An integrated circuit chip packaging processing equipment
By simulating impacts through high-frequency vibration and conducting comprehensive environmental testing, the shortcomings of existing equipment in detecting chip impact resistance in complex environments have been addressed, thereby improving testing efficiency and product reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SUZHOU SATE AUTO ELECTRONICS
- Filing Date
- 2026-03-30
- Publication Date
- 2026-07-07
AI Technical Summary
Existing integrated circuit chip packaging and testing equipment is unable to effectively test the impact resistance of chips in complex environments, leading to product quality problems and high rework rates.
The testing device uses high-frequency vibration to simulate impact. It continuously tests the chip by using an impact bar set on the conveyor belt. Combined with the design of the clamping plate and magnet, it reduces the wear of the chip caused by the clamping force. It also uses a hot air blower to simulate a high temperature and humidification environment for comprehensive testing.
It improves testing efficiency, reduces chip wear and clamping issues, and enables continuous testing on multiple chips, ensuring high product reliability.
Smart Images

Figure CN122349331A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of integrated circuit manufacturing technology, and in particular to an integrated circuit chip packaging and processing equipment. Background Technology
[0002] With the advancement of semiconductor manufacturing technology, integrated circuits are becoming increasingly powerful and highly integrated, leading to more complex internal circuits and denser solder joints and interconnections. Some of these interconnections are as thin as a hair. To ensure the normal operation of the circuits in complex usage environments, physical testing of the chips is usually required before they leave the factory. One of the goals is to ensure high product reliability. Therefore, precise testing equipment is needed to detect potential quality problems in a timely manner.
[0003] Early defect detection can effectively reduce rework and scrap, thereby lowering production costs. The design of packaging and inspection equipment must meet the demands of rapid inspection and efficient production to ensure high yield rates for chip packaging. Traditional inspection methods only use optical devices to check for obvious injection molding defects or exposed circuitry. Chips inspected using this method are often more prone to quality issues when facing complex operating environments. To address the drawbacks of this inspection approach, we propose a novel inspection device for chip packaging processing, aiming to improve the overall quality of the product. Summary of the Invention
[0004] To overcome the aforementioned shortcomings in the prior art, the present invention aims to provide a novel detection device capable of detecting the impact resistance of a chip by simulating impact through high-frequency vibration.
[0005] This invention provides an integrated circuit chip packaging and processing equipment, including a conveying device disposed above a conveyor line for a chip body to be tested. The conveying device includes an upper frame and a lower frame with the same external dimensions, and symmetrical conveyor belts are arranged between the upper and lower frame frames. The distance between the two conveyor belts on their adjacent sides is adapted to the thickness of the chip body. Symmetrical clamping plates are respectively arranged on the front and rear sides of the section of the two conveyor belts that are close to each other. The plates are vertically arranged and attached to the back of the conveyor belts. Horizontally equidistant guide holes are opened in the middle of the two clamping plates, and an impact module is provided at each of the guide holes on the two clamping plates. The impact module includes an impact rod slidably inserted into the guide hole. The end of the impact rod in the same guide hole away from the middle is fixed with the same connecting rod, and the bottom ends of the two connecting rods are fixed with the same H-shaped sliding frame. The H-shaped sliding frame can move horizontally back and forth. The H-shaped sliding frame includes two vertical wing rods, and the bottom ends of the two vertical wing rods are respectively fixed with mutually symmetrical bar magnets. The magnetic poles of the two bar magnets are also mutually symmetrical. The bottom end of the conveying device is equipped with a drive motor. The top end of the output shaft of the drive motor is fixed with a fixing block, and the top end of the fixing block is embedded with a rotating magnet. When it is necessary to perform anti-vibration testing on the chip body, the chip body only needs to be placed between the two conveyor belts. After being bitten, it will be pulled into the testing position one after another under the action of static friction, and the clamping pressure is greatly reduced. This setting can avoid the chip being easily worn or scratched due to the large changes in clamping force of traditional rigid clamping tools. It also overcomes the defect of suction cups that can only pick up one chip at a time, which is inefficient. When the chip body runs to the middle, it can be impacted by the impact rods that intermittently hit the middle from both sides. Multiple chips can be continuously tested at the same time, which greatly improves the testing efficiency.
