Screen support plate, display module and electronic devices

Abstract

This invention discloses a screen support plate, a display module, and an electronic device. The screen support plate includes a support layer and two metal shielding layers. The support layer includes multiple carbon fiber layers. The multiple carbon fiber layers include high thermal conductivity carbon fiber layers and conventional carbon fiber layers. In the multiple carbon fiber layers, any two adjacent carbon fiber layers are cross-laid. One metal shielding layer is stacked on the first surface of the support layer, and another metal shielding layer is stacked on the second surface of the support layer opposite to the first surface. The high thermal conductivity carbon fiber layer has a thermal conductivity greater than 100 W / (m·K), the conventional carbon fiber layer has a thermal conductivity less than 50 W / (m·K), and the metal shielding layer has a thermal conductivity greater than 120 W / (m·K). This screen support plate can balance weight, cost, shielding performance, rigidity, and heat dissipation performance.

Description

Technical Field

[0001] This application relates to the technical field of structural support, and more particularly to a screen support plate, a display module, and an electronic device. Background Technology

[0002] To increase display reliability, electronic devices such as foldable phones and candybar phones typically have a screen support plate on the inside of the display screen. Currently, existing screen support plates on the market suffer from a mismatch between weight, heat dissipation, rigidity, shielding performance, and cost. Therefore, there is an urgent need for a screen support plate that can balance weight, cost, shielding performance, and heat dissipation. Summary of the Invention

[0003] This application provides a screen support plate, a display module, and an electronic device, aiming to solve the problem that current screen support plates cannot simultaneously achieve the desired balance of weight, heat dissipation performance, rigidity, shielding performance, and cost.

[0004] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0005] In a first aspect, embodiments of this application provide a screen support plate. The screen support plate includes a support layer and two metal shielding layers. The support layer includes multiple carbon fiber layers. The multiple carbon fiber layers include a high thermal conductivity carbon fiber layer and a conventional carbon fiber layer. In the multiple carbon fiber layers, any two adjacent carbon fiber layers are cross-laid. One metal shielding layer is stacked on a first surface of the support layer, and another metal shielding layer is stacked on a second surface of the support layer opposite to the first surface. The high thermal conductivity carbon fiber layer has a thermal conductivity greater than 100 W / (m·K), the conventional carbon fiber layer has a thermal conductivity less than 50 W / (m·K), and the metal shielding layer has a thermal conductivity greater than 120 W / (m·K).

[0006] In this screen support panel, the main supporting layer comprises multiple layers of carbon fiber, with adjacent layers cross-laid. The stiffness of the support layer is synergistically enhanced by the high flexural modulus of the carbon fiber layers and the cross-orientation of the fibers in the multiple layers, resulting in good stiffness for the screen support panel. The multiple carbon fiber layers utilize a mixture of conventional carbon fiber layers and high thermal conductivity carbon fiber layers, rather than being entirely composed of high-cost high thermal conductivity carbon fiber layers, thus reducing costs compared to screen support panels made entirely of high thermal conductivity carbon fiber layers. Simultaneously, by adding a metal shielding layer with a thermal conductivity greater than 120 W / (m·K) and high thermal conductivity carbon fiber layers with a thermal conductivity greater than 100 W / (m·K), the screen support panel provides shielding performance while compensating for the reduced thermal conductivity caused by the conventional carbon fiber layers. This allows the screen support panel to achieve better heat dissipation performance compared to screen support panels made entirely of conventional carbon fiber layers. Because the added metal shielding layer is only a part of the screen support plate, and not the entire screen support plate, and another part of the screen support plate is a low-density carbon fiber layer, the weight of the screen support plate is reduced compared to a screen support plate made entirely of metal.

[0007] Therefore, it can be seen that the screen support plate can balance weight, cost, shielding performance, rigidity, and heat dissipation performance.

[0008] As a non-limiting embodiment, the multilayer carbon fiber layer includes alternating stacked layers of highly thermally conductive carbon fibers and conventional carbon fiber layers.

[0009] Alternating stacked high thermal conductivity carbon fiber layers and conventional carbon fiber layers refer to a situation in which no two adjacent carbon fiber layers are both high thermal conductivity carbon fiber layers, nor are any two adjacent carbon fiber layers both conventional carbon fiber layers.

[0010] It should be noted that alternating stacking of high thermal conductivity carbon fiber layers and conventional carbon fiber layers has the following advantages: the stress distribution of the support layer is more uniform, which helps to improve the rigidity of the screen support plate; a more uniform temperature distribution can be achieved inside the support layer, reducing the risk of local overheating; and the high thermal conductivity carbon fiber layers, which have a high thermal conductivity coefficient, can form a good heat conduction channel when stacked with conventional carbon fiber layers, thereby improving the heat dissipation performance of the screen support plate.

[0011] As a non-limiting embodiment, the support layer consists of a conventional carbon fiber layer, a high thermal conductivity carbon fiber layer, and another conventional carbon fiber layer stacked sequentially.

[0012] In this configuration, the screen support plate comprises five layers: a metal shielding layer, a conventional carbon fiber layer, a high thermal conductivity carbon fiber layer, another conventional carbon fiber layer, and a metal shielding layer. The screen support plate is symmetrical about the high thermal conductivity carbon fiber layer. It can be understood that the support plate substrate has the same layered structure as the screen support plate. When the screen support plate has a symmetrical structure, the support plate substrate also has a symmetrical structure.

[0013] It should be noted that the stress distribution and material properties are more uniform in symmetrical structures. During the processing of the screen support plate, the support plate substrate needs to be hot-pressed to obtain the shielding support plate of the required thickness. When hot-pressing the support plate substrate with a symmetrical structure, the tensile deformation on both sides of the high thermal conductivity carbon fiber layer is more uniform, and the resulting screen support plate 120 is less likely to curl to one side, making the front and back of the screen support plate flatter.

[0014] Because the front of the screen support plate contacts the back of the display screen, a flatter front of the screen support plate results in better contact with the back of the display screen, leading to better thermal conductivity and heat dissipation. Furthermore, the shielding support plate has fewer textures on its front, making it less likely to affect the display screen's performance due to the top screen.

[0015] Furthermore, in this screen support plate's five-layer stack, only one layer of high-cost, high-thermal-conductivity carbon fiber is included, while the other four layers are lower-cost conventional carbon fiber layers and a metal shielding layer. Compared to other screen support plates with multiple layers of high-thermal-conductivity carbon fiber, this screen support plate offers better heat dissipation performance at a relatively lower cost.

[0016] As a non-limiting embodiment, the layup angle of the high thermal conductivity carbon fiber layer is 0°; the layup angle of the conventional carbon fiber layer is 90°. When the layup angle of the high thermal conductivity carbon fiber layer is 0°, the high thermal conductivity carbon fiber layer primarily bears the load in the length direction of the screen support plate, while the fibers in the 90° direction bear the load in the width direction of the screen support plate. This alternating layup method can improve the bending resistance of the screen support plate.

