Heat pipe integrated liquid cooling heat sink

Abstract

The application discloses a heat pipe integrated liquid cooling radiator, which comprises a liquid cooling row, a liquid pump, a liquid cooling head and a plurality of heat pipes. The liquid cooling row has two liquid boxes and a heat dissipation row pipe group. The liquid pump is arranged in the liquid cooling row to drive the cooling liquid in the liquid cooling row to circulate and dissipate heat. The liquid cooling head is located below one of the liquid boxes of the liquid cooling row, and the bottom surface of the liquid cooling head is provided with a plurality of heat pipe embedding grooves. The two ends of the heat pipe form closed heat dissipation sections and respectively extend into the second liquid box. The heat absorption section in the middle of the heat pipe is embedded in the heat pipe embedding groove of the liquid cooling head, and a heat source contact surface is formed. When the application is used, the working liquid in the heat pipe is heated by heat exchange with the processor in the heat absorption section, the heated working liquid flows to the heat dissipation sections at the two ends, and the working liquid is cooled by heat exchange with the cooling liquid of the liquid cooling row, so that efficient heat transfer and heat dissipation effect are realized.

Description

Technical Field

[0001] This invention relates to the technical field of liquid cooling heat sinks for electronic devices, and more particularly to an integrated liquid cooling heat sink that combines a heat pipe and a liquid cooling radiator. It utilizes the phase change heat transfer characteristics of the heat pipe and the cooling liquid circulation heat dissipation mechanism of the liquid cooling radiator to improve the heat transfer and heat dissipation efficiency. Background Technology

[0002] All-in-one liquid coolers are commonly used for processor cooling and heat dissipation in desktop computers, as shown in CN214808447U and US11566848B2. Their structure mainly includes a liquid cooler radiator, a liquid pump, and a liquid cooling head. The radiator has two liquid tanks and a heat pipe assembly connecting the two tanks. The heat pipe assembly includes multiple pipes and heat dissipation fins arranged between the pipes. The liquid pump, located in one of the liquid tanks, includes a motor and a fan blade to drive the coolant circulation within the radiator. The liquid cooling head is attached to the bottom of one of the liquid tanks, and through two flow holes connected to the tanks, the coolant flows through the cooling head during circulation. In use, the bottom surface of the cooling head contacts the processor surface or other heat sources, enabling heat exchange between the coolant and the processor. This cools the processor while heating the coolant. The heated coolant then flows through the heat pipe assembly to dissipate heat, becoming cooler before flowing back to the cooling head.

[0003] The conventional liquid cooling head structure described above has only one inlet and one outlet port connecting to the liquid tank of the liquid cooling radiator, allowing coolant to enter and exit the cavity inside the liquid cooling head. This easily leads to a limitation on the flow rate of the coolant entering and exiting the liquid cooling head, making it unable to cool the rapidly increasing heat. Furthermore, the heat exchange effect between the coolant and the processor within the conventional liquid cooling radiator has a physical limit. When the processor generates a large amount of heat instantaneously, relying solely on coolant cooling is insufficient to quickly dissipate the heat away from the processor surface, easily causing localized heat accumulation, which in turn affects heat dissipation efficiency and the stability of processor operation. Therefore, how to overcome the shortcomings of conventional integrated liquid cooling radiator technology is the problem that this invention aims to actively address. Summary of the Invention

[0004] The main objective of this invention is to provide an integrated heat pipe liquid cooling radiator, which combines a liquid cooling radiator, a liquid pump, a liquid cooling head, and multiple sealed heat pipes. The heat dissipation sections at both ends of the heat pipes extend into the liquid cooling radiator, immersing the heat dissipation sections in the coolant of the liquid cooling radiator. In this way, when the heat-absorbing section of the heat pipe absorbs heat, it transfers the heat to the heat dissipation sections at both ends, and the heat is quickly dissipated in the heat dissipation sections and the coolant in the liquid cooling radiator, thereby improving the overall heat conduction speed and heat dissipation efficiency.

[0005] The next objective of this invention is to provide an integrated heat pipe liquid cooling radiator, which first welds the heat pipe to a fixing plate of the same material, and then uses the fixing plate to install on a liquid cooling radiator with a liquid pump, so that the heat dissipation sections at both ends of the heat pipe can extend into the liquid cooling radiator, avoiding the welding difficulties and poor joint problems caused by dissimilar metals.

