A method for determining relative position parameters based on parasitic capacitance, a device for measuring relative position parameters, and a signal processing circuit.

Abstract

This application relates to a method for determining relative position parameters based on parasitic capacitance, a device for measuring relative position parameters, and a signal processing circuit. This method for determining relative position parameters based on parasitic capacitance can detect the capacitance value of the parallel plate capacitors corresponding to each conductive sheet; it can also determine the relative position parameters between the AI ​​server computing board and the heat dissipation metal plate based on these capacitance values. Compared with traditional detection methods, this method for determining relative position parameters based on parasitic capacitance does not require mechanical modifications such as drilling holes or adding brackets, and is compatible with the existing integrated structure of the heat dissipation metal plate and the AI ​​server computing board.

Description

Technical Field

[0001] This application relates to the field of detection technology of relative position parameters between heat dissipation metal plates and AI server computing boards, and in particular to a method for determining relative position parameters based on parasitic capacitance, a relative position parameter measuring device, and a signal processing circuit. Background Technology

[0002] In testing the bonding tightness between a heat sink and an AI (Artificial Intelligence) server computing board, precise distance control between the two significantly impacts the bonding tightness. Traditional techniques commonly employ mechanical, optical, or inductive measurement methods. However, these methods all have limitations and suffer from insufficient accuracy. Summary of the Invention

[0003] Therefore, it is necessary to provide a method for determining relative position parameters based on parasitic capacitance with high detection accuracy, a device for measuring relative position parameters based on parasitic capacitance, and a signal processing circuit.

[0004] Firstly, a method for determining relative position parameters based on parasitic capacitance is provided. The relative position parameters are those between an AI server computing board and a heat dissipation metal plate, wherein the AI ​​server computing board and the heat dissipation metal plate are fitted together. Conductive sheets are located at multiple different positions on the AI ​​server computing board, with the conductive sheets positioned on the side of the AI ​​server computing board closest to the heat dissipation metal plate. The method includes:

[0005] Obtain the capacitance value of each parallel-plate capacitor composed of a conductive sheet and a heat-dissipating metal plate;

[0006] Based on the capacitance values ​​of the parallel plate capacitors corresponding to each conductive sheet, the relative positional parameters between the AI ​​server computing board and the heat dissipation metal plate are determined.

[0007] In one embodiment, the relative position parameters include one or more of the following parameters: the average electrode spacing between the AI ​​server computing board and the heat dissipation metal plate, the standard deviation of the average electrode spacing between the AI ​​server computing board and the heat dissipation metal plate, the electrode spacing between each conductive sheet and the heat dissipation metal plate, the tilt attitude parameters between the AI ​​server computing board and the heat dissipation metal plate, and the standard deviation of the capacitance values ​​corresponding to the multiple conductive sheets.

[0008] In one embodiment, the step of determining the relative positional parameters between the AI ​​server computing board and the heat dissipation metal plate based on the capacitance values ​​of the parallel plate capacitors corresponding to each conductive sheet includes:

[0009] Based on the capacitance value of the parallel plate capacitor corresponding to each conductive sheet and the preset parameter data, determine one or more of the following parameters:

[0010] The average electrode spacing between the AI ​​server computing board and the heat dissipation metal plate, the standard deviation of the average electrode spacing between the AI ​​server computing board and the heat dissipation metal plate, the electrode spacing between each conductive sheet and the heat dissipation metal plate, and the tilt attitude parameters between the AI ​​server computing board and the heat dissipation metal plate.

[0011] The preset parameter data includes the vacuum dielectric constant, the relative dielectric constant between the conductive sheet and the heat sink metal plate, and the relative area between the conductive sheet and the heat sink metal plate.

[0012] In one embodiment, the step of determining the average electrode spacing between the AI ​​server computing board and the heat dissipation metal plate based on the capacitance value of the parallel plate capacitor corresponding to each conductive sheet and preset parameter data includes:

[0013] Assuming the relative areas of each conductive sheet and the heat dissipation metal plate are equal, the average electrode spacing between the AI ​​server computing board and the heat dissipation metal plate is determined based on the capacitance values ​​of the parallel plate capacitors corresponding to each conductive sheet, preset parameter data, and the following expression:

[0014] ,

[0015] in, This refers to the average electrode spacing between the AI ​​server's computing board and the heat dissipation metal plate. The vacuum permittivity, The relative permittivity between the conductive sheet and the heat sink metal plate is denoted as . Let be the relative area of ​​each conductive sheet and the heat sink metal plate. The number of conductive sheets. This represents the capacitance value of the parallel-plate capacitor corresponding to the first conductive plate. This represents the capacitance value of the parallel-plate capacitor corresponding to the second conductive plate. This represents the capacitance value of the parallel-plate capacitor corresponding to the third conductive plate. Let be the capacitance value of the parallel plate capacitor corresponding to the nth conductive sheet.

[0016] In one embodiment, the step of determining the tilt attitude parameters between the AI ​​server computing board and the heat dissipation metal plate based on the capacitance values ​​of the parallel plate capacitors corresponding to each conductive sheet and preset parameter data includes:

[0017] When the AI ​​server computing board is a rectangular AI server computing board, a Cartesian coordinate system is established with the geometric center of the rectangular AI server computing board as the origin of the coordinate system, and with a pair of straight lines parallel to the adjacent sides of the rectangular AI server computing board as the x-axis and y-axis, respectively.

[0018] Obtain the x and y coordinates of each conductive sheet;

[0019] Based on the capacitance value of the parallel plate capacitor corresponding to each conductive sheet, preset parameter data, and the x and y coordinates of each conductive sheet, the tilt attitude parameters between the AI ​​server computing board and the heat dissipation metal plate are determined.

