Composite adhesive tape and assembly method of display module

Abstract

The application discloses a composite adhesive tape and a display module assembly method, and belongs to the technical field of display. The composite adhesive tape comprises a buffer layer, a conductive heat dissipation layer, a supporting gasket and a protective film; the buffer layer is connected with the conductive heat dissipation layer in a laminated mode; the supporting gasket is connected with one side of the conductive heat dissipation layer which is away from the buffer layer; the protective film is connected with one side of the supporting gasket which is away from the buffer layer, and is connected with a part of the one side of the conductive heat dissipation layer which is away from the buffer layer and is not covered by the supporting gasket. The application attaches the supporting gasket to the conductive heat dissipation layer in advance. In the process of assembling the display module, after the composite adhesive tape is attached to the back of the display panel, the display panel can be bent and attached to the supporting gasket by removing the protective film, and the operation of attaching the supporting gasket is not needed, so that the problem caused by the difficulty in accurately attaching the supporting gasket is avoided, and the assembly efficiency and the yield of the display module can be improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a composite tape and a method for assembling a display module. Background Technology

[0002] With the development of display technology, the demand for and application range of display devices are constantly expanding. Commonly used display devices include mobile phones, televisions, tablets, laptops, and monitors.

[0003] A display module in a display device typically includes a display panel and a driver chip. When the display panel is a flexible OLED (Organic Light Emitting Diode) display panel, the driver chip needs to be packaged using COP (Chip On Pi) packaging technology to improve the screen-to-body ratio. Currently, display modules usually also include composite tape and support pads. During the assembly process, the composite tape is first attached to the back of the display portion of the OLED panel, then the support pad is attached to the side of the composite tape facing away from the OLED panel, and finally the OLED panel is bent so that the portion of the OLED panel used to encapsulate the driver chip can be attached to the support pad.

[0004] However, in the current assembly process of display modules, it is difficult to accurately attach the support pads to the OLED display panel, resulting in low assembly efficiency and low yield of display modules. Summary of the Invention

[0005] This application provides a composite tape and its manufacturing method. It can solve the problems existing in the process of attaching support pads to OLED display panels. The technical solution is as follows:

[0006] On the one hand, a composite tape is provided, comprising: a buffer layer, a conductive heat dissipation layer, a support pad, and a protective film;

[0007] The buffer layer is stacked and connected to the conductive heat dissipation layer;

[0008] The support pad is connected to the side of the conductive heat dissipation layer that is away from the buffer layer.

[0009] The protective film is connected to the side of the support pad away from the buffer layer, and is also connected to the portion of the conductive heat dissipation layer that is not covered by the support pad on the side away from the buffer layer.

[0010] Optionally, the protective film includes: a first portion and a second portion connected in a direction parallel to the conductive heat dissipation layer; the first portion is connected to the side of the support pad away from the buffer layer, and the second portion is connected to the portion of the conductive heat dissipation layer away from the buffer layer that is not covered by the support pad.

[0011] In the direction perpendicular to the conductive heat dissipation layer, the thickness of the second portion is greater than the thickness of the first portion.

[0012] Optionally, in the direction perpendicular to the conductive heat dissipation layer, the thickness difference between the first portion and the second portion is greater than or equal to the thickness of the support pad.

[0013] Optionally, if the thickness difference between the first portion and the second portion is greater than the thickness of the support pad, the composite tape further includes: a first release film, the first release film being located between the support pad and the first portion, and the first release film being bonded to both the support pad and the first portion.

[0014] The adhesive force between the first release film and the support pad is less than the adhesive force between the first portion and the first release film.

[0015] Optionally, the support pad is bonded to the conductive heat dissipation layer;

[0016] The adhesive force between the support pad and the conductive heat dissipation layer is greater than the adhesive force between the first release film and the support pad.

[0017] Optionally, in the direction perpendicular to the conductive heat dissipation layer, the thickness difference between the first portion and the second portion is equal to the sum of the thicknesses of the support pad and the first release film.

[0018] Optionally, the protective film includes: a first protective film and a second protective film stacked in a direction perpendicular to the conductive heat dissipation layer;

[0019] The second protective film is connected to the portion of the conductive heat dissipation layer that is not covered by the support pad on the side opposite to the buffer layer;

[0020] The first protective film is located on the side of the support pad and the second protective film away from the conductive heat dissipation layer, and the first protective film covers the support pad and the second protective film;

[0021] The first portion includes the portion of the first protective film covering the support pad; the second portion includes the second protective film, and the portion of the first protective film covering the second protective film.

[0022] Optionally, in the direction perpendicular to the conductive heat dissipation layer, the thickness of the buffer layer ranges from 0.2 mm to 0.3 mm, and the thickness of the support pad ranges from 0.03 mm to 0.12 mm.

