An electronic device

Abstract

This application relates to the field of equipment thermal management technology, and in particular to an electronic device. The electronic device includes a cavity containing at least two heat sources with different temperature specifications and at least two heat dissipation components. Each heat dissipation component corresponds to one heat source and is in thermal contact with its corresponding heat source; however, the heat dissipation components corresponding to the heat sources with different temperature specifications are thermally isolated from each other. Each heat source with different temperature specifications has a corresponding heat dissipation component. The heat dissipation components can adopt different heat dissipation strategies according to the operating conditions and power consumption of the corresponding heat source, thereby meeting the heat dissipation requirements of heat sources with different temperature specifications, thus achieving hierarchical thermal management of different heat sources, and also playing an energy-saving role. Moreover, the thermal isolation between the heat dissipation components corresponding to the heat sources with different temperature specifications reduces thermal cross-interference between heat sources with different temperature specifications.

Description

Technical Field

[0001] This application relates to the field of equipment thermal management technology, and in particular to an electronic device. Background Technology

[0002] For co-packaged electronic devices containing multiple heat sources, heat dissipation presents a significant challenge due to limited package space. Co-packaged optics (CPO) serves as an example. CPO integrates the switching chip and optical engine into a single slot, forming a co-package of chip and module. CPO can significantly shorten the signal transmission distance, offering lower power consumption, more complete signal transmission, and faster transmission rates. Summary of the Invention

[0003] Exemplary embodiments of this application disclose an electronic device.

[0004] The embodiments of this application provide the following technical solutions:

[0005] In a first aspect, embodiments of this application provide an electronic device, which includes a cavity, and at least two heat sources with different temperature specifications and at least two heat dissipation components are provided in the cavity. The heat dissipation components correspond one-to-one with the heat sources and are in thermal contact with the corresponding heat sources; wherein the heat dissipation components corresponding to the heat sources with different temperature specifications are thermally isolated from each other.

[0006] Each heat source with a different temperature specification is equipped with a corresponding heat dissipation component. These components can employ different heat dissipation strategies based on the operating conditions and power consumption of the heat source, thereby meeting the heat dissipation needs of heat sources with varying temperature specifications. This achieves tiered heat dissipation management for different heat sources and also contributes to energy conservation. Furthermore, the heat dissipation components for heat sources with different temperature specifications are thermally isolated, reducing thermal cross-interference between heat sources of different specifications.

[0007] In one possible implementation, the heat dissipation assembly includes a heat sink; wherein, along the direction of gravity, the temperature specification of the heat source corresponding to the lower heat sink is lower than the temperature specification of the heat source corresponding to the upper heat sink.

[0008] In one possible implementation, the heat sink includes multiple heat dissipation fins.

[0009] In one possible implementation, the heat dissipation assembly further includes a substrate, which is stacked with a heat source, and the heat source and the heat sink are in thermal contact through the substrate.

[0010] In one possible implementation, the heat dissipation assembly further includes a heat-conducting element, and the substrate and the heat sink are connected through the heat-conducting element.

[0011] In one possible implementation, of the at least two heat dissipation components, one heat dissipation component is fixed on the substrate of the other heat dissipation component.

[0012] In one possible implementation, a circuit board is provided inside the cavity, and a heat source is fixed to the circuit board; wherein, a heat dissipation component is fixed to the circuit board, and / or, the heat dissipation component is fixed to the cavity.

[0013] In one possible implementation, there are two substrates corresponding to heat sources with different temperature specifications whose orthogonal projections on the circuit board do not overlap.

[0014] In one possible implementation, the electronic device further includes a heat dissipation duct, with heat sources located on the heat dissipation duct, and the distance between two heat sources with different temperature specifications is less than or equal to a first preset value.

[0015] In one possible implementation, the radiator is located on the heat dissipation duct, and along the airflow direction in the heat dissipation duct, the temperature specification of the heat source corresponding to the radiator located upstream of the airflow is lower than the temperature specification of the heat source corresponding to the radiator located downstream of the airflow.

