A radio frequency neutralizer system and an ion source integrated with a radio frequency neutralizer system

Abstract

This invention discloses a radio frequency (RF) neutralizer system and an integrated system of ion source and RF neutralizer. The RF neutralizer system includes: a neutralizer body, comprising a first reaction chamber, an RF coil, and an electrode structure. The RF coil is located on the outer wall of the first reaction chamber and is used to receive RF energy to ionize the process gas within the first reaction chamber. The electrode structure is located inside the first reaction chamber and is used to eject electrons from the first reaction chamber. A first RF driving power supply includes a first detection and control unit, a first DC power supply unit, and a first driving amplification unit. The first detection and control unit is used to detect first current information and first voltage information at the output of the first driving amplification unit. The first driving amplification unit is integrated into the neutralizer body and is disposed together with the neutralizer body within a vacuum process chamber. This invention ensures the fabrication accuracy of semiconductor devices and eliminates the need for impedance matching devices.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a radio frequency neutralizer system and an integrated system of ion source and radio frequency neutralizer. Background Technology

[0002] In semiconductor device manufacturing processes, etching and coating processes often employ ion beam processing technology. Ion beam processing equipment typically includes an ion source and a radio frequency neutralizer. The ion source generates a positively charged ion beam, and the radio frequency neutralizer provides electrons to neutralize the ion beam, resulting in a neutral beam current for etching or coating the wafer.

[0003] Currently, the RF neutralizer body is typically located inside a vacuum process chamber, while the RF power supply and matching unit that provide RF energy to the RF neutralizer body are located outside the vacuum process chamber. The matching unit and the RF neutralizer body are electrically connected via RF cables. Because the length of the RF cables is fixed, the position of the RF neutralizer body within the vacuum process chamber is difficult to adjust flexibly, making movement extremely inconvenient.

[0004] As semiconductor chip integration continues to increase and critical dimensions shrink, etching processes face increasingly stringent requirements for high selectivity and precise pattern transfer. To improve etching uniformity and control pattern accuracy, it is often necessary to enhance etching precision by rotating the etching angle of the neutral beam. This necessitates adjusting the position of the RF neutralizer body to achieve neutral beam angle adjustment. However, the limited range of motion of the RF neutralizer body is severely restricted by the fixed length of the RF cable, making flexible adjustment of the neutral beam etching angle difficult and failing to meet the requirements for high-precision pattern transfer, thus affecting the fabrication accuracy of semiconductor devices. Summary of the Invention

[0005] This invention provides a radio frequency neutralizer system and an integrated system of ion source and radio frequency neutralizer, which can ensure the manufacturing accuracy of semiconductor devices and eliminates the need for impedance matching devices.

[0006] According to one aspect of the present invention, a radio frequency neutralizer system is provided, the radio frequency neutralizer system comprising:

[0007] The neutralizer body includes a first reaction chamber, a radio frequency coil, and an electrode structure. The radio frequency coil is located on the outer wall of the first reaction chamber and is used to receive radio frequency energy to ionize the process gas in the first reaction chamber. The electrode structure is located inside the first reaction chamber and is used to push out electrons from the first reaction chamber.

[0008] The first radio frequency driving power supply includes a first detection control unit, a first DC power supply unit, and a first driving amplification unit; the first detection control unit is electrically connected to the first DC power supply unit and the first driving amplification unit, the first DC power supply unit is electrically connected to the power supply terminal of the first driving amplification unit, and the output terminal of the first driving amplification unit is electrically connected to the radio frequency coil.

[0009] The first detection control unit is used to detect the first current information and the first voltage information at the output terminal of the first drive amplification unit, and control the output frequency of the first radio frequency drive power supply according to the first current information and the first voltage information to match the internal impedance change of the first reaction cavity;

[0010] The first drive amplification unit is integrated into the neutralizer body and is disposed together with the neutralizer body in the vacuum process chamber.

[0011] Optionally, the neutralizer body further includes an electrode detection unit;

[0012] The electrode detection unit is used to detect the second current information on the electrode structure;

[0013] The first detection control unit is also electrically connected to the electrode detection unit, and controls the DC voltage value output by the first DC power supply unit according to the second current information to control the amount of electrons output by the neutralizer body.

[0014] Optionally, the neutralizer body further includes an ignition unit;

[0015] The first detection and control unit is used to determine the ignition state of the ignition unit based on the second current information on the electrode structure.