[0020] In one embodiment, after determining the tilt attitude parameters between the AI ​​server computing board and the heat dissipation metal plate, the method further includes:

[0021] If the tilt attitude parameters are within the preset threshold range, the tilt attitude state between the AI ​​server computing board and the heat dissipation metal plate is determined to be normal.

[0022] If the tilt attitude parameter is outside the preset threshold range, the tilt attitude state between the AI ​​server computing board and the heat dissipation metal plate is determined to be abnormal.

[0023] Secondly, a relative position parameter measurement device based on the parasitic capacitance method is also provided, used to detect the relative position parameters between the AI ​​server computing board and the heat dissipation metal plate; the relative position parameter measurement device based on the parasitic capacitance method includes:

[0024] The capacitance detection circuit has multiple first input terminals that are respectively connected to multiple conductive sheets at different positions on the AI ​​server computing board. The second input terminal of the capacitance detection circuit is connected to the heat dissipation metal plate. The capacitance detection circuit is used to detect the capacitance value of the parallel plate capacitor formed by each conductive sheet and the heat dissipation metal plate. Each conductive sheet is located on the side of the AI ​​server computing board closest to the heat dissipation metal plate.

[0025] The signal processing circuit is connected to the output of the capacitance detection circuit. The signal processing circuit is used to obtain and determine the relative position parameters between the AI ​​server computing board and the heat dissipation metal plate based on the capacitance value of the parallel plate capacitor corresponding to each conductive sheet.

[0026] In one embodiment, the relative position parameters include one or more of the following parameters: the average electrode spacing between the AI ​​server computing board and the heat dissipation metal plate, the standard deviation of the average electrode spacing between the AI ​​server computing board and the heat dissipation metal plate, the electrode spacing between each conductive sheet and the heat dissipation metal plate, the tilt attitude parameters between the AI ​​server computing board and the heat dissipation metal plate, and the standard deviation of the capacitance values ​​corresponding to the multiple conductive sheets.

[0027] In one embodiment, the capacitance detection circuit includes: an excitation source and a plurality of capacitance detection sub-channels;

[0028] The output terminals of the excitation source are connected to each conductive plate, and the excitation source is used to generate excitation signals.

[0029] Each capacitance detection sub-channel includes:

[0030] An automatic balancing bridge is connected to the excitation source, each conductive plate, and the heat dissipation metal plate.

[0031] The calculation module connects the excitation source and the automatic balancing bridge. The calculation module is used to obtain and determine the capacitance value of the parallel plate capacitor based on the resistance value of the reference impedance in the automatic balancing bridge, the bridge imbalance voltage of the automatic balancing bridge, and the electrical signal parameters of the excitation source.

[0032] Thirdly, a signal processing circuit is also provided, including a memory and a processor. The memory stores a computer program, and the processor executes the computer program to implement the steps of the above-mentioned method for determining relative position parameters based on the parasitic capacitance method.

[0033] The aforementioned method for determining relative position parameters based on parasitic capacitance, the corresponding measuring device, and the signal processing circuit can detect the capacitance value of the parallel plate capacitors corresponding to each conductive sheet. Furthermore, it can determine the relative position parameters between the AI ​​server computing board and the heat sink metal plate based on these capacitance values. Compared to traditional detection methods, this method does not require mechanical modifications such as drilling or adding brackets, and is compatible with the existing integrated structure of the heat sink metal plate and the AI ​​server computing board. Moreover, when using this method to detect the inter-board fit between the AI ​​server computing board and the heat sink metal plate, the two boards remain insulated and isolated, without electrical contact. Therefore, it does not damage the original circuit insulation, nor does it affect the signal links and power supply layout within the AI ​​server computing board and the heat sink metal plate, achieving non-contact, passive detection and improving the detection accuracy of the parasitic capacitance-based method for determining relative position parameters. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a flowchart illustrating a method for determining relative position parameters based on parasitic capacitance, according to one embodiment.

[0036] Figure 2This is a schematic diagram of the tilt detection geometric model in a relative position parameter determination method based on parasitic capacitance method according to an embodiment;

[0037] Figure 3 This is one of the structural block diagrams of a relative position parameter measuring device based on the parasitic capacitance method according to an embodiment;

[0038] Figure 4 This is the second structural block diagram of a relative position parameter measuring device based on the parasitic capacitance method, according to one embodiment. Detailed Implementation

[0039] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0041] It is understood that the terms "first," "second," etc., used herein may be used to describe various elements or ports, but these elements are not limited by these terms. These terms are only used to distinguish one element or port from another. For example, without departing from the scope of this application, a first input terminal may be referred to as a second input terminal, and similarly, a second input terminal may be referred to as a first input terminal. Both the first input terminal and the second input terminal are input terminals, but they are not the same input terminal.

[0042] It is understood that the term "connection" in the following embodiments should be understood as "electrical connection," "communication connection," etc., if the connected circuits, modules, units, etc., have electrical signal or data transmission with each other.

[0043] It is understandable that "multiple" refers to two or more. "At least part of an element" refers to part or all of an element.

[0044] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising,” “including,” or “having,” etc., specify the presence of the stated feature, whole, step, operation, component, part, or combination thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof.

[0045] Traditional mechanical measurement methods involve contact measurements using tools such as vernier calipers and feeler gauges. This method is not entirely suitable for the structural relationship between the heat sink and the AI ​​server's computing board, and its operation is rather cumbersome.

[0046] Traditional optical measurement methods use laser displacement sensors or vision systems. However, these methods are limited by detection conditions and are costly.

