Anti-condensation evaporator assembly, anti-condensation evaporator and refrigeration equipment

Abstract

This invention discloses an anti-condensation evaporator assembly, an anti-condensation evaporator, and a refrigeration device. The anti-condensation evaporator assembly includes a layered structure attached to the outer surface of the evaporator's metal wall. From the inside out, the layered structure comprises: a thermally conductive base layer for transferring the evaporator's cooling capacity outwards and providing an adhesion base for the outer layer; the thermally conductive base layer is tightly bonded to the evaporator's metal wall via thermally conductive adhesive, the thermal conductivity of which ranges from 0.5 W / (m·K) to 1 W / (m·K); a vacuum insulation layer disposed on the outside of the thermally conductive base layer to block the outward transfer of cooling capacity, keeping the outer surface temperature of the vacuum insulation layer close to ambient temperature; a composite functional coating directly formed on the outer surface of the vacuum insulation layer, comprising a hydrophilic layer, a capillary channel layer, and a hydrophobic layer arranged sequentially from the inside out; and an edge guiding structure disposed on the bottom surface to collect moisture discharged from the capillary channel layer. This achieves condensation suppression, passive management of condensation, and improves the reliability of system operation.

Description

Technical Field

[0001] This invention relates to the field of refrigeration and air conditioning technology, specifically to an anti-condensation evaporator assembly, an anti-condensation evaporator, and refrigeration equipment. Background Technology

[0002] In temperature control applications such as electronic equipment cooling, the evaporator, as a core component that directly exchanges heat with the object being cooled or the refrigerant, typically maintains a low internal operating temperature, such as 0°C to 10°C. When the outer surface temperature of the evaporator's metal wall is lower than the dew point temperature of the surrounding air, water vapor in the environment will condense on the evaporator's outer surface, forming liquid water droplets, a phenomenon known as condensation. If the condensed dew accumulates and drips onto the electronic circuit boards, optical lenses, or other sensitive components below, it can easily cause serious malfunctions such as short circuits, metal corrosion, decreased insulation performance, and even equipment shutdown.

[0003] To address the aforementioned issues, existing technologies have proposed various solutions; however, these solutions all have certain limitations. A common approach is to wrap the outer surface of the evaporator with a layer of ordinary insulation material such as sponge (NBR / PVC). However, these materials are often open-pore or semi-open-pore structures, and prolonged exposure to a humid environment will gradually absorb moisture, leading to a decrease in insulation effectiveness and the growth of mold. Another approach is to use electric heating elements to actively raise the temperature of the evaporator's outer surface to prevent condensation. However, this method requires continuous energy consumption, which contradicts the trend of green energy conservation. Simultaneously, the introduced external heat can be transferred back to the evaporator's interior through the metal wall, negatively impacting the cooling effect and increasing the compressor's workload. Furthermore, there is the practice of installing a drip tray under the evaporator to collect condensate. However, the drip tray cannot prevent condensation, and water droplets may splash onto sensitive components outside the drip tray's area.

[0004] Therefore, there is an urgent need to develop a new type of evaporator anti-condensation structure, anti-condensation evaporator, and refrigeration equipment. Without affecting the evaporator's own refrigeration performance or consuming additional energy, it can effectively suppress or eliminate condensation from a physical mechanism, and properly treat any trace amounts of condensate that may occur, thereby improving the reliability and safety of refrigeration equipment in harsh environments. Summary of the Invention

[0005] This invention addresses the problems of easy condensation on the outer surface of evaporators and the unsatisfactory effects of conventional anti-condensation solutions in the prior art. It provides an anti-condensation evaporator component, an anti-condensation evaporator, and a refrigeration device that can suppress condensation at the source and passively manage residual moisture.

[0006] The present invention provides an anti-condensation evaporator assembly, comprising a layered structure attached to the outer surface of the metal wall of the evaporator, wherein the layered structure comprises, from the inside out: a heat-conducting base layer, a vacuum insulation layer, and a composite functional coating.

[0007] The thermally conductive base layer is used to transfer the cooling capacity of the evaporator to the outside and provide an adhesion base for the outer layer. The thermally conductive base layer is tightly bonded to the metal wall of the evaporator by thermally conductive adhesive. The thermal conductivity of the thermally conductive adhesive ranges from 0.5 W / (m·K) to 1 W / (m·K).