[0016] Optionally, the first DC power supply unit and the first detection and control unit are both integrated into the neutralizer body and disposed together with the neutralizer body in the vacuum process chamber.

[0017] Optionally, the neutralizer body also includes a metal shield;

[0018] The first reaction chamber, the radio frequency coil, the electrode structure, and the first drive amplification unit are all located inside the metal shield.

[0019] Optionally, the neutralizer body further includes a liquid cooling plate;

[0020] The first drive amplification unit is located on one side of the liquid cooling plate.

[0021] Optionally, the first driving amplification unit includes a first driving subunit, a second driving subunit, a third driving subunit, a fourth driving subunit, a first amplification subunit, a second amplification subunit, a third amplification subunit, and a fourth amplification subunit.

[0022] The input terminals of the first driving subunit, the second driving subunit, the third driving subunit, and the fourth driving subunit are all electrically connected to the first detection and control unit.

[0023] The first end of the first amplification subunit and the first end of the third amplification subunit are both electrically connected to the first DC power supply unit.

[0024] The control terminal of the first amplification subunit is electrically connected to the output terminal of the first drive subunit, the control terminal of the second amplification subunit is electrically connected to the output terminal of the second drive subunit, the control terminal of the third amplification subunit is electrically connected to the output terminal of the third drive subunit, and the control terminal of the fourth amplification subunit is electrically connected to the output terminal of the fourth drive subunit.

[0025] The second end of the first amplification subunit is electrically connected to the first end of the second amplification subunit, and the second end of the second amplification subunit is grounded; the second end of the third amplification subunit is electrically connected to the first end of the fourth amplification subunit, and the second end of the fourth amplification subunit is grounded.

[0026] The radio frequency coil is connected between the second end of the first amplification subunit and the second end of the third amplification subunit.

[0027] Optionally, the first driving amplification unit includes a fifth driving subunit and a sixth driving subunit, a fifth amplification subunit and a sixth amplification subunit;

[0028] The input terminals of the fifth driving subunit and the sixth driving subunit are both electrically connected to the first detection and control unit.

[0029] The first end of the fifth amplification subunit is electrically connected to the first DC power supply unit, the control end of the fifth amplification subunit is electrically connected to the output end of the fifth drive subunit, and the second end of the fifth amplification subunit is electrically connected to the first end of the sixth amplification subunit.

[0030] The second terminal of the sixth amplification subunit is grounded, and the control terminal of the sixth amplification subunit is electrically connected to the output terminal of the sixth drive subunit.

[0031] The first end of the radio frequency coil is electrically connected to the second end of the fifth amplification subunit, and the second end of the radio frequency coil is grounded.

[0032] According to another aspect of the present invention, an integrated ion source system and radio frequency neutralizer system are provided, the integrated system comprising an ion source system and a radio frequency neutralizer system provided in any embodiment of the present invention;

[0033] The ion source system includes a second radio frequency drive power supply and an ion source body;

[0034] The ion source body and the neutralizer body are integrally connected and are disposed together in the vacuum process chamber.

[0035] Optionally, the ion source body is used to receive radio frequency energy output from the second radio frequency drive power supply to ionize process gas and generate positive ions;

[0036] The second radio frequency driving power supply includes a second detection control unit, a second DC power supply unit, and a second driving amplification unit; the second driving amplification unit is integrated into the ion source body and is disposed together with the ion source body in the vacuum process chamber.

[0037] This invention provides a radio frequency (RF) neutralizer system. In this system, a first RF driving power supply adjusts its output frequency by collecting first current and first voltage information from its output terminal, thereby achieving impedance matching between the first RF driving power supply and the first reaction cavity. This eliminates the need for an impedance matching device, reducing the number and size of components in the RF neutralizer system. Furthermore, this invention integrates the first driving amplification unit of the first RF driving power supply with the neutralizer body, allowing the first driving amplification unit to move integrally with the neutralizer body. This avoids the limitation of RF cable length affecting the movement path of the neutralizer body, thus ensuring the manufacturing accuracy of the semiconductor device. In summary, the RF neutralizer system provided by this invention ensures the manufacturing accuracy of the semiconductor device and eliminates the need for an impedance matching device.

