Wafer transfer arm
By using support pads and limiters made of PEEK plastic on the wafer transfer arm, the problem of wafer slippage during wafer transfer was solved, improving product quality and equipment operating efficiency, and reducing maintenance costs and time.
Patent Information
- Application Number
- CN202610416912.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-03-31
- Publication Date
- 2026-07-07
AI Technical Summary
Existing wafer transfer arms are prone to getting dirty after long-term use, which can cause the support pads to slip, resulting in wafer transfer misalignment and the risk of wafer falling off, affecting production line safety and equipment maintenance frequency.
A wafer transfer arm was designed, which uses a support pad and a limiter made of PEEK plastic. The support pad has a fork-shaped structure to provide static friction and is fixed by a hole structure. The limiter is used to further stabilize the wafer position and ensure that slippage is prevented after a set number of wafers have been transferred.
It effectively prevents wafer slippage, improves product quality and yield, reduces equipment maintenance costs and time, ensures normal equipment operation, and increases output.
Smart Images
Figure CN122349340A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor integrated circuit manufacturing, and in particular to a wafer transfer arm. Background Technology
[0002] In semiconductor manufacturing equipment, wafers need to be transferred to process chambers for corresponding processes. This requires a wafer transfer arm, such as transporting a wafer from a load lock chamber to a main chamber. Figure 1 The diagram shows a schematic of an existing wafer transfer arm; it includes a root portion 101 and a wafer support portion 102. The root portion 101 is used to mount the robot, and the wafer support portion 102 has a fork-shaped structure and is used for picking up and placing wafers. Three support pads 103 are provided on the wafer support portion 102. When a wafer is placed on the wafer support portion 102, it contacts the back of the wafer through the support pads 103.
[0003] Prolonged operation can lead to dirt accumulation on the pads of the wafer transfer arm. This dirt can cause the support pad 103 to slip, potentially causing shifting during wafer transport and posing a risk of wafer dropping. This is especially true after replacing the original wafer transfer arm; the frequency of wafer shifts increases over time, for example, after six months of use, severely impacting production line safety. In some cases, wafers must be manually removed during wafer shifts, posing a risk of scrap and fragmentation. Frequent arm replacements also result in significant loss of machine time. Summary of the Invention
[0004] The technical problem to be solved by the present invention is to provide a wafer transfer arm that can eliminate wafer slippage.
[0005] To solve the above-mentioned technical problems, the wafer transfer arm provided by the present invention includes: a root and a wafer support.
[0006] The first end of the wafer support portion is disposed on the root portion.
[0007] From the first end to the second end of the wafer support portion, the wafer support portion has a fork-shaped structure, including two symmetrical side support forks. The two side support forks are connected at the first end of the wafer support portion to form a bottom support crossbar. An opening area is formed between the side support forks and the bottom support crossbar.
[0008] The top surface of the side support fork and the top surface of the bottom support crossbar are a single flat surface and serve as the wafer support surface.
[0009] Multiple support pads are fixedly disposed on the wafer support surface. The support pads are symmetrically distributed from left to right. The top surface of each support pad is higher than the wafer support surface. The support pads are used to provide static friction for the wafer placed on the wafer support surface. The number of support pads is sufficient to ensure that the total static friction provided by each support pad still prevents wafer slippage after a set number of wafers have been transferred.
[0010] A further improvement is that a plurality of first holes are provided on the wafer support surface; each support pad has a first bottom portion that matches the first hole and a second top portion located above the first bottom portion, the support pad being fixed by inserting the first bottom portion into the first hole, and the second top portion being located above the top surface of the first hole and extending to the wafer support surface outside the first hole.
[0011] A further improvement is that the material of the support pad includes PEEK plastic.
[0012] A further improvement is that each of the side support forks has a first edge portion at the edge of its second end, with its top surface higher than the wafer support surface.
[0013] The top surface of the root is higher than the wafer support surface.
