A semiconductor-based air conditioning device and its hot and cold air guiding system

Abstract

This invention discloses a semiconductor cooling and heating air conditioning device and its cooling and heating air guiding system, including an air conditioning casing and a refrigeration device installed inside the casing. The refrigeration device has a cold air channel, a hot air channel, and a semiconductor refrigeration module. The cooling surface of the semiconductor refrigeration module contacts the cold air channel, while the heating surface contacts the hot air channel. The first air inlet and the cold air outlet of the cold air channel are both connected to the indoor environment. The semiconductor refrigeration module cools the air in the cold air channel and quickly discharges the cold air from the cold air outlet to the room through its narrow channel. The hot air channel is located around the cold air channel, with its second air inlet connected to the indoor environment and its hot air outlet connected to the outdoor environment, thereby quickly discharging the hot air exchanged by the heating surface to the outside. This fully utilizes the "rapid cooling and heating" characteristics of the semiconductor refrigeration module, rapidly removing heat and cold, avoiding heat accumulation, reducing costs, miniaturizing, and reducing energy consumption.

Description

Technical Field

[0001] This invention relates to the field of air conditioning and refrigeration technology, and in particular to a semiconductor heating and cooling air conditioning device and its heating and cooling air guiding system. Background Technology

[0002] In the air conditioning industry, refrigeration is mainly accomplished by a refrigeration system consisting of a compressor, condenser, and evaporator. Therefore, the price is relatively high. Air conditioners generate a lot of noise when they start up, and the refrigerants used also have a certain impact on the environment.

[0003] Currently, some air conditioner manufacturers on the market have begun to use semiconductor cooling chips for cooling. Semiconductor cooling chips are solid-state cooling devices based on the Peltier effect. They can achieve bidirectional temperature control for both cooling and heating without a compressor. They have advantages such as low noise, small size, and long lifespan, and are very popular with users.

[0004] However, existing semiconductor refrigeration air conditioners still have the following problems:

[0005] 1. The heat exchange structure of existing semiconductor refrigeration air conditioners is usually designed as a flat multi-channel structure. Due to the extremely small gap between adjacent channels (usually less than 1mm) in the existing flat multi-channel heat exchange structure, the fluid in the channel will generate a significant local pressure drop due to the sudden increase in resistance at high wind speeds.

[0006] To save space, flat channel heat exchange structures adopt open or semi-closed designs, with free space not covered by the airflow guiding structure at the channel edges, ends, or fin tops; and due to uneven inlet distribution, channel manufacturing tolerances, or assembly deviations, the flow velocity in some channels is much higher than the average, forming "high-speed channels".

[0007] As resistance increases and flow velocity decreases in adjacent channels, the pressure gradient between channels widens further, causing airflow to "escape laterally" from high-speed channels to low-speed channels. In summary, this results in extremely high local flow velocities in the flat, multi-channel configuration, leading to chaotic airflow between channels and turbulence (wind short-circuiting). This easily transforms the smooth, orderly airflow into chaotic turbulence, generating unsteady eddies. The airflow uniformity is low, making it difficult to adapt to and fully utilize the rapid cooling and heating characteristics of semiconductor refrigeration.

[0008] 2. In order to achieve a larger heat dissipation area and higher cooling efficiency, it is usually necessary to assemble larger and more numerous heat exchange structures, resulting in the air conditioner still being relatively large in size. Summary of the Invention

[0009] In order to overcome the shortcomings of the prior art, one of the objectives of the present invention is to provide a semiconductor heating and cooling air conditioning device.

[0010] One of the objectives of this invention is achieved by the following technical solution: a semiconductor cooling and heating air conditioning device, comprising an air conditioning housing and a refrigeration device, wherein the air conditioning housing has a cavity for accommodating and installing the refrigeration device, and the refrigeration device has a cold air channel, a hot air channel and a semiconductor refrigeration module, wherein the cooling surface of the semiconductor refrigeration module contacts the cold air channel, and the heating surface contacts the hot air channel;

[0011] The cold air duct is a multi-faceted tubular structure with a single channel. The cold air duct has a first air inlet and a cold air outlet. Both the first air inlet and the cold air outlet are connected to the indoor environment, forming a refrigeration cycle loop for regulating the indoor temperature. The cooling surface of the semiconductor refrigeration module cools the air entering the cold air duct and quickly exhausts the cold air from the cold air outlet into the room through its narrow channel.

[0012] The hot air channel is located around the cold air channel. The hot air channel has a second air inlet and a hot air outlet. The second air inlet is connected to the indoor environment, and the hot air outlet is connected to the outdoor environment, thereby quickly discharging the hot air exchanged by the heating surface to the outside.

[0013] Furthermore, several cold air channels are provided and extend along the air cooling direction within the machine cavity;

[0014] The first air inlet is located at one end of the polyhedral cold air channel, and the cold air outlet is located on one side of the cold air channel. The cold air outlet is provided with a plurality of strip-shaped holes for discharging cold air, and the plurality of strip-shaped holes are arranged in an array on the outlet end on the side of the cold air channel. The extension direction of the holes may be consistent with or inconsistent with the length direction of the cold air channel.

[0015] Alternatively, the cold air exhaust end can be located at the other end of the polyhedral cold air channel, forming a symmetrical structure with the first air intake end;

[0016] The semiconductor cooling module is in the form of a sheet. Several of the semiconductor cooling modules are arranged at equal intervals along the length of the cold air channel and the array direction of the cold air exhaust end. The cooling surface is in close contact with the surface of the cold air channel to cool the air in the channel and exhaust it into the room through the array of cold air exhaust ends.

[0017] Furthermore, the hot air channel is a multi-faceted tubular structure with a single channel. Several hot air channels are arranged around the cold air channel, and these hot air channels are arranged in an equidistant array along the length of the cold air channel. The semiconductor cooling module is attached to the cold air channel and the hot air channel, thus forming a guide channel for separating and transporting hot and cold air.

[0018] Furthermore, several hot air channels are arranged in an array outside the cold air channel at an angle of 30° to 60° to the horizontal line, so that the orientation of the second air inlet and hot air outlet of two adjacent hot air channels is staggered, and one or more semiconductor cooling modules are provided between each hot air channel and the cold air channel.

[0019] Furthermore, several clamping blocks are provided on the outside of the hot air channel. The middle part of the clamping block presses tightly against the hot air channel, and the two ends of the clamping block are connected to the cold air channel by bolts. Thus, the hot air channel and the semiconductor cooling block are pressed tightly onto the cold air channel by the clamping blocks.