[0038] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 This is a schematic diagram of a radio frequency neutralizer system provided according to an embodiment of the present invention;

[0041] Figure 2 This is a schematic diagram of the structure of a neutralizer body according to an embodiment of the present invention;

[0042] Figure 3 This is a schematic diagram of an electrode structure provided according to an embodiment of the present invention;

[0043] Figure 4 This is a schematic diagram of another radio frequency neutralizer system provided according to an embodiment of the present invention;

[0044] Figure 5 This is a schematic diagram of another radio frequency neutralizer system provided according to an embodiment of the present invention;

[0045] Figure 6 This is a schematic diagram of the structure of a first radio frequency driving power supply and a radio frequency coil after being electrically connected according to an embodiment of the present invention;

[0046] Figure 7 This is a schematic diagram of the structure of a first radio frequency driving power supply after being electrically connected to a radio frequency coil according to an embodiment of the present invention;

[0047] Figure 8 This is a schematic diagram of the structure of an integrated ion source system and radio frequency neutralizer system according to an embodiment of the present invention;

[0048] Figure 9 This is a schematic diagram of the structure of another integrated ion source system and radio frequency neutralizer system provided in an embodiment of the present invention. Detailed Implementation

[0049] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0050] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0051] Figure 1 This is a schematic diagram of a radio frequency neutralizer system according to an embodiment of the present invention, with reference to... Figure 1 The radio frequency neutralizer system provided in this embodiment includes: a neutralizer body 110 and a first radio frequency driving power supply 120; the neutralizer body 110 includes a first reaction chamber 111, a radio frequency coil 112, and an electrode structure 113. The radio frequency coil 112 is located on the outer wall of the first reaction chamber 111 and is used to receive radio frequency energy to ionize the process gas in the first reaction chamber 111; the electrode structure 113 is located inside the first reaction chamber 111 and is used to eject electrons from the first reaction chamber 111; the first radio frequency driving power supply 120 includes a first detection control unit 121, a first DC power supply unit 122, and a first driving amplification unit 123; the first detection control unit 121 and the first DC power supply unit 120 are connected to the first DC power supply unit 120. The first DC power supply unit 122 and the first drive amplification unit 123 are electrically connected, and the power supply terminal of the first DC power supply unit 122 is electrically connected to the power supply terminal of the first drive amplification unit 123. The output terminal of the first drive amplification unit 123 is electrically connected to the radio frequency coil 112. The first detection control unit 121 is used to detect the first current information and the first voltage information at the output terminal of the first drive amplification unit 123, and control the output frequency of the first radio frequency drive power supply 120 according to the first current information and the first voltage information to match the internal impedance change of the first reaction cavity 111. The first drive amplification unit 123 is integrated in the neutralizer body 110 and is disposed together with the neutralizer body 110 in the vacuum process chamber 130.

[0052] Specifically, the vacuum process chamber 130 may also be equipped with an ion source and a wafer. The positive ions generated by the ion source and the electrons generated by the neutralizer body 110 in this embodiment form a neutral beam that falls on the wafer to process the wafer (etching or coating).

[0053] The material of the first reaction chamber 111 can be ceramic or quartz. The first reaction chamber 111 is a vacuum. The radio frequency energy generated by the radio frequency coil 112 is coupled into the first reaction chamber 111, which can ionize the process gas to generate plasma. The process gas in the first reaction chamber 111 can be an inert gas, for example, argon or helium.

[0054] The electrode structure 113 can be made of metal or graphite. The electrode structure 113 is conductive and is used to receive negative voltage, thereby pushing electrons in the first reaction chamber 111 out of the first reaction chamber 111. The negative voltage can be in the range of -70V to -100V.

[0055] The first DC power supply unit 122 is used to provide DC voltage to the first drive amplifier unit 123, and the DC voltage value can be controlled by the first detection and control unit 121.

[0056] The first current information includes the current phase information output by the first RF drive power supply 120, and the first voltage information includes the voltage phase information output by the first RF drive power supply 120. The first detection and control unit 121 provided in this embodiment includes a voltage and current detection unit and a control unit. The voltage and current detection unit is used to acquire the first current information and the first voltage information. The control unit dynamically adjusts the output frequency of the first RF drive power supply 120 based on the acquired first current information and first voltage information. After the output frequency changes, the first current information and the first voltage information will change accordingly, ensuring that the difference between the current phase and voltage phase at the output of the first RF drive power supply 120 is within a set threshold range (close to 0 or equal to 0). This ensures that the output impedance of the first RF drive power supply 120 matches the impedance within the first reaction chamber 111, thereby maximizing the transmission of RF energy into the first reaction chamber 111 and ensuring the ionization efficiency of the process gas. Therefore, the first RF drive power supply 120 provided in this embodiment can achieve impedance matching by adjusting the output frequency without the need for an impedance matching device, reducing the size of the impedance matching device.