[0017] As a non-limiting embodiment, the ratio of the thickness of the high thermal conductivity carbon fiber layer to the thickness of the screen support plate is 1 / 4 to 2 / 3. It should be noted that if the thickness of the high thermal conductivity carbon fiber layer is too large, the cost will increase significantly; if the thickness is too small, the heat dissipation performance of the screen support plate will be poor. Therefore, this embodiment provides a ratio of 1 / 4 to 2 / 3 between the thickness of the high thermal conductivity carbon fiber layer and the thickness of the screen support plate, thus achieving a balance between cost and heat dissipation performance of the screen support plate.

[0018] As a non-limiting embodiment, the ratio of the thickness of the metal shielding layer to the thickness of the screen support plate is 1 / 13 to 1 / 5. It should be noted that because metal has a high density, an excessively thick metal shielding layer would result in a heavy screen support plate. Therefore, this embodiment provides a ratio of 1 / 13 to 1 / 5 between the thickness of the metal shielding layer and the thickness of the screen support plate, thus achieving good heat dissipation performance while reducing the weight of the screen support plate.

[0019] As a non-limiting embodiment, the thickness of the conventional carbon fiber layer is less than that of the high thermal conductivity carbon fiber layer. It should be noted that because the conventional carbon fiber layer has a low thermal conductivity, it should not be too thick; otherwise, the heat dissipation performance will be significantly affected. This embodiment uses a thickness of less than that of the high thermal conductivity carbon fiber layer to ensure that the lower thermal conductivity of the conventional carbon fiber layer does not negatively impact the heat dissipation performance of the screen support plate.

[0020] As a non-limiting embodiment, the metal shielding layer is aluminum foil or copper foil.

[0021] Aluminum foil is a thin film material formed from aluminum-containing materials, which can be aluminum alloys or pure aluminum. Aluminum-containing materials have a high thermal conductivity, typically above 120 W / (m·K), while pure aluminum has a thermal conductivity of approximately 235 W / (m·K), which meets the thermal conductivity requirements of the aforementioned metal shielding layers.

[0022] Copper foil is a thin film material formed from copper-containing materials, which can be copper alloys or pure copper. Copper-containing materials have a high thermal conductivity, typically above 200 W / (m·K), while pure copper has a thermal conductivity of approximately 401 W / (m·K), which meets the thermal conductivity requirements of the aforementioned metal shielding layers.

[0023] In this embodiment, aluminum foil or copper foil can be hot-pressed to form a metal shielding layer, eliminating the need for additional physical vapor deposition (PVD) or other coating processes, which can significantly reduce production costs.

[0024] It should be noted that the thickness of the aluminum foil or copper foil is 0.005mm to 0.2mm, which is relatively small. This embodiment uses aluminum foil or copper foil with a relatively small thickness as the metal shielding layer, so that the screen support plate can achieve shielding performance without causing excessive weight.

[0025] As a non-limiting embodiment, the thermal conductivity of the high thermal conductivity carbon fiber layer is greater than or equal to 250 W / (m·K). When the thermal conductivity of the high thermal conductivity carbon fiber layer is greater than or equal to 250 W / (m·K), the heat dissipation performance of the screen support plate can be significantly improved, thereby enhancing the heat dissipation effect of the screen support plate on the display screen.

[0026] It should be noted that conventional carbon fiber layers have a relatively low thermal conductivity, typically around 50 W / (m·K), for example, the commonly used PAN-based carbon fiber layer has a thermal conductivity of approximately 20 W / (m·K). Given the low thermal conductivity of low-cost conventional carbon fiber layers, this embodiment improves the thermal conductivity of the screen support plate by increasing the thermal conductivity of the high-thermal-conductivity carbon fiber layer, thereby balancing the thermal conductivity of the screen support plate and ultimately enhancing its heat dissipation effect.

[0027] In practice, the thermal conductivity of the high thermal conductivity carbon fiber layer can be increased by increasing the carbon fiber content.

[0028] Secondly, embodiments of this application provide a display module. The display module includes a display screen and a screen support plate as described in any embodiment of the first aspect. The screen support plate is disposed on the back of the display screen and fixedly connected to it.

[0029] It should be noted that the beneficial effects of the display module provided in the second aspect can be found in the relevant description of the screen support plate in any embodiment of the first aspect above, and will not be repeated here.

[0030] Thirdly, embodiments of this application provide an electronic device. The electronic device includes a display module, a back cover, and a frame as described in any of the second aspects. The back cover is disposed on the backlight side of the display module. The frame surrounds the side of the back cover and the side of the display module, and is fixedly connected to the display module and the back cover, respectively.

[0031] It should be noted that the beneficial effects of the electronic device provided in the third aspect can be found in the relevant description of the display module provided in the second aspect above, and will not be repeated here. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0033] Figure 2 for Figure 1 The diagram shown is an exploded view of the electronic device.

[0034] Figure 3 for Figure 2 An exploded view of the display module's structure.

[0035] Figure 4A cross-sectional schematic diagram of a screen support plate provided in an embodiment of this application;

[0036] Figure 5 A cross-sectional schematic diagram of the screen support plate provided for related technology 1;

[0037] Figure 6 A cross-sectional schematic diagram of the screen support plate provided for related technology 2;

[0038] Figure 7 for Figure 4 The temperature distribution comparison diagram of the screen support plate shown in Related Technology 1 and Related Technology 3;

[0039] Figure 8 for Figure 4 The displacement cloud diagram of the screen support plate shown in the related technology;

[0040] Figure 9 for Figure 4 The equivalent stress cloud diagram of the screen support plate shown in the related technology 1;

[0041] Figure 10 for Figure 4 The diagram shows the manufacturing process of the screen support plate. Detailed Implementation

[0042] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0043] In the description of this application, it should be understood that the terms "length", "width", "thickness", "top", "bottom", "inner", "outer", "upper", "lower", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0044] The terms "first," "second," "third," and "fourth," etc., are used only for distinguishing descriptions and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. For example, "first swing arm" and "second swing arm" are merely used to distinguish different swing arms and do not limit their order. The first swing arm can also be named the second swing arm, and the second swing arm can also be named the first swing arm, without departing from the scope of the various described embodiments. Furthermore, the terms "first," "second," "third," and "fourth," etc., do not imply that the indicated features must be different.

[0045] In this application, unless otherwise expressly specified and limited, the terms "connected," "linked," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part. The relationship between two components defined by the terms "connected," "linked," "fixed," etc., can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0046] In this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist; for example, A and / or B can represent three cases: A alone, A and B simultaneously, and B alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0047] It should be noted that in this application, the words "in some embodiments," "exemplarily," and "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described in this application as "in some embodiments," "exemplarily," or "for example" should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of the words "in some embodiments," "exemplarily," and "for example" is intended to present the relevant concepts in a specific manner.

