Vibration-resistant structure of electronic component and heat medium heating device provided with the same

Abstract

Provided is a vibration-resistant structure of an electronic component that improves the vibration resistance and heat dissipation of the electronic component. A capacitor (26) is used in a heat medium heating device (1) that has a heat medium flow path formed in a flow path portion (6, 7) of a case (2) and an electric heater that heats a heat medium flowing in the heat medium flow path, for controlling the electric heater, and a vibration-resistant structure of the capacitor (26) has a wall portion (51) formed in the case (2) that surrounds the periphery of the capacitor (26), and a heat dissipation material (52) filled between the wall portion (51) and the capacitor (26).

Description

Technical Field

[0001] The present invention relates to a vibration-resistant structure of electronic components used in a heat medium heating device that heats a heat medium flowing in a heat medium flow path constituting a housing by means of an electric heater, and a heat medium heating device having the same. Background Technology

[0002] Conventionally, heat transfer medium heating devices used in vehicle interior air conditioning systems, etc., form a heat transfer medium flow path within a housing. A cylindrical electric heater, referred to as a cylindrical heater, is installed within this flow path to heat the heat transfer medium flowing through it. In this case, for example, two heat transfer medium flow paths are provided within the housing, connected at one end by a connecting flow path. An electric heater is installed in each heat transfer medium flow path. After heating the heat transfer medium flowing into the heat transfer medium inlet at the other end of one heat transfer medium flow path, the heat transfer medium flows out from the heat transfer medium outlet at the other end of the other heat transfer medium flow path (for example, see Patent Document 1). Existing technical documents Patent documents

[0003] Patent Document 1: Japanese Patent Publication No. 2016-536197 Summary of the Invention The problem that the invention aims to solve

[0004] In recent years, there has been a demand for heating devices that can handle high voltages (e.g., 800V), leading to the envisioning of heating devices that can operate at higher voltage levels than before. To cope with such high voltages, the current and voltage applied to electronic components such as IGBTs, capacitors (film capacitors), and coils used to control the electric heater have also increased, resulting in larger electronic components capable of handling such high voltages.

[0005] On the other hand, it is envisioned that the heat medium heating device is mounted on a vehicle, thus requiring high vibration resistance. However, as mentioned above, if the electronic components become larger, the height of the electronic components relative to the control board increases, and the distance from the control board to the center of gravity of the electronic components becomes larger, making them more prone to vibration. Therefore, the strength of the joint between the electronic components and the control board becomes a problem.

[0006] Furthermore, as electronic components become larger, the heat generated also increases. In the past, heat was dissipated through the air, so in high ambient temperatures, this can cause the temperature to rise and even lead to damage.

[0007] The present invention was made to solve the above-mentioned prior art problems, and its purpose is to provide a vibration-resistant structure for electronic components that improves the vibration resistance and heat dissipation of electronic components, as well as a heating device for a heat medium having the same. Methods for solving problems

[0008] The present invention provides a vibration-resistant structure for an electronic component, characterized in that the electronic component is used in a heat medium heating device having a heat medium flow path formed in a housing and an electric heater for heating the heat medium flowing in the heat medium flow path, for controlling the electric heater, the vibration-resistant structure of the electronic component includes: a wall formed in the housing surrounding the electronic component; and a heat dissipation material filled between the wall and the electronic component.

[0009] The vibration-resistant structure of the electronic component of the invention of technical solution 2 is characterized in that, in the above invention, the heat dissipation material is a two-component curable resin.

[0010] The vibration-resistant structure of the electronic component of the invention of technical solution 3 is characterized in that, in the invention of technical solution 1, the electronic component is a capacitor.

[0011] The vibration-resistant structure of the electronic component of the invention of technical solution 4 is characterized in that, in the invention of technical solution 1, the electronic component is a coil.