[0047] Traditional inductance measurement methods are suitable for metallic conductors, but they are affected by the conductivity and temperature of the measured object, and the inductance measurement method is not sensitive enough for micro-range detection.

[0048] It is evident that traditional measurement methods have limitations to varying degrees and suffer from insufficient detection accuracy.

[0049] In a specific embodiment, such as Figure 1 As shown, a method for determining relative position parameters based on parasitic capacitance is also provided. The relative position parameters are the relative position parameters between the AI ​​server computing board and the heat dissipation metal plate. The AI ​​server computing board and the heat dissipation metal plate are attached together. Conductive sheets are provided at multiple different positions on the AI ​​server computing board, and the conductive sheets are located on the side of the AI ​​server computing board that is close to the heat dissipation metal plate.

[0050] The method includes:

[0051] S102, obtain the capacitance value of each parallel plate capacitor composed of a conductive sheet and a heat dissipation metal plate.

[0052] S104. Determine the relative position parameters between the AI ​​server computing board and the heat dissipation metal plate based on the capacitance values ​​of the parallel plate capacitors corresponding to each conductive sheet.

[0053] Compared to traditional detection methods, this relative position parameter determination method based on parasitic capacitance does not require mechanical modifications such as drilling or adding brackets, and is compatible with the existing integrated structure of the heat sink and the AI ​​server computing board. Furthermore, when using this method to detect board-to-board bonding, the AI ​​server computing board and the heat sink remain insulated and isolated, with no electrical contact. Therefore, it does not damage the original circuit insulation, nor does it affect the signal links and power supply layout within the AI ​​server computing board and the heat sink, achieving non-contact, passive detection and improving the detection accuracy of the relative position parameter determination method based on parasitic capacitance.

[0054] In one specific embodiment, the relative position parameters include one or more of the following parameters: the average electrode spacing between the AI ​​server computing board and the heat dissipation metal plate, the standard deviation of the average electrode spacing between the AI ​​server computing board and the heat dissipation metal plate, the electrode spacing between each conductive sheet and the heat dissipation metal plate, the tilt attitude parameters between the AI ​​server computing board and the heat dissipation metal plate, and the standard deviation of the capacitance values ​​corresponding to the multiple conductive sheets.

[0055] The average electrode spacing between the AI ​​server computing board and the heat dissipation metal plate, as well as the electrode spacing between each conductive sheet and the heat dissipation metal plate, can characterize the relative positional parameters between the AI ​​server computing board and the heat dissipation metal plate from the dimension of electrode spacing.

[0056] The standard deviation of the average electrode spacing between the AI ​​server computing board and the heat dissipation metal plate, as well as the standard deviation of the capacitance values ​​corresponding to multiple conductive sheets, can characterize the relative positional parameters between the AI ​​server computing board and the heat dissipation metal plate from the perspective of standard deviation.

[0057] The tilt attitude parameters between the AI ​​server computing board and the heat dissipation metal plate can be used to characterize the relative position parameters between the AI ​​server computing board and the heat dissipation metal plate from the tilt attitude dimension.

[0058] In one specific embodiment, the step of determining the relative positional parameters between the AI ​​server computing board and the heat dissipation metal plate based on the capacitance values ​​of the parallel plate capacitors corresponding to each conductive sheet includes:

[0059] Based on the capacitance value of the parallel plate capacitor corresponding to each conductive sheet and the preset parameter data, determine one or more of the following parameters:

[0060] The average electrode spacing between the AI ​​server computing board and the heat dissipation metal plate, the standard deviation of the average electrode spacing between the AI ​​server computing board and the heat dissipation metal plate, the electrode spacing between each conductive sheet and the heat dissipation metal plate, and the tilt attitude parameters between the AI ​​server computing board and the heat dissipation metal plate.

[0061] The preset parameter data includes the vacuum dielectric constant, the relative dielectric constant between the conductive sheet and the heat sink metal plate, and the relative area between the conductive sheet and the heat sink metal plate.

[0062] Based on the capacitance value of the parallel plate capacitor corresponding to each conductive sheet and the preset parameter data, the average plate spacing between the AI ​​server computing board and the heat dissipation metal plate is determined; wherein, the preset parameter data includes the vacuum dielectric constant, the relative dielectric constant between the conductive sheet and the heat dissipation metal plate, and the relative area between each conductive sheet and the heat dissipation metal plate.

[0063] Based on the capacitance value of the parallel plate capacitor corresponding to each conductive sheet, the standard deviation of the capacitance values ​​corresponding to multiple conductive sheets can be determined.

[0064] Specifically, the formula for determining the standard deviation of the capacitance values ​​corresponding to multiple conductive sheets is as follows:

[0065] ,

[0066] in, 1 represents the standard deviation of the capacitance values ​​corresponding to multiple conductive plates. Let be the capacitance value of the parallel plate capacitor corresponding to the i-th conductive sheet. This represents the average capacitance value of the parallel-plate capacitors corresponding to the n conductive plates.

[0067] Similarly, based on the above calculation principle of standard deviation, the average standard deviation of the electrode spacing between the AI ​​server computing board and the heat dissipation metal plate can be determined after obtaining the electrode spacing between each conductive sheet and the heat sink.

[0068] Specifically, the formula for determining the standard deviation of the average electrode spacing between the AI ​​server computing board and the heat dissipation metal plate is as follows:

[0069] ,

[0070] in, 2 represents the standard deviation of the average electrode spacing between the AI ​​server computing board and the heat dissipation metal plate. Let J be the electrode spacing between the j-th conductive plate and the heat dissipation metal plate on the AI ​​server computing board. This refers to the average electrode spacing between the AI ​​server's computing board and the heat dissipation metal plate.

