Liquid crystal phase shifter, temperature control method of liquid crystal phase shifter, and antenna

Abstract

This disclosure provides a liquid crystal phase shifter, a temperature control method for the liquid crystal phase shifter, and an antenna. The liquid crystal phase shifter includes: a phase shifting structure comprising two substrates disposed opposite each other and liquid crystal filling the space between the two substrates; a temperature control structure located outside the phase shifting structure; and a conductive structure located inside the phase shifting structure and connected to the temperature control structure, the conductive structure being configured to transfer heat between the phase shifting structure and the temperature control structure; wherein the temperature control structure is configured to heat or cool the conductive structure and / or the medium in the conductive structure to regulate the temperature of the liquid crystal.

Description

Technical Field

[0001] This disclosure relates to the field of antenna technology, and in particular to a liquid crystal phase shifter, a temperature control method for the liquid crystal phase shifter, and an antenna. Background Technology

[0002] With the continuous development of communication technology, people have an increasing demand for high-capacity, high-speed communication. Liquid crystal phase shifters or liquid crystal antennas utilize liquid crystal materials to achieve phase shifting, thus making the phase of the liquid crystal antenna adjustable. However, when operating a liquid crystal phase shifter or liquid crystal antenna, the temperature of the liquid crystal must be considered, as the characteristics of liquid crystal are easily affected by temperature, and these characteristics in turn affect the performance of the antenna. Summary of the Invention

[0003] Based on the background technology, this disclosure proposes a liquid crystal phase shifter, a temperature control method for the liquid crystal phase shifter, and an antenna.

[0004] In a first aspect, this disclosure provides a liquid crystal phase shifter, comprising:

[0005] A phase-shifting structure, the phase-shifting structure comprising two substrates disposed opposite each other and liquid crystal filling the space between the two substrates;

[0006] A temperature control structure is located outside the phase-shifting structure; and,

[0007] A conductive structure is located inside the phase-shifting structure and connected to the temperature control structure, the conductive structure being configured to transfer heat between the phase-shifting structure and the temperature control structure;

[0008] The temperature control structure is configured to heat or cool the conductive structure and / or the medium in the conductive structure to regulate the temperature of the liquid crystal.

[0009] For example, the conductive structure includes at least one conductive path located on any of the substrates, the conductive path being around the substrate and / or located around the perimeter of the substrate;

[0010] The temperature control structure is connected to both ends of the conduction path and is configured to heat or cool the conduction path.

[0011] For example, the conductive path includes a cavity, and a medium different from the liquid crystal is conducted inside the cavity; the liquid crystal phase shifter also includes a dielectric conduit connected to the first end of the conductive path, and the dielectric conduit is located outside the phase shifting structure;

[0012] The temperature control structure includes:

[0013] A drive pump includes a first end and a second end, the first end being connected to the medium pipeline and the second end being connected to the tail end of the conduction passage, and is configured to drive the medium to circulate between the medium pipeline and the conduction passage;

[0014] The first heat exchange plate is in contact with the medium pipeline.

[0015] For example, the medium pipeline includes a periodically bent structure, and part or all of the bent structure is in contact with the first heat exchange plate;

[0016] The bending structure has multiple bends with rounded corners and / or bending angles greater than 90 degrees.

[0017] For example, the conduction path includes:

[0018] The first film layer is located on one side of the substrate;

[0019] The second film layer is disposed opposite to the first film layer;

[0020] A connecting layer that connects the first film layer and the second film layer;

[0021] The first film layer, the second film layer, and the connecting layer are sealed together to form the cavity.

[0022] For example, the conductive path is configured as a conductive patch located on any of the substrates, the conductive patch being configured to conduct heat in the phase-shifting structure;

[0023] Both ends of the conduction path are connected to a heat-conducting part, part or all of which is located outside the phase-shifting structure, and the heat-conducting part includes a second heat exchange plate;

[0024] The temperature control structure includes:

[0025] The heat exchange assembly, which is in contact with the second heat exchange plate of each heat-conducting part, is configured to exchange heat with the second heat exchange plate to dissipate the heat conducted by the conductive patch or to input heat to the conductive patch.

[0026] For example, the heat-conducting part includes a signal input interface, and the conductive patch has a thermal resistance effect;

[0027] The conductive patch generates heat when an electrical signal is connected to the signal input interface.

[0028] For example, the heat exchange assembly includes:

[0029] The first heat exchange component is in direct contact with the second heat exchange plate;

[0030] The second heat exchange component is located on the side of the first heat exchange component away from the heat-conducting part, and a portion of the second heat exchange component is in direct contact with the first heat exchange component.

[0031] For example, the second heat exchange component includes:

[0032] The heat sink is in direct contact with the first heat exchange component.

[0033] A heat dissipation module is located on the side of the heat dissipation plate away from the first heat exchange component and is connected to the heat dissipation plate;

[0034] A cooling fan is located on the side of the heat sink away from the first heat exchange component and is connected to the heat sink.

[0035] There is a gap between the heat dissipation module and the heat dissipation fan.

[0036] For example, the phase-shifting structure further includes:

[0037] The first electrode is located on one of the two substrates, on the side of the first substrate closer to the liquid crystal.

[0038] The second electrode is located on the side of the other of the two substrates closer to the liquid crystal, and the second electrode is grounded;

[0039] The second electrode serves as the conduction path.

[0040] For example, the phase-shifting structure includes a plurality of phase-shifting units, which are arranged in an array along the planar direction of the substrate;

[0041] The orthographic projection of the conductive path on the substrate does not overlap with the orthographic projection of the multiple phase-shifting units on the substrate.

[0042] For example, the orthographic projection of the conductive path on the substrate includes multiple bends, and the bend angle of the conductive path formed with a conductive material is smaller than the bend angle of the conductive path formed with a non-conductive material.

[0043] For example, the conduction structure includes an inlet pipe and an outlet pipe formed on the phase-shifting structure;

[0044] The temperature control structure includes:

[0045] A drive pump includes a receiving cavity connected to the inlet pipe and the outlet pipe respectively, and is configured to drive the liquid crystal to circulate between the inlet pipe, the receiving cavity and the outlet pipe;

[0046] A temperature control component, connected to the drive pump, is configured to heat or cool the liquid crystal located within the containment cavity.

[0047] A second aspect of this disclosure provides a temperature control method for a liquid crystal phase shifter, the method being applied to any of the liquid crystal phase shifters described in the first aspect, the method comprising:

[0048] In response to the phase-shifting structure being in a non-working state, the temperature control structure is controlled to heat or cool the flowing medium conducted by the conductive structure and / or the conductive structure itself.

[0049] In response to the phase-shifting structure being in operation, the temperature control structure is controlled to stop performing the heating or cooling action.

[0050] A third aspect of this disclosure provides an antenna comprising at least one liquid crystal phase shifter as described in any of the first aspects.

[0051] The liquid crystal phase shifter provided in this embodiment may include a phase shifting structure, a conductive structure, and a temperature control structure. The phase shifting structure includes two substrates disposed opposite to each other and liquid crystal filling the space between the two substrates. The conductive structure is located inside the phase shifting structure, and the temperature control structure is located outside the phase shifting structure. The conductive structure is configured to transfer heat between the phase shifting structure and the temperature control structure, and the temperature control structure is configured to heat or cool the conductive structure to regulate the temperature of the liquid crystal.

[0052] Because a conductive structure is incorporated within the phase-shifting structure, heat transfer can occur between the temperature control structure and the phase-shifting structure. For example, heat from within the phase-shifting structure can be transferred to the temperature control structure, which then cools the liquid crystal within the phase-shifting structure. Conversely, heat generated by the temperature control structure can be transferred to the phase-shifting structure, heating the liquid crystal within it. Thus, the conductive structure establishes a temperature regulation bridge between the phase-shifting structure and the temperature control structure, facilitating liquid crystal temperature regulation and providing a suitable temperature environment to ensure the liquid crystal's characteristics and, consequently, the phase-shifting performance of the liquid crystal phase shifter.

[0053] The above description is merely an overview of the technical solution disclosed herein. In order to better understand the technical means of this disclosure and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this disclosure more apparent and understandable, specific embodiments of this disclosure are described below. Attached Figure Description

[0054] To more clearly illustrate the technical solutions in the embodiments or related technologies of this disclosure, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. It should be noted that the scale in the drawings is for illustration only and does not represent the actual scale.

[0055] Figure 1 A schematic planar view of a liquid crystal phase shifter is shown;

[0056] Figure 2 A schematic diagram of the cross-sectional structure of a liquid crystal phase shifter is shown;

[0057] Figure 3 , Figure 7 , Figure 16 Three-dimensional structural schematic diagrams of three types of liquid crystal phase shifters are shown respectively;

[0058] Figure 4A and Figure 4B They are shown respectively Figure 3 Schematic cross-sectional views of the two phase-shifting structures shown;

[0059] Figure 5 It shows Figure 3 A magnified view of a portion of region C1;

[0060] Figure 6 It shows Figure 3 A magnified view of a portion of region C2;

[0061] Figure 8 It shows Figure 7 The diagram shows a front view of the liquid crystal phase-shifting structure.

[0062] Figure 9 A front view of yet another liquid crystal phase shifter is shown;

[0063] Figure 10 and Figure 11 The three-dimensional structural schematic diagrams of partial regions of the liquid crystal phase shifter are shown respectively;

[0064] Figures 12-14 A schematic diagram of the arrangement of conduction pathways within the phase-shifting structure is shown;

[0065] Figure 15 A schematic diagram of yet another liquid crystal phase shifter is shown;

[0066] Figure 17 and Figure 18 They are shown respectively Figure 16 A schematic diagram of a partial area of ​​the liquid crystal phase shifter shown;

[0067] Figure 19 A cross-sectional schematic diagram of the drive pump is shown;

[0068] Figure 20 A flowchart illustrating the steps of a temperature control method for a liquid crystal phase shifter is shown.

[0069] Figure 21 A schematic diagram of the cross-sectional structure of the antenna is shown. Detailed Implementation

[0070] To make the above-mentioned objectives, features, and advantages of this disclosure more apparent and understandable, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0071] In this specification, "electrical connection" and "coupling" include situations where components are connected together by elements that have some electrical function. There are no particular limitations on what constitutes an "electrical function," as long as it allows for the transmission and reception of electrical signals between the connected components. Examples of "electrical functions" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other components with various functions.

[0072] In this specification, "parallel" refers to the state where the angle formed by two straight lines is greater than or equal to -10° and less than 10°, and therefore also includes the state where the angle is greater than or equal to -5° and less than 5°. Similarly, "perpendicular" refers to the state where the angle formed by two straight lines is greater than or equal to 80° and less than 100°, and therefore also includes the state where the angle is greater than or equal to 85° and less than 95°.