[0057] The first drive amplifier unit 123 in the first RF drive power supply 120 is used to output RF energy, which is transmitted to the RF coil 112 through an RF cable. In this embodiment, the first drive amplifier unit 123 is integrated into the neutralizer body 110, thereby ensuring that the distance between the first drive amplifier unit 123 and the neutralizer body 110 is always fixed, and the straight-line distance between them does not change with the movement of the neutralizer body 110. In addition, by integrating the first drive amplifier unit 123 into the neutralizer body 110, the first drive amplifier unit 123 can move with the neutralizer body 110, and the movement path of the neutralizer body 110 will not be affected by the length limitation of the RF cable, thereby ensuring the wafer fabrication accuracy. The first detection control unit 121 and the first DC power supply unit 122 can be located outside the vacuum process chamber 130. Since the first detection control unit 121 and the first drive amplification unit 123 can be connected without an RF cable, and the first DC power supply unit 122 and the first drive amplification unit 123 can also be connected without an RF cable, the length of the connecting line between the first detection control unit 121 and the first drive amplification unit 123 can be set according to actual needs, and the length of the connecting line between the first DC power supply unit 122 and the first drive amplification unit 123 can be set according to actual needs.

[0058] This embodiment provides a radio frequency (RF) neutralizer system. In this system, the first RF drive power supply adjusts its output frequency by collecting first current and first voltage information from its output terminal, thereby achieving impedance matching between the first RF drive power supply and the first reaction cavity. This eliminates the need for an impedance matching device, reducing the number and size of components in the RF neutralizer system. Furthermore, this embodiment integrates the first drive amplification unit of the first RF drive power supply with the neutralizer body, allowing the first drive amplification unit to move integrally with the neutralizer body. This avoids the limited length of the RF cable affecting the movement path of the neutralizer body, thus ensuring the fabrication accuracy of the semiconductor device. In summary, the RF neutralizer system provided in this embodiment ensures the fabrication accuracy of the semiconductor device and eliminates the need for an impedance matching device.

[0059] Optional, continue to refer to Figure 1 The neutralizer body 110 also includes an electrode detection unit 114; the electrode detection unit 114 is used to detect the second current information on the electrode structure 113; the first detection control unit 121 is also electrically connected to the electrode detection unit 114, and controls the DC voltage value output by the first DC power supply unit 122 according to the second current information to control the amount of electrons output by the neutralizer body 110.

[0060] Specifically, Figure 2 This is a schematic diagram of the structure of a neutralizer body according to an embodiment of the present invention. Figure 3This is a schematic diagram of an electrode structure according to an embodiment of the present invention, with reference to... Figure 2 and Figure 3 The electrode structure 113 is located on the inner wall side of the first reaction chamber 111, and is spaced a small distance from the inner wall side of the first reaction chamber 111. The sidewall of the electrode structure 113 includes a plurality of spaced longitudinal openings 1311 (see attached diagram). Figure 3 The electrode structure 113 also includes a longitudinal opening 1311 that penetrates the sidewall. The arrangement of multiple longitudinal openings 1311 ensures that more radio frequency energy enters the first reaction chamber 111, improving the ionization efficiency of the process gas. An electrode fixing plate 1312 is also provided near the bottom of the first reaction chamber 111. The electrode fixing plate 1312 includes a through hole 1313. The electrode fixing plate 1312 contacts the bottom of the first reaction chamber 111, and screws can be used to pass through the through hole 1313 to fix the electrode structure 113 inside the first reaction chamber 111.

[0061] The electrode structure 113 can be understood as a cylindrical structure including multiple longitudinal openings 1311. The height of the electrode structure 113 is basically close to the height of the first reaction chamber 111. This arrangement allows the positive ions in the first reaction chamber 111 to be basically absorbed by the electrode structure 113.