[0008] The vacuum insulation layer is placed on the outside of the heat-conducting base layer to prevent cold energy from being transferred outward, so that the outer surface temperature of the vacuum insulation layer is close to the ambient temperature.

[0009] The composite functional coating is directly formed on the outer surface of the vacuum insulation layer, which includes a hydrophilic layer, a capillary channel layer and a hydrophobic layer arranged sequentially from the inside to the outside.

[0010] It also includes an edge guide structure on the bottom surface, which is used to collect the water discharged from the capillary channel layer.

[0011] Preferably, the heat-conducting base layer is a copper plate or an aluminum plate with a thickness of 1 mm to 2 mm.

[0012] Preferably, the vacuum insulation layer is a vacuum insulation board with a thermal conductivity ranging from 0.002 W / (m·K) to 0.004 W / (m·K) and a thickness of 5 mm to 10 mm.

[0013] Preferably, the hydrophilic layer is used to absorb condensation on the outer surface of the vacuum insulation layer; the capillary channel layer is used to directionally transport the water absorbed by the hydrophilic layer to the edge of the coating through capillary force; and the hydrophobic layer is used to repel external liquid water.

[0014] Preferably, the hydrophilic layer is made of polyacrylate or polyvinyl alcohol and has a thickness of 0.03 mm to 0.07 mm.

[0015] Preferably, the capillary channel layer is made of polytetrafluoroethylene microporous membrane or polypropylene nonwoven fabric, with a thickness of 0.01 mm to 0.03 mm and a micropore diameter of 1 μm to 10 μm.

[0016] Preferably, the hydrophobic layer is made of polytetrafluoroethylene or polyvinylidene fluoride with added nano-silica particles, and has a thickness of 0.03 mm to 0.07 mm.

[0017] Preferably, the edge guide structure is also provided with drainage holes for draining water.

[0018] Preferably, the hydrophilic layer, capillary channel layer, and hydrophobic layer are integrally formed by spraying, bonding, or curing processes.

[0019] The present invention also provides an anti-condensation evaporator, including the aforementioned anti-condensation evaporator assembly, wherein the anti-condensation evaporator assembly is attached to the outer surface of the metal wall of the evaporator.

[0020] The present invention also provides a refrigeration device, including a compressor, a condenser, a throttling device, and the aforementioned anti-condensation evaporator, wherein the compressor, condenser, throttling device, and anti-condensation evaporator are connected in sequence through pipelines to form a refrigeration cycle loop.

[0021] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0022] (1) Suppressing condensation at the source: By introducing a vacuum insulation layer with extremely low thermal conductivity, a highly efficient thermal barrier is constructed between the metal wall of the evaporator and the external environment. This allows the outer surface temperature of the vacuum insulation layer to be stably maintained at a level close to the ambient temperature, and higher than the ambient dew point temperature under most operating conditions, thereby eliminating the temperature difference driving force for condensation and realizing passive, zero-energy active anti-condensation.

[0023] (2) Passive management of residual condensation is achieved: To address the risk of trace condensation that may exist in extreme high humidity environments or at the edges of vacuum insulation layers, a composite functional coating is further designed. Trace amounts of liquid water are directionally transported to the edge of the component and discharged through a guide structure. The entire moisture management process is based entirely on physical principles (capillary action, gravity), requiring no sensors, controllers, or actuators, and is highly reliable and energy-free.

[0024] (3) Improved system reliability: The combination of vacuum insulation layer and hydrophobic coating effectively prevents the insulation material from degrading due to long-term moisture absorption. At the same time, the hydrophobic layer's surface is not prone to dust accumulation and is easy to clean, which also reduces the maintenance frequency caused by increased thermal resistance due to contamination. The passive anti-condensation mechanism avoids additional fault points such as overheating and short circuits that may be caused by electric heating elements, thus improving the reliability of the refrigeration equipment. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the interlayer structure of the anti-condensation evaporator assembly in an embodiment of the present invention.

[0026] Figure 2 This is a schematic diagram of the edge flow guiding structure of the anti-condensation evaporator assembly in an embodiment of the present invention.

[0027] Figure 3 This is a partially enlarged cross-sectional view of the junction of the side and top surfaces of the anti-condensation evaporator assembly in an embodiment of the present invention.

