Power supply device and electric vehicle

Abstract

This application relates to the field of heat dissipation technology for power supply devices, and specifically discloses a power supply device and an electric vehicle. The power supply device includes a housing, a main circuit board, and power devices. The housing has a receiving cavity with a three-dimensional flow channel for the flow of a heat dissipation medium. Along the height direction of the three-dimensional flow channel, a top surface is provided at the end of the flow channel facing away from the bottom of the receiving cavity. The main circuit board is disposed in the receiving cavity, and the power devices are disposed on the main circuit board. Along the height direction of the three-dimensional flow channel, the power devices have opposing mounting surfaces and heat dissipation surfaces. The mounting surface is connected to the main circuit board, and the heat dissipation surface corresponds to the top surface of the three-dimensional flow channel, and the heat dissipation surface and the top surface are thermally connected. Through this method, the side of the power device facing away from the main circuit board is thermally connected to the top outer wall of the three-dimensional flow channel, simplifying the structure and eliminating the need for vertical welding of the power device, which helps reduce production costs and improve heat dissipation efficiency.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for power supply devices, and in particular to a power supply device and an electric vehicle. Background Technology

[0002] In the new energy vehicle industry, the power supply unit, as one of the core components, directly affects the overall vehicle's operating efficiency and safety through its stability and reliability. Among these, heat dissipation is a key factor in improving power supply unit performance. Currently, power devices in power supplies primarily dissipate heat through planar or three-dimensional cooling channels. With planar channels, power devices are horizontally mounted onto the circuit board. To ensure the power devices are close to the channels and that all heat-generating modules receive uniform heat, the circuit board needs to be split into sections to allow coolant to flow evenly to each heat-generating module, ensuring good heat dissipation for all. With three-dimensional channels, power devices are vertically inserted into the circuit board. The vertical power devices conduct heat through the sidewalls of the three-dimensional channels. The insertion points are selectively wave soldered to the circuit board, and additional structural components are used to fix and compress the vertical power devices.

[0003] Separating circuit boards, or requiring selective wave soldering of inserts and additional structural components, will increase the material cost and process complexity of the power supply unit, resulting in higher production costs. Summary of the Invention

[0004] In view of the above problems, embodiments of this application provide a power supply device and an electric vehicle that overcome or at least partially solve the above problems.

[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application is: to provide a power supply device, including a housing, a main circuit board and a power device. The housing is provided with a receiving cavity, and a three-dimensional flow channel is provided in the housing within the receiving cavity. The three-dimensional flow channel is used for the flow of heat dissipation medium. Along the height direction of the three-dimensional flow channel, a top surface is provided at one end of the three-dimensional flow channel away from the bottom of the receiving cavity. The main circuit board is disposed in the receiving cavity, and the power device is disposed on the main circuit board. Along the height direction of the three-dimensional flow channel, the power device is provided with a mounting surface and a heat dissipation surface. The mounting surface is connected to the main circuit board, and the heat dissipation surface is correspondingly disposed to the top surface of the three-dimensional flow channel, and the heat dissipation surface and the top surface are thermally connected.

[0006] In some embodiments, the three-dimensional flow channel includes a first flow channel and a second flow channel that are connected to each other. A first heat dissipation groove is formed in the receiving cavity of the housing along the height direction perpendicular to the three-dimensional flow channel. The power supply device also includes a first magnetic component, which is electrically connected to the main circuit board. The first magnetic component is disposed in the first heat dissipation groove and is thermally connected to the groove wall of the first heat dissipation groove.

[0007] In some embodiments, a second heat dissipation groove is formed between the receiving cavity of the housing, the sidewall of the first flow channel and the sidewall of the housing, and the power supply device further includes a first capacitor assembly, which is electrically connected to the main circuit board, disposed in the second heat dissipation groove, and thermally connected to the groove wall of the second heat dissipation groove.

[0008] In some embodiments, a third heat dissipation groove is formed between the receiving cavity of the housing, the sidewall of the second flow channel and the sidewall of the housing. The power supply device also includes an auxiliary power circuit board, which is vertically disposed on the main circuit board. One end of the auxiliary power circuit board is electrically connected to the main circuit board, and the other end of the auxiliary power circuit board away from the main circuit board extends into the third heat dissipation groove. The auxiliary power circuit board is thermally connected to the groove wall of the third heat dissipation groove.

[0009] In some embodiments, the first heat sink includes a first heat sink sub-slot and a second heat sink sub-slot. The power supply device also includes a secondary circuit board, which is electrically connected to the main circuit board. The secondary circuit board is disposed at the slot opening of the first heat sink sub-slot. The first magnetic component includes a PFC inductor, an OBC main transformer, a DC-DC main transformer, and a DC-DC output freewheeling inductor. The DC-DC main transformer and the DC-DC output freewheeling inductor are disposed in the first heat sink sub-slot and are electrically connected to the secondary circuit board. The PFC inductor and the OBC main transformer are disposed in the second heat sink sub-slot and are electrically connected to the main circuit board.

[0010] In some embodiments, the housing has a first shielding groove in the housing cavity, and the power supply device further includes a connector assembly disposed in the housing, with at least a portion of the connector assembly disposed in the first shielding groove.

[0011] In some embodiments, the housing is provided with a first partition in the receiving cavity, and a second shielding groove is formed between the first partition and one side wall of the housing. The power supply device further includes an AC input filtering module, which is electrically connected to the main circuit board and is disposed in the second shielding groove.

