Substrate assembly and server

Abstract

This application discloses a substrate assembly and a server, relating to the field of server technology. The substrate assembly includes a heat dissipation module, circuit carriers disposed on both sides of the heat dissipation module, and a first elastic member. The first elastic member is disposed in a compressed state between the heat dissipation module and the circuit carriers on both sides. Because the first elastic member is in a compressed state, it stores elastic potential energy. After the fixed connection between the heat dissipation module and the circuit carriers is released, only the adhesive force of the thermally conductive layer between the electronic device and the heat dissipation module exists between them. The elastic potential energy of the first elastic member is used to overcome the adhesive force of the thermally conductive layer, so that the circuit carriers and the heat dissipation module spring apart, making it easier to separate the circuit carriers from the heat dissipation module, thereby reducing the difficulty of disassembling the heat dissipation module.

Description

Technical Field

[0001] This application relates to the field of server technology, and in particular to a substrate assembly and a server. Background Technology

[0002] Servers typically use heat dissipation modules to cool electronic components. Thermal grease is often used between the heat dissipation module and the electronic components to conduct heat and improve the heat dissipation effect of the heat dissipation module on the electronic components.

[0003] Thermal grease generates significant adhesion at high temperatures. Therefore, considerable external force is required to overcome this adhesion between the thermal grease and the heatsink module and electronic components when disassembling or replacing the heatsink module. Furthermore, the small gap between the heatsink module and electronic components makes it difficult to insert disassembly tools; forcibly prying can easily damage the solder joints of the electronic components. Summary of the Invention

[0004] This application provides a substrate assembly and a server to at least solve the problem of difficulty in disassembling the heat dissipation module of the relevant substrate assembly.

[0005] This application provides a substrate assembly, including:

[0006] Heat dissipation module, circuit carrier and first elastic element;

[0007] The heat dissipation module has heat dissipation sides on both sides along a preset direction;

[0008] The heat dissipation module is detachably equipped with circuit carriers on both sides along a preset direction; electronic components are provided on the side of the circuit carriers facing the heat dissipation side, and a heat-conducting layer is provided between the electronic components and the heat dissipation side.

[0009] A first elastic element in a compressed state is respectively provided between the heat dissipation module and the circuit carriers on both sides along a preset direction, and the compression direction of the first elastic element is along the preset direction.

[0010] This application also provides a server, including the aforementioned substrate assembly.

[0011] Through this application, since the first elastic element is in a compressed state, it stores elastic potential energy. After the fixed connection between the heat dissipation module and the circuit carrier is released, only the adhesive force of the thermally conductive layer between the electronic device and the heat dissipation module remains between them. The elastic potential energy of the first elastic element is used to overcome the adhesive force of the thermally conductive layer, allowing the circuit carrier to spring away from the heat dissipation module, making it easier to separate them and reducing the difficulty of disassembling the heat dissipation module. Furthermore, circuit carriers are provided on both sides of the heat dissipation module, allowing the heat dissipation module to simultaneously dissipate heat from the electronic devices on both sides of the circuit carriers. This not only fully utilizes the heat dissipation area of ​​the heat dissipation module, reducing heat loss and improving the heat dissipation efficiency of the module for the circuit carriers, but also improves the compactness of the substrate assembly structure and reduces the volume of the substrate assembly. Attached Figure Description

[0012] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 A schematic diagram of the structure of a substrate assembly provided in an embodiment of this application. Figure 1 ;

[0014] Figure 2 A partial exploded view of a substrate assembly provided in an embodiment of this application. Figure 1 ;

[0015] Figure 3 A partial exploded view of a substrate assembly provided in an embodiment of this application. Figure 2 ;

[0016] Figure 4 for Figure 2 A magnified view of a portion of point P1 in the middle;

[0017] Figure 5 A schematic diagram of the structure of a substrate assembly provided in an embodiment of this application. Figure 2 ;

[0018] Figure 6 for Figure 5 Sectional view along the middle AA direction;

[0019] Figure 7 for Figure 6 A magnified view of a portion of point P2 in the middle;

[0020] Figure 8An exploded view of a circuit carrier in a substrate assembly provided in this application embodiment. Figure 1 ;

[0021] Figure 9 An exploded view of a circuit carrier in a substrate assembly provided in this application embodiment. Figure 2 ;

[0022] Figure 10 A schematic diagram of the structure of an open acceleration module in a substrate assembly provided in this application embodiment. Figure 1 ;

[0023] Figure 11 An exploded view of an open acceleration module in a substrate assembly provided in this application embodiment. Figure 1 ;

[0024] Figure 12 A schematic diagram of the structure of an open acceleration module in a substrate assembly provided in this application embodiment. Figure 2 ;

[0025] Figure 13 An exploded view of an open acceleration module in a substrate assembly provided in this application embodiment. Figure 2 ;

[0026] Figure 14 for Figure 9 A magnified view of a portion of point P3 in the middle;

[0027] Figure 15 for Figure 5 Sectional view along the BB direction;

[0028] Figure 16 for Figure 15 A magnified view of a portion of P4 in the middle;

[0029] Figure 17 A schematic diagram of the structure of a heat dissipation module in a substrate assembly provided in this application embodiment. Figure 1 ;

[0030] Figure 18 for Figure 5 A cross-sectional view along the CC direction;

[0031] Figure 19 for Figure 18 A magnified view of a portion of P5 in the middle;

[0032] Figure 20 A schematic diagram of the structure of a heat dissipation module in a substrate assembly provided in this application embodiment. Figure 2 .

