Flip chip reliability test apparatus

Abstract

This invention provides a flip chip reliability testing device, relating to the field of flip chip testing technology. It includes a worktable with a mounting port in the center. An aging test fixture is positioned above the mounting port, and a mounting base is positioned outside the aging test fixture. The mounting base has a support ring and a second gas distribution chamber for connecting to a hot air source. X-ray source assemblies are positioned on the upper and lower sides of the mounting port. A push pin is slidably mounted on the support ring, and push plates and spring-loaded plates are fixed to the outside of the push pin on both sides of the support ring. By observing the temperature changes of the flip chip under rapid local cooling, rapid heating, and cooling followed by heating, the influence of high and low temperatures on the bumps can be determined using X-ray imaging. This allows for impact testing of the flip chip under heating conditions, simulating bump damage caused by vibrations transmitted from the equipment during use.

Description

Technical Field

[0001] This invention relates to the field of flip chip testing technology, specifically to a flip chip reliability testing device. Background Technology

[0002] Flip-chip devices are primarily used in semiconductor equipment, where the chip is directly connected to a carrier via bumps. Reliability testing of flip-chip devices typically involves placing the chip in a high-low temperature environment. However, this method cannot test different parts of the flip-chip under varying high and low temperatures, making it difficult to measure the reliability differences between different bumps. Summary of the Invention

[0003] To achieve the above objectives, the present invention provides the following technical solution: a flip chip reliability testing device, comprising a workbench, an installation port in the middle of the workbench, an aging test seat above the installation port, an installation base outside the aging test seat, a support ring and a second gas distribution chamber on the installation base, the second gas distribution chamber being used to connect to a hot air source, and X-ray source components on the upper and lower sides of the workbench corresponding to the installation port; a pin is slidably mounted on the support ring, and push plates and spring-loaded plates are fixed on the outer side of the pin on both sides of the support ring, the other end of the spring-loaded plates being fixed to the inner side of the support ring; a vent is provided on the support ring, the spring-loaded plates being used to block the vent; a guide ring is fixed on the outer side of the support ring, and an air pipe passes through the inner side of the guide ring, the air pipe being connected to the second gas distribution chamber and fixed to the push plate; The support ring is provided with an inclined air hole that connects to the air inlet, and a self-sealing component is provided inside the inclined air hole; An internal gear ring is provided on the inner side of the support ring. Multiple drive components are provided on the internal gear ring. A magnetic proximity component is arranged on the drive component. The magnetic proximity component includes a mounting plate. A cold air inlet component that cooperates with the self-sealing component is provided on the mounting plate. The cold air inlet component is connected to a cold air source. A push component that acts on the ejector pin is provided at the end of the mounting plate.

[0004] Preferably, the X-ray source assembly includes an X-ray flat panel detector and an X-ray tube, a baffle for mounting the X-ray tube is fixed at the bottom of the worktable corresponding to the mounting port, and a mounting bracket for mounting the X-ray flat panel detector is rotatably provided on the upper side of the worktable.

[0005] Preferably, the driving component includes a slider that slides along the upper side of the internal gear ring, and a second motor is mounted on the slider. The output end of the second motor is fixed with a gear that meshes with the internal gear ring.

[0006] Preferably, the magnetic proximity component includes an electromagnet and a magnet. When the electromagnet is working, it exhibits an attractive force on the side opposite to the magnet. The electromagnet is mounted on a mounting plate, and the magnet is mounted on a slider. A guide rod is fixed to the lower side of the mounting plate. The guide rod is slidably connected to the slider. A spring is fixed between the guide rods at both ends of the slider. The upper middle part of the spring is fixed to the slider.

[0007] Preferably, the cold air inlet assembly includes an air distribution chamber 1, which is fixed to the mounting plate. An air pipe 2 is connected to the lower side of the air distribution chamber 1, and an air inlet pipe is provided at the upper part of the air distribution chamber 1. The air pipe 2 is used to cooperate with the self-sealing assembly, and the lower end of the air pipe 2 includes an air outlet 1 on its side.

[0008] Preferably, the self-sealing assembly includes a spring and a top block, the support ring is provided with a baffle cavity communicating with the inclined air hole, the inner wall of the baffle cavity is fixed with a baffle ring, the spring is fixed between the bottom wall of the baffle cavity and the top block, and the top block is used in conjunction with the baffle ring.

[0009] Preferably, the push assembly includes a slide table, the mounting plate is provided with a slide groove that slides with the slide table, a motor is mounted on the mounting plate, a swing arm is fixed to the output end of the motor, the other end of the swing arm is movably connected to the slide table, and a push plate that cooperates with the ejector pin is fixed to the lower side of the slide table.