[0006] As a further optimization, the upper frame is a long, rectangular frame structure with a feeding notch at one end. The feeding notch is V-shaped. Vertical support rods are inserted between the four corners of the upper and lower frame frames. Bearing mounting holes are provided on both sides of the upper and lower frame frames near the feeding notch, and anti-detachment bearings are installed in each of the four mounting holes. Two parallel feed rollers with vertical roller shafts are positioned between the four anti-detachment bearings. Two parallel discharge rollers with vertical roller shafts are positioned between the other ends of the upper and lower frame frames. Anti-torsion grooves with opposing openings are provided on both the upper and lower frame frames near the feeding notch, and four anti-torsion grooves are also provided. Each groove is slidably connected with a bearing seat, and each of the four bearing seats is fitted with a tapered roller bearing. The upper and lower tapered roller bearings are symmetrical to each other. The bottom of each of the four anti-torsion grooves is fixed with a retaining spring, and the other end of the retaining spring is fixed to the surface of the corresponding bearing seat. Anti-slip blocks are provided on both sides of the bearing seats, and the left and right sides of the anti-torsion grooves are reserved with a groove that matches the anti-slip blocks. Two bouncing rollers are rotatably connected between the four tapered roller bearings to prevent the bouncing rollers from moving up and down. The end of the two conveyor belts near the feeding notch on the opposite side is flared, which helps the chip body to be bitten into the two conveyor belts in a vertical position and to hold it precisely without damaging the pins.
[0007] As a further optimization, the top ends of the two discharge rollers are respectively fixed with interlocking gears, and a motor mounting hole is opened near one of the gears on the upper frame. A reduction motor is fixed in the motor mounting hole, and a drive gear is fixed at the top end of the output shaft of the reduction motor. The drive gear meshes with one of the gears to drive the two conveyor belts to run simultaneously, thereby driving the clamped chip body to move forward slowly.
[0008] As a further optimization, the two clamping plates are the same width and larger than the width of the conveyor belt. Near the four corners on opposite sides of the two clamping plates, horizontal and perpendicular C-shaped abutments are fixed. Guide members are slidably fitted onto the outer walls of the C-shaped abutments, and these guide members are respectively fixed to the upper surface of the nearest lower frame or the lower surface of the upper frame. Spring stops extending towards the clamping plates are pre-reserved in the middle of each guide member, and compression springs are fixed between the ends of all spring stops and the surface of the clamping plate on their respective sides. This ensures that the two clamping plates firmly clamp the chip body running in the middle against the conveyor belt, and that the clamping force is not too strong, preventing the chip body from moving forward.
[0009] As a further optimization, the opposite sides of the two clamping plates are polished, and both clamping plates are made of metal. This not only provides strong support for the conveyor belt during impact, but also reduces the frictional resistance between the clamping plates and the conveyor belt. The guide holes in the middle of the two clamping plates are at the same height and are staggered. The distance between two adjacent guide holes is greater than the diameter of a single guide hole. With this arrangement, when the impact rods on both sides alternately impact each other, the chip body can be prevented from bending due to the empty back of the chip body.
[0010] As a further optimization, the second bar magnet is an electromagnet, and the second bar magnet is connected to a current controller via a wire. The rotating magnet does not contact the second bar magnet, and the attraction and repulsion can be changed as needed, thereby indirectly changing the impact pressure.
[0011] As a further optimization, L-shaped motor frames are fixed on both the front and rear sides of the drive motor, and the other end of the motor frame is fixed to the lower surface of the lower frame frame by bolts; the H-shaped sliding frame also includes a horizontal strip set between the two vertical wing rods near the bottom, and columnar slide rods are reserved on both the left and right sides of the horizontal strip. The outer walls of the two columnar slide rods are slidably fitted with guide grooves with opposite openings and parallel to each other. The guide grooves are horizontally set and their two ends are fixed to the middle of the lower frame frame near the bottom. With the setting of the rotating magnet, it can be ensured that the impact rods on both sides remain horizontal when reciprocating, reducing frictional loss with the inner wall of the guide hole.
[0012] As a further optimization, the bottom ends of the four support rods are fixed with the same C-shaped frame, and both ends of the C-shaped frame are reserved with insertion holes. The same C-shaped plug rod is slidably inserted into the two insertion holes. The C-shaped frame and the plug rod form a "U"-shaped structure. The lower surface of the C-shaped frame and the plug rod are fixed with return springs near the four corners of the whole. The bottom end of the return spring is provided with a clip. The upper surface of the C-shaped frame is opened with screw holes near both ends, and positioning bolts are screwed into the screw holes to fix the pulled-out plug rod to the C-shaped frame. When in use, it can be fixed on the racks on both sides of the conveying line, and the impact on the chip body on the conveying line is reduced during vibration testing.