[0014] The inner side of the first edge portion and the inner side of the root portion are both sides close to the wafer support surface. The inner side of the first edge portion and the inner side of the root portion are both arcs located on the first circle. The size of the first circle matches that of the wafer.
[0015] Further improvements include the addition of multiple limit switches.
[0016] The limiter is disposed on the inner side of the first edge portion and extends to the top surface of the first edge portion, or disposed on the inner side of the root portion and extends to the top surface of the root portion. The top surface of the limiter is higher than the top surface of the first edge portion and the top surface of the root portion, and is used to place the wafer to slide onto the top surface of the first edge portion or the top surface of the root portion.
[0017] A further improvement is that the limiter includes a first mounting portion and a second insertion portion.
[0018] The first mounting part is fixedly mounted on the first edge part or the root part; the inner side of the first mounting part is located at the same level as or further inside the inner side of the corresponding first edge part or the inner side of the root part; the top surface of the first mounting part is higher than the top surface of the first edge part or the root part.
[0019] The first mounting part is provided with a second hole.
[0020] The second insertion part is fixed to the first mounting part by being inserted into the second hole, and after the second insertion part is fixed to the first mounting part, the top surface of the second insertion part is higher than or level with the top surface of the first mounting part.
[0021] A further improvement is that the first mounting part is integrally formed on the first edge portion or the root portion; or, the first mounting part is fixed to the first edge portion or the root portion by a fixing device.
[0022] A further improvement is that the material of the second insertion part includes PEEK plastic.
[0023] A further improvement is that the material of the first mounting part includes PEEK plastic.
[0024] A further improvement is that the root portion is made of PEEK plastic; the wafer support portion is made of PEEK plastic.
[0025] A further improvement is that the number of support pads is more than 6, with at least 2 support pads provided on each of the side support forks and at least 2 support pads provided on the bottom support crossbar.
[0026] A further improvement is that at least one of the limiters is provided on each of the first edge portions, and at least two of the limiters are provided on the root portion.
[0027] A further improvement is that the root is provided with multiple screw holes for screws to pass through to fix the wafer transfer arm.
[0028] A further improvement is that the wafer transfer arm is mounted on the robotic arm of the transfer cavity.
[0029] A further improvement is that the robotic arm is used to transfer the wafer between the load lock chamber and the process chamber.
[0030] This invention sets the number of support pads according to the total static friction required to prevent slippage, ensuring that slippage will not occur even after a set number of wafers have been transferred. In this invention, the set number of wafers is usually greater than or equal to the number of wafers corresponding to normal preventive maintenance (PM). Therefore, this invention can prevent slippage caused by the increasing number of wafers transferred and the accumulation of contamination on the support pads, which leads to a decrease in friction, during each preventive maintenance cycle. Thus, this invention can eliminate wafer slippage.
[0031] Because slippage can cause difficulties in yield assessment; in more serious cases, slippage can also generate fragments, which not only directly scraps the product but also affects the equipment, requiring downtime for repairs, increasing maintenance costs, and, more importantly, reducing uptime and impacting output. Therefore, this invention can prevent product problems, improve product quality and yield, reduce equipment maintenance costs and time, and increase output.
[0032] The structure of the support pad of the present invention facilitates installation and disassembly, and makes cleaning and maintenance convenient.
[0033] The present invention can further include a limiter, which can further prevent wafer slippage.