[0033] The above figures include the following reference numerals:

[0034] 10-Heat dissipation module; 101-Heat dissipation side; 102-Third mounting hole; 103-Liquid inlet; 104-Liquid outlet; 105-Fluid channel; 106-Heat dissipation boss;

[0035] 20 - Circuit carrier; 210 - Mainboard module; 2101 - Second mounting hole; 2102 - Fourth mounting hole; 211 - Mainboard body; 2111 - First connector; 212 - Tray; 220 - Open acceleration module; 230 - Open acceleration module; 2301 - Second connector; 2302 - First mounting hole; 2303 - Countersunk hole; 231 - First frame; 2311 - First clearance opening; 2312 - First groove; 2313 - Third fastener; 232 - First circuit board; 2321 - Circuit board body; 2322 - Electronic component; 233 - Second frame; 2331 - Second groove; 2332 - Second clearance opening;

[0036] 30 - First elastic element;

[0037] 40 - Second elastic element; 401 - Limiting hole;

[0038] 50 - First fastener;

[0039] 60 - Second fastener. Detailed Implementation

[0040] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, other embodiments obtained by those of ordinary skill in the art without creative effort are all within the protection scope of this application.

[0041] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0042] As stated in the background section, the substrate assemblies in related technologies suffer from the problem of difficulty in disassembling the heat dissipation module. The inventors have discovered that this problem arises because thermal grease is applied between the heat dissipation module and the electronic components in the substrate assemblies. This thermal grease improves the heat conduction efficiency between the heat dissipation module and the electronic components, thereby enhancing the heat dissipation effect of the heat dissipation module on the electronic components. However, the heat generated by the electronic components increases the adhesive force of the thermal grease. When disassembling the heat dissipation module, even after removing the screws securing the electronic components and the heat dissipation module, the thermal grease still adheres to the components. Disassembly tools are needed to overcome the adhesive force of the thermal grease to separate the heat dissipation module from the electronic components. When removing the heat dissipation module with tools, the small gap between the heat dissipation module and the electronic components makes it difficult to insert the tools. Forcible prying can easily damage the solder joints of the electronic components.

[0043] To address the aforementioned technical problems, this application provides a substrate assembly and a server. A first elastic member is disposed on the side of the circuit carrier facing the heat dissipation module. The first elastic member is disposed between the heat dissipation module and the circuit carrier in a compressed state. Because the first elastic member is in a compressed state, it stores elastic potential energy. After the fastening screws between the heat dissipation module and the circuit carrier are removed, this elastic potential energy is used to overcome the adhesive force of the thermal grease between the electronic components on the circuit carrier and the heat dissipation module, making it easier to separate the circuit carrier from the heat dissipation module and reducing the difficulty of disassembling the heat dissipation module. Furthermore, circuit carriers are disposed on both sides of the heat dissipation module, allowing the heat dissipation module to simultaneously dissipate heat from the electronic components on both sides of the circuit carrier. This not only fully utilizes the heat dissipation area of ​​the heat dissipation module, reducing heat loss and improving the heat dissipation efficiency of the heat dissipation module for the circuit carrier, but also improves the compactness of the substrate assembly structure and reduces the volume of the substrate assembly.

[0044] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0045] This application provides a server, which may include, but is not limited to, a rack server, a high-density server, a tower server, a blade server, a full rack server, etc.

[0046] The server includes a baseboard assembly.

[0047] refer to Figure 1 This application provides a substrate assembly, which includes a heat dissipation module 10 and a circuit carrier 20.

[0048] The circuit carrier 20 can be a circuit board, substrate, circuit board, etc.

[0049] The circuit carrier 20 can also be a general-purpose substrate. To meet the needs of high-performance computing scenarios such as artificial intelligence, machine learning, and data analysis, the general-purpose substrate is a standardized substrate that meets the Open Compute Project specifications. The Open Compute Project specifications standardize the physical dimensions, power supply, and high-speed signals of the substrate.

[0050] For example, the server can be an artificial intelligence (AI) server. Servers requiring high performance, such as AI servers, often incorporate a universal baseboard (UBB) that meets the Open Compute Project (OCP) specifications.

[0051] The heat dissipation module 10 can be a liquid cooling plate or other device capable of dissipating heat from a heat source. (Reference) Figure 1 , Figure 2 and Figure 3 The heat dissipation module 10 has a heat dissipation side 101, which is located on one side of the heat dissipation module 10 along a preset direction D.

[0052] The preset direction D can be the thickness direction of the heat dissipation module 10 or other directions.

[0053] The circuit carrier 20 is disposed on the heat dissipation side 101 and is detachably connected to the heat dissipation module 10.