[0073] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and encompassing, that is, "including, but not limited to".

[0074] In this application, "same layer" refers to the relationship between multiple film layers formed from the same material after undergoing the same step (e.g., a patterning process). "Same layer" here does not always mean that multiple film layers have the same thickness or the same height in a cross-sectional view. The polygons used in this specification are not strictly defined; they can be approximate triangles, parallelograms, trapezoids, pentagons, or hexagons, and may have minor deformations due to tolerances.

[0075] In related technologies, during the operation of a liquid crystal phase shifter, the temperature of the liquid crystal that meets the phase shifting function is generally between 20 and 40°C. The actual operating conditions of the product require a temperature between -40°C and 55°C. However, when the phase shifter is in operation, the temperature of the liquid crystal inside the liquid crystal phase shifter can reach as high as 70°C or even higher. This will affect the characteristics of the liquid crystal and thus affect the performance of the antenna using the liquid crystal phase shifter.

[0076] Therefore, it is necessary to ensure that the liquid crystal is within a suitable temperature range, such as 20 to 40°C.

[0077] In view of this, embodiments of the present disclosure provide a liquid crystal phase shifter, a temperature control method for the liquid crystal phase shifter, and an antenna. The liquid crystal phase shifter integrates a temperature control device, which can be used to regulate the temperature of the liquid crystal inside the liquid crystal phase shifter to ensure that the liquid crystal operates within a suitable temperature range. The temperature control device may include a portion located inside the phase shifter (hereinafter referred to as a conductive structure) and a portion located outside the phase shifter (hereinafter referred to as a temperature control structure). The temperature control structure can cool or heat the conductive structure, and the conductive structure can transfer heat between the phase shifter and the temperature control structure. This allows the conductive structure to carry heat from inside the phase shifter out through the temperature control structure to the external environment, or the conductive structure to carry heat from the temperature control structure into the phase shifter, thereby heating the liquid crystal.

[0078] The liquid crystal phase shifter, the temperature control method of the liquid crystal phase shifter, and the antenna provided in the embodiments of this disclosure will be described exemplarily below with reference to the accompanying drawings.

[0079] In some embodiments, a liquid crystal phase shifter is provided; please refer to... Figure 1 and Figure 2 As shown, Figure 1 A schematic diagram of a liquid crystal phase shifter is shown. Figure 2 A schematic diagram of the cross-sectional structure of a liquid crystal phase shifter is shown, such as... Figure 1 and Figure 2 As shown, the liquid crystal phase shifter may include a phase shifting structure 10, a conductive structure 30 located inside the phase shifting structure 10, and a temperature control structure 20 located outside the phase shifting structure 10, wherein:

[0080] The phase-shifting structure 10 includes two substrates disposed opposite to each other and liquid crystal 15 filled between the two substrates;

[0081] The temperature control structure 20 is connected to the conduction structure 30, wherein the conduction structure 30 is configured to transfer heat between the phase shifting structure 10 and the temperature control structure 20, and the temperature control structure 20 is configured to heat or cool the conduction structure 30 to regulate the temperature of the liquid crystal 15.

[0082] In this embodiment, the liquid crystal phase shifter may include three parts: a phase shifting structure 10, a conduction structure 30, and a temperature control structure 20. When the phase shifting structure 10 is working, it can adjust the phase of the output signal. The output signal may be an electromagnetic wave signal, such as a high-frequency signal (a signal with a frequency between 3 and 30 MHz) or a low-frequency signal (a radio electromagnetic wave with a frequency between 30 kHz and 300 kHz).

[0083] like Figure 1 As shown, the phase-shifting structure 10 may include multiple phase-shifting units 110, which may be spaced apart from each other. The distance between two adjacent phase-shifting units 110 may be less than or equal to one operating wavelength. The operating wavelength refers to the wavelength at the center frequency of the liquid crystal phase shifter's operating frequency, such as the wavelength at the center frequency of the output signal. The multiple phase-shifting units 110 may be arranged in an array, for example, in a rectangular array of rows and columns, or in a circular array; no limitation is imposed here.

[0084] like Figure 2 As shown, the phase-shifting structure 10 may include two opposing substrates, which may be a first substrate 11 and a second substrate 18, respectively. Both the first substrate 11 and the second substrate 18 may be glass substrates, and liquid crystal 15 is filled between the first substrate 11 and the second substrate 18. A conductive pattern layer is provided on the side of the first substrate 11 closest to the liquid crystal 15. The conductive pattern layer includes a first electrode 12 and a transmission line connected to the first electrode 12. The transmission line may be a microstrip line or a conductive line formed on the first substrate 11, such as a copper conductive line or an indium tin oxide conductive line. The materials of the first electrode 12 and the transmission line may be different. Generally, the first electrode 12 may be formed of a metal material, and the thickness of the first electrode 12 may be greater than the thickness of the transmission line.

[0085] A second electrode 17 is disposed on the side of the second substrate 18 near the liquid crystal 15. The second electrode 17 may be formed of the same material as the first electrode 12, or each may be formed of a different material.

[0086] In some examples, when the liquid crystal phase shifter is applied to a transmissive antenna, the second electrode 17 can form an electrode pattern, and gaps are left between the second electrodes 17 for electromagnetic wave signals to enter and exit; in other examples, when the liquid crystal phase shifter is applied to a reflective antenna, the second electrode 17 can cover the entire second substrate 18, and the first electrode 12 can be located on the signal side, which is the side of the phase shifting structure 10 that emits electromagnetic wave signals.

[0087] The second electrode 17 can be grounded.

[0088] In some embodiments, the orthographic projections of the first electrode 12 on the second substrate 18 and the second electrode 17 on the second substrate 18 overlap, for example, when there is a gap between the second electrodes 17 for electromagnetic wave signals to enter and exit. Figure 2 As shown, the orthographic projection of the first electrode 12 on the second substrate 18 can intersect with the second electrode 17, and the intersection area is the overlapping area; wherein, the transmission line can transmit an electrical signal to the first electrode 12, and the transmitted electrical signal can form an electric field in the overlapping area of ​​the first electrode 12 and the second electrode 17, thereby driving the liquid crystal 15 to deflect, thereby changing the phase of the output signal.

[0089] Of course, when the second electrode 17 covers the entire surface of the second substrate 18, the second electrode 17 can cover the orthogonal projection of the first electrode 12 on the second substrate 18.

[0090] like Figure 2 As shown, in a further embodiment, the phase-shifting structure 10 may also include an alignment layer. Specifically, a first alignment layer 13 is provided on the side of the conductive pattern layer away from the first substrate 11, and a second alignment layer 16 is provided on the side of the second electrode 17 away from the second substrate 18. The first alignment layer 13 and the second alignment layer 16 are used to align the liquid crystal 15 so that the liquid crystal 15 has an initial alignment direction. In this way, when the liquid crystal 15 is deflected by the electric field, the liquid crystal 15 can start to deflect from the initial alignment direction.

[0091] For example, such as Figure 2 As shown, the phase-shifting structure 10 may also include a frame that can connect the first substrate 11 and the second substrate 18 along the edges of the first substrate 11 and the second substrate 18, thereby forming a cavity filled with liquid crystal 15 between the first substrate 11 and the second substrate 18, and at the same time supporting the first substrate 11 and the second substrate 18.

[0092] like Figure 2 As shown, the liquid crystal phase shifter also integrates a conductive structure 30 and a temperature control structure 20. The conductive structure 30 can be located inside the phase shift structure 10, for example, in the region between the first substrate 11 and the second substrate 18. The conductive structure 30 can transfer heat between the inside and outside of the phase shift structure 10. This heat transfer includes both the heat generated during heating and the cold energy generated during cooling. In other words, the conductive structure 30 can conduct the heat generated by heating the liquid crystal 15 into the phase shift structure 10, and can also carry the heat generated by the liquid crystal 15 to the outside of the phase shift structure 10, thus bringing the external cooling energy into the inside of the phase shift structure 10.

[0093] In some examples, the conductive structure 30 can conduct a solid medium, such as a refrigerant, or other solid media, such as directly conducting the liquid crystal 15. In this way, the solid medium can flow inside and outside the phase-shifting structure 10 through the conductive structure 30, thereby using the solid medium to heat or cool the liquid crystal 15 inside the phase-shifting structure 10.

[0094] In some other examples, the conductive structure 30 itself can serve as a heat transfer medium. For example, the material of the conductive structure 30 can be a heat-sensitive material, such as metal, metal oxide, ceramic, etc., which is sensitive to heat, so that heat can be transferred between the inside and outside of the phase-shifting structure 10 through the conductive structure 30.

[0095] In some examples, the conductive structure 30 may occupy only a portion of the area inside the phase-shifting structure 10, which may be one side edge area of ​​the phase-shifting structure 10. For example, the conductive structure 30 may enclose or partially enclose the edge area of ​​the phase-shifting structure 10. For instance, the conductive structure 30 may be provided in the peripheral area of ​​the phase-shifting structure 10, thereby allowing heat transfer at various locations inside the phase-shifting structure 10.

[0096] In some examples, the conductive structure 30 can be located in various regions inside the phase-shifting structure 10. That is, the conductive structure 30 can be set in various regions inside the phase-shifting structure 10, so that the heat transfer can be balanced inside the phase-shifting structure 10, and the temperature of the liquid crystal 15 at various locations inside the phase-shifting structure 10 is balanced.

[0097] like Figure 2 As shown, the conductive structure 30 can be connected to the temperature control structure 20. The temperature control structure 20 can directly heat or cool the conductive structure 30, or heat or cool the conductive medium in the conductive structure 30, or both heat or cool the conductive medium in the conductive structure 30 and the conductive structure 30 itself.

[0098] Heating or cooling the conductive structure 30 can mean that the temperature control structure 20 directly heats the conductive structure 30 or dissipates the heat carried by the conductive structure 30. This example can be applied to the case where the conductive structure 30 itself is the heat transfer medium, or to the case where there is a flowing medium inside the conductive structure 30.

[0099] Heating or cooling the medium within the conductive structure 30 can mean that the medium in the conductive structure 30 can flow into the temperature control structure 20, whereby the temperature control structure 20 heats or cools the medium in the conductive structure 30. The heated or cooled medium is then transferred back to the phase-shifting structure 10 by the conductive structure 30, thereby heating or cooling the liquid crystal 15 inside the phase-shifting structure 10. This example can be applied to cases where there is a flowing medium within the conductive structure 30.

[0100] The flowing medium can be a refrigerant, or, in some examples, a liquid crystal 15.