[0028] Figure 4 This is a partially enlarged cross-sectional view of the junction of the side and bottom surfaces of the anti-condensation evaporator assembly in an embodiment of the present invention.

[0029] Figure Labels

[0030] 110. Thermally conductive base layer; 120. Vacuum insulation layer; 1201. Top vacuum insulation layer; 1202. Side vacuum insulation layer; 1203. Bottom vacuum insulation layer; 130. Composite functional coating; 131. Hydrophilic layer; 1311. Top hydrophilic layer; 1312. Side hydrophilic layer; 1313. Bottom hydrophilic layer; 132. Capillary channel layer; 1321. Top capillary channel layer; 1322. Side capillary channel layer; 1323. Bottom capillary channel layer; 133. Hydrophobic layer; 1331. Top hydrophobic layer; 1332. Side hydrophobic layer; 1333. Bottom hydrophobic layer; 140. Edge flow guiding structure; 141. Drain hole; 200. Evaporator metal wall. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of the present invention clearer, the anti-condensation evaporator assembly and refrigeration equipment of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0032] In the description of this invention, it should be noted that the terms "inner" and "outer," etc., indicate the orientation or positional relationship with reference to the evaporator metal wall. The side closer to the evaporator metal wall is "inner," and the side farther from the evaporator metal wall is "outer." The terms "top" and "top surface" refer to the position or surface of the anti-condensation evaporator assembly located at the top of the evaporator along the direction of gravity in the actual installed and used state. The terms "bottom" and "bottom surface" refer to the position or surface of the anti-condensation evaporator assembly located at the bottom of the evaporator along the direction of gravity in the actual installed and used state. The term "side" refers to the surfaces of the anti-condensation evaporator assembly that extend along the direction of gravity and connect the top surface and the bottom surface in the actual installed and used state. These terms are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0033] Example 1

[0034] See Figure 1This embodiment provides an anti-condensation evaporator assembly, which is attached to the outer surface of the evaporator metal wall 200. The evaporator metal wall 200 can be a metal shell that forms the heat exchange interface of refrigeration equipment such as a shell-and-tube evaporator, a plate heat exchanger, or a cold plate. The anti-condensation evaporator assembly includes, from the inside out (i.e., from the side closest to the evaporator metal wall 200 to the side furthest away from the evaporator metal wall 200), a thermally conductive base layer 110, a vacuum insulation layer 120, and a composite functional coating 130. In addition, an edge guiding structure 140 is provided at the bottom edge of the anti-condensation evaporator assembly.

[0035] The thermally conductive base layer 110 is used to uniformly transfer the cooling energy of the evaporator metal wall 200 to the area it covers, and to provide a flat and solid adhesion base for the outer vacuum insulation layer 120 and the composite functional coating 130. In this embodiment, the thermally conductive base layer 110 is made of a high thermal conductivity metal material, such as a copper plate or an aluminum plate. Copper and aluminum have excellent thermal conductivity, which can quickly diffuse the local low temperature of the evaporator metal wall 200 to the entire plate surface, forming a uniform temperature field, while avoiding stress generated inside the vacuum insulation layer 120 due to excessive local temperature differences. Considering the balance between installation space and thermal conductivity efficiency, the thickness of the thermally conductive base layer 110 is preferably 1 mm to 2 mm. If the thickness is less than 1 mm, its mechanical strength is insufficient, making it difficult to provide a flat support surface; if the thickness is greater than 2 mm, it will unnecessarily increase the overall thickness and heat capacity of the component, which is not conducive to installation in a compact space.