[0013] As a further optimization, a hot air blower is also provided on the upper surface of the C-shaped frame, and an air supply pipe is fixed at the air outlet of the hot air blower. An air duct is fixed at the end of the air supply pipe away from the hot air blower, and the entire air duct is located above the gap between the top of the two clamping plates. The diameter of the air duct is larger than the width of the gap between the two clamping plates. The lower surface of the air duct has equidistantly distributed air outlets. The air supply pipe is a rigid pipe that can suspend and support the air duct. Through the provided air supply pipe and hot air blower, the chip body being transported can be heated during testing to simulate its high-temperature resistance testing.
[0014] As a further optimization, the hot air blower is also equipped with a humidification function, which can spray water mist onto the surface of the chip body during operation through the air supply pipe to simulate its operational stability in a high humidity environment.
[0015] During testing, the insertion distance of the insertion rod is first adjusted according to the width of the conveyor line. Then, four clamps are fixed to the conveyor frames on both sides of the conveyor line. Next, the chip body to be tested is inserted one by one into the space between the two conveyor belts from the feeding notch end. As the conveyor belts run, the chip body is slowly moved towards the center. At the same time, the drive motor at the bottom is started and the current of the two bar magnets is adjusted to a moderate level. Under the action of alternating magnetic force, the impact rods on both sides alternately hit the chip body moving in the center, thus forming an impact or vibration resistance test. Depending on the testing needs, a hot air blower can also be turned on to conduct high temperature and humidity resistance tests.
[0016] Compared with the prior art, the beneficial effects of this invention are as follows:
[0017] 1. By setting two conveyor belts that are closely attached together and an impact rod that is slidably connected in the guide hole, when it is necessary to perform shock resistance testing on the chip body, the chip body only needs to be placed between the two conveyor belts and then pulled into the testing position under the action of static friction. The clamping pressure is also greatly reduced. This setting can avoid the chip being worn or having clamp marks due to the large changes in clamping force of traditional rigid clamping tools, and also overcomes the low efficiency defect of suction cups that can only pick up one chip at a time.
[0018] 2. By using impact rods set on both sides of the chip's operating position, the chip can be impacted by the impact rods that intermittently strike the middle from both sides, allowing for continuous detection of multiple chips simultaneously, greatly improving detection efficiency.
[0019] 3. The compression spring and C-shaped abutment ensure that the two clamping plates firmly hold the chip body running in the middle against the conveyor belt, and the clamping force is not too hard, so that the chip body cannot move forward.
[0020] 4. By using the guide groove and cylindrical slide bar, along with the rotating magnet, it can be ensured that the impact rods on both sides remain horizontal during reciprocating impacts, reducing frictional loss with the inner wall of the guide hole. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of the overall structure of the present invention;
[0022] Figure 2 This is a bottom-view structural diagram of the present invention;
[0023] Figure 3This is a side view of the present invention;
[0024] Figure 4 This is a three-dimensional structural diagram of the upper frame of the present invention;
[0025] Figure 5 This is a three-dimensional structural diagram of the lower frame of the present invention;
[0026] Figure 6 This is a top view of the present invention;
[0027] Figure 7 for Figure 6 Schematic diagram of the cross-sectional structure along line AA;
[0028] Figure 8 This is a schematic diagram of the overall structure of the transmission device of the present invention;
[0029] Figure 9 This is a schematic diagram of the clamping plate of the present invention;
[0030] Figure 10 This is a schematic diagram of the overall structure of the impact module of the present invention;
[0031] Figure 11 This is a three-dimensional structural diagram of the H-shaped sliding frame of the present invention.
