Computing system and cooling method

Abstract

A computing system includes an immersion cooling system and a plurality of computing devices. Each computing device has multiple heat-generating components. The immersion cooling system includes a coolant distribution unit fluidly coupled to a cooling tank. The coolant distribution unit circulates coolant through the cooling tank. The cooling tank includes a plurality of device cooling guides immersed in the coolant. Each device cooling guide includes a solenoid valve and an open channel. The solenoid valve controls the flow of coolant through the device cooling guide. The open channel is structurally coupled to and fluidly communicates with the solenoid valve. The open channel is configured to accommodate a computing device and direct coolant to a cooling path through the computing device, optimizing immersion cooling by minimizing or eliminating coolant bypass flow.

Description

Technical Field

[0001] This invention relates generally to computing systems, and more particularly to a flow optimization system and method for immersion cooling of computing systems. Background Technology

[0002] As new technologies rapidly increase the efficiency and power of computing systems, energy consumption has become a major challenge for thermal management. Key components used in Internet technology (IT), such as central processing units (CPUs) and graphics processing units (GPUs), are rapidly exceeding 1,500 watts in power. Existing airflow cooling technologies may be insufficient to handle these power-intensive components. Immersion cooling, particularly open bath immersion cooling, has emerged as a high-efficiency technology to improve the overall performance of Internet components and the system. In most open bath systems, a coolant distribution unit circulates coolant through a cooling bath. Within the bath, heat-generating Internet components, such as servers, are immersed in coolant, which is typically guided by a perforated lower plate. In these existing systems, most cooling baths do not provide individual channels for Internet components. Therefore, uneven flow and bypass flows occur as coolant passes through the Internet components, negatively impacting the overall cooling efficiency of the system. Summary of the Invention

[0003] The terms used in the embodiments and similar terms (e.g., implementation, configuration, feature, example, and option) are intended to refer broadly to all objectives of this disclosure and the following claims. Several statements containing these terms should be understood not to limit the objectives described herein or to limit the meaning or scope of the following claims. The embodiments of this disclosure covered herein are defined by the following claims and are not part of the scope of this invention. This summary is a high-level overview of many features of this disclosure and introduces some concepts further described in the following implementation paragraphs. This summary is not intended to identify key or essential features of the objectives of the claims, nor is it intended to be used independently to determine the scope of the objectives of the claims. These objectives should be understood through reference to appropriate portions of the complete specification of this disclosure, any or all of the accompanying drawings, and each claim.

[0004] According to certain features of this disclosure, a computing system with immersion cooling includes one or more computing devices. Each of the one or more computing devices has at least one heat-generating component. The computing system also includes a coolant distribution unit and a cooling tank. The coolant distribution unit circulates coolant through the cooling tank. The cooling tank is fluidly coupled to the coolant distribution unit to contain the coolant. The cooling tank includes one or more device cooling guides immersed in the coolant. Each of the one or more device cooling guides includes a solenoid valve and an open channel. The solenoid valve circulates coolant through the device cooling guide. The open channel is structurally coupled to and fluidly communicates with the solenoid valve. Furthermore, the open channel is designed to accommodate a corresponding computing device among the one or more computing devices and to guide the coolant to a cooling path passing through the corresponding computing device among the one or more computing devices.

[0005] According to another feature of this disclosure, a computing system includes an immersion cooling system and one or more computing devices. Each computing device has at least one heat-generating component. The immersion cooling system has a coolant distribution unit for circulating a coolant. Furthermore, the immersion cooling system has a cooling tank fluidly coupled to the coolant distribution unit to contain the coolant. Additionally, the cooling tank includes one or more device cooling guides immersed in the coolant. Each of the one or more device cooling guides includes a solenoid valve and an open channel. The solenoid valve circulates the coolant. The open channel is structurally coupled to and fluidly communicates with the solenoid valve. The open channel is configured to accommodate a corresponding computing device among the one or more computing devices. Furthermore, the open channel guides the coolant to a cooling path passing through the corresponding computing device among the one or more computing devices.

