A flexible circuit board component mounting device and method

Abstract

This invention belongs to the technical field of circuit board mounting equipment, specifically a flexible circuit board mounting device and method, including a base, a machine head mounted on one side of the base, a drive unit mounted inside the machine head via a guide rail, a flexible mounting mechanism mounted inside the drive unit, and a processing table fixedly mounted on the upper surface of the base, with a groove in the middle of the processing table. Through the above structural combination, and the cooperation of the flexible mounting mechanism and temperature control mechanism, a stable constant temperature environment can be provided for the flexible circuit board, suppressing thermal deformation and temperature shock, while achieving component mounting with controllable micro-pressure. This avoids damage to the board caused by thermal and mechanical stress, such as warping, bulging, surface damage, and pad peeling. It ensures a flat board surface, improves mounting accuracy and consistency, and is adaptable to flexible circuit boards of different specifications, effectively improving mounting yield and equipment versatility.

Description

Technical Field

[0001] This invention belongs to the technical field of circuit board mounting equipment, specifically a flexible circuit board mounting device and method for mounting components. Background Technology

[0002] Flexible circuit board component mounting refers to the process of precisely mounting and fixing electronic components (such as resistors, capacitors, chips, etc.) onto preset pads on a flexible printed circuit board (FPC) using automated equipment (pick-and-place machine). It is one of the core processes in the production of flexible electronic products (such as mobile phone cables and smart wearable devices).

[0003] When the equipment starts up and mounts components, the heat generated during operation is dissipated outwards. At the same time, the production environment is affected by changes in the ambient temperature and temperature differences between different processes, resulting in continuous temperature fluctuations. Because flexible circuit boards have high structural flexibility and low mechanical strength, they are quite sensitive to temperature changes. Under such continuous temperature fluctuations, the thermal expansion and contraction effect is significant, easily causing board warping, twisting, and localized deformation, leading to misalignment of the preset pad positions and affecting the accurate mounting of subsequent components.

[0004] Furthermore, in the specific step of mounting and fixing electronic components onto the pads using a pick-and-place machine, the rigid mounting structure and high-pressure pressing method employed in existing traditional mounting equipment play a crucial role. The direct, rigid contact between the rigid components and the flexible circuit board, coupled with concentrated high-pressure application, inevitably causes mechanical damage such as squeezing, scraping, and peeling to the board surface, edge areas, and surface pads while completing the mounting process, making it difficult to meet the processing requirements of flexible boards.

[0005] Therefore, the present invention provides a flexible circuit board mounting device and method for mounting components. Summary of the Invention

[0006] In order to overcome the shortcomings of the prior art, at least one technical problem raised in the background art is solved.

[0007] The technical solution adopted by the present invention to solve its technical problem is as follows: The flexible circuit board mounting device of the present invention includes a base, a machine head installed on one side of the base, a driving component installed inside the machine head via a guide rail, a flexible mounting mechanism installed inside the driving component, a processing table fixedly installed on the upper surface of the base, a groove formed in the middle of the processing table, an embedding groove formed on the inner side wall of the processing table, a temperature control mechanism installed inside the embedding groove, a mounting plate fixedly installed inside the processing table, a square groove formed on the surface of the mounting plate, a negative pressure mechanism installed inside the square groove, and edge flexible limiting mechanisms fixedly connected around the four sides of the upper surface of the mounting plate.

[0008] The negative pressure mechanism includes a micro vacuum adsorption pump A, the outer surface of which is mounted on the back of the processing table. The output end of the micro vacuum adsorption pump A is fixedly connected to a transmission tube A, and one end of the transmission tube A is fixedly connected to a micro suction cup, which is embedded in the inside of a square groove.

[0009] The flexible mounting mechanism includes a housing. One side of the housing is slidably mounted inside the machine head via a guide rail. A flexible suction nozzle is fixedly connected to the bottom of the housing. A ring frame is fixedly connected to the outer surface of the flexible suction nozzle. A guide rod A is fixedly connected to the upper surface of the ring frame. A spring A is sleeved on the outer surface of the guide rod A. One end of the spring A is fixedly connected to the upper surface of the ring frame, and the other end of the spring A is fixedly connected to the bottom of the housing.