[0012] In some embodiments, the housing is provided with a second partition in the receiving cavity, and a third shielding groove is formed between the second partition and the side wall of the housing opposite to the second shielding groove. The power supply device also includes a high-voltage output filter module, which is disposed in the third shielding groove.

[0013] In some embodiments, the connector assembly includes a signal connector and a DC-DC positive output connector, which are disposed in a first shielding slot. The signal connector is electrically connected to the main circuit board, and the DC-DC positive output connector is electrically connected to the secondary circuit board. The power supply device also includes a shielding sheet disposed between the secondary circuit board and the main circuit board, and the shielding sheet is disposed between the signal connector and the DC-DC positive output connector.

[0014] In some embodiments, the first shielding groove and the first heat dissipation sub-groove are both located between the second shielding groove and the third shielding groove, the distance between the shielding sheet and the bottom surface of the receiving cavity is less than or equal to the height of the first partition, and / or the distance between the shielding sheet and the bottom surface of the receiving cavity is less than or equal to the height of the second partition.

[0015] In some embodiments, along the height direction of the three-dimensional flow channel, a first top surface is provided at one end of the first flow channel away from the bottom of the receiving cavity, and a second top surface is provided at one end of the second flow channel away from the bottom of the receiving cavity. The number of power devices is multiple, and the multiple power devices are arranged in two rows. The two rows of power devices are respectively thermally connected to the first top surface and the second top surface.

[0016] In some embodiments, the inner wall of the three-dimensional flow channel is provided with columns that extend along the height direction of the three-dimensional flow channel. There are multiple columns, and the multiple columns are distributed on the inner wall of at least one side of the three-dimensional flow channel along the flow direction of the medium inside the three-dimensional flow channel.

[0017] In some embodiments, there are multiple columns, which are arranged sequentially and evenly at intervals along the flow direction of the medium in the three-dimensional flow channel.

[0018] In some embodiments, the three-dimensional flow channel has protrusions on the inner wall of its top surface.

[0019] In some embodiments, the power supply device further includes a heat-conducting element disposed between the heat dissipation surface of the power device and the top surface of the three-dimensional flow channel, and the heat-conducting element is in contact with both the heat dissipation surface and the top surface.

[0020] In some embodiments, the heat-conducting component is provided with a limiting hole, the top surface of the three-dimensional flow channel is provided with a limiting groove facing the power device, and the power supply device further includes a first limiting component, the two ends of the first limiting component being respectively provided in the limiting groove and the limiting hole.

[0021] In some embodiments, the power supply device further includes a second limiting member disposed on the side surface of the circuit board on which the power device is disposed, and the two ends of the second limiting member respectively abut against the circuit board and the heat-conducting component.

[0022] To solve the above-mentioned technical problems, another technical solution adopted in this application is to provide an electric vehicle, including the above-mentioned power supply device.

[0023] The beneficial effects of this application embodiment are as follows: Unlike the prior art, this application embodiment provides a power supply device and an electric vehicle. The power supply device includes a housing, a main circuit board, and power devices. The housing has a receiving cavity, and a three-dimensional flow channel is provided within the receiving cavity. The three-dimensional flow channel is used for the flow of heat dissipation medium. Along the height direction of the three-dimensional flow channel, the end of the three-dimensional flow channel opposite to the bottom of the receiving cavity has a top surface. The main circuit board is disposed in the receiving cavity, and the power devices are disposed on the main circuit board. Along the height direction of the three-dimensional flow channel, the power devices have opposing mounting surfaces and heat dissipation surfaces. The mounting surface is connected to the main circuit board, and the heat dissipation surface is correspondingly disposed to the top surface of the three-dimensional flow channel, and the heat dissipation surface and the top surface are thermally connected. Through the above method, the side of the power device opposite to the main circuit board is thermally connected to the top outer wall of the three-dimensional flow channel, simplifying the structure and eliminating the need for vertical welding of the power devices, which helps to reduce production costs and improve heat dissipation efficiency. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the drawings without creative effort.

[0025] Figure 1 This is a perspective view of a power supply device provided in an embodiment of this application; Figure 2 This is an exploded view of a power supply device provided in an embodiment of this application; Figure 3 This is an exploded view of a housing with a connector assembly provided in one embodiment of this application; Figure 4 This is a bottom perspective view of a main housing with a connector assembly provided in an embodiment of this application; Figure 5 This is an exploded view of a power supply device provided in an embodiment of this application, excluding the housing, insulating sheet, and connector assembly; Figure 6 yes Figure 1 A three-dimensional sectional view after being cut along section line AA; Figure 7 yes Figure 6 A magnified view of a portion of region C in the middle; Figure 8 yes Figure 1 A three-dimensional sectional view after being cut along section line BB; Figure 9 This is a partial cross-sectional enlarged view of the power supply device provided in another embodiment of this application after the top cover has been removed. Detailed Implementation

[0026] To facilitate understanding of this application, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as being "connected" to another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this specification are for illustrative purposes only.

[0027] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0028] Please see Figure 1 and Figure 2 The power supply device 1000 includes a housing 1, a main circuit board 2, and a power device 3. The main circuit board 2 and the power device 3 are disposed inside the housing 1. The housing 1 is provided with a three-dimensional flow channel 110. The power device 3 is disposed on the main circuit board 2 and is cooled through the three-dimensional flow channel 110.