[0048] In the embodiments of this application, the numerical range X to Y is understood to mean that it can take the two endpoint values ​​of X and Y, as well as any value between the two endpoint values ​​of X and Y.

[0049] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments.

[0050] First, the technical terms involved in the embodiments of this application will be explained.

[0051] I. Stiffness

[0052] Stiffness refers to the ability of a material or structure to resist deformation. The greater the stiffness, the less deformation the structure undergoes when subjected to stress.

[0053] II. Bending Modulus

[0054] Flexural modulus is a physical quantity that describes the resistance of a material or structure to bending loads. It measures the material's or structure's ability to resist bending deformation, i.e., bending stiffness. The larger the flexural modulus, the greater the bending stiffness.

[0055] III. Thermal conductivity

[0056] Thermal conductivity is a physical quantity that describes the thermal conductivity of a material. It reflects the amount of heat passing through the material per unit time under a unit temperature difference and unit area. Its unit is W / (m·K), read as watts per meter per Kelvin.

[0057] For example, please refer to the reference Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of an electronic device 000 provided in an embodiment of this application. Figure 2 for Figure 1 The diagram shows an exploded view of the structure of electronic device 000.

[0058] The electronic device 000 is a mobile phone. For ease of description below, an XYZ coordinate system is established, defining the width direction of the electronic device 000 as the X-axis, the length direction as the Y-axis, and the thickness direction as the Z-axis. It should be noted that the coordinate system settings of the electronic device 000 can be flexibly set according to actual needs.

[0059] Electronic device 000 includes display module 100, back cover 200, Figure 2 The image shows the mid-frame 300 and the front-facing camera module 400. This is understandable. Figure 1 and Figure 2 The electronic device 000 is shown only schematically, and the actual shape, size, location, and construction of these components are not subject to change. Figure 1 and Figure 2 The limitations. Furthermore, in other embodiments of this application, the electronic device 000 may include more or fewer components than illustrated, or combine some components, or split some components, or have different component arrangements.

[0060] Display module 100 is used to display images, videos, and other display content. Display module 100 can be a flexible display or a rigid display. For example, the display can be an organic light-emitting diode (OLED) display, an active-matrix organic light-emitting diode (AMOLED) display, a mini organic light-emitting diode (MLED) display, a micro organic light-emitting diode (MOLED) display, a quantum dot light-emitting diode (QLED) display, or a liquid crystal display (LCD).

[0061] For mobile phones, the display module 100 is roughly rectangular plate-shaped, meaning that its length and width are significantly greater than its thickness. Figure 1 In the diagram, the length direction of the display module 100 is the Y-axis direction, the width direction of the display module 100 is the X-axis direction, and the thickness direction of the display module 100 is the Z-axis direction.

[0062] The display module 100 includes a back surface and a display surface (the surface shown in the figure is the display surface of the display module 100) that are positioned opposite each other in the Z-axis direction. The display surface of the display module 100 is used to display the aforementioned images, videos, and other display content.

[0063] The back cover 200, also known as the battery cover, is used to protect the internal electronic components of the electronic device 000. The back cover 200 is located on the backlight side of the display module 100 and is stacked with the display module 100. It can be understood that the light-emitting side of the display module 100 is the side facing the display surface of the display module 100, and the side opposite the light-emitting side of the display module 100 is the backlight side of the display module 100.

[0064] like Figure 2As shown, a camera decorative cover 210 is provided on the back cover 200 to protect and decorate the rear camera module. This camera decorative cover 210 can be made of transparent material to allow light to enter the rear camera module through the cover 210, thereby enabling the rear camera function. It should be noted that the rear camera module is fixed in the housing space of the electronic device 000, for example, fixed to the middle plate 320 of the middle frame 300, with the light-incident surface facing the camera decorative cover 210 mounted on the back cover 200. Due to its orientation, the rear camera module is not shown in the figure.

[0065] The mid-frame 300 is located between the display module 100 and the back cover 200 and is used to mount the internal functional components of the electronic device 000. The mid-frame 300 includes a bezel 310 and a mid-plate 320.

[0066] The bezel 310 surrounds the side of the display module 100 and the side of the back cover 200, and is fixedly connected to the display module 100 and the back cover 200 respectively.

[0067] It should be noted that the four surfaces of the display module 100—two facing away from each other in the Y-axis direction and two facing away from each other in the X-axis direction—connected end to end in the order shown in the diagram, form the side surface of the display module 100. Similarly, the four surfaces of the back cover 200—two facing away from each other in the Y-axis direction and two facing away from each other in the X-axis direction—connected end to end in the order shown in the diagram, form the side surface of the back cover 200.

[0068] For example, the bezel 310 can be fixedly connected to the display module 100 and the back cover 200 respectively by adhesive. In some other embodiments, the bezel 310 and the back cover 200 can also be integrally formed, that is, the bezel 310 and the back cover 200 are a single structure. It can be understood that the display module 100, the back cover 200, and the bezel 310 together enclose the receiving space of the electronic device 000, so as to place the functional components of the electronic device 000, such as the front-facing camera module 400, the motherboard, the battery, etc., through the receiving space, while providing a sealing and protection function for the functional components located in the receiving space.

[0069] The middle plate 320 is stacked between the back cover 200 and the display module 100, and is fixed around the inner surface of the frame 310. Exemplarily, the middle plate 320 can be fixed to the frame 310 by welding; alternatively, the middle plate 320 can be integrally formed with the frame 310. The middle plate 320 serves as the structural "skeleton" of the electronic device 000, and is used to mount functional components of the electronic device 000, such as the motherboard and the front-facing camera module 400. The front-facing camera module 400 can be fixed and supported on the middle plate 320 by means of threaded connection, snap-fit, welding, etc.

[0070] The front-facing camera module 400 is used for taking photos / videos. To enable the front-facing camera function, a light-transmitting area 100a is provided on the display module 100. The light-incident surface of the front-facing camera module 400 is directly opposite the light-transmitting area 100a so that light can enter the front-facing camera module 400 through the light-transmitting area 100a, thereby enabling the front-facing camera function.

[0071] For example, please refer to Figure 3 , Figure 3 for Figure 2 An exploded view of the structure of the display module 100.

[0072] The display module 100 includes a display screen 110 and a screen support plate 120. It is understood that... Figure 3 The display module 100 is shown only schematically, and the actual shape, size, position, and construction of these components are not subject to change. Figure 3 The limitations. Furthermore, in other embodiments of this application, the display module 100 may include more or fewer components than illustrated, or combine some components, or split some components, or have different component arrangements.