[0020] Furthermore, the air conditioner casing is configured as a wall-mounted structure with its internal cavity extending laterally; the refrigeration device also has a device housing adapted to the lateral extension direction of the cavity, the cold air channel and the hot air channel are installed in the cavity through the device housing, and the device housing is provided with a normal temperature air inlet, a cold air outlet and a hot air outlet corresponding to the cavity;

[0021] The first air inlet of the cold air duct is connected to the indoor environment through the normal temperature air inlet, and the cold air outlet is connected to the indoor environment through the cold air outlet.

[0022] The second air inlet of the hot air duct is connected to the indoor environment through the normal temperature air inlet, and the hot air outlet is connected to the outdoor environment through the hot air outlet.

[0023] An air extraction module is provided on the ambient temperature air inlet, and an exhaust module is provided on the cold air outlet and the hot air outlet.

[0024] Furthermore, the air conditioner casing is configured as a vertical floor-standing structure, with its cavity extending vertically, including an upper cavity and a lower cavity assembled longitudinally, and a partition plate separating the two; the lower cavity includes an intake cavity and an exhaust cavity, the exhaust cavity being located above the intake cavity, the upper cavity and the intake cavity both communicating with the indoor environment, and the exhaust cavity communicating with the outdoor environment;

[0025] The cold air channel is longitudinally arranged in the exhaust chamber. The cooling surface of the semiconductor refrigeration module is in close contact with the surface of the cold air channel. The first air inlet end of the cold air channel is connected to the air inlet chamber, and the cold air outlet end is connected to the upper chamber through the partition plate. The cold air is then quickly discharged from the upper chamber into the room through its narrow channel.

[0026] The heating surface of the semiconductor cooling module is connected to a heat sink to dissipate the hot air from the heating surface into the exhaust chamber, thereby forming a hot air channel for circulating heat dissipation in the exhaust chamber, which is physically separated from the cold air channel. The second air inlet of the hot air channel is formed at the lower end of the exhaust chamber and communicates with the air inlet chamber, and the hot air outlet is formed on the side wall of the exhaust chamber and communicates with the outdoor environment.

[0027] Furthermore, a heat sink assembly is provided on the inner wall of the cold air channel and / or hot air channel. The heat sink assembly has multiple spaced heat sinks. The heat sinks extend from the inner wall of the channel towards the center of the channel. The heat sink assemblies on each side wall of the channel can be designed to have several heat sinks arranged in a way that is longer in the middle and gradually shortens towards the edges. This forms a main airflow path in the area on the opposite side of the heat sink assembly on each side wall of the channel, and a secondary airflow path between two adjacent heat sinks.

[0028] Furthermore, the first air inlet end of the air conditioning channel is connected to an air extraction module for drawing in room temperature gas into the air intake chamber. The air intake chamber has a room temperature air inlet for connecting to the indoor environment, through which air is introduced into the air intake chamber.

[0029] The upper chamber has a cold air outlet, and the cooled air in the cold air passage is discharged into the indoor environment by setting an exhaust module;

[0030] The exhaust chamber has a hot air outlet for connecting to the outdoor environment, and the hot air is discharged to the outdoor environment by means of an exhaust module.

[0031] To overcome the shortcomings of the prior art, the second objective of this invention is to provide a semiconductor hot and cold air conduction system.

[0032] The second objective of this invention is achieved by the following technical solution: a semiconductor air guiding system, comprising an air conditioner housing and a refrigeration device installed inside the air conditioner housing, the refrigeration device having a semiconductor refrigeration module, a cold air channel and a hot air channel, the cold air channel and / or the hot air channel being configured as a polyhedral and single-channel tubular structure, and the hot air channel being arranged outside the cold air channel, the refrigeration surface of the semiconductor refrigeration module being in close contact with the cold air channel and the heating surface being in close contact with the hot air channel;

[0033] Both ends of the cold air duct are connected to the indoor environment, and one end of the hot air duct is connected to the indoor environment and the other end is connected to the outdoor environment. Thus, through their respective narrow channels, cold air is quickly discharged into the room and hot air is discharged to the outside, forming a crisscrossing air guiding system with separate delivery of cold and hot air.

[0034] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0035] (1) The semiconductor air conditioning equipment provided in this embodiment achieves rapid heat exchange by directly conducting heat to the walls of the cold air channel and the hot air channel through the cooling surface and heating surface of the semiconductor refrigeration module. Indoor air is drawn into the narrow cold air channel and the hot air channel from the first air inlet and the second air inlet respectively. According to the "narrow tube effect", the air velocity will increase sharply and heat exchange will be efficient when entering the narrow pipes of the cold air channel and the hot air channel. Then, the air is quickly discharged to the indoor and outdoor areas from the cold air exhaust end and the hot air exhaust end respectively, effectively avoiding the accumulation of heat in the pipes. The combination of a multi-faceted, single-channel tubular structure design allows airflow to pass smoothly, evenly, and orderly through the single channel. This avoids the defects of heat exchange structures such as small gaps between adjacent channels / high resistance and open / semi-closed designs. It effectively solves the problems of poor airflow uniformity and easy generation of unsteady eddies in traditional flat multi-channel structures. Thus, it fully adapts to the "rapid cooling and heating" characteristics of semiconductor refrigeration modules, realizes rapid removal of heat and cold, significantly improves refrigeration efficiency, and avoids the reverse effect of heat conduction caused by heat accumulation, which affects the refrigeration effect.

[0036] Compared to traditional compressor refrigeration systems (compressor, condenser, evaporator and refrigerant), this solution directly cools the air and achieves physical isolation and efficient circulation of hot and cold air by placing the hot air channel outside the cold air channel. The structure is greatly simplified, achieving the effect of miniaturized air conditioning equipment. Manufacturing costs can be reduced by 30%-40%, while achieving low vibration, low noise and miniaturization, and energy consumption can also be reduced by about 20%.

[0037] (2) The "multi-channel, multi-cooling-chip" arrangement of hot and cold air ducts and semiconductor refrigeration modules provides a highly modular expansion effect, facilitating on-demand assembly. For example, when greater cooling capacity is required, it can be easily achieved by lengthening the cold air duct and installing multiple semiconductor refrigeration modules on the increased length, without significantly increasing the overall width or height of the equipment. The hot air duct can be lengthened accordingly to accommodate this expansion. The semiconductor refrigeration modules can be installed on the same side of the cold air duct or on multiple different sides as needed to increase the contact area and improve heat exchange efficiency. This allows for flexible adjustment of the cooling capacity, facilitates standardized product production, and solves the drawback of increasing equipment size to improve cooling efficiency in existing technologies.