[0054] refer to Figure 1 , Figure 2 and Figure 3 The circuit carrier 20 has an electronic device 2322 on the side facing the heat dissipation side 101. When the heat dissipation module 10 is working, the heat dissipation side 101 can continuously absorb the heat generated by the electronic device 2322 and conduct the absorbed heat out to reduce the temperature of the electronic device 2322.

[0055] Electronic device 2322 can be a graphics processor or other device.

[0056] A thermally conductive layer is provided between the electronic device 2322 and the heat dissipation side 101. The thermally conductive layer can be a thermally conductive silicone grease layer or a thermally conductive gel layer, etc. The thermally conductive layer is attached to the electronic device 2322 and the heat dissipation side 101 on both sides along the preset direction D, respectively, to fill the gap between the electronic device 2322 and the heat dissipation side 101, thereby improving the thermal conductivity between the heat dissipation side 101 and the electronic device 2322, and thus improving the heat dissipation effect of the heat dissipation module 10 on the electronic device 2322.

[0057] The substrate assembly of this application embodiment is referenced. Figure 2 and Figure 3 The heat dissipation module 10 has heat dissipation sides 101 on both sides along the preset direction D. Circuit carriers 20 are respectively provided on both sides of the heat dissipation module 10 along the preset direction D.

[0058] Circuit carriers 20 are respectively provided on both sides of the heat dissipation module 10 so that the heat dissipation module 10 can simultaneously dissipate heat from the electronic devices 2322 on the circuit carriers 20 on both sides. This not only makes full use of the heat dissipation area of ​​the heat dissipation module 10, reduces the heat loss of the heat dissipation module 10, and improves the heat dissipation efficiency of the heat dissipation module 10 for the circuit carriers 20, but also improves the compactness of the substrate assembly structure and reduces the volume of the substrate assembly.

[0059] refer to Figure 2 and Figure 4 The substrate assembly in this embodiment further includes a first elastic member 30. (See reference...) Figure 5 , Figure 6 and Figure 7 The first elastic element 30 is disposed between the heat dissipation module 10 and the circuit carrier 20 in a compressed state, and the compression direction of the first elastic element 30 is along the preset direction D of the heat dissipation module 10.

[0060] The first elastic element 30 can be a spring, an elastic washer, or other elastic element that can store elastic potential energy during compression.

[0061] Since the first elastic element 30 is in a compressed state, it stores elastic potential energy. After the fixed connection between the heat dissipation module 10 and the circuit support 20 is released, only the adhesive force of the thermally conductive layer between the electronic device 2322 and the heat dissipation module 10 remains between them. The elastic potential energy of the first elastic element 30 is used to overcome the adhesive force of the thermally conductive layer, so that the circuit support 20 and the heat dissipation module 10 spring apart, making it easier to separate them and reducing the difficulty of disassembling the heat dissipation module 10.

[0062] If the first elastic element 30 is not provided between the heat dissipation module 10 and the circuit carrier 20, then when it is necessary to disassemble the heat dissipation module 10, an external disassembly tool will be needed to be inserted into the gap between the heat dissipation module 10 and the circuit carrier 20 to pry the heat dissipation module 10 off, but this is very likely to damage the solder pins of the electronic device 2322.

[0063] The substrate assembly of this application embodiment achieves the disassembly of the heat dissipation module 10 by releasing the elastic force of the first elastic member 30. The structure is simple, which simplifies the structure of the substrate assembly. It does not require external disassembly tools and is less likely to damage the solder joints of the electronic device 2322.

[0064] refer to Figure 4 The first elastic element 30 can be a flat wire spring, and the axis of the flat wire spring is along the preset direction D of the heat dissipation module 10. The flat wire spring has a large elastic potential energy stored after being compressed. When releasing the elastic potential energy, it can provide a large rebound force to the circuit carrier 20 and the heat dissipation module 10, making it easier to separate the circuit carrier 20 and the heat dissipation module 10, thereby reducing the difficulty of disassembling the heat dissipation module 10.

[0065] refer to Figure 1 and Figure 2 The circuit carrier 20 in this embodiment may include a motherboard module 210 and an Open Accelerator Module 220 (OCP accelerator module, OAM) based on the Open Compute Project standard. The Open Accelerator Module 220 is detachably connected to the motherboard module 210.

[0066] refer to Figure 8 and Figure 9The motherboard module 210 has a first connector 2111, and the open acceleration module 220 has a second connector 2301. The second connector 2301 is electrically connected to the first connector 2111 to realize signal interaction between the open acceleration module 220 and the motherboard module 210.

[0067] refer to Figure 1 , Figure 2 and Figure 5 The open acceleration module 220 is located between the heat dissipation module 10 and the motherboard module 210, or in other words, the heat dissipation module 10, the open acceleration module 220 and the motherboard module 210 are arranged sequentially along the preset direction D of the heat dissipation module 10.

[0068] refer to Figure 2 An electronic device 2322 is provided on the side of the open acceleration module 220 facing the heat dissipation side 101.