[0073] Display screen 110 refers to a component that can present display content to a user, including a display panel, driving circuit, glass cover, and other components. The display panel is the core component of display screen 110, responsible for actually displaying images and other display content. The thickness direction of display screen 110 is the Z-axis direction, and display screen 110 also includes a back surface and a display surface that are set opposite to each other in the Z-axis direction. The display surface of display screen 110 provides the display surface for display module 100.

[0074] The screen support plate 120 is stacked on the back of the display screen 110 and is fixedly connected to the back of the display screen 110 to support the display screen 110.

[0075] The screen support plate 120 has its length along the Y-axis, its width along the X-axis, and its thickness along the Z-axis. The screen support plate 120 includes a back side and a front side facing away from each other along the Z-axis, with the front side of the screen support plate 120 opposite to and in contact with the back side of the display screen 110. Figure 3 In the middle, the back of the screen support plate 120 provides the back of the display module 100.

[0076] For example, please refer to Figure 4 , Figure 4 This is a cross-sectional schematic diagram of a screen support plate 120 provided in an embodiment of this application. Figure 4 It can be understood as along Figure 3 The diagram shows a partial cross-section obtained by cutting the screen support plate 120 with the cutting line PP shown.

[0077] The screen support plate 120 includes a support layer 121 and two metal shielding layers 122, with the two metal shielding layers 122 sandwiching the support layer 121 in the middle.

[0078] First, the support layer 121 will be described by example.

[0079] The support layer 121 is the main supporting layer in the screen support plate 120, and therefore, the support layer 121 has good rigidity.

[0080] Figure 4 In this structure, the support layer 121 comprises multiple layers of carbon fiber M. Because the carbon fiber layers M have a high flexural modulus, the support layer 121 exhibits high stiffness. Furthermore, the carbon fiber layers M also have a low density, which makes the support layer 121 lightweight.

[0081] The multilayer carbon fiber layer M includes a high thermal conductivity carbon fiber layer M1 and a conventional carbon fiber layer M2. The terms high thermal conductivity carbon fiber layer M1 and conventional carbon fiber layer M2 are relative concepts in terms of thermal conductivity; the thermal conductivity of conventional carbon fiber layer M2 is lower than that of high thermal conductivity carbon fiber layer M1.

[0082] In this embodiment, the high thermal conductivity carbon fiber layer M1 is a carbon fiber layer with a thermal conductivity greater than 100 W / (m·K); the conventional carbon fiber layer M2 is a carbon fiber layer with a thermal conductivity less than 50 W / (m·K).

[0083] For example, Figure 4 The high thermal conductivity carbon fiber layer M1 can be manufactured from high thermal conductivity pitch-based carbon fiber prepreg. High thermal conductivity pitch-based carbon fiber prepreg mainly consists of high thermal conductivity pitch-based carbon fibers and resin. In this case, the high thermal conductivity carbon fiber layer M1 is also called high thermal conductivity pitch-based carbon fiber M1.

[0084] High thermal conductivity pitch-based carbon fiber can be produced by converting mesophase pitch through processes such as spinning, pre-oxidation, carbonization, and graphitization. In specific implementation, high thermal conductivity pitch-based carbon fiber is mixed with resin (such as epoxy resin, polyester resin, etc.), and the resin is uniformly penetrated into each carbon fiber through methods such as soaking or coating to obtain high thermal conductivity pitch-based carbon fiber prepreg.

[0085] For example, Figure 4 The conventional carbon fiber layer M2 can be made from polyacrylonitrile (PAN) carbon fiber prepreg. PAN carbon fiber prepreg is mainly composed of polypropylene-based carbon fibers and resin. In this case, the conventional carbon fiber layer M2 is also called PAN-based carbon fiber layer M2.

[0086] Polypropylene-based carbon fiber, also known as PAN-based carbon fiber, is made from polyacrylonitrile (PAN) as the main raw material through processes such as polymerization, spinning, oxidation, and carbonization. Specifically, PAN-based carbon fiber is obtained by mixing polypropylene-based carbon fiber with resin (such as epoxy resin or polyester resin) and then using methods such as impregnation or coating to ensure the resin evenly penetrates each carbon fiber. Compared to PAN-based carbon fiber, high thermal conductivity pitch-based carbon fiber has extremely high thermal conductivity, higher tensile modulus, and lower coefficient of thermal expansion, but its raw material preparation is more complex and its cost is higher.

[0087] Please refer to Table 1, which is a comparison table of the properties of high thermal conductivity pitch-based carbon fiber and polyacrylonitrile carbon fiber provided in the embodiments of this application.

[0088] Table 1

[0089]

[0090] As shown in Table 1, both PAN-based carbon fiber and high thermal conductivity pitch-based carbon fiber have the characteristics of low density (less than or equal to 2 g / cm3 is considered low density), high flexural modulus (greater than 70 GPa is considered high flexural modulus), and inability to shield electrical signals.

[0091] Furthermore, the thermal conductivity of high thermally conductive pitch-based carbon fiber is relatively high, reaching 300 W / (m·K), which can meet the thermal conductivity requirements of the aforementioned high thermally conductive carbon fiber layer M1. Moreover, by adjusting the carbon fiber content in the high thermally conductive pitch-based carbon fiber, its thermal conductivity and flexural modulus can be adjusted to 300 W / (m·K) to 1500 W / (m·K), or even higher; while the thermal conductivity of PAN-based carbon fiber is relatively low, as low as 20 W / (m·K).

[0092] It should be noted that higher thermal conductivity leads to more complex manufacturing processes, procedures, and materials, resulting in higher costs. Therefore, the cost of high thermal conductivity carbon fiber layer M1 is higher than that of conventional carbon fiber layer M2. For example, the cost of the aforementioned high thermal conductivity pitch-based carbon fiber layer M1 is higher than that of PAN-based carbon fiber layer M2.

[0093] In the multilayer carbon fiber layer M, any two adjacent carbon fiber layers M are cross-laid. Cross-laying means that the fiber orientations of the two carbon fiber layers M are crossed. The cross-alignment of the fiber orientations of adjacent carbon fiber layers M can increase the stiffness of the support layer 121, thereby increasing the stiffness of the screen support plate 120.

[0094] Next, the metal shielding layer 122 will be described by way of example.

[0095] Metals possess electromagnetic shielding properties; therefore, the metal shielding layer 122 is the main layer in the screen support plate 120 that serves to shield electromagnetic signals. For ease of distinction, in this embodiment, the two metal shielding layers 122 are referred to as the first metal shielding layer 1221 and the second metal shielding layer 1222, respectively. The first metal shielding layer 1221 is stacked on the first surface of the support layer 121 (i.e., the upper surface in the figure), and the second metal shielding layer 1222 is stacked on the second surface of the support layer 121 facing away from the first surface (i.e., the lower surface in the figure).