[0006] To achieve the aforementioned main objectives, this invention proposes an integrated heat pipe liquid-cooled radiator. A preferred embodiment includes a liquid cooling radiator, a liquid pump, a liquid cooling head, and a plurality of heat pipes. The liquid cooling radiator comprises a first liquid tank, a second liquid tank, a heat dissipation tube assembly, and a coolant. The first and second liquid tanks are located at opposite ends of the heat dissipation tube assembly. The heat dissipation tube assembly has a plurality of parallel heat dissipation tubes and a plurality of heat dissipation fins disposed between each heat dissipation tube. The two ends of each heat dissipation tube are respectively connected to the first and second liquid tanks. The coolant fills the first liquid tank, the second liquid tank, and the heat dissipation tubes. The liquid pump is located within the liquid cooling radiator and is used to drive the coolant in the liquid cooling radiator to circulate within the first liquid tank, the heat dissipation tube assembly, and the second liquid tank. The liquid cooling head is a heat-dissipating metal block located below the second liquid tank. The bottom or side surface of the liquid cooling head has multiple heat pipe grooves extending to both sides. These heat pipes are copper metal tubes with closed ends, filled with a working fluid. Each heat pipe has a heat dissipation section near both ends, extending into the second liquid reservoir and immersed in the coolant within. A heat-absorbing section in the middle of each heat pipe is embedded in a heat pipe groove in the liquid cooling head, and this heat-absorbing section is machined with a heat source contact surface, which is then combined into a flat surface or a slightly protruding arc surface for contact with a heat source. After absorbing heat, the heat-absorbing section of each heat pipe transfers the heat to the heat dissipation sections at both ends, where it dissipates heat through contact with the coolant in the second liquid reservoir.

[0007] To achieve the aforementioned secondary objective, the two ends of the heat pipe of the present invention are welded to one or two fixing plates of the same material. The fixing plates are locked to the bottom surface of the liquid box by screws or other fixing elements, so that the heat dissipation sections at both ends of the heat pipe extend into the liquid box of the liquid cooler, thereby achieving the effect of combining the copper heat pipe and the aluminum liquid box.

[0008] The advantages of this invention are as follows: Through the structure of a heat-absorbing section in the middle of multiple heat pipes and heat-dissipating sections sealed at both ends, and by integrating the heat-absorbing section with the liquid cooling head of an integrated liquid cooler, while the heat-dissipating sections at both ends extend into the second liquid tank of the liquid cooling radiator, the working fluid within the heat pipes achieves a first heat exchange with the processor's heat source in the heat-absorbing section, cooling the processor and heating the working fluid. The heated working fluid then flows to the heat-dissipating sections at both ends, where it undergoes a second heat exchange with the coolant in the liquid cooling radiator, cooling the working fluid before flowing back to the heat-absorbing section. The coolant in the liquid cooling radiator then flows through the heat pipe assembly and is dissipated outwards by the fan. This significantly improves the efficiency of the heat pipes and enhances the cooling effect of the integrated liquid cooler on the processor.

[0009] In addition, the present invention can first weld the heat pipe to a fixing plate of the same material and then install it on the bottom surface of the liquid box, so that the heat dissipation sections at both ends extend into the second liquid box. This can avoid poor joint and process difficulties caused by direct welding of dissimilar metals, and ensure the bonding strength between the heat pipe and the liquid radiator, thereby improving the overall reliability, durability and mass production feasibility of the heat sink. Attached Figure Description

[0010] Figure 1 This is a perspective view of the first preferred embodiment of the present invention.

[0011] Figure 2 For the present invention Figure 1 A schematic diagram of the fan in its disassembled state.

[0012] Figure 3 For the present invention Figure 2 A three-dimensional diagram viewed from below.

[0013] Figure 4 For the present invention Figure 3 A diagram showing the decomposed state viewed from below.

[0014] Figure 5 For the present invention Figure 3 A schematic diagram of its longitudinal cross-section and fluid flow.

[0015] Figure 6 This is a bottom-view perspective view of the second preferred embodiment of the present invention.

[0016] Figure 7 For the present invention Figure 6 A diagram showing the breakdown from an upward perspective.

[0017] Figure 8 This is a bottom-view perspective view of the third preferred embodiment of the present invention.

[0018] Figure 9 For the present invention Figure 8 A diagram showing the breakdown from an upward perspective.

[0019] Figure 10 This is a schematic diagram of one embodiment of the heat pipes of the present invention arranged side by side without gaps.