[0010] Preferably, an air outlet 2 is provided on the lower side of the side wall of the first air tube, and a spring baffle 2 is fixedly connected between the end of the first air tube and the air inlet. The middle part of the spring baffle 2 is bent and located between the connection between the oblique air hole and the air inlet and the guide ring. The side of the spring baffle 2 is in contact with the corresponding side of the air inlet.

[0011] Preferably, a partition is fixed between the inner side of the guide ring and the side of the support ring, and the partition is located between the vents.

[0012] This invention provides a flip-chip reliability testing device. It has the following advantages: In this invention, by rapidly cooling, rapidly heating, and cooling followed by heating the flip chip locally, the influence of high and low temperatures on the bumps is determined by X-ray imaging. In addition, the flip chip can be impacted under heating conditions to simulate bump damage caused by vibration transmitted by the device during use. This provides a reference for improving the size range of the bumps and the materials, thereby improving the reliability of the flip chip structure. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a front view of the present invention; Figure 3This is a schematic diagram of the structure of the present invention after removing the workbench and mounting bracket; Figure 4 for Figure 3 A structural diagram from another perspective; Figure 5 for Figure 3 A partial sectional view of the structure; Figure 6 for Figure 5 Enlarged view of point A in the middle; Figure 7 for Figure 5 Enlarged view of point B in the middle; Figure 8 for Figure 5 Another perspective on the structure: structural diagram; Figure 9 for Figure 8 Enlarged view of point C in the middle.

[0014] The components are as follows: 1. Workbench; 2. Mounting bracket; 3. X-ray flat panel detector; 4. X-ray tube; 5. Baffle; 6. Slide table; 7. Swing rod; 8. Motor 1; 9. Gas distribution chamber 1; 10. Electromagnet; 11. Magnet; 12. Spring baffle 1; 13. Ejector pin; 14. Support ring; 15. Push plate; 16. Gas distribution chamber 2; 17. Guide ring; 18. Push plate; 19. Mounting base; 20. Aging test base; 21. Spring baffle 2; 22. Air pipe 1; 23. Motor 2; 24. Slider; 25. Gear; 26. Spring; 27. Guide rod; 28. Air pipe 2; 29. ​​Top block; 30. Spring; 31. Baffle cavity; 32. Slanted air hole; 33. Baffle ring. Detailed Implementation

[0015] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0016] Example 1: like Figures 1-9As shown, this embodiment of the invention provides a flip chip reliability testing device, including a workbench 1. A mounting port is provided in the middle of the workbench 1. An aging test socket 20 is provided on the upper side of the mounting port on the workbench 1. The aging test socket 20 is made of an acceptable low-density material. A chip carrier for mounting flip chips is mounted on the aging test socket 20. A mounting base 19 is fixedly provided on the outer side of the aging test socket 20 on the workbench 1. A mounting groove is provided on the upper side of the mounting base 19. A second gas distribution chamber 16 is fixedly connected in the mounting groove. An inlet pipe and an exhaust pipe with a solenoid valve are provided on the second gas distribution chamber 16. A support ring 14 is fixedly provided on the upper side of the mounting base 19. The support ring 14 is located in the second gas distribution chamber 16. Inside 6, and both are coaxially distributed, the second gas distribution chamber 16 is connected to a hot air source through an air inlet pipe. In the above, the flip chip of the aging test holder 20 is uniformly heated around the aging chamber 16. The workbench 1 is provided with X-ray source components on the upper and lower sides of the corresponding mounting port. The X-ray source components include an X-ray flat panel detector 3 and an X-ray tube 4. A cover 5 for mounting the X-ray tube 4 is fixed at the bottom of the workbench 1 corresponding to the mounting port. A mounting bracket 2 for mounting the X-ray flat panel detector 3 is rotatably provided on the upper side of the workbench 1. The X-ray image of the flip chip is displayed on the screen after being processed by the connected industrial control processor through the cooperation of the X-ray flat panel detector 3 and the X-ray tube 4. A pin 13 is slidably disposed on the support ring 14. One end of the pin 13 inside the support ring 14 is bent toward the flip chip. Push plates 15 and spring baffles 12 located on both sides of the support ring 14 are fixed on the outside of the pin 13. The other end of the spring baffles 12 is fixed to the inside of the support ring 14. Under the action of the spring baffles 12, the pins 13 are initially distributed equidistantly on the outside of the flip chip. Vents are provided on the support ring 14 and are equidistantly distributed along the circumference. The spring baffles 12 are used to block the vents, that is, the vents are blocked by the shape of the spring baffles 12. A guide ring 17 is fixed on the outside of the support ring 14. An air pipe 22 slides through the inside of the guide ring 17. The air pipe 22 is connected to the air distribution chamber 16 and fixed to the push plate 15. An air outlet 2 is provided on the lower side of the side wall of the air pipe 22. The support ring 14 is provided with an inclined air hole 32 that communicates with the air vent. The support ring 14 is provided with a baffle cavity 31 that communicates with the inclined air hole 32. The baffle cavity 31 is located between the air vents. A self-sealing component is provided inside the inclined air hole 32. Specifically, the self-sealing component includes a spring 30 and a top block 29. A retaining ring 33 is fixed to the inner wall of the baffle cavity 31. The spring 30 is fixed between the bottom wall of the baffle cavity 31 and the top block 29. The top block 29 works in conjunction with the retaining ring 33. Under the action of the spring, the top block 29 blocks the middle part of the retaining ring 33. An internal gear ring is provided on the inner side of the support ring 14. Multiple drive components are provided on the internal gear ring. Magnetic proximity components are arranged on the drive components. Each magnetic proximity component includes a mounting plate. A cold air inlet component that cooperates with the self-sealing component is provided on the mounting plate. The cold air inlet component is connected to a cold air source. A push component that acts on the ejector pin 13 is provided at the end of the mounting plate. The mounting plate mentioned above is a fan shape with its center coinciding with the support ring 14. In this way, the multiple drive components can make the edges of the corresponding mounting plates fit together.