[0010] The bottom surface of the flexible nozzle has a micro-suction hole, and a flexible gasket A is embedded in the outside of the micro-suction hole. A flexible gasket B is fixedly connected to the bottom outer wall of the flexible nozzle.

[0011] A micro vacuum adsorption pump B is fixedly connected to the outer surface of the housing. A transmission tube B is fixedly connected to the output end of the micro vacuum adsorption pump B. One end of the transmission tube B is fixedly connected to the top of the flexible nozzle. A control sensor A is fixedly installed at the bottom of the outer surface of the housing. The control sensor A is electrically connected to the micro vacuum adsorption pump B.

[0012] The temperature control mechanism includes a blower, the outer surface of which is fixedly mounted on the back of the base. A C-transmission pipe is fixedly connected to the output end of the blower. An annular pipe is fixedly connected to one end of the C-transmission pipe. A heating ring is installed inside the annular pipe. An air outlet groove is opened on the inner side of the annular pipe. A guide fin is fixedly connected inside the air outlet groove.

[0013] A B control sensor is installed on the surface of the processing table, and the B control sensor is electrically connected to the heating ring.

[0014] The edge flexible limiting mechanism includes a flexible ball, the bottom of which is fixedly connected to the upper surface of the mounting plate. A hole is formed on the outer surface of the flexible ball, and a B guide rod is inserted into the hole. One end of the B guide rod is fixedly connected to an abutment plate, and a B spring is fixedly connected to the inner side wall of the abutment plate. The inside of the B spring is sleeved on the outside of the B guide rod, and the other end of the B spring is fixedly connected to the outside of the flexible ball.

[0015] Both sides of the upper surface of the processing table are fixedly connected to the support rods, and lamp tubes are installed inside the support rods.

[0016] A partition is fixedly connected to the inner wall of the square groove, and the surface of the partition has fine holes.

[0017] The second objective of this invention is to provide a method for using a flexible circuit board mounting device, which employs the aforementioned flexible circuit board mounting device and includes the following steps:

[0018] S1. Place the flexible circuit board on the mounting plate; start the A micro vacuum adsorption pump, and use the A transfer tube and micro suction cup to adsorb and fix the flexible circuit board. At the same time, start the blower, and use the C transfer tube, ring tube and heating ring to deliver airflow to the processing table, and use the B control sensor to adjust the airflow temperature.

[0019] S2. The flexible mounting mechanism moves along the guide rail to above the component and starts the B micro vacuum adsorption pump to pick up the component through the micro suction hole of the B transfer tube and the flexible nozzle.

[0020] S3. The flexible mounting mechanism descends and, through the cooperation of guide rod A and spring A, mounts the components onto the flexible circuit board. The component pick-up and mounting actions are repeated until all components are mounted.

[0021] The beneficial effects of this invention are as follows:

[0022] 1. In this flexible circuit board component mounting device, the flexible mounting mechanism and temperature control mechanism work together to provide a stable constant temperature environment for the flexible circuit board, suppress thermal deformation and temperature difference shock, and achieve component mounting with controllable micro pressure. This avoids damage such as warping, bulging, surface damage, and pad peeling caused by thermal stress and mechanical stress to the board, ensuring the board surface is flat and improving mounting accuracy and consistency.

[0023] 2. In this flexible circuit board mounting device, the edge flexible limiting mechanism provides elastic support from the edge of the flexible circuit board in a flexible contact manner, preventing the edge of the board from warping and deforming. It works synergistically with the microporous vacuum adsorption to improve the flatness of the board surface and eliminate mounting errors. At the same time, the flexible structure will not cause rigid compression or damage to the edge of the board. It is compatible with flexible circuit boards of different specifications, improving the versatility of the equipment and the mounting stability. Attached Figure Description

[0024] The invention will now be further described with reference to the accompanying drawings.

[0025] Figure 1 This is a schematic diagram of the overall structure of a flexible circuit board mounting device and method for mounting components;

[0026] Figure 2 This is a schematic cross-sectional view of the overall structure of a flexible circuit board mounting device and method for mounting components.

[0027] Figure 3This is a schematic diagram of the structure of a ring tube in a flexible circuit board mounting device and method;

[0028] Figure 4 This is a schematic diagram of the installation of a partition in a flexible circuit board mounting device and method.