[0023] Optionally, the composite tape further includes: an adhesive layer bonded to the side of the buffer layer opposite to the conductive heat dissipation layer, and a second release film bonded to the side of the adhesive layer opposite to the buffer layer.

[0024] The adhesive force between the second release film and the adhesive layer is less than the adhesive force between the adhesive layer and the buffer layer.

[0025] On the other hand, a method for assembling a display module is provided, the display module including a display panel, the display panel including: a first panel portion and a second panel portion, and a panel bending portion for connecting the first panel portion and the second panel portion, the display area of ​​the display panel being located within the first panel portion;

[0026] The assembly method includes:

[0027] Provide any of the composite tapes described above;

[0028] The composite tape is attached to the back of the first panel, wherein the buffer layer in the composite tape is closer to the first panel than the conductive heat dissipation layer.

[0029] Remove the protective film from the composite tape and bend the panel bending portion so that the second panel portion is attached to the support pad in the composite tape.

[0030] The beneficial effects of the technical solutions provided in this application are:

[0031] By pre-attaching support pads to the conductive heat dissipation layer during the manufacturing of the composite tape, the display module assembly process can be streamlined. After attaching the composite tape to the back of the display panel, removing the protective film allows the display panel to be bent, and the portion used to encapsulate the driver chip can be attached to the support pads without requiring the pads to be attached manually. This eliminates the problem of inaccurate support pad attachment during display module assembly, thereby improving assembly efficiency and yield. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 This is a structural diagram of a common display module.

[0034] Figure 2 This is a schematic diagram of the film structure of a composite tape provided in an embodiment of this application;

[0035] Figure 3 This is a schematic diagram of the film structure of another composite tape provided in the embodiments of this application;

[0036] Figure 4 This is a schematic diagram of the film structure of another composite tape provided in the embodiments of this application;

[0037] Figure 5 This is a schematic diagram of the film structure of another composite tape provided in the embodiments of this application;

[0038] Figure 6 This is a schematic diagram of the film structure of another composite tape provided in the embodiments of this application;

[0039] Figure 7 A top view of a display module provided in an embodiment of this application;

[0040] Figure 8 This is a schematic diagram of the side structure of a display module after the display panel has been bent, as provided in an embodiment of this application.

[0041] Figure 9 A schematic diagram of the assembly method of the display module provided in this application embodiment (I);

[0042] Figure 10 A schematic diagram (II) illustrating the assembly method of the display module provided in this application embodiment;

[0043] Figure 11 A schematic diagram (III) illustrating the assembly method of the display module provided in this application embodiment. Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0045] Please refer to Figure 1 , Figure 1 This is a structural diagram of a common display module. The display module 00 may include a display panel 10, a composite tape 20, a support pad 40, and a driver chip 30.

[0046] Here, the display panel 10 in the display module 00 may include: a first panel portion 11 and a second panel portion 12, and a panel bending portion 13 located between the first panel portion 11 and the second panel portion 12. The display area of ​​the display panel 10 may be located within the first panel portion 11, that is, the first panel portion 11 may have a display surface 11a.

[0047] After the driver chip 30 is bonded to the front side of the second panel portion 12 (the side on the same side as the display surface 11a), the display module 00 can be assembled. During the assembly of the display module 00, the composite tape 20 needs to be attached to the back side of the part of the display panel 10 used for display (that is, the side of the first panel portion 11 opposite to the display surface 11a), and then the support pad 40 needs to be attached to the side of the composite tape 20 away from the first panel portion 11 in the display panel 10. Finally, the panel bending portion 13 in the display panel 10 is bent so that the second panel portion 12 in the display panel 10 used for encapsulating the driver chip 30 can be attached to the support pad 40.

[0048] Here, regarding the bonding between the composite tape 20 and the support pad 40, since the composite tape 20 is usually a separate material provided by the die-cutting manufacturer, and the support pad 40 is also a separate material, the operation of attaching the support pad 40 to the side of the composite tape 20 away from the first panel 11 is currently mostly carried out using adsorption equipment and robotic arms. In some cases, it can also be operated manually by hand. Taking robotic arm operation as an example, the robotic arm can control the adsorption equipment to move above the material table or conveyor belt where the support pad 40 is placed, and use the adsorption equipment to adsorb the support pad 40 for loading. The robotic arm then controls the adsorption equipment to move above the display panel 10, at which point the display surface 11a of the display panel 10 faces downwards. The robotic arm moves the support pad 40 to the preset bonding position of the composite tape 20 on the back of the display panel 10 to achieve bonding between the composite tape 20 and the support pad 40.

[0049] When the support pad 40 is used as an independent material, both sides of the support pad 40 are provided with adhesive layers, and both adhesive layers are protected with release films. Ideally, the adsorption device adsorbs the release film on the top surface of the support pad 40, while the release film on the bottom surface separates from the support pad 40.