[0069] refer to Figure 7 The first elastic element 30 is disposed in a compressed state between the heat dissipation module 10 and the open acceleration module 220. After the fixed connection between the heat dissipation module 10 and the circuit support 20 is released, only the adhesive force of the heat-conducting layer between the open acceleration module 220 and the heat dissipation module 10 exists between them. The elastic potential energy of the first elastic element 30 is used to overcome the adhesive force of the heat-conducting layer, so that the open acceleration module 220 and the heat dissipation module 10 spring apart, making it easier to separate them and reducing the difficulty of disassembling the heat dissipation module 10.

[0070] The open acceleration module 220 faces the heat dissipation side 101, and / or the heat dissipation side 101 may be constructed with a first limiting structure, and a portion of the first elastic member 30 is disposed in the first limiting structure. The first limiting structure is used to restrict the degree of freedom of the first elastic member 30 along a preset direction D perpendicular to the heat dissipation module 10.

[0071] refer to Figure 7 In some embodiments, the first limiting structure can be a first groove 2312. Taking the first groove 2312 constructed on the side of the open acceleration module 220 facing the heat dissipation side 101 as an example, the depth direction of the first groove 2312 is along the preset direction D of the heat dissipation module 10, the groove opening of the first groove 2312 faces the heat dissipation side 101, the bottom of the first groove 2312 and the groove opening of the first groove 2312 are opposite to each other along the preset direction D of the heat dissipation module 10, and the bottom of the first groove 2312 is farther away from the heat dissipation side 101 than the groove opening of the first groove 2312.

[0072] A portion of the first elastic element 30 is disposed in the first groove 2312. The first groove 2312 can limit the first elastic element 30 to reduce the degree of freedom of the first elastic element 30 along the preset direction D perpendicular to the heat dissipation module 10, so that when the first elastic element 30 releases elastic potential energy, it mainly extends along the preset direction D of the heat dissipation module 10 to pop the heat dissipation module 10 away from the opening acceleration module 220.

[0073] The first elastic element 30 can be fixedly connected to the bottom of the first groove 2312. For example, the first elastic element 30 can be glued to the bottom of the first groove 2312 by adhesive or double-sided pressure-sensitive tape, or welded to the bottom of the first groove 2312, so that the end of the first elastic element 30 away from the heat dissipation side 101 is fixed to the bottom of the first groove 2312, so that after the heat dissipation module 10 and the opening acceleration module 220 are separated, the first elastic element 30 is not easy to fall out of the first groove 2312, which facilitates the assembly of the acceleration opening module and the new heat dissipation module 10 after replacement.

[0074] In other embodiments, the first limiting structure can be a limiting tube, and the axial direction of the limiting tube can be along a preset direction D.

[0075] refer to Figure 2 and Figure 10 The open acceleration module 220 may include multiple open acceleration modules 230. Each open acceleration module 230 is provided with multiple first elastic elements 30 between itself and the heat dissipation module 10. The multiple first elastic elements 30 are used to spring the corresponding open acceleration module 230 away from the heat dissipation module 10. The elastic potential energy released by the multiple first elastic elements 30 is relatively large, making it easier to separate the corresponding open acceleration module 230 from the heat dissipation module 10, thereby reducing the difficulty of disassembling the heat dissipation module 10.

[0076] refer to Figure 7 , Figure 10 and Figure 11 The open acceleration module 230 may include a first frame 231, a first circuit board 232 and a second frame 233 connected to each other.

[0077] The first frame 231, the first circuit board 232 and the second frame 233 are arranged sequentially along a preset direction D, and the first frame 231 is located between the heat dissipation module 10 and the first circuit board 232.

[0078] The first frame 231 and the second frame 233 protect the first circuit board 232, reducing the possibility of the first circuit board 232 being damaged by bumps.

[0079] refer to Figure 7The first elastic element 30 is disposed in a compressed state between the heat dissipation module 10 and the first frame 231. After the fixed connection between the heat dissipation module 10 and the circuit support 20 is released, only the adhesive force of the heat-conducting layer between the heat dissipation module 10 and the circuit support 20 exists. The elastic potential energy of the first elastic element 30 is used to overcome the adhesive force of the heat-conducting layer, so that the first frame 231 and the heat dissipation module 10 spring apart, thereby separating the open acceleration module 220 from the heat dissipation module 10, thus reducing the difficulty of disassembling the heat dissipation module 10.

[0080] refer to Figure 10 and Figure 11 The first frame 231, the circuit board body 2321, and the second frame 233 can be fixedly connected by a third fastener 2313 that is sequentially inserted into the first frame 231, the circuit board body 2321, and the second frame 233 along a preset direction D of the heat dissipation module 10. The third fastener 2313 can be a spring screw or other fastening screw, etc.

[0081] refer to Figure 11 The first frame 231 may be constructed with a first clearance opening 2311, which penetrates the first frame 231 along the preset direction D of the heat dissipation module 10.

[0082] The first circuit board 232 may include a circuit board body 2321 and an electronic device 2322. The circuit board body 2321 is located between the first frame 231 and the second frame 233. The electronic device 2322 is disposed on the side of the circuit board body 2321 facing the first frame 231 and is electrically connected to the circuit board body 2321. The electronic device 2322 is accommodated within a first clearance opening 2311 so that the electronic device 2322 can be attached to the heat dissipation side 101 through the first clearance opening 2311.