[0071] In a conductive sheet, the electrode spacing between the conductive sheet and the heat dissipation metal plate is determined based on the capacitance value of the parallel plate capacitor corresponding to the conductive sheet and preset parameter data; wherein, the preset parameter data includes the vacuum dielectric constant, the relative dielectric constant between the conductive sheet and the heat dissipation metal plate, and the relative area between the conductive sheet and the heat dissipation metal plate.

[0072] In one specific embodiment, the step of determining the average electrode spacing between the AI ​​server computing board and the heat dissipation metal plate based on the capacitance value of the parallel plate capacitor corresponding to each conductive sheet and preset parameter data includes:

[0073] Assuming the relative areas of each conductive sheet and the heat dissipation metal plate are equal, the average electrode spacing between the AI ​​server computing board and the heat dissipation metal plate is determined based on the capacitance values ​​of the parallel plate capacitors corresponding to each conductive sheet, preset parameter data, and the following expression:

[0074] ,

[0075] in, The average electrode spacing between the AI ​​server computing board and the heat dissipation metal plate. The vacuum permittivity, The relative permittivity between the conductive sheet and the heat dissipation metal plate is denoted as . The relative area of ​​each conductive sheet and the heat dissipation metal plate. The number of conductive sheets. The capacitance value is the value of the parallel-plate capacitor corresponding to the first conductive sheet. The capacitance value is the value of the parallel plate capacitor corresponding to the second conductive sheet. The capacitance value is the value of the parallel plate capacitor corresponding to the third conductive sheet. Let be the capacitance value of the parallel plate capacitor corresponding to the nth conductive sheet.

[0076] With equal relative areas of each conductive sheet and the heat dissipation metal plate, the average board spacing between the AI ​​server computing board and the heat dissipation metal plate can be calculated and determined with less computing power, resulting in high efficiency.

[0077] In one specific embodiment, the step of determining the tilt attitude parameters between the AI ​​server computing board and the heat dissipation metal plate based on the capacitance values ​​of the parallel plate capacitors corresponding to each conductive sheet and preset parameter data includes:

[0078] When the AI ​​server computing board is a rectangular AI server computing board, a Cartesian coordinate system is established with the geometric center of the rectangular AI server computing board as the origin of the coordinate system, and with the straight lines parallel to a set of adjacent sides of the rectangular AI server computing board as the x-axis and y-axis, respectively.

[0079] Obtain the x and y coordinates of each conductive sheet.

[0080] Based on the capacitance value of the parallel plate capacitor corresponding to each conductive sheet, preset parameter data, and the x and y coordinates of each conductive sheet, the tilt attitude parameters between the AI ​​server computing board and the heat dissipation metal plate are determined.

[0081] like Figure 2 As shown, specifically taking four conductive plates as an example, with the four conductive plates respectively placed at the four corners of the rectangular AI server computing board, the distance between two adjacent conductive plates on a side can be determined based on the x and y coordinates of each conductive plate. The formula for determining the tilt attitude parameters is as follows:

[0082] ,

[0083] ,

[0084] in, The vacuum permittivity, The relative permittivity between the conductive sheet and the heat dissipation metal plate is denoted as . The relative area of ​​each conductive sheet and the heat dissipation metal plate. The capacitance value is the value of the parallel-plate capacitor corresponding to the first conductive sheet. The capacitance value is the value of the parallel plate capacitor corresponding to the second conductive sheet. The capacitance value is the value of the parallel plate capacitor corresponding to the third conductive sheet. This refers to the capacitance value of the parallel-plate capacitor corresponding to the fourth conductive sheet. The distance between two adjacent conductive plates on the first side of the AI ​​server computing board. The distance between two adjacent conductive sheets on the second side of the AI ​​server computing board is defined as the distance between the first and second sides of the AI ​​server computing board. Let be the angle between the AI ​​server's computing board and the heat dissipation metal plate on the plane perpendicular to the y-axis. The angle between the AI ​​server's computing board and the heat dissipation metal plate on the plane perpendicular to the x-axis.

[0085] In one specific embodiment, after determining the tilt attitude parameters between the AI ​​server computing board and the heat dissipation metal plate, the above method further includes:

[0086] If the tilt attitude parameters are within the preset threshold range, the tilt attitude state between the AI ​​server computing board and the heat dissipation metal plate is determined to be normal.

[0087] If the tilt attitude parameter is outside the preset threshold range, the tilt attitude state between the AI ​​server computing board and the heat dissipation metal plate is determined to be abnormal.

[0088] If the tilt attitude parameters are within the preset threshold range, the tilt attitude between the AI ​​server computing board and the heat sink is considered acceptable. If the tilt attitude parameters are outside the preset threshold range, the tilt attitude between the AI ​​server computing board and the heat sink is considered unacceptable. If the tilt attitude between the AI ​​server computing board and the heat sink is abnormal, personnel can inspect and repair the AI ​​server computing board and the heat sink based on the tilt attitude parameters.

[0089] In one embodiment, after determining the relative positional parameters between the AI ​​server computing board and the heat dissipation metal plate, the method further includes:

[0090] If the relative position parameter is within the relative position threshold range, the relative position between the AI ​​server computing board and the heat dissipation metal plate is determined to be within the acceptable range.

[0091] If the relative position parameter is outside the relative position threshold range, the relative position between the AI ​​server computing board and the heat dissipation metal plate is determined to be within the unqualified range.

[0092] Correspondingly, if the relative position between the AI ​​server computing board and the heat dissipation metal plate is within the acceptable range, the staff can inspect and repair the AI ​​server computing board and the heat dissipation metal plate.