[0101] Since the conductive structure 30 can transfer heat between the inside and outside of the phase-shifting structure 10, the heat generated when the temperature control structure 20 or the medium located in the conductive structure 30 is heated can be transferred to the inside of the phase-shifting structure 10 via the conductive structure 30, thereby heating the liquid crystal 15. When the temperature control structure 20 cools the conductive structure 30 or the medium located in the conductive structure 30, the heat carried out from the inside of the phase-shifting structure 10 by the conductive structure 30 can be dissipated during the cooling process. Furthermore, as the cooling continues, the cooling energy can be carried back to the inside of the phase-shifting structure 10 via the conductive structure 30, thereby achieving the purpose of cooling the liquid crystal 15 inside the phase-shifting structure 10.

[0102] The temperature control structure 20 may have a heating function, a cooling function, or both heating and cooling functions.

[0103] In some embodiments, the conductive structure 30 can transfer heat between the interior and exterior of the phase-shifting structure 10, including carrying heat from the interior of the phase-shifting structure 10 to the exterior, and the temperature control structure 20 cooling the conductive structure 30 or the medium within the conductive structure 30. Additionally, heat generated by the temperature control structure 20 can be carried into the phase-shifting structure 10; this heat can be used to heat the conductive structure 30 or the medium within the conductive structure 30.

[0104] Please combine Figures 3-10 In this embodiment, the conductive structure 30 may include a conductive path 34 located on any substrate, which may run around the substrate and / or be located around the perimeter of the substrate. The temperature control structure 20 is connected to both ends of the conductive path 34 and is configured to heat or cool the conductive path 34.

[0105] like Figure 3 , Figure 4A and Figure 4B As shown, Figure 3 A three-dimensional structural schematic diagram of a liquid crystal phase shifter is shown. Figure 4A and Figure 4B They are shown respectively Figure 3 The cross-sectional schematic diagrams of the two phase-shifting structures 10 shown are as follows: Figure 3 , Figure 4A and Figure 4B As shown, the conductive structure 30 can be located on any substrate. The conductive structure 30 includes a conductive path 34, which can be arranged around the substrate. For example, it can be arranged in the form of a paperclip, a square wave, or other arrangements.

[0106] Reference Figures 12-14 As shown, Figures 12-14 A schematic diagram of the arrangement of conductive pathways 34 within the phase-shifting structure 10 is shown. This arrangement of conductive pathways 34 within the phase-shifting structure 10 can be referred to as the orientation of conductive pathways 34 on the substrate. For example... Figure 4A As shown, the conductive path 34 can be routed in a regular pattern on the substrate. For example, the conductive path 34 can be routed in a zigzag pattern on the substrate. Overall, the conductive path 34 is arranged in a square wave shape.

[0107] like Figures 12-14 As shown, the conduction path 34 can be irregularly routed in the phase-shifting structure 10, for example, as... Figure 12 As shown, the conduction path 34 bypasses the phase shifting unit 110 on the substrate, and at least one side of each phase shifting unit 110 has a conduction path 34, so that the conduction path 34 can transfer heat between each phase shifting unit 110 and the temperature control structure 20. Figure 12 Some phase-shifting units 110 have a conduction path 34 on only one side, while some phase-shifting units 110 have conduction paths 34 on both sides. The conduction paths 34 have multiple right-angle bends on the substrate. The number of phase-shifting units 110 with a conduction path 34 on one side is less than the number of phase-shifting units 110 with conduction paths 34 on both sides.

[0108] like Figure 13 As shown, at least two of the phase-shifting units 110 have conductive paths 34. For example, most phase-shifting units 110 have conductive paths 34 on both sides, while a small number of phase-shifting units 110 have conductive paths 34 on all three sides. The conductive paths 34 have multiple right-angle bends on the substrate. That is, the number of phase-shifting units 110 with conductive paths 34 on both sides is greater than the number of phase-shifting units 110 with conductive paths 34 on all three sides.

[0109] like Figure 14As shown, each phase shifting unit 110 has a conduction path 34 on at least two sides, and most of the phase shifting units 110 have a conduction path 34 on three sides. Only a small number of phase shifting units 110 have a conduction path 34 on two sides. That is, the number of phase shifting units 110 with a conduction path 34 on two sides is less than the number of phase shifting units 110 with a conduction path 34 on three sides. The conduction path 34 has multiple right-angle bends.

[0110] In some examples, the conduction path 34 may also be a non-right-angle bend; for example, it may be an obtuse-angle bend so as not to affect the operation of the phase shifting unit 110.

[0111] The conductive path 34 can be one or multiple. When multiple conductive paths 34 are included, the multiple conductive paths 34 can be located on the same substrate, or the multiple conductive paths 34 can be distributed on two substrates. When the multiple conductive paths 34 are located on the same substrate, the orthographic projections of the multiple conductive paths 34 on the substrate can be non-overlapping. When the multiple conductive paths 34 are distributed on two substrates, the orthographic projections of the multiple conductive paths 34 on the same substrate also do not overlap, or there is partial overlap.

[0112] For example, two conductive paths 34 may be included. The two conductive paths 34 may be located on the first substrate 11 and the second substrate 18 respectively. The orthographic projections of the two conductive paths 34 on the first substrate 11 do not overlap. Thus, when the conductive paths 34 are formed of conductive material, it is possible to avoid the formation of overlapping capacitance between the two conductive paths 34 on the upper and lower substrates (first substrate 11 and second substrate 18), which would affect the performance of the phase-shifting structure 10.

[0113] Combination Figure 15 As shown, a planar schematic diagram of another liquid crystal phase shifter is illustrated. Exemplarily, the phase shifting structure 10 may include multiple phase shifting units 110, which are arranged in an array. In some examples, multiple conductive paths 34 may be included. The multiple conductive paths 34 may be located on the same substrate or distributed on different substrates. The orthographic projections of the multiple conductive paths 34 on the same substrate are spaced apart from each other. Different conductive paths 34 can respectively transfer heat to the phase shifting units 110 in different regions of the phase shifting structure 10.

[0114] like Figure 15As shown, the phase-shifting structure 10 is divided into four regions, and a conduction path 34 can be set in each region. The conduction path 34 is responsible for heat transfer to the liquid crystal 15 in that region, such as heating or cooling. Multiple conduction paths 34 can be driven by independent temperature control structures 20, so that the liquid crystal temperature in each region can be controlled independently. In another example, multiple conduction paths 34 can be driven by the same temperature control structure 20, so that the liquid crystal temperature in each region can be uniformly regulated.

[0115] Of course, whether the liquid crystal temperature in each region is controlled independently or uniformly, the purpose of liquid crystal temperature control can be achieved. However, when controlled independently, since each conduction path 34 corresponds to a separate temperature control structure 20, its temperature control sensitivity is higher and its temperature response is faster, which helps to improve the phase-shifting performance of the phase-shifting structure 10.

[0116] In this embodiment, when multiple conductive paths 34 are included, the shapes of the orthographic projections of the multiple conductive paths 34 on the substrate may be consistent or not completely consistent. For example, as shown in the figure... Figure 14 As shown, the conductive path 34 in region F1 has the same shape as the conductive path 34 in region F2, but they are symmetrically distributed on the substrate; the conductive path 34 in region F1 has the same shape as the conductive path 34 in region F4, and the conductive path 34 in region F3 has a different shape than the conductive path 34 in the other three regions.

[0117] In this embodiment, each conduction path 34 may include two ends, such as a first end and a second end. The first end may be called the head end 341 of the conduction path 34, and the second end may be called the tail end 342 of the conduction path 34; or, the first end may be called the tail end 342 of the conduction path 34, and the second end may be called the head end 341 of the conduction path 34.

[0118] The first end and the second end can be located on the same side of the phase-shifting structure 10. Taking the area occupied by the plane of the phase-shifting structure 10 as the area where the substrate is located as an example, the first end and the second end can be located on the same side of the substrate. For example, as shown in the figure... Figure 14 As shown, in the multiple conductive paths 34, both ends of each conductive path 34 are located on the same side of the substrate, which facilitates the connection of both ends to the temperature control structure 20. Secondly, Figure 3 , Figure 4A , Figure 8 and Figure 9 Both cases show the case where the two ends of the conductive path 34 are located on the same side of the substrate.

[0119] Furthermore, by way of example, the first end and the second end of the conductive path 34 can be located on different sides of the substrate, for example, such as Figure 12 As shown, the first and second ends of the conductive path 34 can be located on opposite sides of the substrate, or, as... Figure 13 As shown, the first and second ends of the conductive path 34 can be located on adjacent sides of the substrate.

[0120] In cases where the first and second ends of the conductive path 34 are located on different sides of the substrate, the temperature control structure 20 can be located in the middle of the two ends, for example, as shown in the image. Figure 1 As shown, the temperature control structure 20 can be disposed on the back side of the phase shifting structure 10. In this case, the phase shifting structure 10 can be a reflective phase shifter, and the output signal can be emitted from one side of the first substrate 11. Then the temperature control structure 20 can be located on the side of the second substrate 18 away from the first substrate 11. In this way, the temperature control structure 20 can be connected to the first end and the second end at the same time.

[0121] like Figure 3 As shown, the temperature control structure 20 may include a first temperature control unit connected to the first end and a second temperature control unit connected to the second end. The first temperature control unit and the second temperature control unit may both perform the same operation on the first end and the second end, for example, both heat the first end and the second end, or both cool the first end and the second end.

[0122] In this case, the conduction path 34 can be located on the same side of the substrate or on different sides of the substrate, which facilitates its connection with the temperature control structure 20.

[0123] In this embodiment, the temperature control structure 20 can directly heat or cool the conduction path 34. Specifically, in this embodiment, the conduction path 34 may or may not contain a medium, and the conduction path 34 itself has the function of heat transfer.

[0124] For example, such as Figure 4A and Figure 4B As shown, the conduction path 34 can be formed of a conductive material, thus the conduction path 34 has thermal conductivity, which can carry the heat inside the phase shift structure 10 to the outside of the phase shift structure 10, and the temperature control structure 20 performs cooling treatment on the first end and the second end of the conduction path 34, so that the heat carried out by the conduction path 34 is quickly dissipated, thereby achieving the cooling of the internal environment of the phase shift structure 10.

[0125] For example, such as Figures 7-9As shown, the conduction path 34 can form a flow channel for the medium to flow through. The temperature control structure 20 can heat or cool the medium flowing in the flow channel at the first and second ends, thereby regulating the internal temperature of the phase-shifting structure 10 through the medium flowing in the flow channel. For example, the temperature control structure 20 can heat the medium flowing in the flow channel at the first and second ends, so that the flowing medium carries the heat from the first and second ends into the interior of the phase-shifting structure 10, thereby heating the internal liquid crystal 15. Alternatively, the temperature control structure 20 can cool the medium flowing in the flow channel at the first and second ends, so that the flowing medium carries the heat from the interior of the phase-shifting structure 10 into the first and second ends and is cooled, thereby cooling the internal liquid crystal 15.