[0020] Figure 11 This is a schematic diagram of another embodiment of the heat pipes of the present invention arranged side by side without spacing.

[0021] Figure 12A ~ Figure 12C This is a cross-sectional schematic diagram of three preferred embodiments of the heat pipes of the present invention.

[0022] Explanation of reference numerals in the attached diagram: 10: Liquid Cooling Radiator 11: First liquid box 111: Box 112: Box lid 113: partition 114, 115: Liquid Chamber 12: Second liquid box 121: Box 122: Box lid 123:Lower box wall 124: Perforation 125: Screw hole 126: Ring Ditch 13: Heat dissipation pipe assembly 131: First heat dissipation pipe assembly 132: Second heat dissipation pipe assembly 133: Heat pipe 134: Heat dissipation fins 14: Coolant 20: Liquid Pump 21: Motor 22: Fan blades 30: Liquid cooling head 31: Heat pipe groove 32: Heatsink 40: Heat pipe 41: Heat dissipation section 42: Heat absorption section 43: Heat source contact surface 44: Working fluid 45: Stopping convex ring 46: Capillary grooves 47: Sintered metal powder layer 48: Metal mesh layer F1: Plane A1: Micro-convex curved surface 50: Fixing plate 51: Fixing hole 52: Screw hole 60: Screws 70: Sealing ring 80: Fan Detailed Implementation See Figures 1 to 5 As shown, the present invention discloses an integrated heat pipe liquid cooler for cooling and heat dissipating a processor. Its first preferred embodiment includes a liquid cooling radiator 10, a liquid pump 20, a liquid cooling head 30, and a plurality of heat pipes 40. A fan 80 can be added to improve the heat dissipation efficiency of the liquid cooling radiator 10. like Figure 3 , Figure 4 and Figure 5 As shown, the liquid cooling radiator 10 has a first liquid tank 11 and a second liquid tank 12 spaced apart, and a heat dissipation pipe assembly 13 connected between the first liquid tank 11 and the second liquid tank 12. The first liquid tank 11 and the second liquid tank 12 are each composed of a box body 111, 121 and a box cover 112, 122, respectively. A partition 113 is provided in the middle of the first liquid tank 11, dividing the interior of the first liquid tank 11 into two independent liquid chambers 114 and 115, while the second liquid tank 12 has a completely open structure without a partition. The heat dissipation pipe assembly 13 is divided into a first heat dissipation pipe assembly 131 and a second heat dissipation pipe assembly 132. The first heat dissipation pipe assembly 131 and the second heat dissipation pipe assembly 132 are each composed of multiple parallel heat dissipation pipes 133 and heat dissipation fins 134 arranged between each heat dissipation pipe 133. The two ends of the heat dissipation pipes 133 are respectively inserted, welded, and connected to the interior of the first liquid tank 11 and the second liquid tank 12. In this way, a coolant 14 (such as pure water) is filled into the liquid cooling radiator 10, so that the coolant 14 fills the first liquid box 11, the second liquid box 12 and the heat dissipation pipe 133. The coolant 14 can form a closed circulation system through the liquid pump 20. When the coolant 14 flows through the first heat dissipation pipe group 131 and the second heat dissipation pipe group 132, it achieves heat dissipation through the heat dissipation fins 134 and the fan 80.

[0023] like Figure 4 and Figure 5 As shown, the liquid pump 20 is a conventional item having a motor 21 and a blade 22. It is disposed in a liquid chamber 114 of the first liquid box 11 of the liquid coolant radiator 10, and is used to drive the coolant 14 from the liquid chamber 114 to another liquid chamber 115. Therefore, the coolant 14 in the liquid coolant radiator 10 can circulate sequentially in the first liquid box 11, the first heat dissipation pipe assembly 131, the second liquid box 12, and the second heat dissipation pipe assembly 132 (e.g., Figure 5 (As indicated by the arrow direction).

[0024] like Figure 4 and Figure 5As shown, the liquid cooling head 30 is a heat-dissipating metal block, such as a rectangular copper or aluminum block, disposed below the second liquid tank 12. The bottom or side surface of the liquid cooling head 30 has multiple heat pipe grooves 31 extending to both sides. Each heat pipe groove 31 is a semi-circular groove used to install several heat pipes 40. The top surface of the liquid cooling head 30 can be fitted with multiple heat sinks 32, which enable the liquid cooling head 30 itself to also have a heat dissipation function.