[0093] In a specific embodiment, such as Figure 3 As shown, a relative position parameter measuring device 10 based on the parasitic capacitance method is used to detect the relative position parameters between an AI server computing board (PCBA, Printed Circuit Board Assembly) 20 and a heat dissipation metal plate 30. The relative position parameter measuring device 10 based on the parasitic capacitance method includes a capacitance detection circuit 102 and a signal processing circuit 104.

[0094] Multiple first input terminals of the capacitance detection circuit 102 ( Figure 3 PIN1 in the figure is used to connect one-to-one with the conductive pieces 202 at different positions on the AI ​​server computing board 20, and the second input terminal of the capacitance detection circuit 102. Figure 3 PIN2 is used to connect to the heat sink metal plate 30, and the capacitance detection circuit 102 is used to detect the capacitance value of the parallel plate capacitor formed by each conductive sheet 202 and the heat sink metal plate 30; wherein, each conductive sheet 202 is disposed on the side of the AI ​​server computing board 20 close to the heat sink metal plate 30. The conductive sheets 202 may be symmetrically or asymmetrically distributed on the AI ​​server computing board 20.

[0095] The signal processing circuit 104 is connected to the output terminal of the capacitance detection circuit 102. The signal processing circuit 104 is used to obtain and determine the relative position parameters between the AI ​​server computing board 20 and the heat dissipation metal plate 30 based on the capacitance value of the parallel plate capacitor corresponding to each conductive sheet 202.

[0096] Each conductive sheet 202 is disposed on the AI ​​server computing board 20 and is arranged opposite to and parallel to the heat dissipation metal plate 30. Thus, a conductive sheet 202 and a corresponding area on the heat dissipation metal plate 30 together constitute a parallel plate capacitor. The corresponding area on the heat dissipation metal plate 30 is the projection area of ​​the conductive sheet 202 on the heat dissipation metal plate 30 along a direction perpendicular to the heat dissipation metal plate 30.

[0097] The resistors, chips, capacitors, and other components on the AI ​​server computing board 20 rely on copper foil traces for electrical connection. Therefore, the conductive sheets 202 at various locations on the AI ​​server computing board 20 can be the copper-clad areas corresponding to these copper foil traces. In this case, without structural modifications to the AI ​​server computing board 20 and the heat sink 30, parasitic capacitance can be formed by the heat sink 30 and the copper-clad areas on the AI ​​server computing board 20, creating a parallel-plate capacitor. This significantly reduces the impact of the relative position parameter measurement device 10 based on the parasitic capacitance method on the AI ​​server computing board 20 and the heat sink 30 during the detection process.

[0098] Furthermore, the space between the AI ​​server computing board 20 and the heat dissipation metal plate 30 is narrow, making it technically challenging to detect the relative positional parameters between them using a large-volume detection device. However, utilizing the conductive sheet 202 on the AI ​​server computing board 20 for relative positional parameter detection significantly reduces this technical difficulty, is suitable for the confined space between the AI ​​server computing board 20 and the heat dissipation metal plate 30, and eliminates the need for additional mechanical modules, resulting in high ease of use.

[0099] After the AI ​​server computing board 20 and the heat dissipation metal plate 30 are installed, gaps of varying degrees may exist between them due to errors in the installation process and mechanical components. These installation components include screws. Relative positional parameters characterize the fit between the AI ​​server computing board 20 and the heat dissipation metal plate 30. Specifically, relative positional parameters may characterize parameters such as the electrode spacing and parallelism between the AI ​​server computing board 20 and the heat dissipation metal plate 30.

[0100] Therefore, the aforementioned relative position parameter measuring device 10 based on the parasitic capacitance method, based on the capacitance detection circuit 102, can detect the capacitance value of the parallel plate capacitor corresponding to each conductive sheet 202; based on the signal processing circuit 104, it can determine the relative position parameters between the AI ​​server computing board 20 and the heat dissipation metal plate 30 according to each capacitance value. Compared with traditional detection methods, this relative position parameter measuring device 10 based on the parasitic capacitance method does not require mechanical modifications such as drilling holes or adding brackets, and is compatible with the existing integrated structure of the heat dissipation metal plate and the AI ​​server computing board 20. Moreover, when using this relative position parameter measuring device 10 based on the parasitic capacitance method to detect the board-to-board fit, the AI ​​server computing board 20 and the heat dissipation metal plate 30 remain insulated and isolated, without electrical contact. Therefore, it will not damage the original circuit insulation, nor will it affect the signal link and power supply layout in the AI ​​server computing board 20 and the heat dissipation metal plate 30, realizing non-contact passive detection and improving the detection accuracy of the relative position parameter measuring device 10 based on the parasitic capacitance method.

[0101] Furthermore, the relative position parameter measurement device 10 based on the parasitic capacitance method does not require additional sensors; it can detect the relative position parameters between the AI ​​server computing board 20 and the heat dissipation metal plate 30 based on parasitic capacitance. This parasitic capacitance itself has high-frequency response characteristics, making it compatible with the AI ​​server computing board 20, and especially the AI ​​server computing board 20, enabling rapid detection of board-to-board fit in high-speed link scenarios.

[0102] In one specific embodiment, the relative position parameters include one or more of the following parameters: the average electrode spacing between the AI ​​server computing board 20 and the heat dissipation metal plate 30, the standard deviation of the average electrode spacing between the AI ​​server computing board 20 and the heat dissipation metal plate 30, the electrode spacing between each conductive sheet 202 and the heat dissipation metal plate 30, the tilt attitude parameter between the AI ​​server computing board 20 and the heat dissipation metal plate 30, and the standard deviation of the capacitance values ​​corresponding to the multiple conductive sheets 202.