[0062] The electrode detection unit 114 can be a current sensor. Plasma is generated within the first reaction chamber 111. After the electrode structure 113 ejects electrons from the plasma outside the first reaction chamber 111, the remaining positive ions within the first reaction chamber 111 are attracted to the electrode structure 113. The voltage received by the electrode structure 113 can remain constant, while its current value changes with the amount of positive ions absorbed. Since there is a one-to-one correspondence between positive ions and electrons within the first reaction chamber 111, the amount of electrons output by the neutralizer body 110 can be determined by detecting the amount of positive ions absorbed by the electrode structure 113. Therefore, the second current information can characterize the amount of positive ions absorbed by the electrode structure 113, thereby characterizing the amount of electrons output by the neutralizer body 110. The amount of electrons output by the neutralizer body 110 can be determined by collecting the second current information, thus controlling the magnitude of the electron quantity.

[0063] The first detection and control unit 121 controls the first DC power supply unit 122 to output a DC voltage value according to the second current information. The first DC power supply unit 122 is used to input a DC voltage value to the first drive amplification unit 123. The magnitude of the DC voltage value can affect the amount of radio frequency energy (radio frequency power), thereby controlling the degree of ionization of the process gas and controlling the amount of electrons.

[0064] In summary, this embodiment uses an electrode detection unit 114 to detect the amount of electrons output by the neutralizer body 110, and controls the amount of electrons by controlling the DC voltage value output by the first DC power supply unit 122. This ensures that the amount of electrons generated by the radio frequency neutralizer system provided in this embodiment matches the positive ions generated by the ion source system, thereby guaranteeing the neutralization effect of ions.

[0065] Optionally, the neutralizer body also includes a first electrode power supply, which is used to supply a negative voltage to the electrode structure.

[0066] Optionally, the neutralizer body also includes an extraction electrode and a second electrode power supply. The extraction electrode is located outside the first reaction chamber and is used to extract electrons. The second electrode power supply is used to supply power to the extraction electrode.

[0067] Specifically, the second electrode power supply can provide a positive voltage to the lead-out electrode, with the positive voltage ranging from +40V to +60V. The first and second electrode power supplies can share a common ground.

[0068] Optionally, the neutralizer body also includes an ignition unit; the first detection and control unit is used to determine the ignition state of the ignition unit based on the second current information on the electrode structure.

[0069] Specifically, the ignition unit ensures rapid plasma generation within the neutralizer body. Ignition status includes successful and unsuccessful ignition. Since the neutralizer body is a closed structure, plasma generation cannot be directly observed, thus making it impossible to determine whether the ignition unit has successfully ignited. However, when no plasma is generated within the first reaction chamber, only a weak current flows across the electrode structure. Once successful ignition generates plasma, positive ions are attracted to the electrode surface under the influence of the electric field, forming a detectable ion current. At this point, a significant jump occurs in the second current information. Therefore, by detecting changes in the second current information on the electrode structure, it is possible to accurately and quickly determine whether the ignition unit has successfully excited plasma, thereby achieving real-time monitoring of plasma generation within the closed first reaction chamber.

[0070] Optional, Figure 4 This is a schematic diagram of another radio frequency neutralizer system provided according to an embodiment of the present invention, with reference to... Figure 4 The first DC power supply unit 122 and the first detection and control unit 121 are both integrated into the neutralizer body 110 and are disposed together with the neutralizer body 110 in the vacuum process chamber 130.

[0071] Specifically, in this embodiment, the first radio frequency drive power supply 120 is integrated into the neutralizer body 110, which makes it easier and more flexible to move the radio frequency neutralizer system and further improve the manufacturing precision of semiconductor devices.

[0072] Optional, continue to refer to Figure 1 or Figure 4 The neutralizer body 110 provided in this embodiment also includes a metal shield 115; the first reaction chamber 111, the radio frequency coil 112, the electrode structure 113 and the first drive amplification unit 123 are all located inside the metal shield 115.

[0073] Specifically, the metal shield 115 can extend the service life of the first reaction chamber 111, the radio frequency coil 112, and the first drive amplification unit 123, while reducing radio frequency energy leakage and improving the ionization efficiency of the process gas.

[0074] Continue to refer to Figure 4 When the first radio frequency drive power supply 120 is integrated with the neutralizer body 110, the first DC power supply unit 122 and the first detection and control unit 121 are also located inside the metal shield 115.

[0075] Optional, Figure 5 This is a schematic diagram of another radio frequency neutralizer system provided according to an embodiment of the present invention, with reference to... Figure 5 The neutralizer body 110 also includes a liquid cooling plate 116; the first drive amplification unit 123 is located on one side of the liquid cooling plate 116.