[0126] The flowing medium may be different from the liquid crystal 15, meaning that the liquid crystal 15 does not flow in the conduction path 34, so as to avoid affecting the performance of the phase shifting structure 10.

[0127] In some embodiments, the phase-shifting structure 10 includes a plurality of phase-shifting units 110, which are arranged in an array in the planar direction of the substrate; wherein the orthographic projection of the conduction path 34 on the substrate does not overlap with the orthographic projection of the plurality of phase-shifting units 110 on the substrate.

[0128] In this embodiment, the phase-shifting structure 10 can be used in a reflective liquid crystal 15 antenna, so that one side of the substrate of the phase-shifting structure 10 emits electromagnetic wave signals. Alternatively, it can be used in a transmissive liquid crystal 15 antenna. In order not to affect the phase-shifting performance of the phase-shifting structure 10, the traces of the conduction path 34 on the substrate can bypass the phase-shifting unit 110. In this way, the orthographic projection of the conduction path 34 on the substrate does not overlap with the orthographic projections of the multiple phase-shifting units 110 on the substrate.

[0129] For example, one can continue to refer to Figures 12-15 As shown, the orthogonal projection of the conduction path 34 on the substrate can be located between the orthogonal projections of the phase shifting unit 110 on the substrate. Generally speaking, the area where the first electrode 12 is located can be understood as the area where a phase shifting unit 110 is located. Therefore, the orthogonal projection of the conduction path 34 on the substrate can be non-overlapping with the orthogonal projections of the multiple first electrodes 12 on the substrate and located between the orthogonal projections of the multiple first electrodes 12 on the substrate.

[0130] For example, if the conductive path 34 is located on one side of the second substrate 18, then the orthographic projection of the conductive path 34 on the first substrate 11 lies between the plurality of first electrodes 12. In this way, the conductive path 34 can be an irregular trace or a regular trace on the second substrate 18.

[0131] In some embodiments, such as Figures 3-6 As shown, where, Figure 5It shows Figure 3 A magnified view of a portion of region C1. Figure 6 It shows Figure 3 A magnified view of a portion of region C2, as shown below. Figures 3-6 As shown, the conductive path 34 can be configured as a conductive patch located on any substrate, and the conductive patch is configured to conduct heat in the phase-shifting structure 10;

[0132] Both ends of the conduction path 34 are connected to a heat-conducting part, part or all of which is located outside the phase-shifting structure 10, and the heat-conducting part includes a second heat exchange plate 32.

[0133] The temperature control structure 20 includes:

[0134] The heat exchange assembly, which is in contact with the second heat exchange plate 32, is configured to exchange heat with the heat-conducting part to dissipate heat conducted by the conductive patch or to input heat to the conductive patch.

[0135] In this embodiment, the conductive path 34 can be formed of a conductive material, which can be regarded as a conductive patch or conductive line on the substrate. Since the conductive patch is made of a conductive material, it has good thermal conductivity.

[0136] Among them, conductive materials can be formed from metals, such as copper, aluminum, silver and other metals with good thermal conductivity.

[0137] In some embodiments, such as Figure 3 , Figure 4A and Figure 4B As shown, a heat-conducting part is connected to both ends of the conduction path 34. Part of this heat-conducting part can be located inside the phase-shifting structure 10, and part can be located outside the phase-shifting structure 10. For example, as shown... Figure 4A and Figure 4B The diagram shows the case where all the heat-conducting parts are located outside the phase-shifting structure 10.

[0138] The heat-conducting part can also be made of metal. In one example, the material used for the heat-conducting part can be the same as that used for the conductive patch, such as copper, aluminum, or silver, which are good thermal conductors. In another example, the material used for the heat-conducting part can be different from that used for the conductive patch. The heat-conducting part can be formed using a thermally conductive and thermally resistive material, such as platinum, nickel, or molybdenum. In this way, the heat-conducting part can generate heat when an external electrical signal is applied, thereby heating the connected conductive patch (conduction path 34).

[0139] The conductive patch can also be formed using a thermal resistance material with a thermal resistance effect.

[0140] Among them, such as Figure 4AAs shown, the heat-conducting part may include a second heat exchange plate 32 and a signal input interface 33 that is cross-connected to the second heat exchange plate 32. The signal input interface 33 can be connected to an electrical signal. For example, the signal input interface 33 of the heat-conducting part located at the first end can be connected to the positive electrode, and the signal input interface 33 of the heat-conducting part located at the second end can be connected to the negative electrode. In this way, heat can be generated by utilizing the thermal resistance effect of the heat-conducting part to heat the liquid crystal 15 inside the phase-shifting structure 10.

[0141] Among them, such as Figure 4A As shown, the signal input interface 33 and the second heat exchange plate 32 can be cross-connected or orthogonally connected. For example, the signal input interface 33 can be strip-shaped, parallel to the substrate, and the second heat exchange plate 32 can be parallel to the cross-sectional direction of the phase shifting structure 10.

[0142] Among them, such as Figure 4A As shown, a connecting piece is also connected between the signal input interface 33 and the second heat exchange plate 32. The connecting piece connects to the signal input interface 33 on one hand and to the second heat exchange plate 32 on the other. More specifically, the size of the connecting piece in the first direction x is the same as the size of the second heat exchange plate 32 in the first direction x, and the size of the connecting piece in the second direction y is smaller than the size of the signal input interface 33 in the second direction y, and smaller than the size of the second heat exchange plate 32 in the third direction z.

[0143] Wherein, the first direction x and the second direction y are the planar directions of the substrate, and the third direction z is the cross-sectional direction of the phase-shifting structure 10, which is the thickness direction of the substrate.

[0144] The heat-conducting part can be integrally molded, or the signal input interface 33, the second heat exchange plate 32, and the connecting piece in the heat-conducting part can be welded together. It should be noted that the materials of the signal input interface 33, the second heat exchange plate 32, and the connecting piece in the heat-conducting part can be the same.

[0145] In this embodiment, the temperature control structure 20 may include a temperature control component that contacts the second heat exchange plate 32 of each heat-conducting part, such as a temperature control component that contacts the second heat exchange plate 32 of the heat-conducting part connected to the first end, and a temperature control component that contacts the second heat exchange plate 32 of the heat-conducting part connected to the second end.

[0146] like Figure 3As shown, the temperature control component can be attached to the second heat exchange plate 32. Specifically, for example, it can be attached to the side of the second heat exchange plate 32 closest to the phase-shifting structure 10, or to the side of the second heat exchange plate 32 furthest from the phase-shifting structure 10. "Closest to the phase-shifting structure 10" can mean located on one side of the phase-shifting structure 10, or located within the orthographic projection of the phase-shifting structure 10. "Principal phase-shifting structure 10" can mean that the orthographic projection of the temperature control component on the plane of the substrate is located outside the phase-shifting structure 10.

[0147] Among them, such as Figure 3 As shown, when the first end and the second end are located on the same side of the phase-shifting structure 10, the temperature control component on the first end can be attached to the side of the second heat exchange plate 32 away from the second end, and the temperature control component on the second end can be attached to the side of the second heat exchange plate 32 away from the first end.

[0148] Of course, in some other examples, when the first end and the second end are located on the same side of the phase-shifting structure 10, the temperature control component on the first end can be attached to the side of the second heat exchange plate 32 near the second end, and the temperature control component on the second end can be attached to the side of the second heat exchange plate 32 away from the first end; or, the temperature control component on the first end can be attached to the side of the second heat exchange plate 32 near the second end, and the temperature control component on the second end can be attached to the side of the second heat exchange plate 32 near the first end; or, the temperature control component on the first end can be attached to the side of the second heat exchange plate 32 away from the second end, and the temperature control component on the second end can be attached to the side of the second heat exchange plate 32 near the first end.

[0149] The contact area between the temperature control component and the second heat exchange plate 32 can be less than or equal to the planar area of ​​the second heat exchange plate 32, such as... Figure 5 As shown, the orthographic projection of the temperature control component on the plane where the second heat exchange plate 32 is located can cover the second heat exchange plate 32. At this time, the temperature control component and the second heat exchange plate 32 have the largest contact area, thereby improving the heat exchange performance.

[0150] Alternatively, the orthographic projection of the temperature control component on the plane where the second heat exchange plate 32 is located can overlap with the second heat exchange plate 32. In this case, the contact area between the temperature control component and the second heat exchange plate 32 can be smaller than the planar area of ​​the second heat exchange plate 32.

[0151] Where the contact area between the temperature control component and the second heat exchange plate 32 is smaller than the planar area of ​​the second heat exchange plate 32, the difference between the contact area and the planar area of ​​the second heat exchange plate 32 can be less than 1 / 20 to 1 / 10 of the planar area of ​​the second heat exchange plate 32, thereby maximizing the guarantee of sufficient heat exchange area.

[0152] In this embodiment, the temperature control component is in contact with the second heat exchange plate 32 and can exchange heat with the second heat exchange plate 32. This heat exchange can mean that the temperature control component transfers its own heat to the second heat exchange plate 32 to heat the liquid crystal 15; or, the temperature control component can remove the heat from the second heat exchange plate 32 to cool the liquid crystal 15.

[0153] In the case where the temperature control component transfers its own heat to the second heat exchange plate 32, the temperature control component may include a conductive line connected to the signal input interface 33. In this way, by applying voltage to the conductive line, the heat-conducting part generates heat based on the thermal resistance effect under the action of voltage, and the heat is transferred to the interior of the phase shift structure 10 through the conductive patch to heat the liquid crystal 15.

[0154] In the case where the temperature control component removes heat from the second heat exchange plate 32, the temperature control component may include a cooling fan 23 and / or a cooling chip. The cooling fan 23 can dissipate heat into the air to achieve rapid cooling, and the cooling chip can perform contact cooling with the second heat exchange plate 32, thereby dissipating the heat carried out from the phase shifting structure 10 by the conductive patch to cool the liquid crystal 15.

[0155] In this embodiment, the signal input interface 33 can receive input external electrical signals. In one example, the temperature control component can be separated from the external device connected to the signal input interface 33. In this way, an external electrical signal can be applied to the signal input interface 33 alone, thereby activating the heat generation function of the heat-conducting part. When the external electrical signal disappears, the heat generation function of the heat-conducting part disappears.

[0156] In this embodiment, the conductive patch generates heat when an electrical signal is connected to the signal input interface 33.

