An antenna and a communication device

Abstract

This invention relates to the field of antenna technology, and specifically discloses an antenna and a communication device. The antenna includes a feed board, a radiating slot plate, a dielectric substrate, a director plate, and an isolation adjustment plate. The feed board is used to feed the antenna. The radiating slot plate is disposed on one side of the feed board. The dielectric substrate is disposed on the side of the radiating slot plate opposite to the feed board. The director plate is disposed on the side of the dielectric substrate opposite to the radiating slot plate. The isolation adjustment plate is disposed on the side of the director plate opposite to the dielectric substrate. Through the above method, this invention can meet the isolation requirements.

Description

Technical Field

[0001] This invention relates to the field of antenna technology, and in particular to an antenna and a communication device. Background Technology

[0002] Currently, in the field of satellite phased array antennas, especially in the field of communication for highly integrated low-orbit satellite phased array antennas, there is an urgent need for antennas with high isolation.

[0003] In the process of realizing this invention, the inventors discovered that the self-polarization isolation of antenna products in the current industry is relatively small and cannot meet the requirements of satellite link communication quality. Summary of the Invention

[0004] This invention provides an antenna and a communication device that can meet the isolation requirements.

[0005] To solve the above-mentioned technical problems, one technical solution adopted by the present invention is: to provide an antenna, the antenna including a feed board, a radiating slot plate, a dielectric plate, a director plate and an isolation adjustment plate; the feed board is used for feeding the antenna; the radiating slot plate is disposed on one side of the feed board; the dielectric plate is disposed on the side of the radiating slot plate opposite to the feed board; the director plate is disposed on the side of the dielectric plate opposite to the radiating slot plate; and the isolation adjustment plate is disposed on the side of the director plate opposite to the dielectric plate.

[0006] Optionally, the power feed board includes a first substrate, a first microstrip line and a second microstrip line. The first microstrip line and the second microstrip line are disposed on one side of the first substrate. The first microstrip line is arranged along a first direction, and the second microstrip line is arranged along a second direction. The first direction and the second direction are perpendicular to each other, and the first microstrip line and the second microstrip line are arranged at intervals.

[0007] Optionally, the radiating slit plate includes a second substrate disposed on the first substrate. The second substrate has a first slit and a second slit. The first slit includes a first parallel segment and two first vertical segments. One end of each of the two first parallel segments is connected to one end of each of the two first vertical segments. The first vertical segment and the two first parallel segments enclose and define a first opening. The second slit includes a second parallel segment and two second vertical segments. One end of each of the two second parallel segments is connected to one end of each of the two second vertical segments. The second vertical segment and the two second parallel segments enclose and define a second opening. The orientation of the first opening and the orientation of the second opening are perpendicular.

[0008] Optionally, the first vertical segment is set along a first direction, and the first parallel segment is set along a second direction; the second vertical segment is set along a second direction, and the second parallel segment is set along a first direction, with the first and second directions being perpendicular.

[0009] Optionally, the guide plate includes a first guide layer and a second guide layer; the first guide layer includes a third substrate, a first copper-clad laminate, and a first hollow plate. The first hollow plate has a first circular hole, the first copper-clad laminate is circular, the third substrate is disposed on the side of the dielectric substrate away from the radiating slot plate, and the first copper-clad laminate and the first hollow plate are both disposed on the side of the third substrate away from the dielectric substrate. Along the thickness direction of the first hollow plate, the first copper-clad laminate is located in the first circular hole; the second guide layer includes a fourth substrate, a second copper-clad laminate, and a second hollow plate. The second hollow plate has a second circular hole, the second copper-clad laminate is circular, and the second copper-clad laminate has four notches. The notches are disposed on the edge of the second copper-clad laminate and are spaced apart along the circumference of the second copper-clad laminate. The fourth substrate is disposed on the side of the first hollow plate away from the third substrate, and the second copper-clad laminate and the second hollow plate are both disposed on the side of the fourth substrate away from the first hollow plate. Along the thickness direction of the second hollow plate, the second copper-clad laminate is located in the second circular hole.