[0050] However, at least the following problems may occur during the process of attaching the support pad 40 to the composite tape 20. For example, the adsorption device may fail to adsorb the support pad 40; or the adsorption device may adsorb the support pad 40, but due to its relatively large thickness, the adsorption force may be too strong, causing the support pad 40 to deform and wrinkle, resulting in wrinkles on the composite tape 20. This situation is called attachment wrinkling; or the adsorption device may only remove the release film on the top surface of the support pad 40, without separating the support pad 40 from the release film on the bottom surface. This situation is called reverse release.

[0051] It should be noted that after the display module 00 is assembled, it can be installed into the mid-frame of the mobile terminal to obtain a mobile terminal with the display module 00. Currently, mobile terminals such as mobile phones or tablets inevitably experience drops during use, which can cause deformation of the mid-frame. The protrusions formed by the deformation can press against the display panel 10, making the display panel 10 prone to display malfunctions.

[0052] Currently, the composite tape 20 contains a conductive heat dissipation layer 22 and a buffer layer 21. To reduce the probability of display abnormalities in the display panel 10 caused by drops, it is usually necessary to increase the thickness h2 of the buffer layer 21 in the composite tape 20. Furthermore, due to the limited installation space inside the mid-frame of the mobile terminal, the distance between the first panel portion 11 and the second panel portion 12 in the display panel 10 cannot be arbitrarily increased. Therefore, when it is necessary to increase the thickness h2 of the buffer layer 21 in the composite tape 20, it is usually also necessary to decrease the thickness h2 of the support pad 40.

[0053] However, reducing the thickness h2 of the support pad 40 results in a thinner support pad 40 (e.g., less than 0.12 mm), which exacerbates the aforementioned problems of inability to adhere, adhesion wrinkles, and reverse release. It is evident that the existing composite tape 20 and the assembly method of the display module 00 have the problem that the support pad 40 is difficult to attach accurately to the display panel 10, resulting in low assembly efficiency and low yield of the display module 00.

[0054] This application provides a composite tape. Please refer to... Figure 2 , Figure 2 This is a schematic diagram of the film structure of a composite tape provided in an embodiment of this application. The composite tape 200 may include: a buffer layer 210, a conductive and heat-dissipating layer 220, a support pad 230, and a protective film 240.

[0055] The buffer layer 210 is stacked and connected to the conductive heat dissipation layer 220; the support pad 230 is connected to the side of the conductive heat dissipation layer 220 away from the buffer layer 210; the protective film 240 is connected to the side of the support pad 230 away from the buffer layer 210, and is also connected to the portion of the conductive heat dissipation layer 220 away from the buffer layer 210 that is not covered by the support pad 230.

[0056] For example, adhesive can be provided on the side of the conductive heat dissipation layer 220 facing the buffer layer 210, adhesive can be provided on both sides of the support pad 230, and adhesive can be provided on the side of the protective film 240 facing the buffer layer 210.

[0057] Thus, in some implementations, the buffer layer 210 can be bonded to the conductive heat dissipation layer 220; the support pad 230 can be bonded to the side of the conductive heat dissipation layer 220 away from the buffer layer 210; the protective film 240 can be bonded to the side of the support pad 230 away from the buffer layer 210, and can also be bonded to the portion of the conductive heat dissipation layer 220 away from the buffer layer 210 that is not covered by the support pad 230.

[0058] In existing composite tape production, die-cutting plants mostly use roller pressing to bond the multi-layer structure of the composite tape. The composite tape 200 provided in this application embodiment can be cut into shape using a die-cutting machine (rotary die-cutting machine) to form the buffer layer 210, conductive heat dissipation layer 220, support pad 230, and protective film 240. Then, a roller press is used to roll the structures of the buffer layer 210, conductive heat dissipation layer 220, support pad 230, and protective film 240 that need to be bonded. For example, the buffer layer 210 and conductive heat dissipation layer 220 can be cut separately and then pressed together, or they can be pressed together and then cut as a whole. Subsequently, the support pad 230 and protective film 240 can be cut separately and then pressed together. Finally, the first component formed by the buffer layer 210 and conductive heat dissipation layer 220 and the second component formed by the support pad 230 and protective film 240 are pressed together.

[0059] It should be noted that the embodiments of this application do not limit the specific manufacturing process of the composite tape 200. The above examples are used to illustrate the feasibility of the composite tape 200 provided in the embodiments of this application. By pre-installing the support pad 230 into the composite tape 200, the composite tape 200 can be pre-installed with the support pad 230 during the production process. Subsequently, during the assembly of the display module 000, it is not necessary to attach the support pad 230 to the conductive heat dissipation layer 220 or to the second panel portion 102 using an adsorption device. Therefore, the aforementioned problems of the support pad 230 failing to adsorb, adsorption wrinkles, and reverse release during the assembly of the display module 000 do not exist.