[0029] In some embodiments, please refer to Figure 1 , Figure 3 , Figure 6 and Figure 8 The housing 1 has a receiving cavity 10, and a three-dimensional flow channel 110 is provided in the receiving cavity 10. The three-dimensional flow channel 110 is used for the flow of heat dissipation medium to dissipate heat for the power device 3. The three-dimensional flow channel 110 is formed by protrusion from the bottom of the receiving cavity 10. Along the height direction z of the three-dimensional flow channel 110, a top surface 1101 is provided at the end of the three-dimensional flow channel 110 away from the bottom of the receiving cavity 10. The top surface 1101 is used for thermal conduction connection with the power device 3. Compared with a planar flow channel, the three-dimensional flow channel 110 provides a larger heat dissipation area and can allow a larger flow rate of heat dissipation medium to pass through, which is beneficial to improving heat dissipation efficiency.

[0030] It should be noted that the heat dissipation medium is a cooling fluid with high thermal conductivity, high specific heat capacity and low viscosity, such as water or water-based coolant.

[0031] In some embodiments, please refer to Figure 2 , Figure 5 and Figure 6The main circuit board 2 is disposed in the receiving cavity 10. Along the thickness direction of the main circuit board 2, the main circuit board 2 includes a first surface 21 and a second surface 22 facing each other, with the second surface 22 facing the three-dimensional flow channel 110. The thickness direction of the main circuit board 2 is parallel to the height direction z of the three-dimensional flow channel 110.

[0032] In some embodiments, the main circuit board 2 is an integrated board with good stability.

[0033] In some embodiments, please refer to Figure 2 , Figure 5 and Figure 6 The power device 3 is disposed on the second surface 22 of the main circuit board 2. Along the height z of the three-dimensional flow channel 110, the main circuit board 2, the power device 3, and the three-dimensional flow channel 110 are arranged sequentially. Along the height z, the power device 3 has a mounting surface 31 and a heat dissipation surface 32. The mounting surface 31 is connected to the second surface 22 via surface mount technology and is parallel to the second surface 22. The heat dissipation surface 32 is correspondingly disposed to the top surface 1101 of the three-dimensional flow channel 110, and the heat dissipation surface 32 is thermally connected to the top surface 1101. Thus, on the one hand, by correspondingly thermally connecting the heat dissipation surface 32 to the top surface 1101 of the three-dimensional flow channel 110, the number of fixing and clamping components required for lateral heat conduction is reduced, simplifying the structure and reducing costs; on the other hand, the power device 3 is mounted on the main circuit board 2, eliminating the need for soldering vertical inserts and saving the selective wave soldering process, thus simplifying the manufacturing process.

[0034] In some embodiments, the number of power devices 3 is multiple, and the arrangement direction of the multiple power devices 3 is the same as the flow direction of the medium in the three-dimensional flow channel 110, so as to dissipate heat for the multiple power devices 3 and improve the practicality of the power supply device 1000.

[0035] In some embodiments, please refer to Figure 3 , Figure 6 and Figure 8 The three-dimensional flow channel 110 includes a first flow channel 111 and a second flow channel 112 that are connected to each other, and a top surface 1101 includes a first top surface 1111 and a second top surface 1121. Along the height direction of the three-dimensional flow channel 110, the first top surface 1111 is provided at one end of the first flow channel 111 away from the bottom of the receiving cavity 10, and the second top surface 1121 is provided at one end of the second flow channel 112 away from the bottom of the receiving cavity 10. There are multiple power devices 3, which are arranged in two rows, and the two rows of power devices 3 are respectively thermally connected to the first top surface 1111 and the second top surface 1121.

[0036] In some embodiments, in the two columns of power devices 3, the first column of power devices 3 and the second column of power devices 3 are spaced apart along a first direction x. In each column of power devices 3, multiple power devices 3 are arranged adjacent to each other along a second direction y. The first flow channel 111 and the second flow channel 112 both extend along the second direction y. The first column of power devices 3 corresponds to the first flow channel 111, and the second column of power devices 3 corresponds to the second flow channel 112. The first direction x, the second direction y, and the height direction z of the three-dimensional flow channel 110 are all perpendicular to each other.

[0037] In some embodiments, please refer to Figure 4 and Figure 6 The three-dimensional flow channel 110 also includes a connecting flow channel 113, which extends along a first direction x, and the first flow channel 111 and the second flow channel 112 are connected through the connecting flow channel 113. In some examples, the connecting flow channel 113 is a planar flow channel, which reduces the space occupied by the receiving cavity 10.

[0038] In some embodiments, please refer to Figures 2 to 4 The housing 1 includes a main housing 11, a top cover 12, and a bottom plate 13. The main housing 11 is provided with a receiving groove, and the top cover 12 is used to close the opening of the receiving groove to form a receiving cavity 10. The main housing 11 has a flow channel 114 at the bottom of the receiving groove. The flow channel 114 includes a first flow channel 1141, a connecting flow channel 1142, and a second flow channel 1143 connected in sequence. The bottom plate 13 is used to close the opening of the flow channel 114 to form a first flow channel 111, a connecting flow channel 113, and a second flow channel 112 corresponding in sequence. The opening of the flow channel 114 is opposite to the opening of the receiving groove.

[0039] In some embodiments, an insulating sheet 14 is provided between the top cover 12 and the first surface 21 of the main circuit board 2 to provide insulation protection between the main circuit board 2 and the housing 1.

[0040] In some embodiments, please refer to Figure 4 The three-dimensional flow channel 110 has an inlet pipe 115 and an outlet pipe 116 at its two ends. The inlet pipe 115 is used to allow the heat dissipation medium to enter the three-dimensional flow channel 110, where it flows and undergoes heat exchange. The outlet pipe 116 is used to allow the heat dissipation medium that has completed heat exchange to flow out. The inlet pipe 115, the first flow channel 111, the connecting flow channel 113, the second flow channel 112, and the outlet pipe 116 are connected in sequence. Both the inlet pipe 115 and the outlet pipe 116 are located at the first end of the housing 1 along the second direction y.