[0012] The heating device for the heat medium of technical solution 5 is characterized by comprising: a vibration-resistant structure for the electronic components of the above-mentioned inventions; at least two heat medium flow paths arranged side by side in the housing; a connecting flow path connecting one end of each heat medium flow path; a heat medium inflow portion formed at the other end of one heat medium flow path; a heat medium outflow portion formed at the other end of the other heat medium flow path; an electric heater; and a control board disposed in the housing, on which the electronic components are mounted, wherein each heat medium flow path is arranged separately from each other, and the electronic components are disposed in the interval between each heat medium flow path.

[0013] The feature of the heating device for the heat medium of the invention of technical solution 6 is that, in the above invention, the wall is capable of heat exchange with the heat medium flowing in each heat medium flow path and the connecting flow path.

[0014] The heating device for the heat medium of the invention described in technical solution 7 is characterized in that, in the above invention, the housing includes: at least two flow path sections that form heat medium flow paths inside; and a connecting section that forms a connecting flow path inside, and the wall section is integrally formed with the flow path section and / or the connecting section. Invention Effects

[0015] According to the present invention, an electronic component is used in a heat medium heating device comprising a heat medium flow path formed within a housing and an electric heater for heating the heat medium flowing in the heat medium flow path, for controlling the electric heater. In the vibration-resistant structure of the electronic component, a wall is formed around the housing, and a heat-dissipating material is filled between the wall and the electronic component. Therefore, even with large electronic components, vibration resistance can be improved. This also prevents damage to the joint between the electronic component and the control board due to vibration, making it particularly suitable for vehicle-mounted heat medium heating devices requiring high vibration resistance.

[0016] In addition, by filling the space between the wall and the electronic components with heat dissipation material, the amount of heat dissipation from the electronic components can be ensured, so that even when the electronic components are larger and the amount of heat dissipation is increased, the temperature can be maintained within an appropriate range.

[0017] In this case, as in the invention of technical solution 2, a two-component curable resin with high thermal conductivity can be used as the heat dissipation material. In particular, by using a two-component curable resin, the position of electronic components can be easily adjusted immediately after the heat dissipation material is filled, and the joint between the electronic components and the control board can be prevented from breaking due to vibration after curing, thus improving assemblability and vibration resistance. Furthermore, by using a two-component curable resin, the holding time until curing is shortened, thereby increasing the productivity of the device.

[0018] Furthermore, as electronic components, for example, a capacitor can be cited as in the invention of technical solution 3, and a coil can be cited as in the invention of technical solution 4.

[0019] Furthermore, the heat medium heating device of technical solution 5 includes: a vibration-resistant structure for the electronic components of the above-mentioned inventions; at least two heat medium flow paths arranged side by side in the housing; a connecting flow path connecting one end of each heat medium flow path; a heat medium inlet portion formed at the other end of one heat medium flow path; a heat medium outlet portion formed at the other end of the other heat medium flow path; an electric heater; and a control board, which is provided in the housing and has electronic components installed thereon. Each heat medium flow path is arranged separately from each other, thus preventing heat exchange with the heat medium flowing in the heat medium inlet portion and the heat medium outlet portion.

[0020] In particular, since the electronic components are arranged in the intervals between the heat medium flow paths, the ineffective space between the heat medium flow paths can be effectively utilized for the arrangement of electronic components used to control the electric heater, thereby enabling the miniaturization of the heat medium heating device.

[0021] Furthermore, as in the invention of technical solution 6, if the wall portion is made capable of heat exchange with the heat medium flowing in each heat medium flow path and the connecting flow path, then in the three-way space surrounded by each heat medium flow path and the connecting flow path, the electronic component can exchange heat with the heat medium through the heat dissipation material and the wall portion, and the electronic component can be reliably cooled to below the allowable temperature.

