Multi-station cooperative LED wafer high-speed die bonding device

Abstract

This invention relates to the field of semiconductor die bonding technology and provides a multi-station collaborative high-speed LED wafer die bonding device, including a top plate with an arc-shaped ramp and a herringbone ramp at its bottom; it also includes: a wafer transfer module, comprising a first drive shaft with a first cross-shaped rotating frame mounted at its bottom, each arm of the first cross-shaped rotating frame having a wafer picking and placing unit at its end; a dispensing module, comprising a second drive shaft with a second cross-shaped rotating frame mounted at its bottom, each arm of the second cross-shaped rotating frame having a second mounting post at its end, a fourth spring between the second mounting post and the second cross-shaped rotating frame, and a dispensing head at the bottom of each second mounting post; and a drive module. This device effectively improves work efficiency and is adjustable, capable of adapting to LED wafers of different thicknesses, and exhibits good performance.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor die bonding technology, and particularly relates to a high-speed die bonding device for LED wafers with multi-station collaboration. Background Technology

[0002] In the manufacturing process of light-emitting diodes (LEDs), die bonding is one of the key front-end packaging processes. Its core task is to precisely pick up the micron-sized LED chip from the expanded blue film or wafer disk and mount it at high speed and high precision to the designated pad positions on the bracket (such as lead frame) or substrate (such as ceramic substrate, PCB), while simultaneously completing the initial curing connection of conductive adhesive (silver paste, insulating adhesive) or eutectic solder.

[0003] In existing technologies, die bonding typically involves using the reciprocating swing of a die bonding mechanism's arm to transport the LED chip to the bonding position on a pre-applied FPC substrate, and then attaching the LED chip to the adhesive to complete the die bonding operation. Because the dispensing and chip fixing operations are performed in separate steps, the waiting time between each process reduces production efficiency. Therefore, designing a device capable of continuously and uninterruptedly performing LED chip die bonding is essential. Summary of the Invention

[0004] The purpose of this invention is to provide a high-speed die bonding device for LED chips with multi-station collaboration, which aims to solve the problems mentioned in the background art.

[0005] This invention is implemented as follows: a multi-station collaborative high-speed LED wafer bonding device includes a top plate, two symmetrically arranged arc-shaped ramps at the bottom of the top plate, and a herringbone-shaped ramp located at the midpoint between the two arc-shaped ramps at the bottom of the top plate; it also includes:

[0006] A wafer transfer module includes a first drive shaft installed at the bottom of a top plate, a first cross rotating frame installed at the bottom of the first drive shaft, and a wafer picking and placing unit for picking up LED wafers at the end of each arm of the first cross rotating frame. Each wafer picking and placing unit is slidably installed on the first cross rotating frame in the vertical direction.

[0007] The dispensing module includes a second drive shaft installed at the bottom of the top plate, a second cross rotating frame installed at the bottom of the second drive shaft, a second mounting post provided at the end of each arm of the second cross rotating frame, a dispensing head for dispensing provided at the bottom of each second mounting post, and each dispensing head being slidably mounted on the second cross rotating frame in the vertical direction. A fourth spring is provided between the second mounting post and the second cross rotating frame. When no external force is applied, the elastic force of the fourth spring will cause the second mounting post to be located at the upper limit position.

[0008] A drive module is installed on the top of the top plate and is connected to both the first drive shaft and the second drive shaft, for driving the first drive shaft and the second drive shaft to rotate in opposite directions simultaneously.

[0009] In a further technical solution, the drive module includes a drive motor mounted on the top plate, the output end of the drive motor is connected to a drive shaft, two drive bevel gears are symmetrically arranged on the drive shaft, and a transmission bevel gear is mounted on both the first transmission shaft and the second transmission shaft, and the two transmission bevel gears mesh with the two drive bevel gears respectively.