[0096] Due to the presence of the conventional carbon fiber layer M2, Figure 4 The thermal conductivity of the screen support plate 120 shown is reduced. In order to give the screen support plate 120 better thermal conductivity, the thermal conductivity of the metal shielding layer 122 is greater than 120 W / (m·K) to balance the thermal conductivity reduced by the conventional carbon fiber layer M2.

[0097] Please refer to Table 2, which is a comparison table of the properties of four metals provided in the embodiments of this application.

[0098] Table 2

[0099]

[0100] As shown in Table 2, stainless steel and titanium alloys have low thermal conductivity, while aluminum alloys and copper foil have high thermal conductivity, which can meet the thermal conductivity requirements of the metal shielding layer 122. Based on this, the metal shielding layer 122 can be a laminate formed of aluminum-containing or copper-containing materials.

[0101] As a non-limiting embodiment, the metal shielding layer 122 is aluminum foil or copper foil. Figure 4 In the middle, the metal shielding layer 122 is aluminum foil.

[0102] Aluminum foil is a thin film material formed from aluminum-containing materials, which can be aluminum alloys or pure aluminum. Aluminum-containing materials have a high thermal conductivity, typically above 120 W / (m·K), while pure aluminum has a thermal conductivity of approximately 235 W / (m·K), which meets the thermal conductivity requirements of the aforementioned metal shielding layer 122.

[0103] Copper foil is a thin film material formed from copper-containing materials, which can be copper alloys or pure copper. Copper-containing materials have a high thermal conductivity, typically above 200 W / (m·K), while pure copper has a thermal conductivity of approximately 401 W / (m·K), which meets the thermal conductivity requirements of the aforementioned metal shielding layer 122.

[0104] In this embodiment, aluminum foil or copper foil can be hot-pressed to form a metal shielding layer 122, eliminating the need for additional physical vapor deposition (PVD) or other coating processes, which can significantly reduce production costs.

[0105] It should be noted that the thickness of the aluminum foil or copper foil is 0.005mm to 0.2mm, which is relatively small. In this embodiment, aluminum foil or copper foil with a relatively small thickness is selected as the metal shielding layer 122, so that the screen support plate 120 can achieve shielding performance without causing excessive weight.

[0106] The following is combined Figures 5 to 6 ,right Figure 4 The design concept of the screen support plate 120 shown is compared and analyzed.

[0107] In related technology one, such as Figure 5 As shown, the screen support plate 120 is entirely formed by stacking high thermal conductivity carbon fiber layers M1. Although it has good thermal conductivity, light weight, and good rigidity, it is expensive and has no shielding performance.

[0108] In related technology two, such as Figure 6 As shown, the screen support plate 120 is entirely formed by stacking conventional carbon fiber layers M2. Although it has low cost, light weight and good rigidity, its thermal conductivity is low, resulting in poor heat dissipation performance and no shielding performance.

[0109] In related technology three, the screen support plate 120 can be obtained from a metal plate through processes such as stamping, etching, and CNC machining. Although it has signal shielding properties, its high density results in a large weight.

[0110] As can be seen from related technologies one through three, the current screen support plate 120 cannot simultaneously achieve the desired balance between weight, cost, shielding performance, and heat dissipation performance.

[0111] Figure 4 The screen support plate 120 shown can balance weight, cost, shielding performance, rigidity, and heat dissipation performance.

[0112] Specifically Figure 4 In the screen support plate 120 shown, the support layer 121, which mainly plays a supporting role, comprises multiple layers of carbon fiber M, with adjacent layers of carbon fiber M being cross-laid. The stiffness of the support layer 121 is synergistically enhanced by the high flexural modulus of the carbon fiber layers M and the fiber cross-orientation of the multiple layers of carbon fiber M, thereby giving the screen support plate 120 good stiffness. The multiple layers of carbon fiber M utilize a mixture of conventional carbon fiber layers M2 and high thermal conductivity carbon fiber layers M1, and are not entirely made of high-cost high thermal conductivity carbon fiber layers M1, compared to... Figure 5Compared to the technology solution where all layers are stacked with high thermal conductivity carbon fiber M1, the cost can be reduced. At the same time, by adding a metal shielding layer 122 with a thermal conductivity greater than 120 W / (m·K) and a high thermal conductivity carbon fiber layer M1 with a thermal conductivity greater than 100 W / (m·K), the screen support plate 120 not only has shielding performance but also compensates for the reduced thermal conductivity caused by the conventional carbon fiber layer M2. Figure 4 The screen support plate 120 shown is compared to Figure 6 The screen support plate 120 shown can achieve good heat dissipation performance. Because the added metal shielding layer 122 is only a part of the stack of the screen support plate 120, and not the entire screen support plate 120, and the other part of the stack of the screen support plate 120 is a low-density carbon fiber layer M, this allows for better heat dissipation. Figure 4 The screen support plate 120 shown is lighter than that of related technology three. Therefore, it can be seen that... Figure 4 The screen support plate 120 shown can balance weight, cost, shielding performance, rigidity, and heat dissipation performance.

[0113] As a non-limiting embodiment, please continue to refer to Figure 4 The multilayer carbon fiber layer M includes alternating stacked high thermal conductivity carbon fiber layers M1 and conventional carbon fiber layers M2.

[0114] Alternating stacked high thermal conductivity carbon fiber layers M1 and conventional carbon fiber layers M2 means that in a multilayer carbon fiber layer M, there is no situation where two adjacent carbon fiber layers M are both high thermal conductivity carbon fiber layers M1, nor is there a situation where two adjacent carbon fiber layers M are both conventional carbon fiber layers M2.

[0115] for example, Figure 4 The three carbon fiber layers M shown are, respectively, a conventional carbon fiber layer M2, a high thermal conductivity carbon fiber layer M1, and a conventional carbon fiber layer M2 stacked sequentially along the Z-axis. In these three carbon fiber layers M, there are no adjacent high thermal conductivity carbon fiber layers M1, nor are there adjacent conventional carbon fiber layers M2. Of course, in some other embodiments, the support layer 121 may contain more or fewer carbon fiber layers M, and this application does not limit this.

[0116] Taking the support layer 121 as an example containing four carbon fiber layers M, the alternating stacked high thermal conductivity carbon fiber layer M1 and conventional carbon fiber layer M2 can be as follows: conventional carbon fiber layer M2, high thermal conductivity carbon fiber layer M1, conventional carbon fiber layer M2, high thermal conductivity carbon fiber layer M1; or, high thermal conductivity carbon fiber layer M1, conventional carbon fiber layer M2, high thermal conductivity carbon fiber layer M1, conventional carbon fiber layer M2.