[0038] (3) The cold air discharged from several strip-shaped holes at the cold air exhaust end of the cold air duct is collected in the cavity of the wall-mounted air conditioning unit, and then evenly drawn in and blown into the room by the strip-shaped impeller. This not only utilizes the narrow tube effect of the cold air duct to achieve high-speed exhaust of cold air from the duct, but also uses the wide strip-shaped impeller of the wall-mounted air conditioning unit to evenly and gently distribute the cold air into the indoor space, avoiding local overcooling and achieving a better air conditioning effect to regulate the indoor temperature, thus improving the comfort of the user. At the same time, the horizontal arrangement of the cold air duct perfectly matches the lateral extension design of the wall-mounted casing, thereby ensuring the compactness and aesthetics of the whole unit.

[0039] (4) The air conditioning equipment with a vertical floor-standing structure is used for the refrigeration unit. Its upper and lower chambers are stacked longitudinally, which allows the equipment to be placed in the corner of the room, suitable for large spaces or rooms with different decoration styles. The lower chamber is further divided into an air intake chamber and an exhaust chamber. The cold air channel is set longitudinally in the exhaust chamber. The air intake chamber and the exhaust chamber are physically separated by a partition plate, thus forming a hot air channel for circulating heat dissipation in the exhaust chamber, which is physically separated from the cold air channel. The design is reasonable, the structure is simplified, the manufacturing cost is saved, and it is conducive to market promotion.

[0040] (5) At the system level, both ends of the cold air duct are connected to the indoor environment, forming an independent indoor cooling circulation loop. One end of the hot air duct is connected to the indoor environment, and the other end is connected to the outdoor environment, forming an independent outdoor heat exhaust circulation loop. Through their respective narrow channels, the system utilizes the slit effect to quickly exhaust cold air into the room and hot air into the outside, thus constructing a highly efficient airflow system with completely physical separation of cold and hot air delivery. This system can be integrated as an independent module into air conditioning equipment of various structural forms to achieve efficient, energy-saving, and compact air conditioning heat exchange applications. Attached Figure Description

[0041] Figure 1 This is a schematic diagram of the overall structure of the wall-mounted semiconductor cooling and heating air conditioning device in Embodiment 1 of the present invention;

[0042] Figure 2 This is another overall structural schematic diagram of the wall-mounted semiconductor cooling and heating air conditioning device in Embodiment 1 of the present invention;

[0043] Figure 3 This is a top view of the overall structure of the wall-mounted semiconductor air conditioning device in Embodiment 1 of the present invention;

[0044] Figure 4 for Figure 3 A three-dimensional sectional view after being cut along the AA direction;

[0045] Figure 5This is an exploded view of the refrigeration device in Embodiment 1 of the present invention;

[0046] Figure 6 This is a top view of the assembly of the cold air duct and the hot air duct in Embodiment 1 of the present invention;

[0047] Figure 7 This is a planar schematic diagram of the airflow path formed by the heat sink in the cold air channel or hot air channel in Embodiment 1 of the present invention;

[0048] Figure 8 This is a three-dimensional structural diagram of the vertical floor-standing semiconductor air conditioning device in Embodiment 2 of the present invention;

[0049] Figure 9 This is another three-dimensional structural diagram of the vertical floor-standing semiconductor cooling and heating air conditioning device in Embodiment 2 of the present invention;

[0050] Figure 10 This is an exploded view of the structure of the vertical floor-standing semiconductor air conditioning equipment in Embodiment 2 of the present invention.

[0051] In the picture:

[0052] 10. Air conditioner housing; 101. Air chamber; 1011. Normal temperature air inlet; 1012. Cold air outlet; 1013. Hot air outlet; 11. Air extraction module; 12. Exhaust module;

[0053] 20. Cold air passage; 201. First air intake end; 202. Cold air exhaust end; 203. Strip-shaped hole; 21. Heat sink assembly;

[0054] 30. Hot air duct; 301. Second air inlet; 302. Hot air exhaust end;

[0055] 40. Semiconductor cooling module;

[0056] 50. Device casing; 501. Cold air deflector;

[0057] 60. Upper engine cavity; 61. Lower engine cavity; 611. Intake engine cavity; 612. Exhaust engine cavity; 63. Partition plate;

[0058] 70. Radiator;

[0059] 80. Clamping block; 801. Bolt. Detailed Implementation

[0060] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0061] Example 1

[0062] like Figures 1 to 7 As shown, a semiconductor-based air conditioning device is provided, which, based on its production cost and cooling power, is particularly suitable for indoor environments such as homes, shopping malls, shops, and office buildings. This semiconductor-based air conditioning device includes an air conditioning housing 10 and a refrigeration unit. The air conditioning housing 10 has a cavity 101 for accommodating and installing the refrigeration unit. The refrigeration unit in this embodiment is the core functional unit for achieving cooling and heating, specifically including a cold air channel 20 for conveying and cooling air, a hot air channel 30 for conveying and removing heat, and a semiconductor refrigeration module 40 as a temperature control element.

[0063] The semiconductor cooling module 40 provided in this embodiment utilizes the Peltier effect, with one side serving as a cooling surface and the other as a heating surface. The cooling surface is installed in close contact with the surface of the cold air channel 20 to achieve heat conduction cooling; the heating surface is installed in close contact with the surface of the hot air channel 30 to conduct the generated heat into the air within the hot air channel 30. In this embodiment, the cold air channel and hot air channel are made of materials with good thermal conductivity, such as aluminum or copper.

[0064] Regarding the specific construction of the airflow channel, the cold air channel 20 provided in this embodiment is designed as a multi-faceted, single-channel tubular structure. Therefore, the cold air channel has a fully enclosed sidewall and is open at both ends, such as a tetrahedron or hexahedron, to form a narrow airflow cross-section. In this embodiment, the cold air channel can be configured as a single or multiple channels depending on the air conditioning system's cooling requirements. When multiple cold air channels 20 are configured, they can be arranged in parallel, either longitudinally or laterally. One end of each cold air channel 20 is designated as a first air inlet 201, used to draw in air to be cooled (room temperature gas), and the other end is designated as a cold air outlet 202, used to expel the cooled air. Both the first air inlet 201 and the cold air outlet 202 are connected to the indoor environment, forming a cooling circulation loop for regulating the indoor temperature. When air flows through the cold air channel 20, the cooling surface of the semiconductor refrigeration module 40 transfers the cooling energy to the air through the channel wall, achieving efficient cooling.