[0010] Optionally, the isolation adjustment board includes a fifth substrate and an adjustment layer. The fifth substrate is disposed on the side of the guide plate away from the dielectric substrate, and the adjustment layer is disposed on the side of the fifth substrate away from the guide plate. The adjustment layer includes an edge choke ring, parasitic plates, and third copper-clad sheets. The fifth substrate is rectangular in shape. The edge choke ring is disposed along the periphery of the fifth substrate and defines two diagonals and four right angles. There are four parasitic plates, one of which is disposed at a right angle and protrudes inward from the edge choke ring. There are multiple third copper-clad sheets, each disposed within the edge choke ring.

[0011] Optionally, the parasitic plate is rhomboid in shape, with one vertex of the rhombus coinciding with the vertex of the corresponding right angle.

[0012] Optionally, one diagonal of the rhombus coincides with one diagonal of the corresponding edge choke ring.

[0013] Optionally, the plurality of third copper-clad sheets are symmetrical about the fifth substrate along a first direction, and the plurality of third copper-clad sheets are symmetrical about the fifth substrate along a second direction, with the first and second directions being perpendicular.

[0014] To solve the above-mentioned technical problems, another technical solution adopted by the present invention is to provide a communication device, which includes an antenna as described in any of the above embodiments.

[0015] The beneficial effects of this invention are as follows: Unlike existing technologies, this invention provides an antenna comprising a feed board, a radiating slot plate, a dielectric substrate, a director plate, and an isolation adjustment plate. The feed board powers the antenna. The radiating slot plate is disposed on one side of the feed board. The dielectric substrate is disposed on the side of the radiating slot plate opposite to the feed board. The director plate is disposed on the side of the dielectric substrate opposite to the radiating slot plate. The isolation adjustment plate is disposed on the side of the director plate opposite to the dielectric substrate. Through the above arrangement, different isolation adjustment plates can be configured as needed to meet the isolation requirements. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the drawings without creative effort.

[0017] Figure 1 This is a perspective view of the antenna according to an embodiment of the present invention; Figure 2 This is an exploded view of the antenna according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the power supply board according to an embodiment of the present invention; Figure 4 This is a schematic diagram of a radial slotted plate according to an embodiment of the present invention; Figure 5 This is an exploded view of the guide plate according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the isolation adjustment plate according to an embodiment of the present invention; Figure 7 This is a port polarization isolation curve of the antenna according to an embodiment of the present invention; Figure 8 This is a simulation curve of the VSWR of the antenna in an embodiment of the present invention; Figure 9 This is a simulation curve of the transmit TX left-hand circular polarization axial ratio of the antenna according to an embodiment of the present invention; Figure 10 This is a simulation curve of the right-hand circular polarization axial ratio of the antenna in an embodiment of the present invention.

[0018] Explanation of reference numerals in the attached figures: 1. Antenna; 10. Feed board; 11. First substrate; 12. First microstrip line; 13. Second microstrip line; 20. Radiation slit plate; 21. Second substrate; 22. First slit; 221. First parallel segment; 222. First vertical segment; 23. Second slit; 231. Second parallel segment; 232. Second vertical segment; 30. Medium plate; 40. Guide plate; 41. Third substrate; 42. First copper clad laminate; 43. First hollow plate; 431. First through hole; 44. Fourth substrate; 45. Second copper clad laminate; 451. Notch; 46. Second hollow plate; 461. Second through hole; 50. Isolation adjustment plate; 51. Fifth substrate; 52. Adjustment layer; 521. Edge choke ring; 522. Parasitic plate; 523. Third copper clad sheet. Detailed Implementation

[0019] To facilitate understanding of the present invention, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as being "connected to" another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this specification are for illustrative purposes only.