[0016] In one possible implementation, when the heat source corresponding to the radiator located upstream of the airflow is located downstream of the airflow, the heat source and the radiator are connected through a heat-conducting component.

[0017] In one possible implementation, at least two heat sources include a first heat source and a second heat source; the temperature specification of the first heat source is higher than that of the second heat source; the second heat source includes at least two second heating elements arranged at intervals, and at least one second heating element is located upstream of the first heat source along the airflow direction in the heat dissipation duct; the heat dissipation component in thermal contact with the first heat source is a first heat dissipation component, which includes a first radiator; the heat dissipation component in thermal contact with the second heat source is a second heat dissipation component, which includes a second radiator; at least two second heating elements share the second radiator, and the second radiator is located upstream of the first radiator along the airflow direction in the heat dissipation duct.

[0018] In one possible implementation, at least two heat sources include a first heat source and a second heat source; the temperature specification of the first heat source is higher than that of the second heat source; the second heat source includes at least two second heating elements arranged at intervals, and at least one second heating element is located upstream of the first heat source along the airflow direction in the heat dissipation duct; the heat dissipation component in thermal contact with the first heat source is a first heat dissipation component, which includes a first radiator; the heat dissipation component in thermal contact with the second heat source is a second heat dissipation component, which includes at least two second radiators, and each second radiator corresponds to a second heating element.

[0019] At least one second radiator is located upstream of the first radiator. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application;

[0022] Figure 2 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application;

[0023] Figure 3 This is a schematic diagram of the structure of a heat dissipation component according to an embodiment of this application;

[0024] Figure 4 This is a schematic diagram of the structure of a heat dissipation assembly according to another embodiment of this application;

[0025] Figure 5 This is a schematic diagram of the structure of a heat dissipation assembly according to another embodiment of this application;

[0026] Figure 6 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application;

[0027] Figure 7 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application;

[0028] Figure 8 This is a top view of the heat dissipation fins of different heat sinks according to one embodiment of this application;

[0029] Figure 9 This is a top view of the heat dissipation fins of different heat sinks according to one embodiment of this application;

[0030] Figure 10 This is a top view of the heat dissipation fins of a different heat sink according to one embodiment of this application;

[0031] Figure 11 This is a top view of the heat dissipation fins of different heat sinks in one embodiment of this application.

[0032] Reference numerals: 100-Cavity; 110-Base plate; 120-Top plate; 130-Side plate; 200-Heat source; 210-First heat source; 211-First heating element; 220-Second heat source; 221-Second heating element; 230-Third heat source; 231-Third heating element; 300-Heat dissipation assembly; 310-Radiator; 320-Base plate; 330-Heat conductive component; 400-Circuit board; 500-Heat dissipation duct; 3 00a - First heat dissipation component; 310a - First heat sink; 320a - First substrate; 330a - First thermal conductive element; 300b - Second heat dissipation component; 310b - Second heat sink; 320b - Second substrate; 300c - Third heat dissipation component; 310c - Third heat sink; 320c - Third substrate; 330c - Third thermal conductive element; 600 - Connector; 610 - First locking accessory; 620 - Second locking accessory;

[0033] 01-Cavity. Detailed Implementation

[0034] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0035] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0036] For electronic devices that incorporate multiple heat sources in a co-package, heat dissipation presents a significant challenge due to limited package space. Co-packaged optics (CPO) serve as an example. CPO integrates a switching chip and an optical engine into a single slot, forming a co-package of chip and module. CPO can significantly shorten signal transmission distances, resulting in lower power consumption, more complete signal transmission, and faster transmission rates. However, the close integration of the switching chip and optical module makes it difficult for the heat sink, which directly contacts the switching chip, to simultaneously provide adequate heat dissipation for the optical module. Furthermore, the dense arrangement of multiple chips in a CPO, with varying temperature specifications for each chip and the optical module, limits the available package space. The resulting heat dissipation devices are often integrated heat sinks, which struggle to effectively cool multiple heat sources and cannot provide differentiated cooling solutions for different temperature-specifications. Moreover, cross-thermal interference can occur between the optical module and the switching chip.