[0032] In the diagram: 1. C-shaped frame; 2. Lower frame; 3. Clamp; 4. Return spring; 5. Insert rod; 6. Support rod; 7. Discharge roller; 8. Drive gear; 9. Gear 1; 10. Clamping plate; 1001. Guide hole; 11. Upper frame; 12. C-shaped abutment tube; 13. Guide component; 14. Conveyor belt; 15. Air duct; 16. Air supply pipe; 17. Bearing seat; 18. Anti-torsion groove; 19. Hot air blower; 20. Feed roller; 21. Bounce roller; 22. Motor frame; 23. Rotating magnet 1; 24. Bar magnet 2; 25. Drive motor; 26. Guide groove; 27. Bearing mounting hole 1; 28. Motor mounting hole; 29. Impact module; 30. Clamping spring; 31. Chip body; 32. H-shaped sliding frame; 33. Columnar sliding rod. Detailed Implementation
[0033] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0034] In the description of this application, the terms "component one" and "component two" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined as "component one" or "component two" may explicitly or implicitly include one or more of the stated features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0035] Example 1, refer to Figures 1 to 11 As shown, an integrated circuit chip packaging and processing equipment includes a conveying device disposed above the conveying line of the chip body 31 to be tested. The conveying device includes an upper frame frame 11 and a lower frame frame 2 with the same external dimensions. Symmetrical conveyor belts 14 are arranged between the upper frame frame 11 and the lower frame frame 2. The distance between the adjacent sides of the two conveyor belts 14 is adapted to the thickness of the chip body 31, enabling the chip body 31 to be clamped and moved from one end of the conveying device to the other under the action of static friction. The front and rear sections of the two conveyor belts 14 that are close together... Symmetrical clamping plates 10 are provided on both sides, with the plates of the clamping plates 10 vertically positioned and in contact with the back of the conveyor belt 14. Guide holes 1001 are evenly spaced laterally distributed in the middle of the two clamping plates 10. Impact modules 29 are provided at each of the guide holes 1001 on both clamping plates 10. Each impact module 29 includes an impact rod slidably inserted into the guide hole 1001. The end of the impact rod in the same guide hole 1001 furthest from the center is fixed to the same connecting rod, and the bottom ends of the two connecting rods are fixed to the same H-shaped sliding frame 32. The moving frame 32 can slide horizontally back and forth. The H-shaped sliding frame 32 includes two vertical wing rods, and the bottom ends of the two vertical wing rods are respectively fixed with mutually symmetrical bar magnets 24. The magnetic poles of the two bar magnets 24 are also mutually symmetrical. The bottom end of the conveying device is provided with a drive motor 25. The top end of the output shaft of the drive motor 25 is fixed with a fixing block, and the top end of the fixing block is embedded with a rotating magnet 23. By setting two conveyor belts 14 that are closely attached together and an impact rod that is slidably connected in the guide hole 1001, it is necessary to perform shock resistance testing on the chip body 31. When the chip body 31 is placed between two conveyor belts 14 and engaged, it will be pulled into the detection position under the action of static friction, and the clamping pressure will be greatly reduced. This setting can avoid the chip being worn or having clamp marks due to the large change in clamping force of traditional rigid clamping tools. It also overcomes the defect that the suction cup can only pick up one chip at a time, which is inefficient. When the chip body 31 runs to the middle, it can be impacted by the impact rods that intermittently hit the middle from both sides. This allows multiple chips to be continuously detected at the same time, which greatly improves the detection efficiency.
[0036] Reference Figures 4 to 6 ,as well as Figure 8As shown, the upper frame 11 is a long, rectangular frame structure with a feeding notch at one end. The feeding notch is V-shaped. Vertical support rods 6 are inserted between the four corners of the upper frame 11 and the lower frame 2. Bearing mounting holes 27 are provided on both sides of the upper frame 11 and the lower frame 2 near the feeding notch, and anti-detachment bearings are installed in each of the four bearing mounting holes 27. Two parallel feed rollers 20 with vertical roller shafts are arranged between the four anti-detachment bearings. Two parallel discharge rollers 7 with vertical roller shafts are arranged between the other ends of the upper frame 11 and the lower frame 2. Anti-torsion grooves 18 with opposite openings are provided on the upper frame 11 and the lower frame 2 near the feeding notch, and bearing seats 1 are slidably connected in each of the four anti-torsion grooves 18. 7. Each of the four bearing housings 17 is fitted with a tapered roller bearing, and the two upper and lower tapered roller bearings are symmetrical to each other. The bottom of each of the four anti-torsion grooves 18 is fixed with a retaining spring 30, and the other end of the retaining spring 30 is fixed to the surface of the corresponding bearing housing 17. Anti-slip blocks are provided on both the left and right sides of the bearing housing 17, and the left and right sides of the anti-torsion groove 18 are reserved with a groove that matches the anti-slip block. Two bouncing rollers 21 are rotatably connected between the four tapered roller bearings to prevent the bouncing rollers 21 from moving up and down. The two conveyor belts 14 are flared at the end near the feeding notch on the opposite side. The V-shaped feeding notch helps the chip body 31 to be bitten into the two conveyor belts 14 in a vertical position and to hold it precisely without damaging the pins.