[0065] Meanwhile, since the cold air channel 20 is a polyhedral tubular structure and its internal design is a single channel, the airflow velocity is uniform and controllable when it flows through the cold air channel 20, avoiding the "air short circuit" and unsteady eddy current phenomena commonly found in the flat multi-channel structure of traditional heat dissipation structures; the single channel of the cold air channel is much narrower than the indoor space, forming a "narrow tube effect", which can quickly and stably discharge the generated cold air from the cold air exhaust end 202 into the room.

[0066] In addition, the hot air duct 30 is arranged around the cold air duct 20, forming a parallel, longitudinal, or angled layout with the cold air duct 20. One end of the hot air duct 30 is set as the second air intake end 301, which is connected to the indoor environment and is used to draw in indoor air as a heat dissipation medium. The other end is the hot air exhaust end 302, which is connected to the outdoor environment through ducts or other pipes to exhaust the high-temperature air that has absorbed heat to the outside.

[0067] Therefore, in this embodiment, after the semiconductor cooling module 40 is powered on, its cooling surface generates cold energy, which is directly conducted to the pipe wall of the cold air channel 20. Indoor air is drawn into the narrow cold air channel 20 from the first air inlet 201. Since the channel cross-section is much smaller than the air inlet / outlet area (i.e., compared to the machine cavity or indoor space), according to the principle of fluid continuity and Bernoulli's principle, the air velocity increases sharply when entering the narrow pipe, forming a "narrow pipe effect". The high-speed air exchanges heat efficiently with the cooled pipe wall, is rapidly cooled, and is quickly discharged back into the room from the cold air outlet 202, effectively preventing the accumulation of cold energy in the pipe.

[0068] Simultaneously, the heat generated by the heating surface of the semiconductor cooling module 40 is conducted to the hot air channel 30. Indoor air enters from the second air inlet 301, and the airflow is accelerated using the narrow tube effect, quickly carrying away heat and being discharged to the outside via the hot air outlet 302. Thus, by utilizing the narrow channel of the hot and cold air channel 30 to accelerate airflow and guide airflow, combined with the multifaceted and single-channel tubular structure design of the channel, the airflow can pass smoothly, evenly, and orderly through the single channel. This avoids the defects of heat exchange structures such as small gaps / high resistance between adjacent channels and open / semi-closed designs. It effectively solves the problems of poor airflow uniformity and easy generation of unsteady eddies in traditional flat multi-channel structures, thus fully adapting to the "rapid cooling and heating" characteristics of the semiconductor cooling module 40, realizing the rapid removal of heat and cold, significantly improving cooling efficiency, and avoiding the reverse effect of heat conduction caused by heat accumulation on the cooling effect.

[0069] Compared to traditional compressor refrigeration systems (compressor, condenser, evaporator, and refrigerant), this solution directly cools the air. By placing the hot air duct 30 around the cold air duct 20, it achieves physical isolation and efficient circulation of hot and cold air, significantly simplifying the structure and achieving the effect of miniaturized air conditioning equipment. Manufacturing costs can be reduced by 30%-40%, while also achieving low vibration, low noise, and miniaturization, and energy consumption can be reduced by about 20%. In particular, by placing the cold air duct in the middle and surrounding the hot air duct on the outside, the cooling effect can be fully utilized.

[0070] In this embodiment, the arrangement of the cold air channel 20 and the installation method of the semiconductor cooling module 40 have been optimized. For example... Figures 4 to 6As shown, each cold air channel 20 is configured as a tetrahedral, pentahedral, hexahedral, or irregularly shaped polyhedral single-channel tubular structure, preferably a tetrahedral tubular structure, that is, a single-channel tubular structure with an overall cuboid shape. The cold air channels 20 are arranged horizontally (extending along the air cooling direction) within the cavity 101. If it is necessary to increase the cooling capacity, multiple such cold air channels 20 can be stacked in parallel within a suitable cavity. This array layout enables efficient utilization of the internal space of the cavity 101 and improves the cooling effect, thereby facilitating the addition or removal of cold air channels 20 according to cooling and heating requirements.

[0071] More specifically, the first air inlet is located at one end of the polyhedral cold air channel, while the cold air outlet is located on one side of the cold air channel, or at the other end of the polyhedral cold air channel, forming a symmetrical structure with the first air inlet. In this embodiment, it is preferred to locate the cold air outlet on the side of the cold air channel, and the cold air outlet is provided with a plurality of strip-shaped holes 203 for discharging cold air. The plurality of strip-shaped holes 203 are arranged in an array on the outlet end of the cold air channel, and the extension direction of the strip-shaped holes 203 at the outlet end may be consistent with or inconsistent with the length direction of the cold air channel; in this embodiment, the direction is preferably consistent. In addition, the holes at the outlet end can also be selected as round holes, polygonal holes, or irregular holes, as long as they meet the requirements for cold air discharge.

[0072] In this embodiment, the semiconductor cooling module 40 has a plate-like structure. To increase the cooling capacity, multiple semiconductor cooling modules 40 are arranged at equal intervals along the length (i.e., laterally) of the cold air channel 20, such as... Figure 5 As shown, the cooling surface of each semiconductor cooling module 40 is tightly attached to the outer surface of the cold air channel 20. Multiple semiconductor cooling modules are arranged along the length of the cold air channel, and are arrayed with the strip-shaped holes at the cold air exhaust end along the length of the cold air channel. This allows the air entering the cold air channel and flowing along the length of the channel to be cooled by the previous semiconductor cooling module, and then continue to be cooled again by the next semiconductor cooling module as it flows backward. This achieves continuous accumulation of cooling capacity within the cold air channel, further improving the cooling effect. Moreover, the cooled air can be evenly discharged from the multiple strip-shaped holes at the cold air exhaust end.

[0073] Therefore, the "multi-channel, multi-cooling-chip" arrangement of the hot and cold air ducts and the semiconductor cooling module 40 has a highly modular expansion effect, facilitating assembly as needed. For example, when a larger cooling capacity is required, it can be easily achieved by lengthening the cold air duct 20 and installing multiple semiconductor cooling modules 40 along the increased length, without significantly increasing the overall width or height of the equipment. The hot air duct 30 can be lengthened accordingly to accommodate this expansion. The semiconductor cooling module 40 can be installed on the same side of the cold air duct 20, or it can be installed on multiple different sides as needed to increase the contact area and improve heat exchange efficiency. This allows for flexible adjustment of the cooling capacity, facilitates standardized product production, and solves the drawback of increasing equipment size to improve cooling efficiency in existing technologies.

[0074] In this embodiment, the layout relationship between the cold air channel 20 and the hot air channel 30, as well as the internal structure of the cold air channel 20 and the hot air channel 30, are further defined.