[0041] In some embodiments, please refer to Figures 5 to 7A heat-conducting component 4 is provided between the heat dissipation surface 32 of the power device 3 and the three-dimensional channel 110. The heat-conducting component 4 is in contact with both the heat dissipation surface 32 and the top surface 1101 of the three-dimensional channel. Through the heat-conducting component 4, the surface-mount power device 3 is thermally connected to the top of the three-dimensional channel, thereby improving the heat conduction efficiency and enhancing the heat dissipation effect.

[0042] It should be noted that the heat-conducting component 4 is an insulating material with a high thermal conductivity. In some examples, the heat-conducting component 4 may be a ceramic substrate, a silicone grease layer, or other coatings or substrates with insulating and thermally conductive properties.

[0043] In some embodiments, please refer to Figure 2 and Figure 3 There are two heat-conducting components 4. The two heat-conducting components 4 are respectively disposed between the first top surface 1111 of the first flow channel 111 and the first column of power devices 3, and between the second top surface 1121 of the second flow channel 112 and the second column of power devices 3.

[0044] In some embodiments, a first thermally conductive medium is filled between the thermally conductive element 4 and the heat dissipation surface 32 of the power device 3 to enhance the thermal conductivity and structural stability. The first thermally conductive medium can be thermally conductive silicone grease, thermal paste, or liquid metal thermal conductive agent, etc., and is applied between the thermally conductive element 4 and the heat dissipation surface 32 by spot filling.

[0045] In some embodiments, a second thermally conductive medium is filled between the thermally conductive element 4 and the top surface 1101 of the three-dimensional flow channel 110. The second thermally conductive medium may be thermally conductive silicone grease, thermally conductive paste, or liquid metal thermally conductive agent, etc., and is disposed between the thermally conductive element 4 and the top surface 1101 of the three-dimensional flow channel 110 by coating.

[0046] In some embodiments, please refer to Figure 4 and Figure 6 The inner wall of the three-dimensional flow channel 110 is provided with a column 117, which extends along the height direction z of the three-dimensional flow channel 110. The column 117 is used to increase the length and curvature of the flow path of the medium within the three-dimensional flow channel 110, thereby improving the heat exchange efficiency between the medium and the channel wall. In some examples, the height of the column 117 is equal to the height of the three-dimensional flow channel 110, and the cross-section of the column 117 is approximately semi-circular, approximately fan-shaped, or approximately arc-shaped. In some examples, the width of the three-dimensional flow channel 110 ranges from 4 mm to 14 mm, with the widest point of the channel being 14 mm, and the width of the channel at the location of the column 117 being 4 mm. It is understood that the width range of the three-dimensional flow channel 110 can be adjusted according to actual heat dissipation requirements and structural characteristics.

[0047] In some embodiments, there are multiple columns 117. Along the flow direction of the medium in the three-dimensional flow channel 110, multiple columns 117 are distributed on the inner wall of at least one side of the three-dimensional flow channel 110, so that the heat dissipation medium flows in a wave-like manner, further slowing down the flow speed of the heat dissipation medium and enhancing the heat exchange efficiency.

[0048] In some embodiments, please refer to Figure 4 The inner sidewall of the three-dimensional flow channel 110 includes a first sidewall 1102 and a second sidewall 1103, which are arranged at intervals relative to each other and both extend along the flow direction of the medium. A plurality of columns 117 are respectively distributed on the first sidewall 1102 and the second sidewall 1103.

[0049] In some embodiments, multiple columns 117 are arranged sequentially and evenly at intervals along the flow direction of the medium within the three-dimensional flow channel 110, which helps to improve the heat transfer uniformity of the heat dissipation medium. In some examples, multiple columns 117 are evenly and alternately distributed on the first sidewall 1102 and the second sidewall 1103, and the specific value of the spacing between two adjacent columns 117 located on the first sidewall 1102 and the second sidewall 1103 can be adjusted according to the actual heat dissipation requirements.

[0050] In other embodiments, please refer to Figure 9 The three-dimensional flow channel 110 has a protrusion 118 on the inner wall of its top surface 1101. The protrusion 118 increases the heat conduction area at the top of the three-dimensional flow channel 110, which helps to enhance the heat dissipation effect. The protrusion 118 extends along the height direction z of the three-dimensional flow channel 110, and the height of the protrusion 118 is less than the height of the three-dimensional flow channel 110. The protrusion 118 can be regular or irregular in shape. In some examples, the protrusion 118 is cylindrical, with a diameter of 3 mm and a height of 3 mm.

[0051] In some embodiments, the number of protrusions 118 is multiple, further increasing the heat dissipation surface area 32. Along the flow direction of the medium in the three-dimensional flow channel 110, multiple protrusions 118 are arranged sequentially at intervals, and multiple protrusions 118 are correspondingly arranged with multiple power devices 3.

[0052] In some embodiments, please refer to Figure 2 , Figure 6 and Figure 7 The power supply device 1000 also includes a first limiting member 5, which is used to limit the connection between the heat-conducting member 4 and the three-dimensional flow channel 110. The heat-conducting member 4 is provided with a limiting hole 41, and the top surface 1101 of the three-dimensional flow channel 110 is provided with a limiting groove 119 facing the heat-conducting member 4. The two ends of the first limiting member 5 are respectively provided in the limiting groove 119 and the limiting hole 41.