[0036] The inner side of the thermally conductive base layer 110 (the side closest to the evaporator metal wall 200) is tightly bonded to the outer surface of the evaporator metal wall 200 using thermally conductive adhesive. The thermally conductive adhesive serves not only to achieve physical bonding but, more importantly, to establish a controlled heat transfer path between the evaporator metal wall 200 and the thermally conductive base layer 110. To achieve this, the thermal conductivity of the thermally conductive adhesive is specifically selected to be in the range of 0.5 W / (m·K) to 1 W / (m·K). If the thermal conductivity of the thermally conductive adhesive is too high, for example, greater than 1 W / (m·K), it will cause excessive transfer of cold energy to the thermally conductive base layer 110. Since the thermally conductive base layer 110 and the vacuum insulation layer 120 may have edge sealing areas or any potential microscopic defects in actual operating conditions, these areas will cause further transfer of cold energy, potentially leading to the temperature of the outer surface of the vacuum insulation layer 120 dropping below the dew point in these localized areas, thus inducing condensation on its outer surface. If the thermal conductivity of the thermally conductive adhesive is too low, for example, less than 0.5 W / (m·K), the adhesive itself will create a large thermal resistance, preventing the cooling capacity of the evaporator metal wall 200 from being effectively transferred to the thermally conductive base layer 110. Consequently, it will be unable to provide a uniform low-temperature environment for the inner surface of the vacuum insulation layer 120 to ensure its insulation efficiency. Furthermore, it will be unable to create the necessary temperature gradient within the coating to guide external water vapor molecules to condense in the hydrophilic layer 131 region, thereby working with the vacuum insulation layer 120 and the composite functional coating 130 to expel moisture. A thermally conductive adhesive meeting these requirements can be an epoxy resin or silicone rubber with a specific proportion of thermally conductive fillers (such as alumina or boron nitride).

[0037] A vacuum insulation layer 120 is disposed on the outer side of the thermally conductive base layer 110 (away from the outer wall of the evaporator) to maximize the prevention of cold energy transfer. In this embodiment, the vacuum insulation layer 120 is preferably a vacuum insulation panel. This vacuum insulation panel consists of an inner nano-silica core material and an outer multilayer composite gas barrier film. The nano-silica core material has extremely high porosity and extremely low solid-phase thermal conductivity, enabling excellent insulation performance at relatively low vacuum levels. The multilayer composite gas barrier film is typically composed of aluminum foil and polymer materials such as PET (polyethylene terephthalate). The aluminum foil layer serves as the core barrier layer, effectively preventing the penetration of gases and water vapor, while the PET layer provides mechanical protection and puncture resistance. By evacuating the interior to a high vacuum state of 0.1 Pa to 1 Pa and sealing it with the multilayer composite gas barrier film, the thermal conductivity of this vacuum insulation panel can be as low as 0.002 W / (m·K) to 0.004 W / (m·K). The thickness of the vacuum insulation layer 120 needs to balance insulation performance and space adaptability. In this embodiment, its thickness is preferably 5mm to 10mm. When the thickness is less than 5mm, the thermal resistance (thermal resistance = thickness / thermal conductivity) of the vacuum insulation board is relatively small, and the temperature of its outer surface may still be lower than the dew point temperature of the ambient air, failing to completely eliminate the risk of condensation at the source. When the thickness exceeds 10mm, although the insulation performance is better, it will significantly increase the overall volume of the component, reducing its applicability for applications where space is extremely valuable, such as cooling electronic devices and lasers. The vacuum insulation layer 120 can be fixed to the outside of the thermally conductive base layer 110 by structural adhesive or mechanical compression.

[0038] In the field of refrigeration and air conditioning technology, determining whether condensation will occur on a solid surface depends on the relative relationship between the actual surface temperature and the dew point temperature of the ambient air. Specifically, water vapor in the air will only condense into liquid water on the surface when the surface temperature is lower than or equal to the dew point temperature; if the surface temperature is higher than the dew point temperature, condensation will not occur. In unsaturated humid air environments, the ambient air temperature is always higher than the dew point temperature, and the lower the relative humidity, the greater the difference between the two. In this embodiment, because the vacuum insulation layer 120 has an extremely low thermal conductivity, its thermal resistance is much greater than the convective heat transfer resistance between its outer surface and the ambient air. Therefore, the cooling capacity inside the evaporator can hardly penetrate the vacuum insulation layer 120 to reach its outer surface. The temperature of the outer surface of the vacuum insulation layer 120 is only slightly lower than the ambient air temperature, very close to it. Under most operating conditions, the temperature of the outer surface of the vacuum insulation layer 120 can be stably higher than the dew point temperature, thus preventing condensation.

[0039] The vacuum insulation layer 120 can suppress condensation under most operating conditions. However, in extremely high humidity environments or at the edges and seams of the vacuum insulation layer 120, a cold bridge effect may still occur, causing the temperature of the outer surface of the vacuum insulation layer 120 to drop further in these local areas, even below the ambient dew point temperature, resulting in trace amounts of condensation. To address this residual risk, the present invention directly forms a composite functional coating 130 on the outer surface of the vacuum insulation layer 120 to achieve passive moisture management.