[0034] The structure of the limiter of the present invention is also conducive to installation and disassembly, and convenient for cleaning and maintenance. Attached Figure Description
[0035] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments: Figure 1 This is a schematic diagram of the structure of an existing wafer transfer arm; Figure 2 This is a schematic diagram of the wafer transfer arm in an embodiment of the present invention. Figure 1 ; Figure 3 This is a schematic diagram of the wafer transfer arm in an embodiment of the present invention. Figure 2 ; Figure 4 yes Figure 2 Enlarged view of the area within the dashed coil 301. Detailed Implementation
[0036] like Figure 2 The diagram shown is a schematic representation of the wafer transfer arm according to an embodiment of the present invention. Figure 1 , Figure 3 This is a schematic diagram of the wafer transfer arm in an embodiment of the present invention. Figure 2 ; Figure 4 yes Figure 2 Enlarged view of the area within the dashed coil 301; Figure 2 and Figure 3 The corresponding observation directions are different. Figure 2 The observation is mainly from the root towards the wafer support. Figure 3 The observation is mainly from the wafer support section towards the root section; the wafer transfer arm in this embodiment of the invention includes: a root section 201 and a wafer support section.
[0037] The first end of the wafer support portion is disposed on the root portion 201.
[0038] From the first end to the second end of the wafer support portion, the wafer support portion has a fork-shaped structure, including two symmetrical side support forks 202. The two side support forks 202 are connected at the first end of the wafer support portion to form a bottom support crossbar 203. An opening area is formed between the side support forks 202 and the bottom support crossbar 203.
[0039] The top surface of the side support fork 202 and the top surface of the bottom support crossbar 203 form a single flat surface and serve as a wafer support surface.
[0040] Multiple support pads 204 are fixedly disposed on the wafer support surface. Each support pad 204 is symmetrically distributed from left to right. The top surface of each support pad 204 is higher than the wafer support surface. The support pads 204 are used to provide static friction for the wafer placed on the wafer support surface. The number of support pads 204 is sufficient to ensure that the total static friction provided by each support pad 204 still prevents wafer slippage after a set number of wafers have been transferred.
[0041] like Figure 4 As shown, a plurality of first holes 208 are provided on the wafer support surface; each support pad 204 has a first bottom portion that matches the first hole 208 and a second top portion located above the first bottom portion. The support pad 204 is fixed by inserting the first bottom portion into the first hole 208, and the second top portion is located above the top surface of the first hole 208 and extends to the wafer support surface outside the first hole 208.
[0042] In this embodiment of the invention, the material of the support pad 204 includes PEEK plastic.
[0043] In this embodiment of the invention, each of the side support forks 202 has a first edge portion 207 at the edge of the second end, with its top surface higher than the wafer support surface.
[0044] The top surface of the root 201 is higher than the wafer support surface.
[0045] The inner side surfaces of the first edge portion 207 and the root portion 201 are both sides close to the wafer support surface. Both the inner side surfaces of the first edge portion 207 and the root portion 201 are arc-shaped on a first circle, and the size of the first circle matches that of the wafer. Preferably, the inner side surfaces of the first edge portion 207 and the root portion 201 are both inclined structures.
[0046] In this embodiment of the invention, a plurality of limiters 205 are also included.
[0047] The limiter 205 is disposed on the inner side of the first edge portion 207 and extends to the top surface of the first edge portion 207, or disposed on the inner side of the root portion 201 and extends to the top surface of the root portion 201. The top surface of the limiter 205 is higher than the top surface of the first edge portion 207 and the top surface of the root portion 201, and is used to place the wafer to slide onto the top surface of the first edge portion 207 or the top surface of the root portion 201.
[0048] like Figure 4 As shown, the limiter 205 includes a first mounting part 209 and a second insertion part 210.
[0049] The first mounting portion 209 is fixedly mounted on the first edge portion 207 or the root portion 201; the inner side of the first mounting portion 209 is located at the same level as or further inside the inner side of the corresponding first edge portion 207 or the inner side of the root portion 201; the top surface of the first mounting portion 209 is higher than the top surface of the first edge portion 207 or the root portion 201.
[0050] The first mounting part 209 is provided with a second hole 211.
[0051] The second insertion part 210 is fixed to the first mounting part 209 by being inserted into the second hole 211, and after the second insertion part 210 is fixed to the first mounting part 209, the top surface of the second insertion part 210 is higher than or level with the top surface of the first mounting part 209.