[0029] Figure 5 for Figure 3 Enlarged diagram of point A in the diagram;

[0030] Figure 6 This is a schematic diagram of the housing installation in a flexible circuit board mounting device and method.

[0031] Figure 7 This is a schematic diagram of the installation of a blower in a flexible circuit board mounting device and method.

[0032] Figure 8 This is a schematic diagram of the mounting of the abutment plate in a flexible circuit board mounting component device and method.

[0033] Figure 9 This is a cross-sectional schematic diagram of the mounting board in a flexible circuit board mounting component device and method;

[0034] Figure 10 A top view schematic diagram of a flexible ball in a flexible circuit board mounting device and method;

[0035] Figure 11 A cross-sectional schematic diagram of the machine head in a flexible circuit board mounting device and method;

[0036] Figure 12 for Figure 6 Enlarged diagram of point B in the middle.

[0037] In the picture:

[0038] 1. Base; 2. Head; 3. Guide rail; 4. Drive unit; 5. Processing table; 6. Insertion slot; 7. Mounting plate; 8. A. Miniature vacuum adsorption pump; 9. A. Transfer pipe;

[0039] 10. Miniature suction cup; 11. Housing; 12. Flexible suction nozzle; 13. Ring frame; 14. A guide rod; 15. A spring; 16. Miniature suction hole; 17. A flexible washer; 18. B flexible washer; 19. B miniature vacuum adsorption pump;

[0040] 20. B Transmission pipe; 21. A Control sensor; 22. Blower; 23. C Transmission pipe; 24. Annular pipe; 25. Heating ring; 26. Guide fins; 27. B Control sensor; 28. Flexible ball; 29. ​​B Guide rod;

[0041] 30. Abutment plate; 31. Spring B; 32. Frame rod; 33. Partition plate; 34. Square groove. Detailed Implementation

[0042] The technical solutions of this invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0043] Therefore, in view of the above-mentioned problems, the present invention provides a flexible circuit board mounting device for components, with reference to... Figure 1-12 As shown, Example 1 is illustrated:

[0044] The machine includes a base 1, a machine head 2 mounted on one side of the base 1, a drive component 4 mounted inside the machine head 2 via a guide rail 3, a flexible mounting mechanism mounted inside the drive component 4, a processing table 5 fixedly mounted on the upper surface of the base 1, a groove in the middle of the processing table 5, an embedding groove 6 on the inner side wall of the processing table 5, a temperature control mechanism mounted inside the embedding groove 6, a mounting plate 7 fixedly mounted inside the processing table 5, a square groove 34 on the surface of the mounting plate 7, a negative pressure mechanism mounted inside the square groove 34, and edge flexible limiting mechanisms fixedly connected around the upper surface of the mounting plate 7.

[0045] The negative pressure mechanism includes a micro vacuum adsorption pump 8. The outer surface of the micro vacuum adsorption pump 8 is mounted on the back of the processing table 5. The output end of the micro vacuum adsorption pump 8 is fixedly connected to a transmission tube 9. One end of the transmission tube 9 is fixedly connected to a micro suction cup 10. The micro suction cup 10 is embedded in the inside of the square groove 34. The outer surface of the micro vacuum adsorption pump 8 is fixedly mounted on the back of the processing table 5, which can utilize the space on the back of the processing table 5 and avoid structural interference with the upper mounting area.

[0046] Secondly, the output end of the micro vacuum adsorption pump 8 is fixedly connected to the transmission tube 9. One end of the transmission tube 9 passes through the processing table 5 and is fixedly connected to the micro suction cup 10. The micro suction cup 10 is embedded in the square groove 34 opened on the surface of the mounting plate 7, and the upper surface of the micro suction cup 10 is flush with the upper surface of the mounting plate 7. The surface of the micro suction cup 10 is uniformly provided with fine vacuum adsorption holes. The negative pressure generated by the micro vacuum adsorption pump 8 is transmitted to the micro suction cup 10 through the transmission tube 9, so as to achieve uniform adsorption and fixation of the flexible circuit board placed on the mounting plate 7, so that the flexible circuit board remains flat during the mounting process.