[0025] like Figures 3 to 5 As shown, the heat pipes 40 are circular tubes made of copper and closed at both ends, filled with a working fluid 44. Each heat pipe 40 has a heat dissipation section 41 near both ends, which passes through the lower wall 123 of the second liquid tank 12 and extends into the second liquid tank 12, immersing the heat dissipation section 41 in the coolant 14 within the second liquid tank 12. However, the working fluid 44 and the coolant 14 are not in communication, allowing the working fluid 44 to exchange heat and cool down only through the heat dissipation section 41. A heat-absorbing section 42 in the middle of each heat pipe 40 is embedded in the heat pipe groove 31 of the liquid cooling head 30, and a heat source contact surface 43 is machined on the bottom surface of the heat-absorbing section 42. When combined with the liquid cooling head 30, the heat source contact surfaces 43 merge into a flat plane F1 or a micro-protruding arc surface A1, which can then contact the surface of the processor (heat source).

[0026] like Figure 5 As shown, in use, the heat pipe integrated liquid cooling radiator of the present invention absorbs heat in the heat-absorbing section 42 of the heat pipes 40 and transfers the heat to the heat dissipation section 41 at both ends, where it dissipates heat with the coolant 14 in the second liquid tank 12. Specifically, the planar F1 or micro-protruding arc surface A1 formed by the heat pipes 40 is attached to a heat source such as a computer processor, so that the heat generated by the heat source can be directly conducted to the heat-absorbing section 42 of each heat pipe 40. At this time, when the working liquid 44 in the heat pipe 40 flows through the heat-absorbing section 42, it exchanges heat with the heat source for the first time, causing the processor to cool down and the working liquid 44 to heat up (usually becoming a vaporized fluid). The heated working liquid 44 can flow to the heat dissipation section 41 at both ends by itself due to the characteristics of the heat pipe 40, and after a second heat exchange with the coolant 14 in the second liquid tank 12 in the heat dissipation section 41, it cools down rapidly. The rapidly cooled working liquid 44 then flows back to the heat-absorbing section 42. Therefore, the present invention can continuously cool the processor and transfer heat to the liquid cooling radiator 10. The present invention not only utilizes the high thermal conductivity of the heat pipe 40 and the high flow rate of the liquid cooling radiator 10 to improve heat conduction and heat dissipation speed, but also improves the problems of insufficient heat dissipation and limited heat exchange efficiency of conventional liquid cooling heads, thereby effectively improving the overall heat dissipation performance and cooling stability.

[0027] For example Figure 3 and Figure 4 As shown, in this embodiment, the heat pipes 40 are U-shaped tubes with both ends bent upwards. Near each end of the heat pipe 40, a stop ring 45 is provided on the outer wall, and a heat dissipation section 41 is formed on the stop ring 45. During assembly, each heat dissipation section 41 is inserted and welded (furnace soldering) into the through hole 124 of the lower wall 123 of the second liquid box 12, while the stop ring 45 abuts against the lower wall 123. This assembly structure, in which the heat dissipation sections 41 at both ends of the heat pipe 40 are directly inserted into the second liquid box 12 and immersed in the coolant 14, is suitable for applications where the heat pipe 40 and the second liquid box 12 are made of the same metal material (e.g., both are copper), allowing for direct welding assembly.

[0028] See Figure 6 and Figure 7 The second preferred embodiment of the present invention is shown below. It, like the first preferred embodiment, includes a liquid cooling radiator 10, a liquid pump 20, a liquid cooling head 30, and multiple heat pipes 40. The difference is the addition of a fixing plate 50, which serves as a connector when the heat pipes 40 and the second liquid tank 12 are made of different metals. The fixing plate 50 is made of the same copper material as the heat pipes 40, and has fixing holes 51 corresponding to both ends of each heat pipe 40, allowing the heat dissipation sections 41 at both ends of the heat pipes 40 to pass through and be welded to the fixing holes 51. The fixing holes 51 of the fixing plate 50 also correspond to an elongated through-hole 124 in the lower wall 123 of the aluminum second liquid tank 12, thereby fixing the fixing plate 50 to the lower wall 123. This allows the heat dissipation sections 41 at both ends of the heat pipes 40 to pass through the through-hole 124 and extend into the second liquid tank 12, thus completing the connection between the different metal materials. The fixing plate 50 is provided with a plurality of screw through holes 52, and the lower box wall 123 is provided with screw holes 125. A plurality of screws 60 are then passed through the screw through holes 52 and locked in the screw holes 125 of the lower box wall 123.