[0076] Specifically, the liquid cooling plate 116 includes a liquid cooling channel for receiving the cooling medium. The liquid cooling plate 116 provides the first drive amplifier unit 123 with powerful active heat dissipation capabilities, which can promptly remove the large amount of heat generated by the first drive amplifier unit 123 during operation, ensuring its long-term stable operation at a safe temperature.

[0077] The first drive amplifier unit 123 is integrated into the PCB circuit board, and its structure can be a cuboid with a certain thickness. The liquid cooling plate 116 can also be a cuboid. The first drive amplifier unit 123 can be closely attached to the surface of the liquid cooling plate 116 to ensure heat dissipation. The first drive amplifier unit 123 can be fixed to one side of the liquid cooling plate 116 with screws.

[0078] It should be noted that when the first radio frequency drive power supply 120 is integrated with the neutralizer body 110, the first DC power supply unit 122 and the first detection control unit 121 are also located on one side of the liquid cooling plate 116. The liquid cooling plate 116 is used to actively dissipate heat for the first DC power supply unit 122 and the first detection control unit 121.

[0079] Optional, Figure 6 This is a schematic diagram of the structure of a first radio frequency drive power supply and a radio frequency coil electrically connected according to an embodiment of the present invention. (Refer to...) Figure 6The first drive amplification unit includes a first drive subunit 131, a second drive subunit 132, a third drive subunit 133, a fourth drive subunit 134, a first amplification subunit 135, a second amplification subunit 136, a third amplification subunit 137, and a fourth amplification subunit 138. The input terminals of the first drive subunit 131, the second drive subunit 132, the third drive subunit 133, and the fourth drive subunit 134 are all electrically connected to the first detection and control unit 121. The first terminals of the first amplification subunit 135 and the third amplification subunit 137 are both electrically connected to the first DC power supply unit 122. The control terminal of the first amplification subunit 135 is connected to the first drive subunit 131. The output terminals are electrically connected as follows: the control terminal of the second amplification subunit 136 is electrically connected to the output terminal of the second drive subunit 132; the control terminal of the third amplification subunit 137 is electrically connected to the output terminal of the third drive subunit 133; and the control terminal of the fourth amplification subunit 138 is electrically connected to the output terminal of the fourth drive subunit 134. The second terminal of the first amplification subunit 135 is electrically connected to the first terminal of the second amplification subunit 136, and the second terminal of the second amplification subunit 136 is grounded. The second terminal of the third amplification subunit 137 is electrically connected to the first terminal of the fourth amplification subunit 138, and the second terminal of the fourth amplification subunit 138 is grounded. The RF coil 112 is connected between the second terminal of the first amplification subunit 135 and the second terminal of the third amplification subunit 137.

[0080] Specifically, the first DC power supply unit 122 is used to input DC voltage values ​​to the first terminal of the first amplification subunit 135 and the first terminal of the third amplification subunit 137.

[0081] The first amplification subunit 135, the second amplification subunit 136, the third amplification subunit 137, and the fourth amplification subunit 138 constitute a full-bridge circuit. The full-bridge circuit configuration allows the first RF drive power supply to output a larger power, such as 1kW or 2kW. The first amplification subunit 135, the second amplification subunit 136, the third amplification subunit 137, and the fourth amplification subunit 138 are used to receive the drive signals output by their corresponding drive subunits and amplify them.

[0082] Optional, Figure 7 This is a schematic diagram of the structure of a first radio frequency drive power supply electrically connected to a radio frequency coil according to an embodiment of the present invention, for reference. Figure 7The first driving amplification unit includes a fifth driving subunit 141, a sixth driving subunit 142, a fifth amplification subunit 143, and a sixth amplification subunit 144. The input terminals of the fifth driving subunit 141 and the sixth driving subunit 142 are both electrically connected to the first detection and control unit 121. The first terminal of the fifth amplification subunit 143 is electrically connected to the first DC power supply unit 122, the control terminal of the fifth amplification subunit 143 is electrically connected to the output terminal of the fifth driving subunit 141, and the second terminal of the fifth amplification subunit 143 is electrically connected to the first terminal of the sixth amplification subunit 144. The second terminal of the sixth amplification subunit 144 is grounded, and the control terminal of the sixth amplification subunit 144 is electrically connected to the output terminal of the sixth driving subunit 142. The first terminal of the radio frequency coil 112 is electrically connected to the second terminal of the fifth amplification subunit 143, and the second terminal of the radio frequency coil 112 is grounded.