[0037] This application provides an electronic device. Figure 1 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application. Please refer to... Figure 1 The electronic device includes a cavity 100, within which are at least two heat sources 200 with different temperature specifications and at least two heat dissipation components 300. Each heat dissipation component 300 corresponds to one heat source 200 and is in thermal contact with its corresponding heat source 200. The heat dissipation components 300 corresponding to the heat sources 200 with different temperature specifications are thermally isolated from each other, ensuring that the corresponding heat dissipation components 300 are independent of each other. Thermal isolation can be physical isolation, i.e., a gap between them; or thermal isolation can be achieved through heat insulation components to reduce or avoid thermal cross-interference between heat sources 200 with different temperature specifications.

[0038] It is understood that the number of heat sources 200 with different temperature specifications in the electronic device can be two, three, or more. For example, at least two heat sources 200 include a first heat source 210 and a second heat source 220, where the temperature specification of the first heat source 210 is higher than that of the second heat source 220.

[0039] The following explanation will use at least two heat sources 200 with different temperature specifications, including three heat sources 200, as an example. The at least two heat sources 200 with different temperature specifications include a first heat source 210, a second heat source 220, and a third heat source 230. The temperature specification of the first heat source 210 is higher than that of the second heat source 220, and the temperature specification of the second heat source 220 is higher than that of the third heat source 230. The component in thermal contact with the first heat source 210 is the first heat dissipation component 300a, the component in thermal contact with the second heat source 220 is the second heat dissipation component 300b, and the component in thermal contact with the third heat source 230 is the third heat dissipation component 300c.

[0040] The temperature specification refers to the temperature range that the heat source 200 can provide during normal operation. This range depends on the type of heat source 200 and its design purpose. Heat sources 200 with lower temperature specifications need to operate under lower temperature conditions to maintain good operating conditions.

[0041] It is understandable that heat sources 200 with different temperature specifications are equipped with corresponding heat dissipation components 300. The heat dissipation components 300 can adopt different heat dissipation strategies according to the operating conditions and power consumption of the corresponding heat source 200, thereby providing personalized heat dissipation solutions for heat sources 200 with different temperature specifications. They can also adjust the operating status of the heat dissipation components 300 according to the different operating conditions of the heat source 200, thereby realizing graded heat dissipation management for different heat sources 200, and also playing an energy-saving role.

[0042] Electronic devices can include CPOs, switches, etc. Figure 1 As shown, the electronic device is a CPO, which includes a switching chip and an optical module. The switching chip has a temperature specification of less than or equal to 105°C, and the optical module has a temperature specification of less than or equal to 85°C. The switching chip may include multiple chips, which are closely arranged within the cavity 100.

[0043] Continue to refer to Figure 1 The electronic device includes a base plate 110, a top plate 120, and multiple side plates 130. The base plate 110, top plate 120, and side plates 130 are arranged to form a cavity 01, in which a switching chip and an optical module are disposed. For example, the number of side plates 130 may be four.

[0044] Figure 2 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application, with reference to... Figure 2 The heat dissipation assembly 300 includes a heat sink 310. Optionally, the heat sink 310 may include at least one of a liquid cooling plate, heat dissipation fins, or heat pipes. For example, Figure 2 The at least two heat sources 200 with different temperature specifications include a first heat source 210, a second heat source 220, and a third heat source 230. Correspondingly, the first heat dissipation component 300a includes a first heat sink 310a, the second heat dissipation component 300b includes a second heat sink 310b, and the third heat dissipation component 300c includes a third heat sink 310c.