[0117] Taking the support layer 121 as an example containing five carbon fiber layers M, the alternating stacked high thermal conductivity carbon fiber layer M1 and conventional carbon fiber layer M2 can be as follows: high thermal conductivity carbon fiber layer M1, conventional carbon fiber layer M2, high thermal conductivity carbon fiber layer M1, conventional carbon fiber layer M2, high thermal conductivity carbon fiber layer M1; or, conventional carbon fiber layer M2, high thermal conductivity carbon fiber layer M1, conventional carbon fiber layer M2, high thermal conductivity carbon fiber layer M1, conventional carbon fiber layer M2.

[0118] It should be noted that alternating stacking of high thermal conductivity carbon fiber layer M1 and conventional carbon fiber layer M2 has at least the following advantages:

[0119] (i) The stress distribution of the support layer 121 is more uniform, which helps to improve the rigidity of the screen support plate 120.

[0120] (ii) A more uniform temperature distribution can be achieved inside the support layer 121, reducing the risk of local overheating.

[0121] (III) The high thermal conductivity carbon fiber layer M1 has a high thermal conductivity. When stacked alternately with the conventional carbon fiber layer M2, it can form a good heat conduction channel and improve the heat dissipation performance of the screen support plate 120.

[0122] As a non-limiting embodiment, please continue to refer to Figure 4 When the support layer 121 includes a conventional carbon fiber layer M2, a high thermal conductivity carbon fiber layer M1 and a conventional carbon fiber layer M2 stacked in sequence, the screen support plate 120 includes a total of five layers, namely: metal shielding layer 122, conventional carbon fiber layer M2, high thermal conductivity carbon fiber layer M1, conventional carbon fiber layer M2 and metal shielding layer 122. The screen support plate 120 is symmetrical about the high thermal conductivity carbon fiber layer M1.

[0123] It is understandable that the support plate substrate has the same laminated structure as the screen support plate 120. When the screen support plate 120 has a symmetrical structure, the support plate substrate also has a symmetrical structure.

[0124] It should be noted that the stress distribution and material properties are more uniform in symmetrical structures. During the processing of the screen support plate 120, the support plate substrate needs to be hot-pressed to obtain a shielding support plate of the required thickness. When hot-pressing the support plate substrate with a symmetrical structure, the tensile deformation on both sides of the high thermal conductivity carbon fiber layer M1 is more uniform, and the resulting screen support plate 120 is less likely to curl to one side, making the front and back of the screen support plate 120 flatter.

[0125] Since the front of the screen support plate 120 contacts the back of the display screen 110, and the front of the screen support plate 120 is flatter, on the one hand, it fits better with the back of the display screen 110, resulting in better heat conduction and better heat dissipation for the display screen 110; on the other hand, the front of the shielding support plate has less texture, making it less likely to affect the display effect of the display screen 110 due to the top screen.

[0126] Furthermore, in the five-layer stack of the screen support plate 120, the high-cost, high-thermal-conductivity carbon fiber layer M1 is only provided once, while the other four layers are the lower-cost conventional carbon fiber layer M2 and the metal shielding layer 122. Compared with other screen support plates 120 with multiple layers of high-thermal-conductivity carbon fiber layers M1, the cost of this screen support plate 120 is relatively low.

[0127] As a non-limiting embodiment, please continue to refer to Figure 4 The high thermal conductivity carbon fiber layer M1 has a layup angle of 0°, represented by a horizontal line along the Y-axis in the figure. The conventional carbon fiber layer M2 has a layup angle of 90°, represented by dots in the figure. The layup angle refers to the angle between the fiber orientation of the carbon fiber and the Y-axis. In this case, the fiber orientation of the high thermal conductivity carbon fiber layer M1 and the fiber orientation of the conventional carbon fiber layer M2 are orthogonal.

[0128] When the layup angle of the high thermal conductivity carbon fiber layer M1 is 0°, the high thermal conductivity carbon fiber layer M1 mainly bears the load in the Y-axis direction, while the fibers in the 90° direction bear the load in the X-axis direction. This alternating layup method can improve the bending resistance of the screen support plate 120.

[0129] Of course, in some other embodiments, the layup angle of the high thermal conductivity carbon fiber layer M1 and the layup angle of the conventional carbon fiber layer M2 can be other angles. As long as the fiber orientation of the high thermal conductivity carbon fiber layer M1 and the fiber of the conventional carbon fiber layer M2 intersect, the rigidity of the screen support plate 120 can be enhanced.

[0130] As a non-limiting embodiment, please continue to refer to Figure 4 The ratio of the thickness of the high thermal conductivity carbon fiber layer M1 to the thickness of the screen support plate 120 is 1 / 4 to 2 / 3 (first condition).

[0131] by Figure 4 Taking the screen support plate 120 with a thickness of 0.25mm as an example, the thickness of the high thermal conductivity carbon fiber layer M1 is 0.0625mm to 0.166mm. For example, the thickness of the high thermal conductivity carbon fiber layer M1 can be 0.08mm, 0.10mm, 0.12mm, or 0.15mm. Figure 4 In the middle, the thickness of the high thermal conductivity carbon fiber layer M1 is 0.08 mm.

[0132] It should be noted that excessive thickness of the high thermal conductivity carbon fiber layer M1 leads to a significant increase in cost; conversely, insufficient thickness results in poor heat dissipation performance of the screen support plate 120. Therefore, in this embodiment, the ratio of the thickness of the high thermal conductivity carbon fiber layer M1 to the thickness of the screen support plate 120 is 1 / 4 to 2 / 3, thus achieving a balance between cost and heat dissipation performance of the screen support plate 120.

[0133] As a non-limiting embodiment, please continue to refer to Figure 4 The ratio of the thickness of the metal shielding layer 122 to the thickness of the screen support plate 120 is 1 / 13 to 1 / 5 (second condition).

[0134] Continue with Figure 4 Taking the screen support plate 120 as an example, which has a thickness of 0.25mm, the thickness of the metal shielding layer 122 is 0.019mm to 0.05mm. For example, the thickness of the metal shielding layer 122 is 0.02mm, 0.03mm, 0.04mm, or 0.05mm. Figure 4 In the middle, the thickness of the metal shielding layer 122 is 0.035mm.

[0135] It should be noted that, due to the high density of metal, an excessively thick metal shielding layer 122 would result in a heavy screen support plate 120. Therefore, in this embodiment, the thickness of the metal shielding layer 122 is in a ratio of 1 / 13 to 1 / 5 to the thickness of the screen support plate 120. This allows for good heat dissipation while reducing the weight of the screen support plate 120.

[0136] As a non-limiting embodiment, please continue to refer to Figure 4 The thickness of the conventional carbon fiber layer M2 is less than the thickness of the high thermal conductivity carbon fiber layer M1.