[0157] The conductive patch can also have a thermal resistance effect, such as being formed using a thermal resistance material. In this way, when an electrical signal is connected to the signal input interface 33, the conductive patch can generate heat, thereby directly heating the liquid crystal 15 in the phase shift structure 10. This example can be applied to scenarios where liquid crystal phase shifters are used in cold regions, such as using liquid crystal phase shifters in polar regions, to avoid the problem of the liquid crystal 15 not working properly due to extreme low temperatures caused by the extreme cold of the polar regions.

[0158] In some embodiments, the heat exchange assembly can be used to dissipate heat from the second heat exchange plate 32, such as... Figures 3-6 As shown, the heat exchange assembly may include a first heat exchange assembly and a second heat exchange assembly. The first heat exchange assembly is in direct contact with the second heat exchange plate 32. The second heat exchange assembly is located on the side of the first heat exchange assembly away from the heat-conducting part, and a part of the second heat exchange assembly is in direct contact with the first heat exchange assembly.

[0159] In this embodiment, the first heat exchange component can be a semiconductor refrigeration chip. The working principle of the semiconductor refrigeration chip is based on the thermoelectric effect. It uses the thermoelectric effect caused by the current to generate a temperature difference in the PN junction and conducts heat from the high temperature side to the low temperature side, thereby achieving a cooling effect. It has the advantages of small size, no vibration and no noise.

[0160] In the case where the first heat exchange component is a semiconductor refrigeration chip, one side of the semiconductor refrigeration chip is a low-temperature side used for cooling, and the other side is a high-temperature side; wherein, the low-temperature side can be attached to the second heat exchange plate 32, and the heat of the high-temperature side can be exchanged to the air environment.

[0161] In this embodiment, the second heat exchange component may include a side of the first heat exchange component away from the heat-conducting part, and a portion of the structure of the second heat exchange component may be in direct contact with the first heat exchange component. For example... Figure 5 As shown, a portion of the second heat exchange component can be attached to the first heat exchange component, for example, it can be attached to the high-temperature surface of the thermoelectric cooler. The second heat exchange component can carry the heat from the first heat exchange component into the air, thereby achieving heat dissipation for the first heat exchange component. For example, the heat from the high-temperature surface of the thermoelectric cooler can be carried into the air. In this way, the temperature inside the phase-shifting structure 10 can be dissipated to the external environment sequentially through the conductive patch, the second heat exchange plate 32 in the heat-conducting part, the low-temperature surface of the thermoelectric cooler, the high-temperature surface of the thermoelectric cooler, and the second heat exchange component, thereby achieving cooling of the liquid crystal 15 inside the phase-shifting structure 10.

[0162] In some embodiments, such as Figure 3 and Figure 5 As shown, the second heat exchange component may include:

[0163] The heat sink 22 is in direct contact with the first heat exchange component;

[0164] The heat dissipation module 24 is located on the side of the heat dissipation plate 22 away from the first heat exchange component and is connected to the heat dissipation plate 22.

[0165] Cooling fan 23 is located on the side of heat sink 22 away from the first heat exchange component and is connected to heat sink 22;

[0166] There is a gap between the heat dissipation module 24 and the heat dissipation fan 23.

[0167] A portion of the heat sink 22 can directly contact the first heat exchange component and the heat dissipation module 24, for example, such as... Figure 5 As shown, one side of a portion of the heat sink 22 can directly contact the first heat exchange component, and the other side can directly contact the heat dissipation module 24.

[0168] For example, the heat dissipation module 24 and the first heat exchange component can be located on opposite sides of the heat sink 22, and the rest of the heat dissipation module 24 can be exposed to the air environment.

[0169] The heat sink 22 can directly contact the high-temperature surface of the thermoelectric cooler, and the contact area can be less than or equal to the area of ​​the high-temperature surface of the thermoelectric cooler. For example, as... Figure 5 As shown, the contact area can be equal to the area of ​​the high-temperature surface of the conductor cooling chip, thus achieving the maximum heat exchange effect.

[0170] Alternatively, the contact area can be smaller than the area of ​​the high-temperature surface of the conductor cooling chip, wherein the difference between the contact area and the area of ​​the high-temperature surface of the conductor cooling chip can be less than 1 / 20 to 1 / 10 of the area of ​​the high-temperature surface.

[0171] The contact area between the heat dissipation module 24 and the heat sink 22 can be greater than the contact area between the heat sink 22 and the thermoelectric cooler. For example, the contact area between the heat dissipation module 24 and the heat sink 22 can be a multiple of the contact area between the heat sink 22 and the thermoelectric cooler; or, the difference in area between the contact area between the heat dissipation module 24 and the heat sink 22 and the contact area between the heat sink 22 and the thermoelectric cooler can be less than the high-temperature surface area of ​​the thermoelectric cooler.

[0172] The heat dissipation module 24 can be formed of plastic or metal; the heat dissipation module 24 can include multiple heat dissipation fins 241, and the gap between each pair of adjacent heat dissipation fins 241 can be consistent.

[0173] In some examples, the heat dissipation fins 241 and the heat sink 22 in the heat dissipation module 24 can intersect, such as orthogonally; the dimension of the heat dissipation fins 241 in the thickness direction of the heat sink 22 can be greater than the thickness of the heat sink 22. This can improve the heat dissipation effect of the heat dissipation module 24.

[0174] The angle between the heat dissipation module 24 and the heat sink 22 can also be less than 90 degrees. For example, the heat dissipation module 24 can be tilted towards the signal output side of the phase shifting structure 10. Figure 3 As shown, the first substrate 11 is the output side of the electromagnetic wave signal. The heat dissipation module 24 can be tilted toward the first substrate 11, that is, the heat dissipation fins 241 are tilted toward the first substrate 11. In this way, the heat dissipation module 24 can reflect the output electromagnetic wave signal, so that the output electromagnetic wave beam is focused in the pointing direction, thereby improving the antenna performance.

[0175] Of course, furthermore, the connecting piece and signal input interface 33 in the heat-conducting part can also be tilted toward the first substrate 11, which can also cause the output electromagnetic wave beam to converge in the pointing direction.

[0176] Furthermore, the tilted arrangement of the heat dissipation module 24 toward the first substrate 11 allows the slit formed between the heat dissipation fins 241 and the heat dissipation plate 22 to facilitate airflow and improve the heat dissipation effect of the heat dissipation module 24.

[0177] Among them, such as Figure 3 As shown, the cooling fan 23 is also located on the side of the heat sink 22 away from the first heat exchange component and is connected to the heat sink 22; there is a gap between the heat sink module 24 and the cooling fan 23, which allows the air blown out by the cooling fan 23 to have a greater flow rate at this point, thereby quickly carrying the heat dissipated by the heat sink module 24 to the surrounding air environment to improve heat dissipation efficiency.

[0178] In this heat dissipation module 24, the heat dissipation fins 241 can be rectangular, including a long side and a short side. The gap between the heat dissipation module 24 and the cooling fan 23 can be smaller than the short side dimension of the heat dissipation fins 241 in the heat dissipation module 24. Alternatively, it can be larger than the short side dimension of the heat dissipation fins 241, but smaller than the long side dimension of the heat dissipation fins 241.

[0179] When the gap between the heat dissipation module 24 and the heat dissipation fan 23 is smaller than the short side dimension of the heat dissipation fins 241 in the heat dissipation module 24, a slit can be formed between the heat dissipation fan 23 and the heat dissipation module 24, thereby further increasing the airflow rate at this location.

[0180] The heat dissipation module 24 can be encased in a metal shell, which provides a larger heat dissipation area and also protects the phase-shifting structure 10 and the semiconductor cooling chip.

[0181] In some embodiments, the cooling fan 23 may be self-powered, such as by including a battery assembly that can power the cooling fan 23, thereby eliminating the need for an external power supply and making the cooling scenario of the liquid crystal phase shifter unrestricted; or, the cooling fan 23 may have a power interface that can be used to connect an external power supply. When working, power is connected to the power interface to start the cooling fan 23.

[0182] In some embodiments, the conductive patch can be reused as part of the phase-shifting structure 10. For example, as... Figure 4A and Figure 4B As shown, the phase-shifting structure 10 may further include a first electrode 12 and a second electrode 17, such as... Figure 2 As shown, the first electrode 12 is located on the side of the first substrate 11 near the liquid crystal 15, and the second electrode 17 is located on the side of the second substrate 18 near the liquid crystal 15, wherein the second electrode 17 is grounded.

[0183] In this embodiment, as Figure 2As shown, there is an overlapping region between the first electrode 12 and the second electrode 17, as described in the aforementioned embodiments, in combination with Figure 4B As shown, when the phase-shifting structure 10 is applied to a reflective liquid crystal antenna 15, the second electrode 17 can cover the entire second substrate 18.

[0184] In the case where the phase-shifting structure 10 is applied to a transmissive liquid crystal antenna 15, the second electrode 17 can be routed around one side of the second substrate 18 and does not completely cover the second substrate 18, such as... Figure 4A As shown.

[0185] In this embodiment, the second electrode 17 can be used as a conductive path 34, that is, the ground layer of the phase shifting structure 10 is used as a heat conduction layer, thereby simplifying the structure of the liquid crystal phase shifter and achieving the purpose of electrode layer reuse. Furthermore, since the second electrode 17 is close to the liquid crystal 15, it can directly affect the temperature of the liquid crystal 15. Therefore, using the second electrode 17 directly as a conductive path 34 (conductive patch) can achieve rapid temperature regulation.

[0186] like Figure 4B As shown, when the second electrode 17 fully covers the second substrate 18, the conductive path 34 can also cover the entire surface of the second substrate 18.

[0187] Of course, in some examples, the conduction path 34 can be independent of the second electrode 17. The conduction path 34 can be located in a different layer or in the same layer as the second electrode 17. If they are in the same layer, the conduction path 34 and the second electrode 17 are isolated from each other.

[0188] When not located on the same layer, the conductive path 34 can be located on the side of the second electrode 17 away from the first electrode 12. The conductive path 34 and the second electrode 17 do not overlap. An insulating layer can be provided between the conductive path 34 and the second electrode 17, such that the orthographic projection of the conductive path 34 on the second substrate 18 does not overlap with the orthographic projection of the second electrode 17 on the substrate. For example,... Figure 4A As shown, the phase-shifting structure 10 is applied in a transmissive liquid crystal antenna 15. The second electrode 17 does not completely cover the second substrate 18, and the conductive path 34 is wired around the second electrode 17 on the second substrate 18. In this way, no overlapping capacitance is generated between the second electrode 17 and the conductive path 34, so as not to affect the phase-shifting performance of the phase-shifting structure 10.