[0037] Reference Figure 4 and Figure 8 As shown, the top ends of the two discharge rollers 7 are respectively fixed with interlocking gears 9, and the upper frame frame 11 has a motor mounting hole 28 near one of the gears 9. A geared motor is fixed in the motor mounting hole 28, and a drive gear 8 is fixed at the top end of the output shaft of the geared motor. The drive gear 8 meshes with one of the gears 9. By setting the interlocking gears 9, the two conveyor belts 14 are driven to run simultaneously, thereby driving the clamped chip body 31 to move forward slowly.
[0038] Reference Figures 7 to 9As shown, the two clamping plates 10 are the same width and larger than the width of the conveyor belt 14. On the opposite sides of the two clamping plates 10, near the four corners, there are horizontal and perpendicular C-shaped abutments 12. The outer walls of the C-shaped abutments 12 are slidably fitted with guide members 13. The guide members 13 are respectively fixed to the upper surface of the nearby lower frame 2 or the lower surface of the upper frame 11. The middle of the guide members 13 is reserved with spring blocks extending to the clamping plates 10. The ends of all the spring blocks are fixed with compression springs between them and the surface of the clamping plate 10 on the side they are on. Through the compression springs and the C-shaped abutments 12, it can be ensured that the two clamping plates 10 tightly clamp the chip body 31 running in the middle against the conveyor belt 14, and the clamping force is not too hard, so that the chip body 31 cannot move forward.
[0039] Reference Figure 7 and Figure 9 As shown, the opposite sides of the two clamping plates 10 are polished, and both clamping plates 10 are made of metal. This not only provides strong support for the conveyor belt 14 during impact, but also reduces the frictional resistance between them. The guide holes 1001 in the middle of the two clamping plates 10 are at the same height and are staggered. The distance between two adjacent guide holes 1001 is greater than the diameter of a single guide hole 1001. With this arrangement, when the impact rods on both sides alternately impact each other, the chip body 31 is prevented from being bent due to the empty back side.
[0040] Reference Figure 7 and Figure 10 As shown, bar magnet 24 is an electromagnet, and bar magnet 24 is connected to a current controller via a wire. Rotating magnet 23 does not contact bar magnet 24. By setting bar magnet 24, which can adjust the current, the attraction and repulsion can be changed as needed, thereby indirectly changing the impact pressure.
[0041] Reference Figure 2 , Figure 7 , Figure 10 and Figure 11 As shown, L-shaped motor frames 22 are fixed on both the front and rear sides of the drive motor 25, and the other end of the motor frame 22 is fixed to the lower surface of the lower frame frame 2 by bolts; the H-shaped sliding frame 32 also includes a horizontal strip set between the two vertical wing rods near the bottom, and columnar slide rods 33 are reserved on both the left and right sides of the horizontal strip. The outer walls of the two columnar slide rods 33 are slidably fitted with guide grooves 26 with opposite openings and parallel to each other. The guide grooves 26 are horizontally set and their two ends are fixed to the middle of the lower frame frame 2 near the bottom. With the setting of the guide grooves 26 and columnar slide rods 33, and the setting of the rotating magnet 23, it can be ensured that the impact rods on both sides remain horizontal when reciprocating, reducing the friction loss with the inner wall of the guide hole 1001.
[0042] Refer to 1 to Figure 3 As shown, the bottom ends of the four support rods 6 are fixed with the same C-shaped frame 1, and both ends of the C-shaped frame 1 are reserved with insertion holes. The same C-shaped insertion rod 5 is slidably inserted into the two insertion holes. The C-shaped frame 1 and the insertion rod 5 form a "U"-shaped structure. The lower surface of the C-shaped frame 1 and the insertion rod 5 are fixed with return springs 4 near the four corners of the whole. The bottom end of the return spring 4 is provided with clips 3. The upper surface of the C-shaped frame 1 is provided with screw holes near both ends, and positioning bolts are screwed into the screw holes to fix the inserted rod 5 after it is pulled out to the C-shaped frame 1. With the clips 3 and the removable insertion rod 5, it can be fixed on the racks on both sides of the conveying line during use, and the impact on the chip body 31 on the conveying line is reduced during vibration testing.