[0060] By pre-installing the support pad 230 into the composite tape 200 and producing the composite tape 200 in the die-cutting process, the thickness of the support pad 230 will not affect the production of the composite tape 200, which can meet the requirements of reducing the thickness of the support pad 230 and increasing the thickness of the buffer layer 210.

[0061] In the embodiments of this application, please refer to Figure 2 and Figure 3 , Figure 3 This is a schematic diagram of the film structure of another composite tape provided in this application embodiment. The protective film 240 may include a first portion 2401 and a second portion 2402 connected in a direction parallel to the conductive heat dissipation layer 220. The first portion 2401 of the protective film 240 is connected to the side of the support pad 230 opposite to the buffer layer 210, and the second portion 2402 of the protective film 240 is connected to the portion of the conductive heat dissipation layer 220 on the side opposite to the buffer layer 210 that is not covered by the support pad 230.

[0062] In the direction perpendicular to the conductive heat dissipation layer 220, the thickness of the second portion 2402 in the protective film 240 is greater than the thickness of the first portion 2401. By controlling the thickness difference between the second portion 2402 and the first portion 2401 in the protective film 240, the surface of the protective film 240 facing away from the buffer layer 210 can be made smoother. This facilitates more uniform stress on the composite tape 200 under rolling, resulting in a firmer bond between each pair of components in the composite tape 200, including the buffer layer 210, conductive heat dissipation layer 220, support pad 230, and protective film 240. This makes subsequent transportation and distribution of materials more convenient.

[0063] In one possible implementation, in the direction perpendicular to the conductive heat dissipation layer 220, the thickness difference between the first portion 2401 and the second portion 2402 of the protective film 240 is greater than or equal to the thickness of the support pad 230. When the thickness difference between the first portion 2401 and the second portion 2402 of the protective film 240 is equal to the thickness of the support pad 230, such as... Figure 3 As shown, the surface of the protective film 240 facing away from the buffer layer 210 is flat, so that the bottom surface of the buffer layer 210 is flush with the top surface of the protective film 240.

[0064] When the thickness difference between the first portion 2401 and the second portion 2402 of the protective film 240 is greater than the thickness of the support pad 230, a space may exist between the first portion 2401 of the protective film 240 and the support pad 230, and a film layer such as a release film may also be provided. For example, please refer to Figure 4 , Figure 4This is a schematic diagram of the film layer structure of another composite tape provided in this application embodiment. The composite tape 200 may further include: a first release film 250, the first release film 250 being located between the support pad 230 and the first portion 2401, and the first release film 250 being bonded to both the support pad 230 and the first portion 2401; wherein, the adhesive force between the first release film 250 and the support pad 230 is less than the adhesive force between the first portion 2401 and the first release film 250.

[0065] Since adhesive is provided on both sides of the support pad 230, or adhesive is provided on the side of the first portion 2401 of the protective film 240 facing the support pad 230, and a first release film 250 is provided between the support pad 230 and the first portion 2401, since the adhesive force between the first release film 250 and the support pad 230 is less than the adhesive force between the first portion 2401 and the first release film 250, when the protective film 240 is removed, the first release film 250 will be adhered to by the first portion 2401 and removed together, and the first release film 250 will separate from the support pad 230, without the first portion 2401 separating from the first release film 250. In this case, the first release film 250 still needs to be removed.

[0066] For example, the side of the first release film 250 facing the support pad 230 may be provided with a release agent, such as silicone oil, while the side away from the support pad 230 may not have a release agent or adhesive. The first portion 2401 in the protective film 240 is provided with adhesive on the side facing the support pad 230, thereby achieving a bonding force between the first release film 250 and the support pad 230 that is less than the bonding force between the first portion 2401 and the first release film 250.

[0067] Based on this, the support pad 230 is bonded to the conductive heat dissipation layer 220. The adhesive force between the support pad 230 and the conductive heat dissipation layer 220 is greater than the adhesive force between the first release film 250 and the support pad 230. This ensures that the support pad 230 will not separate from the conductive heat dissipation layer 220 when the protective film 240 and the first release film 250 are removed. Even after the protective film 240 is removed, the first release film 250 remains on the support pad 230, ensuring that the support pad 230 will not separate from the conductive heat dissipation layer 220 when the first release film 250 is subsequently removed.

[0068] In the embodiments of this application, such as Figure 4As shown, in the direction perpendicular to the conductive heat dissipation layer 220, the thickness difference between the first portion 2401 and the second portion 2402 of the protective film 240 is equal to the sum of the thicknesses of the support pad 230 and the first release film 250. When the first release film 250 is provided between the first portion 2401 and the support pad 230, by changing the thickness difference between the first portion 2401 and the second portion 2402, the surface of the protective film 240 facing away from the buffer layer 210 can be kept flat.