[0053] In some embodiments, please refer to Figure 7The first limiting member 5 includes a base 51 and a column 52. The base 51 is received in the limiting groove 119. One end of the column 52 is fixed to the base 51, and the other end of the column 52 away from the base 51 has a limiting hole 41 to enhance the limiting and positioning function of the structure. In some examples, the other end of the column 52 away from the base 51 does not protrude from the surface of the heat-conducting member 4.

[0054] In some embodiments, the first limiting member 5 is made of an insulating material, such as polycarbonate (PC), acrylonitrile-butadiene-styrene copolymer (ABS), or polyamide (PA). By providing the first limiting member 5 made of an insulating material, the risk of malfunction caused by conductive contact between the housing 1 and the power device 3 is reduced, thereby improving the safety of the power supply device 1000.

[0055] In some embodiments, the number of first limiting members 5 is at least two, and the first limiting members 5 are provided between the two heat-conducting members 4 and the three-dimensional flow channel 110.

[0056] In other embodiments, please refer to Figure 9 The power supply device 1000 also includes a second limiting member 6, which is disposed on the second surface 22 of the main circuit board 2. The two ends of the second limiting member 6 abut against the second surface 22 and the heat-conducting member 4 respectively, thereby limiting the heat-conducting member 4 on one side in the height direction z.

[0057] Along the height direction z, the first limiting member 5 and the second limiting member 6 limit the heat-conducting member 4 from opposite sides, further enhancing structural stability.

[0058] In some embodiments, the second limiting member 6 is located between adjacent power devices 3.

[0059] In some embodiments, the second limiting member 6 is made of an insulating elastic material, such as rubber, to reduce the risk of separation between the heat-conducting member 4 and the three-dimensional flow channel 110 by using the vibration energy generated by the power supply device 1000 during operation or transportation, thereby improving the reliability of the heat dissipation structure.

[0060] In some embodiments, the number of second limiting members 6 is at least two, and a second limiting member 6 is provided between the main circuit board 2 and the first flow channel 111 and the second flow channel 112.

[0061] In other embodiments, please continue to refer to Figure 9 The other end of the column 52, away from the base 51, passes through the limiting hole 41 and protrudes from the surface of the heat conductor 4. The portion of the column 52 protruding from the surface of the heat conductor 4 is located between the power devices 3. In some examples, the height of the portion of the column 52 protruding from the surface of the heat conductor 4 is 2 mm.

[0062] In some embodiments, please refer to Figure 2 , Figure 3 and Figure 5 Along the height direction perpendicular to the three-dimensional flow channel 110, a first heat dissipation groove 101 is formed between the receiving groove of the main housing 11, the first flow channel 111, and the second flow channel 112. The power supply device 1000 also includes a first magnetic component 7, which is electrically connected to the main circuit board 2. The first magnetic component 7 is disposed in the first heat dissipation groove 101 and is thermally connected to the groove wall of the first heat dissipation groove 101.

[0063] In some embodiments, a third thermally conductive medium is filled into the first heat dissipation groove 101, and at least three sides of the first magnetic component 7 are thermally connected to the groove wall of the first heat dissipation groove 101 through the third thermally conductive medium, thereby improving heat dissipation efficiency. The third thermally conductive medium may be thermally conductive silicone grease, thermal paste, or liquid metal thermally conductive agent, etc.

[0064] In some embodiments, please refer to Figure 2 and Figure 3 The first heat dissipation groove 101 includes a first heat dissipation sub-groove 1011 and a second heat dissipation sub-groove 1012. The first heat dissipation sub-groove 1011 and the second heat dissipation sub-groove 1012 are separated by a partition. The first heat dissipation sub-groove 1011 and the second heat dissipation sub-groove 1012 are used to respectively set different magnetic devices in the first magnetic assembly 7 to reduce interference between devices.

[0065] In some embodiments, please refer to Figure 2 and Figure 8 The power supply device 1000 also includes a secondary circuit board 81, which is electrically connected to the main circuit board 2. The secondary circuit board 81 is disposed in the slot of the first heat dissipation sub-slot 1011. The secondary circuit board 81 is provided with a DC-DC power circuit. The secondary circuit board 81 is arranged parallel to the second surface 22 of the main circuit board 2, and the secondary circuit board 81 and the main circuit board 2 are connected by screws. The screw connection not only achieves a good electrical connection, but also helps to enhance the structural support.

[0066] In some embodiments, please refer to Figure 2 , Figure 3 and Figure 5The first magnetic component 7 includes a PFC inductor 71, an OBC main transformer 72, a DC-DC main transformer 73, and a DC-DC output freewheeling inductor 74. Along the second direction y, the DC-DC main transformer 73 and the DC-DC output freewheeling inductor 74 are sequentially disposed in the first heat sink sub-slot 1011, and are electrically connected to the secondary circuit board 81. The DC-DC main transformer 73 and the DC-DC output freewheeling inductor 74 are fixed to the surface of the secondary circuit board 81 facing away from the main circuit board 2 by soldering. Along the second direction y, the PFC inductor 71 and the OBC main transformer 72 are sequentially disposed in the second heat sink sub-slot 1012, and are electrically connected to the main circuit board. The PFC inductor 71 is fixed to the main circuit board 2 by soldering. The OBC main transformer 72 is fixed to the main circuit board 2 by screws and soldering, wherein the screws are used to position the OBC main transformer 72 relative to the main circuit board 2. In this embodiment, the power supply device 1000 integrates OBC and DC-DC functions, improving the integration and usability of the power supply device 1000.