[0040] like Figure 1 As shown, the composite functional coating 130 comprises, from the inside out (from the side closest to the vacuum insulation layer 120 to the side in contact with the environment), a hydrophilic layer 131, a capillary channel layer 132, and a hydrophobic layer 133. These three layers are integrally formed through processes such as spraying, bonding, and curing, with tight interlayer bonding and no obvious interfaces to ensure smooth moisture transfer between layers.

[0041] The hydrophilic layer 131 is located at the innermost layer and is in direct contact with the outer surface of the vacuum insulation layer 120. Its function is to rapidly absorb liquid water when a small amount of condensation occurs on the outer surface of the vacuum insulation layer 120 due to cold bridging at edges or seams; and to absorb condensate when water vapor molecules pass through the hydrophobic layer 133 and the capillary channel layer 132 to reach the outer surface of the vacuum insulation layer 120 and condense into liquid water there. This layer is made of a hydrophilic polymer material, such as polyacrylate or polyvinyl alcohol, with a thickness of approximately 0.05 mm (preferably in the range of 0.03 mm to 0.07 mm). This thickness is sufficient to form a continuous and stable hydrophilic film, spreading the absorbed water in the form of a monolayer or multilayer, providing a water source for the capillary action of the next layer. If the thickness is less than 0.03 mm, the film formation may be discontinuous and have microscopic defects; if it is greater than 0.07 mm, the coating thickness and cost are unnecessarily increased.

[0042] The capillary channel layer 132 is closely attached to the outer side of the hydrophilic layer 131. Its function is to utilize capillary action to directionally transport water absorbed in the hydrophilic layer 131 from the center region of the coating to the edge. This layer is made of a material with a large number of interconnected micropores, such as hydrophilically modified polytetrafluoroethylene (PTFE) microporous membranes or polypropylene (PP) nonwoven fabrics. The PTFE microporous membrane has a three-dimensional network microporous structure formed by interconnected nodes and fibers. After hydrophilic modification, its micropore inner walls can generate a strong capillary driving force, realizing the rapid directional transport of liquid water. PP nonwoven fabrics, after hydrophilic modification, also have good capillary effect and water absorption properties. The thickness of the capillary channel layer 132 is approximately 0.02 mm, preferably in the range of 0.01 mm to 0.03 mm. The micropore size of the capillary channels in this layer is preferably between 1 μm and 10 μm. According to the principle of capillary mechanics, the smaller the pore size, the stronger the capillary driving force. If the pore size is greater than 10 μm, the capillary force is significantly weakened, and it cannot effectively drive water to overcome gravity and migrate horizontally. If the pore size is less than 1 μm, although the capillary force is strong, the manufacturing cost is high and the water flux is too small, making it difficult to deal with possible trace condensation. A pore size range of 1 μm to 10 μm can generate sufficient capillary driving force to efficiently transport water laterally without causing excessive flow resistance due to excessively small pore size, which would reduce the water transport efficiency. Under the drive of the lateral capillary force, the water entering the capillary channel layer 132 is continuously transported to the junction of the composite functional coating 130 and the edge guiding structure 140, where it leaves the capillary channel layer 132 and enters the edge guiding structure 140.

[0043] The hydrophobic layer 133 is located on the outermost side and is in direct contact with the ambient air. Its function is to repel liquid water from the environment using its superhydrophobic properties, preventing external water droplets from adhering to the coating surface. This layer is made of fluorocarbon resin (such as polytetrafluoroethylene PTFE or polyvinylidene fluoride PVDF) with added nano-silica (SiO2) particles, and has a thickness of approximately 0.05 mm, preferably in the range of 0.03 mm to 0.07 mm. By controlling the content of nanoparticles in the resin and the curing process of the coating, a micro-nano secondary rough structure is constructed on the surface, so that the contact angle of water on this surface is greater than 150°, exhibiting a superhydrophobic state. External water droplets cannot spread on it and will roll off to the edge guiding structure 140 under minimal external force (such as slight vibration or airflow) or their own gravity, thereby keeping the coating surface dry and clean.