[0083] A thermally conductive layer is filled between the electronic device 2322 and the heat dissipation side 101 to improve the thermal conductivity between the electronic device 2322 and the heat dissipation side 101.

[0084] refer to Figure 8 and Figure 9 The motherboard module 210 may have a first connector 2111 on the side facing the open acceleration module 220.

[0085] The open acceleration module 220 may have a second connector 2301 on the side facing the motherboard module 210, and the second connector 2301 is crimped with the first connector 2111. Crimping eliminates the need for heating and solder, avoiding thermal damage to the motherboard module 210 and the open acceleration module 220 caused by localized high temperatures during soldering. Furthermore, the crimped connection can be disassembled non-destructively using specialized tools, eliminating the need for rework soldering and significantly reducing maintenance time; simultaneously, the first connector 2111 and the second connector 2301 can be reused, reducing costs.

[0086] refer to Figure 12 and Figure 13 In the implementation of the open acceleration module 230, which includes a first frame 231, a first circuit board 232 and a second frame 233 connected to each other, the second frame 233 may be constructed with a second clearance opening 2332, which passes through the second frame 233 along the preset direction D of the heat dissipation module 10.

[0087] The first circuit board 232 may include a circuit board body 2321 and a second connector 2301. The second connector 2301 is disposed on the side of the circuit board body 2321 facing the second frame 233 and is electrically connected to the circuit board body 2321. The second connector 2301 is accommodated within a second clearance opening 2332 so that the second connector 2301 can be electrically connected to the first connector 2111 on the motherboard module 210 through the second clearance opening 2332.

[0088] refer to Figure 9 , Figure 12 , Figure 13 , Figure 14 , Figure 15 and Figure 16 The substrate assembly in this application embodiment also includes a second elastic member 40, which is disposed between the motherboard module 210 and the open acceleration module 220 in a compressed state, and the compression direction of the second elastic member 40 is along a preset direction D.

[0089] The second elastic element 40 can be a spring, an elastic washer, or other elastic element that can store elastic potential energy during compression.

[0090] Since the second elastic element 40 is in a compressed state, it stores elastic potential energy. After the fixed connection between the motherboard module 210 and the open acceleration module 220 is released, only the pressing force between the first connector 2111 and the second connector 2301 exists between the motherboard module 210 and the open acceleration module 220. The elastic potential energy of the second elastic element 40 is used to overcome the pressing force of the first connector 2111 and the second connector 2301, so that the motherboard module 210 and the open acceleration module 220 spring apart, making it easier to separate the open acceleration module 220 from the motherboard module 210. This reduces the difficulty of disassembling the open acceleration module 220 and improves the maintenance and replacement efficiency of the open acceleration module 220.

[0091] If a second elastic element 40 is not provided between the motherboard module 210 and the open acceleration module 220, then when it is necessary to disassemble the open acceleration module 220, an external disassembly tool will be needed to be inserted into the gap between the motherboard module 210 and the open acceleration module 220 to pry the open acceleration module 220 off. However, this is very likely to damage the first connector 2111 on the motherboard module 210.

[0092] The substrate assembly of this application embodiment achieves the disassembly of the open acceleration module 220 by releasing the elastic force of the second elastic member 40. The structure is simple, which simplifies the structure of the substrate assembly. Moreover, it does not require external disassembly tools and is not easy to damage the first connector 2111 on the motherboard module 210.

[0093] refer to Figure 14 and Figure 16 The second elastic element 40 can be a flat wire spring, with its axis along a preset direction D of the heat dissipation module 10. The flat wire spring stores a large amount of elastic potential energy after being compressed, and when releasing this elastic potential energy, it can provide a large rebound force to the motherboard module 210 and the open acceleration module 220, making it easier to separate the motherboard module 210 and the open acceleration module 220, thereby reducing the difficulty of disassembling the open acceleration module 220.

[0094] The side of the open acceleration module 220 facing the motherboard module 210, and / or the side of the motherboard module 210 facing the open acceleration module 220 is provided with a second limiting structure, and a portion of the second elastic member 40 is disposed in the second limiting structure.

[0095] refer to Figure 16In some embodiments, the second limiting structure can be a second groove 2331. Taking the side of the open acceleration module 220 facing the motherboard module 210 as an example, the depth direction of the second groove 2331 is along the preset direction D of the heat dissipation module 10, the opening of the second groove 2331 faces the motherboard module 210, the bottom of the second groove 2331 and the opening of the second groove 2331 are opposite to each other along the preset direction D of the heat dissipation module 10, and the bottom of the second groove 2331 is farther away from the motherboard module 210 than the opening of the second groove 2331.

[0096] Part of the second elastic member 40 is disposed in the second groove 2331. The second groove 2331 can limit the second elastic member 40 to reduce the degree of freedom of the second elastic member 40 along the preset direction D perpendicular to the heat dissipation module 10, so that when the second elastic member 40 releases elastic potential energy, it mainly extends along the preset direction D of the heat dissipation module 10 to pop the motherboard module 210 and the open acceleration module 220 apart.