[0029] See Figure 8 and Figure 9As shown, this is the third preferred embodiment of the present invention. Unlike the second preferred embodiment described above, it incorporates two fixing plates 50. Each fixing plate 50 has a fixing hole 51 corresponding to one end of each heat pipe 40. The heat dissipation sections 41 at both ends of the heat pipe 40 pass through and are welded to the fixing holes 51 of the two fixing plates 50. The fixing holes 51 of the two fixing plates 50 correspond to an elongated through-hole 124 in the lower wall 123 of the second liquid tank 12. The two fixing plates 50 are then fixed to the lower wall 123, allowing the heat dissipation sections 41 at both ends of the heat pipe 40 to pass through the through-hole 124 and extend into the second liquid tank 12. Similarly, the two fixing plates 50 may have a plurality of screw holes 52, and the lower wall 123 has corresponding screw holes 125. A plurality of screws 60 pass through the screw holes 52 and are locked in the screw holes 125 of the lower wall 123, thus completing the structure of the two fixing plates 50 connected to the second liquid tank 12.

[0030] See also Figure 7 and Figure 9 As shown, to achieve a leak-proof seal between the fixing hole 51 and the elongated perforation 124, and to prevent coolant from leaking out from the gap between the mating surfaces, the lower wall 123 of the second liquid box 12 is recessed with an annular groove 126, such as a circular or elliptical annular groove. This annular groove 126 surrounds the perforation 124 and is fitted with a correspondingly shaped sealing ring 70. Therefore, when the fixing piece 50 is engaged with the lower wall 123 of the second liquid box 12, it can compress the sealing ring 70, achieving a leak-proof seal.

[0031] See also Figure 4 , Figure 7 and Figure 9 As shown, in the three embodiments described above, the multiple heat pipe grooves 31 of the liquid cooling head 30 can be spaced apart from each other; and the heat absorption sections 42 of the heat pipes 40 are spaced apart in the heat pipe grooves 31, so that the heat source contact surfaces 43 are spaced apart from each other, thereby forming the aforementioned planar F1 or micro-protruding arc surface A1. See also... Figure 10 and Figure 11 As shown, the multiple heat pipe grooves 31 of the liquid cooling head 30 can also be arranged side by side without any gap between them; and the heat absorption section 42 and heat source contact surface 43 of the heat pipes 40 can be arranged side by side without any gap between them to form the above-mentioned plane F1 or micro-protruding arc surface A1. Both of the above two structures of heat pipes 40 arranged side by side without gap or separated by gap can achieve the same effect.

[0032] See also Figure 12A As shown, in a preferred embodiment, the heat pipe 40 described above is a copper pipe, the inner wall of which has a plurality of capillary grooves 46 extending along the inner wall of the heat pipe 40 to both ends. See also... Figure 12BAs shown, the inner wall of the heat pipe 40 may also be provided with a metal powder sintered layer 47, which extends along the inner wall of the heat pipe 40 to both ends. See also... Figure 12C As shown, the inner wall of the heat pipe 40 can also be provided with a metal mesh layer 48, which extends along the inner wall of the heat pipe 40 to both ends. Through the above-mentioned design of the inner wall of the heat pipe 40, whether it is the capillary grooves 46 extending to both ends, the sintered metal powder layer 47, or the metal mesh layer 48, an effective capillary reflux structure can be formed, which can increase the contact area between the liquid and the inner wall and the uniformity of liquid film distribution, improve heat conduction and heat dissipation efficiency, improve the problem of insufficient heat dissipation in local high heat flux density areas, and ensure the thermal stability and performance of the overall radiator.

[0033] In summary, the heat pipe integrated liquid cooling radiator of the present invention is indeed practical and innovative, the application of its technical means is undoubtedly novel, and its efficacy and design purpose are indeed in line with the present invention, which can be called reasonable progress.