[0044] Meanwhile, because the diameter of a single water vapor molecule is much smaller than the free volume gaps between the molecular chains of the hydrophobic layer material itself and the micropores (typically nanometer to micrometer scale) formed during the coating curing process, water vapor molecules can diffuse very slowly through the hydrophobic layer driven by the concentration difference between the external environment and the interior of the coating. Liquid water, due to hydrogen bonding between water molecules, forms large molecular clusters with an effective diameter much larger than the aforementioned micropore size, and is constrained by strong surface tension. More importantly, the hydrophobic surface generates a huge capillary negative pressure (repulsive force) on the liquid water, making it completely impossible for liquid water to pass through the hydrophobic layer. Therefore, the hydrophobic layer can effectively block the intrusion of external liquid water, but cannot completely prevent the slow penetration of individual water vapor molecules. If water vapor molecules penetrate the hydrophobic layer 133 and enter the interior of the coating, because the vacuum insulation layer 120 in this embodiment is a vacuum insulation board with a multi-layer composite gas barrier membrane, it has an extremely low permeability to gas molecules. Water vapor molecules cannot penetrate the vacuum insulation layer 120 to continue diffusing inwards and can only remain in the area outside the vacuum insulation layer 120. In an extremely humid environment, if the temperature outside the vacuum insulation layer 120 is below or equal to the dew point, water vapor molecules will condense into liquid water, which will then be absorbed by the hydrophilic layer 131 and discharged through the capillary channel layer 132. In an extremely humid environment, if the temperature outside the vacuum insulation layer 120 is above the dew point, water vapor molecules will enter and remain outside the vacuum insulation layer 120, but will not condense. Once the external environment changes, the water vapor molecules will spontaneously diffuse outward from the outside of the vacuum insulation layer 120 and return to the environment. Under normal operating conditions, the temperature outside the vacuum insulation layer 120 is usually above the dew point, and water vapor molecules will not condense and can freely enter and exit. In this case, the normal operation of the anti-condensation evaporator assembly in this embodiment will not be affected.

[0045] refer to Figure 2 - Figure 4 To facilitate the removal of moisture transported from the capillary channel layer 132 to the coating edge, an edge guide structure 140 is provided at the bottom edge of the anti-condensation evaporator assembly or other easily collectible edge locations. The edge guide structure 140 collects the moisture discharged from the capillary channel layer 132. When moisture reaches the edge through the capillary channel layer 132, it is collected by gravity or capillary force and then discharged through the edge guide structure 140 to the drain pipe of the refrigeration system or other water collection areas (such as the equipment's drain trough). The edge guide structure 140 can be implemented by pre-reserving a drain groove at the edge of the assembly or by directly forming tiny grooves on the edge encapsulation structure of the vacuum insulation layer 120. Specifically, the slope within the groove of the edge guide structure 140 can be adjusted so that the collected moisture flows to the lowest point within the groove, and a drain hole 141 is provided at the lowest point to guide the moisture out.

[0046] Specifically, in the scenario of the anti-condensation evaporator assembly operating in this embodiment, corresponding anti-condensation components are installed on all six sides of the evaporator. The top surface refers to the uppermost position or surface of the evaporator along the direction of gravity in the actual installation and use state. The bottom surface refers to the lowermost position or surface of the evaporator along the direction of gravity in the actual installation and use state. The side surfaces refer to the surfaces of the evaporator that extend along the direction of gravity and connect the top surface and the bottom surface in the actual installation and use state. Hereinafter, the top surface, side surface, and bottom surface represent the anti-condensation components installed on each side of the evaporator.

[0047] refer to Figure 2 - Figure 4 In this embodiment, when a small amount of condensation occurs on the outer surface or at the edge seam of the top vacuum insulation layer 1201, the condensation is absorbed by the top hydrophilic layer 1311, and the top capillary channel layer 1321 uses capillary force to transport the water laterally from the central area of ​​the top surface to the surrounding edges. After reaching the top edge, the water detaches from the top capillary channel layer 1321 and drips downwards under gravity or flows along the surface of the component to the outer surface of the side hydrophobic layer 1332. Due to the superhydrophobic properties of the hydrophobic layer, water droplets cannot adhere to it and continue to slide downwards along the side surface under gravity, eventually reaching the bottom edge of the evaporator component, where it is received and discharged by the edge guiding structure 140 located there.