[0097] The second elastic member 40 can be fixedly connected to the bottom of the second groove 2331. For example, the second elastic member 40 can be glued to the bottom of the second groove 2331 by adhesive or double-sided pressure-sensitive tape, or welded to the bottom of the second groove 2331, so that the end of the second elastic member 40 away from the motherboard module 210 is fixed to the bottom of the second groove 2331, so that after the motherboard module 210 and the opening acceleration module 220 are separated, the second elastic member 40 is not easy to fall out of the second groove 2331, which facilitates the assembly of the repaired acceleration opening module and the motherboard module 210.

[0098] In other embodiments, the second limiting structure can be a limiting tube, and the axial direction of the limiting tube can be along a preset direction D.

[0099] refer to Figure 16 In the implementation of the open acceleration module 220, which includes a first frame 231, a first circuit board 232, and a second frame 233 connected together, a second groove 2331 may be constructed on the side of the second frame 233 facing the motherboard module 210. The second elastic member 40 is used to spring the second frame 233 away from the motherboard module 210, so that the motherboard module 210 is separated from the open acceleration module 220.

[0100] refer to Figure 16 The open acceleration module 220 may be constructed with a first mounting hole 2302, which penetrates the open acceleration module 220 along a preset direction D.

[0101] The motherboard module 210 has a second mounting hole 2101, which is opposite to the first mounting hole 2302.

[0102] The open acceleration module 220 and the motherboard module 210 are fixedly connected by a first fastener 50 passing through the first mounting hole 2302 and the second mounting hole 2101. The first fastener 50 can be a spring screw or other fastening screw, etc.

[0103] After the first fastener 50 releases the fixed connection between the motherboard module 210 and the open acceleration module 220, only the crimping force between the first connector 2111 and the second connector 2301 exists between the motherboard module 210 and the open acceleration module 220. The elastic potential energy of the second elastic member 40 is used to overcome the crimping force of the first connector 2111 and the second connector 2301, so that the motherboard module 210 and the open acceleration module 220 spring apart, making it easier to separate the open acceleration module 220 from the motherboard module 210. This reduces the difficulty of disassembling the open acceleration module 220 and improves the maintenance and replacement efficiency of the open acceleration module 220.

[0104] refer to Figure 16 In the implementation of the open acceleration module 230 including the first frame 231, the first circuit board 232 and the second frame 233 connected to each other, the first mounting hole 2302 passes through the first frame 231, the circuit board body 2321 and the second frame 233. In this way, the first fastener 50 can not only fix the open acceleration module 230 to the motherboard module 210, but also fix the first frame 231, the circuit board body 2321 and the second frame 233.

[0105] The first mounting hole 2302 penetrates the bottom of the second groove 2331, and the first mounting hole 2302 communicates with the second groove 2331. The second mounting hole 2101 is opposite to the opening of the second groove 2331.

[0106] refer to Figure 14 and Figure 16 The second elastic element 40 forms a limiting hole 401, and the axis of the limiting hole 401 is along the preset direction D of the heat dissipation module 10.

[0107] Part of the first fastener 50 passes through the limiting hole 401. In this way, the first fastener 50 can not only fix the open acceleration module 220 and the motherboard module 210, but also further limit the second elastic member 40 to reduce the degree of freedom of the second elastic member 40 along the preset direction D perpendicular to the heat dissipation module 10. When the second elastic member 40 releases elastic potential energy, it mainly extends along the preset direction D of the heat dissipation module 10 to pop the motherboard module 210 and the open acceleration module 220 apart.

[0108] refer to Figure 16The first mounting hole 2302 is countersunk at one end near the heat dissipation side 101. At least a portion of the head of the first fastener 50 is accommodated in the countersunk hole 2303 to reduce the height of the first fastener 50 protruding from the heat dissipation module 10 into the open acceleration module 220, thereby reducing the gap between the open acceleration module 220 and the heat dissipation module 10.

[0109] In this embodiment of the application, the heat dissipation module 10 is detachably connected to the motherboard module 210. During the assembly of the substrate assembly, the open acceleration module 220 can be first fixedly connected to the motherboard module 210 using a first fastener 50 to form a circuit carrier 20. Then, the motherboard module 210 and the heat dissipation module 10 are fixedly connected using a second fastener 60. The second fastener 60 can be a spring screw or other fastening screw, etc.

[0110] When disassembling the substrate assembly, first release the second fastener 60 from fixing the motherboard module 210 and the heat dissipation module 10. After the second fastener 60 is released from fixing the motherboard module 210 and the heat dissipation module 10, the elastic potential energy of the first elastic member 30 is used to overcome the adhesive force of the heat-conducting layer, so that the opening acceleration module 220 and the heat dissipation module 10 are popped apart, so that the circuit carrier 20 and the heat dissipation module 10 are separated.