[0010] In a further technical solution, the wafer pick-and-place unit includes a first mounting post that is slidably mounted on a first cross-shaped rotating frame in a vertical direction, and a second spring is provided between the first mounting post and the first cross-shaped rotating frame. The elastic force of the second spring allows the first mounting post to be in the upper limit position when it is not subjected to external force. A ball head is provided at the top of the first mounting post, and a vacuum suction head is provided at the bottom of the first mounting post.

[0011] In a further technical solution, a pressure ring is provided at the bottom of the first mounting post. The pressure ring is sleeved on the outside of the vacuum suction head. The pressure ring is slidably mounted on the first mounting post in the vertical direction, and a third spring is provided between the top of the pressure ring and the first mounting post.

[0012] In a further technical solution, a pressure rod is provided at the end of the herringbone ramp located directly above the die-bonding position. The pressure rod passes through the top plate and extends above the top plate. A pressure plate is provided at the top of the pressure rod, and a first spring is provided between the pressure plate and the upper surface of the top plate. An adjustment unit for pushing the pressure plate to move periodically downward is also installed on the drive shaft.

[0013] In a further technical solution, the adjustment unit includes a mounting plate installed on the drive shaft, an elastic band sleeved on the mounting plate, and a top post provided on the mounting plate, wherein the top post abuts against the inner sidewall of the elastic band and lifts the elastic band up.

[0014] In a further technical solution, the mounting plate is provided with a mounting groove, in which an electric telescopic rod is provided, and the telescopic end of the electric telescopic rod is connected to the top column, which is used to drive the top column to move linearly along the radial direction of the mounting plate.

[0015] This invention provides a multi-station collaborative high-speed LED chip bonding device. In use, simply activating the drive module causes the first and second drive shafts to rotate simultaneously in opposite directions. The first drive shaft drives the first cross-shaped rotating frame to rotate synchronously, and the second drive shaft drives the second cross-shaped rotating frame to rotate synchronously. During operation, each second mounting post first passes the adhesive removal position. The arc-shaped ramp above it pushes the entire second mounting post downwards, allowing the dispensing head to pick up adhesive dots. As the second drive shaft continues to rotate, the dispensing head disengages from the arc-shaped ramp and returns to its upper limit position under the elastic force of the fourth spring until it reaches the bonding position. During this process, the top of the second mounting post contacts the herringbone ramp and moves downwards under its limiting effect, thereby applying the bonding adhesive to the substrate through the dispensing head, achieving cyclic dispensing. Similarly, the first cross-shaped rotating frame drives each chip pick-and-place unit to rotate synchronously, thereby continuously transporting LED chips to the die-bonding position and pressing the LED chips onto the die-bonding adhesive. This device achieves cyclic processing through the cooperation of the chip transfer module and the dispensing module. The entire process greatly shortens the waiting time at idle positions, effectively improves work efficiency, and is adjustable to adapt to LED chips of different thicknesses and specifications, resulting in good performance. Attached Figure Description

[0016] Figure 1 A schematic diagram of a multi-station collaborative high-speed die bonding device for LED wafers provided in an embodiment of the present invention;

[0017] Figure 2 A schematic diagram of the structure of a multi-station collaborative high-speed die bonding device for LED chips, shown from a bottom-view perspective, provided in an embodiment of the present invention;

[0018] Figure 3 A schematic diagram of the top plate in a multi-station collaborative high-speed die bonding device for LED wafers provided in an embodiment of the present invention;

[0019] Figure 4 This is a schematic diagram of the wafer pick-and-place unit in a multi-station collaborative high-speed LED wafer bonding device provided in an embodiment of the present invention.

[0020] Figure 5 for Figure 1 Enlarged view of point A in the image;

[0021] Figure 6A schematic diagram of the structure of the adjustment unit in a multi-station collaborative high-speed die bonding device for LED wafers provided in an embodiment of the present invention;

[0022] Figure 7 for Figure 3 Enlarged view of point B in the image.