[0045] Along the gravitational direction Dg, the temperature specification of the heat source 200 corresponding to the lower heat sink 310 is lower than the temperature specification of the heat source 200 corresponding to the upper heat sink 310. For example, the temperature specification of the third heat source 230 is lower than that of the second heat source 220, and the third heat sink 310c is located below the second heat sink 310b. Because hot air is less dense than cold air, hot air will naturally rise, and cold air will sink. The lower temperature specification of the third heat source 230 and the lower temperature specification of the second heat source 220 and the higher temperature specification of the second heat source 220 and the higher temperature specification of the second heat sink 310b enhance this natural convection effect and improve heat dissipation efficiency. Moreover, it helps to form a more obvious temperature stratification, which can reduce thermal interference between different heat sources 200 and improve the heat dissipation effect of each heat source 200. The electronic device in this application can reduce the operating temperature of the heat source 200 and its surrounding components through more efficient heat dissipation, thereby reducing thermal stress and extending the service life of the electronic device.

[0046] Figure 3 This is a schematic diagram of the structure of a heat dissipation component according to one embodiment of this application. Please refer to it as well. Figure 2 and Figure 3 The heat dissipation assembly 300 also includes a substrate 320, which is stacked with the heat source 200, and the heat sink 310 and the heat source 200 achieve thermal contact through the substrate 320. The substrate 320 has high thermal conductivity. The substrate 320 can be made of aluminum plate, copper plate, vapor chamber (VC) heat spreader, or other composite materials with high thermal conductivity. When the substrate 320 is made of composite material, it can be an aluminum substrate with nested heat pipes, a VC welded heat pipe, or a three-dimensional vapor chamber (3DVC), etc.

[0047] It is understood that the shape and size of the substrate 320 are not limited in this application, and can be set according to actual needs.

[0048] Figure 4 This is a schematic diagram of the structure of a heat dissipation component according to another embodiment of this application. Figure 5 This is a schematic diagram of the heat dissipation assembly according to another embodiment of this application, please refer to it as well. Figure 2 , Figure 4 and Figure 5 The heat dissipation assembly 300 also includes a heat-conducting component 330, through which the substrate 320 and the heat sink 310 are connected. The heat-conducting component 330 can be a heat pipe, a thermal pad, a thermal block, etc. The heat-conducting component 330 is made of a high thermal conductivity material, such as graphite, metal, or interface material.

[0049] Optionally, the heat-conducting component 330 is a flexible heat-conducting component 330, which can be flexibly set according to space and heat dissipation requirements. For example, for a heat source 200 with a low temperature specification, the corresponding heat sink 310 can be extended from the substrate 320 to the upstream of the airflow through the heat-conducting component 330, so that the heat sink 310 corresponding to the heat source 200 with a low temperature specification comes into contact with the cold airflow first, thereby obtaining the best heat dissipation conditions. Conversely, for a heat source 200 with a high temperature specification, if the heat source 200 is located downstream of the cold airflow, the corresponding heat sink 310 can be directly set on one side of the heat source 200; if the heat source 200 is not located downstream of the cold airflow, the corresponding heat sink 310 can be extended from the substrate 320 to the downstream of the airflow through the heat-conducting component 330 to save energy.

[0050] Continue to refer to Figures 2 to 5 The first heat dissipation assembly 300a may include a first substrate 320a and a first heat sink 310a disposed on the first substrate 320a. The first heat source 210 has the highest temperature specification, and the first heat sink 310a may be disposed on the surface of the first substrate 320a opposite to the first heat source 210. Furthermore, the third heat source 230 has the lowest temperature specification, and the third heat dissipation assembly 300c may include a third substrate 320c, a third heat sink 310c, and a third heat conductor 330c. The third heat conductor 330c extends from the third substrate 320c upstream of the airflow, so that the third heat sink 310c is located upstream of the airflow, thereby allowing the third heat sink 310c to contact the cold airflow first and obtain optimal heat dissipation conditions. The second heat dissipation assembly 300b may include a second substrate 320b, a second heat sink 310b, and a second heat conductor 330b. The second heat-conducting element 330b extends upward from the second substrate 320b so that the second heat sink 310b is located above the third heat sink 310c and upstream of the airflow of the first heat sink 310a, thereby enabling the second heat sink 310b to preferentially contact the cold airflow and enhancing the natural convection effect between the second heat sink 310b and the third heat sink 310c.