[0075] like Figures 5 to 6 As shown, the hot air channel 30 is also designed as a single-channel tubular structure, which is a tetrahedron, pentahedron, hexahedron, or irregularly shaped polyhedron, preferably a tetrahedron. Therefore, the hot air channel has a fully enclosed sidewall and open ends, i.e., an overall rectangular single-channel tubular structure. Multiple hot air channels 30 are arranged in an equidistant array on the outside of the longitudinally arranged cold air channel 20. To further improve the heat dissipation effect on the surface of the cold air channel, several heat sinks can be directly installed on the surface of the cold air channel for heat dissipation.

[0076] Furthermore, one or more semiconductor cooling modules 40 are tightly clamped between the cold air channel 20 and the hot air channel 30, with their cooling surface in close contact with the outer wall of the cold air channel 20 and their heating surface in close contact with the outer wall of the hot air channel 30. This forms an independent air guide channel for separating and transporting cold and hot air.

[0077] More specifically, such as Figure 6 As shown, several hot air channels are arranged in an array outside the cold air channels at angles of 30° to 60° to the horizontal line. Preferably, the hot air channels are arranged at an angle of 45° to the horizontal line. Furthermore, the second air inlet ends of the several hot air channels face the same direction, and the hot air outlet ends also face the same direction. When the several hot air channels are arranged in an array at the same angle to the horizontal line and along the same straight line on the surface of the cold air channels, the second air inlet ends and hot air outlet ends of adjacent hot air channels can be staggered. Therefore, compared to the implementation method of setting up a single hot air channel and corresponding to several semiconductor cooling modules for heat dissipation, this embodiment can ensure that the air inlet temperature at the second air inlet end of each hot air channel remains consistent, thereby achieving optimal heat dissipation for each semiconductor cooling module.

[0078] To further enhance the heat exchange effect, such as Figure 7 As shown, heat sinks 21 are provided on the inner walls of both the hot air channel 30 and the cold air channel 20.

[0079] Specifically, a heat sink assembly 21 can be provided on the inner wall of each side of the channel. Each heat sink assembly has multiple spaced heat sinks, and these heat sinks 21 in each assembly extend from the inner wall of the channel toward the center of the channel. Moreover, the heat sinks of the heat sink assembly 21 on each side wall of the channel can be designed to be arranged in a way that is longer in the middle and gradually shortens towards the edges.

[0080] By arranging multiple sets of intermittent heat sinks 21, a main airflow path is formed in the area on the opposite side of each heat sink set on each side wall of the channel, serving as the main path for air circulation. For example, when the cold air channel or hot air channel adopts a tetrahedral tubular structure, the heat sinks on the four inner walls of the channel are all designed to be arranged in a way that is longer in the middle and gradually shorter on both sides. Therefore, the areas on the opposite side of the ends of the heat sink sets are intermittent and form an "X"-shaped main airflow path.

[0081] In this configuration, the heat sinks of each heat sink group 21 extend from the inner wall of the channel toward the center of the channel, which increases the contact area between the heat sink and the airflow, helps heat to be transferred from the inner wall of the channel to the airflow, and improves the heat dissipation efficiency.

[0082] The design creates a main airflow path in the area opposite the heat sink assembly on each side wall of the channel. This design guides the airflow, allowing it to pass through the channel in a more orderly manner and avoiding airflow turbulence. At the same time, it ensures that there is sufficient airflow through the main heat dissipation area, further improving the heat dissipation effect.

[0083] Furthermore, the "X"-shaped main airflow path ensures a more uniform airflow distribution within the channel, preventing localized areas of excessive or insufficient airflow and thus guaranteeing uniform heat dissipation throughout the channel, preventing localized overcooling or overheating. This airflow path shape extends the airflow path within the channel, increasing the contact time between the airflow and the heat sink, which facilitates full heat exchange and improves heat transfer efficiency. The "X"-shaped main airflow path can also enhance airflow turbulence to some extent, breaking down the boundary layer and reducing the thermal resistance between the airflow and the heat sink surface, further improving heat dissipation performance.

[0084] The formation of secondary airflow paths between two adjacent heat sinks increases the diversity of airflow paths, allowing the airflow to make more full contact with the heat sink, carrying away more cold or heat, and helping to guide the airflow smoothly and reduce turbulence.

[0085] In summary, by optimizing the design of the heat sink assembly within the hot and cold air channels, an airflow channel is formed that possesses both efficient heat dissipation capabilities and good airflow guidance, balancing heat exchange efficiency and airflow resistance, thereby further improving the uniformity, flow velocity, and heat exchange efficiency of the airflow.

[0086] In practical applications, the semiconductor cooling module 40 uses a semiconductor cooling chip, preferably a 12706 model, 12V, 6A, 72W. For example, ... Figure 5 As shown, a combined assembly structure with one cold air channel 20 and five hot air channels 30 is constructed, and its cooling effect is equivalent to that of a traditional 1.5 horsepower compressor air conditioning unit.

[0087] In this embodiment, a specific mounting structure is provided to ensure a tight fit between the semiconductor cooling module 40 and the channel. For example... Figures 5 to 6 As shown, several clamping blocks 80 are arranged on the outer side of the hot air channel 30. The middle of each clamping block 80 presses tightly against the hot air channel 30, while both ends are fixedly connected to the outer wall or shell of the cold air channel 20 by fasteners such as bolts 801. In use, by tightening the bolts 801, the clamping blocks 80 apply pressure inward, thereby firmly pressing the hot air channel 30 and the semiconductor cooling module 40 sandwiched in the middle onto the cold air channel 20.

[0088] Therefore, by designing the clamping block 80 and using bolts 801 to lock the two ends in a mechanical clamping method, good, low thermal resistance physical contact is ensured between the cooling and heating surfaces of the semiconductor cooling module 40 and the surfaces of the cold air channel 20 and hot air channel 30, respectively, guaranteeing heat transfer efficiency. To prevent heat from the hot air channel 30 from being conducted to the cold air channel 20 through the clamping block 80 or bolts 801, thus causing unfavorable heat recirculation, a heat insulation layer can be covered on the contact surface between the hot air channel 30 and the clamping block 80. Meanwhile, the clamping block 80 itself is preferably made of nylon or other materials with low thermal conductivity to effectively block thermal bridges and ensure that the cooling effect is not compromised.

[0089] If necessary, to facilitate installation and ensure good heat transfer, mounting openings (not shown in the figure) or mounting recesses are provided on the surfaces of the cold air channel 20 and the hot air channel 30. These mounting openings are used to connect the internal spaces of their respective channels so that the thermoelectric cooler can be embedded or mounted therein. When the thermoelectric cooler is assembled in place, its cooling surface and heating surface are directly exposed to the interior of the cold air channel 20 and the hot air channel 30 or in close contact with their inner walls through the mounting openings, thereby minimizing the thermal resistance in the heat transfer path and improving the heat exchange efficiency.