[0023] In the attached diagram: Top plate 1; Arc-shaped inclined platform 11; A-shaped inclined platform 12; Pressure rod 121; Pressure plate 122; First spring 123; Wafer transfer module 2; First drive shaft 21; First cross rotating frame 22; Wafer pick-and-place unit 23; First mounting post 231; Ball head 232; Second spring 233; Vacuum suction head 234; Pressure ring 235; Third spring 236; Drive module 3; Drive motor 31; Drive shaft 32; Transmission bevel gear 33; Drive bevel gear 34; Dispensing module 4; Second drive shaft 41; Second cross rotating frame 42; Second mounting post 43; Fourth spring 44; Dispensing head 45; Adjustment unit 5; Mounting plate 51; Mounting groove 511; Elastic band 52; Electric telescopic rod 53; Top column 54. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0025] The specific implementation of the present invention will be described in detail below with reference to specific embodiments.

[0026] like Figures 1-3 As shown, a multi-station collaborative high-speed LED wafer bonding device according to an embodiment of the present invention includes a top plate 1, two arc-shaped ramps 11 symmetrically arranged at the bottom of the top plate 1, and a herringbone ramp 12 located at the middle position of the two arc-shaped ramps 11 at the bottom of the top plate 1; it also includes:

[0027] The wafer transfer module 2 includes a first drive shaft 21 installed at the bottom of the top plate 1. A first cross rotating frame 22 is installed at the bottom of the first drive shaft 21. Each arm end of the first cross rotating frame 22 is provided with a wafer picking and placing unit 23 for picking up LED wafers. Each wafer picking and placing unit 23 is slidably installed on the first cross rotating frame 22 in the vertical direction.

[0028] The dispensing module 4 includes a second drive shaft 41 installed at the bottom of the top plate 1. A second cross rotating frame 42 is installed at the bottom of the second drive shaft 41, and there is a certain angle difference between the second cross rotating frame 42 and the first cross rotating frame 22 to prevent interference between the first cross rotating frame 22 and the second cross rotating frame 42 during rotation. Each arm end of the second cross rotating frame 42 is provided with a second mounting post 43, and the bottom of each second mounting post 43 is provided with a dispensing head 45 for dispensing. Each dispensing head 45 is slidably installed on the second cross rotating frame 42 in the vertical direction. A fourth spring 44 is provided between the second mounting post 43 and the second cross rotating frame 42. When no external force is applied, the elastic force of the fourth spring 44 will cause the second mounting post 43 to be located at the upper limit position.

[0029] The drive module 3 is installed on the top of the top plate 1 and is connected to both the first drive shaft 21 and the second drive shaft 41. The drive module 3 is used to drive the first drive shaft 21 and the second drive shaft 41 to rotate in opposite directions at the same time.

[0030] In this embodiment of the invention, the herringbone-shaped ramp 12 can be considered as being formed by splicing two arc-shaped ramps 11. Specifically, the two arc-shaped ramps 11 on both sides are rotated 180° along the rotation direction of the first drive shaft 21 or the second drive shaft 41, and the rotated two arc-shaped ramps 11 are merged into one component, namely the herringbone-shaped ramp 12. The lower surfaces of both the arc-shaped ramp 11 and the herringbone-shaped ramp 12 are inclined, and along the rotation direction, the lower surfaces of the arc-shaped ramp 11 and the herringbone-shaped ramp 12 continuously decrease in elevation.