[0020] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0021] Please see Figure 1 and 2 Antenna 1 includes a feed plate 10, a radiating slot plate 20, a dielectric substrate 30, a director plate 40, and an isolation adjustment plate 50. The feed plate 10 is used for feeding the antenna. The radiating slot plate 20 is disposed on one side of the feed plate 10, and the dielectric substrate 30 is disposed on the side of the radiating slot plate 20 opposite to the feed plate 10. The director plate 40 is disposed on the side of the dielectric substrate 30 opposite to the radiating slot plate 20. The isolation adjustment plate 50 is disposed on the side of the director plate 40 opposite to the dielectric substrate 30. Through the above arrangement, different isolation adjustment plates 50 can be set as needed to meet the isolation requirements. It should be noted that the antenna 1 in this embodiment of the invention does not require drilling; the feed plate 10, radiating slot plate 20, dielectric substrate 30, director plate 40, and isolation adjustment plate 50 are all fixed by pressing, thereby reducing the manufacturing difficulty and facilitating mass production.

[0022] For ease of understanding, the directions are defined as follows: the first direction X is perpendicular to the second direction Y.

[0023] For the aforementioned feeder board 10, please refer to... Figure 2 and Figure 3 The feed board 10 includes a first substrate 11, a first microstrip line 12, and a second microstrip line 13. The first substrate 11 is rectangular in shape, and its length and width are parallel to the first direction X and the second direction Y, respectively. Both sides of the first substrate 11 are copper-clad, and the dielectric constant of the first substrate 11 is 3.58, with a thickness of 0.127 mm. The first microstrip line 12 and the second microstrip line 13 are disposed on the same side of the first substrate 11. Both the first microstrip line 12 and the second microstrip line 13 are in a straight line shape. The length of both the first microstrip line 12 and the second microstrip line 13 is 3 mm, and the width of both the first microstrip line 12 and the second microstrip line 13 is 0.3 mm. The first microstrip line 12 is arranged along the first direction X, and the second microstrip line 13 is arranged along the second direction Y, with the first microstrip line 12 and the second microstrip line 13 spaced apart. For the aforementioned radiant slotted plate 20, please refer to... Figure 2 and Figure 4 The radiating slot plate 20 is used to filter and radiate the energy of the feed layer. The radiating slot plate 20 includes a second substrate 21, which is rectangular in shape. Along the thickness direction of the second substrate 21, the projection of the second substrate 21 coincides with the projection of the first substrate 11. The dielectric constant of the second substrate 21 is 3.58, and the thickness of the second substrate 21 is 0.254 mm. The second substrate 21 is disposed on the first substrate 11, and the first microstrip line 12 and the second microstrip line 13 are both located between the second substrate 21 and the first substrate 11. Furthermore, the surface of the second substrate 21 facing away from the first substrate 11 is copper-clad. The second substrate 21 is provided with a first slot 22 and a second slot 23, which are spaced apart. The first slot 22 includes a first parallel segment 221 and two first vertical segments 222. One end of each of the two first parallel segments 221 is connected to one end of each of the two first vertical segments 222, and the first vertical segment 222 and the two first parallel segments 221 enclose and define a first opening. The second gap 23 includes a second parallel segment 231 and two second vertical segments 232. One end of each of the two second parallel segments 231 is connected to one end of each of the two second vertical segments 232. The second vertical segments 232 and the two second parallel segments 231 enclose and define a second opening. The orientation of the first opening is perpendicular to the orientation of the second opening. The width of each of the first parallel segment 221, the first vertical segment 222, the second parallel segment 231, and the second vertical segment 232 is 0.4 mm.

[0024] For example, the first vertical segment 222 is set along the first direction X, and the first parallel segment 221 is set along the second direction Y. The second vertical segment 232 is set along the second direction Y, and the second parallel segment 231 is set along the first direction X.

[0025] For the aforementioned dielectric substrate 30, please refer to... Figure 2 A dielectric substrate 30 is disposed on the side of the second substrate 21 opposite to the first substrate 11. The dielectric substrate 30 provides a high dielectric constant, thereby adjusting the Q value of the antenna 1 and thus its bandwidth. The dielectric substrate 30 is rectangular in shape, and its projection coincides with the projection of the second substrate 21 along its thickness direction. The dielectric constant of the dielectric substrate 30 is 4.53, and its thickness is 0.6 mm. Both sides of the dielectric substrate 30 are copper-clad.