[0067] In some embodiments, a second heat dissipation groove 102 is formed between the sidewall of the first flow channel 111 and the sidewall of the housing 1 in the receiving groove of the main housing 11 along the height direction perpendicular to the three-dimensional flow channel 110. The power supply device 1000 also includes a first capacitor assembly 82, which is electrically connected to the main circuit board 2. The first capacitor assembly 82 is disposed in the second heat dissipation groove 102 and is thermally connected to the groove wall of the second heat dissipation groove 102.

[0068] In some embodiments, a fourth thermally conductive medium is filled into the second heat sink 102 so that at least three sides of the first capacitor assembly 82 are thermally connected to the wall of the second heat sink 102 through the fourth thermally conductive medium, thereby improving heat dissipation efficiency. The fourth thermally conductive medium can be thermal grease, thermal paste, or liquid metal thermal conductive agent, etc.

[0069] In some embodiments, please refer to Figure 5 The first capacitor assembly 82 includes a resonant capacitor circuit board 821 and multiple resonant capacitors 822. The multiple resonant capacitors 822 are disposed on the resonant capacitor circuit board 821, which is vertically connected to the second surface 22 of the main circuit board 2. The resonant capacitor circuit board 821 is inserted into the main circuit board 2 and fixed by soldering at the insertion point between the resonant capacitor circuit board 821 and the main circuit board 2. Electrical connection between the circuit boards is achieved by pin soldering, eliminating the need for additional positioning processes and simplifying the manufacturing process.

[0070] In some embodiments, a third heat dissipation groove 103 is formed between the sidewall of the second flow channel 112 and the sidewall of the housing 1. The power supply device 1000 also includes an auxiliary power circuit board 83, which is vertically disposed on the main circuit board. The auxiliary power circuit board 83 is inserted into the main circuit board 2 and fixed by soldering at the insertion point between the auxiliary power circuit board 83 and the main circuit board 2. One end of the auxiliary power circuit board 83 is electrically connected to the main circuit board, and the other end of the auxiliary power circuit board 83 away from the main circuit board 2 extends into the third heat dissipation groove 103, and the auxiliary power circuit board 83 is thermally connected to the groove wall of the third heat dissipation groove 103.

[0071] In some embodiments, a fifth thermally conductive medium is filled into the third heat sink 103 so that at least three sides of the auxiliary power circuit board 83 are thermally connected to the wall of the third heat sink 103 through the fifth thermally conductive medium, thereby improving heat dissipation efficiency. The fifth thermally conductive medium can be thermal grease, thermal paste, or liquid metal thermal conductive agent, etc.

[0072] Understandably, compared to the second heat sink 102 and the third heat sink 103, the first heat sink 101, formed between the first flow channel 111 and the second flow channel 112, has a larger heat conduction area than the three-dimensional flow channel 110. In the power supply device 1000, the first magnetic component 7 is a device that generates a significant amount of heat. By placing the heat-generating first magnetic component 7 in the first heat sink 101 and placing other devices with relatively lower heat generation in the second and third heat sinks 102 and 103, the thermal management of the power supply device 1000 is optimized, which is beneficial for improving the overall heat dissipation efficiency and system stability. Furthermore, the first, second, and third heat sinks 101, 102, and 103 provide relatively independent spaces for different modules of the power supply device 1000, which is beneficial for optimizing the physical space distribution and enhancing the electromagnetic shielding effect between devices.

[0073] In this embodiment, the power device 3 of the power supply device 1000 dissipates heat through the top surface 1101 of the three-dimensional flow channel 110, eliminating the need for additional board construction for the power device 3. Other devices or functional modules dissipate heat through the side walls of the three-dimensional flow channel 110 and the housing 1, reducing the number of boards, lowering the structural complexity of the device, and reducing the manufacturing difficulty.

[0074] In some embodiments, please refer to Figure 3 and Figure 4 The main housing 11 has a receiving groove, and the main housing 11 is provided with a first shielding groove 104. The power supply device 1000 also includes a connector assembly 9, which is disposed in the housing 1. At least a portion of the connector assembly 9 is disposed in the first shielding groove 104 to reduce the impact of electromagnetic interference on the connector assembly 9.

[0075] In some embodiments, please refer to Figure 2 , Figure 3 and Figure 5 The main housing 11 has a first partition 15 in the receiving groove, and a second shielding groove 105 is formed between the first partition 15 and one side wall of the housing. The power supply device also includes an AC input filtering module 85, which is electrically connected to the main circuit board 2. The AC input filtering module 85 is disposed in the second shielding groove 105 to improve the filtering stability of the AC input signal.

[0076] In some embodiments, please refer to Figure 3 and Figure 4 The connector assembly 9 includes an AC input connector 91, which is fixed to the side wall of the main housing 11 and disposed in the second shielding groove 105.

[0077] In some embodiments, please refer to Figure 2 , Figure 3 and Figure 5 The main housing 11 has a second partition 16 in the receiving groove, and a third shielding groove 106 is formed between the second partition 16 and the side wall of the housing opposite to the second shielding groove 105. The power supply device 1000 also includes a high-voltage output filtering module 86, which is disposed in the third shielding groove 106 to improve the filtering stability of the high-voltage output signal.

[0078] In some embodiments, please refer to Figure 3 and Figure 4 The connector assembly 9 includes a high-voltage output connector 92, which is fixed to the side wall of the main housing 11 and disposed in the third shielding groove 106.

[0079] In this embodiment, the first magnetic component 7, the first capacitor component 82, the auxiliary power supply circuit board 83, the AC input filter module 85, and the high voltage output filter module 86 are modularly designed to facilitate assembly and maintenance.

