed at the other end of the first circuit board to avoid the light emitting component; The optical module includes an optical receiving component, which includes: A refractive element is located on the surface of the first circuit board and on one side of the second clearance notch. The refractive element includes an optical fiber, the end face of which is formed on a reflective end face. The optical fiber has a height difference with the surface of the first circuit board or the second circuit board, so that the bonding wire between the first circuit board and the second circuit board is located below the optical fiber. The light receiving chip is located on the surface of the first circuit board and on the reflected light path of the reflective end face.

10. The optical module according to claim 1, characterized in that, A fourth clearance notch is formed at one end of the first circuit board to avoid the light emitting component; a third support surface and a fourth support surface are formed on both sides of the fourth clearance notch respectively; The optical module includes an optical receiving component, which includes: A refractive element is located on the surface of the first circuit board and on one side of the fourth clearance notch. The refractive element includes an optical fiber, the end face of which is formed on a reflective end face. The optical fiber has a height difference with the surface of the first circuit board or the second circuit board, so that the bonding wire between the first circuit board and the second circuit board is located below the optical fiber. The light receiving chip is located on the surface of the first circuit board and on the reflected light path of the reflective end face.

11. An optical module, characterized in that, include: The light emitting component includes: A laser is configured to emit light that does not carry a signal. An optical modulation chip, located in the optical path of the laser output, is configured to modulate the signal-free light to generate an optical signal. The optical modulation chip includes: The first input optical port is located at the light input end of the optical modulation chip; when the output optical power of the laser is not higher than a preset value, the first input optical port is optically connected to the laser. The second input optical port is located at the light input end of the optical modulation chip; when the output optical power of the laser is higher than a preset value, the second input optical port is optically connected to the laser. The third input optical port is located at the light input end of the optical modulation chip; when the output optical power of the laser is not higher than a preset value, the third input optical port is optically connected to the laser. The first optical splitter includes an input port, a first output port and a second output port, wherein the input port is optically connected to the second input port. The second beam splitter includes two optical inlets and two optical outlets, wherein one optical inlet is optically connected to the third optical inlet, and the other optical inlet is optically connected to the first optical outlet of the first beam splitter. The third beam splitter includes two optical inlets and two optical outlets, wherein one optical inlet is optically connected to the first optical inlet, and the other optical inlet is optically connected to the second optical outlet of the first beam splitter. The fiber optic array is configured to transmit the optical signal modulated by the optical modulation chip.

12. The optical module according to claim 11, characterized in that, When the output optical power of the laser is higher than a preset value, the laser emits light toward the second input optical port, and the emitted light is split into a first beam and a second beam by the first beam splitter; If the first output port of the first beam splitter is optically connected to the first input port of the second beam splitter, then the first beam is split into a first beam and a second beam by the second beam splitter, and output along the two output ports of the second beam splitter respectively. If the second output port of the first beam splitter is optically connected to one input port of the third beam splitter, the second beam is split into a third beam and a fourth beam by the third beam splitter, and then output along the two output ports of the third beam splitter respectively.

13. The optical module according to claim 11, characterized in that, If the output optical power of the laser is not higher than the preset value, then two lasers are set respectively; Of the two lasers, one of the lasers outputs light toward the third input port, which is optically connected to one of the input ports of the second beam splitter. The light output by the laser is coupled into the second beam splitter along the third input port, and the second beam splitter splits the input light into a first beam splitter and a second beam splitter. Of the two lasers, the other laser outputs light toward the first input port. The first input port is optically connected to one of the input ports of the third beam splitter. The light output by the laser is coupled into the third beam splitter along the first input port. The third beam splitter splits the input light into a third beam splitter and a fourth beam splitter.

14. The optical module according to claim 11, characterized in that, The optical modulation chip includes a first MZ modulator, a second MZ modulator, a third MZ modulator, and a fourth MZ modulator, to modulate the signals of each beam splitter after being processed by the first beam splitter, the second beam splitter, and the third beam splitter, respectively. The incident light from the first MZ modulator is split into two paths by a first wavelength division multiplexer for modulation, and the two optical signals generated by modulation are output through a first interferometer. The incident light from the second MZ modulator is split into two paths by a second wavelength division multiplexer for modulation, and the two optical signals generated by modulation are output through a second interferometer. The incident light from the third MZ modulator is split into two paths by a third wavelength division multiplexer for modulation, and the two optical signals generated by modulation are output through a third interferometer. The incident light from the fourth MZ modulator is split into two paths by a fourth wavelength division multiplexer for modulation, and the two optical signals generated by modulation are output through a fourth interferometer.

15. The optical module according to claim 14, characterized in that, One input optical path of the first wavelength division multiplexer is coupled to the first grating coupler, and one output optical path of the first interferometer is coupled to the second grating coupler; one input optical path of the second wavelength division multiplexer is coupled to the third grating coupler, and one output optical path of the second interferometer is coupled to the fourth grating coupler; one input optical path of the third wavelength division multiplexer is coupled to the fifth grating coupler, and one output optical path of the third interferometer is coupled to the sixth grating coupler; one input optical path of the fourth wavelength division multiplexer is coupled to the seventh grating coupler, and one output optical path of the fourth interferometer is coupled to the eighth grating coupler.

16. The optical module according to claim 14, characterized in that, The optical modulation chip includes a first optical loop interface and a second optical loop interface, and an optical waveguide connects the first optical loop interface and the second optical loop interface.

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