[0017] The aforementioned driving component includes a slider 24, which slides along the upper side of the internal gear ring. A second motor 23 is mounted on the slider 24, and a gear 25 that meshes with the internal gear ring is fixed at the output end of the second motor 23. The second motor 23 drives the gear 25 to rotate, and the slider 24 moves along the internal gear ring under the meshing of the gear 25 and the internal gear ring. Specifically, a guide groove for guiding the slider 24 is provided on the inner side of the internal gear ring. The magnetic proximity assembly includes an electromagnet 10 and a magnet 11. The electromagnet 10 is mounted on a mounting plate, and the magnet 11 is mounted on a slider 24. A guide rod 27 is fixed to the lower side of the mounting plate and is slidably connected to the slider 24. A spring piece 26 is fixed between the guide rods 27 at both ends of the slider 24. The upper middle part of the spring piece 26 is fixed to the slider 24. A connecting shaft is fixed to the lower side of the mounting plate. A roller is rotatably connected to the outer side of the connecting shaft. The roller is in contact with the outer side of the support ring 14. The cooperation between the roller and the slider 24 ensures the structural stability of the mounting plate. When the electromagnet 10 is energized, it attracts the magnet 11, thereby driving the mounting plate to move closer to the slider 24, thus overcoming the resistance of the spring piece 26. During the process, the mounting plate drives the connecting shaft and the roller to move downward on the outer side of the support ring 14.

[0018] The cold air inlet assembly includes a first air distribution chamber 9, which is fixed to the mounting plate. A second air pipe 28 is connected to the lower side of the first air distribution chamber 9, and an air inlet pipe is provided at the upper part of the first air distribution chamber 9. The second air pipe 28 is used to cooperate with the self-sealing assembly. The lower end of the second air pipe 28 includes an air outlet. When the mounting plate moves downward, it drives the second air pipe 28 downward to the top block 29, and then the top block 29 is pushed away from the baffle ring 33. In this way, the cold air blown out from the first air outlet of the first air distribution chamber 9 enters the baffle cavity 31, and then passes through the inclined air hole 32 to reach the corresponding air inlet.

[0019] The push assembly includes a slide table 6. A sliding groove is provided on the mounting plate to slide with the slide table 6. A motor 8 is mounted on the mounting plate. A rocker arm 7 is fixed to the output end of the motor 8. The other end of the rocker arm 7 is movably connected to the slide table 6. A push plate 18 that cooperates with the ejector pin 13 is fixed to the lower side of the slide table 6. Under the action of the motor 8, the rocker arm 7 drives the slide table 6 to move, thereby realizing the push plate 18 pushing the ejector pin 13. The inner side of the push plate 18 is an arc shape coaxial with the support ring 14. The distribution length of the push plate 18 is less than the gap between two ejector pins 13 distributed at intervals of one ejector pin 13 at the corresponding push plate 18. In this way, by adjusting the drive assembly, the mounting plate can be moved so that the push plate 18 can only push one ejector pin 13, or it can be adjusted to push up to two adjacent ejector pins 13. During the process of the push plate 18 pushing the ejector pin 13, the air tube 22 is pushed into the guide ring 17 by the push plate 15.