[0090] In this embodiment, the application of a wall-mounted air conditioning unit is described as an example. Figures 1 to 7As shown, specifically, the air conditioner casing 10 is designed as a wall-mounted structure, meaning the entire unit can be suspended from the wall. Its internal cavity extends laterally, meaning its width is greater than its height.

[0091] The refrigeration device provided in this embodiment also has a housing 50. Each cold air duct 20 is installed horizontally inside the housing 50, and several hot air ducts are arranged in an array at a predetermined angle to the horizontal line on the cold air ducts. This allows the cold air ducts and hot air ducts to be installed in a way that adapts to the lateral extension direction of the machine cavity through the housing 50. This arrangement adapts to the shape of the laterally extending machine cavity, resulting in a compact internal structure and an aesthetically pleasing appearance, making it suitable for wall-mounted installation in indoor settings such as homes and shops.

[0092] The machine cavity 101 is provided with a normal temperature air inlet 1011, a cold air outlet 1012, and a hot air outlet 1013 corresponding to the outer shell of the device. Since several hot air channels 30 are completely assembled inside the outer shell of the device, the second air inlet end 301 and the hot air outlet end 302 of each hot air channel are directly connected to the inner cavity of the outer shell of the device. The cross-sectional area of ​​the hot air channel is significantly smaller than the cross-sectional area of ​​the inner cavity of the outer shell of the device, so that each hot air channel can independently form a "narrow tube effect" that accelerates the airflow within the inner cavity of the outer shell of the device.

[0093] The air conditioner casing has a corresponding ambient temperature air inlet 1011, a cold air outlet 1012, and a hot air outlet 1013 between its cavity and outer shell. The number of ambient temperature outlets 1011 can be adjusted according to the design requirements of the cold and hot air ducts. Therefore, the first air inlet of the cold air duct connects to the indoor environment through its ambient temperature air inlet 1011, and the cold air outlet connects to the indoor environment through its cold air outlet. A flared cold air guide plate is installed at the cold air outlet of the outer shell to further enhance the cold air flow. The second air inlet 301 of the hot air duct 30 connects to the indoor atmosphere through another ambient temperature air inlet 1011, and the hot air outlet 302 connects to the outdoor atmosphere through its hot air outlet 1013.

[0094] Furthermore, by installing an air extraction module at the ambient temperature air inlet, ambient temperature air is drawn to the first air inlet of the cold air channel and the second air inlet of the hot air channel, respectively, further improving the heat exchange effect. By installing exhaust modules 12 (such as axial flow fans or centrifugal fans) at the cold air outlet and hot air outlet 1013, respectively, the cold air is actively exhausted into the room and the hot air is exhausted to the outside. The fans have a certain regulating effect on the airflow velocity in the channels.

[0095] Therefore, by arranging several hot air channels within the inner cavity of the device casing, and with the diameter of the hot air channel 30 being much narrower than the inner cavity of the device casing, when air enters the narrow hot air channel 30 from a large space (the inner cavity of the device casing or the room), the airflow cross-sectional area changes drastically. According to the principle of fluid continuity, the airflow velocity increases sharply, forming a strong septum effect within the channel, which greatly enhances the heat exchange efficiency and rapidly carries away the heat. Similarly, the first air inlet 201 of the cold air channel 20 is directly connected to the large indoor space through the ambient temperature air inlet 1011, and the cold air outlet 202 is connected to the large indoor environment through the cold air outlet 1012. This also creates a significant septum effect within the cold air channel 20, promoting the rapid release of cold energy.

[0096] In this embodiment, as Figure 4 As shown, on the side of the cold air outlet 1012 of the wall-mounted air conditioning unit cavity, that is, on the side facing the cold air exhaust end 202 of the cold air duct 20, a strip-shaped impeller 12 is provided as an exhaust module. The length direction of the strip-shaped impeller 12 is consistent with the array arrangement direction of several strip-shaped holes 203 on the cold air exhaust end of the cold air duct, and the length of the strip-shaped impeller 12 is sufficient to cover all the strip-shaped holes 203 of the cold air exhaust of the cold air duct 20.

[0097] Therefore, the cold air discharged from the cold air duct 20 is gathered within the cavity of the wall-mounted air conditioning unit and then evenly drawn in and blown into the room by the strip impeller 12. This not only utilizes the narrow tube effect of the cold air duct 20 to achieve high-speed exhaust of cold air from the duct, but also uses the wide strip impeller 12 of the wall-mounted air conditioning unit to evenly and gently distribute the cold air into the indoor space, avoiding localized overcooling and achieving a better air conditioning effect to regulate indoor temperature, thus improving comfort. Simultaneously, the horizontal arrangement of the cold air duct 20 perfectly matches the lateral extension design of the wall-mounted casing, ensuring the compactness and aesthetics of the entire unit.

[0098] Example 2

[0099] In this embodiment, the application of a vertical, floor-standing air conditioning unit is used as an example for description. Figures 8 to 10 As shown, specifically, the air conditioner casing 10 is configured with another type of vertical floor-standing structure, meaning the entire unit can be placed on the ground for use. Its internal cavity extends vertically, specifically including an upper cavity 60 and a lower cavity 61 that are longitudinally stacked and assembled, separated by a partition plate 63. The lower cavity 61 further includes an intake cavity 611 and an exhaust cavity 612, with the exhaust cavity 612 positioned above the intake cavity 611.

[0100] The air conditioning duct is vertically positioned within the exhaust chamber 612. The cooling surface of the semiconductor cooling module 40 is in close contact with the surface of the air conditioning duct. The first air inlet 201 of the air conditioning duct is connected to the lower intake chamber 611, and the air outlet 202 is connected to the upper chamber 60. In this vertical structure, the air conditioning duct also utilizes its narrow channel to create a slit effect, quickly exhausting the cold air from the upper chamber 60 into the room.

[0101] The heating surface of the semiconductor cooling module 40 is connected to a heat sink 70 (e.g., a finned heat sink 70) to enhance heat dissipation from the heating surface of the semiconductor cooling module into the exhaust chamber. The exhaust chamber 612 has a hot air outlet connecting to the outside and an intake chamber 611 connecting to the interior, thereby forming a hot air channel 30 for circulating heat dissipation within the exhaust chamber 612, physically separated from the cold air channel 20. Specifically, the second intake end of this hot air channel is formed at the lower end of the exhaust chamber and connects to the intake chamber, while the hot air exhaust end is formed on the side wall of the exhaust chamber and connects to the outdoor environment. Indoor air enters from the intake chamber 611, part of which enters the cold air channel 20, and the other part enters the exhaust chamber 612, absorbing heat from the heat sink 70 before being exhausted to the outside.

