electrostatic chuck
By setting a conductive layer structure with matching thickness and particle size in the electrostatic chuck, the problem of insufficient adhesion between the dielectric substrate and the conductive layer is solved, achieving more efficient electrostatic adsorption and conductivity.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- TOTO LTD
- Filing Date
- 2025-10-23
- Publication Date
- 2026-06-30
AI Technical Summary
In existing electrostatic chucks, the adhesion between the dielectric substrate and the conductive layer is insufficient, especially when the thickness of the conductive layer is different, which can easily lead to problems such as decreased adhesion and narrowing of the conductive path.
Two conductive layers are set inside the dielectric substrate. One conductive layer (heater) is thicker and the other conductive layer (adsorption electrode) is thinner. Small ceramic particles are used inside the thicker conductive layer to ensure a match between 50% and 150% of the particle size of the ceramic particles inside the thinner conductive layer, thereby enhancing adhesion.
By adjusting the particle size of the ceramic particles and the thickness difference of the conductive layer, the adhesion between the dielectric substrate and the conductive layer is significantly improved, avoiding the problems of narrowing of the conductive path and resistance deviation from the design value, thus ensuring the effective operation of the electrostatic chuck.
Smart Images
Figure CN122318801A_ABST