[0103] Based on the capacitance value of the parallel plate capacitor corresponding to each conductive sheet 202 and the preset parameter data, the average plate spacing between the AI ​​server computing board 20 and the heat dissipation metal plate 30 is determined; wherein, the preset parameter data includes the vacuum dielectric constant, the relative dielectric constant between the conductive sheet 202 and the heat dissipation metal plate 30, and the relative area between each conductive sheet 202 and the heat dissipation metal plate 30.

[0104] Based on the capacitance value of the parallel plate capacitor corresponding to each conductive sheet 202, the standard deviation of the capacitance values ​​corresponding to multiple conductive sheets 202 can be determined.

[0105] Specifically, the formula for determining the standard deviation of the capacitance values ​​corresponding to the multiple conductive sheets 202 is as follows:

[0106] ,

[0107] in, The standard deviation of the capacitance values ​​corresponding to the multiple conductive sheets 202. Let be the capacitance value of the parallel plate capacitor corresponding to the i-th conductive sheet 202. This represents the average capacitance value of the parallel plate capacitors corresponding to the n conductive sheets 202.

[0108] Similarly, based on the above standard deviation calculation principle, the average standard deviation of the electrode spacing between the AI ​​server computing board 20 and the heat dissipation metal plate 30 can be determined after obtaining the electrode spacing between each conductive sheet 202 and the heat sink.

[0109] Specifically, the formula for determining the standard deviation of the average electrode spacing between the AI ​​server computing board and the heat dissipation metal plate is as follows:

[0110] ,

[0111] in, 2 represents the standard deviation of the average electrode spacing between the AI ​​server computing board and the heat dissipation metal plate. Let J be the electrode spacing between the j-th conductive plate and the heat dissipation metal plate on the AI ​​server computing board. This refers to the average electrode spacing between the AI ​​server's computing board and the heat dissipation metal plate.

[0112] In a conductive sheet 202, the electrode spacing between the conductive sheet 202 on the AI ​​server computing board 20 and the heat dissipation metal plate 30 is determined based on the capacitance value of the parallel plate capacitor corresponding to the conductive sheet 202 and preset parameter data; wherein, the preset parameter data includes the vacuum dielectric constant, the relative dielectric constant between the conductive sheet 202 and the heat dissipation metal plate 30, and the relative area between the conductive sheet 202 and the heat dissipation metal plate 30.

[0113] Taking a rectangular AI server computing board 20 as an example, with four conductive sheets 202, the conductive sheets 202 are respectively set on the four corners of the rectangular AI server computing board. A Cartesian coordinate system is established with the geometric center of the rectangular AI server computing board as the origin of the coordinate system, and with a set of adjacent lines parallel to the rectangular AI server computing board as the x-axis and y-axis respectively.

[0114] Obtain the x and y coordinates of each conductive sheet 202.

[0115] Based on the capacitance value of the parallel plate capacitor corresponding to each conductive sheet 202, the preset parameter data, and the x and y coordinates of each conductive sheet 202, the tilt attitude parameters between the AI ​​server computing board 20 and the heat dissipation metal plate 30 are determined.

[0116] The tilt attitude parameter is used to characterize the tilt angle between the plane where the AI ​​server computing board 20 is located and the plane where the heat dissipation metal plate 30 is located.

[0117] In a specific embodiment, such as Figure 4 As shown, the capacitance detection circuit 102 includes an excitation source and multiple capacitance detection sub-channels.

[0118] The output terminals of the excitation source are connected to each conductive sheet 202, and the excitation source is used to generate excitation signals.

[0119] Each capacitance detection sub-channel includes: an automatic balancing bridge 1022 and a calculation module.

[0120] The automatic balancing bridge 1022 is connected to the excitation source, each conductive plate 202 and the heat dissipation metal plate 30 respectively.

[0121] The calculation module is connected to the excitation source and the automatic balancing bridge 1022. The calculation module is used to obtain and determine the capacitance value of the parallel plate capacitor based on the resistance value of the reference impedance in the automatic balancing bridge 1022, the bridge imbalance voltage of the automatic balancing bridge 1022, and the electrical signal parameters of the excitation source.

[0122] The automatic balancing bridge 1022 includes a reference impedance R. F And amplifier circuit A, Figure 4 The impedance Z in x The corresponding representation is a parallel-plate capacitor, and the excitation signal is an excitation voltage signal. Specifically, the excitation signal can be a sine wave signal V with an amplitude of V and a frequency of f. i .

[0123] Based on this automatic balancing bridge 1022, the bridge imbalance voltage V of the automatic balancing bridge 1022 can be detected. x , where V x =I x *R F I x For the flow through the reference impedance R F The current.

[0124] According to the excitation signal V i The bridge imbalance voltage V output by the automatic balancing bridge 1022 x Reference impedance R F The impedance value of a parallel-plate capacitor is determined using the following formula:

[0125] ,

[0126] The formula for determining the capacitance value of a parallel plate capacitor is:

[0127] ,

[0128] in, X is the angular frequency. X This represents the imaginary part of the impedance of a parallel-plate capacitor. Rx is the real part of the impedance of the parallel-plate capacitor, and j is the imaginary unit, j= .

[0129] This automatic balancing bridge method uses the principle of vector impedance measurement, simultaneously measuring the real and imaginary parts of the impedance, and calculates the capacitance value while eliminating the influence of parasitic resistance.