[0189] In some embodiments, the conductive path 34 may include a cavity, and a medium different from the liquid crystal 15 may be included within the cavity, so that the conductive structure 30 can form a flow channel for the medium to flow. In this embodiment, please refer to... Figures 7-10 As shown, Figure 7 This illustrates another three-dimensional structure of a liquid crystal phase shifter. Figure 8It shows Figure 7 The front view of the phase-shifting structure 10 of the liquid crystal 15 shown is shown. Figure 9 A front view of yet another liquid crystal phase shifter is shown. Figure 10 A three-dimensional structural schematic diagram of a partial area of ​​a liquid crystal phase shifter is shown, such as... Figures 7-10 As shown,

[0190] The liquid crystal phase shifter also includes a dielectric conduit 40 connected to the first end 341 of the conduction path 34, and the dielectric conduit 40 is located outside the phase shifting structure 10;

[0191] The temperature control structure 20 includes a drive pump 21 and a first heat exchange plate 23. The drive pump 21 includes a first end 211 and a second end 212. The second end 212 is connected to the tail end 342 of the conduction passage 34, and the first end 211 is connected to the medium pipeline 40. The medium pipeline 40 is connected to the head end 341 of the conduction passage 34. The drive pump 21 is configured to drive the flowing medium to circulate between the medium pipeline 40 and the conduction passage 34.

[0192] The first heat exchange plate 23 is located between the first end 211 of the driving pump and the first end 341 of the conduction passage 34, and the first heat exchange plate 23 is in contact with the medium pipeline 40.

[0193] like Figure 7 As shown, the conduction passage 34 has a cavity and includes a first end 341 and a last end 342. The first end 341 is connected to the medium pipeline 40. The cavity in the medium pipeline 40 is connected to the first end of the conduction passage 34. The other end of the medium pipeline 40 is connected to the first end 211 of the drive pump.

[0194] Both the medium conduit 40 and the conduction path 34 can be cylindrical, or the three-dimensional shape of the medium conduit 40 and the conduction path 34 can include a rectangular column or a square column.

[0195] The medium pipeline 40 and the first end 341 of the conduction passage 34 can be connected by thread, plug, welding or bonding, and there are no restrictions.

[0196] The medium pipeline 40 can be made of a material with a high thermal conductivity, specifically including metal plates or non-metallic materials, such as rock wool, gold, graphite, aluminum, polyurethane foam, etc.

[0197] Among them, such as Figures 7-9 As shown, the medium conduit 40 may include multiple bends, which can expand the flow area of ​​the medium within a limited area. For example, the medium conduit 40 may include multiple periodic bends, which may be right-angle bends, and through multiple bends, the medium conduit 40 may form a continuous Z-shaped form.

[0198] In this regard, please combine Figure 19 As shown, a cross-sectional schematic diagram of the drive pump 21 is presented, as follows: Figure 19 As shown, the drive pump 21 may include a housing 215, a drive pump array 216, a first valve 213 and a second valve 214. The housing 215 has a cavity. The drive pump array 216 is connected to the housing 215. A channel for medium flow is formed between the drive pump array 216 and the housing 215. A first channel 211 and a second channel 212 are opened on the side of the channel opposite to the drive pump array 216. The first valve 213 is provided at the first channel 211 and the second valve 214 is provided at the second channel 212.

[0199] Among them, such as Figure 7 As shown by the dashed arrow, the first channel 211 can be connected to the tail end 342 of the conduction path 34, and the second channel 212 can be connected to one end of the medium pipeline 40. In this way, the medium can flow from the tail end 342 of the conduction path 34 through the first channel into the cavity from inside the phase shifting structure 10, and under the action of the driving pump 21, it flows from the second channel into the medium pipeline 40, and then flows back from the medium pipeline 40 into the conduction path 34.

[0200] The area surrounding the first channel and the area surrounding one end of the media pipeline 40 can be sealed to prevent leakage of the media at the first channel. In some examples, the vertical distance between the first valve and the drive pump array 216 can be less than the vertical distance between the second valve and the drive pump array 216. This ensures that the connection point between the first channel and the conduction passage 34 is not coplanar with the connection point between the second channel and the media pipeline 40, thereby increasing the flow rate of the media in the drive pump 21.

[0201] Among them, the driving pump 21 can be a micro driving pump 21. The driving pump 21 as a whole or at least the driving pump array 216 has the inverse piezoelectric effect, for example, it is made of piezoelectric ceramic. Piezoelectric ceramic has the inverse piezoelectric effect, which can realize the mutual conversion of electrical energy and mechanical energy, and can drive the flow of refrigerant. It has the characteristics of thin thickness, small size, simple structure, high pressure, small flow, no electromagnetic interference and low working noise, and can realize precise fluid transportation and control.

[0202] In this embodiment, the drive pump array 216 can vibrate under voltage. During the vibration, the drive pump array 216 deforms. When the drive pump array 216 deforms, the volume of the cavity formed between the drive pump array 216 and the housing changes, and the pressure in the cavity changes accordingly, thereby opening the first channel and the second channel. When the first channel is open, the medium in the conduction passage 34 is absorbed into the cavity, and the first valve is closed. When the volume of the cavity decreases, the second valve is opened, and the medium flows out from the second channel to the medium pipeline 40. In this way, through the deformation of the drive pump array 216, the medium can be driven to circulate between the medium pipeline 40 and the conduction passage 34.

[0203] Among them, such as Figures 7-9 As shown, the first heat exchange plate 23 is located between the first end 211 of the driving pump and the medium pipeline 40, and is in contact with the medium pipeline 40. This contact can mean that the medium pipeline 40 is in direct contact with the first heat exchange plate 23.

[0204] The first heat exchange plate 23 can be a cooling plate used to cool the medium pipeline 40, so that the temperature of the medium in the medium pipeline 40 drops and then flows back into the conduction path 34 inside the phase shifting structure 10.

[0205] The first heat exchange plate 23 can also be a heating plate used to heat the medium pipeline 40, so that the temperature of the medium in the medium pipeline 40 rises and then flows back into the conduction path 34 inside the phase shifting structure 10.

[0206] The first heat exchange plate 23 can be a metal plate or a non-metal plate, and it can be made of a material with a high thermal conductivity, such as rock wool, gold, graphite, aluminum, polyurethane foam, etc.

[0207] In some embodiments, when the first heat exchange plate 23 is a cooling plate, the thermal conductivity of the first heat exchange plate 23 can be higher than that of the medium pipeline 40, thereby allowing the heat from the medium pipeline 40 to be quickly carried away by the first heat exchange plate 23.

[0208] In some embodiments, when the first heat exchange plate 23 is a heating plate, the thermal conductivity of the first heat exchange plate 23 can be lower than that of the medium pipeline 40. As a result, the heat on the first heat exchange plate 23 can be quickly introduced into the medium pipeline 40, thereby improving the heating effect on the medium in the pipeline.

[0209] The shape of the first heat exchange plate 23 can be plate-shaped, such as rectangular plate, circular plate, elliptical plate, etc. The plate shape means that the planar dimension of the first heat exchange plate 23 is greater than the thickness of the first heat exchange plate 23. For example, the length and width of the first heat exchange plate 23 are both greater than the thickness of the first heat exchange plate 23, or the diameter, major axis, etc. of the first heat exchange plate 23 are greater than the thickness of the first heat exchange plate 23.

[0210] The medium pipeline 40 can be attached to the first heat exchange plate 23. To increase the heat exchange area, the medium pipeline 40 can be continuously bent in a Z-shape, for example, as shown below. Figure 8 As shown, the medium pipeline 40 may include a first pipeline 41 and a second pipeline 42, which are cross-connected. The first pipeline 41 extends along the long side direction y of the first heat exchange plate 23, and the second pipeline 42 extends along the short side direction x of the first heat exchange plate 23. The length of the first pipeline 41 is greater than the length of the second pipeline 42. Multiple first pipelines 41 are parallel to each other, and multiple second pipelines 42 are parallel to each other.

[0211] The length of the second pipe 42 can be 1 / 20 to 1 / 10 of the length of the first pipe 41. For example, the length of the second pipe 42 can be 1 / 20 of the length of the first pipe 41. In this way, more first pipes 41 can be laid out, thereby increasing the heat exchange area between the medium and the first heat exchange plate 23, so as to fully cool or heat the medium in the medium pipe 40.

[0212] like Figure 8 As shown, the orthographic projection of the medium pipeline 40 on the plane where the first heat exchange plate 23 is located can overlap with the first heat exchange plate 23. For example, there is an overlapping area between the orthographic projections of the medium pipeline 40 on the plane where the first heat exchange plate 23 is located. In some examples, the orthographic projection of the medium pipeline 40 on the plane where the first heat exchange plate 23 is located can fall within the first heat exchange plate 23, so that the entire medium pipeline 40 can exchange heat with the first heat exchange plate 23.

[0213] For example, when the orthographic projection of the medium pipeline 40 on the plane where the first heat exchange plate 23 is located can overlap with the first heat exchange plate 23, the long side dimension of the first heat exchange plate 23 can be larger than the dimension of the first pipeline 41, and the short side dimension of the medium pipeline 40 can be larger than the short side dimension of the second pipeline 42. For example, the short side dimension of the medium pipeline 40 can be an integer multiple of the short side dimension of the second pipeline 42.

[0214] Wherein, the long side dimension of the first heat exchange plate 23 refers to the dimension of the first heat exchange plate 23 in the long side direction y, and the short side dimension of the first heat exchange plate 23 refers to the dimension of the first heat exchange plate 23 in the short side direction x.

[0215] In some embodiments, the thickness of the first heat exchange plate 23 can be greater than the thickness of the pipe wall of the medium pipeline 40. Thus, the pipe wall of the medium pipeline 40 is thinner, and heat exchange can be carried out quickly between it and the first heat exchange plate 23.

[0216] like Figure 7-9As shown, the medium pipeline 40 may include a periodically bent structure, part or all of which is in contact with the first heat exchange plate 23, wherein multiple bends of the bent structure have rounded corners and / or bend angles greater than 90 degrees.

[0217] In this embodiment, the medium pipeline 40 may include a bent structure and a straight pipeline structure 343, such as Figure 7 As shown, the bending structure includes multiple periodic bends. As described in the above embodiment, the bending structure may include multiple first pipes 41 and multiple second pipes 42, wherein the multiple first pipes 41 and multiple second pipes 42 can be connected to form a bending structure, and the first pipes 41 and the second pipes 42 intersect.

[0218] Specifically, such as Figure 7 As shown, the straight conduit structure 343 can be connected between the bent structure and the beginning 341 of the conduction path 34. This example can be adapted to situations where the beginning 341 and the end 342 of the conduction path 34 are not located on the same side of the phase shifting structure 10, and the drive pump 21 is located at the end 342 of the conduction path 34. Thus, the straight conduit structure can be used to transition between the medium conduit 40 and the conduction path 34.