[0031] This device can be directly integrated with existing equipment. It provides LED chips via a die-supply device and die-bonding adhesive via a glue-supply device, and moves the substrate to the area below the herringbone ramp 12 via a conveying device. In use, simply activate the drive module 3, which drives the first drive shaft 21 and the second drive shaft 41 to rotate simultaneously in opposite directions. The first drive shaft 21 drives the first cross-shaped rotating frame 22 to rotate synchronously, and the second drive shaft 41 drives the second cross-shaped rotating frame 42 to rotate synchronously. During operation, each second mounting post 43 first passes through the glue-removing position. The arc-shaped ramp 11 above it pushes the second mounting post 43 downwards, allowing the dispensing head 45 to pick up adhesive dots. As the second drive shaft 41 continues to rotate, the dispensing head 45 disengages from the arc-shaped ramp 11 and returns to its upper limit position under the elastic force of the fourth spring 44 until the dispensing head 45 moves to the die-bonding position. During this process, the top of the second mounting post 43 contacts the herringbone ramp 12 and moves downwards under the limiting effect of the herringbone ramp 12, thereby applying die-bonding adhesive to the substrate through the dispensing head 45, achieving cyclic dispensing. Similarly, the first cross-shaped rotating frame 22 drives each chip pick-and-place unit 23 to rotate synchronously, thereby continuously transporting LED chips to the die-bonding position and pressing the LED chips onto the die-bonding adhesive. Through the cooperation of the chip transfer module 2 and the dispensing module 4, cyclic processing is achieved, greatly shortening the waiting time and effectively improving work efficiency.

[0032] like Figure 1 As shown, in a preferred embodiment of the present invention, the drive module 3 includes a drive motor 31 mounted on the top plate 1. The output end of the drive motor 31 is connected to a drive shaft 32. Two drive bevel gears 34 are symmetrically arranged on the drive shaft 32. A transmission bevel gear 33 is mounted on both the first transmission shaft 21 and the second transmission shaft 41. The two transmission bevel gears 33 mesh with the two drive bevel gears 34 respectively.

[0033] In this embodiment of the invention, during use, simply start the drive motor 31. The drive motor 31 can drive the drive shaft 32 to rotate. Through the meshing of the transmission bevel gear 33 and the drive bevel gear 34, the drive shaft 32 can drive the first transmission shaft 21 and the second transmission shaft 41 to rotate simultaneously. The rotation directions of the first transmission shaft 21 and the second transmission shaft 41 are opposite, thereby allowing the wafer pick-and-place unit 23 and the second mounting post 43 to alternately pass through the die bonding position, realizing high-speed cyclic operation of dispensing and die bonding.

[0034] like Figure 2 and Figure 4As shown, in a preferred embodiment of the present invention, the wafer pick-and-place unit 23 includes a first mounting post 231 that is slidably mounted on a first cross rotating frame 22 in a vertical direction, and a second spring 233 is provided between the first mounting post 231 and the first cross rotating frame 22. The elastic force of the second spring 233 allows the first mounting post 231 to be in the upper limit position when it is not subjected to external force. A ball head 232 is provided at the top of the first mounting post 231, and a vacuum suction head 234 is provided at the bottom of the first mounting post 231.

[0035] In this embodiment of the invention, when the ball head 232 is not in contact with the curved ramp 11 or the herringbone ramp 12, the entire wafer pick-and-place unit 23 is at its upper limit position. During the rotation of the wafer pick-and-place unit 23 to the position for picking up the LED wafer, the ball head 232 contacts the curved ramp 11 and slides along the lower surface of the curved ramp 11, thereby pushing the entire wafer pick-and-place unit 23 downwards. When the wafer pick-and-place unit 23 moves to the position for picking up the LED wafer, the entire wafer pick-and-place unit 23 is at its lower limit position, causing the vacuum suction head 234 to contact the LED wafer to be picked up. At this time, the LED wafer can be adsorbed by the vacuum suction head 234. As the first cross-shaped rotating frame 22 continues to rotate, the ball head 232 disengages from the curved ramp 11. At this time, the elastic force of the second spring 233 causes the first mounting post 231 to return to its upper limit position, thereby causing the LED wafer to detach from the blue film. As the chip pick-and-place unit 23 rotates to the herringbone ramp 12, the herringbone ramp 12 can also push the chip pick-and-place unit 23 downward. When the chip pick-and-place unit 23 moves to the die bonding position, the chip pick-and-place unit 23 is at its lower limit position and presses the picked-up LED chip onto the die bonding adhesive. At this time, the vacuum suction head 234 stops working, so that the LED chip is detached from the vacuum suction head 234, thus completing one die bonding operation.