[0006] Based on a feature of the above embodiments, a cooling method is provided for cooling a computing system having one or more computing devices. The cooling method includes (i) obtaining an immersion cooling system having a coolant distribution unit and a cooling tank, wherein the cooling tank is fluidly coupled to the coolant distribution unit to contain a coolant; (ii) installing one or more device cooling guides in the cooling tank; (iii) installing a solenoid valve to each of the one or more device cooling guides; (iv) fluidly coupling the solenoid valve to an open channel of each of the one or more device cooling guides; (v) accommodating a corresponding computing device among the one or more computing devices within the open channel; and (vi) if the solenoid valve is open, coolant flows through the open channel in a cooling path through the corresponding computing device among the one or more computing devices.

[0007] The foregoing summary is not intended to present every embodiment or feature of this disclosure. Rather, it provides only examples of some novel features and characteristics set forth herein. The foregoing features and advantages, as well as other features and advantages, will become apparent from the following detailed description of representative embodiments and modes of implementation of the invention, taken in conjunction with the accompanying drawings and appended claims. Additional features of this disclosure will be apparent to those skilled in the art from the following brief description of various embodiments with reference to the accompanying drawings and the provided symbols. Attached Figure Description

[0008] This disclosure and its advantages, along with the accompanying drawings, will be better understood from the following description of exemplary embodiments in conjunction with the accompanying drawings. These drawings illustrate exemplary embodiments only and should therefore not be construed as limiting the various embodiments or claims.

[0009] Figure 1A This is a front view of a computing system having one or more computing devices with immersion cooling, based on certain features of this disclosure.

[0010] Figure 1B It is a front view showing an existing computing system with one or more computing devices having immersion cooling.

[0011] Figure 2 Based on certain features of this disclosure, a front view of a computing system with immersion cooling is shown, wherein the immersion cooling is used to cool one or more computing devices, each computing device having at least one heat-generating component and a substrate management controller.

[0012] Figure 3 This is a front view of a cooling guide of a device coupled to a solenoid valve of a computing system, based on certain features of this disclosure.

[0013] Figure 4 Based on certain features of this disclosure, this is a schematic diagram showing the electrical connections of the control system of the computing system and the data flow.

[0014] Figure 5 Based on certain features of this disclosure, this is a flowchart showing the process of cooling one or more computing devices by means of a control system.

[0015] Figure 6 Based on certain features of this disclosure, a flowchart is shown illustrating a method for cooling a computational system by using one or more device cooling conductors, each device cooling conductor being coupled to a solenoid valve.

[0016] Figure 7 Based on certain features of this disclosure, a flowchart is shown showing a sub-process of cooling the calculation system by controlling a solenoid valve.

[0017] Figure 8 Based on certain features of this disclosure, a flowchart is shown illustrating a sub-process of cooling the computing system by using sensors mounted on cooling conductors of each device. Detailed Implementation

[0018] A computing system and method are disclosed to overcome the drawbacks of open-tank cooling for Internet of Things (IT) components and systems. The computing system includes an immersion cooling system and computing devices. Each computing device has heat-generating components, such as a central processing unit (CPU) and a graphics processing unit (GPU). The immersion cooling system includes a coolant distribution unit fluidly coupled to a cooling tank. The coolant distribution unit circulates coolant through the cooling tank. The cooling tank includes device-cooling guides immersed in coolant. Each device-cooling guide includes a solenoid valve and an open channel. The solenoid valve controls the flow of coolant through the device-cooling guide. The open channel is structurally coupled to and fluidly communicates with the solenoid valve. The open channel is designed to accommodate the computing device and guide the coolant along a uniform cooling path through the computing device. Therefore, the computing system optimizes immersion cooling by minimizing or eliminating coolant bypass flow present in computing systems that previously used immersion cooling. Furthermore, the computing system is designed to provide on / off and / or precise proportional control of coolant flow via solenoid valves, controlling any components mounted on the device's cooling conductors to reduce energy consumption. Additionally, the device's cooling conductors are designed to provide efficient mounting for Internet technology components, such as servers, to improve the computing system's operating efficiency.

[0019] A method for providing immersion cooling for a computing system includes using a sensor mounted on a device cooling conductor. The sensor detects when Internet technology components are installed on the device cooling conductor. If the device cooling conductor is empty, for example, no Internet technology components are installed, the method closes a solenoid valve. For servers with a baseboard management controller, this method provides precise control of coolant flow. In this case, the method compares the server temperature detected by the baseboard management controller with a predetermined temperature. Subsequently, the method opens the solenoid valve based on the temperature difference, opening it to a corresponding proportion. Thus, the method provides the required precise coolant flow to cool the server to the predetermined temperature.