[0051] Figure 6 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application, with reference to... Figure 6 The electronic device in this application also includes a circuit board 400, and heat sources 200 are fixedly mounted on the circuit board 400. Each heat source 200 is located on the same side surface of the circuit board 400. Of course, the heat sources 200 can also be fixedly mounted on the cavity 100 as needed, and this application does not impose any limitations on this.

[0052] Figure 7 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application. Please refer to it as well. Figure 6 and Figure 7The heat dissipation component 300 can be fixed to the circuit board 400 or to the cavity 100. Specifically, the heat dissipation component 300 can be connected to the circuit board 400 or the cavity 100 via a connector 600. Figure 6 As shown, the second heat sink 310b is fixed to the cavity 100 by a first locking accessory 610, which can be a screw or bolt, etc. Meanwhile, the second substrate 320b is fixed to the circuit board 400 by a second locking accessory 620.

[0053] In some optional embodiments, among at least two heat dissipation components 300, one heat sink 310 is fixed to the substrate 320 to which the other heat sink 310 is connected, to achieve stress coupling. Of course, each heat dissipation component 300 can also be independently fixed to the cavity 100 or the circuit board 400 to achieve stress decoupling. It is understood that the heat dissipation component 300 can be fixedly connected to the cavity 100, the circuit board 400, or the substrate 320, or it can be floatingly connected, depending on the actual situation. The key is to ensure good contact between the heat dissipation component 300 and the heat source 200, thereby reducing thermal resistance and improving heat exchange efficiency. Furthermore, the fixed position of the heat dissipation component 300 can also be flexibly set according to the actual situation.

[0054] In some optional embodiments, the orthographic projections of two substrates 320 corresponding to heat sources 200 with different temperature specifications on the circuit board 400 do not overlap, thereby avoiding thermal cross-interference between heat sources 200 with different temperature specifications.

[0055] Continue to refer to Figure 2 , Figure 6 and Figure 7 The electronic equipment also includes a heat dissipation duct 500, on which all heat sources 200 are located. It is understood that the cool airflow in the heat dissipation duct 500 can be natural wind or airflow generated by a fan, which can be a blower or an exhaust fan. The fan's location can be set according to actual needs.

[0056] Among them, there are two heat sources 200 with different temperature specifications whose distance is less than or equal to a first preset value. The first preset value is designed according to the actual situation, that is, the distance between the two heat sources 200 with different temperature specifications is small and the space is limited.

[0057] It should be noted that the airflow direction in the heat dissipation duct can be parallel to or perpendicular to the surface of the circuit board 400. This application does not limit it, and the specific setting is based on actual needs.

[0058] In some optional embodiments, the heat sink 310 is located on the heat dissipation duct 500, and along the airflow direction D1 in the heat dissipation duct 500, the temperature specification of the heat source 200 corresponding to the heat sink 310 located upstream of the airflow is lower than the temperature specification of the heat source 200 corresponding to the heat sink 310 located downstream of the airflow. For example... Figure 2 As shown, along the airflow direction D1 in the heat dissipation duct 500, the third radiator 310c is located upstream of the airflow of the first radiator 310a, and the second radiator 310b is located upstream of the airflow of the first radiator 310a, so that the third radiator 310c and the second radiator 310b can come into contact with the cold airflow first, thereby providing a lower temperature specification for the third heat source 230 and the second heat source 220.