[0026] For the aforementioned guide plate 40, please refer to... Figure 2 and Figure 5 The guide plate 40 includes a first guide layer and a second guide layer. Both the first guide layer and the second guide layer are used to adjust impedance and directional radiation energy. The first guide layer is disposed on the side of the dielectric plate 30 opposite to the second substrate 21, and the second guide layer is disposed on the side of the first guide layer opposite to the dielectric plate 30.

[0027] The first guiding layer includes a third substrate 41, a first copper-clad laminate 42, and a first hollow plate 43. The first hollow plate 43 has a first circular hole that penetrates the first hollow plate 43 along its thickness direction. The first copper-clad laminate 42 is circular. The third substrate 41 is disposed on the side of the dielectric substrate 30 opposite to the second substrate 21. Both the first copper-clad laminate 42 and the first hollow plate 43 are disposed on the side of the third substrate 41 opposite to the dielectric substrate 30. Along the thickness direction of the first hollow plate 43, the first copper-clad laminate 42 is located within the first circular hole. The projections of the third substrate 41 and the first hollow plate 43 coincide with the projection of the dielectric substrate 30 along its thickness direction. The diameter of the first circular hole is 7.2 mm, and the diameter of the first copper-clad laminate 42 is 6.4 mm. The first copper-clad laminate 42 is spaced apart from the inner wall of the first hollow plate 43. The third substrate 41 has a dielectric constant of 3.58 and a thickness of 0.102 mm. The surface of the third substrate 41 facing away from the dielectric substrate 30 is copper-clad. The first copper-clad sheet 42 is made of copper, has a dielectric constant of 0, and a thickness of 0.035 mm. The first hollow plate 43 has a dielectric constant of 4.53 and a thickness of 1 mm.

[0028] The second guiding layer includes a fourth substrate 44, a second copper-clad laminate 45, and a second hollow plate 46. The second hollow plate 46 has a second circular hole. The second copper-clad laminate 45 is circular and has four notches 451 located at its edges. The four notches 451 are evenly spaced along the circumference of the second copper-clad laminate 45. The notches 451 are 0.96 mm wide and are arranged along the diameter of the second copper-clad laminate 45. The corners of the notches 451 are rounded. The fourth substrate 44 is disposed on the side of the first hollow plate 43 opposite to the third substrate 41. The second copper-clad laminate 45 and the second hollow plate 46 are both disposed on the side of the fourth substrate 44 opposite to the first hollow plate 43. Along the thickness direction of the second hollow plate 46, the second copper-clad laminate 45 is located within the second circular hole. The projections of the fourth substrate 44 and the second hollow plate 46 along the thickness direction coincide with the projection of the dielectric substrate 30. The diameter of the second circular hole is 7.2 mm, and the diameter of the second copper-clad sheet 45 is 6.4 mm. The second copper-clad sheet 45 is spaced apart from the inner sidewall of the second hollow plate 46. The dielectric constant of the fourth substrate 44 is 3.58, and the thickness of the fourth substrate 44 is 0.102 mm. The surface of the fourth substrate 44 facing away from the first hollow plate 43 is copper-clad. The material of the second copper-clad sheet 45 is copper, the dielectric constant of the second copper-clad sheet 45 is 0, and the thickness of the second copper-clad sheet 45 is 0.035 mm. The dielectric constant of the second hollow plate 46 is 4.53, and the thickness of the second hollow plate 46 is 1 mm.

[0029] For the isolation adjustment plate 50 mentioned above, please refer to... Figure 2 and Figure 6 The isolation adjustment plate 50 includes a fifth substrate 51 and an adjustment layer 52. The fifth substrate 51 is disposed on the side of the second hollow plate 46 opposite to the fourth substrate 44, and the adjustment layer 52 is disposed on the side of the fifth substrate 51 opposite to the guide plate 40. The fifth substrate 51 is rectangular in shape, and its projection coincides with the projection of the second hollow plate 46 along its thickness direction. The fifth substrate 51 has a dielectric constant of 3.58 and a thickness of 0.127 mm, and its surface opposite to the second hollow plate 46 is copper-clad. The adjustment layer 52 is made of copper, has a dielectric constant of 0, and a thickness of 0.035 mm.

