Root cause analysis methods, devices, electronic equipment, media and products
By combining machine learning models with engineer experience in semiconductor manufacturing, features are extracted from multi-dimensional data, solving the problem of low accuracy in existing traceability analysis and achieving more accurate yield traceability and production optimization.
Patent Information
- Application Number
- CN202411954460.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-27
- Publication Date
- 2026-06-30
AI Technical Summary
Existing traceability analysis has low accuracy in semiconductor manufacturing and cannot fully reflect the complexity of yield issues, leading to low analysis efficiency and misleading optimization.
By employing a pre-trained machine learning model, feature data is extracted from multi-dimensional data through multiple feature extraction layers. Combined with engineers' experience and prior information, the source tracing results are comprehensively analyzed to ensure the representativeness and interpretability of the results.
It improves the accuracy and efficiency of yield traceability analysis, enabling the identification of the root causes of yield anomalies caused by multiple factors, reducing misleading optimization, and improving production efficiency and product quality.
Smart Images

Figure CN122310068A_ABST