[0022] In this case, for example, as in the invention of technical solution 7, all or any one of the at least two flow path portions provided in the housing and forming a heat medium flow path inside, and the connecting portion forming a connecting flow path inside, are integrally formed with the wall portion, thereby further improving the heat exchange between the electronic components and the heat medium. Attached Figure Description

[0023] Figure 1 This is a perspective view showing the appearance of a heat medium heating device according to an embodiment of the vibration-resistant structure of the electronic component to which the present invention is applied. Figure 2 It is used for explanation Figure 1 A top sectional view of the flow path of the heat medium within the heat medium heating device 1. Figure 3 It means Figure 1 A top view of the interior of a heat medium heating device. Figure 4 Is Figure 3 The image shows a top view of the control board of the heat medium heating device. Figure 5 yes Figure 1 A longitudinal sectional side view of a heat medium heating device. Figure 6 yes Figure 1 The circuit block diagram of the control device for the heat medium heating device. Detailed Implementation

[0024] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Figure 1 This is a perspective view showing the appearance of a heat medium heating device 1 according to an embodiment of the vibration-resistant structure of the electronic component of the present invention. Figure 2 This is a top sectional view illustrating the flow of the heat medium within the heat medium heating device 1. Figure 3 It means it has been disassembled. Figure 1 A top view of the interior of the main body 3 of the casing 2, with the cover 4 of the heating medium heating device 1 in its state. Figure 4 It's X-ray vision. Figure 3 The diagram of the control board 21, Figure 5 This is a longitudinal sectional side view of the heat medium heating device 1. Figure 6 This is a circuit block diagram of the control device 31.

[0025] (1) Heating device for heat medium 1 The heat medium heating device 1 of this embodiment is used for air conditioning inside a vehicle (not shown). A housing 2 is constructed from a main body 3 made of metal with high thermal conductivity, such as iron or aluminum, and a cover 4, also made of metal, mounted on the main body 3. In this embodiment, two flow path sections 6 and 7 (also made of metal) are separated from each other by a gap 8 and are arranged within the main body 3 of the housing 2, forming part of the main body 3. Heat medium flow paths 9 and 11 are respectively formed inside them. That is, each heat medium flow path 9 and 11 is arranged side-by-side within the housing 2, separated by a gap 8.

[0026] The connecting portion 13, which has an internal connecting flow path 12, is connected to one end of the flow path portions 6 and 7, forming part of the main body 3, and one end of the two heat medium flow paths 9 and 11 is connected through the connecting flow path 12. Furthermore, the heat medium inflow portion 16 is connected to the other end of one of the heat medium flow paths 9, and the heat medium outflow portion 17 is connected to the other end of the other heat medium flow path 11.

[0027] In the figures, 18 and 19 are rod-shaped electric heaters (heating elements) made of cylindrical heaters (cylindrical heaters) in the embodiments. The electric heater (electric heater 1) 18 is inserted into one of the heat medium flow paths 9 at a distance from the inner surface of the flow path 6, and the electric heater (electric heater 2) 19 is inserted into the other of the heat medium flow paths 11 at a distance from the inner surface of the flow path 7.

[0028] A control board 21 is installed on the side of the cover 4 of each flow path section 6, 7 within the main body 3. Power switching elements 22 (IGBT1) for controlling the energization of the electric heater 18, power switching elements 23 (IGBT2) for controlling the energization of the electric heater 19, and power switching elements 24 (IGBT3) for adjusting the overall power of each electric heater 18, 19 are mounted on this control board 21. Furthermore, in this embodiment, the aforementioned power switching elements 22-24 are composed of IGBTs.

[0029] Furthermore, the control board 21 also includes a capacitor 26 (film capacitor) which serves as an electronic component constituting the noise filter 25, and a choke coil 27 which is also an electronic component. These capacitors 26 and choke coils 27 are electronic components larger than the power switching elements 22-24. These power switching elements 22-24, capacitors 26, choke coils 27, etc., constitute a control device 31 for controlling the electric heaters 18, 19, etc., of the thermal medium heating device 1. Figure 6 ).

[0030] Furthermore, each power switching element 22-24 is mounted on the surface of each flow path portion 6, 7 of the control board 21, and is mounted in a manner that allows heat exchange with the flow path portion 6. Thus, each power switching element 22-24 is configured to exchange heat with the hot medium flowing within the hot medium flow path 9. Furthermore, compared to the other power switching elements 22, 23, the power switching element 24 (a specific power switching element) is positioned upstream of the refrigerant flow. Figure 3 ).