[0047] Example 2:

[0048] First, the flexible mounting mechanism includes a housing 11. One side of the housing 11 is slidably mounted inside the head 2 via a guide rail 3. A flexible nozzle 12 is fixedly connected to the bottom of the housing 11. A ring frame 13 is fixedly connected to the outer surface of the flexible nozzle 12. An A guide rod 14 is fixedly connected to the upper surface of the ring frame 13. An A spring 15 is sleeved on the outer surface of the A guide rod 14. One end of the A spring 15 is fixedly connected to the upper surface of the ring frame 13, and the other end of the A spring 15 is fixedly connected to the bottom of the housing 11. One side of the housing 11 is slidably mounted inside the head 2 via the guide rail 3. During operation, the housing 11 can achieve stable linear sliding along the guide rail 3 inside the head 2, thereby driving the entire flexible mounting mechanism to perform horizontal position adjustment and precise positioning.

[0049] In addition, a flexible nozzle 12 is fixedly connected to the bottom of the housing 11, a ring frame 13 is fixedly connected to the outer surface of the flexible nozzle 12, an A guide rod 14 is fixedly connected to the upper surface of the ring frame 13, an A spring 15 is sleeved on the outer surface of the A guide rod 14, one end of the A spring 15 is fixedly connected to the upper surface of the ring frame 13, and the other end of the A spring 15 is fixedly connected to the bottom of the housing 11. When the flexible nozzle 12 contacts the components or flexible circuit board, the A spring 15 can achieve buffering through its own elastic deformation. At the same time, the A guide rod 14 guides and limits the movement of the ring frame 13 to prevent the flexible nozzle 12 from deviating or tilting, so that the mounting pressure can be effectively controlled, preventing damage to components or the surface of the flexible circuit board caused by rigid impact, and realizing controllable micro-pressure mounting.

[0050] Because the bottom surface of the flexible suction nozzle 12 has a micro suction hole 16, and the outside of the micro suction hole 16 is embedded with a flexible gasket A 17, and the bottom outer wall of the flexible suction nozzle 12 is fixedly connected with a flexible gasket B 18, and the center of the bottom surface of the flexible suction nozzle 12 has a micro suction hole 16 that communicates with the internal air passage, the micro suction hole 16 can achieve stable suction and release of components through vacuum negative pressure; moreover, the outer periphery of the micro suction hole 16 is embedded with an annular flexible gasket A 17, which can form a flexible buffer and seal when in contact with the surface of the component, which can not only avoid scratches or damage to the surface of the component caused by rigid contact, but also improve the airtightness of the adsorption and prevent the component from falling or shifting due to air leakage.

[0051] Next, a flexible B washer 18 is fixedly connected to the bottom outer wall of the flexible nozzle 12. The outer diameter of the flexible B washer 18 is larger than that of the flexible A washer 17. When the nozzle contacts the flexible circuit board, it forms a secondary flexible protection for the board surface, preventing the nozzle edge from directly scratching or squeezing the circuit board surface, effectively preventing pad peeling and circuit damage. At the same time, it can further disperse the mounting pressure, reduce local stress concentration, and improve the stability and safety of the mounting process.

[0052] A miniature vacuum adsorption pump 19 is fixedly connected to the outer surface of the outer shell 11. The output end of the miniature vacuum adsorption pump 19 is fixedly connected to a transmission tube 20. One end of the transmission tube 20 is fixedly connected to the top of the flexible nozzle 12. A control sensor 21 is fixedly installed at the bottom of the outer surface of the outer shell 11. The control sensor 21 is electrically connected to the miniature vacuum adsorption pump 19. The miniature vacuum adsorption pump 19 is fixedly installed on the outer wall surface of the outer shell 11. On the other hand, the output end of the miniature vacuum adsorption pump 19 is fixedly connected to the transmission tube 20. The transmission tube 20 is neatly arranged along the outer side of the outer shell 11, and one end is firmly connected to the inside of the top of the flexible nozzle 12, forming a closed negative pressure delivery channel, which can stably transmit negative pressure.

[0053] A control sensor 21 is fixedly installed on the lower part of the outer surface of the outer shell 11. The control sensor 21 is electrically connected to the miniature vacuum adsorption pump 19 to collect negative pressure data in real time during the mounting process and monitor the adsorption status of the components. This allows for intelligent control of the start / stop and negative pressure of the miniature vacuum adsorption pump 19, enabling precise control of the component's suction, fixation, and release actions. This prevents components from falling off or shifting due to excessive or insufficient adsorption negative pressure. The mechanical downward pressure during the mounting process is provided by a passive and controllable micro-pressure from the elastic buffer structure composed of the guide rod 14 and the spring 15, ensuring that the mounting force is always within a safe range.