[0036] like Figure 4 As shown, in a preferred embodiment of the present invention, a pressure ring 235 is further provided at the bottom of the first mounting post 231. The pressure ring 235 is sleeved on the outside of the vacuum suction head 234. The pressure ring 235 is slidably mounted on the first mounting post 231 in the vertical direction, and a third spring 236 is provided between the top of the pressure ring 235 and the first mounting post 231.

[0037] In this embodiment of the invention, when no external force is applied, the elastic force of the third spring 236 will cause the pressure ring 235 to be at its lower limit position. When the vacuum suction head 234 descends to the LED chip to be picked up, the pressure ring 235 will slide upward along the first mounting post 231 under the reaction force of the LED chip tray. When the vacuum suction head 234 picks up the LED chip and moves upward, the pressure ring 235 will move relative to the vacuum suction head 234 under the action of the elastic force of the third spring 236, thereby pressing the blue film around the LED chip, thus facilitating the detachment of the LED chip from the blue film.

[0038] like Figure 1 , Figure 3 , Figure 5 and Figure 7 As shown, in a preferred embodiment of the present invention, a pressure rod 121 is provided at the end of the herringbone ramp 12 located directly above the die-bonding position. The pressure rod 121 passes through the top plate 1 and extends to the top of the top plate 1. A pressure plate 122 is provided at the top of the pressure rod 121. A first spring 123 is provided between the pressure plate 122 and the upper surface of the top plate 1. An adjustment unit 5 for pushing the pressure plate 122 to move periodically downward is also installed on the drive shaft 32.

[0039] In this embodiment of the invention, when no external force is applied, the elastic force of the first spring 123 will cause the pressure plate 122 to be at its upper limit position, and at this time the bottom of the pressure rod 121 is flush with the lower surface of the herringbone ramp 12. When the wafer pick-and-place unit 23 moves to the die bonding position, the drive shaft 32 will drive the pressure plate 122 to move downward a certain distance through the adjustment unit 5, thereby driving the pressure rod 121 to move downward synchronously through the pressure plate 122, and pushing the corresponding wafer pick-and-place unit 23 to move downward as a whole through the pressure rod 121, thereby stably pressing the LED wafer picked up by the bottom of the wafer pick-and-place unit 23 onto the die bonding adhesive, thereby ensuring that the LED wafer can be fully pressed onto the die bonding adhesive.

[0040] like Figure 1 , Figure 5 and Figure 6 As shown, in a preferred embodiment of the present invention, the adjustment unit 5 includes a mounting plate 51 mounted on the drive shaft 32, an elastic band 52 is sleeved on the mounting plate 51, and a top post 54 is also provided on the mounting plate 51. The top post 54 abuts against the inner sidewall of the elastic band 52 and lifts the elastic band 52.

[0041] In this embodiment of the invention, the elastic band 52 is lifted by the top column 54, so that the overall outline of the elastic band 52 is cam-shaped. As the drive shaft 32 drives the mounting plate 51 to rotate, the elastic band 52 can push the pressure plate 122 to move downward. Through cooperation with the first spring 123, the pressure rod 121 can perform periodic lifting and lowering movements, thereby pushing the corresponding chip picking and placing unit 23 to move downward as a whole, and stably pressing the LED chip picked up by the bottom of the chip picking and placing unit 23 onto the die bond adhesive.

[0042] As shown in the figure Figure 6 As shown, in a preferred embodiment of the present invention, the mounting plate 51 is further provided with a mounting groove 511, and an electric telescopic rod 53 is provided in the mounting groove 511. The telescopic end of the electric telescopic rod 53 is connected to the top column 54 and is used to drive the top column 54 to move linearly along the radial direction of the mounting plate 51.