[0219] In some embodiments, the bend in the bending structure has a rounded corner, which can be understood as a rounded chamfer formed between the first pipe 41 and the second pipe 42. For example, the second pipe 42 can be a pipe with an arc, so the bend between the second pipe 42 and the first pipe 41 can be an arc bend. In this case, the flow velocity of the medium at the bend can be increased, thereby improving the heat exchange effect with the first heat exchange plate 23.

[0220] In some embodiments, the bend in the bending structure has an obtuse angle, which can be understood as the angle formed between the first pipe 41 and the second pipe 42. For example, the second pipe 42 can be a pipe with an arc, so the bend between the second pipe 42 and the first pipe 41 can be an arc bend. In this case, the flow velocity of the medium at the bend can be increased, thereby improving the heat exchange effect with the first heat exchange plate 23, and / or the bend angle is greater than 90 degrees. For example, as Figure 10 As shown, a plan view of the medium pipeline 40 and the first heat exchange plate 23 is presented, as follows. Figure 10 As shown, the first pipe 41 and the second pipe 42 are connected to each other to form a bend. The included angle θ1 between the first pipe 41 and the second pipe 42 can be an obtuse angle, such as 120 degrees. Multiple second pipes 42 can be connected between two adjacent first pipes 41. The included angle θ2 between adjacent second pipes 42 can also be an obtuse angle, such as 120 degrees.

[0221] This embodiment can improve the smoothness of the medium flow at the bend, thereby improving the heat exchange efficiency between the medium and the first heat exchange plate 23.

[0222] In some embodiments, the conductive path 34 within the phase-shifting structure 10 may include a first film layer, a second film layer, and a connecting layer, thereby enabling the fabrication of the conductive path 34 on a substrate.

[0223] Specifically, the conduction pathway 34 may include:

[0224] The first film layer is located on one side of the substrate;

[0225] The second film layer is disposed opposite to the first film layer;

[0226] A connecting layer connects the first film layer and the second film layer;

[0227] The first membrane layer, the second membrane layer, and the connecting layer are sealed together to form a cavity.

[0228] In this embodiment, the conductive path 34 is fabricated by superimposing a first film layer and a second film layer. The first film layer and the second film layer can be formed using materials with high thermal conductivity, such as graphite or polyurethane foam.

[0229] The process of forming the above-mentioned conductive path 34 can be as follows: a first film layer is formed on one side of the substrate, a filling layer is formed on the side of the first film layer away from the substrate, the filling layer is etched to form a groove, the sidewall of the groove is formed as a connecting layer, and a second film layer is formed on the side of the connecting layer away from the substrate. The second film layer can be independently fabricated according to the shape of the conductive path 34 and then fixed with the connecting layer to form a connecting path.

[0230] The first membrane layer, the second membrane layer, and the connecting layer are sealed to prevent the medium from leaking from the conduction path 34 and contaminating the interior of the phase-shifting structure 10.

[0231] The thickness of the first film layer and the thickness of the second film layer can be lower than the thickness of the first electrode 12 and the second electrode 17 in the phase-shifting structure 10.

[0232] The material of the first film layer can be the same as that of the connecting layer, for example, both can be metallic or both can be non-metallic. If the materials are the same, the connection between the first film layer and the connecting layer can be made more difficult and stronger. The material of the second film layer can be different from that of the connecting layer. For example, the thermal conductivity of the second film layer can be higher than that of the first film layer. In this way, the second film layer is closer to the liquid crystal 15, thereby improving the heat exchange efficiency between the second film layer and the liquid crystal 15.

[0233] The conduction path 34 is located in the same layer as the first electrode 12 or the second electrode 17 inside the phase shifting structure 10. Furthermore, the material of the first film layer can be the same as the material of the first electrode 12 or the second electrode 17. Thus, the first film layer can be formed in the same process as the first electrode 12 or the second electrode 17, thereby simplifying the process flow.

[0234] In some embodiments, such as Figures 3-5 As shown, the conductive path 34 is formed using a conductive patch, which does not conduct a medium but directly conducts heat; as Figures 7-9 As shown, the conductive path 34 has a cavity in which a medium flows. In both examples, the conductive path 34 can be bent and routed around the phase shifting unit 110 on the substrate. Exemplarily, the conductive path 34 can have multiple bends, thereby allowing the conductive path 34 to bend and route on the substrate.

[0235] The conductive path 34 can be formed using a conductive material. In this case, the phase shifter can be formed as follows: Figures 3-5 The structure shown, wherein the conduction path 34 can be formed using a first film layer, a second film layer, and a connecting layer, in which case the phase shifter can be formed as follows: Figures 7-9 The structure shown is such that the bending angle of the conductive path 34 formed using a conductive material is smaller than that of the conductive path 34 formed using a non-conductive material.

[0236] like Figures 3-5 As shown, the conductive path 34 is formed of a conductive material, for example, it can be a conductive patch formed on a substrate. In this case, since the conductive path 34 is conductive and the conductive path 34 is bent and routed on the substrate, the conductive path 34 can be used as an isolation structure between multiple phase shifting units 110 to improve crosstalk between phase shifting units 110. In this case, the bending angle of the conductive path 34 can be a right angle, such as 90°, or it can be 85° to 95°.

[0237] like Figures 7-9 As shown, the conductive path 34 can be formed using a first film layer, a second film layer, and a connecting layer. The first film layer, the second film layer, and the connecting layer in the conductive path 34 can all be non-conductive materials. In this case, since the conductive path 34 needs to conduct the flow of the medium, to improve the smoothness of the medium flow, the bending angle of the conductive path 34 when it is bent on the substrate can be greater than 90°, such as an obtuse angle. Specific details regarding the bending routing can be found in [reference needed]. Figure 10 The routing of the medium medium pipeline 40 is sufficient and will not be elaborated here.

[0238] For example, when this liquid crystal phase shifter is performing temperature control, for instance, if the liquid crystal 15 needs to be set to 30°C and the external ambient temperature of the liquid crystal 15 is 75°C, the temperature of the first heat exchange plate 23 may need to be reduced to 25°C. Through the contact between the first heat exchange plate 23 and the medium pipeline 40, the temperature of the medium inside the medium pipeline 40 is 27°C. The medium flows into the interior of the phase shifting structure 10, thereby affecting the liquid crystal temperature to the target temperature of around 30°C.

[0239] In some embodiments, please combine Figures 16-18 As shown, Figure 16 A schematic diagram of another phase shifter is shown. Figure 17 and Figure 18 They are shown respectively Figure 16 The schematic diagram of a partial area of ​​the liquid crystal phase shifter shown is as follows: Figures 16-18 As shown, the conductive structure 30 can directly conduct the liquid crystal 15 inside the phase-shifting structure 10, so the temperature control structure 20 can directly heat or cool the liquid crystal 15.

[0240] For example, the conduction structure 30 may include an inlet pipe 351 and an outlet pipe 352 formed on the phase-shifting structure 10, and the temperature control structure 20 may include:

[0241] The drive pump 21 includes a receiving cavity, which is connected to an inlet pipe 351 and an outlet pipe 352 respectively, and is configured to drive the liquid crystal 15 to circulate between the inlet pipe 351, the receiving cavity and the outlet pipe 352.

[0242] The temperature control component, connected to the drive pump 21, is configured to heat or cool the liquid crystal 15 located in the receiving cavity.

[0243] In this embodiment, as Figure 17 As shown, the conductive structure 30 may include an inlet pipe 351 and an outlet pipe 352. Both the inlet pipe 351 and the outlet pipe 352 can connect the inside of the phase shift structure 10 and the outside of the phase shift structure 10. The inside of the phase shift structure 10 refers to the filling area where the liquid crystal 15 is located, and the outside of the phase shift structure 10 can refer to the outside of the substrate.

[0244] Among them, such as Figure 17 As shown, the inlet pipe 351 and the outlet pipe 352 can be located between the substrate and the frame adhesive 14, and are sealed to the frame adhesive 14 and the substrate, thereby preventing leakage of the liquid crystal 15.

[0245] The materials for the inlet pipe 351 and the outlet pipe 352 are not limited.

[0246] The number of inlet pipes 351 and outlet pipes 352 is unlimited. For example, it can include multiple inlet pipes 351 located in different locations and multiple outlet pipes 352 located in different locations. It should be noted that one inlet pipe 351 is matched with one outlet pipe 352.

[0247] One drive pump 21 can be connected to an inlet pipe 351 and an outlet pipe 352. In this way, with multiple inlet pipes 351 and multiple outlet pipes 352, multiple drive pumps 21 can be corresponding. In one example, multiple drive pumps 21 can independently correspond to different regions in the phase shifting structure 10, thereby realizing independent temperature control of the liquid crystal 15 in different regions.

[0248] The structure of the drive pump 21 can be as follows: Figure 19 As shown above, please refer to the specific details. Figure 19 The description of the drive pump 21 is sufficient. For example, the drive pump 21 may include a housing, a drive pump array 216, a first valve and a second valve. The housing has a cavity, and the drive pump array 216 is connected to the housing. A channel for medium flow is formed between the drive pump array 216 and the housing. A first channel and a second channel are opened on the side of the channel opposite to the drive pump array 216. A first valve is installed at the first channel and a second valve is installed at the second channel. The first channel is connected to the outlet pipe 352 and the second channel is connected to the inlet pipe 351.

[0249] In this way, the liquid crystal 15 can be pumped into the cavity of the drive pump 21 through the outlet pipe 352, and then flow back into the phase shifting structure 10 through the first passage and the inlet pipe 351.

[0250] Among them, the drive pump 21 is a miniature drive pump 21. The temperature control component can be directly connected to the drive pump 21, or the temperature control component can be configured into the drive pump 21. Since the cavity volume of the drive pump 21 is very small, the heating or cooling efficiency of the liquid crystal 15 in the cavity can be improved, making temperature control simpler and the power consumption lower.

[0251] In some examples, the cavity surrounding the drive pump 21 can be made of an opaque material, thereby preventing the liquid crystal 15 from being affected by light.

[0252] In this example, when the antenna or phase shifter is not working, the liquid crystal 15 will be squeezed from the interlayer space of the antenna or phase shifter (the space between the first substrate 11 and the second substrate 18) into the cavity under the action of the drive pump 21, and the temperature control component will control the temperature of the cavity.

[0253] The temperature control component may include a heating wire and a cooling element, such as attaching the heating wire to the inner wall of the cavity and attaching the cooling element to the outer wall of the cavity. Alternatively, the cooling element may be attached to the inner wall of the cavity and the heating wire to the outer wall of the cavity.