[0052] The first mounting portion 209 is integrally formed on the first edge portion 207 or the root portion 201. Alternatively, the first mounting portion 209 is fixed to the first edge portion 207 or the root portion 201 by a fixing device; the fixing device may be, for example, a screw or a snap-fit.
[0053] In this embodiment of the invention, the material of the second insertion portion 210 includes PEEK plastic.
[0054] In some embodiments, the first mounting portion 209 is made of PEEK plastic. The root portion 201 is made of PEEK plastic; the wafer support portion is made of PEEK plastic. In other embodiments, the materials of the first mounting portion 209, the root portion 201, and the wafer support portion can also be selected according to actual needs, for example, ceramic.
[0055] In this embodiment of the invention, the number of support pads 204 is six or more, with at least two support pads 204 provided on each of the side support forks 202 and at least two support pads 204 provided on the bottom support crossbar 203. For example, Figure 2 The image shows six of the aforementioned support pads 204.
[0056] In this embodiment of the invention, at least one limiter 205 is provided on each of the first edge portions 207, and at least two limiters 205 are provided on the root portion 201. Figure 2 As shown, a limiter 205 is provided on each of the first edge portions 207; by Figure 3 As shown, two limiters 205 are provided on the root 201.
[0057] In this embodiment of the invention, the root portion 201 is provided with a plurality of screw holes 206 for screws to pass through to fix the wafer transfer arm.
[0058] In some embodiments, the wafer transfer arm is mounted on a robot in the transfer cavity.
[0059] The robotic arm is used to transfer the wafer between the load lock cavity and the process cavity.
[0060] In this embodiment of the invention, the number of support pads 204 is set according to the magnitude of the total static friction force required to prevent slippage. This ensures that slippage will not occur even after a set number of wafers have been transferred. In this embodiment of the invention, the set number of wafers is usually greater than or equal to the number of wafers corresponding to normal preventive maintenance (PM). Therefore, this embodiment of the invention can prevent slippage caused by the increasing number of wafers transferred and the accumulation of contamination on the support pads 204, which leads to a decrease in friction, during each preventive maintenance cycle. Thus, this embodiment of the invention can eliminate wafer slippage.
[0061] Due to slippage, yield assessment becomes somewhat difficult, affecting the yield rate. In more serious cases, slippage may even generate fragments, which not only directly scraps the product but also affects the equipment, requiring downtime for repairs, increasing maintenance costs. More importantly, it reduces the equipment's uptime, impacting output. Therefore, the embodiments of the present invention can prevent product problems, improve product quality and yield, reduce equipment maintenance costs and time, and increase output.
[0062] The structure of the support pad 204 in this embodiment of the invention facilitates installation and disassembly, and makes cleaning and maintenance convenient.
[0063] The embodiments of the present invention can further include a limiter 205, which can further prevent the wafer from slipping.
[0064] The structure of the limiter 205 in this embodiment of the invention is also conducive to installation and disassembly, and convenient for cleaning and maintenance.
[0065] This invention ensures wafer position safety by adding pads and limiters. For example, increasing the number of pads from 3 to 6 in the existing structure can improve static friction. At the same time, lengthening the arm and adding 4 limiters around the wafer can control the wafer position, thereby effectively solving the wafer shift problem.
[0066] The present invention has been described in detail above through specific embodiments, but these are not intended to limit the invention. Many modifications and improvements can be made by those skilled in the art without departing from the principles of the invention, and these should also be considered within the scope of protection of the present invention.