[0054] Furthermore, the temperature control mechanism includes a blower 22, the outer surface of which is fixedly mounted on the back of the base 1. The output end of the blower 22 is fixedly connected to a C-transmission pipe 23, one end of which is fixedly connected to an annular pipe 24. A heating ring 25 is installed inside the annular pipe 24, and an air outlet groove is opened on the inner side of the annular pipe 24. A guide fin 26 is fixedly connected inside the air outlet groove. The blower 22 is fixedly mounted on the outer back of the base 1, adopting a concealed installation structure, saving overall equipment space, avoiding structural interference with the front-end mounting area, and ensuring structural stability during equipment operation.

[0055] The output end of the blower 22 is tightly and fixedly connected to the C transmission pipe 23. The C transmission pipe 23 has a regular pipe layout, which can stably deliver airflow. The pipe joints are tightly sealed to prevent airflow leakage. One end of the C transmission pipe 23 is firmly connected to and fixed to the annular pipe 24. The annular pipe 24 is arranged around the periphery of the processing table 5, which can form an all-round airflow circulation structure. The annular pipe 24 has a heating ring 25 installed inside in a sealed manner to uniformly heat the airflow inside and realize the controllable adjustment of temperature.

[0056] The inner wall of the annular tube 24 is evenly and densely provided with air outlet slots to facilitate the uniform outward diffusion of heated airflow. At the same time, guide fins 26 are fixedly installed inside each air outlet slot. With the guidance structure of the guide fins 26, the output airflow can be orderly guided and evenly distributed, so that the warm airflow blows smoothly and evenly on the surface of the processing table 5 and around the flexible circuit board. This effectively mitigates the impact of ambient temperature fluctuations, suppresses thermal deformation and warping caused by uneven heating of the flexible circuit board, and continuously maintains the temperature stability of the working area, providing a suitable constant temperature environment for the precise placement of components.

[0057] A B control sensor 27 is installed on the surface of the processing table 5. The B control sensor 27 is electrically connected to the heating ring 25. A high-precision B control sensor 27 is fixedly installed on the upper surface of the processing table 5. This sensor can collect the ambient temperature changes of the processing area in real time, continuously monitor the temperature data of the flexible circuit board operating environment, and capture the temperature deviation caused by external environmental fluctuations and equipment operation.

[0058] B control sensor 27 forms a stable electrical connection with the heating ring 25 inside the annular tube 24. Based on the real-time temperature signal, it can dynamically adjust the working power and start / stop status of the heating ring 25 to achieve automated closed-loop temperature control. Through real-time feedback and intelligent adjustment, it can stably maintain a constant temperature in the processing area, avoid local overheating or excessive temperature fluctuations, suppress thermal expansion and contraction and deformation warping of the flexible circuit board caused by temperature difference changes, ensure the stability of the workpiece processing environment, and provide reliable temperature protection for the stable fixation of the flexible circuit board and the accurate placement of components.

[0059] The edge flexible limiting mechanism includes a flexible ball 28. The bottom of the flexible ball 28 is fixedly connected to the upper surface of the mounting plate 7. The outer surface of the flexible ball 28 has a hole, and a B guide rod 29 is inserted into the hole. One end of the B guide rod 29 is fixedly connected to an abutment plate 30. A B spring 31 is fixedly connected to the inner side wall of the abutment plate 30. The inside of the B spring 31 is sleeved on the outside of the B guide rod 29, and the other end of the B spring 31 is fixedly connected to the outside of the flexible ball 28. The flexible ball 28 is made of a flexible elastic material and is fixedly fixed to the upper surface of the mounting plate 7 around the perimeter, which can closely adhere to the edge of the flexible circuit board to form a flexible limiting constraint.

[0060] In addition, the outer wall of the flexible ball 28 is uniformly provided with positioning holes, and a matching B guide rod 29 is tightly inserted into the hole. The B guide rod 29 can slide smoothly back and forth along the inside of the hole to ensure the stability and guidance of the structure movement. The outer end of the B guide rod 29 is fixedly connected to an arc-shaped abutment plate 30. The contact surface of the abutment plate 30 is smooth and flat, which can conform to the edge contour of the flexible circuit board for flexible pressure.