[0048] When a small amount of condensation occurs on the outer surface or at the edge seam of the side vacuum insulation layer 1202, the condensation is absorbed by the side hydrophilic layer 1312. The side capillary channel layer 1322 then uses capillary force to transport the water generated on this surface within the coating plane. Due to gravity, the water gains additional momentum when transported downwards in the side capillary channel layer 1322 and encounters additional resistance when transported upwards. Therefore, most of the water generated on the side will preferentially be transported downwards, with only a very small amount being transported upwards to the junction of the top and side surfaces. This small amount of water will eventually dissipate through natural evaporation and will not affect the anti-condensation function of the system. The vast majority of the water generated on the side is transported downwards under the combined action of capillary force and gravity. After exiting the side capillary channel layer 1322, it is collected by gravity at the edge guide structure 140 located at the bottom edge. The side vacuum insulation layers 1202 between adjacent sides are not directly bonded at the junction, but instead leave a gap extending vertically to the edge guide structure 140, allowing moisture to smoothly detach from the coating and flow downwards. If moisture is transported to the junction of adjacent sides by the side capillary channel layer 1322, it will flow or drip downwards under gravity after detaching from the side capillary channel layer 1322, eventually entering the edge guide structure 140 located at the bottom edge.

[0049] When a small amount of condensation occurs on the outer surface or at the edge seams of the bottom vacuum insulation layer 1203, the condensation is absorbed by the bottom hydrophilic layer 1313. Then, the bottom capillary channel layer 1323 uses capillary force to transport the moisture generated on this surface laterally from the central area of ​​the bottom surface to the surrounding edges. All the moisture is transported to the edge guide structure 140 located at the edge of the bottom surface. Here, the moisture leaves the bottom capillary channel layer 1323 and is discharged into the guide groove of the edge guide structure 140 under the action of gravity.

[0050] It should be noted that, in this embodiment, the heat-conducting base layer 110 on each side of the evaporator can be made of a one-piece bent high thermal conductivity metal plate (such as a copper plate or an aluminum plate) covering the outer surface of the evaporator metal wall 200 to reduce splicing gaps and thermal resistance; alternatively, independent metal plates can be attached to each side, with the joints between the panels filled with thermally conductive adhesive to ensure the continuity of heat transfer. The vacuum insulation layer 120 is independently set on each side, and the joints can be filled with thermal insulation sealing material as needed to reduce the cold bridge effect. The composite functional coating 130 is independently coated and formed on each side. Thus, through the anti-condensation evaporator assembly of this embodiment, a passive management of condensation that may occur in the evaporator is achieved throughout the entire process.

[0051] The following is combined Figure 1 - Figure 4 The working principle of the anti-condensation evaporator assembly in this embodiment is explained in detail. When the refrigeration system is running, the refrigerant in the evaporator absorbs heat and evaporates, causing the temperature of the evaporator metal wall 200 to decrease. The cooling energy is transferred to the inner surface of the vacuum insulation layer 120 through the evaporator metal wall 200, the thermally conductive adhesive, and the thermally conductive base layer 110. Because the thermal conductivity of the vacuum insulation layer 120 is extremely low, the cooling energy transferred to the external environment is significantly reduced, thus maintaining the temperature of the outer surface of the vacuum insulation layer 120 at a level close to the ambient temperature. In most cases, this temperature is higher than the dew point temperature of the environment, so external water vapor will not condense on its surface, fundamentally achieving anti-condensation.

[0052] In extremely humid environments, condensation formed on the outer surface of the vacuum insulation layer 120 by water vapor molecules passing through the composite functional coating 130, or condensation at the edge seams of the vacuum insulation layer 120, is rapidly absorbed by the hydrophilic layer 131. Subsequently, the capillary channel layer 132 uses capillary force to transport the condensation from the central region of the coating to the edge of the component. Under the influence of gravity or capillary force, all condensation is collected in the edge guiding structure 140 and discharged through the drain hole 141.

[0053] Throughout the process, the thermally conductive base layer 110 provides adhesion and support, while the vacuum insulation layer 120 traps most of the cold energy inside, creating a low-condensation-risk working environment for the composite functional coating 130. The composite functional coating 130 then utilizes physical principles to systematically collect and directionally release any trace amounts of moisture that may occur. These three elements work together to form a passive anti-condensation system that requires no external energy source, sensors, or controllers.