[0069] Please refer to some possible implementation methods. Figure 5 , Figure 5 This is a schematic diagram of the film structure of another composite tape provided in this application embodiment. The protective film 240 may include a first protective film 241 and a second protective film 242 stacked in a direction perpendicular to the conductive heat dissipation layer 220.

[0070] The second protective film 242 is connected to the portion of the conductive heat dissipation layer 220 that is not covered by the support pad 230 on the side away from the buffer layer 210; the first protective film 241 is located on the side of the support pad 230 and the second protective film 242 that is away from the conductive heat dissipation layer 220, and the first protective film 241 covers the support pad 230 and the second protective film 242; the first portion 2401 may include the portion of the first protective film 241 covering the support pad 230; the second portion 2402 may include the second protective film 242, and the portion of the first protective film 241 covering the second protective film 242.

[0071] By employing a layered arrangement of a first protective film 241 and a second protective film 242, and since the second portion 2402 includes the second protective film 242 and the portion of the first protective film 241 covering the second protective film 242, when it is necessary to adjust the thickness difference between the first portion 2401 and the second portion 2402 of the protective film 240 according to the thickness of the support pad 230, this can be achieved by changing the thickness of the second protective film 242. For example... Figure 5 As shown, when a first release film 250 is provided between the support pad 230 and the first portion 2401 of the protective film 240, the thickness of the second protective film 242 can be the sum of the thicknesses of the first release film 250 and the support pad 230. When it is necessary to adjust the thickness difference between the first portion 2401 and the second portion 2402 of the protective film 240 according to the thicknesses of the support pad 230 and the first release film 250, this can also be achieved by changing the thickness of the second protective film 242. In summary, by changing the thickness of the second protective film 242, it can be ensured that after the protective film 240 covers the support pad 230, the surface of the protective film 240 facing away from the buffer layer 210 can remain flat.

[0072] For example, the first protective film 241 has adhesive on the side facing the buffer layer 210, and the second protective film 242 has adhesive on the side facing the buffer layer 210, so that the first protective film 241 and the second protective film 242 can be bonded together. The first protective film 241 is bonded to the first release film 250 or the support pad 230, and the second protective film 242 is bonded to the conductive heat dissipation layer 220.

[0073] like Figure 5 As shown, in a direction parallel to the conductive heat dissipation layer 220, the second protective film 242 contacts the support pad 230, and the second protective film 242 and the support pad 230 completely cover the side of the conductive heat dissipation layer 220 away from the buffer layer 210. This ensures that the exposed area of ​​the conductive heat dissipation layer 220 is protected by the second protective film 242, preventing scratches or dust from entering.

[0074] In this embodiment, the thickness of the buffer layer 210 can range from 0.2 mm to 0.3 mm in the direction perpendicular to the conductive heat dissipation layer 220, and the thickness of the support pad 230 can range from 0.03 mm to 0.12 mm. For example, the thickness of the buffer layer 210 can be 0.21 mm, 0.23 mm, or 0.27 mm, etc.; and the thickness of the support pad 230 can be 0.03 mm, 0.05 mm, or 0.12 mm, etc. If the support pad 230 with a thickness of 0.03 mm or 0.05 mm is used as a separate material, during the assembly process of the display module 000, when it is attached to the display panel 100 using an adsorption device, the aforementioned problems of failure to adsorb, attachment wrinkles, and reverse release may easily occur. In this application, the support pad 230 is added to the composite tape 200, and the composite tape 200 is directly attached to the display panel 100. There is no need to reattach the support pad 230, so the above-mentioned problem does not exist. The thickness of the support pad 230 in the composite tape 200 will not affect the assembly of the display module 000.

[0075] Please refer to Figure 6 , Figure 6 This is a schematic diagram of the film structure of another composite tape provided in this application embodiment. The composite tape 200 may further include: an adhesive layer 260 bonded to the side of the buffer layer 210 opposite to the conductive heat dissipation layer 220, and a second release film 270 bonded to the side of the adhesive layer 260 opposite to the buffer layer 210; wherein the adhesive force between the second release film 270 and the adhesive layer 260 is less than the adhesive force between the adhesive layer 260 and the buffer layer 210. For example, the adhesive layer may be pressure-sensitive adhesive (PSA), which is suitable for assembling the display panel 100. PSA can eliminate the need for heating and pressure, saving production time, improving efficiency, and also has good flexibility, which can reduce panel deformation.

[0076] In this embodiment, the composite tape 200 may have an adhesive layer 260 and a second release film 270 on the side of the buffer layer 210 facing away from the conductive heat dissipation layer 220. When the composite tape 200 is attached to the back of the display panel 100, the second release film 270 is first removed, and the adhesive layer 260 is used to adhere it to the back of the display panel 100. A release agent may be provided on the side of the second release film 270 facing the buffer layer 210 to ensure that the adhesive force between the second release film 270 and the adhesive layer 260 is less than the adhesive force between the adhesive layer 260 and the buffer layer 210. Therefore, when the second release film 270 is removed, the adhesive layer 260 is retained on the side of the buffer layer 210 facing away from the conductive heat dissipation layer 220, making the bottom surface of the composite tape 200 flat.