[0137] Figure 4 Taking the high thermal conductivity carbon fiber layer M1 with a thickness of 0.08 mm as an example, the thickness of the conventional carbon fiber layer M2 can be less than 0.08 mm. Because... Figure 4 The thickness of the screen support plate 120 is 0.25mm, the thickness of the metal shielding layer 122 is 0.035mm, therefore, the thickness of the conventional carbon fiber layer M2 is 0.05mm.

[0138] It should be noted that because the conventional carbon fiber layer M2 has a low thermal conductivity, it should not be too thick; otherwise, the heat dissipation performance will be significantly affected. Therefore, in this embodiment, the thickness of the conventional carbon fiber layer M2 is less than the thickness of the high thermal conductivity carbon fiber layer M1.

[0139] In practice, the thickness of the conventional carbon fiber layer M2 is adjusted according to the thickness requirements of the screen support plate 120. Specifically, after determining the thicknesses of the metal shielding layer 122 and the high thermal conductivity carbon fiber layer M1, the thickness of the conventional carbon fiber layer M2 = the thickness of the screen support plate 120 - the thickness of the metal shielding layer 122 * 2 - the thickness of the high thermal conductivity carbon fiber layer M1.

[0140] In order to make the thickness of the conventional carbon fiber layer M2 less than the thickness of the high thermal conductivity carbon fiber layer M1, the thickness of the high thermal conductivity carbon fiber layer M1 and the thickness of the metal shielding layer 122 can be determined to be a value that makes the thickness of the conventional carbon fiber layer M2 less than the thickness of the high thermal conductivity carbon fiber layer M1, provided that the thickness of the high thermal conductivity carbon fiber layer M1 and the thickness of the metal shielding layer 122 do not violate the aforementioned first and second conditions.

[0141] As a non-limiting embodiment, the thermal conductivity of the high thermal conductivity carbon fiber layer M1 is greater than or equal to 250 W / (m·K).

[0142] When the thermal conductivity of the high thermal conductivity carbon fiber layer M1 is greater than or equal to 250 W / (m·K), the thermal conductivity of the screen support plate 120 can be significantly improved, thereby improving the heat dissipation effect of the screen support plate 120 on the display screen 110.

[0143] It should be noted that the thermal conductivity of conventional carbon fiber layer M2 is relatively low, typically around 50 W / (m·K), for example, the thermal conductivity of commonly used PAN-based carbon fiber layer is approximately 20 W / (m·K). Given the low thermal conductivity of the low-cost conventional carbon fiber layer M2, this embodiment improves the thermal conductivity of the high-thermal-conductivity carbon fiber layer M1 to balance the thermal conductivity of the screen support plate 120, thereby improving the thermal conductivity performance of the screen support plate 120 and ultimately enhancing its heat dissipation effect.

[0144] In practice, the thermal conductivity of the high thermal conductivity carbon fiber layer M1 can be increased by increasing the carbon fiber content.

[0145] The following is combined Figure 7 and Figure 9 ,right Figure 4 The heat dissipation performance and rigidity are illustrated.

[0146] For example, please refer to Figure 7 , Figure 7 for Figure 4 The temperature distribution comparison diagram of the screen support plate 120 shown in Related Technology 1 and Related Technology 3 is as follows. In the diagram, the warmer the color, the higher the temperature; the cooler the color, the higher the temperature; the darkest blue has the lowest temperature; and the darkest red has the highest temperature.

[0147] Figure 4 The screen support plate 120 shown comprises the following layers: aluminum foil (0.035 mm thick), PAN-based carbon fiber layer M2 (specifically M40), high thermal conductivity pitch-based carbon fiber layer M1 (0.08 mm thick), PAN-based carbon fiber layer M2 (specifically M40, 0.05 mm thick), and aluminum foil (0.035 mm thick). The total thickness of the screen support plate 120 is 0.25 mm.

[0148] The screen support plate 120 shown in the related technology has the following stacks: three layers of high thermal conductivity carbon fiber M1, the thickness of a single layer of high thermal conductivity carbon fiber M1 (specifically, a high thermal conductivity asphalt base) is 0.08mm, and the thickness of the screen support plate 120 is approximately 0.25mm.

[0149] The screen support plate 120 shown in related technology 3 consists of layers of a 0.25mm thick metal plate with a thermal conductivity of 100W / (m·K).

[0150] The three screen support plates 120 have approximately the same thickness, 0.25 mm. The following thermal simulation tests were performed on these three screen support plates 120:

[0151] Thermal simulation boundary:

[0152] Heat flow (power: 5W; heat flow application size / mm: 50*50) is applied at the same position on the surface of the three screen support plates 120. Convection exists in the calculation condition. The heat flow and convection are applied at the same position on each screen support plate 120. The heat flow is applied in the middle area of ​​the screen support plate 120. It is assumed that the model only transfers heat through convection, and the convection area is the entire back of the screen support plate 120.

[0153] Thermal simulation results:

[0154] like Figure 7 As shown in (a) in the figure, Figure 4 The overall temperature distribution of the screen support plate 120 shown is as follows: the highest temperature is 65.671℃, the lowest temperature is 24.409℃, the temperature difference is about 41℃, the temperature is highest at the heat source, and the temperature is lowest at the edge of the screen support plate 120.

[0155] like Figure 7 As shown in (b) of the related art, the overall temperature distribution of the screen support plate 120 is as follows: the highest temperature is 65.405℃, the lowest temperature is 23.575℃, the temperature difference is 41.8℃, the temperature is highest at the heat source, and the temperature is lowest at the edge of the screen support plate 120.

[0156] like Figure 7As shown in (c) of the related technology, the overall temperature distribution of the screen support plate 120 is as follows: the highest temperature is 65.616℃, the lowest temperature is 24.13℃, the temperature difference is 41.486℃, the temperature is highest at the heat source, and the temperature is lowest at the edge of the screen support plate 120.

[0157] As can be seen, the temperature differences among the three are similar. It should be noted that the magnitude of the temperature difference can represent heat dissipation performance. The larger the temperature difference, the better the heat dissipation performance. The similar temperature differences among the three in the diagram indicate that their heat dissipation performance is similar. Clearly, Figure 4 While the heat dissipation performance of the screen support plate 120 shown is close to that of the screen support plate 120 shown in related technology, the cost is lower; and... Figure 4 The screen support plate 120 shown has heat dissipation performance close to that of the screen support plate 120 shown in related technology 3, but is lighter in weight.

[0158] For example, please refer to Figure 8 and Figure 9 , Figure 8 for Figure 4 The displacement cloud diagram of the screen support plate 120 shown in the related technology; Figure 9 for Figure 4 Equivalent stress cloud diagram of screen support plate 120 shown in related technology 1.

[0159] Figure 8 In the diagram, the warmer the color, the greater the position displacement; the cooler the color, the smaller the position displacement; the darkest blue has the smallest displacement, while the darkest red has the largest displacement.