[0030] The regulating layer 52 includes an edge choke ring 521, parasitic patches 522, and third copper-clad sheets 523. The edge choke ring 521 is disposed along the periphery of the fifth substrate 51, and its outer contour coincides with the outer contour of the fifth substrate 51. The width of the edge choke ring 521 is 0.2 mm. The edge choke ring 521 defines two diagonals and four right angles. There are four parasitic patches 522, one of which is disposed at a right angle and protrudes inward from the edge choke ring 521. There are multiple third copper-clad sheets 523, each disposed within the edge choke ring 521. The parasitic patches 522 are rhomboid in shape, with one vertex of the rhombus coinciding with the vertex of the corresponding right angle. It should be noted that the vertex of the right angle is located on the outer contour of the edge choke ring 521. Furthermore, one diagonal of the rhombus coincides with one diagonal of the corresponding edge choke ring 521.

[0031] For the aforementioned third copper-clad sheets 523, the pattern formed by each third copper-clad sheet 523 is symmetrical about the fifth substrate 51 along the first direction X and about the fifth substrate 51 along the second direction Y, with the first direction X and the second direction Y being perpendicular. As an example, the shape of the third copper-clad sheet 523 is hexagonal, and the number of third copper-clad sheets 523 is four. Two third copper-clad sheets 523 are spaced apart along the fifth substrate 51 along the first direction X, and another two third copper-clad sheets 523 are spaced apart along the fifth substrate 51 along the first direction X. It is understood that the shape of the third copper-clad sheets 523 can also be triangular, circular, or rectangular. The isolation of the antenna 1 can be adjusted by adjusting the width of the edge choke ring 521, and / or the size of the parasitic patch 522, and / or the shape and / or the size of the third copper-clad sheets 523. For antennas 1 with different requirements, only different adjustment layers 52 need to be adapted, which is beneficial for mass production.

[0032] Please see Figure 7 , Figure 7 The port polarization isolation curve for antenna 1 is shown. (From...) Figure 7 It can be seen that the isolation of antenna 1 is less than the specified value, that is, less than -20dB.

[0033] Please see Figure 8 , Figure 8 The simulated VSWR curve for antenna 1 is shown. Figure 8 It can be seen that the voltage reflection coefficient is less than the index value, that is, less than 1.8.

[0034] Please see Figure 9 , Figure 9 The simulated axial ratio curve of the transmit TX left-hand circular polarization of antenna 1 is shown. Figure 9 It can be seen that the left-hand circular polarization axis ratio of the transmitting port is less than the specified value, that is, less than 3dB.

[0035] Please see Figure 10 , Figure 10 The simulated axial ratio curve of the right-hand circular polarization of antenna 1's receiving RX is shown. Figure 10 It can be seen that the right-hand circular polarization axis ratio of the receiving port is less than the specified value, that is, less than 3dB.

[0036] In this embodiment of the invention, the antenna 1 includes a feed plate 10, a radiating slot plate 20, a dielectric substrate 30, a director plate 40, and an isolation adjustment plate 50. The feed plate 10 is used to feed the antenna 1. The radiating slot plate 20 is disposed on one side of the feed plate 10. The dielectric substrate 30 is disposed on the side of the radiating slot plate 20 away from the feed plate 10. The director plate 40 is disposed on the side of the dielectric substrate 30 away from the radiating slot plate 20. The isolation adjustment plate 50 is disposed on the side of the director plate 40 away from the dielectric substrate 30. Through the above arrangement, different isolation adjustment plates 50 can be set as needed to meet the isolation requirements.

[0037] The present invention provides an embodiment of a communication device, which includes the antenna 1 described above. The structure and function of the antenna 1 can be referred to the above embodiment, and will not be repeated here.

[0038] It should be noted that while the preferred embodiments of the present invention are given in the specification and accompanying drawings, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are not intended to impose additional limitations on the content of the present invention; their purpose is to provide a more thorough and comprehensive understanding of the disclosure of the present invention. Furthermore, the above-described technical features can be combined with each other to form various embodiments not listed above, all of which are considered to be within the scope of the present invention specification. Moreover, those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. An antenna, characterized in that, include: Feed board, used for antenna feeding; A radiating slotted plate, wherein the radiating slotted plate is disposed on one side of the feed plate; A dielectric plate is disposed on the side of the radiating slot plate opposite to the feed plate; A guide plate is disposed on the side of the dielectric plate opposite to the radiation slot plate; An isolation adjustment plate is disposed on the side of the guide plate opposite to the medium plate.