[0059] To avoid thermal cross-interference between the first radiator 310a and the second radiator 310b, the first radiator 310a is located below the second radiator 310b along the direction of gravity Dg. This enhances the convection effect between the first radiator 310a and the second radiator 310b along the direction of gravity Dg, thereby improving heat dissipation efficiency. At the same time, when the airflow direction is perpendicular to the direction of gravity Dg, the second radiator 310b and the third radiator 310c can both come into contact with the cold airflow first along the airflow direction in the heat dissipation duct 500, thus avoiding thermal cross-interference between them.

[0060] Each heat source 200 may include one heating element, or two or more heating elements. The corresponding heat dissipation component 300 may include one heat sink 310, or two or more heat sinks 310, depending on the package space and heat dissipation requirements, taking into account both heat dissipation efficiency and space utilization.

[0061] Continue to refer to Figure 2 and Figure 6 The second heat source 220 includes at least two second heating elements 221 spaced apart. Along the airflow direction D1 in the heat dissipation duct 500, at least one second heating element 221 is located upstream of the airflow of the first heat source 210. The at least two second heating elements 221 may surround the first heat source 210 or be disposed on one side of the first heat source 210, and there is no specific limitation.

[0062] like Figure 2 As shown, the second heat dissipation component 300b may include a second heat sink 310b, and the two second heat-generating bodies 221 may share a second heat sink 310b. Along the airflow direction in the heat dissipation duct 500, the second heat sink 310b is located upstream of the airflow of the first heat sink 310a.

[0063] Or, such as Figure 6As shown, the second heat dissipation assembly 300b includes at least two second heat sinks 310b, each corresponding to a second heat-generating element 221. Each second heat sink 310b can be positioned as close as possible to its corresponding second heat-generating element 221 to shorten the heat conduction distance and thus improve heat conduction efficiency. The at least two second heat sinks 310b can share a single second substrate 320b or each correspond to an independent second substrate 320b. For example, at least one second heat sink 310b is located upstream of the airflow of the first heat sink 310a.

[0064] Of course, the first heat source 210 may include along one first heating element 211, or along two or more first heating elements 211.

[0065] Similarly, the third heat source 230 may include at least two third heating elements 231 arranged at intervals. For the specific arrangement of the third heat dissipation component 300c corresponding to the third heat source 230, please refer to the arrangement of the second heat dissipation component 300b corresponding to the second heat source 220, which will not be repeated here.

[0066] In some optional embodiments, the radiator 310 includes multiple heat dissipation fins, with adjacent fins spaced apart. Along the airflow direction in the heat dissipation duct, the spacing between heat sources 200 is relatively small. The heat dissipation fins can extend in a direction perpendicular to the airflow direction in the heat dissipation duct to increase the size of the fins or the spacing between adjacent fins. This allows the radiator 310 to obtain optimal airflow to meet the heat dissipation needs of the heat sources 200, thereby reducing the number or workload of fans and achieving energy savings.

[0067] It is understandable that the heat sink fins can also extend in other directions, as long as they can effectively utilize the package space or optimize the flow resistance of the heat sink 310, so as to improve the heat dissipation efficiency of the heat sink 310.

[0068] Figure 8 This is a top view of the heat dissipation fins of different heat sinks according to one embodiment of this application. Figure 9 This is a top view of the heat dissipation fins of different heat sinks according to one embodiment of this application. Figure 10 This is a top view of the heat dissipation fins of different heat sinks in one embodiment of this application. Figure 11 This is a top view of the heat dissipation fins of a different heat sink according to one embodiment of this application. Please refer to it as well. Figures 8 to 11 The shape, size and position of each heat sink 310 are set according to actual needs. Along the airflow direction D1 in the heat dissipation duct, each heat sink 310 is stacked separately to make full use of space.

[0069] In some optional embodiments, the orthographic projections of each heat sink 310 on the circuit board 400 do not overlap, so as to avoid thermal cross-interference between the heat sinks 310 and improve the heat dissipation effect.

[0070] Obviously, those skilled in the art can make various modifications and variations to the embodiments of this application without departing from the spirit and scope of this application. Therefore, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalents, this application also intends to include these modifications and variations.