Claims
1. A wafer transfer arm, characterized in that, include: Root and wafer support; The first end of the wafer support portion is disposed on the root portion; From the first end to the second end of the wafer support portion, the wafer support portion has a fork-shaped structure, including two symmetrical side support forks. The two side support forks are connected at the first end of the wafer support portion to form a bottom support crossbar. An opening area is formed between the side support forks and the bottom support crossbar. The top surface of the side support fork and the top surface of the bottom support crossbar are a single flat surface and serve as a wafer support surface. Multiple support pads are fixedly disposed on the wafer support surface. The support pads are symmetrically distributed from left to right. The top surface of each support pad is higher than the wafer support surface. The support pads are used to provide static friction for the wafer placed on the wafer support surface. The number of support pads is sufficient to ensure that the total static friction provided by each support pad still prevents wafer slippage after a set number of wafers have been transferred.
2. The wafer transfer arm as described in claim 1, characterized in that: A plurality of first holes are provided on the wafer support surface; each support pad has a first bottom portion that matches the first hole and a second top portion located above the first bottom portion. The support pad is fixed by inserting the first bottom portion into the first hole, and the second top portion is located above the top surface of the first hole and extends to the wafer support surface outside the first hole.
3. The wafer transfer arm as described in claim 2, characterized in that: The material of the support pad includes PEEK plastic.
4. The wafer transfer arm as described in claim 2, characterized in that: Each of the side support forks has a first edge portion at the edge of the second end of its top surface that is higher than the wafer support surface; The top surface of the root is higher than the wafer support surface; The inner side of the first edge portion and the inner side of the root portion are both sides close to the wafer support surface. The inner side of the first edge portion and the inner side of the root portion are both arcs located on the first circle. The size of the first circle matches that of the wafer.
5. The wafer transfer arm as described in claim 4, characterized in that, Also includes: Multiple limit switches; The limiter is disposed on the inner side of the first edge portion and extends to the top surface of the first edge portion, or disposed on the inner side of the root portion and extends to the top surface of the root portion. The top surface of the limiter is higher than the top surface of the first edge portion and the top surface of the root portion, and is used to place the wafer to slide onto the top surface of the first edge portion or the top surface of the root portion.
6. The wafer transfer arm as described in claim 5, characterized in that: The limiter includes a first mounting part and a second insertion part; The first mounting part is fixedly mounted on the first edge part or the root part; the inner side of the first mounting part is located at the same level as or further inward of the inner side of the corresponding first edge part or the inner side of the root part; the top surface of the first mounting part is higher than the top surface of the first edge part or the root part. The first mounting part is provided with a second hole; The second insertion part is fixed to the first mounting part by being inserted into the second hole, and after the second insertion part is fixed to the first mounting part, the top surface of the second insertion part is higher than or level with the top surface of the first mounting part.
7. The wafer transfer arm as described in claim 6, characterized in that: The first mounting part is integrally formed on the first edge portion or the root portion; or, the first mounting part is fixed to the first edge portion or the root portion by a fixing device.
8. The wafer transfer arm as described in claim 6, characterized in that: The material of the second insertion part includes PEEK plastic.
9. The wafer transfer arm as described in claim 6, characterized in that: The material of the first mounting part includes PEEK plastic.
10. The wafer transfer arm as described in claim 1, characterized in that: The root portion is made of PEEK plastic; the wafer support portion is made of PEEK plastic.
11. The wafer transfer arm as described in claim 1, characterized in that: The number of support pads is 6 or more, with at least 2 support pads provided on each of the side support forks and at least 2 support pads provided on the bottom support crossbar.
12. The wafer transfer arm as described in claim 5, characterized in that: At least one of the limiting devices is provided on each of the first edge portions, and at least two of the limiting devices are provided on the root portion.
13. The wafer transfer arm as described in claim 1, characterized in that: The root is provided with multiple screw holes for screws to be inserted to fix the wafer transfer arm.
14. The wafer transfer arm as described in claim 13, characterized in that: The wafer transfer arm is mounted on the robotic arm of the transfer chamber.
15. The wafer transfer arm as described in claim 14, characterized in that: The robotic arm is used to transfer the wafer between the load lock cavity and the process cavity.