Claims

1. A heat pipe integrated liquid-cooled radiator, comprising a liquid radiator, a liquid pump, a liquid cooling head, and a plurality of heat pipes, wherein: The liquid cooling radiator has a first liquid tank, a second liquid tank, a heat dissipation tube assembly, and a coolant; the first liquid tank and the second liquid tank are located at both ends of the heat dissipation tube assembly; the heat dissipation tube assembly has a plurality of heat dissipation tubes arranged side by side, and a plurality of heat dissipation fins disposed between each heat dissipation tube, and the two ends of each heat dissipation tube are respectively connected to the first liquid tank and the second liquid tank; the coolant fills the first liquid tank, the second liquid tank, and the heat dissipation tubes; The liquid pump is installed in the liquid cooling radiator to drive the coolant in the liquid cooling radiator to circulate in the first liquid box, the heat dissipation pipe assembly and the second liquid box; The liquid cooling head is a heat dissipation metal block located below the second liquid box. The bottom or side surface of the liquid cooling head is provided with multiple heat pipe grooves extending to both sides. These heat pipes are copper metal tubes with closed ends, filled with a working fluid. Each heat pipe has a heat dissipation section near both ends, extending into the second liquid tank and submerged in the coolant within. A heat-absorbing section in the middle of each heat pipe is embedded in a heat pipe groove in the liquid cooling head, and this heat-absorbing section is machined with a heat source contact surface, which is then combined into a flat surface or a slightly protruding arc surface for contact with a heat source. After absorbing heat, the heat-absorbing section of these heat pipes transfers the heat to the heat-dissipating section at both ends, and dissipates heat with the coolant in the second liquid box in the heat-dissipating section.

2. The integrated liquid-cooled heat sink with heat pipe as described in claim 1, wherein the heat pipe is a U-shaped tube bent upward at both ends, and a stop ring is provided on the outer wall of the heat pipe near both ends, and the heat dissipation section is formed above the stop ring. Each heat dissipation section is inserted into and welded to the through hole in the lower box wall of the second liquid box, so that the heat dissipation section extends into the second liquid box, and the stop ring abuts against the lower box wall.

3. The integrated liquid-cooled heat sink with heat pipe as described in claim 2, comprising a fixing plate, the fixing plate having fixing holes corresponding to the two ends of each heat pipe, the heat dissipation sections at both ends of the heat pipe being inserted into and welded to the fixing holes; the fixing holes of the fixing plate also correspond to the through holes in the lower wall of the second liquid box, the fixing plate being fixed to the lower wall of the second liquid box, so that the heat dissipation sections at both ends of the heat pipe pass through the through holes and extend into the second liquid box.

4. The integrated liquid-cooled heat sink with heat pipe as described in claim 3, wherein the fixing plate is provided with a plurality of screw holes, the lower box wall is provided with screw holes, and a plurality of screws pass through the screw holes of the fixing plate and are locked in the screw holes of the lower box wall.

5. The integrated liquid-cooled heat sink with heat pipe as described in claim 2, comprising two fixing plates, each of the two fixing plates having a fixing hole corresponding to one end of each heat pipe, the heat dissipation sections at both ends of the heat pipe being inserted into and welded to the fixing holes of the two fixing plates; the fixing holes of the two fixing plates also correspond to the through holes in the lower wall of the second liquid box, the two fixing plates being combined and fixed to the lower wall of the box, so that the heat dissipation sections at both ends of the heat pipe pass through the through holes and extend into the second liquid box.

6. The heat pipe integrated liquid cooling radiator as described in claim 5, wherein the two fixing plates are respectively provided with a plurality of screw through holes, the lower box wall is provided with screw holes, and a plurality of screws respectively pass through the screw through holes of the two fixing plates and are locked in the screw holes of the lower box wall.

7. The integrated liquid-cooled heat sink with heat pipes as claimed in claim 2, wherein the multiple heat pipe slots of the liquid cooling head are arranged side by side without spacing; and the heat absorption sections and heat source contact surfaces of the heat pipes are arranged side by side without spacing to form the plane or the micro-protruding arc surface.

8. The integrated liquid-cooled heat sink with heat pipes as claimed in claim 2, wherein the multiple heat pipe slots of the liquid cooling head are spaced apart from each other; and the heat absorption sections of the heat pipes are spaced apart in the heat pipe slots, so that the heat source contact surfaces are spaced apart from each other.

9. The integrated liquid-cooled heat sink with heat pipe as claimed in claim 1, wherein the inner wall of the heat pipe has a plurality of capillary grooves extending along the heat pipe to both ends.

10. The integrated liquid-cooled heat sink with heat pipe as described in claim 9, wherein the inner wall of the heat pipe is provided with a metal powder sintered layer or a metal mesh layer.

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