[0020] The electromagnet 10, motor 8 and motor 23 mentioned above are controlled by a controller. The mounting plate corresponds to the vision module arranged on the outside of the air compartment 2 16. The controller controls the movement of motor 8 and motor 23 according to the signal from the vision module.

[0021] A spring-loaded retaining plate 21 is fixedly connected between the end of the trachea 22 and the air vent. The middle part of the spring-loaded retaining plate 21 is bent and located between the connection between the oblique air hole 32 and the air vent and the guide ring 17. The side of the spring-loaded retaining plate 21 is in contact with the corresponding side of the air vent. When the ejector pin 13 is in the initial position, there is a gap between the downwardly bent middle part of the spring-loaded retaining plate 21 and the bottom of the air vent. As the ejector pin 13 moves into the support ring 14, it pushes the middle part of the spring-loaded retaining plate 21 towards the air vent. The lower curved part is attached to the bottom of the vent, and further pushed from being attached to being separated. An expansion port is provided on the inner side of the guide ring 17 facing the support ring 14. After the air outlet 2 of the air pipe 12 enters the expansion port, the hot air in the air distribution chamber 26 can enter the vent through the air outlet 2 and then enter the vent. During the process of pushing the middle of the spring baffle 21 downward curved part to be attached to and separated from the vent, the air outlet 2 moves past the side wall of the guide ring 17 to reach the expansion port.

[0022] The aforementioned spring stop plate 12 and spring stop plate 21 are made of shape memory alloy material.

[0023] Working principle: After the flip chip carrier is placed into the aging test holder 20, the ejector pins 13 are evenly distributed around the flip chip at one end inside the support ring 14. The surrounding area of ​​the flip chip is heated by the gas distribution chamber 16. When further heating is needed at a specific location on the flip chip, the position of the slider 24 is adjusted by the engagement of the motor 23, gear 25, and internal gear ring. Under the action of the motor 8, the rocker arm 7 drives the slide table 6 to slide, which in turn drives the push plate 18 to move forward. As the ejector pin 13 moves towards the flip-chip side, it pushes the spring stop plate 12 to move away from the vent. With the electromagnet 10 not energized, the top block 29, under the action of the spring 30, blocks the retaining ring 33. As the ejector pin 13 moves, the pusher plate 15 drives the air tube 22 to move into the guide ring 17. During this process, the downward-curving middle part of the spring stop plate 21 moves past the bottom of the vent, allowing hot air from the air distribution chamber 16 to enter the expansion port through the air tube 22. Then, the air is blown through the vent to the flip chip, achieving rapid heating of the flip chip. After the downward bending part of the middle of the spring baffle 21 comes into contact with the bottom of the vent and stops pushing the ejector pin 13, the electromagnet 10 is energized. With the cooperation of the electromagnet 10 and the magnet 11, the mounting plate drives the air distribution chamber 9, causing the air pipe 28 to move downward, thereby pushing the top block 29 away from the baffle ring 33 to allow cold air to enter. Then, the cold air passes through the baffle cavity 31 and the oblique air hole 32 into the vent, and is then blown towards the flip chip. The cooling process involves energizing and then de-energizing the electromagnet 10 under the control of the controller, allowing cold air to enter and then de-energize. The ejector pin 13 is then pushed, causing the downward-curving part of the spring stop plate 21 to come into contact with and then separate from the bottom of the vent. This process allows the flip chip to cool down rapidly and then heat up rapidly. The ejector pin 13 can also further impact the flip chip, achieving impact at high temperatures. Through the cooperation of the X-ray flat panel detector 3 and the X-ray tube 4, X-ray images of the flip chip bumps are obtained, thereby determining the damage to the flip chip bumps.

[0024] Example 2: Based on Embodiment 1, this embodiment has a partition fixed between the expansion port inside the guide ring 17 and the side of the support ring 14. The partition is located between the vents. Both the guide ring 17 and the partition are made of ceramic material with low thermal conductivity, so that less heat is lost through the diffusion of the partitions on both sides. The partition also prevents hot air from flowing through the expansion port.