[0031] Furthermore, capacitor 26 and choke coil 27 are also mounted on the sides of each flow path section 6 and 7 of the control board 21, and are inserted into the gap 8 between flow path section 6 (heat medium flow path 9) and flow path section 7 (heat medium flow path 11). Figures 3-5 ).

[0032] (2) Vibration-resistant structure of capacitor 26 In the case of an embodiment, such as Figures 3-5 As shown, a wall portion 51 (made of metal) is erected from the main body 3 at a position corresponding to the periphery of the capacitor 26 within the aforementioned interval 8. This wall portion 51 is integrally formed with the main body 3. In the embodiment, this wall portion 51 includes a longitudinal wall 51A on the flow path 6 side, a longitudinal wall 51B on the communication portion 13 side that is continuous with one end of the longitudinal wall 51A, a longitudinal wall 51C on the flow path 7 side that is continuous with one end of the longitudinal wall 51B, and a longitudinal wall 51D that connects one end of the longitudinal wall 51C to the other end of the longitudinal wall 51A. The control substrate 21 side of this wall portion 51 is open.

[0033] Furthermore, the wall portion 51 has an inner dimension that is sufficiently spaced to surround the capacitor 26. The outer surface of the longitudinal wall 51A abuts against the outer surface of the flow path portion 6 in a manner that allows for heat exchange, and the outer surface of the longitudinal wall 51B abuts against the outer surface of the connecting portion 13 in a manner that allows for heat exchange, and the longitudinal wall 51C abuts against the outer surface of the flow path portion 7 in a manner that allows for heat exchange, and the longitudinal wall 51C abuts against the outer surface of the flow path portion 7 in a manner that allows for heat exchange.

[0034] The capacitor 26 is inserted into the wall 51 through the opening in the wall 51, but a heat-dissipating material 52 is filled between the capacitor 26 and the wall 51. In this embodiment, the heat-dissipating material 52 is made of a two-component curable resin such as epoxy resin and has high conductivity.

[0035] When assembling the heat transfer medium heating device 1, firstly, a liquid (flowable) of one component of the heat dissipation material 52 is injected into the wall portion 51. Then, when mounting the control board 21 onto the main body 3, a capacitor 26 is inserted into the wall portion 51 and immersed in the heat dissipation material 52 injected into the wall portion 51. Next, the other component of the heat dissipation material 52 is injected into the wall portion 51, causing the heat dissipation material 52 to solidify. Thus, the capacitor 26 is embedded within the heat dissipation material 52, surrounded by the heat dissipation material 52 and the wall portion 51.

[0036] Alternatively, as another assembly method, the heat dissipation material 52, which is a mixture of two liquids, can be injected into the wall portion 51, and the capacitor 26 can be inserted into the wall portion 51 before curing, so that the capacitor 26 is buried in the heat dissipation material 52.

[0037] If a two-component curable resin is used as the heat dissipation material 52, it can cure in a shorter time even at room temperature compared to a single-component liquid resin. That is, by using a two-component curable resin as the heat dissipation material 52, the position of the capacitor 26 can be easily adjusted immediately after the heat dissipation material 52 is filled, and the connection between the capacitor 26 and the control substrate 21 can be prevented from breaking due to vibration after curing, thus improving assemblability and vibration resistance. Furthermore, by using a two-component curable resin, the holding time until curing is shortened, thereby increasing the productivity of the heat transfer medium heating device 1.

[0038] (3) Control device 31 then, Figure 6 This represents the circuit block of control device 31. The noise filter 25 is connected to a vehicle battery (DC power supply) not shown. Power switch element 22 and electric heater 18 are connected in series, and power switch element 23 and electric heater 19 are connected in series. These two series-connected circuits are connected in parallel. Power switch element 24 is connected in series with the above-mentioned parallel circuit, and current sensor 32 is connected in series with power switch element 24.