[0077] In this application, the specific materials of the buffer layer 210, the conductive heat dissipation layer 220 and the support pad 230 are not limited. Materials commonly used in composite tapes in the existing display module field can be used. Examples are given below.

[0078] The buffer layer 210 provides shock absorption, impact resistance, and pressure relief. It typically possesses good flexibility, elasticity, and compressibility, effectively absorbing external vibrations and pressure. Common materials for the buffer layer 210 include foam, non-woven fabric, and silicone gel.

[0079] The primary functions of the conductive heat dissipation layer 220 are heat conduction, heat dissipation, protection, or shielding. They can effectively reduce the risk of overheating in electronic equipment, improve heat dissipation performance, and even provide electromagnetic interference (EMI) shielding. The conductive heat dissipation layer 220 may include aluminum foil, copper foil, copper alloy layers, aluminum alloy layers, carbon fiber layers, graphite layers, etc.

[0080] The support pad 230 provides additional support to ensure that key components such as the driver chip 300 of the display panel 100 are stably held in the proper position and protected from damage under physical or thermal stress. The support pad 230 is generally made of insulating material, and depending on the application requirements (such as thickness requirements), it can be made of rubber, silicone, foam, polyester film, etc. Polyester film (PET) can be used as a material for thin support pads 230, suitable for applications requiring both thinness and strength. It provides a certain degree of mechanical support while also exhibiting good heat resistance and chemical stability.

[0081] The materials of the protective film 240 (including the first protective film 241 and the second protective film 242) and the release film (including the first release film 250 and the second release film 270) are not limited.

[0082] The main function of the protective film 240 is to prevent external physical damage, chemical pollution, fingerprints, dust, scratches, etc. The protective film 240 generally includes a film and an adhesive, which has a certain adhesive strength. Commonly used materials include polyethylene (PE), polyester (PET), polyurethane (PU), and polypropylene (PP).

[0083] Release films are commonly made of materials such as polyester (PET), polyethylene (PE), and paper-based films. They are usually coated with silicone oil to ensure good release properties and high-temperature resistance, and are suitable for the peeling and protection of adhesives.

[0084] In summary, the composite tape provided in this application pre-attaches the support pads to the conductive heat dissipation layer during the manufacturing process. Thus, during the display module assembly process, after attaching the composite tape to the back of the display panel, removing the protective film allows the display panel to be bent and the portion used for encapsulating the driver chip attached to the support pads. This eliminates the need for manually attaching the support pads, avoiding problems caused by inaccurate attachment of the support pads during display module assembly. Consequently, this improves the assembly efficiency and yield rate of the display module.

[0085] The above is a detailed description of the composite tape 200 provided in the embodiments of this application. The following is a description of the assembly method of the display module 000 provided in the embodiments of this application.

[0086] Please refer to the following: Figures 7 to 11 , Figure 7 This is a top view of a display module provided in an embodiment of this application. Figure 8 This is a schematic diagram of the side structure of a display module after the display panel has been bent, as provided in an embodiment of this application. Figures 9 to 11 The diagrams (I) to (III) illustrate the assembly process of the display module provided in the embodiments of this application. The embodiments of this application also provide a method for assembling a display module 000.

[0087] Among them, such as Figure 7 and Figure 8 As shown, the display module 000 may include a display panel 100, which may include a first panel portion 101 and a second panel portion 102, and a panel bending portion 103 for connecting the first panel portion 101 and the second panel portion 102. The display panel 100 in the display module 000 may have a display area 101a and a non-display area 101b located around the display area 101a. The display area 101a of the display panel 100 is located within the first panel portion 101, and a portion of the non-display area 101b of the display panel 100 is located within the panel bending portion 103 and the second panel portion 102. The assembly method of the display module 000 may include:

[0088] Step S101: Provide the composite tape described in the above embodiments.

[0089] In the embodiments of this application, such as Figure 9 As shown, in addition to the composite tape 200 described in the above embodiments, a display panel 100 to be assembled is also required. The front side of the second panel portion 102 of the display panel 100 may be bonded with a driver chip 300.

[0090] Step S102: Apply the composite tape to the back of the first panel.

[0091] In the embodiments of this application, such as Figure 10 As shown, after the composite tape 200 is attached to the back side of the first panel portion 101, the buffer layer 210 in the composite tape 200 is closer to the first panel portion 101 than the conductive heat dissipation layer 220. The back side of the first panel portion 101 refers to the side opposite to the display surface of the first panel portion 101.