[0102] In addition, an industrial control module is installed on the outer wall of the upper or lower chamber for touch control and display of the air conditioning equipment's operating status.

[0103] The airflow interface of the vertical floor structure is further clarified. Specifically, the first air intake of the cold air passage is connected to an air extraction module (such as a worm gear fan) for drawing in room temperature air into the intake chamber. The intake chamber 611 has multiple room temperature air inlets 1011 for connecting to the indoor environment. Air enters the intake chamber through these inlets and is then drawn into the cold air passage 20 by the worm gear fan. Another portion of the room temperature air flows upward and serves as the heat dissipation medium for the radiator of the hot air passage 30.

[0104] The upper chamber has a cold air outlet 1012. The cold air exhaust end of the cold air duct is provided with a trumpet-shaped cold air guide plate 501, which is connected to and communicates with the partition plate through the cold air guide plate 501. The cooled air is then discharged into the room through the cold air outlet of the upper chamber for temperature regulation.

[0105] The exhaust chamber 612 has a hot air outlet 1013 for connecting to the outdoor environment, and an exhaust module 12 is provided thereon for forcibly exhausting the heat-exchanged hot air to the outside.

[0106] Example 3

[0107] In this embodiment, a semiconductor air guiding system is provided, which is formed in the cavity, cold air channel 20, hot air channel 30 and other component structures of the semiconductor air conditioning equipment of Embodiment 1 or Embodiment 2.

[0108] The core structure of this semiconductor air guiding system consists of the air conditioner housing 10 and the refrigeration unit as described in the previous embodiment. The refrigeration unit includes a semiconductor refrigeration module 40, a cold air channel 20, and a hot air channel 30. The cold air channel 20 and / or the hot air channel 30 are configured as a polyhedral, single-channel tubular structure, with the hot air channel 30 located outside the cold air channel 20. The cooling surface of the semiconductor refrigeration module 40 is in close contact with the cold air channel 20, and the heating surface is in close contact with the hot air channel 30.

[0109] Therefore, at the system level, both ends of the cold air duct 20 are connected to the indoor environment, forming an independent indoor cooling circulation loop. One end of the hot air duct 30 is connected to the indoor environment, and the other end is connected to the outdoor environment, forming an independent outdoor heat exhaust circulation loop. This system, through its narrow channels, utilizes the tube effect to quickly exhaust cold air into the room and hot air to the outside, thus constructing a highly efficient airflow system with completely physically separated cold and hot air delivery. This system can be integrated as an independent module into air conditioning equipment of various structural forms to achieve efficient, energy-saving, and compact air conditioning heat exchange applications.

[0110] Taking the wall-mounted implementation as an example, the overall working process is as follows:

[0111] 1. When the user starts the device, the semiconductor cooling module 40 is powered on, and the temperature of its cooling surface drops rapidly while the temperature of its heating surface rises rapidly. The cold air from the cooling surface is conducted to the wall of the cold air channel 20 that is in close contact with it; the heat from the heating surface is conducted to the wall of the hot air channel 30 that is in close contact with it.

[0112] 2. Cold air circulation: Room temperature air is drawn into the air chamber through the ambient temperature air inlet 1011 by the extraction module at the first air inlet end of the cold air duct and the strip-shaped impeller 12 inside the air conditioner casing 10. It then enters the narrow passageway 20 from the first air inlet end 201. Because the passageway cross-section is much smaller than the air inlet space, the air velocity increases exponentially within the passageway (narrow tube effect), passing rapidly through the cold pipe walls and internal heat sinks 21 for thorough and efficient heat exchange. Utilizing the rapid cooling characteristics of the semiconductor cooling chip, the air is quickly cooled and discharged at high speed from the cold air outlet end 202, converging at the cold air outlet 1012 side of the air chamber. Finally, it is evenly blown back into the indoor environment by the strip-shaped impeller 12, achieving indoor cooling.

[0113] 3. Hot air circulation: Room temperature indoor air is simultaneously drawn in by the extraction module at the second air inlet of the hot air duct and the exhaust module 12 at the hot air outlet. It enters the inner cavity of the device housing through the room temperature air inlet 1011 and then enters the hot air duct 30 through the second air inlet 301. Utilizing the narrow tube effect, the air flows at high speed within the narrow hot air duct 30, rapidly carrying away the heat transferred from the heating surface of the semiconductor cooling module 40 to the duct wall and heat sink 21. The high-temperature air, having absorbed heat, exits the inner cavity of the device housing from the hot air outlet 302 and is forced out to the outdoor environment by the exhaust module 12 via the hot air outlet 1013.

[0114] Therefore, through the continuous cold and hot air circulation process described above, the cold air duct 20 continuously delivers ambient temperature air from the room to the cooling surface of the semiconductor refrigeration module 40, while the hot air duct 30 continuously carries the generated heat out to the outside. Because the cold and hot air ducts 30 are independent and have extremely high airflow velocities, neither cold nor heat can effectively accumulate within the ducts, thus ensuring that the semiconductor refrigeration module 40 is always in a highly efficient temperature difference operating state, achieving a rapid, stable, and controllable cooling effect. Throughout the process, the equipment utilizes the Peltier effect of semiconductor materials to directly cool the air, eliminating the need for complex refrigeration processes such as traditional compressors, condensers, evaporators, and refrigerant applications, achieving low-noise, energy-saving, and compact operation of the heat exchange air conditioning equipment.

[0115] The above embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of protection of the present invention. Any non-substantial changes and substitutions made by those skilled in the art based on the present invention shall fall within the scope of protection claimed by the present invention.

Claims

1. A semiconductor cold heat air conditioning device, characterized by, The device includes an air conditioner housing and a refrigeration unit. The air conditioner housing has a cavity for accommodating and installing the refrigeration unit. The refrigeration unit has a cold air passage, a hot air passage, and a semiconductor refrigeration module. The cooling surface of the semiconductor refrigeration module contacts the cold air passage, while the heating surface contacts the hot air passage. The cold air duct is a multi-faceted tubular structure with a single channel. The cold air duct has a first air inlet and a cold air outlet. Both the first air inlet and the cold air outlet are connected to the indoor environment, forming a refrigeration cycle loop for regulating the indoor temperature. The cooling surface of the semiconductor refrigeration module cools the air entering the cold air duct and quickly exhausts the cold air from the cold air outlet into the room through its narrow channel. The hot air channel is located around the cold air channel. The hot air channel has a second air inlet and a hot air outlet. The second air inlet is connected to the indoor environment, and the hot air outlet is connected to the outdoor environment, thereby quickly discharging the hot air exchanged by the heating surface to the outside.