[0083] Specifically, the fifth amplification subunit 143 and the sixth amplification subunit 144 constitute a half-bridge circuit. The half-bridge circuit can reduce the number of components in the first drive amplification unit, thereby reducing the manufacturing cost of the first RF drive power supply.

[0084] It should be noted that the reference Figure 6 and Figure 7 The first amplification subunit 135, the second amplification subunit 136, the third amplification subunit 137, the fourth amplification subunit 138, the fifth amplification subunit 143 and the sixth amplification subunit 144 can be metal oxide semiconductor field-effect transistors (MOSFETs).

[0085] Optionally, the first RF drive power supply also includes a shielding box; the first drive amplification unit is located inside the shielding box; the shielding box is located inside a metal shielding cover. This arrangement can reduce the leakage of the RF signal output by the first drive amplification unit, protect the first drive amplification unit from damage, and extend the service life of the first drive amplification unit.

[0086] It should be noted that when the first radio frequency drive power supply is integrated with the neutralizer body, the first DC power supply unit and the first detection and control unit are also located inside the shielding box.

[0087] Figure 8 This is a schematic diagram of an integrated ion source system and radio frequency neutralizer system according to an embodiment of the present invention. (Refer to...) Figure 8 The integrated machine provided in this embodiment includes an ion source system and a radio frequency neutralizer system provided in any embodiment of the present invention; the ion source system includes a second radio frequency driving power supply 310 and an ion source body 320; the ion source body 320 is integrally connected to the neutralizer body 110 and is disposed together in the vacuum process chamber 130.

[0088] Specifically, the second RF drive power supply 310 may be located entirely outside the vacuum process chamber 130, or the second RF drive power supply 310 may be located at least partially outside the vacuum process chamber 130 and at least partially inside the vacuum process chamber 130.

[0089] This embodiment connects the ion source body and the neutralizer body as a single unit, allowing them to move together, thereby further ensuring the manufacturing precision of the semiconductor device.

[0090] Optional, Figure 9 This is a schematic diagram of the structure of another integrated ion source system and radio frequency neutralizer system provided according to an embodiment of the present invention, with reference to... Figure 9 The ion source body 320 is used to receive the radio frequency energy output by the second radio frequency drive power supply to ionize the process gas and generate positive ions; the second radio frequency drive power supply includes a second detection control unit 311, a second DC power supply unit 312 and a second drive amplification unit 313; the second drive amplification unit 313 is integrated in the ion source body 320 and is disposed together with the ion source body 320 in the vacuum process chamber 130.

[0091] Specifically, the second drive amplification unit 313 in the second RF drive power supply is used to output RF energy, which is transmitted to the ion source body 320 through an RF cable. In this embodiment, the second drive amplification unit 313 is integrated into the ion source body 320, thereby ensuring that the linear distance between the second drive amplification unit 313 and the ion source body 320 remains constant and does not change with the movement of the ion source body 320. Furthermore, integrating the second drive amplification unit 313 into the ion source body 320 allows it to move with the ion source body 320, preventing the movement path of the ion source body 320 from being affected by the length of the RF cable, thus ensuring the wafer fabrication accuracy. The second detection control unit 311 and the second DC power supply unit 312 can be located outside the vacuum process chamber 130.

[0092] It should be noted that the structure of the second RF drive power supply can be the same as that of the first RF drive power supply, and the control logic can also be the same.

[0093] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0094] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A radio frequency neutralizer system, characterized in that, include: The neutralizer body includes a first reaction chamber, a radio frequency coil, and an electrode structure. The radio frequency coil is located on the outer wall of the first reaction chamber and is used to receive radio frequency energy to ionize the process gas in the first reaction chamber. The electrode structure is located inside the first reaction chamber and is used to push out electrons from the first reaction chamber. The first radio frequency driving power supply includes a first detection control unit, a first DC power supply unit, and a first driving amplification unit; the first detection control unit is electrically connected to the first DC power supply unit and the first driving amplification unit, and the first DC power supply unit is electrically connected to the power supply terminal of the first driving amplification unit. The output terminal of the first driving amplifier unit is electrically connected to the radio frequency coil; The first detection control unit is used to detect the first current information and the first voltage information at the output terminal of the first drive amplification unit, and control the output frequency of the first radio frequency drive power supply according to the first current information and the first voltage information to match the internal impedance change of the first reaction cavity; The first drive amplification unit is integrated into the neutralizer body and is disposed together with the neutralizer body in the vacuum process chamber.