[0092] For example, such as Figure 6 As shown, the buffer layer 210 of the composite tape 200 is provided with an adhesive layer 260 and a second release film 270 on the side opposite to the conductive heat dissipation layer 220. The second release film 270 in the composite tape 200 can be removed first, and then the adhesive layer 260 can be used to attach it to the back of the first panel portion 101.

[0093] Step S103: Remove the protective film from the composite tape and bend the panel bending part so that the second panel part is attached to the support pad in the composite tape.

[0094] For example, such as Figure 6 , Figure 8 and Figure 11 As shown, a first release film 250 is provided on the side of the support pad 230 away from the conductive heat dissipation layer 220. When the protective film 240 is removed, the first release film 250 is bonded to the protective film 240 and is removed together. The side of the support pad 230 away from the conductive heat dissipation layer 220 has adhesive. After the display panel 100 is bent, the back of the second panel portion 102 is bonded to the support pad 230.

[0095] In this embodiment, using the assembly method of the display panel 100 described above, after attaching the composite tape 200 provided in this embodiment to the back of the display panel 100, it is not necessary to perform the step of attaching the support pad 230 to the display panel 100 or the composite tape 200. At this time, the support pad 230 does not suffer from problems such as failure to adhere, adhesion wrinkles, or reverse release caused by adsorption equipment. Furthermore, the problems that become more pronounced when the support pad 230 is too thin are also avoided, thereby improving the assembly efficiency and yield of the display module 000. Figure 1 and Figure 8 As shown, after the same display panel 100 is bent, the height h0 between the front of the first panel portion 101 and the front of the second panel portion 102 is the same, and the space height between the back of the first panel portion 101 and the back of the second panel portion 102 is fixed. By using the composite tape 200 provided in this application embodiment, compared with the buffer layer 21 and support pad 40 of the current display module 00, it is possible to achieve the technical effect of thinning the support pad 230 (h3 < h1) and thickening the buffer layer 210 (h4 > h2), thereby meeting the technical requirement of thickening the buffer layer 210, such as overcoming the above-mentioned display device drop problem.

[0096] The above is a detailed description of the assembly method of the display module 000 provided in the embodiments of this application. The following is a description of the manufacturing method of the composite tape 200 provided in the embodiments of this application.

[0097] This application embodiment also provides a method for manufacturing a composite tape 200, which may include:

[0098] Step S201: Form or connect a conductive heat dissipation layer on the buffer layer.

[0099] Step S202: Form or connect support pads and protective film on the conductive heat dissipation layer.

[0100] The buffer layer 210 is stacked and connected to the conductive heat dissipation layer 220; the support pad 230 is connected to the side of the conductive heat dissipation layer 220 away from the buffer layer 210; the protective film 240 is connected to the side of the support pad 230 away from the buffer layer 210, and is also connected to the portion of the conductive heat dissipation layer 220 away from the buffer layer 210 that is not covered by the support pad 230.

[0101] In one possible implementation, step S201 above may include:

[0102] Step S2011: Attach the conductive heat dissipation layer to the buffer layer to obtain the first component, and cut the shape of the first component.

[0103] For example, a roller device is used to attach the conductive heat dissipation layer 220 to the buffer layer 210 and then cut it.

[0104] The conductive heat dissipation layer 220 may be provided with adhesive on the side facing the buffer layer 210, and is attached to the buffer layer 210 by adhesive bonding. The side of the buffer layer 210 away from the conductive heat dissipation layer 220 may be pre-formed with adhesive layer 260 and second release film 270.

[0105] Step S202 above may include:

[0106] Step S2021: Provide a support pad with a preset shape. For example, the support pad 230 is cut using a roller.

[0107] It should be noted that, in the direction parallel to the conductive heat dissipation layer 220, the external dimensions of the support pad 230 (e.g., ...) Figure 6 The dimensions in the left and right directions, and the dimensions perpendicular to Figure 6 The dimensions (in the paper direction) are smaller than the external dimensions of the conductive heat dissipation layer 220, generally corresponding to, for example... Figure 7 The external dimensions of the driver chip 300 are shown. Therefore, in the manufacturing method of the composite tape 200, the support pad 230 needs to be cut to the required shape first, and then attached to the conductive heat dissipation layer 220 or attached to the protective film 240.

[0108] Step S2022: Provide a protective film with a preset shape. For example, use a roller to cut the protective film 240.

[0109] When the protective film 240 includes a first protective film 241 and a second protective film 242, a first protective film 241 and a second protective film 242 with a preset shape are provided, and the second protective film 242 is attached to the first protective film 241.

[0110] Step S2023: Adhere the protective film to the support pad to obtain the second component. For example, a roller device can be used to press the protective film and the support pad together.

[0111] Step S2024: Attach the first component and the second component together. For example, use a roller to press the first component and the second component together.