[0160] Figure 9 In the diagram, the warmer the color, the greater the stress; the cooler the color, the less the stress; the darkest blue has the least stress, while the darkest red has the greatest stress.

[0161] Figure 4 The screen support plate 120 shown comprises the following layers: aluminum foil (0.035 mm thick), PAN-based carbon fiber layer M2 (specifically M40), high thermal conductivity pitch-based carbon fiber layer M1 (0.08 mm thick), PAN-based carbon fiber layer M3 (specifically M40, 0.05 mm thick), and aluminum foil (0.035 mm thick). The total thickness of the screen support plate 120 is 0.25 mm.

[0162] The screen support plate 120 shown in the related technology has the following layers: three layers of high thermal conductivity asphalt-based carbon fiber layer M1, the thickness of a single layer of high thermal conductivity asphalt-based carbon fiber layer M1 is 0.083mm, and the thickness of the screen support plate 120 is 0.25mm.

[0163] The two screen support plates 120 have the same thickness, 0.25 mm. The following mechanical simulation test was performed on these two screen support plates 120:

[0164] Mechanical simulation boundary: Both screen support plates 120 are fixed around the perimeter, and a force of 0.4N is applied downward in the central area.

[0165] Force simulation results:

[0166] like Figure 8 As shown in (a) in the figure, Figure 4 The screen support plate 120 shown, under stress, exhibits a maximum deformation of 0.77 mm, with the maximum deformation located at the center of the screen support plate 120. Figure 8 As shown in (b) of the related art, the maximum deformation of the screen support plate 120 after being subjected to force is 1.0427 mm, and the maximum deformation is located at the center of the screen support plate 120.

[0167] like Figure 9 As shown in (a) in the figure, Figure 4 The maximum stress on the screen support plate 120 shown is 8.97 MPa after being subjected to force; Figure 9 As shown in (b) of the related art, the maximum stress of the screen support plate 120 after being subjected to force is 12.17 MPa.

[0168] visible, Figure 4 The maximum stress of the screen support plate 120 shown is about 3.2 MPa lower than the maximum stress of the screen support plate 120 shown in related art. Therefore, Figure 4 The screen support plate 120 shown has stronger bending resistance and better rigidity. It is evident that... Figure 4 The screen support plate 120 shown has better heat dissipation performance than the screen support plate 120 shown in related art, but with better rigidity.

[0169] The following is combined Figure 10 ,right Figure 4 The manufacturing process of the screen support plate 120 shown is illustrated by way of example.

[0170] First, the high thermal conductivity pitch-based carbon fiber prepreg, PAN-based carbon fiber prepreg, and aluminum foil are cut into the required shapes.

[0171] Secondly, high thermal conductivity pitch-based carbon fiber prepreg is used as the middle layer and laid at 0°; PAN-based carbon fiber prepreg is laid at 90° on both sides of the high thermal conductivity pitch-based carbon fiber prepreg; and an aluminum foil layer is laid at the outermost symmetrical position to obtain the prepreg support plate substrate.

[0172] Finally, the prepreg support plate substrate is hot-pressed to obtain... Figure 4The screen support plate 120 shown has a thickness of 0.25 mm.

[0173] Because the density of aluminum foil itself is approximately 2.0 g / cm³. 3 The density of the other layers in the screen support plate 120 is less than 2.0 g / cm³. 3 Approximately 1.6 g / cm³ 3 This makes Figure 4 The density of the screen support plate 120 shown is less than 2.0 g / cm³. 3 Due to the high thermal conductivity of the pitch-based carbon fiber layer M1 and the PAN-based carbon fiber layer M2, the high flexural modulus makes... Figure 4 The flexural modulus of the screen support plate 120 shown is above 80 GPa, which is greater than that of the aluminum foil (70 GPa). The high thermal conductivity of the high thermal conductivity of the pitch-based carbon fiber layer M1 and the aluminum foil balances the low thermal conductivity of the PAN-based carbon fiber layer M2, resulting in… Figure 4 The thermal conductivity of the screen support plate 120 shown is above 70 W / (m·K), which is greater than the thermal conductivity of the PAN-based carbon fiber layer M2 (20 W / (m·K)).

[0174] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application.

Claims

1. A screen support plate, characterized in that, include: Support layer; the support layer includes multiple carbon fiber layers; the multiple carbon fiber layers include high thermal conductivity carbon fiber layers and conventional carbon fiber layers; in the multiple carbon fiber layers, any two adjacent carbon fiber layers are cross-laid; Two metal shielding layers; one of the metal shielding layers is stacked on the first surface of the support layer, and the other metal shielding layer is stacked on the second surface of the support layer opposite to the first surface; The thermal conductivity of the high thermal conductivity carbon fiber layer is greater than 100 W / (m·K), the thermal conductivity of the conventional carbon fiber layer is less than 50 W / (m·K), and the thermal conductivity of the metal shielding layer is greater than 120 W / (m·K).

2. The screen support plate according to claim 1, characterized in that, The multilayer carbon fiber comprises alternating stacks of highly thermally conductive carbon fiber layers and conventional carbon fiber layers.

3. The screen support plate according to claim 2, characterized in that, The support layer consists of a conventional carbon fiber layer, a high thermal conductivity carbon fiber layer, and another conventional carbon fiber layer stacked sequentially.

4. The screen support plate according to claim 3, characterized in that, The high thermal conductivity carbon fiber layer has a layup angle of 0°; the conventional carbon fiber layer has a layup angle of 90°.

5. The screen support plate according to claim 3 or 4, characterized in that, The ratio of the thickness of the high thermal conductivity carbon fiber layer to the thickness of the screen support plate is 1 / 4 to 2 / 3.

6. The screen support plate according to any one of claims 3 to 5, characterized in that, The ratio of the thickness of the metal shielding layer to the thickness of the screen support plate is 1 / 13 to 1 / 5.

7. The screen support plate according to any one of claims 3 to 6, characterized in that, The thickness of the conventional carbon fiber layer is less than the thickness of the high thermal conductivity carbon fiber layer.

8. The screen support plate according to any one of claims 3 to 7, characterized in that, The metal shielding layer is aluminum foil or copper foil.

9. The screen support plate according to any one of claims 1 to 8, characterized in that, The thermal conductivity of the high thermal conductivity carbon fiber layer is greater than or equal to 250 W / (m·K).

10. A display module, characterized in that, include: Display screen; The screen support plate as described in any one of claims 1 to 9; the screen support plate is disposed on the back of the display screen and is fixedly connected to the display screen.

11. An electronic device, characterized in that, include: The display module as described in claim 10; Back cover; the back cover is disposed on the backlight side of the display module; The frame surrounds the side of the back cover and the side of the display module, and is fixedly connected to the display module and the back cover respectively.

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