[0043] Reference Figure 1 , Figure 6 and Figure 7 As shown, a hot air blower 19 is also provided on the upper surface of the C-shaped frame 1, and an air supply pipe 16 is fixed at the air outlet of the hot air blower 19. An air duct 15 is fixed at the end of the air supply pipe 16 away from the hot air blower 19, and the entire air duct 15 is located above the gap between the top ends of the two clamping plates 10. The diameter of the air duct 15 is larger than the width of the gap between the two clamping plates 10. An air outlet is provided in the middle of the lower surface of the air duct 15 at equal intervals. The air supply pipe 16 is a rigid pipe that can suspend and support the air duct 15. Through the provided air supply pipe 16 and hot air blower 19, the chip body 31 being transported can be heated during testing to simulate its high-temperature resistance testing.
[0044] Example 2, refer to Figure 1 and Figure 7 As shown, the hot air blower 19 is also equipped with a humidification function, which can spray water mist onto the surface of the chip body 31 that is in operation through the air pipe 16 to simulate its operational stability in a high humidity environment.
[0045] During testing, the device first adjusts and fixes the extension length of the insertion rod 5 according to the span of the conveyor line used to transport the chip body 31. Then, it fixes the four clamps 3 to the conveyor frame on both sides of the conveyor line and turns on the relevant electrical equipment. At this time, the chip body 31 to be tested is inserted one by one into the space between the two conveyor belts 14 from the feeding notch end. As the conveyor belts 14 run, the chip body 31 is slowly moved towards the center. At the same time, the drive motor 25 at the bottom is started and the current of the two bar magnets 24 is adjusted to a moderate level. Under the action of alternating magnetic force, the impact rods on both sides alternately hit the chip body 31 moving in the center, thus forming an impact or vibration resistance test. According to the test requirements, the hot air blower 19 can also be turned on to conduct high temperature and humidity resistance tests.
[0046] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.
Claims
1. An integrated circuit chip packaging and processing apparatus, comprising a conveying device disposed above a conveying line of a chip body (31) to be tested, characterized in that, The transmission device includes an upper frame (11) and a lower frame (2) of the same external dimensions. Symmetrical conveyor belts (14) are arranged between the upper frame (11) and the lower frame (2). The distance between the two conveyor belts (14) on their adjacent sides is adapted to the thickness of the chip body (31). Symmetrical clamping plates (10) are respectively arranged on the front and rear sides of the section of the two conveyor belts (14) that are close together. The plates of the clamping plates (10) are vertically arranged and attached to the back of the conveyor belts (14). Guide holes (1001) are evenly distributed laterally in the middle of the two clamping plates (10). Impact modules (29) are provided at the guide holes (1001) on both clamping plates (10). The impact module (29) includes an impact rod that is slidably inserted into a guide hole (1001). The end of the impact rod in the same guide hole (1001) away from the middle is fixed with the same connecting rod, and the bottom ends of the two connecting rods are fixed with the same H-shaped sliding frame (32). The H-shaped sliding frame (32) can slide horizontally back and forth. The H-shaped sliding frame (32) includes two vertical wing rods, and the bottom ends of the two vertical wing rods are respectively fixed with mutually symmetrical bar magnets (24). The magnetic poles of the two bar magnets (24) are also mutually symmetrical. The bottom end of the conveying device is provided with a drive motor (25). The top end of the output shaft of the drive motor (25) is fixed with a fixing block, and the top end of the fixing block is embedded with a rotating magnet (23).
2. The integrated circuit chip packaging and processing equipment according to claim 1, characterized in that, The upper frame (11) is a long, rectangular frame structure with a feeding notch at one end. The feeding notch is V-shaped. Vertical support rods (6) are inserted between the four corners of the upper frame (11) and the lower frame (2). Bearing mounting holes (27) are provided on both sides of the upper frame (11) and the lower frame (2) near the feeding notch. Anti-detachment bearings are installed in each of the four bearing mounting holes (27). Two parallel feed rollers (20) with vertical roller shafts are installed between the four anti-detachment bearings. Two parallel discharge rollers (7) with vertical roller shafts are installed between the other ends of the upper frame (11) and the lower frame (2). Each of the four anti-torsion grooves (18) has an opening with opposite openings. Each of the four anti-torsion grooves (18) is slidably connected to a bearing seat (17). Each of the four bearing seats (17) is fitted with a tapered roller bearing. The upper and lower tapered roller bearings are symmetrical to each other. Each of the four anti-torsion grooves (18) has a retaining spring (30) fixed at the bottom. The other end of the retaining spring (30) is fixed to the surface of the corresponding bearing seat (17). Each of the bearing seats (17) has an anti-blocking block on both the left and right sides. Each of the four anti-torsion grooves (18) has a groove that matches the anti-blocking block. Two bouncing rollers (21) are rotatably connected between the four tapered roller bearings. The two conveyor belts (14) are flared at the end near the feeding gap on the opposite side.