[0039] Furthermore, the power switching elements 22 and 23 are configured to be connected to the positive side of the noise filter 25, and the current sensor 32 is connected to the negative side. As a result, the currents flowing in the two power switching elements 22 and 23 merge and flow into the power switching element 24.

[0040] exist Figure 6 In this configuration, 36 is a control unit comprised of a microcomputer, and drivers 37, 38, and 39 are connected to the output of this control unit 36. Driver 37 is connected to the gate of power switching element 22, and driver 38 is connected to the gate of power switching element 23. Furthermore, driver 39 is connected to the gate of power switching element 24.

[0041] The output of the aforementioned current sensor 32 is input to the input terminal of the control unit 36, as are the outputs of the inlet temperature sensor 41 and the outlet temperature sensor 42. The inlet temperature sensor 41 detects the temperature of the hot medium flowing into the hot medium flow path 9 from the hot medium inlet section 16, and the outlet temperature sensor 42 detects the temperature of the hot medium flowing out of the hot medium outlet section 17. Furthermore, in this application, the hot medium flowing into the hot medium inlet section 16 refers to the hot medium just before entering or immediately after entering the hot medium inlet section 16, and the hot medium flowing out of the hot medium outlet section 17 refers to the hot medium just before exiting or immediately after exiting the hot medium outlet section 17.

[0042] (4) Operation of the heating medium heating device 1 Based on the above structure, the operation of the heat medium heating device 1 will now be explained. Furthermore, the heat medium inlet 16 is connected to a heat medium circuit (not shown), and a pump (not shown) causes the heat medium (water in this embodiment) to flow from the heat medium inlet 16 into the heat medium flow path 9. The heat medium flowing into the heat medium flow path 9 flows through the connecting flow path 12 into the heat medium flow path 11, and then flows out from the heat medium outlet 17 into the aforementioned heat medium circuit.

[0043] On the other hand, the control unit 36 ​​of the control device 31 controls the switching of each power switching element 22-24 via each driver 37-39 based on the outputs of the inlet temperature sensor 41, the outlet temperature sensor 42, and the current sensor 32. As a result, each electric heater 18 and 19 is energized, and the electric heaters 18 and 19 generate heat. Therefore, the heat medium flowing into the heat medium flow path 9 is heated as it passes around the electric heater 18, and is further heated as it passes around the electric heater 19 after entering the heat medium flow path 11.

[0044] A heater core, installed in the vehicle's HV unit, is connected to the aforementioned heat medium circuit. The heat medium, heated by the heat medium heating device 1, circulates within this heater core. Air supplied to the vehicle's interior passes through the heater core, thereby heating the interior.

[0045] The control unit 36 ​​controls the switching of power switching elements 22 and 23 based on the temperature of the inflowing heat medium detected by the inlet temperature sensor 41 and the temperature of the outflowing heat medium detected by the outlet temperature sensor 42, thereby controlling the energization to each electric heater 18 and 19. The currents flowing in these power switching elements 22 and 23 (electric heaters 18 and 19) converge and flow into the power switching element (specific power switching element) 24. The control unit 36 ​​controls the switching of the power switching element 24 based on the converged current value detected by the current sensor 32, thereby adjusting the overall power supply to each electric heater 18 and 19.

[0046] Here, the current flowing in each power switching element 22, 23 merges and flows to the power switching element 24 (a specific power switching element). Therefore, the power switching element 24 generates more heat than these power switching elements 22, 23, and generates the most heat. However, the power switching element 24 is positioned upstream of the other power switching elements 22, 23 relative to the flow of the heat medium, so it exchanges heat with the heat medium with the lowest temperature flowing into the heat medium flow path 9.

[0047] Thus, the heat generated by the power switching element 24, which generates the most heat, is successfully transferred to the heat medium, effectively cooling the power switching element 24, and the temperature of the heat medium rises effectively due to the heat from the power switching element 24. Additionally, the heat generated by the power switching elements 22 and 23 is also transferred to the heat medium downstream of the power switching element 24, thus cooling the power switching elements 22 and 23, and causing the heat medium to experience a further temperature increase.