[0254] In some embodiments, a temperature control method for a liquid crystal phase shifter is also provided, combined with Figure 20 As shown, Figure 20 A schematic diagram of the steps in the temperature control method for a liquid crystal phase shifter is shown, as follows: Figure 20 As shown, the specific steps may include:

[0255] Step S101: In response to the phase shifting structure 10 being in a non-working state, the temperature control structure 20 is controlled to heat or cool the flow medium conducted by the conductive structure 30 and / or the conductive structure 30.

[0256] Step S102: In response to the phase shifting structure 10 being in working state, control the temperature control structure 20 to stop performing heating or cooling actions.

[0257] In this embodiment, the liquid crystal phase shifter can be Figures 3-6 The liquid crystal phase shifter shown, or may be Figures 7-10 The liquid crystal phase shifter shown may be... Figures 16-18 The liquid crystal phase shifter shown is an example of this. Specifically, the liquid crystal phase shifter is... Figures 3-6 As shown or Figures 7-10 In the case of the liquid crystal phase shifter shown, the temperature control structure 20 can directly heat or cool the conductive structure; in the liquid crystal phase shifter is Figures 16-18 In the case of the liquid crystal phase shifter shown, the temperature control structure 20 can heat or cool the flowing medium, such as the liquid crystal 15, that is conducted by the conductive structure 30.

[0258] In some embodiments, when the liquid crystal phase shifter is Figures 3-6 In the case of the liquid crystal phase shifter shown, and when the conductive structure 30 is configured as the second electrode 17 in the phase shift structure 10, the temperature control structure 20 can be used to heat or cool the conductive structure 30 while the phase shift structure 10 is working, thereby achieving temperature control of the liquid crystal 15 while the phase shift structure 10 is working.

[0259] In some embodiments, when the liquid crystal phase shifter is Figures 7-9 or Figures 16-18In the case of the liquid crystal phase shifter shown, the temperature control structure 20 can heat or cool the conductive structure 30 when the phase shifting structure 10 is not working, thereby achieving temperature control of the liquid crystal 15 without affecting the phase shifting performance of the phase shifting structure 10. For example, when the phase shifting structure 10 is in a non-working state, the temperature control structure 20 is controlled to heat or cool the flow medium conducted by the conductive structure 30 and / or the conductive structure 30; when the phase shifting structure 10 is in a working state, the temperature control structure 20 is controlled to stop performing the heating or cooling action.

[0260] When the phase-shifting structure 10 is not working, the drive pump can recover the medium in the conduction structure into the internal cavity, so that the medium, such as the refrigerant, does not interfere with the antenna signal.

[0261] In one implementation of this embodiment, the temperature control structure 20 can be connected to the control unit of the phase-shifting structure 10. The control unit can be configured to input a control signal to the first electrode 12 in the phase-shifting structure 10, so that an electric field is formed between the first electrode 12 and the second electrode 17 in the phase-shifting structure 10, thereby driving the liquid crystal 15 to deflect and achieve the phase-shifting function. Specifically, the temperature control structure 20 may also include a temperature control unit, which can be connected to the control unit. The temperature control unit can start performing heating or cooling operations in response to the control unit inputting a control signal to the first electrode 12. For example, when the control unit inputs a control signal to the first electrode 12, it can input a level signal, such as a high level, to the temperature control unit, so that the temperature control unit responds to the high level and performs heating or cooling operations; when the control unit does not input a control signal to the first electrode 12, the input level signal of the temperature control unit can be a low level, so that the temperature control unit responds to the low level and stops performing heating or cooling operations.

[0262] In some embodiments, an antenna is also provided, with reference to Figure 21 As shown, a schematic diagram of the cross-sectional structure of the antenna is presented, such as... Figure 21 As shown, including the above Figures 3-18 The liquid crystal phase shifter 200 described herein, and the radiating structure 300 located on one side of the liquid crystal phase shifter 200, and the feeding structure 100 located on the side of the liquid crystal phase shifter away from the radiating structure.

[0263] The radiating structure can be located on one side of the first substrate 11 of the phase-shifting structure 10, and the feeding structure can be located on one side of the second substrate 18 of the phase-shifting structure 10. The feeding structure is used to feed the signal to be radiated into the phase-shifting structure 10. The signal to be radiated is emitted from one side of the first substrate 11 after being phase-shifted by the phase-shifting structure 10.

[0264] The radiation structure may include radiation units corresponding to each phase-shifting unit in the phase-shifting structure 10.

[0265] The antenna can be a liquid crystal phased array antenna or a vehicle-mounted antenna.

[0266] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0267] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0268] The above provides a detailed description of a liquid crystal phase shifter, a temperature control method for the liquid crystal phase shifter, and an antenna provided by this disclosure. Specific examples have been used to illustrate the principles and implementation methods of this disclosure. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this disclosure. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this disclosure. Therefore, the content of this specification should not be construed as a limitation of this disclosure.

[0269] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0270] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

[0271] The terms "an embodiment," "embodiment," or "one or more embodiments" as used herein mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of this disclosure. Furthermore, please note that the examples of the phrase "in one embodiment" do not necessarily all refer to the same embodiment.

[0272] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of this disclosure may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0273] In the claims, any reference signs placed between parentheses should not be construed as limiting the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. This disclosure can be implemented by means of hardware comprising a plurality of different elements and by means of a suitably programmed computer. In a unit claim enumerating a plurality of means, several of these means may be embodied by the same item of hardware. The use of the words first, second, and third, etc., does not indicate any order. These words may be interpreted as names.

[0274] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure.

Claims

1. A liquid crystal phase shifter, characterized by, include: A phase-shifting structure, the phase-shifting structure comprising two substrates disposed opposite each other and liquid crystal filling the space between the two substrates; A temperature control structure is located outside the phase-shifting structure; and, A conductive structure is located inside the phase-shifting structure and connected to the temperature control structure, the conductive structure being configured to transfer heat between the phase-shifting structure and the temperature control structure; The temperature control structure is configured to heat or cool the conductive structure and / or the medium in the conductive structure to regulate the temperature of the liquid crystal.

2. The liquid crystal phase shifter of claim 1, wherein, The conductive structure includes at least one conductive path located on any of the substrates, the conductive path being around the substrate and / or located around the perimeter of the substrate; The temperature control structure is connected to both ends of the conduction path and is configured to heat or cool the conduction path.

3. The liquid crystal phase shifter of claim 2, wherein, The conductive path includes a cavity, and a medium different from the liquid crystal is conducted inside the cavity; the liquid crystal phase shifter also includes a dielectric conduit connected to the first end of the conductive path, and the dielectric conduit is located outside the phase shifting structure; The temperature control structure includes: A drive pump includes a first end and a second end, the first end being connected to the medium pipeline and the second end being connected to the tail end of the conduction passage, and is configured to drive the medium to circulate between the medium pipeline and the conduction passage; The first heat exchange plate is in contact with the medium pipeline.

4. The liquid crystal phase shifter of claim 3, wherein, The medium pipeline includes a periodically bent structure, and part or all of the bent structure is in contact with the first heat exchange plate. The bending structure has multiple bends with rounded corners and / or bending angles greater than 90 degrees.

5. The liquid crystal phase shifter of claim 3, wherein, The conduction pathway includes: The first film layer is located on one side of the substrate; The second film layer is disposed opposite to the first film layer; A connecting layer that connects the first film layer and the second film layer; The first film layer, the second film layer, and the connecting layer are sealed together to form the cavity.

6. The liquid crystal phase shifter of claim 2, wherein, The conductive path is configured as a conductive patch located on any of the substrates, the conductive patch being configured to conduct heat in the phase-shifting structure; Both ends of the conduction path are connected to a heat-conducting part, part or all of which is located outside the phase-shifting structure, and the heat-conducting part includes a second heat exchange plate; The temperature control structure includes: The heat exchange assembly, which is in contact with the second heat exchange plate of each heat-conducting part, is configured to exchange heat with the second heat exchange plate to dissipate the heat conducted by the conductive patch or to input heat to the conductive patch.

7. The liquid crystal phase shifter of claim 6, wherein, The heat-conducting part includes a signal input interface, and the conductive patch has a thermal resistance effect; The conductive patch generates heat when an electrical signal is connected to the signal input interface.

8. The liquid crystal phase shifter of claim 6, wherein, The heat exchange assembly includes: The first heat exchange component is in direct contact with the second heat exchange plate; The second heat exchange component is located on the side of the first heat exchange component away from the heat-conducting part, and a portion of the second heat exchange component is in direct contact with the first heat exchange component.

9. The liquid crystal phase shifter of claim 8, wherein, The second heat exchange component includes: The heat sink is in direct contact with the first heat exchange component. A heat dissipation module is located on the side of the heat dissipation plate away from the first heat exchange component and is connected to the heat dissipation plate. The heat dissipation module includes multiple heat dissipation fins. A cooling fan is located on the side of the heat sink away from the first heat exchange component and is connected to the heat sink. There is a gap between the heat dissipation module and the heat dissipation fan.

10. The liquid crystal phase shifter of claim 6, wherein, The phase-shifting structure further includes: The first electrode is located on one of the two substrates, on the side of the first substrate closer to the liquid crystal. The second electrode is located on the side of the other of the two substrates closer to the liquid crystal, and the second electrode is grounded; The second electrode serves as the conduction path.

11. The liquid crystal phase shifter of any of claims 2-10, wherein, The phase-shifting structure includes multiple phase-shifting units, which are arranged in an array along the planar direction of the substrate. The orthographic projection of the conductive path on the substrate does not overlap with the orthographic projection of the multiple phase-shifting units on the substrate.

12. The liquid crystal phase shifter of claim 11, wherein, The orthographic projection of the conductive path on the substrate includes multiple bends, and the bending angle of the conductive path formed with a conductive material is smaller than the bending angle of the conductive path formed with a non-conductive material.

13. The liquid crystal phase shifter of claim 1, wherein, The conduction structure includes an inlet pipe and an outlet pipe formed on the phase-shifting structure; The temperature control structure includes: A drive pump includes a receiving cavity connected to the inlet pipe and the outlet pipe respectively, and is configured to drive the liquid crystal to circulate between the inlet pipe, the receiving cavity and the outlet pipe; A temperature control component, connected to the drive pump, is configured to heat or cool the liquid crystal located within the containment cavity.

14. A temperature control method for a liquid crystal phase shifter, characterized by, The method is applied to the liquid crystal phase shifter according to any one of claims 1-13, and the method includes: In response to the phase-shifting structure being in a non-working state, the temperature control structure is controlled to heat or cool the flowing medium conducted by the conductive structure and / or the conductive structure itself. In response to the phase-shifting structure being in operation, the temperature control structure is controlled to stop performing the heating or cooling action.

15. An antenna, characterized by Includes at least one liquid crystal phase shifter as described in any one of claims 1-13.

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