[0043] In this embodiment of the invention, the position of the top column 54 can be adjusted by the electric telescopic rod 53, thereby changing the cam profile formed by the elastic band 52 and thus controlling the descent distance of the pressure rod 121. This facilitates the adaptation to LED chips of different thicknesses, ensuring stable bonding of LED chips of various thicknesses to the die bonder during die bonding. After adjustment, as the drive shaft 32 drives the mounting plate 51 to rotate, the elastic band 52 pushes the pressure plate 122 downward. Through cooperation with the first spring 123, the pressure rod 121 can perform periodic lifting and lowering movements. The pressure rod 121 pushes the corresponding chip picking and placing unit 23 downward as a whole, allowing the chip picking and placing unit 23 to move further downward beyond the limit set by the herringbone ramp 12, thus stably pressing the LED chip picked up by the bottom of the chip picking and placing unit 23 onto the die bonder.

[0044] In addition, it should be noted that the elastic band 52 should be made of a highly elastic material, and the elastic band 52 should remain taut when the top post 54 is completely retracted into the mounting groove 511 (at which point the elastic band 52 is in a circular shape).

[0045] Working Principle: In use, simply start the drive motor 31. The drive motor 31 drives the drive shaft 32 to rotate. Through the meshing of the transmission bevel gear 33 and the drive bevel gear 34, the drive shaft 32 drives the first transmission shaft 21 and the second transmission shaft 41 to rotate simultaneously. The rotation directions of the first transmission shaft 21 and the second transmission shaft 41 are opposite, thus allowing the wafer pick-and-place unit 23 and the second mounting post 43 to alternately pass through the die-bonding position, achieving high-speed cyclic operation of dispensing and die bonding. The first transmission shaft 21 drives the first cross-shaped rotating frame 22 to rotate synchronously, and the second transmission shaft 41 drives the second cross-shaped rotating frame 42 to rotate synchronously. During operation, each second mounting post 43 first passes through the adhesive removal position. The arc-shaped ramp 11 above it pushes the second mounting post 43 downwards, allowing the dispensing head 45 to pick up adhesive dots. As the second transmission shaft 41 continues to rotate, the dispensing head 45 disengages from the arc-shaped ramp 11 and returns to its upper limit position under the elastic force of the fourth spring 44 until the dispensing head 45 moves to the die-bonding position. During this process, the top of the second mounting post 43 contacts the herringbone ramp 12 and moves downwards due to the limiting effect of the herringbone ramp 12, thereby applying die-bonding adhesive to the substrate through the dispensing head 45, achieving cyclic dispensing. Similarly, the first cross-shaped rotating frame 22 drives each chip pick-and-place unit 23 to rotate synchronously, thereby continuously transporting LED chips to the die-bonding position and pressing the LED chips onto the die-bonding adhesive. When the chip pick-and-place unit 23 moves to the die-bonding position, the drive shaft 32 drives the pressure plate 122 to move downwards a certain distance through the adjustment unit 5, thereby driving the pressure rod 121 to move downwards synchronously through the pressure plate 122, and pushing the corresponding chip pick-and-place unit 23 downwards as a whole through the pressure rod 121, thereby stably pressing the LED chip picked up by the bottom of the chip pick-and-place unit 23 onto the die-bonding adhesive, thus ensuring that the LED chip can be fully pressed onto the die-bonding adhesive. Through the cooperation of the chip transfer module 2 and the dispensing module 4, cyclic processing is achieved, and the entire process greatly shortens the waiting time at idle positions.

[0046] Furthermore, when performing die bonding operations on LED chips of different thicknesses, the position of the top post 54 can be adjusted by using the electric telescopic rod 53 to change the cam profile formed by the elastic band 52, thereby controlling the descent distance of the pressure rod 121. As the drive shaft 32 drives the mounting plate 51 to rotate, the elastic band 52 can push the pressure plate 122 downward. Through cooperation with the first spring 123, the pressure rod 121 can perform periodic lifting and lowering movements. The pressure rod 121 pushes the corresponding chip pick-and-place unit 23 downward as a whole, allowing the chip pick-and-place unit 23 to move further downward beyond the limit set by the herringbone ramp 12, thus stably pressing the LED chip picked up by the bottom of the chip pick-and-place unit 23 onto the die bonding adhesive.