[0020] Various embodiments are described with reference to the accompanying drawings, throughout which similar reference numerals are used to designate similar or equivalent components. The drawings are not drawn to scale and are provided solely to illustrate the features and characteristics of this disclosure. It should be understood that many specific details, relationships, and methods are set forth to provide a comprehensive understanding. However, those skilled in the art will readily appreciate that various embodiments may be practiced without one or more specific details or in other ways. In some cases, well-known structures or operations are not shown in detail for illustrative purposes. The various embodiments are not limited to the order in which actions or events are shown, as some actions may occur in a different order and / or simultaneously with other actions or events. Furthermore, not all actions or events shown are necessary to implement certain features and characteristics of this disclosure.

[0021] For the purposes of this embodiment, unless explicitly stated otherwise, the singular includes multiples and vice versa. The term "including" means "including but not limited to". Furthermore, approximate words such as "about," "almost," "substantially," and similar words may be meant herein as, for example, "at," "near," "within 3-5% of," "within acceptable manufacturing tolerances," or any logical combination thereof. Additionally, the terms "vertical" or "horizontal" are used to further include "within 3-5%" in the vertical or horizontal direction, respectively. Furthermore, directional words such as "top," "bottom," "left," "right," "above," and "below" are intended to relate to the equivalent directions depicted in the reference illustrations; to be understood from the context of the reference object or component, such as from its usual location; or other such descriptions.

[0022] Figure 1A This illustrates a computing system 100 with immersion cooling. The computing system 100 includes one or more computing devices 101, each having at least one heat-generating component 103. For example, in a typical computing system 100, at least one heat-generating component 103 is a microprocessor, such as a central processing unit (CPU), graphics processing unit (GPU), power supply, baseboard management controller (BMC), memory, storage device, fan module, or any other component. Furthermore, in some embodiments, one or more computing devices 101 are servers.

[0023] The computing system 100 includes an immersion cooling system 110 to facilitate immersion cooling. Specifically, the immersion cooling system 110 includes a cooling tank 111 and a coolant distribution unit (CDU). The coolant distribution unit 113 is configured to circulate coolant 115. The cooling tank 111 is fluidly coupled to the coolant distribution unit 113 to contain the coolant 115. Furthermore, the cooling tank 111 has a lower plate 112 located at the bottom of the cooling tank 111. In some embodiments, the coolant 115 is a dielectric liquid. The coolant 115 includes, but is not limited to, mineral oil, synthetic oil, fluorocarbon liquid, silicone fluid, single-phase thermally conductive dielectric liquid, or any combination thereof. For example, the coolant 115 is a polyalphaolefin 4 (PAO 4) liquid.

[0024] like Figure 1A As shown, the computing system 100 includes one or more device cooling guides 130. The one or more device cooling guides 130 define an open channel 131 for accommodating a corresponding computing device among the one or more computing devices 101. For example, the open channel 131 may only accommodate a portion of the corresponding computing device 101. Furthermore, each device cooling guide 130 is mounted on a lower plate 112 of a cooling tank 111. Further, the corresponding computing device 101 is detachably connected to the open channel 131 located opposite the lower plate 112.

[0025] The computing system 100 also includes a solenoid valve 120. The solenoid valve 120 is used to circulate coolant 115 from the cooling tank 111 to the coolant distribution unit 113. For example... Figure 1AAs shown, the open channel 131 is structurally and fluidly coupled to the solenoid valve 120. In some embodiments, the solenoid valve 120 is located within the cooling tank 111. Furthermore, the solenoid valve 120 is attached to the open channel 131 via a lower plate 112. The solenoid valve 120 is configured to provide opening, closing, and / or precise flow control of the coolant 115 within the open channel 131. The open channel 131 then guides the coolant 115 upwards and uniformly distributes the coolant flow rate through the cooling paths 132 of one or more computing devices 101. The upward flow of the coolant 115, as shown by the cooling paths 132, effectively removes heat generated by at least one heat-generating component 103 of one or more computing devices 101. For example, heat exchange between the coolant 115 and the computing device 101 is achieved by convection transfer. Since one or more computing devices 101 are aligned with the open channel 131, the cooling path 132 provides efficient cooling while minimizing or eliminating bypass flows of coolant 115 around one or more computing devices 101.