Claims

1. An electronic device, characterized in that, Includes a cavity, wherein the cavity is provided with: At least two heat sources with different temperature specifications; At least two heat dissipation components, each corresponding to a heat source and in thermal contact with the corresponding heat source; Among them, the heat dissipation components corresponding to the heat sources with different temperature specifications are thermally isolated.

2. The electronic device according to claim 1, characterized in that, The heat dissipation assembly includes a heat sink; wherein, along the direction of gravity, the temperature specification of the heat source corresponding to the lower heat sink is lower than the temperature specification of the heat source corresponding to the upper heat sink.

3. The electronic device according to claim 2, characterized in that, The radiator includes multiple heat dissipation fins.

4. The electronic device according to claim 2, characterized in that, The heat dissipation assembly further includes a substrate, which is stacked with the heat source, and the heat source and the heat sink are in thermal contact through the substrate.

5. The electronic device according to claim 4, characterized in that, The heat dissipation assembly further includes a heat-conducting element, and the substrate and the heat sink are connected through the heat-conducting element.

6. The electronic device according to claim 4, characterized in that, Of the at least two heat dissipation components, one heat dissipation component is fixed on the substrate of the other heat dissipation component.

7. The electronic device according to claim 4, characterized in that, The cavity is equipped with a circuit board, and the heat source is fixed to the circuit board; The heat dissipation component is fixed to the circuit board, and / or the heat dissipation component is fixed to the cavity.

8. The electronic device according to claim 7, characterized in that, There are two substrates on the circuit board whose orthogonal projections on the circuit board do not overlap, each corresponding to a heat source with a different temperature specification.

9. The electronic device according to any one of claims 2-8, characterized in that, The electronic device also includes a heat dissipation duct, and the heat source is located on the heat dissipation duct. There is a distance between two heat sources with different temperature specifications that is less than or equal to a first preset value.

10. The electronic device according to claim 9, characterized in that, The radiator is located on the heat dissipation duct. Along the airflow direction in the heat dissipation duct, the temperature specification of the heat source corresponding to the radiator located upstream of the airflow is lower than the temperature specification of the heat source corresponding to the radiator located downstream of the airflow.

11. The electronic device according to claim 10, characterized in that, When the heat source corresponding to the radiator located upstream of the airflow is located downstream of the airflow, the heat source and the radiator are connected through a heat-conducting component.

12. The electronic device according to claim 9, characterized in that, The at least two heat sources include a first heat source and a second heat source; the temperature specification of the first heat source is higher than that of the second heat source; the second heat source includes at least two second heating elements arranged at intervals, and at least one second heating element is located upstream of the first heat source along the airflow direction in the heat dissipation duct. The heat dissipation component that is in thermal contact with the first heat source is the first heat dissipation component, and the first heat dissipation component includes a first radiator. The heat dissipation component that is in thermal contact with the second heat source is a second heat dissipation component, and the second heat dissipation component includes a second radiator. The at least two second heating elements share the second radiator, and the second radiator is located upstream of the first radiator along the airflow direction in the heat dissipation duct.

13. The electronic device according to claim 8, characterized in that, The at least two heat sources include a first heat source and a second heat source; the temperature specification of the first heat source is higher than that of the second heat source; the second heat source includes at least two second heating elements arranged at intervals, and at least one second heating element is located upstream of the first heat source along the airflow direction in the heat dissipation duct. The heat dissipation component that is in thermal contact with the first heat source is the first heat dissipation component, and the first heat dissipation component includes a first radiator. The heat dissipation component that is in thermal contact with the second heat source is the second heat dissipation component. The second heat dissipation component includes at least two second heat sinks, and each of the second heat sinks corresponds to one of the second heat-generating elements.

14. The electronic device according to claim 13, characterized in that, At least one of the second heat sinks is located upstream of the first heat sink.

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