[0047] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A multi-station collaborative high-speed LED chip bonding device, comprising a top plate, characterized in that, The bottom of the top plate is symmetrically provided with two arc-shaped ramps, and a herringbone ramp is also provided at the midpoint between the two arc-shaped ramps at the bottom of the top plate; it also includes: A wafer transfer module includes a first drive shaft installed at the bottom of a top plate, a first cross rotating frame installed at the bottom of the first drive shaft, and a wafer picking and placing unit for picking up LED wafers at the end of each arm of the first cross rotating frame. Each wafer picking and placing unit is slidably installed on the first cross rotating frame in the vertical direction. The dispensing module includes a second drive shaft installed at the bottom of the top plate, a second cross rotating frame installed at the bottom of the second drive shaft, a second mounting post provided at the end of each arm of the second cross rotating frame, a dispensing head for dispensing provided at the bottom of each second mounting post, and each dispensing head being slidably mounted on the second cross rotating frame in the vertical direction. A fourth spring is provided between the second mounting post and the second cross rotating frame. When no external force is applied, the elastic force of the fourth spring will cause the second mounting post to be located at the upper limit position. A drive module is installed on the top of the top plate and is connected to both the first drive shaft and the second drive shaft, for driving the first drive shaft and the second drive shaft to rotate in opposite directions simultaneously.

2. The multi-station collaborative high-speed LED wafer bonding device according to claim 1, characterized in that, The drive module includes a drive motor mounted on the top plate. The output end of the drive motor is connected to a drive shaft. Two drive bevel gears are symmetrically arranged on the drive shaft. A transmission bevel gear is mounted on both the first transmission shaft and the second transmission shaft. The two transmission bevel gears mesh with the two drive bevel gears respectively.

3. The multi-station collaborative high-speed LED wafer bonding device according to claim 1, characterized in that, The wafer pick-and-place unit includes a first mounting post that is slidably mounted on a first cross-shaped rotating frame in a vertical direction, and a second spring is provided between the first mounting post and the first cross-shaped rotating frame. The elastic force of the second spring causes the first mounting post to be in the upper limit position when no external force is applied. A ball head is provided at the top of the first mounting post, and a vacuum suction head is provided at the bottom of the first mounting post.

4. The multi-station collaborative high-speed LED wafer bonding device according to claim 3, characterized in that, The bottom of the first mounting post is also provided with a pressure ring, which is sleeved on the outside of the vacuum suction head. The pressure ring is slidably mounted on the first mounting post in the vertical direction, and a third spring is provided between the top of the pressure ring and the first mounting post.

5. The multi-station collaborative high-speed LED wafer bonding device according to claim 2, characterized in that, A pressure rod is provided at the end of the herringbone ramp located directly above the die-bonding position. The pressure rod passes through the top plate and extends above the top plate. A pressure plate is provided at the top of the pressure rod, and a first spring is provided between the pressure plate and the upper surface of the top plate. An adjustment unit for pushing the pressure plate to move periodically downward is also installed on the drive shaft.

6. The multi-station collaborative high-speed LED wafer bonding device according to claim 5, characterized in that, The adjustment unit includes a mounting plate installed on the drive shaft, an elastic band sleeved on the mounting plate, and a top post provided on the mounting plate. The top post abuts against the inner sidewall of the elastic band and lifts the elastic band up.

7. The multi-station collaborative high-speed LED wafer bonding device according to claim 6, characterized in that, The mounting plate is also provided with a mounting groove, in which an electric telescopic rod is installed. The telescopic end of the electric telescopic rod is connected to the top column, which is used to drive the top column to move linearly along the radial direction of the mounting plate.

Images