[0080] In some embodiments, please refer to Figure 3 and Figure 4 The connector assembly 9 includes a signal connector 93 and a DC-DC positive output connector 94. The signal connector 93 and the DC-DC positive output connector 94 are fixed to the side wall of the main housing 11 and are disposed in the first shielding groove 104. The signal connector 93 is electrically connected to the main circuit board 2 and the DC-DC positive output connector 94 is electrically connected to the secondary circuit board 81.

[0081] In some embodiments, Figure 2 , Figure 5 and Figure 8The power supply device 1000 also includes a shielding sheet 84, which is disposed between the secondary circuit board 81 and the main circuit board, and between the signal connector 93 and the DC-DC positive output connector 94. The shielding sheet 84, together with the first heat sink sub-slot 1011 and the first shielding slot 104, forms a shielding cavity. This shielding cavity provides comprehensive electromagnetic shielding space for the secondary circuit board 81, the DC-DC main transformer 73, the DC-DC output freewheeling inductor 74, and the DC-DC positive output connector 94, achieving centralized shielding protection for the DC-DC functional modules. Simultaneously, the shielding sheet 84 separates the secondary circuit board 81 from the main circuit board 2, and also separates the signal connector 93 from the DC-DC positive output connector 94, further improving the electromagnetic compatibility of the power supply device 1000.

[0082] In some embodiments, please refer to Figure 2 The first shielding groove 104 and the first heat dissipation sub-groove 1011 are both located between the second shielding groove 105 and the third shielding groove 106. The distance between the shielding plate 84 and the bottom surface of the receiving cavity 10 is less than or equal to the height of the first partition 15, and / or, the distance between the shielding plate 84 and the bottom surface of the receiving cavity 10 is less than or equal to the height of the second partition 16. The shielding cavity formed by the shielding plate 84 and the shielding structure formed by the first partition 15 and the second partition 16 are connected in the height direction z to enhance the shielding effect.

[0083] In some embodiments, please refer to Figure 5 The shielding sheet 84 is provided with an extension 841, which extends from the edge of the shielding sheet 84 toward the bottom surface of the receiving cavity 10. The extension 841 helps to further improve the shielding performance. The extension 841 is provided at least on the side of the shielding sheet 84 near the first partition 15, and / or on the side of the shielding sheet 84 near the second partition 16.

[0084] In some embodiments, the connector assembly 9 is disposed at the first end of the housing 1 along the second direction y by means of screw mounting or other methods. The AC input connector 91 and the high-voltage output connector 92 are respectively disposed near the two sides of the housing 1 along the first direction x. The signal connector 93 and the DC-DC positive output connector 94 are disposed sequentially along the height direction z, with the DC-DC positive output connector 94 disposed near the bottom surface of the receiving cavity 10. Along the first direction x, the third shielding groove 106, the first shielding groove 104, and the second shielding groove 105 are disposed sequentially. Along the second direction y, the first shielding groove 104, the first heat dissipation sub-groove 1011, and the second heat dissipation sub-groove 1012 are disposed sequentially.

[0085] In this embodiment, the power supply device 1000 includes a housing 1, a main circuit board 2, and a power device 3. The housing 1 has a receiving cavity 10, and a three-dimensional flow channel 110 for the flow of heat dissipation medium is provided in the receiving cavity 10. The main circuit board 2 is disposed in the receiving cavity 10, and the power device 3 is disposed on the main circuit board 2. Along the height direction z of the three-dimensional flow channel 110, the main circuit board 2, the power device 3, and the three-dimensional flow channel 110 are arranged sequentially. The heat dissipation surface 32 of the power device 3 and the top surface 1101 of the three-dimensional flow channel 110 are thermally connected, thereby thermally connecting the side surface of the power device 3 away from the main circuit board 2 to the top of the three-dimensional flow channel 110. This allows the power device 3 to dissipate heat through the top surface 1101 of the three-dimensional flow channel 110, eliminating the need for additional board separation for the power device 3 and vertical insertion of the power device 3 into the main circuit board 2. This simplifies the structure and helps reduce production costs and improve assembly efficiency.

[0086] This application also provides an embodiment of an electric vehicle, which includes the power supply device 1000 described above. The structure and function of the power supply device 1000 can be found in the above embodiments, and will not be described in detail here.

[0087] In this embodiment of the application, in the power supply device 1000 of the electric vehicle, the power device 3 is cooled by the top surface 1101 of the three-dimensional flow channel 110, which is beneficial to optimize thermal management, reduce production costs and improve production efficiency.

[0088] It should be noted that while preferred embodiments of this application are provided in the specification and accompanying drawings, this application can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are not intended to impose additional limitations on the content of this application; their purpose is to provide a more thorough and comprehensive understanding of the disclosure of this application. Furthermore, the above-described technical features can be combined with each other to form various embodiments not listed above, all of which are considered to be within the scope of this application's specification. Moreover, those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A power supply device characterized by comprising: include: The housing has a receiving cavity, and a three-dimensional flow channel is provided in the receiving cavity. The three-dimensional flow channel is used for the flow of heat dissipation medium. Along the height direction of the three-dimensional flow channel, a top surface is provided at one end of the three-dimensional flow channel away from the bottom of the receiving cavity. The main circuit board is disposed in the receiving cavity; A power device is disposed on the main circuit board. Along the height direction of the three-dimensional flow channel, the power device is provided with a mounting surface and a heat dissipation surface. The mounting surface is connected to the main circuit board, and the heat dissipation surface is correspondingly disposed to the top surface of the three-dimensional flow channel, and the heat dissipation surface is thermally connected to the top surface.