[0026] Figure 1B This displays an existing computing system 100P with immersion cooling. (Compared to...) Figure 1A Similar to the computing system 100 in the example, the existing computing system 100P also has an immersion cooling system 110, including a cooling tank 111 and a coolant distribution unit 113. The coolant distribution unit 113 is fluidly coupled to the cooling tank 111 and circulates coolant 115 through the cooling tank 111. Furthermore, the existing computing system 100P has one or more computing devices 101, which are detachably mounted within the cooling tank 111. Each computing device 101 has at least one heat-generating component 103. Additionally, the cooling tank 111 has a perforated lower plate 112. The lower plate 112 is mounted within the cooling tank 111 and is located below the one or more computing devices 101, as shown below. Figure 1B As shown. One or more computing devices 101 are immersed in coolant 115. Coolant 115 is guided upward through lower plate 112 and flows through one or more computing devices 101. The upward flow of coolant 115 includes at least (1) a cooling path 132 and (2) bypass flows 152P.

[0027] Figure 1B and Figure 1A The difference lies in the fact that the existing computing system 100P does not have one or more cooling guides 130 and solenoid valves 120. Due to the lack of one or more cooling guides 130 to guide the flow of coolant 115, a bypass flow 152P occurs in the existing computing system 100P, such as... Figure 1BAs shown. The bypass flow 152P significantly reduces the total amount of coolant 115 flowing uniformly and directly through one or more computing devices 101, thereby resulting in the inefficient removal of heat generated by at least one heat-generating component 103 of one or more computing devices 101.

[0028] In computing system 100, the open channel 131 of each device cooling conductor 130 guides coolant 115 upward and uniformly across one or more computing devices 101. Therefore, the open channel 131 optimizes coolant flow by minimizing and / or eliminating bypass flow of coolant 115 around one or more computing devices 101. This optimization is expected to significantly reduce bypass flow, thereby improving the cooling efficiency of the existing computing system 100P.

[0029] For example, computational fluid dynamics (CFD) simulations were performed on computing system 100 and an existing computing system 100P. Both systems include: (i) the same number of computing units, such as seven 2U2P (two-unit-two-processor) servers; (ii) each computing unit has the same heat-generating components, such as a central processing unit (CPU); (iii) the same coolant, PAO-4; and (iv) the same coolant onset temperature, 40°C. Figure 1B Compared to the existing computing system 100P, the analysis results show that computing system 100 (such as...) Figure 1A As shown): (a) reduce the total bypass flow 152P by at least 20%; (b) achieve a total bypass flow of less than 5% of the total coolant flow; and (c) reduce the temperature of the central processing unit (CPU) by more than 2°C.

[0030] Figure 2 A computing system 200 with immersion cooling is shown for one or more computing devices 101. The computing system 200 has an immersion cooling system 110, including a cooling tank 111 and a coolant distribution unit 113. The coolant distribution unit 113 has a pump 217 for circulating coolant 115 into the cooling tank 111. The cooling tank 111 is fluidly coupled to the coolant distribution unit 113 to contain the coolant 115. Furthermore, the cooling tank 111 has a lower plate 112 located within the cooling tank 111. In some embodiments, the lower plate 112 is a perforated plate allowing coolant 115 to flow through it. A solenoid valve 120 is coupled to the lower plate 112. Additionally, the solenoid valve 120 is mounted within the cooling tank 111 for circulating the coolant 115. Further, each computing device 101 has a baseboard management controller 205 and at least one heat-generating component 103.

[0031] like Figure 2 As shown, the computing system 200 includes one or more device cooling guides 130 mounted on the lower plate 112 of the cooling tank 111. Each of the one or more device cooling guides 130 includes an open channel 131. The open channel 131 is structurally and fluidly coupled to a solenoid valve 120. Both the open channel 131 and the solenoid valve 120 are immersed in a coolant 115. The open channel 131 is used to accommodate a corresponding computing device of one or more computing devices 101, such that the computing device 101 is detachably fixed in the open channel 131 of the device cooling guide 130. In some embodiments, the open channel 131 accommodates only a portion of a corresponding computing device 101 of one or more computing devices 101. The corresponding computing device 101 of one or more computing devices 101 is also immersed in the coolant 115. Furthermore, when the solenoid valve 120 is open, the coolant distribution unit 113 circulates the coolant 115 by means of a pump 217. Coolant 115 flows upward through lower plate 112 and enters open channel 131. Subsequently, coolant 115 is guided by open channel 131 and flows along cooling path 132 through the respective computing devices 101 of one or more computing devices 101. The flow of coolant along cooling path 132 significantly reduces bypass flow, thereby improving the cooling efficiency of the respective computing devices 101 of one or more computing devices 101.

