CPU efficient heat dissipation structure and heat dissipation method

By combining air cooling and liquid cooling methods, and utilizing a combination design of heat spreader, heat conduction plate, fins and fan, along with intelligent temperature control by NTC sensor and controller, the problem of insufficient CPU heat dissipation capacity is solved, achieving efficient and stable heat dissipation.

CN122363471APending Publication Date: 2026-07-10SHENZHEN BAOCHUANG YUNHANG TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHENZHEN BAOCHUANG YUNHANG TECHNOLOGY CO LTD
Filing Date
2026-02-24
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

Existing CPUs have relatively simple heat dissipation structures, resulting in insufficient heat dissipation capacity under high loads, weak regulation capabilities under light loads, and weak adaptive energy management.

Method used

It adopts a heat dissipation method that combines contact air cooling and liquid circulation cooling. Through the combined design of heat dissipation plate, heat conduction plate, fins, fan and water channel, combined with NTC sensor and controller to achieve intelligent temperature control, it ensures efficient heat dissipation under different load conditions.

Benefits of technology

It enables the central processing unit to be maintained within a safe temperature range under any working condition, improves heat dissipation redundancy and system stability, and maximizes the CPU performance potential.

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Abstract

This invention relates to the field of CPU heat dissipation, and more particularly to a high-efficiency CPU heat dissipation structure and method, comprising a frame assembly, auxiliary components connected to the frame assembly, a heat dissipation assembly connected to the frame assembly, and a protective assembly connected to the frame assembly. This invention provides efficient heat dissipation under different load conditions through contact air cooling and liquid circulation cooling. The heat dissipation assembly's vapor chamber rapidly and evenly diffuses the heat generated by the central processing unit and transfers it to the heat-conducting fins. Stacked fins formed by thin metal sheets, along with directional airflow generated by a first cooling fan, effectively remove heat from the air, achieving rapid heat dissipation. The cold head transfers heat to the circulating medium, which then flows through a radiator with multiple internal water channels. A second cooling fan powerfully blows air across the surface of the radiator, efficiently dissipating heat from the cooling medium to the external environment, thus ensuring continuous heat dissipation.
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