[0054] Example 2

[0055] This embodiment provides an anti-condensation evaporator based on Embodiment 1. The anti-condensation evaporator includes an evaporator metal wall 200 and an anti-condensation evaporator assembly as described in Embodiment 1. The anti-condensation evaporator assembly is disposed on the outer surface of the evaporator metal wall 200. The evaporator metal wall 200 can be a metal shell constituting the heat exchange interface of refrigeration equipment such as a shell-and-tube evaporator, a plate heat exchanger, or a cold plate.

[0056] Example 3

[0057] This embodiment provides a refrigeration device based on Embodiment 2. The refrigeration device includes a compressor, a condenser, a throttling device, and an anti-condensation evaporator as described in Embodiment 2. The compressor, condenser, throttling device, and anti-condensation evaporator are connected sequentially via pipelines to form a complete compression-type refrigeration cycle.

[0058] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An anti-fog evaporator assembly characterized by, It includes a layered structure attached to the outer surface of the metal wall (200) of the evaporator, the layered structure comprising, from the inside out: a heat-conducting base layer (110), a vacuum insulation layer (120), and a composite functional coating (130). The thermally conductive base layer (110) is used to transfer the cooling capacity of the evaporator to the outside and provide an adhesion base for the outer layer. The thermally conductive base layer (110) is tightly bonded to the metal wall (200) of the evaporator by thermally conductive adhesive. The thermal conductivity of the thermally conductive adhesive ranges from 0.5 W / (m·K) to 1 W / (m·K). The vacuum insulation layer (120) is disposed on the outside of the heat-conducting base layer (110) to block the outward transfer of cold energy so that the outer surface temperature of the vacuum insulation layer (120) is close to the ambient temperature. The composite functional coating (130) is directly formed on the outer surface of the vacuum insulation layer (120), and includes a hydrophilic layer (131), a capillary channel layer (132) and a hydrophobic layer (133) arranged sequentially from the inside to the outside. It also includes an edge guide structure (140) disposed on the bottom surface, the edge guide structure (140) being used to collect the water discharged from the capillary channel layer (132).

2. The anti-icing evaporator assembly of claim 1, wherein, The thermally conductive base layer (110) is a copper plate or an aluminum plate with a thickness of 1 mm to 2 mm.

3. The anti-icing evaporator assembly of claim 1, wherein, The vacuum insulation layer (120) is a vacuum insulation board with a thermal conductivity ranging from 0.002 W / (m·K) to 0.004 W / (m·K) and a thickness ranging from 5 mm to 10 mm.

4. The anti-icing evaporator assembly of claim 1, wherein, The hydrophilic layer (131) is used to absorb condensation on the outer surface of the vacuum insulation layer (120); the capillary channel layer (132) is used to directionally transport the water absorbed by the hydrophilic layer (131) to the edge of the coating through capillary force; and the hydrophobic layer (133) is used to repel external liquid water.

5. The anti-icing evaporator assembly of claim 4, wherein, The hydrophilic layer (131) is made of polyacrylate or polyvinyl alcohol and has a thickness of 0.03 mm to 0.07 mm.

6. The anti-condensation evaporator assembly according to claim 4, characterized in that, The capillary channel layer (132) is made of polytetrafluoroethylene microporous membrane or polypropylene nonwoven fabric, with a thickness of 0.01 mm to 0.03 mm and a micropore diameter of 1 μm to 10 μm.

7. The anti-condensation evaporator assembly according to claim 4, characterized in that, The hydrophobic layer (133) is made of polytetrafluoroethylene or polyvinylidene fluoride with added nano-silica particles, and has a thickness of 0.03 mm to 0.07 mm.

8. The anti-condensation evaporator assembly according to claim 1, characterized in that, The edge guide structure (140) is also provided with a drain hole (141) for draining water.

9. The anti-condensation evaporator assembly according to claim 1, characterized in that, The hydrophilic layer (131), capillary channel layer (132) and hydrophobic layer (133) are integrally formed by spraying, bonding or curing processes.

10. An anti-condensation evaporator, characterized in that, The evaporator assembly includes any one of claims 1 to 9, wherein the anti-condensation evaporator assembly is attached to the outer surface of the evaporator metal wall (200).

11. A refrigeration device, characterized in that, It includes a compressor, a condenser, a throttling device, and an anti-condensation evaporator as described in claim 10, wherein the compressor, condenser, throttling device, and anti-condensation evaporator are connected in sequence through pipelines to form a refrigeration cycle loop.

Images