[0061] A B spring 31 is fixedly connected to the inner wall of the abutment plate 30. The B spring 31 is tightly sleeved on the outside of the B guide rod 29, and the other end of the B spring 31 is firmly fixed to the outer surface of the flexible ball 28, forming an elastic buffer structure. Relying on the elastic extension and contraction characteristics of the B spring 31, the abutment plate 30 can adaptively extend and contract according to the flexible circuit board of different specifications. The elastic tension can moderately and flexibly limit the edge of the board, which can effectively constrain the edge of the board and prevent problems such as warping, folding and misalignment. It can also avoid defects such as board breakage and edge cracking caused by rigid extrusion. At the same time, it can be adapted to flexible circuit boards of different widths, improving the adaptability and versatility of the equipment. Together with the vacuum adsorption structure, it can ensure the overall flatness of the board.

[0062] It should be noted that the elastic coefficient of spring B 31 is optimally set so that the contact force applied by the abutment plate 30 to the edge of the flexible circuit board is less than the thermal stress generated by the thermal expansion of the board. When the flexible circuit board is heated and undergoes slight thermal expansion under the action of the temperature control mechanism, the edge of the board can overcome the elastic force of spring B 31 and push the abutment plate 30 slightly outward, achieving free extension in the horizontal direction, avoiding internal stress or local bulging due to limited thermal expansion. When the temperature drops and the board shrinks, spring B 31 drives the abutment plate 30 to follow and reset inward, always maintaining flexible contact with the edge of the board, and continuously providing vertical constraint to prevent edge warping and curling.

[0063] Therefore, the edge flexible limiting mechanism allows the board to expand and contract freely with temperature changes in the horizontal direction, while only applying moderate limiting in the vertical direction. Together with vacuum adsorption and temperature-controlled heating, it achieves dynamic flatness of the entire board surface.

[0064] Both sides of the upper surface of the processing table 5 are fixedly connected to support rods 32, and lamp tubes are installed inside the support rods 32. The support rods 32 are symmetrically fixedly installed on both sides of the upper surface of the processing table 5. The overall structure of the support rods 32 is stable and the arrangement is neat, which can form a stable support structure. The internal structure of the support rods 32 adopts a closed installation structure and has built-in lighting tubes. The lamp tubes are made of energy-saving and high-brightness material, which can provide all-round lighting for the entire working area above the processing table 5, improve the lighting conditions of the working environment, eliminate problems such as insufficient light and blurred vision, and facilitate workers to observe the placement status of flexible circuit boards, the flatness of the boards, and the details of the component placement process in real time. At the same time, the symmetrical lighting structure on both sides can avoid shadows caused by light blockage, ensure clear and uniform vision, facilitate the timely detection of abnormal problems such as edge warping of boards and component misalignment, facilitate equipment debugging and quality inspection during the production process, and improve the convenience of operation and the monitoring of the processing process.

[0065] A partition plate 33 is fixedly connected to the inner wall of the square groove 34. The surface of the partition plate 33 has fine holes. Multiple layers of partition plates 33 are uniformly fixedly connected to the inner wall of the square groove 34. The partition plates 33 are arranged in a regular structure inside the square groove 34, which can reasonably divide and categorize the space inside the groove, making the internal airflow path more standardized. The surface of the partition plate 33 has dense and fine ventilation holes with small hole diameter and uniform distribution, which can allow the negative pressure airflow to penetrate evenly and flow smoothly, effectively dispersing the airflow pressure generated by vacuum adsorption, avoiding excessive local airflow concentration and causing local pressure deformation of the flexible circuit board. At the same time, the combination of the partition plate 33 and the fine holes can optimize the overall negative pressure distribution effect, so that the adsorption force is evenly diffused to the entire board surface, further improving the flatness of the flexible circuit board, reducing the occurrence of deformation problems such as wrinkles and dents, and ensuring the stability and uniformity of the vacuum adsorption process.