[0111] When it is necessary to remove the open acceleration module 220 from the circuit carrier 20, the first fastener 50 is released from fixing the open acceleration module 220 and the motherboard module 210. After the first fastener 50 is released from fixing the open acceleration module 220 and the motherboard module 210, the elastic potential energy of the second elastic member 40 is used to overcome the crimping force of the first connector 2111 and the second connector 2301, so that the motherboard module 210 and the open acceleration module 220 spring apart, making it easier to separate the open acceleration module 220 and the motherboard module 210, thereby reducing the difficulty of disassembling the open acceleration module 220 and improving the maintenance and replacement efficiency of the open acceleration module 220.

[0112] refer to Figure 17 The heat dissipation module 10 may be constructed with a third mounting hole 102, and the axis of the third mounting hole 102 may be along the preset direction D of the heat dissipation module 10.

[0113] refer to Figure 18 and Figure 19 The motherboard module 210 may be constructed with a fourth mounting hole 2102, which is opposite to the third mounting hole 102.

[0114] The heat dissipation module 10 and the motherboard module 210 are fixedly connected by a second fastener 60 that passes through the fourth mounting hole 2102 and the third mounting hole 102 in sequence. The second fastener 60 can be a spring screw or other fastening screw.

[0115] The substrate assembly of this application embodiment is referenced. Figure 8 The motherboard module 210 may include a motherboard body 211 and a tray 212 connected to each other. A first connector 2111 is provided on the motherboard body 211. The motherboard body 211 is located on the side of the open acceleration module 220 away from the heat dissipation module 10, and the tray 212 is located on the side of the motherboard body 211 away from the open acceleration module 220.

[0116] The tray 212 is used to fix the motherboard body 211 and protect the motherboard body 211 from being damaged by impact.

[0117] The tray 212 can be made of metal to improve its structural strength, thereby enhancing its protective effect on the main body 211.

[0118] refer to Figure 17 and Figure 20 In the implementation of the heat dissipation module 10 as a liquid cooling plate, the liquid cooling plate can be constructed with an inlet 103, an outlet 104, and a fluid channel 105, which are connected to the inlet 103 and the outlet 104 respectively. The inlet 103 is used for the inflow of coolant, and the outlet 104 is used for the outflow of coolant. The coolant flows into the fluid channel 105 from the inlet 103 and flows out from the outlet 104.

[0119] The coolant in the fluid channel 105 can reduce the temperature of the heat dissipation side 101, allowing the heat dissipation side 101 to exchange heat with the electronic device 2322, thereby reducing the temperature of the electronic device 2322.

[0120] The liquid cooling plate has heat dissipation protrusions 106 on both sides along the preset direction D. The heat dissipation protrusions 106 are attached to the electronic device 2322, and there is a heat-conducting layer between the heat dissipation protrusions 106 and the electronic device 2322.

[0121] The heat dissipation boss 106 has a cooling cavity inside, which is connected to the fluid channel 105. The coolant in the fluid channel 105 flows into the cooling cavity, which lowers the temperature of the heat dissipation boss 106. The lower-temperature heat dissipation boss 106 exchanges heat with the electronic device 2322, thereby lowering the temperature of the electronic device 2322.

[0122] refer to Figure 2 and Figure 3 In the implementation of the open acceleration module 220 including multiple open acceleration modules 230, each heat dissipation side 101 of the liquid cooling plate can have multiple heat dissipation protrusions 106. The number of heat dissipation protrusions 106 corresponds to the number of open acceleration modules 230. Each heat dissipation protrusion 106 is attached to the electronic device 2322 on the corresponding open acceleration module 230 and dissipates heat from the electronic device 2322.

[0123] It should be noted that the heat dissipation side 101 in this embodiment can be an irregular plane, and any side of the heat dissipation module 10 facing the circuit support member 20 can be referred to as the heat dissipation side 101. The side of the heat dissipation boss 106 facing the circuit support member 20 constitutes part of the heat dissipation side 101.

[0124] The foregoing has provided a detailed description of a substrate assembly and server provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of this application.

Claims

1. A substrate assembly, characterized in that, include: Heat dissipation module (10), circuit carrier (20) and first elastic element (30); The heat dissipation module (10) has heat dissipation sides (101) on both sides along a preset direction. The heat dissipation module (10) is detachably provided with the circuit carrier (20) on both sides along the preset direction; the circuit carrier (20) is provided with an electronic device (2322) on the side facing the heat dissipation side (101), and a heat-conducting layer is provided between the electronic device (2322) and the heat dissipation side (101); The heat dissipation module (10) and the circuit carrier (20) on both sides along the preset direction are respectively provided with the first elastic member (30) in a compressed state, and the compression direction of the first elastic member (30) is along the preset direction.

2. The substrate assembly according to claim 1, characterized in that, The circuit carrier (20) includes a motherboard module (210) and an open acceleration module (220); the open acceleration module (220) is detachably connected to the motherboard module (210). The open acceleration module (220) is located between the heat dissipation module (10) and the motherboard module (210); the electronic device (2322) is provided on the side of the open acceleration module (220) facing the heat dissipation side (101). The first elastic element (30) is disposed in a compressed state between the heat dissipation module (10) and the open acceleration module (220).