[0112] It should be noted that the embodiments of this application do not limit the specific implementation of the manufacturing method of the composite tape 200. The roller equipment (rotary die-cutting machine) using the die-cutting process described above is only an example. For example, it can also be manufactured using equipment such as a flatbed die-cutting machine.

[0113] The composite tape 200 can be prepared using the manufacturing method of the composite tape 200. The support pad 230 can then be processed into the composite tape 200. Utilizing a die-cutting process that eliminates the need for adsorption equipment, the support pad 230 can be accurately attached to the conductive heat dissipation layer 220. This manufacturing method also possesses the technical effects of the composite tape 200 described in the above embodiments, and will not be repeated here.

[0114] In summary, the composite tape and display module assembly method provided in this application pre-attach support pads to the conductive heat dissipation layer during the composite tape manufacturing process. Thus, during the display module assembly process, after attaching the composite tape to the back of the display panel, removing the protective film allows the display panel to be bent and the portion used for encapsulating the driver chip attached to the support pads. This eliminates the need for manually attaching the support pads, avoiding problems caused by inaccurate attachment of the support pads during display module assembly. Consequently, this improves the assembly efficiency and yield rate of the display module.

[0115] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0116] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A composite tape, characterized in that, include: Buffer layer, conductive heat dissipation layer, support pads, and protective film; The buffer layer is stacked and connected to the conductive heat dissipation layer; The support pad is connected to the side of the conductive heat dissipation layer that is away from the buffer layer. The protective film is connected to the side of the support pad away from the buffer layer, and is also connected to the portion of the conductive heat dissipation layer that is not covered by the support pad on the side away from the buffer layer.

2. The composite tape according to claim 1, characterized in that, The protective film includes: a first portion and a second portion connected in a direction parallel to the conductive heat dissipation layer; the first portion is connected to the side of the support pad away from the buffer layer, and the second portion is connected to the portion of the conductive heat dissipation layer away from the buffer layer that is not covered by the support pad; In the direction perpendicular to the conductive heat dissipation layer, the thickness of the second portion is greater than the thickness of the first portion.

3. The composite tape according to claim 2, characterized in that, In the direction perpendicular to the conductive heat dissipation layer, the thickness difference between the first portion and the second portion is greater than or equal to the thickness of the support pad.

4. The composite tape according to claim 3, characterized in that, When the thickness difference between the first portion and the second portion is greater than the thickness of the support pad, the composite tape further includes: a first release film, which is located between the support pad and the first portion, and is bonded to both the support pad and the first portion. The adhesive force between the first release film and the support pad is less than the adhesive force between the first portion and the first release film.

5. The composite tape according to claim 4, characterized in that, The support pad is bonded to the conductive heat dissipation layer; The adhesive force between the support pad and the conductive heat dissipation layer is greater than the adhesive force between the first release film and the support pad.

6. The composite tape according to claim 4, characterized in that, In the direction perpendicular to the conductive heat dissipation layer, the thickness difference between the first portion and the second portion is equal to the sum of the thicknesses of the support pad and the first release film.

7. The composite tape according to any one of claims 2-6, characterized in that, The protective film includes a first protective film and a second protective film stacked in a direction perpendicular to the conductive heat dissipation layer; The second protective film is connected to the portion of the conductive heat dissipation layer that is not covered by the support pad on the side opposite to the buffer layer; The first protective film is located on the side of the support pad and the second protective film away from the conductive heat dissipation layer, and the first protective film covers the support pad and the second protective film; The first portion includes the portion of the first protective film covering the support pad; the second portion includes the second protective film, and the portion of the first protective film covering the second protective film.

8. The composite tape according to any one of claims 1-6, characterized in that, In the direction perpendicular to the conductive heat dissipation layer, the thickness of the buffer layer ranges from 0.2 mm to 0.3 mm, and the thickness of the support pad ranges from 0.03 mm to 0.12 mm.

9. The composite tape according to any one of claims 1-6, characterized in that, The composite tape further includes: an adhesive layer bonded to the side of the buffer layer opposite to the conductive heat dissipation layer, and a second release film bonded to the side of the adhesive layer opposite to the buffer layer. The adhesive force between the second release film and the adhesive layer is less than the adhesive force between the adhesive layer and the buffer layer.

10. A method for assembling a display module, characterized in that, The display module includes a display panel, which includes a first panel portion and a second panel portion, and a panel bending portion for connecting the first panel portion and the second panel portion. The display area of ​​the display panel is located within the first panel portion. The assembly method includes: Provide a composite tape according to any one of claims 1-9; The composite tape is attached to the back of the first panel, wherein the buffer layer in the composite tape is closer to the first panel than the conductive heat dissipation layer. Remove the protective film from the composite tape and bend the panel bending portion so that the second panel portion is attached to the support pad in the composite tape.

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