[0066] The present invention also discloses a method for using a flexible circuit board mounting component device, comprising the following steps:

[0067] S1. Place the flexible circuit board on the mounting plate 7; start the micro vacuum adsorption pump 8 (A), and use the A transmission pipe 9 and micro suction cup 10 to adsorb and fix the flexible circuit board. At the same time, start the blower 22, and use the C transmission pipe 23, the ring pipe 24 and the heating ring 25 to deliver airflow to the processing table 5. The airflow temperature is adjusted by the B control sensor 27.

[0068] S2. The flexible mounting mechanism moves along the guide rail 3 to above the component and starts the B micro vacuum adsorption pump 19 to pick up the component through the B transmission tube 20 and the micro suction hole 16 of the flexible nozzle 12.

[0069] S3. The flexible mounting mechanism descends and, through the cooperation of guide rod A 14 and spring A 15, mounts the components onto the flexible circuit board. The component pick-up and mounting actions are repeated until all components are mounted.

[0070] Working principle: The flexible circuit board to be mounted is placed on the mounting plate 7 of the processing table 5, so that it is above the square groove 34 of the mounting plate 7. The edge flexible limiting mechanism around the mounting plate 7 is activated. Under the elastic force of the B spring 31, the flexible ball 28 and the abutment plate 30 move along the B guide rod 29 towards the edge of the board, and initially limit the flexible circuit board from all sides.

[0071] Start the A micro vacuum adsorption pump 8, and provide negative pressure to the micro suction cup 10 of the mounting board 7 through the A transmission pipe 9. The micro suction cup 10 adsorbs the flexible circuit board evenly over the entire area through the fine holes in the square groove 34, so that the board is tightly attached to the surface of the mounting board 7. Start the blower 22, and the airflow enters the annular pipe 24 through the C transmission pipe 23. The B control sensor 27 on the processing table 5 collects the temperature signal in real time and sends control commands to the heating ring 25. The heating ring 25 heats the airflow in the annular pipe 24, and the hot air is blown evenly onto the surface of the processing table 5 through the air outlet groove and guide fins 26 on the inner side of the annular pipe 24.

[0072] Next, the temperature control mechanism continues to work, maintaining the set temperature of the processing table 5 to provide a constant temperature environment for the placement process. The machine head 2 on the base 1 moves along the guide rail 3, and the drive component 4 drives the flexible placement mechanism to move above the component feeding position. The B micro vacuum suction pump 19 is started, and negative pressure is provided to the micro suction hole 16 of the flexible suction nozzle 12 through the B transmission pipe 20. The A flexible gasket 17 and the B flexible gasket 18 at the bottom of the flexible suction nozzle 12 contact the surface of the component to complete the component pick-up.

[0073] Then, the flexible mounting mechanism moves along the guide rail 3 to above the target pad on the mounting board 7. The flexible mounting mechanism descends, and the A guide rod 14 at the bottom of the housing 11 and the A spring 15 cooperate to form a buffer, so that the flexible nozzle 12 can mount the components onto the flexible circuit board pad with controllable pressure. During the mounting process, the A control sensor 21 provides real-time feedback of pressure signals and is electrically connected to the B micro vacuum adsorption pump 19 to control the adsorption and vacuum breaking actions. After the mounting is completed, the B micro vacuum adsorption pump 19 breaks the vacuum, and the flexible mounting mechanism is lifted and reset.

[0074] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A flexible circuit board mounting device, comprising a base (1), a head (2) mounted on one side of the base (1), a drive unit (4) mounted inside the head (2) via a guide rail (3), a flexible mounting mechanism mounted inside the drive unit (4), and a processing table (5) fixedly mounted on the upper surface of the base (1), characterized in that: The processing table (5) has a groove in the middle and an embedding groove (6) on the inner side wall. A temperature control mechanism is installed inside the embedding groove (6). A mounting plate (7) is fixedly installed inside the processing table (5). A square groove (34) is opened on the surface of the mounting plate (7). A negative pressure mechanism is installed inside the square groove (34). An edge flexible limiting mechanism is fixedly connected around the upper surface of the mounting plate (7). The negative pressure mechanism includes a micro vacuum adsorption pump (8), the outer surface of which is mounted on the back of the processing table (5). The output end of the micro vacuum adsorption pump (8) is fixedly connected to a transmission tube (9), and one end of the transmission tube (9) is fixedly connected to a micro suction cup (10). The micro suction cup (10) is embedded in the inside of a square groove (34).