[0032] like Figure 2 As shown, the computing system 200 includes a sensor 240 mounted on an open channel 131. The sensor 240 is used to detect a corresponding computing device of one or more computing devices fixed in the open channel 131. When the sensor 240 does not detect a corresponding computing device of one or more computing devices, for example, when the open channel 131 is empty, the solenoid valve 120 is closed to prevent coolant 115 from flowing through the open channel 131. Therefore, the sensor 240 can be used to improve the energy efficiency of the immersion cooling of the computing system 200.

[0033] In some embodiments, one or more device cooling conductors 130 include a plurality of device cooling conductors 239. Specifically, Figure 2 Each of the multiple device cooling guides 239 shown is typically mounted in parallel with another device cooling guide 239.

[0034] Figure 3This illustrates the coupling of the device cooling guide 130 and the solenoid valve 120 in computing systems 100 and 200. The device cooling guide 130 includes an open channel 131. The open channel 131 includes a base plate 331, a first wall 332, and a second wall 333. The base plate 331 is attached to the lower plate 112 of the cooling tank 111. In some embodiments, the base plate 331 is a perforated plate. The first wall 332 and the second wall 333 are coupled to the ends of the base plate 331. Furthermore, the first wall 332 and the second wall 333 are mounted relative to each other, thereby defining the open channel 131. The first wall 332 and the second wall 333 each have a chamfered edge 336. The chamfered edges 336 are located at their distal ends and relative to the base plate 331. Furthermore, the chamfered edges 336 are oriented at an angle away from the open channel 131. The beveled edges 336 of each of the first wall 332 and the second wall 333 are designed to facilitate the efficient mounting of one or more computing devices 101 onto the open channels 131 of one or more device cooling guides 130.

[0035] like Figure 3 As shown, the open channel 131 includes a first spring plate 334 and a second spring plate 335. The first spring plate 334 is mounted on the first wall 332 and located within the open channel 131. Similarly, the second spring plate 335 is mounted on the second wall 333 and located within the open channel 131. In some embodiments, the first spring plate 334 and the second spring plate 335 each have a surface that curves towards the center of the open channel. The first spring plate 334 and the second spring plate 335 are designed to secure one or more computing devices 101 within the open channel 131. This structure ensures proper alignment of the computing devices 101 so that the coolant 115 can flow efficiently through the computing devices 101, and bypass flow is minimized or eliminated.

[0036] Figure 4 The display shows the electrical connections and data flow of the control system 410 of the immersion-cooled computing system 400. The control system 410 is electrically connected to and communicates with the coolant distribution unit 113, solenoid valve 120, sensor 240, and board management controller 205. Furthermore, the control system 410 includes one or more processors 411, a memory device 412, and a storage device 413. The memory device 412 has machine-readable instructions or algorithms for controlling the flow of coolant 115 circulating through the cooling tank 111.

[0037] Figure 5The display control system 410 performs the cooling process 500. Specifically, the processor 411 of the control system 410 executes machine-readable instructions, causing the computing system 200 to perform the following operations: (1) if the temperature of the corresponding computing device 101 of one or more computing devices 101 exceeds a predetermined value set by the board management controller 205, then the solenoid valve 120 is opened (step 501); (2) using the coolant distribution unit 113, coolant 115 is allowed to flow through the open channel 131 and the corresponding computing device 101 of one or more computing devices 101 (step 503). In step 501, the predetermined temperature value of the corresponding computing device 101 of one or more computing devices 101 is, for example, 40°C. In some embodiments, the predetermined temperature value ranges from 40°C to 50°C.