3. The integrated circuit chip packaging and processing equipment according to claim 2, characterized in that, The top ends of the two discharge rollers (7) are respectively fixed with interlocking gears (9), and the upper frame frame (11) is provided with a motor mounting hole (28) near one of the gears (9). A reduction motor is fixed in the motor mounting hole (28), and a drive gear (8) is fixed at the top end of the output shaft of the reduction motor. The drive gear (8) meshes with one of the gears (9).
4. The integrated circuit chip packaging and processing equipment according to claim 1, characterized in that, The two clamping plates (10) are the same width and are greater than the width of the conveyor belt (14). C-shaped abutments (12) are fixed near the four corners on opposite sides of the two clamping plates (10). Guide members (13) are slidably sleeved on the outer wall of the C-shaped abutments (12). The guide members (13) are fixed on the upper surface of the nearest lower frame frame (2) or the lower surface of the upper frame frame (11). Spring blocks extending to the clamping plates (10) are reserved in the middle of the guide members (13). Compression springs are fixed between the end of all the spring blocks and the surface of the clamping plate (10) on the side where they are located.
5. The integrated circuit chip packaging and processing equipment according to claim 4, characterized in that, The two clamping plates (10) are polished on opposite sides, and both clamping plates (10) are made of metal. The guide holes (1001) in the middle of the two clamping plates (10) are of the same height and are staggered. The distance between two adjacent guide holes (1001) is greater than the diameter of a single guide hole (1001).
6. The integrated circuit chip packaging and processing equipment according to claim 1, characterized in that, The second bar magnet (24) is an electromagnet, and the second bar magnet (24) is connected to a current controller through a wire, so that the first rotating magnet (23) does not come into contact with the second bar magnet (24).
7. The integrated circuit chip packaging and processing equipment according to claim 1, characterized in that, The drive motor (25) is fixed with an L-shaped motor frame (22) on both the front and rear sides, and the other end of the motor frame (22) is fixed to the lower surface of the lower frame frame (2) by bolts; the H-shaped sliding frame (32) also includes a horizontal strip set between two vertical wing rods near the bottom, and columnar slide rods (33) are reserved on both the left and right sides of the horizontal strip. The outer walls of the two columnar slide rods (33) are slidably fitted with guide slide grooves (26) with opposite openings and parallel to each other. The guide slide grooves (26) are horizontally set and their two ends are fixed to the middle of the lower frame frame (2) near the bottom.
8. The integrated circuit chip packaging and processing equipment according to claim 2, characterized in that, The bottom ends of the four support rods (6) are fixed with the same C-shaped frame (1), and both ends of the C-shaped frame (1) are reserved with insertion holes. The same C-shaped rod (5) is slidably inserted into the two insertion holes. The C-shaped frame (1) and the rod (5) form a "U" shaped structure. The lower surface of the C-shaped frame (1) and the rod (5) are fixed with return springs (4) near the four corners of the whole. The bottom end of the return springs (4) is provided with clips (3). The upper surface of the C-shaped frame (1) is opened with screw holes near both ends, and positioning bolts are screwed into the screw holes.
9. An integrated circuit chip packaging and processing equipment according to claim 8, characterized in that, The upper surface of the C-shaped frame (1) is also provided with a hot air blower (19), and a gas supply pipe (16) is fixed at the air outlet of the hot air blower (19). A duct (15) is fixed at the end of the duct (16) away from the hot air blower (19), and the entire duct (15) is located above the gap between the top ends of the two clamping plates (10). The diameter of the duct (15) is greater than the width of the gap between the two clamping plates (10). An air outlet is provided in the middle of the lower surface of the duct (15). The gas supply pipe (16) is a rigid pipe.
10. An integrated circuit chip packaging and processing equipment according to claim 1, characterized in that, The hot air blower (19) is also equipped with a humidification function.