3. The substrate assembly according to claim 2, characterized in that, The open acceleration module (220) faces the heat dissipation side (101), and / or the heat dissipation side (101) is provided with a first limiting structure, and a portion of the first elastic member (30) is disposed in the first limiting structure.

4. The substrate assembly according to claim 3, characterized in that, The first limiting structure is a first groove (2312), and part of the first elastic member (30) is disposed in the first groove (2312).

5. The substrate assembly according to claim 4, characterized in that, The first elastic element (30) is fixedly connected to the bottom of the first groove (2312).

6. The substrate assembly according to claim 2, characterized in that, The open acceleration module (220) includes a first frame (231), a first circuit board (232), and a second frame (233) connected to each other. The first frame (231), the first circuit board (232) and the second frame (233) are arranged sequentially along the preset direction, and the first frame (231) is located between the heat dissipation module (10) and the first circuit board (232); The first elastic element (30) is disposed in a compressed state between the heat dissipation module (10) and the first frame (231).

7. The substrate assembly according to claim 6, characterized in that, The first frame (231) is constructed with a first clearance opening (2311); The first circuit board (232) includes a circuit board body (2321) and the electronic device (2322); the electronic device (2322) is disposed on the side of the circuit board body (2321) facing the first frame (231) and is electrically connected to the circuit board body (2321); the electronic device (2322) is housed in the first clearance opening (2311).

8. The substrate assembly according to claim 2, characterized in that, The open acceleration module (220) includes multiple open acceleration modules (230), and multiple first elastic elements (30) are provided between the open acceleration modules (230) and the heat dissipation module (10).

9. The substrate assembly according to any one of claims 1-8, characterized in that, The first elastic element (30) is a flat wire spring, and the axis of the flat wire spring is along the preset direction.

10. The substrate assembly according to any one of claims 2-8, characterized in that, The motherboard module (210) has a first connector (2111) on the side facing the open acceleration module (220). The open acceleration module (220) has a second connector (2301) on the side facing the motherboard module (210), and the second connector (2301) is crimped to the first connector (2111).

11. The substrate assembly according to claim 10, characterized in that, The substrate assembly further includes a second elastic member (40), which is disposed between the motherboard module (210) and the open acceleration module (220) in a compressed state, and the compression direction of the second elastic member (40) is along the preset direction.

12. The substrate assembly according to claim 11, characterized in that, The open acceleration module (220) faces the motherboard module (210) on one side, and / or the motherboard module (210) faces the open acceleration module (220) on one side and a second limiting structure is constructed thereon, and a portion of the second elastic member (40) is disposed in the second limiting structure.

13. The substrate assembly according to claim 12, characterized in that, The second limiting structure is a second groove (2331), and part of the second elastic element (40) is disposed in the second groove (2331).

14. The substrate assembly according to claim 13, characterized in that, The second elastic element (40) is fixedly connected to the bottom of the second groove (2331).

15. The substrate assembly according to claim 13, characterized in that, The open acceleration module (220) is provided with a first mounting hole (2302), which penetrates the open acceleration module (220) along the preset direction. The motherboard module (210) is provided with a second mounting hole (2101), which is opposite to the first mounting hole (2302); The open acceleration module (220) and the motherboard module (210) are fixedly connected by a first fastener (50) passing through the first mounting hole (2302) and the second mounting hole (2101).

16. The substrate assembly according to claim 15, characterized in that, The first mounting hole (2302) penetrates the bottom of the second groove (2331); the second mounting hole (2101) is opposite to the opening of the second groove (2331); The second elastic element (40) forms a limiting hole (401); A portion of the first fastener (50) passes through the limiting hole (401).

17. The substrate assembly according to claim 15, characterized in that, The first mounting hole (2302) is countersunk (2303) at one end near the heat dissipation side (101). At least a portion of the head of the first fastener (50) is accommodated within the countersunk hole (2303).

18. The substrate assembly according to any one of claims 2-8, characterized in that, The heat dissipation module (10) is detachably connected to the motherboard module (210).

19. The substrate assembly according to claim 18, characterized in that, The heat dissipation module (10) is provided with a third mounting hole (102). The motherboard module (210) is provided with a fourth mounting hole (2102), which is opposite to the third mounting hole (102); The heat dissipation module (10) and the motherboard module (210) are fixedly connected by a second fastener (60) that passes through the fourth mounting hole (2102) and the third mounting hole (102) in sequence.

20. The substrate assembly according to any one of claims 1-8, characterized in that, The heat dissipation module (10) is a liquid cooling plate; the liquid cooling plate is constructed with a liquid inlet (103), a liquid outlet (104) and a fluid channel (105), and the fluid channel (105) is connected to the liquid inlet (103) and the liquid outlet (104) respectively. The liquid cooling plate has heat dissipation protrusions (106) on both sides along the preset direction. The heat dissipation protrusions (106) are attached to the electronic device (2322). The heat dissipation protrusions (106) and the electronic device (2322) have the heat-conducting layer between them. The heat dissipation boss (106) has a cooling cavity inside, which is connected to the fluid channel (105).

21. A server, characterized in that, Includes the substrate assembly as described in any one of claims 1-20.

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