[0038] like Figure 5 As shown, the control system 410 is configured to close the solenoid valve 120 (step 505) when the open channel 131 is determined to be empty by the sensor 240. The sensor 240 is mounted in the open channel 131 to detect corresponding computing devices 101 of one or more computing devices 101 mounted in the open channel 131 of the device cooling guide 130, such as... Figure 2 As shown. Sensor 240 communicates with control system 410 to control the opening and closing of solenoid valve 120. When the open channel 131 of any device cooling guide 130 is detected to be empty, control system 410 closes the solenoid valve 120 fluidly coupled to the open channel 131. Therefore, the total energy consumption of computing system 400 is reduced compared to computing systems without such control.

[0039] Furthermore, the control system 410 is configured to open the solenoid valve 120 to a percentage (step 511) when cooling each computing device 101. This percentage value is based on the temperature difference between the temperature of the respective computing device 101 and a predetermined value, ranging from 0.1% to 100%. This process provides precise control of the coolant flow rate, enabling not only the achievement of the desired temperature of the respective computing device 101, but also improving the efficiency of immersion cooling of the computing system 400.

[0040] Figure 6Method 600 for cooling a computing system using device cooling conductors is shown. Specifically, method 600 includes: (i) obtaining an immersion cooling system having a coolant distribution unit and a cooling tank, wherein the cooling tank is fluidly coupled to the coolant distribution unit to contain coolant (step 601); (ii) installing one or more device cooling conductors in the cooling tank (step 603); (iii) installing a solenoid valve onto each of the one or more device cooling conductors (step 605); (iv) fluidly coupling the solenoid valve to an open channel of each of the one or more device cooling conductors (step 607); (v) installing a corresponding computing device of one or more computing devices in the open channel (step 609); and (vi) if the solenoid valve is open, flowing coolant through the open channel along a cooling path through the corresponding computing device of one or more computing devices (step 611).

[0041] Figure 7 This illustrates a sub-process for cooling the computing system by controlling a solenoid valve. First, method 700 includes a sub-process for closing the solenoid valve (step 711) when the temperature of a respective computing device of one or more computing devices is at or below a predetermined value set by its board management controller. In this sub-process, the predetermined value is approximately 40°C for the temperature of the respective computing device of one or more computing devices. In some embodiments, the predetermined value ranges from approximately 40°C to approximately 50°C, or from approximately 40°C to approximately 89°C.

[0042] Secondly, method 700 includes another sub-process for opening the solenoid valve to a percentage of full opening. This percentage is a value between 0.1% and 100% of full opening. Furthermore, the percentage is determined based on the temperature difference between the temperature of the respective computing device of one or more computing devices and a predetermined value. Additionally, the predetermined value is determined by a baseboard management controller of the respective computing device of one or more computing devices (step 715).

[0043] Figure 8 A sub-process 800 of method 700 cools the computing system by installing sensors on each device cooling conductor. Specifically, sub-process 800 includes: (a) installing sensors into open channels (step 801); (b) determining whether the open channel is empty using the sensors (step 803); and (c) closing solenoid valves based on this determination (step 805). In this sub-process 800, method 700 uses sensors to detect whether a computing device is installed in an open channel of a device cooling conductor. If the corresponding device cooling conductor of one or more device cooling conductors is detected to be empty, method 700 closes the solenoid valves, thereby saving coolant circulation energy that the computing system would otherwise consume.

[0044] Although embodiments of this disclosure have been shown and described with respect to one or more implementations, equivalents and modifications will occur to those skilled in the art upon reading and understanding this specification and the accompanying drawings. Furthermore, while specific features of this disclosure may have been disclosed with respect to only one of several implementations, such features may be combined with one or more other features of other implementations, as may be required and advantageous for any given or particular application.

[0045] While various embodiments of this disclosure have been described above, it should be understood that they are presented by way of example only and not as limiting. Various changes may be made to the embodiments disclosed herein without departing from the spirit or scope of this disclosure. Therefore, the breadth and scope of this disclosure should not be limited by any of the foregoing embodiments. Rather, the scope of this disclosure should be defined by the following claims and their equivalents.

