Thermally conductive gasket composition, method of making and use thereof
By constructing a three-dimensional thermally conductive network using ternary mixed fillers, the problems of filler dispersion and thermal conductivity in existing thermal pad compositions are solved, achieving high-efficiency thermal conductivity and flexibility. This makes the material suitable for thermal management of high-power electronic devices and has broad application prospects.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- XIAN BOXIN NEW MATERIAL TECH CO LTD
- Filing Date
- 2026-04-30
- Publication Date
- 2026-07-10
AI Technical Summary
Existing compositions for thermal pads suffer from problems such as poor filler dispersion, high interfacial thermal resistance, discontinuous thermal conductive network, and poor processing flowability. Furthermore, the preparation process is complex, making it difficult to achieve large-scale, low-cost production.
A unique three-dimensional thermally conductive network is constructed by using a ternary mixed filler of one-dimensional silicon nitride fiber, zero-dimensional spherical alumina and two-dimensional sheet boron nitride, through surface modification with silane coupling agent and multi-particle size distribution. Combined with a silicone rubber matrix, it forms an efficient thermally conductive path and is formed by mechanical mixing and hot pressing molding process.
With a low total filler content, high thermal conductivity (6.0~9.5 W·m⁻¹·K⁻¹), excellent flexibility, good processing flowability and high electrical insulation of thermal pads are achieved, making them suitable for thermal management of high-power electronic devices, and the process is simple and suitable for mass production.
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