2. The antenna according to claim 1, characterized in that, The power supply board includes a first substrate, a first microstrip line, and a second microstrip line. The first microstrip line and the second microstrip line are disposed on one side of the first substrate. The first microstrip line is arranged along a first direction, and the second microstrip line is arranged along a second direction. The first direction and the second direction are perpendicular to each other, and the first microstrip line and the second microstrip line are arranged at intervals.

3. The antenna according to claim 1, characterized in that, The radiation slit plate includes a second substrate, which is disposed on the first substrate, and the second substrate is provided with a first slit and a second slit; The first gap includes a first parallel segment and two first vertical segments, one end of each of the two first parallel segments is connected to both ends of the first vertical segment, and the first vertical segment and the two first parallel segments enclose and define a first opening; The second gap includes a second parallel segment and two second vertical segments. One end of each of the two second parallel segments is connected to both ends of the second vertical segment. The second vertical segment and the two second parallel segments enclose and define a second opening. The orientation of the first opening is perpendicular to the orientation of the second opening.

4. The antenna according to claim 3, characterized in that, The first vertical segment is arranged along a first direction, and the first parallel segment is arranged along a second direction; The second vertical segment is arranged along the second direction, and the second parallel segment is arranged along the first direction, wherein the first direction and the second direction are perpendicular.

5. The antenna according to claim 1, characterized in that, The guide plate includes a first guide layer and a second guide layer; The first guiding layer includes a third substrate, a first copper-clad laminate, and a first hollow plate. The first hollow plate has a first circular hole. The first copper-clad laminate is circular. The third substrate is disposed on the side of the dielectric substrate away from the radiating slot plate. The first copper-clad laminate and the first hollow plate are both disposed on the side of the third substrate away from the dielectric substrate. Along the thickness direction of the first hollow plate, the first copper-clad laminate is located inside the first circular hole. The second guiding layer includes a fourth substrate, a second copper-clad laminate, and a second hollow plate. The second hollow plate has a second circular hole. The second copper-clad laminate is circular and has four notches located on its edges. The four notches are spaced apart along the circumference of the second copper-clad laminate. The fourth substrate is located on the side of the first hollow plate away from the third substrate. Both the second copper-clad laminate and the second hollow plate are located on the side of the fourth substrate away from the first hollow plate. Along the thickness direction of the second hollow plate, the second copper-clad laminate is located inside the second circular hole.

6. The antenna according to claim 1, characterized in that, The isolation adjustment plate includes a fifth substrate and an adjustment layer. The fifth substrate is disposed on the side of the guide plate opposite to the dielectric plate, and the adjustment layer is disposed on the side of the fifth substrate opposite to the guide plate. The adjustment layer includes an edge choke ring, parasitic plates, and third copper-clad sheets. The fifth substrate is rectangular in shape. The edge choke ring is disposed along the periphery of the fifth substrate and defines two diagonals and four right angles. There are four parasitic plates, one of which is disposed at one of the right angles and protrudes inward from the edge choke ring. There are multiple third copper-clad sheets, each disposed within the edge choke ring.

7. The antenna according to claim 6, characterized in that, The parasitic plate is rhomboid in shape, with one vertex of the rhombus coinciding with the vertex of the corresponding right angle.

8. The antenna according to claim 6, characterized in that, One diagonal of the rhombus coincides with one diagonal of the corresponding edge choke ring.

9. The antenna according to claim 6, characterized in that, The plurality of third copper-clad sheets are symmetrical about the fifth substrate along a first direction, and the plurality of third copper-clad sheets are symmetrical about the fifth substrate along a second direction, wherein the first direction and the second direction are perpendicular.

10. A communication device, characterized in that, Including the antenna as described in any one of claims 1-9.

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