[0130] In one embodiment, the number of capacitance detection sub-channels in the capacitance detection circuit 102 is the same as the number of conductive sheets 202, thereby enabling independent sampling and calculation for each conductive sheet 202. Furthermore, since the calculations of each conductive sheet 202 are independent, they can be performed synchronously, thus achieving millisecond-level polling.

[0131] The automatic balancing bridge 1022, based on the automatic balancing bridge method, automatically adjusts the reference branch through a negative feedback loop to maintain the bridge in a balanced state in real time, directly outputting a digital quantity proportional to the measured capacitance without manual adjustment or iterative search. The measured capacitance is a parallel-plate capacitor composed of the conductive sheet 202 and the heat-dissipating metal plate 30. Therefore, the capacitance detection circuit 102 employs a multi-channel automatic balancing bridge structure.

[0132] By inputting a sinusoidal excitation signal with a frequency in the MHz range into the automatic balancing bridge 1022, and in conjunction with phase-sensitive detection technology, the detection resolution of the relative position parameter measuring device 10 based on the parasitic capacitance method can be improved to the aF level.

[0133] In one specific embodiment, when the AI ​​server computing board 20 is a rectangular AI server computing board, each conductive sheet 202 is disposed at the corner of the rectangular AI server computing board.

[0134] In one embodiment, when the AI ​​server computing board 20 is a rectangular AI server computing board, each conductive sheet 202 is disposed at at least three corners of the rectangular AI server computing board.

[0135] The three corners correspond to the three capacitance detection sub-channels in the capacitance detection circuit 102. Compared with four or more capacitance detection sub-channels, the three capacitance detection sub-channels consume less computing power. By adopting the computing power scheme of three capacitance detection sub-channels with lower computing power, the detection efficiency of the relative position parameter measurement device 10 based on the parasitic capacitance method can be improved.

[0136] In one embodiment, when the relative areas between each conductive plate and the heat dissipation metal plate 30 are equal, the formula for determining the average electrode spacing is:

[0137] ,

[0138] in, The average electrode spacing between the AI ​​server computing board 20 and the heat dissipation metal plate 30. The vacuum permittivity, The relative permittivity between the conductive sheet 202 and the heat dissipation metal plate 30 is... The relative area of ​​each of the conductive sheets 202 and the heat dissipation metal plate 30. The number of conductive sheets 202 The capacitance value is the value of the parallel plate capacitor corresponding to the first conductive sheet 202. The capacitance value is the value of the parallel plate capacitor corresponding to the second conductive sheet 202. The capacitance value is the value of the parallel plate capacitor corresponding to the third conductive sheet 202. This is the capacitance value of the parallel plate capacitor corresponding to the nth conductive sheet 202.

[0139] In a specific embodiment, such as Figure 2 and Figure 4 As shown, a heat-conducting layer 40 is also provided between the AI ​​server computing board 20 and the heat dissipation metal plate 30.

[0140] The thermally conductive layer 40 is made of thermally conductive materials such as thermal grease, which can improve the heat dissipation efficiency of the AI ​​server computing board 20. At the same time, the thermally conductive layer 40, which is located between the AI ​​server computing board 20 and the heat dissipation metal plate 30, can ensure the insulation between the AI ​​server computing board 20 and the heat dissipation metal plate 30, thereby facilitating the formation of parasitic capacitance between the conductive sheets on the AI ​​server computing board 20 and the heat dissipation metal plate 30, thus forming a parallel plate capacitor.

[0141] Furthermore, the heat dissipation metal plate 30 can further improve the heat dissipation efficiency of the AI ​​server computing board 20, thereby reducing the local high temperature of the AI ​​server computing board 20 and improving the computing performance of the AI ​​server computing board 20.

[0142] In one specific embodiment, a signal processing circuit is also provided, including a memory and a processor. The memory stores a computer program, and the processor executes the computer program to implement the steps of the above-described method for determining relative position parameters based on the parasitic capacitance method.

[0143] In the description of this specification, references to terms such as "some embodiments," "other embodiments," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0144] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0145] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these modifications and improvements all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A method for determining relative position parameters based on parasitic capacitance, characterized in that, The relative position parameter is the relative position parameter between the AI ​​server computing board and the heat dissipation metal plate. The AI ​​server computing board and the heat dissipation metal plate are fitted together. Conductive sheets are provided at multiple different positions on the AI ​​server computing board, and the conductive sheets are located on the side of the AI ​​server computing board closest to the heat dissipation metal plate. The method includes: Obtain the capacitance value of each of the parallel plate capacitors formed by the conductive sheet and the heat dissipation metal plate; The relative position parameters between the AI ​​server computing board and the heat dissipation metal plate are determined based on the capacitance values ​​of the parallel plate capacitors corresponding to each conductive sheet.

2. The method for determining relative position parameters based on parasitic capacitance according to claim 1, characterized in that, The relative position parameters include one or more of the following parameters: the average electrode spacing between the AI ​​server computing board and the heat dissipation metal plate, the standard deviation of the average electrode spacing between the AI ​​server computing board and the heat dissipation metal plate, the electrode spacing between each conductive sheet and the heat dissipation metal plate, the tilt attitude parameter between the AI ​​server computing board and the heat dissipation metal plate, and the standard deviation of the capacitance values ​​corresponding to the multiple conductive sheets.