2. The flexible circuit board component mounting device of claim 1, wherein: The flexible mounting mechanism includes a housing (11), one side of which is slidably mounted inside the head (2) via a guide rail (3). A flexible suction nozzle (12) is fixedly connected to the bottom of the housing (11). A ring frame (13) is fixedly connected to the outer surface of the flexible suction nozzle (12). An A guide rod (14) is fixedly connected to the upper surface of the ring frame (13). An A spring (15) is sleeved on the outer surface of the A guide rod (14). One end of the A spring (15) is fixedly connected to the upper surface of the ring frame (13), and the other end of the A spring (15) is fixedly connected to the bottom of the housing (11).

3. The flex circuit board component mounting device of claim 2, wherein: The bottom surface of the flexible suction nozzle (12) is provided with a micro suction hole (16), and a flexible gasket A (17) is embedded in the outside of the micro suction hole (16). A flexible gasket B (18) is fixedly connected to the bottom outer wall of the flexible suction nozzle (12).

4. The flex circuit board component mounting device of claim 2, wherein: A micro vacuum adsorption pump (19) B is fixedly connected to the outer surface of the outer shell (11). A transmission tube (20) B is fixedly connected to the output end of the micro vacuum adsorption pump (19). One end of the transmission tube (20) B is fixedly connected to the top of the flexible nozzle (12). A control sensor (21) A is fixedly installed at the bottom of the outer surface of the outer shell (11). The control sensor (21) A is electrically connected to the micro vacuum adsorption pump (19).

5. The flexible circuit board component mounting device of claim 1, wherein: The temperature control mechanism includes a blower (22), the outer surface of which is fixedly installed on the back of the base (1). The output end of the blower (22) is fixedly connected to a C transmission pipe (23), one end of which is fixedly connected to an annular pipe (24). A heating ring (25) is installed inside the annular pipe (24), and an air outlet groove is opened on the inner side of the annular pipe (24). A guide fin (26) is fixedly connected inside the air outlet groove.

6. The flex circuit board component mounting device of claim 5, wherein: A B control sensor (27) is installed on the surface of the processing table (5), and the B control sensor (27) is electrically connected to the heating ring (25).

7. The flexible circuit board component mounting device of claim 1, wherein: The edge flexible limiting mechanism includes a flexible ball (28), the bottom of which is fixedly connected to the upper surface of the mounting plate (7). The outer surface of the flexible ball (28) has a hole, and a B guide rod (29) is inserted into the hole. One end of the B guide rod (29) is fixedly connected to an abutment plate (30). A B spring (31) is fixedly connected to the inner side wall of the abutment plate (30). The inside of the B spring (31) is sleeved on the outside of the B guide rod (29), and the other end of the B spring (31) is fixedly connected to the outside of the flexible ball (28).

8. The flexible circuit board component mounting device of claim 1, wherein: Both sides of the upper surface of the processing table (5) are fixedly connected to the support rods (32), and the lamp tubes are installed inside the support rods (32).

9. The flexible circuit board mounting device according to claim 1, characterized in that: The inner wall of the square groove (34) is fixedly connected to a partition (33), and the surface of the partition (33) is provided with fine holes.

10. A method of using a flexible circuit board mounting device, wherein the method employs the flexible circuit board mounting device as described in claim 9, characterized in that: Includes the following steps: S1. Place the flexible circuit board on the mounting plate (7); start the micro vacuum adsorption pump (8) and use the A transmission pipe (9) and micro suction cup (10) to adsorb and fix the flexible circuit board. At the same time, start the blower (22) and use the C transmission pipe (23), ring pipe (24) and heating ring (25) to deliver airflow to the processing table (5). The airflow temperature is adjusted by the B control sensor (27). S2. The flexible mounting mechanism moves along the guide rail (3) to the top of the component and starts the B micro vacuum adsorption pump (19). The component is picked up through the micro suction hole (16) of the B transmission tube (20) and the flexible suction nozzle (12). S3. The flexible mounting mechanism descends and, through the cooperation of guide rod A (14) and spring A (15), mounts the components onto the flexible circuit board. The component pick-up and mounting actions are repeated until all components are mounted.

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