[0048] (5) Effects resulting from the configuration of heat medium flow paths 9 and 11 and power switching elements 22-24 Through the above methods, the heat medium can be effectively heated, and all power switching elements 22-24 can be maintained in an appropriate temperature range, thus preventing malfunctions of power switching elements 22-24.

[0049] That is, by configuring the power switching elements 22-24 to be in a heat exchange relationship with the heat medium, the heat generated by the power switching elements 22-24 can be used to heat the heat medium, while the power switching elements 22-24 themselves are cooled.

[0050] Furthermore, as described above, the heat medium heating device 1 has each heat medium flow path 9 and 11 arranged separately from each other, so the two heat medium flow paths 9 and 11 do not exchange heat with each other. As in the embodiment, when the temperature of the heat medium flowing in from the heat medium inlet 16 is detected by the inlet temperature sensor 41 and the electric heaters 18 and 19 are controlled based on this, the adverse situation of detecting the wrong temperature can also be avoided.

[0051] Furthermore, as in the embodiment, electric heaters 18 and 19 are respectively arranged in each heat medium flow path 9 and 11 to heat the heat medium flowing in from the heat medium inlet 16 and flow out from the heat medium outlet 17. In this case, the undesirable situation of the outflowing refrigerant being cooled by the inflowing refrigerant can also be avoided.

[0052] (6) The configuration of capacitor 26 and the effect of vibration-resistant structure Furthermore, a control board 21, which houses electronic components that constitute a control device 31 for controlling electric heaters 18 and 19, is installed inside the housing 2. Electronic components that constitute the noise filter 25 of the control board 21, namely capacitor 26 and choke coil 27, are arranged in the interval 8 between each heat medium flow path 9 and 11. Therefore, the ineffective space (interval 8) between each heat medium flow path 9 and 11 can be effectively utilized for the arrangement of electronic components, and miniaturization of the heat medium heating device 1 can be achieved.

[0053] Furthermore, in this embodiment, electronic components larger than the power switching elements 22-24, namely the capacitor 26 and the choke coil 27, are arranged within the interval 8, thus effectively achieving overall miniaturization of the device. Moreover, even if the capacitor 26 and the choke coil 27 need to be modified according to required specifications, the heating medium 1 will not be enlarged, as they can be housed within the interval 8, thus increasing design flexibility.

[0054] In particular, in this invention, a wall 51 is formed in the housing 2 around a capacitor 26, which is an example of an electronic component, and a heat-dissipating material 52 is filled between the wall 51 and the capacitor 26. Therefore, even with a large capacitor 26, vibration resistance can be improved. As a result, the joint between the capacitor 26 and the control board 21 can be prevented from breaking due to vibration, which is extremely suitable for vehicle-mounted heat transfer medium heating devices 1 that require high vibration resistance.

[0055] Furthermore, the heat dissipation material 52 filled between the wall 51 and the capacitor 26 can also ensure the amount of heat dissipation from the capacitor 26, so that even when the capacitor 26 is enlarged and the amount of heat dissipation is increased, it can still be maintained in an appropriate temperature range.

[0056] In this configuration, the longitudinal walls 51A, 51C, and 51B constituting the wall portion 51 are in a heat exchange relationship with the flow path portions 6 and 7 and the connecting portion 13, enabling them to exchange heat with the heat medium flowing in these heat medium flow paths 9, 11, and the connecting flow path 12. Thus, within the three-sided enclosure of each heat medium flow path 9, 11, and the connecting flow path 12, the capacitor 26 can exchange heat with the heat medium via the heat dissipation material 52 and the wall portion 51, reliably cooling the capacitor 26 to below the allowable temperature.

[0057] In addition, in this embodiment, capacitor 26 is used as an electronic component, but it is not limited to this. The vibration-resistant structure of the present invention is also effective for choke coil 27 (electronic component).