2. The radio frequency neutralizer system according to claim 1, characterized in that, The neutralizer body also includes an electrode detection unit; The electrode detection unit is used to detect the second current information on the electrode structure; The first detection control unit is also electrically connected to the electrode detection unit, and controls the DC voltage value output by the first DC power supply unit according to the second current information to control the amount of electrons output by the neutralizer body.

3. The radio frequency neutralizer system according to claim 2, characterized in that, The neutralizer body also includes an ignition unit; The first detection and control unit is used to determine the ignition state of the ignition unit based on the second current information on the electrode structure.

4. The radio frequency neutralizer system according to claim 1, characterized in that, The first DC power supply unit and the first detection and control unit are both integrated into the neutralizer body and are disposed together with the neutralizer body in the vacuum process chamber.

5. The radio frequency neutralizer system according to claim 1, characterized in that, The neutralizer body also includes a metal shielding cover; The first reaction chamber, the radio frequency coil, the electrode structure, and the first drive amplification unit are all located inside the metal shield.

6. The radio frequency neutralizer system according to claim 1, characterized in that, The neutralizer body also includes a liquid cooling plate; The first drive amplification unit is located on one side of the liquid cooling plate.

7. The radio frequency neutralizer system according to any one of claims 1-6, characterized in that, The first driving amplification unit includes a first driving subunit, a second driving subunit, a third driving subunit, a fourth driving subunit, a first amplification subunit, a second amplification subunit, a third amplification subunit, and a fourth amplification subunit; The input terminals of the first driving subunit, the second driving subunit, the third driving subunit, and the fourth driving subunit are all electrically connected to the first detection and control unit. The first end of the first amplification subunit and the first end of the third amplification subunit are both electrically connected to the first DC power supply unit. The control terminal of the first amplification subunit is electrically connected to the output terminal of the first drive subunit, the control terminal of the second amplification subunit is electrically connected to the output terminal of the second drive subunit, the control terminal of the third amplification subunit is electrically connected to the output terminal of the third drive subunit, and the control terminal of the fourth amplification subunit is electrically connected to the output terminal of the fourth drive subunit. The second end of the first amplification subunit is electrically connected to the first end of the second amplification subunit, and the second end of the second amplification subunit is grounded; the second end of the third amplification subunit is electrically connected to the first end of the fourth amplification subunit, and the second end of the fourth amplification subunit is grounded. The radio frequency coil is connected between the second end of the first amplification subunit and the second end of the third amplification subunit.

8. The radio frequency neutralizer system according to any one of claims 1-6, characterized in that, The first driving amplification unit includes a fifth driving subunit and a sixth driving subunit, a fifth amplification subunit and a sixth amplification subunit; The input terminals of the fifth driving subunit and the sixth driving subunit are both electrically connected to the first detection and control unit. The first end of the fifth amplification subunit is electrically connected to the first DC power supply unit, the control end of the fifth amplification subunit is electrically connected to the output end of the fifth drive subunit, and the second end of the fifth amplification subunit is electrically connected to the first end of the sixth amplification subunit. The second terminal of the sixth amplification subunit is grounded, and the control terminal of the sixth amplification subunit is electrically connected to the output terminal of the sixth drive subunit. The first end of the radio frequency coil is electrically connected to the second end of the fifth amplification subunit, and the second end of the radio frequency coil is grounded.

9. An integrated system of ion source system and radio frequency neutralizer system, characterized in that, Includes an ion source system and a radio frequency neutralizer system as described in any one of claims 1-8; The ion source system includes a second radio frequency drive power supply and an ion source body; The ion source body and the neutralizer body are integrally connected and are disposed together in the vacuum process chamber.

10. The integrated ion source system and radio frequency neutralizer system according to claim 9, characterized in that, The ion source body is used to receive radio frequency energy output from the second radio frequency drive power supply to ionize process gas and generate positive ions. The second radio frequency drive power supply includes a second detection control unit, a second DC power supply unit, and a second drive amplification unit; The second driving amplification unit is integrated into the ion source body and is disposed together with the ion source body in the vacuum process chamber.

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