[0046] Figure Labels

[0047] 100: Computing System

[0048] 100P: Existing computing systems

[0049] 101: Computing device

[0050] 103: Heat-generating components

[0051] 110: Immersion Cooling System

[0052] 111: Cooling tank

[0053] 112: Lower board

[0054] 113: Coolant Distribution Unit

[0055] 115: Coolant

[0056] 120: Solenoid valve

[0057] 130: Device cooling guide

[0058] 131: Open Channel

[0059] 132: Cooling Path

[0060] 152P: Bypass Flow

[0061] 200: Computing System

[0062] 205: Baseboard Management Controller

[0063] 217: Pump

[0064] 239: Device cooling guide

[0065] 240: Sensor

[0066] 331: Base Plate

[0067] 332: The First Wall

[0068] 333: The Second Wall

[0069] 334: First Spring Plate

[0070] 335: Second spring plate

[0071] 336: Beveled edge

[0072] 400: Computing System

[0073] 410: Control System

[0074] 411: Processor

[0075] 412: Memory device

[0076] 413: Storage device

[0077] 500: Process

[0078] 501, 503, 505, 511: Steps

[0079] 600: Method

[0080] 601, 603, 605, 607, 609, 611: Steps

[0081] 700: Method

[0082] 711, 715: Steps

[0083] 800: Subprocess

[0084] 801, 803, 805: Steps

Claims

1. A computing system with immersion cooling, the computing system comprising: One or more computing devices, each of the one or more computing devices having at least one heat-generating component; A coolant distribution unit for circulating coolant; as well as A cooling tank, fluidly coupled to the coolant distribution unit to contain the coolant, the cooling tank including one or more device cooling guides immersed in the coolant, each of the one or more device cooling guides including: A solenoid valve is used to circulate the coolant; as well as An open channel is structurally coupled to and in fluid communication with the solenoid valve, the open channel being configured to accommodate a corresponding computing device among the one or more computing devices and to guide the coolant to a cooling path through the corresponding computing device among the one or more computing devices.

2. The computing system of claim 1, wherein one or more device cooling conductors comprise a plurality of device cooling conductors, each of the plurality of device cooling conductors being substantially parallel to another device cooling conductor.

3. The computing system according to claim 1, wherein the solenoid valve is coupled to a base plate of the open channel.

4. The computing system according to claim 1, wherein the open channel is defined by a first wall, a second wall, and a base plate, the first wall and the second wall being coupled to the base plate at their ends, the first wall and the second wall being located in opposite positions to define the open channel.

5. The computing system according to claim 4, wherein the open channel further includes a first spring plate, the first spring plate being mounted on the first wall and located within the open channel.

6. The computing system of claim 4, wherein the first wall and the second wall each include a beveled edge.

7. A computing system, comprising: One or more computing devices, each computing device having at least one heat-generating component; as well as An immersion cooling system includes a coolant distribution unit and a cooling tank. The coolant distribution unit circulates a coolant, and the cooling tank is fluidly coupled to the coolant distribution unit to contain the coolant. The cooling tank includes one or more device cooling conductors immersed in the coolant. Each of the one or more device cooling conductors includes: A solenoid valve is used to circulate the coolant; as well as An open channel is structurally coupled to and in fluid communication with the solenoid valve, the open channel being configured to accommodate a corresponding computing device among the one or more computing devices and to guide the coolant to a cooling path through the corresponding computing device among the one or more computing devices.

8. The computing system according to claim 7, further comprising: A storage device that stores multiple machine-readable instructions; as well as A control system is communicatively connected to the solenoid valve, the coolant distribution unit, and a baseboard management controller of the corresponding computing device, wherein the control system has one or more processors configured to execute machine-readable instructions to enable the computing system to: The solenoid valve opens when the temperature of the corresponding computing device exceeds a predetermined value determined by the board management controller; and Using the coolant distribution unit, the coolant flows through the open channel and the corresponding computing device.

9. A cooling method for cooling a computing system having one or more computing devices, the cooling method comprising: An immersion cooling system is obtained, having a coolant distribution unit and a cooling tank, wherein the cooling tank is fluidly coupled to the coolant distribution unit to contain a coolant; One or more cooling conductors are installed in the cooling tank; Install a solenoid valve into each of the one or more device cooling guides; The solenoid valve is fluidly coupled to an open passage of each of the one or more device cooling conductors; The open channel contains a corresponding computing device among one or more computing devices; as well as If the solenoid valve opens, the coolant flows through the open channel in a cooling path through the corresponding computing device in one or more computing devices.

10. The cooling method according to claim 9, further comprising: Install a sensor in this open channel; The sensor determined that the open channel was empty. as well as According to the determination process, the solenoid valve is closed.

Images