3. The method for determining relative position parameters based on parasitic capacitance according to claim 2, characterized in that, The step of determining the relative position parameters between the AI ​​server computing board and the heat dissipation metal plate based on the capacitance values ​​of the parallel plate capacitors corresponding to each of the conductive sheets includes: Based on the capacitance value of the parallel plate capacitor corresponding to each conductive sheet and the preset parameter data, determine one or more of the following parameters: The average electrode spacing between the AI ​​server computing board and the heat dissipation metal plate, the standard deviation of the average electrode spacing between the AI ​​server computing board and the heat dissipation metal plate, the electrode spacing between each conductive sheet and the heat dissipation metal plate, and the tilt attitude parameters between the AI ​​server computing board and the heat dissipation metal plate. The preset parameter data includes the vacuum dielectric constant, the relative dielectric constant between the conductive sheet and the heat dissipation metal plate, and the relative area between the conductive sheet and the heat dissipation metal plate.

4. The method for determining relative position parameters based on the parasitic capacitance method according to claim 3, characterized in that, Based on the capacitance values ​​of the parallel-plate capacitors corresponding to each conductive sheet and preset parameter data, the average electrode spacing between the AI ​​server computing board and the heat dissipation metal plate is determined, including: When the relative areas of each conductive sheet and the heat dissipation metal plate are equal, the average plate spacing between the AI ​​server computing board and the heat dissipation metal plate is determined based on the capacitance values ​​of the parallel plate capacitors corresponding to each conductive sheet, the preset parameter data, and the following expression: ， in, The average electrode spacing between the AI ​​server computing board and the heat dissipation metal plate. The vacuum permittivity, The relative permittivity between the conductive sheet and the heat dissipation metal plate is denoted as . The relative area of ​​each conductive sheet and the heat dissipation metal plate. The number of conductive sheets. The capacitance value is the value of the parallel-plate capacitor corresponding to the first conductive sheet. The capacitance value is the value of the parallel plate capacitor corresponding to the second conductive sheet. The capacitance value is the value of the parallel plate capacitor corresponding to the third conductive sheet. Let be the capacitance value of the parallel plate capacitor corresponding to the nth conductive sheet.

5. The method for determining relative position parameters based on parasitic capacitance according to claim 3, characterized in that, Based on the capacitance values ​​of the parallel plate capacitors corresponding to each conductive sheet and preset parameter data, the tilt attitude parameters between the AI ​​server computing board and the heat dissipation metal plate are determined, including: When the AI ​​server computing board is a rectangular AI server computing board, a Cartesian coordinate system is established with the geometric center of the rectangular AI server computing board as the origin of the coordinate system, and with a set of adjacent lines parallel to the rectangular AI server computing board as the x-axis and y-axis, respectively. Obtain the x and y coordinates of each conductive sheet; Based on the capacitance value of the parallel plate capacitor corresponding to each conductive sheet, the preset parameter data, and the x and y coordinates of each conductive sheet, the tilt attitude parameters between the AI ​​server computing board and the heat dissipation metal plate are determined.

6. The method for determining relative position parameters based on the parasitic capacitance method according to claim 5, characterized in that, After determining the tilt attitude parameters between the AI ​​server computing board and the heat dissipation metal plate, the method further includes: If the tilt attitude parameter is within a preset threshold range, the tilt attitude state between the AI ​​server computing board and the heat dissipation metal plate is determined to be normal. If the tilt attitude parameter is outside the preset threshold range, the tilt attitude state between the AI ​​server computing board and the heat dissipation metal plate is determined to be an abnormal state.

7. A relative position parameter measuring device based on the parasitic capacitance method, characterized in that, The device for measuring the relative position parameters between the AI ​​server computing board and the heat dissipation metal plate includes: A capacitance detection circuit is provided, wherein multiple first input terminals of the capacitance detection circuit are respectively used to connect one-to-one with multiple conductive sheets at different positions on the AI ​​server computing board, and a second input terminal of the capacitance detection circuit is used to connect to the heat dissipation metal plate. The capacitance detection circuit is used to detect the capacitance value of each parallel plate capacitor formed by the conductive sheet and the heat dissipation metal plate; wherein each conductive sheet is disposed on the side of the AI ​​server computing board closest to the heat dissipation metal plate. A signal processing circuit is connected to the output of the capacitance detection circuit. The signal processing circuit is used to acquire and determine the relative position parameters between the AI ​​server computing board and the heat dissipation metal plate based on the capacitance values ​​of the parallel plate capacitors corresponding to each conductive sheet.

8. The relative position parameter measuring device based on the parasitic capacitance method according to claim 7, characterized in that, The relative position parameters include one or more of the following parameters: the average electrode spacing between the AI ​​server computing board and the heat dissipation metal plate, the standard deviation of the average electrode spacing between the AI ​​server computing board and the heat dissipation metal plate, the electrode spacing between each conductive sheet and the heat dissipation metal plate, the tilt attitude parameter between the AI ​​server computing board and the heat dissipation metal plate, and the standard deviation of the capacitance values ​​corresponding to the multiple conductive sheets.

9. The relative position parameter measuring device based on the parasitic capacitance method according to claim 7, characterized in that, The capacitance detection circuit includes: an excitation source and multiple capacitance detection sub-channels; The output terminal of the excitation source is connected to each of the conductive sheets respectively, and the excitation source is used to generate an excitation signal; Each of the aforementioned capacitance detection sub-channels includes: An automatic balancing bridge is connected to the excitation source, each of the conductive plates, and the heat dissipation metal plate. A calculation module is connected to the excitation source and the automatic balancing bridge. The calculation module is used to obtain and determine the capacitance value of the parallel plate capacitor based on the resistance value of the reference impedance in the automatic balancing bridge, the bridge imbalance voltage of the automatic balancing bridge, and the electrical signal parameters of the excitation source.

10. A signal processing circuit, characterized in that, It includes a memory and a processor, the memory storing a computer program, and the processor executing the computer program to implement the steps of the method according to any one of claims 1 to 6.

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