2. The semiconductor cold heat air conditioning apparatus as claimed in claim 1, wherein Several cold air channels are provided and extend along the air cooling direction within the machine cavity; The first air inlet is located at one end of the polyhedral cold air channel, and the cold air outlet is located on one side of the cold air channel. The cold air outlet is provided with a plurality of strip-shaped holes for discharging cold air, and the plurality of strip-shaped holes are arranged in an array on the outlet end on the side of the cold air channel. The extension direction of the holes may be consistent with or inconsistent with the length direction of the cold air channel. Alternatively, the cold air exhaust end can be located at the other end of the polyhedral cold air channel, forming a symmetrical structure with the first air intake end; The semiconductor cooling module is in the form of a sheet. Several of the semiconductor cooling modules are arranged at equal intervals along the length of the cold air channel and the array direction of the cold air exhaust end. The cooling surface is in close contact with the surface of the cold air channel to cool the air in the channel and exhaust it into the room through the array of cold air exhaust ends.

3. The semiconductor cold heat air conditioning apparatus as claimed in claim 2, wherein The hot air channel is a multi-faceted tubular structure with a single channel. Several hot air channels are arranged around the cold air channel, and these hot air channels are arranged in an equidistant array along the length of the cold air channel. The semiconductor cooling module is attached to the cold air channel and the hot air channel, thus forming a guide channel for separating and transporting hot and cold air.

4. The semiconductor heating and cooling air conditioning equipment as described in claim 3, characterized in that, Several hot air channels are arranged in an array outside the cold air channel at an angle of 30° to 60° with respect to the horizontal line, so that the orientation of the second air inlet and hot air outlet of two adjacent hot air channels is staggered, and one or more semiconductor cooling modules are provided between each hot air channel and the cold air channel.

5. The semiconductor heating and cooling air conditioning equipment as described in claim 3, characterized in that, Several clamping blocks are provided on the outside of the hot air channel. The middle part of the clamping block presses tightly against the hot air channel, and the two ends of the clamping block are connected to the cold air channel by bolts. Thus, the hot air channel and the semiconductor cooling block are pressed tightly onto the cold air channel by the clamping blocks.

6. The semiconductor heating and cooling air conditioning equipment as described in claim 2, characterized in that, The air conditioner casing is configured as a wall-mounted structure, with its internal cavity extending laterally; the refrigeration device also has a device housing adapted to the lateral extension direction of the cavity, the cold air channel and the hot air channel are installed in the cavity through the device housing, and the device housing is provided with a normal temperature air inlet, a cold air outlet and a hot air outlet corresponding to the cavity; The first air inlet of the cold air duct is connected to the indoor environment through the normal temperature air inlet, and the cold air outlet is connected to the indoor environment through the cold air outlet. The second air inlet of the hot air duct is connected to the indoor environment through the normal temperature air inlet, and the hot air outlet is connected to the outdoor environment through the hot air outlet. An air extraction module is provided on the ambient temperature air inlet, and an exhaust module is provided on the cold air outlet and the hot air outlet.

7. The semiconductor heating and cooling air conditioning equipment as described in claim 1, characterized in that, The air conditioner casing is designed as a vertical floor-standing structure, with its cavity extending vertically. It includes an upper cavity and a lower cavity that are stacked vertically and are separated by a partition plate. The lower cavity includes an intake cavity and an exhaust cavity. The exhaust cavity is located above the intake cavity. The upper cavity and the intake cavity are connected to the indoor environment, and the exhaust cavity is connected to the outdoor environment. The cold air channel is longitudinally arranged in the exhaust chamber. The cooling surface of the semiconductor refrigeration module is in close contact with the surface of the cold air channel. The first air inlet end of the cold air channel is connected to the air inlet chamber, and the cold air outlet end is connected to the upper chamber through the partition plate. The cold air is then quickly discharged from the upper chamber into the room through its narrow channel. The heating surface of the semiconductor cooling module is connected to a heat sink to dissipate the hot air from the heating surface into the exhaust chamber, thereby forming a hot air channel for circulating heat dissipation in the exhaust chamber, which is physically separated from the cold air channel. The second air inlet of the hot air channel is formed at the lower end of the exhaust chamber and communicates with the air inlet chamber, and the hot air outlet is formed on the side wall of the exhaust chamber and communicates with the outdoor environment.

8. The semiconductor heating and cooling air conditioning equipment as described in any one of claims 1 to 7, characterized in that, The inner wall of the cold air channel and / or hot air channel is provided with a heat sink assembly. The heat sink assembly is provided with multiple spaced heat sinks. The heat sinks extend from the inner wall of the channel to the center of the channel. The heat sink assemblies on each side wall of the channel can be designed with several heat sinks arranged in a way that is longer in the middle and gradually shorter towards the edges. This forms a main airflow path in the area on the opposite side of the heat sink assembly on each side wall of the channel, and a secondary airflow path between two adjacent heat sinks.

9. The semiconductor heating and cooling air conditioning equipment as described in claim 7, characterized in that, The first air inlet of the air conditioning channel is connected to an air extraction module for drawing in room temperature gas into the air intake chamber. The air intake chamber has a room temperature air inlet for connecting to the indoor environment, and air is introduced into the air intake chamber through the room temperature air inlet. The upper chamber has a cold air outlet, and the cooled air in the cold air passage is discharged into the indoor environment by setting an exhaust module; The exhaust chamber has a hot air outlet for connecting to the outdoor environment, and the hot air is discharged to the outdoor environment by means of an exhaust module.

10. A semiconductor airflow guiding system, characterized in that, The device includes an air conditioner housing and a refrigeration unit installed inside the air conditioner housing. The refrigeration unit has a semiconductor refrigeration module, a cold air channel, and a hot air channel. The cold air channel and / or the hot air channel are configured as a multi-faceted tubular structure with a single channel. The hot air channel is arranged outside the cold air channel. The refrigeration surface of the semiconductor refrigeration module is in close contact with the cold air channel, and the heating surface is in close contact with the hot air channel. Both ends of the cold air duct are connected to the indoor environment, and one end of the hot air duct is connected to the indoor environment and the other end is connected to the outdoor environment. Thus, through their respective narrow channels, cold air is quickly discharged into the room and hot air is discharged to the outside, forming a crisscrossing air guiding system with separate delivery of cold and hot air.

Images