[0025] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A flip chip reliability testing device, comprising a workbench (1), a mounting opening is arranged in the middle of the workbench (1), an aging test seat (20) is arranged at the upper side of the mounting opening of the workbench (1), a mounting seat (19) is arranged at the outer side of the aging test seat (20), a support ring (14) and a second gas distribution chamber (16) are arranged on the mounting seat (19), and the second gas distribution chamber (16) is used for connecting a hot air source, characterized in that: The workbench (1) is provided with X-ray source components on the upper and lower sides of the corresponding installation port; a pin (13) is slidably provided on the support ring (14), and a pusher (15) and a spring baffle (12) are fixed on the outside of the pin (13) on both sides of the support ring (14). The other end of the spring baffle (12) is fixed to the inside of the support ring (14). A vent is provided on the support ring (14). The spring baffle (12) is used to block the vent. A guide ring (17) is fixed on the outside of the support ring (14). A gas pipe (22) slides through the inside of the guide ring (17). The gas pipe (22) is connected to the gas distribution chamber (16) and fixed to the pusher (15). The support ring (14) is provided with an inclined air hole (32) that connects to the air inlet, and a self-sealing component is provided inside the inclined air hole (32); An internal gear ring is provided on the inner side of the support ring (14). Multiple drive components are provided on the internal gear ring. A magnetic proximity component is arranged on the drive component. The magnetic proximity component includes a mounting plate. A cold air inlet component that cooperates with the self-sealing component is provided on the mounting plate. The cold air inlet component is connected to a cold air source. A push component that acts on the ejector pin (13) is provided at the end of the mounting plate.

2. The flip chip reliability testing device according to claim 1, characterized in that: The X-ray source assembly includes an X-ray flat panel detector (3) and an X-ray tube (4). A cover (5) for mounting the X-ray tube (4) is fixed at the bottom of the worktable (1) corresponding to the mounting port. A mounting bracket (2) for mounting the X-ray flat panel detector (3) is rotatably provided on the upper side of the worktable (1).

3. The flip chip reliability testing device according to claim 2, characterized in that: The drive assembly includes a slider (24), which slides along the upper side of the internal gear ring. A second motor (23) is mounted on the slider (24), and a gear (25) that meshes with the internal gear ring is fixed at the output end of the second motor (23).

4. The flip chip reliability testing device according to claim 3, characterized in that: The magnetic proximity assembly includes an electromagnet (10) and a magnet (11). When the electromagnet (10) is working, it exhibits an attractive force on the side opposite to the magnet (11). The electromagnet (10) is mounted on a mounting plate, and the magnet (11) is mounted on a slider (24). A guide rod (27) is fixed on the lower side of the mounting plate. The guide rod (27) is slidably connected to the slider (24). A spring piece (26) is fixed between the guide rods (27) at both ends of the slider (24). The upper middle part of the spring piece (26) is fixed to the slider (24).

5. The flip chip reliability testing device according to claim 4, characterized in that: The cold air inlet assembly includes a first air distribution chamber (9), which is fixed on the mounting plate. A second air pipe (28) is connected to the lower side of the first air distribution chamber (9). An air inlet pipe is provided on the upper part of the first air distribution chamber (9). The second air pipe (28) is used to cooperate with the self-sealing assembly. The lower side of the second air pipe (28) includes an air outlet.

6. The flip chip reliability testing device according to claim 5, characterized in that: The self-sealing assembly includes a spring (30) and a top block (29). The support ring (14) is provided with a baffle cavity (31) communicating with the inclined air hole (32). A baffle ring (33) is fixed on the inner wall of the baffle cavity (31). The spring (30) is fixed between the bottom wall of the baffle cavity (31) and the top block (29). The top block (29) and the baffle ring (33) are used together.

7. The flip-chip reliability testing device according to claim 6, characterized in that: The push assembly includes a slide (6), and the mounting plate is provided with a sliding groove that slides with the slide (6). A motor (8) is mounted on the mounting plate. A swing rod (7) is fixed at the output end of the motor (8). The other end of the swing rod (7) is movably connected to the slide (6). A push plate (18) that cooperates with the ejector pin (13) is fixed on the lower side of the slide (6).

8. The flip chip reliability testing device according to claim 7, characterized in that: The lower side of the side wall of the first air pipe (22) is provided with an air outlet. The end of the first air pipe (22) is fixedly connected to the air inlet with a spring baffle (21). The middle part of the spring baffle (21) is bent and located between the oblique air hole (32) and the air inlet and the guide ring (17). The side of the spring baffle (21) is attached to the corresponding side of the air inlet.

9. A flip-chip reliability testing device according to claim 7 or 8, characterized in that: A partition is fixed between the inner side of the guide ring (17) and the side of the support ring (14), and the partition is located between the vents.

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