[0058] Furthermore, in this embodiment, the wall portion 51 is integrally formed with the main body 3, but it is not limited to this. The longitudinal wall 51A of the wall portion 51 may also be integrally formed with the flow path portion 6, the longitudinal wall 51B with the connecting portion 13, and the longitudinal wall 51C with the flow path portion 7. According to this structure, the heat exchange performance between the capacitor 26 and the heat medium can be further improved.

[0059] Furthermore, in this embodiment, the capacitor 26 and the choke coil 27 are arranged within the interval 8, but only the capacitor 26 may be arranged. Similarly, if a vibration-resistant structure is applied to the choke coil 27, only the choke coil 27 may be arranged. Moreover, in this embodiment, an inlet temperature sensor 41 and an outlet temperature sensor 42 are provided to control the energization of the electric heaters 18 and 19, but control may also be achieved using only the inlet temperature sensor 41 or only the outlet temperature sensor 42.

[0060] Furthermore, while an example with two thermal dielectric flow paths 9 and 11 has been described in the embodiment, the present invention is also effective when more thermal dielectric flow paths are constructed and configured separately from each other. Additionally, while the power switching elements 22-24 are constructed from IGBTs in the embodiment, they may also be constructed from MOSFETs or the like.

[0061] Furthermore, in the embodiments, a heat medium heating device for an air conditioner in a vehicle is used as an example for illustration, but it is not limited thereto. The vibration-resistant structure of the present invention is effective for heat medium heating devices in various heating systems. Explanation of reference numerals in the attached figures:

[0062] 1: Heating device for heat transfer medium; 2: Housing; 8: Spacing; 9, 11: Heat transfer medium flow path; 12: Connecting flow path; 16: Heat transfer medium inlet; 17: Heat transfer medium outlet; 18, 19: Electric heater; 21: Control board; 22~24: Power switching element; 25: Noise filter; 26: Capacitor (electronic component); 27: Choke coil (electronic component); 31: Control device; 32: Current sensor; 36: Control unit; 41: Inlet temperature sensor; 42: Outlet temperature sensor; 51: Wall; 51A~51D: Longitudinal wall; 52: Heat dissipation material.

Claims

1. A vibration-resistant structure for an electronic component, characterized in that, The electronic component is used in a heat medium heating device comprising a heat medium flow path formed within a housing and an electric heater for heating the heat medium flowing in the heat medium flow path, and is used to control the electric heater. The vibration-resistant structure of the electronic component includes: A wall portion, formed in the housing, surrounds the electronic components; and Heat dissipation material is filled between the wall and the electronic component.

2. The vibration-resistant structure of the electronic component according to claim 1, characterized in that, The heat dissipation material is a two-component curing resin.

3. The vibration-resistant structure of the electronic component according to claim 1, characterized in that, The electronic component is a capacitor.

4. The vibration-resistant structure of the electronic component according to claim 1, characterized in that, The electronic component is a coil.

5. A heating device for a heat transfer medium, comprising the vibration-resistant structure of the electronic component as described in any one of claims 1 to 4, characterized in that, The heating medium device comprises: at least two heat medium flow paths arranged side-by-side inside the housing; a connecting flow path connecting one end of each heat medium flow path; a heat medium inlet portion formed at the other end of one of the heat medium flow paths; a heat medium outlet portion formed at the other end of the other heat medium flow path; an electric heater; and a control board disposed inside the housing, on which the electronic components are mounted. Each of the aforementioned heat medium flow paths is configured separately from the others. The electronic components are arranged in intervals between the heat medium flow paths.

6. The heating device for the heat medium according to claim 5, characterized in that, The wall portion is capable of exchanging heat with the heat medium flowing in each of the heat medium flow paths and the connecting flow paths.

7. The heating device for the heat medium according to claim 6, characterized in that, The housing includes: at least two flow path sections that internally form the heat medium flow path; and a connecting section that internally forms the connecting flow path. The wall portion is integrally formed with the flow path portion and / or the connecting portion.

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