2. The power supply device according to claim 1, characterized in that, The three-dimensional flow channel includes a first flow channel and a second flow channel that are connected to each other. A first heat dissipation groove is formed between the first flow channel and the second flow channel in the receiving cavity of the housing along the height direction perpendicular to the three-dimensional flow channel. The power supply device further includes a first magnetic component, which is electrically connected to the main circuit board. The first magnetic component is disposed in the first heat sink and is thermally connected to the wall of the first heat sink.

3. The power supply device according to claim 2, characterized in that... , A second heat dissipation groove is formed between the sidewall of the first flow channel and the sidewall of the housing in the receiving cavity of the housing; The power supply device further includes a first capacitor assembly, which is electrically connected to the main circuit board. The first capacitor assembly is disposed in the second heat sink and is thermally connected to the wall of the second heat sink.

4. The power supply device according to claim 2, characterized in that... , A third heat dissipation groove is formed between the sidewall of the second flow channel and the sidewall of the housing in the receiving cavity of the housing; The power supply device also includes an auxiliary power circuit board, which is vertically disposed on the main circuit board. One end of the auxiliary power circuit board is electrically connected to the main circuit board, and the other end of the auxiliary power circuit board, away from the main circuit board, extends into the third heat dissipation groove. The auxiliary power circuit board is thermally connected to the groove wall of the third heat dissipation groove.

5. The power supply device according to claim 2, characterized in that... , The first heat sink includes a first heat sink sub-slot and a second heat sink sub-slot. The power supply device also includes a secondary side circuit board, which is electrically connected to the main circuit board. The secondary side circuit board is disposed at the slot opening of the first heat sink sub-slot. The first magnetic component includes a PFC inductor, an OBC main transformer, a DC-DC main transformer, and a DC-DC output freewheeling inductor. The DC-DC main transformer and the DC-DC output freewheeling inductor are disposed in the first heat sink sub-slot and are electrically connected to the secondary circuit board. The PFC inductor and the OBC main transformer are disposed in the second heat sink sub-slot and are electrically connected to the main circuit board.

6. The power supply device according to claim 5, characterized in that... , The housing has a first shielding groove in its receiving cavity; The power supply device further includes a connector assembly disposed in the housing, with at least a portion of the connector assembly disposed in the first shielding groove.

7. The power supply device according to claim 6, characterized in that... , The housing has a first partition in the receiving cavity, and a second shielding groove is formed between the first partition and one side wall of the housing; The power supply device further includes an AC input filtering module, which is electrically connected to the main circuit board and is disposed in the second shielding slot.

8. The power supply device according to claim 7, characterized in that... , The housing is provided with a second partition in the receiving cavity, and a third shielding groove is formed between the second partition and the side wall of the housing on the other side of the second shielding groove; The power supply device also includes a high-voltage output filter module, which is disposed in the third shielding slot.

9. The power supply device according to claim 8, characterized in that... , The connector assembly includes a signal connector and a DC-DC positive output connector, which are disposed in the first shielding slot. The signal connector is electrically connected to the main circuit board, and the DC-DC positive output connector is electrically connected to the secondary circuit board. The power supply device also includes a shielding plate, which is disposed between the secondary circuit board and the main circuit board, and between the signal connector and the DC-DC positive output connector.

10. The power supply device according to claim 9, characterized in that... , The first shielding slot and the first heat dissipation sub-slot are both located between the second shielding slot and the third shielding slot. The distance between the shielding sheet and the bottom surface of the receiving cavity is less than or equal to the height of the first partition, and / or the distance between the shielding sheet and the bottom surface of the receiving cavity is less than or equal to the height of the second partition.

11. The power supply device according to claim 2, characterized in that... , Along the height direction of the three-dimensional flow channel, the first flow channel has a first top surface at one end away from the bottom of the receiving cavity, and the second flow channel has a second top surface at one end away from the bottom of the receiving cavity. The power devices are multiple in number and arranged in two columns. The two columns of power devices are respectively thermally connected to the first top surface and the second top surface.

12. The power supply device according to claim 1, characterized in that, The inner wall of the three-dimensional flow channel is provided with a column, which extends along the height direction of the three-dimensional flow channel. The number of columns is multiple, and the multiple columns are distributed on the inner wall of at least one side of the three-dimensional flow channel along the flow direction of the medium; and / or, The number of columns is multiple, and the multiple columns are arranged sequentially and evenly at intervals along the flow direction of the medium in the three-dimensional flow channel; and / or, The three-dimensional flow channel has protrusions on the inner wall of the top surface.

13. The power supply device according to any one of claims 1-5, characterized in that... , The power supply device further includes a heat-conducting component, which is disposed between the heat dissipation surface of the power device and the top surface of the three-dimensional flow channel, and the heat-conducting component is in contact with both the heat dissipation surface and the top surface.

14. The power supply device according to claim 13, characterized in that, The heat-conducting component is provided with a limiting hole, and the top surface of the three-dimensional flow channel is provided with a limiting groove facing the power device; The power supply device further includes a first limiting member, the two ends of which are respectively disposed in the limiting groove and the limiting hole; and / or, The power supply device further includes a second limiting member, which is disposed on the side surface of the circuit board on which the power device is disposed, and the two ends of the second limiting member respectively abut against the circuit board and the heat-conducting component.

15. An electric vehicle, characterized in that, Includes the power supply device as described in any one of claims 1-14.

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